JPH1170473A - Diamond abrasive cutting wheel - Google Patents
Diamond abrasive cutting wheelInfo
- Publication number
- JPH1170473A JPH1170473A JP23493697A JP23493697A JPH1170473A JP H1170473 A JPH1170473 A JP H1170473A JP 23493697 A JP23493697 A JP 23493697A JP 23493697 A JP23493697 A JP 23493697A JP H1170473 A JPH1170473 A JP H1170473A
- Authority
- JP
- Japan
- Prior art keywords
- pair
- degree
- peripheral surface
- outer peripheral
- segment chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、石材、コンクリー
ト、耐火物等の切断に適したダイヤモンド切断砥石、よ
り詳しくはそのセグメントチップ構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond cutting whetstone suitable for cutting stone, concrete, refractory and the like, and more particularly to a segment chip structure thereof.
【０００２】[0002]
【従来の技術】ダイヤモンド切断砥石の一般的なものと
して、従来より、円盤状鉄基板の外周に多数のセグメン
トチップを固着したものが使用されている。このいわゆ
るセグメントタイプのものは、セグメントチップの間に
設けられたスリットの作用によって、基板外周全面に砥
粒層を固着したコンティニアス型のものに比べ、切断時
に発生する切粉の排出効果に優れている。2. Description of the Related Art As a general diamond cutting whetstone, one in which a number of segment chips are fixed on the outer periphery of a disk-shaped iron substrate has been used. This so-called segment type is superior in the effect of discharging chips generated during cutting, compared to the continuous type in which an abrasive layer is fixed to the entire outer periphery of the substrate by the action of the slit provided between the segment chips. ing.
【０００３】しかしながら、セグメントタイプの切断砥
石においても完全な切粉の排出は困難であり、特にセグ
メントチップの中間位置において多量の摩擦熱が発生し
易く、これが、砥石の焼け付きや切れ味低下などの原因
となっている。[0003] However, even with a segment type cutting wheel, it is difficult to completely discharge chips, and a large amount of frictional heat is likely to be generated particularly at an intermediate position of a segment chip. Cause.
【０００４】このような問題点を解決したものとして、
実開昭６１−３５７４２号公報にはセグメントチップの
外周面に凹部を形成した切断砥石が開示されている。ま
た本願出願人は、上記公報に開示された切断砥石に更に
改良を加えたダイヤモンド切断砥石を、実開昭６２−１
７２５６０号公報において開示した。As a solution to such a problem,
Japanese Utility Model Laid-Open Publication No. 61-35742 discloses a cutting wheel having a concave portion formed on the outer peripheral surface of a segment chip. In addition, the present applicant has proposed a diamond cutting whetstone obtained by further improving the cutting whetstone disclosed in the above official gazette,
No. 72560.
【０００５】実開昭６２−１７２５６０号公報において
開示された切断砥石は、円盤状鉄基板の外周に固着した
セグメントチップの外周面両端部に外広がりの台形状凹
部を形成し、さらにこのセグメントチップのほぼ中間位
置であって鉄基板との接着部に凹部を形成したものであ
る。このような構造によって、台形状凹部の台形のテー
パ面に沿って切粉が排出されやすくなり、また中間位置
に凹部を形成することによって、切断時に最も高温にな
りやすいセグメントチップ中央部を効果的に冷却するこ
とが可能となる。The cutting whetstone disclosed in Japanese Utility Model Laid-Open Publication No. Sho 62-172560 has a trapezoidal concave portion formed on both ends of an outer peripheral surface of a segment chip fixed to the outer periphery of a disk-shaped iron substrate. And a concave portion is formed at a substantially intermediate position of the bonding portion with the iron substrate. With such a structure, chips are easily discharged along the trapezoidal tapered surface of the trapezoidal concave portion, and by forming the concave portion at the intermediate position, the central portion of the segment chip, which is most likely to be hot at the time of cutting, is effectively made. It is possible to cool down.
