JPH1173869A - Temperature fuse - Google Patents
Temperature fuseInfo
- Publication number
- JPH1173869A JPH1173869A JP23359697A JP23359697A JPH1173869A JP H1173869 A JPH1173869 A JP H1173869A JP 23359697 A JP23359697 A JP 23359697A JP 23359697 A JP23359697 A JP 23359697A JP H1173869 A JPH1173869 A JP H1173869A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- melting point
- low melting
- point alloy
- rosin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器に設置し
て所定の温度で低融点合金が溶断することにより通電を
切ることができる温度ヒューズに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal fuse which can be installed in an electronic device and cut off the current when a low melting point alloy melts at a predetermined temperature.
【０００２】[0002]
【従来の技術】電子機器では、電子部品に異常電流が流
れたり、許容範囲であっても長時間にわたって高電圧が
かかったりすると、電子部品が発熱し、電子部品を熱損
傷させるばかりでなく、発火してそれが火災の原因とな
ることがある。2. Description of the Related Art In an electronic device, when an abnormal current flows through an electronic component or a high voltage is applied for a long period of time even within an allowable range, the electronic component generates heat, causing not only thermal damage to the electronic component but also damage to the electronic component. May ignite and cause a fire.
【０００３】そこで電子機器では過電流が流れやすい箇
所や熱を発生しやすい箇所に温度ヒューズを取り付けて
おくことがなされている。温度ヒューズとは、図１に示
すように所定の太さに成形した低融点合金１を銅線のよ
うなリード２、２に接続したものであり、低融点合金の
表面にはフラックス３を塗布してある。そして該低融点
合金の部分は絶縁ケース４内に収納され、該絶縁ケース
の端部を樹脂５、５で封止してある。Therefore, in electronic equipment, a thermal fuse is attached to a place where an overcurrent easily flows or a place where heat is easily generated. The thermal fuse is formed by connecting a low melting point alloy 1 formed to a predetermined thickness to leads 2 and 2 such as copper wires as shown in FIG. 1, and applying a flux 3 to the surface of the low melting point alloy. I have. The portion of the low melting point alloy is housed in the insulating case 4 and the end of the insulating case is sealed with the resin 5.
【０００４】温度ヒューズの多くは、作動温度が７０〜
１４０℃のものである。これら温度ヒューズは、比較的
融点の低いＰｂ、Ｓｎ、Ｂｉ、Ｉｎ、Ｃｄのような金属
や電気抵抗を下げるＡｇのような金属を適宜組み合わせ
て所定の作動温度となるようにしてある。[0004] Most of the thermal fuses have an operating temperature of 70 to 70 ° C.
140 ° C. These thermal fuses are set to a predetermined operating temperature by appropriately combining metals such as Pb, Sn, Bi, In, and Cd having relatively low melting points and metals such as Ag that reduce electric resistance.
【０００５】温度ヒューズは電子機器に必要以上に過電
流が流れたり、電子機器の周囲の温度が高くなりすぎた
りしたときに、温度ヒューズの低融点合金が溶断して電
気の流れを止め、それ以上に電流を流さないようにする
ものである。従って、温度ヒューズが作動するときには
所定の作動温度で、しかも完全に低融点合金が溶断しな
ければならない。When an excessive current flows to an electronic device more than necessary or when the temperature around the electronic device becomes too high, the low melting point alloy of the thermal fuse melts and stops the flow of electricity. Thus, the current is prevented from flowing. Therefore, when the thermal fuse operates, the low melting point alloy must be completely blown at a predetermined operating temperature and completely.
【０００６】一般に金属は、高温に曝されると表面が酸
化し、さらに温度が上がると溶融するが、溶融した金属
表面には、一層厚い酸化膜が形成されるようになる。こ
の酸化膜は、相当高温になっても溶けることがなく、よ
り酸化が進んで金属表面を厚く覆った状態となる。Generally, the surface of a metal is oxidized when exposed to a high temperature and melts when the temperature is further increased. However, a thicker oxide film is formed on the surface of the molten metal. This oxide film does not melt even at a very high temperature, and becomes more oxidized, and covers the metal surface thickly.
【０００７】従って、過電流や周囲の温度上昇で作動温
度になったときでも、温度ヒューズの低融点合金の表面
を酸化膜が覆っていると、例えば棒状の低融点合金を用
いる場合には酸化膜があたかもチューブのようになり、
該チューブの中に溶融した低融点合金が存在した状態と
なって、電流がながれたままとなる。Therefore, even when the operating temperature is increased due to an overcurrent or an increase in ambient temperature, if the surface of the low melting point alloy of the thermal fuse is covered with an oxide film, for example, when a rod-shaped low melting point alloy is used, the oxidation may occur. The membrane becomes like a tube,
The state where the molten low melting point alloy is present in the tube is maintained, and the current is kept flowing.
