JPH1171697A - Plated product as well as its production and apparatus therefor - Google Patents
Plated product as well as its production and apparatus thereforInfo
- Publication number
- JPH1171697A JPH1171697A JP25001197A JP25001197A JPH1171697A JP H1171697 A JPH1171697 A JP H1171697A JP 25001197 A JP25001197 A JP 25001197A JP 25001197 A JP25001197 A JP 25001197A JP H1171697 A JPH1171697 A JP H1171697A
- Authority
- JP
- Japan
- Prior art keywords
- size
- recesses
- depressions
- metal
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、金属または非金属
の材料の表面をメッキして成る製品並びにその製造方法
およびその製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a product obtained by plating a surface of a metal or nonmetal material, a method of manufacturing the same, and an apparatus for manufacturing the same.
【0002】[0002]
【従来の技術】従来、金属あるいは非金属の材料の表面
をメッキする場合、材料と薄層金属(メッキ)との密着
性を高める目的で、メッキをする前に材料の表面に微細
な窪みを形成することが行われており、その窪みの形成
方法としては、材料に微細な粉体粒子を投射するように
したものや、ある溶液に溶けやすい分子レベルの物質ま
たは微細な粒子を前もって材料の表面近くに埋め込んだ
り混在させて、メッキ前にその溶液でその物質または粒
子を溶かすようにしたものがある。2. Description of the Related Art Conventionally, when plating the surface of a metallic or non-metallic material, a fine depression is formed on the surface of the material before plating in order to enhance the adhesion between the material and a thin metal (plating). The method of forming the pits is to project fine powder particles onto the material, or to use a molecular-level substance or fine particles that are easily soluble in a solution beforehand. Some are embedded or mixed near the surface so that the material or particles are dissolved in the solution before plating.
【0003】[0003]
【発明が解決しようとする課題】ところで、このような
従来の窪み形成方法のうち前者では、微細な粉体粒子と
して数十μmから数百μmの大きさの粒子が使われるた
め、微細窪みは粉体の衝突による塑性変形または切削に
よって形成される。すなわち、図4(a)に示すよう
に、粒子が材料の表面にほぼ直角に衝突して形成される
塑性変形が主体の窪みと、図4(b)に示すように、粒
子が材料の表面に対して鋭角の入射角で衝突して形成さ
れる切削が主体の窪みとがある。しかし、これら窪み
は、惑星に隕石が衝突したような外に開いた形状をして
いるため、この表面にメッキをした場合、材料表面に対
する薄層金属の密着性は、薄層金属それ自体の密着力
と、薄層金属が被覆される材料表面の凹凸による抵抗
と、密着面積の広狭で決まる。そのため、材料表面に対
する薄層金属の密着性においては、材料表面と平行する
方向に力が働く場合には、薄層金属自体の密着力ばかり
でなく、材料表面の凹凸による抵抗と密着面積の広さに
対応した抵抗力(耐剥離性)が生じるが、材料の表面に
ほぼ直角に力が働く場合には、薄層金属自体が持つ密着
力によるものだけであり、材料表面の凹凸による抵抗と
密着面積の広さはあまり寄与せず、この結果、打撃のよ
うな機械的に大きな力が作用したときには、その部分に
微細な剥離現象が発生し、さらに、繰り返しの力が作用
するとやがて剥離が成長し、薄層金属が材料から剥離し
てしまう問題があった。However, in the former method of forming such a depression, since particles having a size of several tens of μm to several hundreds of μm are used as fine powder particles, the fine depression cannot be formed. It is formed by plastic deformation or cutting due to collision of powder. That is, as shown in FIG. 4 (a), a depression mainly formed by plastic deformation caused by the particles colliding with the surface of the material at substantially right angles, and as shown in FIG. There is a dent mainly formed by cutting which is formed by colliding at an acute incident angle with respect to the pit. However, these pits have an open shape like a meteorite hitting the planet, so if this surface is plated, the adhesion of the thin metal to the material surface is limited to that of the thin metal itself. It is determined by the adhesion strength, the resistance due to the unevenness of the surface of the material to be coated with the thin metal, and the width of the adhesion area. Therefore, when a force acts in a direction parallel to the material surface, not only the adhesion force of the thin-layer metal itself but also the resistance due to the unevenness of the material surface and the adhesion area of the thin-layer metal increase. Although a resistance (peeling resistance) corresponding to the resistance is generated, when a force acts on the surface of the material almost at right angles, it is only due to the adhesion force of the thin metal itself, and the resistance due to the unevenness of the material surface The area of the contact area does not contribute much, and as a result, when a large mechanical force such as a blow acts, a minute peeling phenomenon occurs at that part, and further, when repeated force acts, the peeling eventually occurs. There is a problem that the thin metal layer grows and peels off from the material.