【０００６】[0006]
【発明が解決しようとする課題】ところで、実開昭６２
−１７２５６０号公報に開示された上記切断砥石は、外
周面両端部の台形状凹部及びこれと逆向きに形成された
接着部の凹部の深さは、共にセグメントチップの全高さ
の半分以下であるため、使用にともなって、外周面両端
部に形成された台形状凹部の深さが次第に浅くなり、こ
の凹部が消失してしまった段階では、未だ接着部の凹部
が出現していない状態、すなわちコンティニアス型と同
様の状態が出現することとなる。Problems to be Solved by the Invention
In the cutting wheel disclosed in Japanese Patent No. 172560, the depths of the trapezoidal concave portions at both ends of the outer peripheral surface and the concave portion of the bonding portion formed in the opposite direction are less than half of the total height of the segment chip. Therefore, with use, the depth of the trapezoidal concave portion formed at both ends of the outer peripheral surface gradually decreases, and at the stage where this concave portion has disappeared, the concave portion of the bonded portion has not yet appeared, that is, A state similar to the continuous type will appear.
【０００７】一方、切断砥石を用いて被加工物を加工す
るに際し、要求される特性の一つとして、加工の均一性
が挙げられる。しかしながら、上記したように、凹部を
形成した切断砥石が使用によってコンティニアス型の状
態となり、被加工物に当たる砥粒の数が変化すると、す
なわち特に砥粒の数が多くなると切削抵抗が高くなり、
切れ味の低下を来すこととなる。On the other hand, when processing a workpiece using a cutting grindstone, uniformity of processing is one of the characteristics required. However, as described above, the cutting wheel having the concave portion becomes a continuous type by use, and when the number of abrasive grains hitting the workpiece changes, that is, especially when the number of abrasive grains increases, the cutting resistance increases,
This results in a decrease in sharpness.
【０００８】これを回避するために、上下に形成した凹
部の深さをそれぞれセグメントチップの全高さの半分以
上とし、外周面両端部に形成された台形状凹部が消失し
てしまう前に、接着部側の凹部が出現するようにし、で
きる限り被加工物に接触する砥粒の数を均一に維持する
ようにすることも考えられる。しかし、凹部の深さを大
にすると、セグメントチップ自体の強度が低下するため
好ましくない。In order to avoid this, the depth of each of the upper and lower concave portions is set to be at least half the total height of the segment chip, and the trapezoidal concave portions formed at both ends of the outer peripheral surface are bonded before the disappearance. It is also conceivable to make the recesses on the part side appear, and to keep the number of abrasive grains in contact with the workpiece as uniform as possible. However, increasing the depth of the concave portion is not preferable because the strength of the segment chip itself decreases.
【０００９】そこで本発明において解決すべき課題は、
セグメントチップの外周面両端部に凹部を形成すると共
に、このセグメントチップのほぼ中間位置であって基板
との接着部に凹部を形成した切断砥石において、使い始
めから使い終わりまで安定した切れ味を維持するセグメ
ントチップの構造を提供することにある。Therefore, the problem to be solved in the present invention is:
A concave portion is formed at both ends of the outer peripheral surface of the segment chip, and a cutting wheel having a concave portion formed at a substantially intermediate position between the segment chip and the bonding portion with the substrate maintains stable sharpness from the beginning to the end of use. It is to provide a structure of a segment chip.
【００１０】[0010]
【課題を解決するための手段】本発明は、円盤状基板の
外周に固着したセグメントチップの外周面両端部に一対
の凹部を形成するとともに、前記セグメントチップの長
さ方向のほぼ中間位置であって前記基板との接着部に第
２の凹部を形成してなるダイヤモンド切断砥石におい
て、前記外周面側の一対の凹部の底面と前記接着部側の
凹部の底面を前記基板を中心とするほぼ同一円周上に配
置し、さらに前記セグメントチップの高さ方向の中間部
であって前記外周面側の一対の凹部の底部及び接着部側
の凹部の底部を含む領域に、他の部位よりも磨耗度が高
い中間層を形成したことを特徴とする。According to the present invention, a pair of concave portions are formed at both ends of the outer peripheral surface of a segment chip fixed to the outer periphery of a disk-shaped substrate, and the pair of concave portions are located at substantially intermediate positions in the length direction of the segment chip. In the diamond cutting whetstone having a second concave portion formed in the bonding portion with the substrate, the bottom surfaces of the pair of concave portions on the outer peripheral surface side and the bottom surfaces of the concave portions on the bonding portion side are substantially the same with respect to the substrate. It is arranged on the circumference, and further wears more than the other parts in a region including the bottom of the pair of recesses on the outer peripheral surface side and the bottom of the recess on the bonding portion side, which is the intermediate portion in the height direction of the segment chip. An intermediate layer having a high degree is formed.