【０００８】このように温度ヒューズが作動しても酸化
膜の存在により電流が流れたままとなっていると、過電
流が流れ続いて他の高価な電子部品を損傷させたり、電
子機器が高温となってついには火災を発生させたりする
という大事故を起こすことがある。If the current continues to flow due to the presence of the oxide film even when the thermal fuse operates as described above, an overcurrent continues to flow, damaging other expensive electronic parts or causing the electronic equipment to reach a high temperature. Eventually, a catastrophic accident such as a fire may occur.
【０００９】そこで従来より、温度ヒューズの作動時に
酸化膜が残るのを防ぐために低融点合金の表面にフラッ
クスを塗布しておくことがなされていた。該フラックス
としては、温度ヒューズの作動時に下記のようなフラッ
クス作用を有したものでなければならない。Therefore, conventionally, a flux has been applied to the surface of the low melting point alloy in order to prevent an oxide film from remaining during operation of the thermal fuse. The flux must have the following flux action when the thermal fuse is activated.
【００１０】還元作用：溶融した低融点合金の表面に
発生した酸化膜を還元除去して、酸化膜が残らないよう
にする。 再酸化防止作用：フラックスで酸化膜を還元除去した
後、溶融した低融点合金の表面を覆い、低融点合金が大
気と接触するのを妨げて再酸化を防止する。 溶融金属の球状化作用：溶融した低融点合金を球状化
して、リード間を完全に遮断する。[0010] Reduction action: An oxide film formed on the surface of the molten low melting point alloy is reduced and removed so that no oxide film remains. Anti-reoxidation action: After the oxide film is reduced and removed by the flux, the surface of the molten low melting point alloy is covered, and the low melting point alloy is prevented from coming into contact with the atmosphere to prevent reoxidation. The spheroidizing action of the molten metal: The spheroidizing of the molten low melting point alloy completely blocks the space between the leads.
【００１１】従来の温度ヒューズに用いられていたフラ
ックスは、松脂を主成分とし、これに活性剤やチキソ剤
等を添加したものであった。また、これらの成分に作動
時のフラックス滴下防止としてホットメルト接着剤を添
加したもの（特開昭６０−１９０７４７号）、温度ヒュ
ーズの作動後の耐電圧性向上のために脂肪酸アミドや直
鎖飽和脂肪酸を添加したもの（特開平２−１９５６２
４、同４−１２６３２５号）等も提案されている。The flux used in the conventional thermal fuse has rosin as a main component, to which an activator, a thixotropic agent and the like are added. In addition, a hot melt adhesive is added to these components to prevent flux dripping during operation (Japanese Patent Application Laid-Open No. 60-190747). Those containing fatty acids (Japanese Unexamined Patent Publication (Kokai) No. 2-19562
4, No. 4-126325) and the like have also been proposed.
【００１２】[0012]
【発明が解決しようとする課題】ところで、温度ヒュー
ズではフラックスが低融点合金の表面に長時間にわたっ
て安定した状態で被覆されていなければならない。つま
り電子機器では、使用時にコイルやパワートランジスタ
ーのような電子機器から熱が発せられ、電子機器のケー
ス内が高温となり、長時間にわたって電子機器が使用さ
れると、電子機器に取り付けられた温度ヒューズは長時
間高温に曝された状態となる。このように温度ヒューズ
が長時間高温に曝されると、低融点合金に塗布したフラ
ックスが劣化して前記フラックス作用が低下し、実際に
過電流が流れたり異常高温に曝されたりしたときに低融
点合金が所定の作動温度で溶断しなくなってしまう。By the way, in the thermal fuse, the flux must be coated on the surface of the low melting point alloy in a stable state for a long time. In other words, in electronic equipment, heat is generated from electronic equipment such as coils and power transistors during use, and the temperature inside the electronic equipment case becomes high.If the electronic equipment is used for a long time, the thermal fuse attached to the electronic equipment Are exposed to high temperatures for a long time. When the thermal fuse is exposed to a high temperature for a long time as described above, the flux applied to the low melting point alloy is degraded, and the above-mentioned flux action is reduced. The melting point alloy will not melt at a predetermined operating temperature.