【0004】一方、後者では、材料表面の微細窪みの大
きさは、埋め込まれ等された物質または粒子の大きさで
決まるが、2〜3μm以下の小さなものであり、しか
も、この微細窪みの上端開口部の大きさは、図5(a)
に示すように、窪みの大きさに比較して小さいものもあ
り、そのため、メッキをしたときに薄層金属がその窪み
に入り込みにくく、図5(b)に示すように、薄層金属
が窪みの上端開口部を塞ぐだけであり、これに伴って、
材料表面に対する薄層金属の密着性は、薄層金属自体の
密着力によるものだけであり、この結果、機械的に大き
な力が働くと、特に、材料の表面にほぼ直角に力が働く
場合は、その部分が剥離しやすい問題があった。本発明
は上記の問題を解決するためになされたもので、その目
的は、従来のメッキよりもその薄層金属が材料表面から
剥離しにくいようにしたメッキ製品並びにその製造方法
およびその製造装置を提供することにある。[0004] On the other hand, in the latter, the size of the fine pits on the surface of the material is determined by the size of the embedded substance or particle, but is as small as 2 to 3 µm or less. The size of the opening is shown in FIG.
As shown in FIG. 5, some of the pits are smaller than the size of the pits. Therefore, when plating, the thin-layer metal is less likely to enter the pits, and as shown in FIG. Only closes the top opening of the
The adhesion of the thin-layer metal to the material surface is only due to the adhesive force of the thin-layer metal itself. As a result, when a large mechanical force is applied, particularly when a force is applied almost at right angles to the surface of the material, However, there was a problem that the part was easily peeled off. The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a plated product, a method of manufacturing the same, and an apparatus for manufacturing the same in which the thin-layer metal is less likely to peel off from the material surface than conventional plating. To provide.
【0005】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに請求項1の発明におけるメッキ製品は、金属または
非金属の材料の表面をメッキして成る製品であって、開
口の大きさが5〜100μm、深さが0.2d〜d
(d:窪みの開口の大きさ μm)であり、かつアンカ
ー部を有する窪みを多数個表面に備えた材料と、この材
料の表面を覆いかつ一部が前記窪みに侵入している薄層
金属と、を具備したことを特徴とする。In order to achieve the above object, a plated product according to the first aspect of the present invention is a product formed by plating a surface of a metal or nonmetal material, and the size of the opening is small. 5-100 μm, depth 0.2d-d
(D: the size of the opening of the depression μm), and a material provided with a large number of depressions having an anchor portion on the surface, and a thin-layer metal covering the surface of the material and partially penetrating the depression. And characterized in that:
【0006】また、請求項3の発明におけるメッキ製品
の製造方法は、金属または非金属の材料の表面をメッキ
して成る製品を製造する方法であって、針または太さ3
〜95μmの伸線材の先端を材料の表面にこの表面に対
して90度未満または45度以上の角度で突き刺した後
抜き出して、前記材料の表面に開口の大きさが5〜10
0μm、深さが0.2d〜d(d:窪みの開口の大きさ
μm)でありかつアンカー部を有する窪みを多数個形
成し、その後窪みの形成させた材料の前記窪みを含む表
面を薄層金属で被覆するようにしたことを特徴とする。A method of manufacturing a plated product according to a third aspect of the present invention is a method of manufacturing a product formed by plating a surface of a metal or non-metallic material.
The tip of a drawn wire of about 95 μm is pierced into the surface of the material at an angle of less than 90 ° or 45 ° or more with respect to the surface, and then withdrawn.
A plurality of depressions having a depth of 0.2 μm and a depth of 0.2 d to d (d: the size of the opening of the depression μm) and having an anchor portion are formed, and then the surface including the depression of the material having the depression formed thereon is thinned. It is characterized by being coated with a layer metal.