【００１１】本発明のダイヤモンド切断砥石は、セグメ
ントチップの高さ方向の中間部に磨耗度が高い中間層が
形成されているので、使用に伴ってセグメントチップが
磨耗し、外周面両端部に形成した凹部が浅くなった段階
で磨耗度の高い中間層が現れる。磨耗度が高いというこ
とは、砥粒の保持力が小さいということであり、したが
って、この中間層においては砥粒の自生作用が促進さ
れ、磨滅した砥粒がいつまでも保持されて切断抵抗が大
きくなることがなく、切れ味が低下することがない。こ
れによって外周面側の凹部と接着部側の凹部を互いにオ
ーバーラップするように形成することなく、言い換えれ
ばセグメントチップの強度を維持しつつ、使い始めから
終わりまで安定した切れ味を持続することが可能とな
る。In the diamond cutting whetstone of the present invention, since the intermediate layer having a high degree of wear is formed at the intermediate portion in the height direction of the segment chip, the segment chip is worn with use and formed on both ends of the outer peripheral surface. An intermediate layer having a high degree of wear appears when the recessed portion becomes shallow. The high degree of wear means that the holding power of the abrasive grains is small, and therefore, in this intermediate layer, the autogenous action of the abrasive grains is promoted, and the worn abrasive grains are retained forever and the cutting resistance is increased. No sharpness is reduced. As a result, it is possible to maintain a stable sharpness from the beginning to the end of use while maintaining the strength of the segment chip without forming the concave part on the outer peripheral surface side and the concave part on the adhesive part side so as to overlap each other. Becomes
【００１２】ここで、中間層の好ましい磨耗度は、使用
する砥粒の粒度やセグメントチップの全高さに対する凹
部深さの割合によっても異なるが、例えば、砥粒の粒度
が＃３０〜＃８０で、凹部深さの割合が４５〜５５％の
場合、他の部位の磨耗度の１０５〜１８０％の範囲であ
る。中間層の磨耗度が他の部位の磨耗度の１０５％未満
であると、砥粒の自生作用を促進する効果がなくなり、
一方１８０％を超えると、砥粒保持力が大きく低下して
砥粒が切断に関与する前に脱落してしまうため、上記範
囲が望ましい。Here, the preferred degree of wear of the intermediate layer varies depending on the grain size of the abrasive grains used and the ratio of the depth of the recess to the total height of the segment chips. When the ratio of the depth of the concave portion is 45 to 55%, it is in the range of 105 to 180% of the degree of wear of other portions. If the degree of wear of the intermediate layer is less than 105% of the degree of wear of other parts, the effect of promoting the self-producing action of the abrasive grains is lost,
On the other hand, if it exceeds 180%, the abrasive grain holding force is greatly reduced and the abrasive grains fall off before participating in cutting, so the above range is desirable.
【００１３】このような磨耗度の差異は、砥粒集中度に
差異を設けたり、また使用する結合剤に軟質のものを用
いるなどによって達成することができる。前記した１０
５〜１８０％の範囲の磨耗度とするには、砥粒集中度に
よる場合は、中間層の砥粒集中度を他の部位の砥粒集中
度より２０〜５０％低くすることによって達成でき、ま
た、結合剤による場合は、中間層の結合剤として例えば
コバルト−鉄−ブロンズ系、コバルト−ブロンズ系、ま
たは鉄−ブロンズ系の結合剤を用い、他の部位の結合剤
としてコバルト−鉄系、コバルト系、または鉄系の結合
剤を用いることによって、中間層の磨耗度を他の部位の
磨耗度の１０５〜１８０％とすることができる。また、
砥粒集中度と結合剤の双方を調整することによって磨耗
度を調整することもできる。Such a difference in the degree of wear can be achieved by providing a difference in the degree of concentration of the abrasive grains, or by using a soft binder for use. 10 mentioned above
In order to obtain a degree of wear in the range of 5 to 180%, in the case of the degree of concentration of abrasive grains, the degree of concentration of abrasive grains in the intermediate layer can be achieved by lowering the degree of concentration of abrasive grains in other parts by 20 to 50%, In the case of using a binder, for example, a cobalt-iron-bronze-based, cobalt-bronze-based, or iron-bronze-based binder is used as a binder of the intermediate layer, and a cobalt-iron-based binder is used as a binder of another portion. By using a cobalt-based or iron-based binder, the degree of wear of the intermediate layer can be set to 105 to 180% of the degree of wear of other parts. Also,
The degree of wear can also be adjusted by adjusting both the degree of abrasive concentration and the binder.