【００１３】[0013]
【課題を解決するための手段】本発明者等は、フラック
スが長時間高温に曝されても劣化しないような特性、即
ち耐熱性を持たせることについて鋭意研究を重ねた結
果、フラックスに合成ゴムを添加すると、その効果が現
われることを見いだし、本発明を完成させた。即ち、本
発明は、チキソ剤５〜２０重量％、活性剤０．５〜４重
量％、合成ゴム５〜２０重量％残部が松脂と不可避的不
純物からなるフラックスを低融点合金の表面に被覆して
ある温度ヒューズを提供する。Means for Solving the Problems The inventors of the present invention have conducted intensive studies on the property that the flux does not deteriorate even if it is exposed to a high temperature for a long period of time, that is, as a result of the synthetic rubber being added to the flux. It was found that the effect was exhibited by adding, and the present invention was completed. That is, the present invention covers the surface of the low melting point alloy with a flux comprising 5 to 20% by weight of a thixotropic agent, 0.5 to 4% by weight of an activator, and 5 to 20% by weight of a synthetic rubber, the remainder comprising rosin and unavoidable impurities. Provide a thermal fuse.
【００１４】また、前記合成ゴムが、スチレン共重合ゴ
ム、ブチルゴム、ニトリルゴム、クロロブレンゴム、ウ
レタンゴム、シリコ−ンゴム、フッ素ゴムより成る群か
ら選択された少なくとも１種の合成ゴムである温度ヒュ
−ズを提供する。Further, the synthetic rubber is at least one kind of synthetic rubber selected from the group consisting of styrene copolymer rubber, butyl rubber, nitrile rubber, chlorobrene rubber, urethane rubber, silicone rubber, and fluoro rubber. -Provide
【００１５】また、前記低融点合金は、Ｐｂ１５〜３０
重量％、Ｉｎ２０〜３５重量％、残部がＳｎと不可避的
不純物から成る低融点合金である温度ヒュ−ズを提供す
る。[0015] The low melting point alloy may be Pb15-30.
The present invention provides a temperature fuse which is a low melting point alloy containing 20% to 35% by weight of In and the balance of Sn and inevitable impurities.
【００１６】また、前記松脂は、重合ロジン、水添ロジ
ン、変性ロジン、ＷＷロジンから成る群から選択された
少なくとも一種の松脂である温度ヒュ−ズを提供する。[0016] Further, the rosin provides a temperature fuse which is at least one rosin selected from the group consisting of a polymerized rosin, a hydrogenated rosin, a modified rosin, and a WW rosin.
【００１７】また、前記活性材は、ジエタノ−ルアミン
ＨＣｌ、トリエタノ−ルアミンＨＢｒ、モノエタノ−ル
アミンＨＦ等のアルカノールアミンのハロゲン化水素酸
塩やアミンのハロゲン化水素酸塩である温度ヒュ−ズを
提供する。Further, the active material provides a temperature fuse which is a hydrohalide of an alkanolamine such as diethanolamine HCl, triethanolamine HBr, monoethanolamine HF, or a hydrohalide of an amine. I do.
【００１８】また、前記チキソ材は、ヒマ硬である温度
ヒュ−ズを提供する。The thixotropic material also provides a temperature fuse that is castor-hard.
【００１９】[0019]
【発明の実施の形態】本発明に用いるフラックスにおい
て松脂は、重合ロジン、水添ロジン、変性ロジン、ＷＷ
ロジン等であり、これらの松脂を適宜混合して適当な軟
化点を得る。松脂の添加量が５０重量％よりも少ないと
フラックス作用、特に再酸化防止作用が劣るようにな
る。しかるに松脂の添加量が８０重量％を越えると低融
点合金に対する塗布性が悪くなってしまう。DETAILED DESCRIPTION OF THE INVENTION In the flux used in the present invention, rosin is polymerized rosin, hydrogenated rosin, modified rosin, WW
Rosin and the like, and these rosins are appropriately mixed to obtain an appropriate softening point. If the added amount of rosin is less than 50% by weight, the flux action, particularly the antioxidant action, becomes poor. However, if the added amount of the rosin exceeds 80% by weight, the applicability to the low melting point alloy is deteriorated.