【0007】なお、前記窪みの開口の大きさが5μm未
満では、薄層金属の分子同士の結合力が、薄層金属の分
子と材料の分子との結合力または重力よりも大きくなっ
て薄層金属が材料の窪み内に入り込むことができず、ま
た窪みの開口の大きさが100μmを越えると、薄層金
属が窪みに入り込むが、窪み内の密着部分をミクロ的に
見ると、材料表面に窪みのない状態で被覆される状態に
近くなり、従来法によると同様の結果が現れて密着性も
従来法に近い。また、前記窪みの深さが開口の大きさの
0.2倍未満では、従来法と同等の耐剥離性しかなく耐
剥離性が改善されず、また深さが開口の大きさを越える
と、針等を材料内に刺し込むのにエネルギを要するが、
それに比較してその効果が小さい。ここでいうアンカー
部とは、図6に示すように、窪みの開口の縁から材料表
面に垂直に引いた線から反開口側に入り込んだ部分の凹
みaをいう。If the size of the opening of the depression is less than 5 μm, the bonding force between the molecules of the thin-layer metal becomes larger than the bonding force between the molecules of the thin-layer metal and the molecules of the material or the gravity, and If the metal cannot enter into the dent of the material and the size of the opening of the dent exceeds 100 μm, the thin layer metal will enter into the dent. The state is close to the state of being covered without any depression, and the same result is obtained according to the conventional method, and the adhesion is also close to the conventional method. Further, if the depth of the depression is less than 0.2 times the size of the opening, only the same peeling resistance as the conventional method is not improved, and if the depth exceeds the size of the opening, It takes energy to pierce the needle etc. into the material,
The effect is smaller than that. As used herein, the term “anchor portion” refers to a recess a at a portion which enters the opposite side of the opening from a line drawn perpendicular to the material surface from the edge of the opening of the recess, as shown in FIG.
【0008】[0008]
【実施例】本発明の効果を確認するために、10×60
×1(mm)のアルミ板の表面を、各種の方法で粗面化
した後、その粗面化した表面を銅メッキして多数枚の試
験片を作り、各試験片について両振り疲労試験(屈曲繰
り返し試験)を104回行い、その場合に被覆した薄層
金属の剥離個所の有無についてチェックを行い、その結
果を表1に示す。EXAMPLES In order to confirm the effect of the present invention, 10 × 60
After roughening the surface of a × 1 (mm) aluminum plate by various methods, the roughened surface is plated with copper to form a large number of test pieces, and a swing fatigue test ( (Bending repetition test) was performed 10 4 times, and in that case, it was checked whether or not the coated thin metal had peeled off. The results are shown in Table 1.
【0009】[0009]
【表1】 [Table 1]
【0010】表1に示すように、化学エッチングで粗面
化した試験片では、全枚数の試験片の60%以上に何ら
かの剥離が生じた。また、大きさ0.8mmのショット
を速度70m/sで投射して表面粗さ55μmに粗面化
した試験片では、全枚数の試験片の50%以上に何らか
の剥離が生じた。また、大きさ0.2mmのショットを
速度30m/sで投射して表面粗さ8μmに粗面化した
試験片では、全枚数の試験片の40%以上に何らかの剥
離が生じた。これに対して、アルミ板の表面に対して9
0度未満または45度以上の角度の下、単位面積当たり
の本数をいろいろ変えてアルミ板表面に針を突き刺し、
アルミ板の表面に窪み(開口10μm、深さ5μm)を
生成した後、メッキして試験片を作った。[0010] As shown in Table 1, in the test pieces roughened by chemical etching, some peeling occurred in 60% or more of all the test pieces. Further, in a test piece roughened to a surface roughness of 55 μm by projecting a 0.8 mm shot at a speed of 70 m / s, some peeling occurred in 50% or more of all the test pieces. Further, in a test piece roughened to a surface roughness of 8 μm by projecting a shot having a size of 0.2 mm at a speed of 30 m / s, some peeling occurred in 40% or more of all the test pieces. On the other hand, 9
Under an angle of less than 0 degrees or 45 degrees or more, variously change the number per unit area and pierce the needle on the aluminum plate surface,
After forming a depression (opening 10 μm, depth 5 μm) on the surface of the aluminum plate, a test piece was prepared by plating.
