JPH1174650A - Production of multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance positional accuracy of a multilayer wiring board by making guide holes for alignment at a plurality of positions on all faces of an inner layer circuit board and a prepreg and then aligning the inner layer circuit board and the prepreg using a jig plate having a fixed positioning pin and a movable positioning pin. SOLUTION: A jig plate comprises a base 1 arranged with a fixed positioning pin 2 and first and second movable positioning pins 3, 4. An inner layer circuit board and a prepreg are set on the jig plate and a retaining plate is applied thereon. The first movable pin 3 is movable only in the direction B and the second movable pins 4 is movable in all directions on the same plane. If the pitch of alignment guide hole made in the inner layer circuit board is different from a design value when the inner layer circuit board and the prepreg are set on the jig plate, the first and second movable pins 3, 4 slide to match the pitch of alignment guide hole made in the inner layer circuit board with the pitch of positioning hole made in the jig plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a multilayer printed circuit board.

[0002]

2. Description of the Related Art In recent years, high-speed and high-density industrial electronic devices have been required to increase the number of layers and thinning of printed wiring boards. In addition, the increase in multilayer printed wiring boards is remarkable, and in order to cope with such an increase in multilayer printed wiring boards,
Improvements in productivity are also strongly demanded.

Conventionally, a multilayer printed circuit board having five or more layers is sandwiched between a copper foil, a plurality of inner layer circuit boards on which circuits have been formed in advance, and between each inner layer circuit board and between an interior circuit board and the copper foil. The so-called pin lamination method, which is a method for manufacturing a multilayer printed wiring board in which a prepreg and a prepreg are fixed by positioning pins and then heated and pressed to form a laminate, has been used. However, the pin lamination method can perform alignment with high accuracy, but the workability such as pin removal is poor.
There was a problem that productivity was low.

Therefore, usually, after positioning the inner circuit board and the prepreg using a jig plate on which positioning pins are arranged, the relative position between the inner circuit board and the prepreg is fixed by means of a metal U-shaped needle. While holding the
A printed wiring board having five or more layers is manufactured by a method of pressing and integrating.

[0005]

However, in the method of aligning the inner circuit board and the prepreg using a jig plate on which positioning pins are arranged, there is a method in which a predetermined number of positions are formed on the inner circuit board. If the pitch between the alignment guide holes is different from the pitch between the positioning pins arranged on the jig, the inner circuit board becomes slack or the alignment guide holes formed on the inner circuit board are deformed. And the position accuracy is reduced.

An object of the present invention is to provide a method for manufacturing a multilayer wiring board having excellent positional accuracy.

[0007]

According to the present invention, there is provided a method of manufacturing a multilayer wiring board, comprising the steps of: forming a copper foil, a plurality of inner-layer circuit boards on which circuits have been formed in advance; After fixing the prepreg with the positioning pin,
By a metal U-shaped needle, in a state of holding these relative positions, in a method of manufacturing a multilayer printed wiring board to be laminated by heating and pressing, in the entire surface of the inner layer circuit board and the prepreg, Guide holes for positioning are formed in at least two or more positions, and the inner circuit board and the prepreg are positioned by a jig plate having fixed positioning pins and movable positioning pins.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a positioning pin arranged on a jig plate is used by combining a fixed pin, a first movable pin shown in FIG. 3 and a second movable pin shown in FIG. Put the holding plate on the inner layer plate and prepreg
It is characterized in that alignment is performed. The details of the present invention will be described with reference to the drawings. FIG. 1 shows a jig plate, in which a fixed positioning pin 2, a first movable pin 3 and a second movable pin 4 are fixed to a base 1.
And are arranged. FIG. 2 shows an inner circuit board 5 as a jig board.
And a prepreg 6 on which a holding plate 7 is mounted. FIG. 3 is a cross section when viewed from the A and B directions in FIG. As can be seen from FIG. 3, the first movable pin 3
The structure is movable only in the B direction. FIG. 4 is a cross-section when viewed from the C and D directions in FIG. As can be seen from FIG. 4, the second movable pins 4 are movable in all directions on the same plane.

As shown in FIG. 2, when the inner circuit board 5 and the prepreg 6 are set on the jig plate, when the pitch between the alignment holes formed in the inner circuit board 5 differs from the design value, First movable pin 3 other than fixed positioning pin 2
And the second movable pin 4 slide, so that the pitch between the alignment guide holes formed on the inner layer circuit board 5 and the pitch between the positioning holes arranged on the jig plate match.