【００２０】フラックスに添加するチキソ剤は、フラッ
クスにある程度柔軟性を付与するものである。つまり松
脂は常温では脆性であり、この松脂が大量に添加された
フラックスは非常に脆く、温度ヒューズの低融点合金に
塗布後、少しの振動や衝撃を受けただけで簡単に剥離し
てしまう。そこで松脂が主成分であるフラックスにチキ
ソ剤を添加して柔軟性を持たせ、衝撃に強くする。チキ
ソ剤の添加は５重量％未満では松脂が主成分であるフラ
ックスの柔軟性付与に効果がなく、しかるに２０重量％
よりも多くなるとフラックス作用に影響するようにな
る。本発明の温度ヒューズに使用するチキソ剤としては
ヒマ硬が適している。The thixotropic agent added to the flux imparts some flexibility to the flux. In other words, rosin is brittle at room temperature, and the flux to which a large amount of rosin is added is very brittle, and after being applied to the low melting point alloy of the thermal fuse, it can be easily peeled off with a slight vibration or impact. Therefore, a thixotropic agent is added to the flux containing rosin as a main component to give flexibility and to make it more resistant to impact. If the addition of the thixotropic agent is less than 5% by weight, there is no effect on imparting flexibility to a flux containing rosin as a main component, but 20% by weight.
If it is larger than this, it will affect the flux action. As a thixotropic agent used for the thermal fuse of the present invention, castor hard is suitable.
【００２１】活性剤は、フラックス作用のうち還元作用
に大いに効果のあるものである。松脂自体にもアビエチ
ン酸という活性成分が含まれているが、松脂の活性成分
だけでは強固な酸化膜を還元するには充分でない。そこ
で、さらに活性作用を強くするために活性剤を添加す
る。活性剤の添加量は０．５重量％よりも少ないと還元
作用の効果が現われない。The activator has a great effect on the reducing action of the flux action. Although rosin itself contains an active ingredient called abietic acid, rosin alone is not sufficient to reduce a strong oxide film. Therefore, an activator is added to further enhance the activity. If the amount of the activator is less than 0.5% by weight, the effect of the reducing action will not be exhibited.
【００２２】しかるに活性剤は腐食性の強いハロゲン化
物や酸性の強い有機酸であるため４重量％よりも多く添
加すると、長期間経過するうちに低融点合金を腐食させ
て低融点合金を断線させたり、融点の高い腐食生成物を
発生させて作動時の溶断の妨げとなったりする恐れが出
てくる。本発明の温度ヒューズに使用する活性剤として
は、ジエタノールアミンＨＣｌ、トリエタノールアミン
ＨＢｒ、モノエタノールアミンＨＦのようなアルカノー
ルアミンやアミンのハロゲン化物が適している。However, since the activator is a highly corrosive halide or a strongly acidic organic acid, if it is added in an amount of more than 4% by weight, the low melting point alloy is corroded and the low melting point alloy is broken after a long period of time. Alternatively, a corrosion product having a high melting point may be generated to hinder fusing during operation. Suitable activators for use in the thermal fuse of the present invention include alkanolamines such as diethanolamine HCl, triethanolamine HBr, and monoethanolamine HF and amine halides.
【００２３】合成ゴムは、フラックスの耐熱性を与え
て、電子機器の使用時にケース内が高温になっってもフ
ラックスが劣化しないようにするものである。合成ゴム
の添加量が５重量％未満ではフラックスの耐熱性が充分
でなく、２０重量％を越えるとフラックス作用を邪魔す
るようになってしまう。本発明の温度ヒューズに使用し
て好適な合成ゴムとしては、スチレ共重合ゴム、ブチル
ゴム、ニトリルゴム、クロブレンゴム、ウレタンゴム、
シリコーンゴム、フッ素ゴム、等である。The synthetic rubber gives the heat resistance of the flux so that the flux does not deteriorate even when the temperature inside the case becomes high when the electronic device is used. If the amount of the synthetic rubber is less than 5% by weight, the heat resistance of the flux is not sufficient, and if it exceeds 20% by weight, the flux action is hindered. Suitable synthetic rubbers for use in the thermal fuse of the present invention include styrene copolymer rubber, butyl rubber, nitrile rubber, clobrene rubber, urethane rubber,
Silicone rubber, fluorine rubber, and the like.