【0011】この場合、アンカー部を有する窪みの個数
が10,000個/cm2の試験片では、剥離したもの
は全枚数の試験片の10%以下であり、さらにアンカー
部を有する窪みの個数が250,000個/cm2の試
験片では、剥離したものは全枚数の試験片の1%以下で
あった。したがって、表1から、本発明のように材料の
表面にアンカー部を有する多数の窪み設けると、薄層金
属が剥離しにくことが分かる。なお、アンカー部を有す
る窪みの個数が5,000個/cm2の試験片では、剥
離したものは全枚数の試験片の35%以上であり、実用
性にかける。この窪みの個数は、窪みの開口の大きさを
dμmとしたとき、針の突き刺しピッチが10dを越え
る数値では実用性に問題があり、また、2d未満では針
の突き刺しで窪みに干渉が生じアンカー部を破壊する恐
れがある。In this case, in the test piece having the number of depressions having the anchor portion of 10,000 / cm 2 , the peeled portion is 10% or less of the total number of the test pieces, and the number of the depressions having the anchor portion is less than 10%. However, in 250,000 test pieces / cm 2 , 1% or less of all the test pieces peeled off. Therefore, it can be seen from Table 1 that when a large number of depressions having anchor portions are provided on the surface of the material as in the present invention, the thin metal layer is difficult to peel off. In a test piece having 5,000 depressions / cm 2 having an anchor portion, the peeled sample is 35% or more of the total number of test pieces, which is practical. When the size of the opening of the depression is dμm, the number of the depressions is not practical if the piercing pitch of the needle exceeds 10 d. There is a risk of destroying the part.
【0012】次に、材料の表面に針を突き刺してその表
面を粗面化する装置の実施例について図面に基づき詳細
に説明する。図1および図2に示すように、C字状のコ
ラム1の空洞内に、材料Mを固定するとともに水平面内
で移動させることができる支持機構2が装着してあり、
コラム1における支持機構2の真上位置には窪み成形機
構3が装着してある。この窪み成形機構3は、針4また
は太さ3〜95μmの伸線材と、この針4または太さ3
〜95μmの伸線材の基部を前記材料Mのに対して90
度未満または45度以上の角度で保持する保持手段5
と、この保持手段5をガイド部材6を介して昇降させる
昇降手段としての下向きのシリンダ7とで構成してあ
り、シリンダ7は取付け部材8を介して前記コラム1の
上部に装着してある。そして、シリンダ7には、これに
かかる反力を検知してこれの下降力を制御する指令を出
すコントローラ9が電気的に接続してある。Next, an embodiment of an apparatus for piercing a surface of a material with a needle to roughen the surface will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, a support mechanism 2 that can fix the material M and move the material M in a horizontal plane is mounted in the cavity of the C-shaped column 1.
At the position just above the support mechanism 2 in the column 1, a depression forming mechanism 3 is mounted. The dent forming mechanism 3 includes a needle 4 or a drawn wire having a thickness of 3 to 95 μm,
The base of the ~ 95 µm drawn wire is 90
Holding means 5 for holding at an angle of less than 45 degrees or more than 45 degrees
And a downward cylinder 7 as an elevating means for elevating and lowering the holding means 5 via a guide member 6. The cylinder 7 is mounted on the upper part of the column 1 via a mounting member 8. The cylinder 7 is electrically connected to a controller 9 for detecting a reaction force applied to the cylinder 7 and issuing a command for controlling the descending force.
【0013】このように構成した装置を用いてメッキ製
品の材料Mの表面を粗面化するには、その材料Mを支持
機構2で固定し、その後シリンダ7を伸長作動して針
4、保持手段5等を下降させ、針4を前記材料Mの表面
に突き刺す。次いで、シリンダ7を収縮作動して針4、
保持手段5等を上昇させ、針4を材料から抜き出して材
料Mの表面に多数のアンカー部を有する窪みを設る。そ
の後、表面に窪みを設けた材料Mをメッキして所望のメ
ッキ製品を得る。In order to roughen the surface of the material M of the plated product by using the apparatus configured as described above, the material M is fixed by the support mechanism 2, and then the cylinder 7 is extended and the needle 4 is held. The means 5 and the like are lowered, and the needle 4 pierces the surface of the material M. Next, the cylinder 7 is contracted to operate the needle 4,
By raising the holding means 5 and the like, the needle 4 is extracted from the material, and a depression having a large number of anchor portions is provided on the surface of the material M. Thereafter, a material M having a depression on the surface is plated to obtain a desired plated product.