【００１４】従来技術の項で述べたように、砥石による
加工の均一性を維持するためには、使い始めから終わり
まで、被加工物に当たる砥粒の数を同じレベルに保つこ
とが重要であるが、実開昭６２−１７２５６０号公報に
開示された凹部は、外周面側の一対の凹部と接着部側の
凹部とはそれぞれがほぼ同じ断面積であるため、使用に
伴い外周面側の一対の凹部が無くなり接着部側の凹部に
切り替わると、凹部の総断面積がほぼ半分となり、した
がって被加工物に接触する砥粒が増加することとなる。
これによって、接着部側の凹部に切り替わった後にそれ
以前の切れ味との差異が発生し、加工の均一性が維持で
きないことになる。As described in the section of the prior art, in order to maintain the uniformity of the processing by the grindstone, it is important to keep the number of abrasive grains hitting the workpiece from the beginning to the end of use at the same level. However, the concave portion disclosed in Japanese Utility Model Laid-Open No. 62-172560 has a pair of concave portions on the outer peripheral surface side and a concave portion on the adhesive portion side each having substantially the same cross-sectional area. When the concave portion disappears and is switched to the concave portion on the side of the bonding portion, the total cross-sectional area of the concave portion becomes substantially half, and therefore, the abrasive grains in contact with the workpiece increase.
This causes a difference from the sharpness before switching to the concave portion on the bonding portion side, and it is impossible to maintain the uniformity of processing.
【００１５】本発明においてはこのような状態を回避す
るために、外周面側の一対の凹部の断面積の和が、接着
部側の凹部の断面積の８０〜１５０％の範囲となるよう
にしている。これによって、外周面側の一対の凹部が消
失して接着部側の凹部が出現する前後における被加工物
に当たる砥粒数を、実質上同じレベルに維持することが
可能となり、加工の均一性を維持することができる。In the present invention, in order to avoid such a state, the sum of the cross-sectional areas of the pair of concave portions on the outer peripheral surface side is set to be in a range of 80 to 150% of the cross-sectional area of the concave portion on the bonding portion side. ing. Thereby, it becomes possible to maintain the number of abrasive grains hitting the workpiece before and after the pair of concave portions on the outer peripheral surface disappear and the concave portion on the bonding portion side appears, at substantially the same level, and to improve the uniformity of processing. Can be maintained.
【００１６】外周面側の一対の凹部の深さ及び接着部側
の凹部の深さは、セグメントチップの全高さや加工条件
から要求されるセグメントチップの強度に応じて決定す
る。セグメントチップの全高さが８〜１５ｍｍの場合、
凹部の深さはセグメントチップの全高さの４５〜５５％
の範囲であることが望ましい。両凹部の深さがセグメン
トチップの全高さの４５％未満であると、セグメントチ
ップの高さ方向の中央部で凹部の形成されていない領域
が存在し、この領域において切れ味が大幅に低下する。
一方５５％を超えると両凹部がラップする領域が広くな
り、セグメントチップの強度が低下するため、上記範囲
が望ましい。The depth of the pair of concave portions on the outer peripheral surface side and the depth of the concave portion on the bonding portion side are determined in accordance with the total height of the segment chip and the strength of the segment chip required from processing conditions. When the total height of the segment tip is 8 to 15 mm,
The depth of the recess is 45 to 55% of the total height of the segment chip.
Is desirably within the range. If the depth of both concave portions is less than 45% of the total height of the segment chip, there is a region where no concave portion is formed at the center in the height direction of the segment chip, and the sharpness is significantly reduced in this region.