However, when setting the jig plate using a thin inner layer circuit board and a prepreg, if the pitch between the alignment guide holes formed in the inner layer circuit board is longer than a design value, the jig is not used. First movable pin 3 arranged on a plate
Then, the second movable pin 4 does not move, and the inner circuit board is bent. Therefore, by placing the holding plate 7 on the inner layer circuit board 5 and the prepreg 6, the occurrence of bending can be prevented.

(Operation) According to the operation of the present invention, a positioning guide hole is provided in a jig plate on which one fixed positioning pin, a positioning pin movable only in one direction, and a positioning pin movable in all directions are arranged. By setting the inner circuit board and prepreg, and holding the inner circuit board to move the movable pins with the holding plate, the slack or alignment guide of the inner circuit board is maintained while maintaining the flatness of the inner circuit board and the prepreg. The phenomenon that the hole is deformed can be prevented, and the alignment can be performed with high accuracy.

If the pins arranged on the jig plate are only positioning pins movable in all directions, the aligned inner circuit board can be moved in all directions. Although there is no method for determining the position of the jig, as in the present invention, a jig is provided by arranging one fixed positioning pin, a positioning pin movable only in one direction, and a positioning pin movable in all directions on a jig plate. It is also possible to improve the positional accuracy between the board and the inner layer circuit board. Thereby, in the case where the inner layer circuit board and the prepreg are fixedly held by the fixing means such as the metal U-shaped needle, it is possible to improve the positional accuracy of the fixing material between these and the metal U-shaped needle. It becomes possible.

[0011]

【Example】

Example 1 As shown in FIG. 1, on a metal base 1 having a thickness of 5 mm,
A fixed positioning pin 2 having a diameter of 4.98 mm and a first positioning pin 2 having the same diameter
The movable pin 3 and the second movable pin 4 are arranged. As shown in FIG. 2, an inner layer circuit board 5 having a thickness of 0.18 mm
3 pieces of prepreg 6 each having a thickness of 0.1 mm
Set one. The dimensions of the inner circuit board 5 are 400 mm × 5
Four alignment holes of 00 mm and 5.00 mm in diameter are provided for alignment. The size of the prepreg 6 is 400 m
Four positioning guide holes having a size of mx 500 mm and a diameter of 8.00 mm are formed. After setting these, a 5 mm-thick holding plate 7 made of glass epoxy is placed thereon, and the inner circuit board 5 and the four corners of the prepreg 6 are fixedly held by metal U-shaped needles. FIG. 3 shows the first movable pin 3 used here. The clearance between the base 1 and the first movable pin in the sectional view in the direction A is 0.5 mm, and the clearance in the direction B is 0.05.
mm. FIG. 4 shows the second movable pin. The clearance between the base 1 and the second movable pin in the sectional view in the direction C is 0.5 m.
The clearance in the m and D directions is 0.5 mm.

Comparative Example 1 All the positioning pins arranged on the jig plate were fixed positioning pins, and the fixed holding was performed in the same manner as in the embodiment.

Table 1 shows the results of measuring the positional accuracy of the laminates obtained in the examples and comparative examples. The laminate obtained by the present invention can ensure high positional accuracy, and the effect of the present invention has been confirmed.

[0015]

[Table 1]

[0016]

As described above, according to the method of the present invention, it is possible to align the prepreg with the inner layer circuit board used for the multilayer printed wiring board having five or more layers with high accuracy. , A multilayer printed wiring board with high quality was able to be manufactured.

[Brief description of the drawings]

FIG. 1 is a top view showing a jig plate used in one embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a state in which an inner circuit board, a prepreg, and a holding plate are set on the jig plate shown in FIG. 1 for explaining one embodiment of the present invention.

FIG. 3 is a cross-sectional view of the vicinity of a first movable pin shown in FIG.

FIG. 4 is a cross-sectional view of the vicinity of a second movable pin shown in FIG.

[Explanation of symbols]

1. Base 2. Fixed positioning pin 3. First movable pin 4. Second movable pin 5. Inner layer circuit board 6. Prepreg 7. Holding plate 8. lid

Claims (1)

[Claims] After fixing a copper foil, a plurality of inner-layer circuit boards on which circuits have been formed in advance, and a prepreg sandwiched between the inner-layer circuit boards and between the interior circuit board and the copper foil with positioning pins, By a metal U-shaped needle, in a state of holding these relative positions, in a method of manufacturing a multilayer printed wiring board to be laminated by heating and pressing, in the entire surface of the inner layer circuit board and the prepreg, A guide hole for alignment is formed at least at two or more positions, and the inner circuit board and the prepreg are aligned by a jig plate having a fixed positioning pin and a movable positioning pin. Manufacturing method of wiring board.