【0014】なお、上記の実施例では、針4等は保持手
段5に固定的に装着してあるが、図3に示すように、個
々の針4等を小型のシリンダ11のピストンロッドの先
端に取り付けて相互に独立して昇降できるようにしても
よく、また、個々の針4等を回転機能を有する保持手段
に取り付けて回転させながら昇降してもよく、この場合
には針11等を材料Mに円滑に突き刺すことができる。In the above embodiment, the needles 4 and the like are fixedly mounted on the holding means 5, but as shown in FIG. And the needles 4 and the like may be lifted and lowered independently of each other. Alternatively, the individual needles 4 and the like may be mounted on a holding means having a rotation function and moved up and down while rotating. It can pierce the material M smoothly.
【0015】[0015]
【効果】以上の説明から明らかなように本発明は、開口
の大きさが5〜100μm、深さが0.2d〜d(d:
窪みの開口の大きさ μm)であり、かつアンカー部を
有する窪みを多数個表面に備えた材料と、この材料の表
面を覆いかつ一部が前記窪みに侵入している薄層金属
と、を具備したメッキ製品であるから、従来のメッキよ
りもその薄層金属が材料表面から剥離しにくいなどの優
れた効果を奏する。As is clear from the above description, according to the present invention, the size of the opening is 5 to 100 μm and the depth is 0.2 d to d (d:
A material having a plurality of depressions having an anchor portion on the surface thereof, and a thin metal covering the surface of the material and partially penetrating into the depressions. Since it is a plated product provided, it has excellent effects such as that the thin-layer metal is less likely to peel off from the material surface than conventional plating.
【図1】本発明の第1実施例を示す一部断面正面図であ
る。FIG. 1 is a partial sectional front view showing a first embodiment of the present invention.
【図2】図1のA−A矢視図である。FIG. 2 is a view as viewed in the direction of arrows AA in FIG. 1;
【図3】本発明の第2実施例を示す一部断面正面図であ
る。FIG. 3 is a partially sectional front view showing a second embodiment of the present invention.
【図4】従来の材料表面の粗面化法について説明するた
めの概略正面図である。FIG. 4 is a schematic front view for explaining a conventional method of roughening a material surface.
【図5】従来の材料表面の粗面化法について説明するた
めの概略正面図である。FIG. 5 is a schematic front view for explaining a conventional method of roughening a material surface.
【図6】本発明によって形成された窪みを説明するため
の概略正面図である。FIG. 6 is a schematic front view illustrating a depression formed by the present invention.
4 針 5 保持手段 7 シリンダ 9 コントローラ 4 Needle 5 Holding means 7 Cylinder 9 Controller
Claims (6)
して成る製品であって、開口の大きさが5〜100μ
m、深さが0.2d〜d(d:窪みの開口の大きさμ
m)でありかつアンカー部を有する窪みを多数個表面に
備えた材料と、この材料の表面を覆いかつ一部が前記窪
みに侵入している薄層金属と、を具備したことを特徴と
するメッキ製品。1. A product formed by plating a surface of a metal or nonmetal material, wherein the size of an opening is 5 to 100 μm.
m, depth 0.2d-d (d: size μ of the opening of the depression)
m), comprising a material having a plurality of depressions having an anchor portion on the surface thereof, and a thin-layer metal covering the surface of the material and partially penetrating into the depressions. Plated products.
記窪みが1cm2当り106/d2〜108/4d2(d:
窪みの開口の大きさ μm)個であることを特徴とする
メッキ製品。2. A plated product according to claim 1, wherein the recess is 1 cm 2 per 10 6 / d 2 ~10 8 / 4d 2 (d:
A plated product characterized in that the number of depression openings is μm).