【００２４】[0024]
【実施例】以下に本発明の実施例を表をもって示す。 実施例１〜１６EXAMPLES Examples of the present invention are shown below in tables. Examples 1 to 16
【表１】 実施例１６が本願請求項１に記載したものであり、実施
例１〜１２が本願請求項２及び４〜８に記載したもので
あり、実施例１３〜１５が本願請求項３に記載したもの
である。一方、従来の温度ヒューズを代表するものとし
て比較例１〜３を実施した。 比較例１〜３[Table 1] Example 16 is described in claim 1 of the present application, Examples 1 to 12 are described in claims 2 and 4 to 8 of the present application, and Examples 13 to 15 are described in claim 3 of the present application. It is. On the other hand, Comparative Examples 1 to 3 were implemented as representatives of a conventional thermal fuse. Comparative Examples 1-3
【表２】 [Table 2]
【００２５】上記実施例１〜１５と比較例１〜３の温度
ヒューズを低融点合金の融点よりも２０℃低い１１５℃
に保った恒温槽内に複数本放置し、一定時間経過毎に１
０本ずつ取り出して、これらを炉内に置き、１℃／分の
温度上昇をさせて作動温度の試験を行なった。その結果
を図２に示す。図２の作動試験結果からも明らかなよう
に、実施例１〜１５の温度ヒューズは４０００時間経過
後でも所定の作動温度以下の温度で作動しており、比較
例１〜３の温度ヒューズは５００時間を越えた頃から作
動温度が上昇していた。The thermal fuses of Examples 1 to 15 and Comparative Examples 1 to 3 were heated to 115 ° C. which is 20 ° C. lower than the melting point of the low melting point alloy.
Multiple tubes in a thermostat kept at
The test pieces were taken out at a time, placed in a furnace, and heated at a rate of 1 ° C./min to test the operating temperature. The result is shown in FIG. As is clear from the operation test results in FIG. 2, the thermal fuses of Examples 1 to 15 operate at a temperature equal to or lower than the predetermined operating temperature even after 4000 hours, and the thermal fuses of Comparative Examples 1 to 3 The operating temperature had risen since the time had passed.
【００２６】実施例１〜１５の温度ヒューズは長時間高
温に曝されてもフラックスが劣化しないため所定の作動
温度で作動するが、比較例１〜３の温度ヒューズはフラ
ックスが劣化するため作動温度が上昇してしまうもので
ある。また、本発明の温度ヒューズはセラミックパッケ
ージ型のものにも用いられることは言うまでもない。The thermal fuses of Examples 1 to 15 operate at a predetermined operating temperature because the flux does not deteriorate even when exposed to a high temperature for a long time, whereas the thermal fuses of Comparative Examples 1 to 3 operate at a predetermined operating temperature because the flux deteriorates. Is going to rise. Needless to say, the thermal fuse of the present invention can also be used for a ceramic package type.
【００２７】[0027]
【発明の効果】以上、説明したように、本発明の温度ヒ
ューズは、フラックスに耐熱性が備わっているため、電
子機器の使用時に高温に曝されてもフラックスが劣化せ
ず、温度ヒューズに過電流が流れたり、電子機器内が異
常高温になったりしたときには必ず所定の温度で溶断し
て電子機器を火災から守るという信頼性にすぐれたもの
である。As described above, the thermal fuse of the present invention has heat resistance to the flux, so that the flux does not deteriorate even when exposed to a high temperature during use of the electronic equipment, and the thermal fuse is not overheated. It is highly reliable that when an electric current flows or the inside of the electronic device becomes abnormally high, the electronic device is always blown at a predetermined temperature to protect the electronic device from fire.
【図１】 温度ヒューズの断面図FIG. 1 is a sectional view of a thermal fuse.
【図２】 本発明と従来の温度ヒューズの作動試験結果
を比較した図FIG. 2 is a diagram comparing operation test results of the present invention and a conventional thermal fuse.
１ 低融点合金 ２ リード ３ フラックス ４ 絶縁ケース ５ 封止用樹脂 DESCRIPTION OF SYMBOLS 1 Low melting point alloy 2 Lead 3 Flux 4 Insulation case 5 Resin for sealing
───────────────────────────────────────────────────── フロントページの続き (72)発明者 黒子 知秀 東京都足立区千住橋戸町23番地 千住金属 工業株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomohide Kuroko 23 Senju Hashido-cho, Adachi-ku, Tokyo Inside Senju Metal Industry Co., Ltd.
Claims (7)
０重量％及び残部が松脂と不可避的不純物から成るフラ
ックスを低融点合金の表面に被覆したことを特徴とする
温度ヒュ−ズ。An active material of 0.5 to 4% by weight and a synthetic rubber of 5-2
A temperature fuse characterized in that a surface of a low melting point alloy is coated with a flux composed of rosin and unavoidable impurities in an amount of 0% by weight.
４重量％、合成ゴム５〜２０重量％及び残部が松脂と不
可避的不純物から成るフラックスを低融点合金の表面に
被覆したことを特徴とする温度ヒュ−ズ。2. A thixotropic material of 5 to 20% by weight, an active material of 0.5 to 20% by weight.