On the other hand, if it exceeds 55%, the area where the two concave portions overlap is widened, and the strength of the segment chip is reduced.
【００１７】本発明において、他の部位よりも磨耗度を
高くした中間層は、外周面側の一対の凹部から接着部側
の凹部へ切り替わる際の切れ味の変化に伴う不都合を解
消するものであり、中間層の厚み（セグメントチップの
高さ方向にみた厚み）は、この目的を達成するように定
めることが必要である。この厚みの望ましい範囲は、使
用する砥粒の粒度、セグメントチップの全高さ、両凹部
の深さによって異なるが、例えば、砥粒の粒度が＃３０
〜＃８０で、両凹部の深さがセグメントチップの全高さ
の４５〜５５％の場合、中間層の厚みはセグメントチッ
プの全高さの１０〜４０％の範囲が望ましい。中間層の
厚みがセグメントチップの全高さの１０％未満である
と、砥粒の粒径に対する中間層の厚みが小さ過ぎ、砥粒
の自生作用が円滑に進まない状態となって切れ味が低下
する。一方、４０％を超えると、磨耗度の高い中間層の
厚みがセグメントチップの全高さに占める割合が大きく
なり過ぎ、寿命の低下が大きくなるため、上記範囲が望
ましい。In the present invention, the intermediate layer having a higher degree of wear than the other portions eliminates the inconvenience associated with the change in sharpness when switching from the pair of concave portions on the outer peripheral surface side to the concave portion on the adhesive portion side. The thickness of the intermediate layer (thickness in the height direction of the segment chip) needs to be determined so as to achieve this purpose. The desirable range of the thickness differs depending on the grain size of the abrasive grains used, the total height of the segment chips, and the depth of both concave portions.
In the case of # 80, when the depth of both recesses is 45 to 55% of the total height of the segment chip, the thickness of the intermediate layer is preferably in the range of 10 to 40% of the total height of the segment chip. When the thickness of the intermediate layer is less than 10% of the total height of the segment chips, the thickness of the intermediate layer is too small with respect to the particle size of the abrasive grains, and the self-generating action of the abrasive grains does not proceed smoothly, and the sharpness is reduced. . On the other hand, if it exceeds 40%, the ratio of the thickness of the intermediate layer having a high degree of wear to the total height of the segment chip becomes too large, and the life is greatly reduced.
【００１８】このような中間層を有するセグメントチッ
プは、ダイヤモンド砥粒と結合剤粉末の攪拌混合物を下
部層、中間層、上部層の順にセグメントチップの高さ方
向に積層し、冷間加圧して成形し、これを所定の圧力、
温度で焼結することにより製造することができる。その
際、特に中間層と下部層及び上部層との境界が平坦にな
るように積層することが肝要である。A segment chip having such an intermediate layer is prepared by laminating a stirred mixture of diamond abrasive grains and a binder powder in the order of lower layer, intermediate layer, and upper layer in the height direction of the segment chip, and applying cold pressure. Molding, and press this at a predetermined pressure,
It can be manufactured by sintering at a temperature. In this case, it is particularly important that the layers are stacked such that the boundaries between the intermediate layer and the lower and upper layers are flat.
【００１９】[0019]
【発明の実施の形態】図１は本発明の一実施の形態を示
す切断砥石の正面図、図２は図１の部分拡大図である。
本実施形態の切断砥石１０は、スリット１１を等間隔で
設けた基板１２の外周面にセグメントチップ１３を固着
し、このセグメントチップ１３の外周面両端部に一対の
凹部１４ａ，１４ｂを形成し、基板１２との接着部に第
２の凹部１５を形成したものであり、セグメントチップ
１３はその高さ方向に上部層１６、中間層１７、下部層
１８の三層構造としている。FIG. 1 is a front view of a cutting wheel showing an embodiment of the present invention, and FIG. 2 is a partially enlarged view of FIG.
In the cutting wheel 10 of the present embodiment, the segment chips 13 are fixed to the outer peripheral surface of the substrate 12 provided with the slits 11 at equal intervals, and a pair of concave portions 14a and 14b are formed at both ends of the outer peripheral surface of the segment chip 13. A second concave portion 15 is formed in a bonding portion with the substrate 12, and the segment chip 13 has a three-layer structure of an upper layer 16, an intermediate layer 17, and a lower layer 18 in the height direction.