して成る製品を製造する方法であって、針または太さ3
〜95μmの伸線材の先端を前記材料の表面にこの表面
に対して90度未満または45度以上の角度で突き刺し
た後抜き出して、前記材料の表面に開口の大きさが5〜
100μm、深さが0.2d〜d(d:窪みの開口の大
きさ μm)でありかつアンカー部を有する窪みを多数
個形成し、その後窪みの形成された材料の前記窪みを含
む表面を薄層金属で被覆するようにしたことを特徴とす
るメッキ製品の製造方法。3. A method for producing a product formed by plating a surface of a metal or non-metallic material, comprising:
A tip of a drawn wire of about 95 μm is pierced into the surface of the material at an angle of less than 90 degrees or 45 degrees or more with respect to the surface, and then withdrawn.
A plurality of depressions having a depth of 0.2 μm to 100 μm (d: opening size of depressions μm) and having an anchor portion are formed, and then the surface of the material having the depressions including the depressions is thinned. A method for producing a plated product, characterized by being coated with a layer metal.
おいて、前記窪みが1cm2当り106/d2〜108/4
d2(d:窪みの開口の大きさμm)個であることを特
徴とするメッキ製品の製造方法。4. The method for manufacturing a plated article according to claim 3, wherein said recess is 1 cm 2 per 10 6 / d 2 ~10 8/ 4
A method for producing a plated product, wherein the number is d 2 (d: the size of the opening of the depression is μm).
して成る製品を製造する装置であって、針または太さ3
〜95μmの伸線材と、この針または太さ3〜95μm
の伸線材の基部を、前記材料の表面に対して90度未満
または45度以上の角度で保持する保持手段と、前記保
持手段を昇降させる昇降手段と、を具備したことを特徴
とするメッキ製品の製造装置。5. An apparatus for producing a product formed by plating a surface of a metal or non-metallic material, comprising:
9595 μm drawn wire and this needle or 3 to 95 μm thick
A plated product comprising: holding means for holding the base of the drawn wire at an angle of less than 90 degrees or 45 degrees or more with respect to the surface of the material; and elevating means for elevating the holding means. Manufacturing equipment.
して成る製品を製造する装置であって、針または太さ3
〜95μmの伸線材と、この針または太さ3〜95μm
の伸線材の基部を、前記材料のに対して90度未満また
は45度以上の角度で保持する保持手段と、前記保持手
段を昇降させる昇降手段と、この昇降手段にかかる反力
を検知してこれの下降力を制御する指令を出すコントロ
ーラと、を具備したことを特徴とするメッキ製品の製造
装置。6. An apparatus for manufacturing a product formed by plating a surface of a metal or non-metal material, comprising a needle or a thickness of 3 mm.
9595 μm drawn wire and this needle or 3 to 95 μm thick
Holding means for holding the base of the drawn wire at an angle of less than 90 degrees or 45 degrees or more with respect to the material, elevating means for elevating the holding means, and detecting a reaction force applied to the elevating means And a controller for issuing a command for controlling the descending force.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25001197A JPH1171697A (en) | 1997-08-29 | 1997-08-29 | Plated product as well as its production and apparatus therefor |
EP98116098A EP0899053A3 (en) | 1997-08-29 | 1998-08-26 | A plated product and a method and apparatus for producing the same |
US09/140,085 US6180171B1 (en) | 1997-08-29 | 1998-08-26 | Method of producing a plated product having recesses |
US09/538,096 US6314785B1 (en) | 1997-08-29 | 2000-03-29 | Apparatus for producing a plated product having recesses |
US09/537,313 US6254999B1 (en) | 1997-08-29 | 2000-03-29 | Plated product having recesses and anchor portions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25001197A JPH1171697A (en) | 1997-08-29 | 1997-08-29 | Plated product as well as its production and apparatus therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1171697A true JPH1171697A (en) | 1999-03-16 |
Family
ID=17201525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25001197A Pending JPH1171697A (en) | 1997-08-29 | 1997-08-29 | Plated product as well as its production and apparatus therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1171697A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018124114A1 (en) * | 2016-12-27 | 2018-07-05 | 古河電気工業株式会社 | Surface treatment material and article fabricated using same |
-
1997
- 1997-08-29 JP JP25001197A patent/JPH1171697A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018124114A1 (en) * | 2016-12-27 | 2018-07-05 | 古河電気工業株式会社 | Surface treatment material and article fabricated using same |
JPWO2018124114A1 (en) * | 2016-12-27 | 2018-12-27 | 古河電気工業株式会社 | Surface treatment material and parts produced using the same |
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