A temperature fuse characterized in that the surface of the low melting point alloy is coated with a flux composed of 4% by weight, 5 to 20% by weight of synthetic rubber and the remainder consisting of rosin and unavoidable impurities.
チルゴム、ニトリルゴム、クロロブレンゴム、ウレタン
ゴム、シリコ−ンゴム、フッ素ゴムより成る群から選択
された少なくとも１種の合成ゴムである請求項１から３
いずれか一に記載の温度ヒュ−ズ。3. The synthetic rubber is at least one synthetic rubber selected from the group consisting of styrene copolymer rubber, butyl rubber, nitrile rubber, chlorobrene rubber, urethane rubber, silicone rubber, and fluoro rubber. 1 to 3
The temperature fuse according to any one of the above.
％、Ｉｎ２０〜３５重量％、残部がＳｎと不可避的不純
物から成る低融点合金である請求項１から４いずれか一
に記載の温度ヒュ−ズ。4. The temperature hue alloy according to claim 1, wherein said low melting point alloy is a low melting point alloy comprising 15 to 30% by weight of Pb, 20 to 35% by weight of In, and the balance consisting of Sn and unavoidable impurities. -.
性ロジン、ＷＷロジンから成る群から選択された少なく
とも１種の松脂である請求項１から５のいずれか一に記
載の温度ヒュ−ズ。5. The temperature hue according to claim 1, wherein the rosin is at least one rosin selected from the group consisting of a polymerized rosin, a hydrogenated rosin, a modified rosin, and a WW rosin. Z.
ｌ、トリエタノ−ルアミンＨＢｒ、モノエタノ−ルアミ
ンＨＦより成る群から選択された少なくとも１種の活性
材である請求項１から６いずれか一に記載の温度ヒュ−
ズ。6. The active material is diethanolamine HC.
7. The temperature hue according to claim 1, which is at least one active material selected from the group consisting of 1, triethanolamine HBr, and monoethanolamine HF.
Z.
ゲン化水素酸塩又はアミンのハロゲン化水素酸塩である
請求項１から５いずれか一に記載の温度ヒュ−ズ。7. The temperature fuse according to claim 1, wherein the activator is an alkanolamine hydrohalide or an amine hydrohalide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23359697A JP3456623B2 (en) | 1997-08-29 | 1997-08-29 | Thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23359697A JP3456623B2 (en) | 1997-08-29 | 1997-08-29 | Thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1173869A true JPH1173869A (en) | 1999-03-16 |
| JP3456623B2 JP3456623B2 (en) | 2003-10-14 |
Family
ID=16957546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23359697A Expired - Fee Related JP3456623B2 (en) | 1997-08-29 | 1997-08-29 | Thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3456623B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334394A (en) * | 2000-05-23 | 2001-12-04 | Nec Schott Components Corp | Flux, flux-filled low melting point alloy and protective element using the same |
| JPWO2002095783A1 (en) * | 2001-05-21 | 2005-04-07 | 松下電器産業株式会社 | Thermal fuse |
| US7042327B2 (en) | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| WO2008116698A1 (en) * | 2007-03-26 | 2008-10-02 | Robert Bosch Gmbh | Fuse for interrupting a voltage and/or current-carrying conductor in case of a thermal fault and method for producing the fuse |
-
1997
- 1997-08-29 JP JP23359697A patent/JP3456623B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334394A (en) * | 2000-05-23 | 2001-12-04 | Nec Schott Components Corp | Flux, flux-filled low melting point alloy and protective element using the same |
| JP4488586B2 (en) * | 2000-05-23 | 2010-06-23 | エヌイーシー ショット コンポーネンツ株式会社 | Flux, fluxed low melting point alloy and protective element using the same |
| JPWO2002095783A1 (en) * | 2001-05-21 | 2005-04-07 | 松下電器産業株式会社 | Thermal fuse |
| US7042327B2 (en) | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| WO2008116698A1 (en) * | 2007-03-26 | 2008-10-02 | Robert Bosch Gmbh | Fuse for interrupting a voltage and/or current-carrying conductor in case of a thermal fault and method for producing the fuse |
| US9093238B2 (en) | 2007-03-26 | 2015-07-28 | Robert Bosch Gmbh | Fuse for interrupting a voltage and/or current-carrying conductor in case of a thermal fault and method for producing the fuse |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3456623B2 (en) | 2003-10-14 |
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