【００２０】切断砥石１０の各部の寸法は、基板１２の
外径１００５ｍｍ、同厚み６ｍｍ、セグメントチップ１
３の数６０個、同長さ４０ｍｍ、同高さ１５ｍｍ、同厚
み８．５ｍ、凹部１４ａ，１４ｂの溝幅４．８ｍｍ、同
深さ７．５ｍｍ、凹部１５の溝幅８ｍｍ、同深さ７．５
ｍｍである。The dimensions of each part of the cutting grindstone 10 are as follows: the outer diameter of the substrate 12 is 1005 mm;
3 number 60, same length 40mm, same height 15mm, same thickness 8.5m, groove width of recesses 14a and 14b 4.8mm, same depth 7.5mm, groove width of recess 15 8mm, same depth 7.5
mm.
【００２１】外周面側の一対の凹部１４ａ，１４ｂは図
示のように外広がりの台形状をしており、これによって
切断時に切粉がテーパ面に沿って外部に排出され、切粉
の残留による切断抵抗の増加やセグメントチップ１３の
磨耗を低減することができる。また、接着部側の凹部１
５によって冷却水の供給が効率的に行えるようになる。The pair of concave portions 14a and 14b on the outer peripheral surface have a trapezoidal shape which spreads outward as shown in the figure, whereby chips are discharged to the outside along the tapered surface at the time of cutting, and chips due to residual chips are formed. It is possible to reduce an increase in cutting resistance and wear of the segment chip 13. Also, the concave portion 1 on the bonding portion side
5, the cooling water can be supplied efficiently.
【００２２】セグメントチップ１３の三層構造を構成す
る上部層１６、中間層１７、下部層１８は、ダイヤモン
ド砥粒を用いた砥粒層であり、各層の厚みは、上部層１
６は５．５ｍｍ、中間層１７は４ｍｍ、下部層１８は
５．５ｍｍである。中間層１７は、砥粒の集中度を上部
層１６及び下部層１８の集中度３０に対して集中度２１
と低くし、結合剤として上部層１６及び下部層１８の結
合剤よりも耐磨耗性が３０％低い結合剤を使用して、中
間層１７の磨耗度が上部層１６及び下部層１８の磨耗度
の約１５０％となるようにしている。The upper layer 16, the intermediate layer 17, and the lower layer 18 constituting the three-layer structure of the segment chip 13 are abrasive layers using diamond abrasive grains.
6 is 5.5 mm, the intermediate layer 17 is 4 mm, and the lower layer 18 is 5.5 mm. The intermediate layer 17 has a degree of concentration of the abrasive grains of 21 relative to the degree of concentration 30 of the upper layer 16 and the lower layer 18.
And using a binder having a 30% lower abrasion resistance than the binder of the upper layer 16 and the lower layer 18 as a binder, the degree of wear of the intermediate layer 17 is reduced by the wear of the upper layer 16 and the lower layer 18. About 150% of the degree.
【００２３】このように中間層１７の磨耗度を上部層１
６及び下部層１８よりも高くしたことによって、使用に
伴ってセグメントチップ１３が磨耗し、外周面側の一対
の凹部１４ａ，１４ｂが浅くなった段階で中間層１７が
現れ、この磨耗度の高い中間層１７においては砥粒の自
生作用が促進され、磨滅した砥粒がいつまでも保持され
て切断抵抗が大きくなることがないので、切れ味が低下
することがなく、さらにセグメントチップ１３の磨耗が
進んで接着部側の凹部１５の断面積が大きくなった段階
で中間層１７から下層部１８に移行して、上層部１６と
同じ切れ味に復帰する。このようにして、使い始めから
終わりまで安定した切れ味を持続することができる。As described above, the degree of wear of the middle layer 17 is
6 and the lower layer 18, the segment chip 13 is worn by use, and the intermediate layer 17 appears when the pair of concave portions 14 a and 14 b on the outer peripheral surface becomes shallow, and the degree of wear is high. In the intermediate layer 17, the self-producing action of the abrasive grains is promoted, and the worn abrasive grains are kept forever and the cutting resistance does not increase. Therefore, the sharpness does not decrease, and the wear of the segment chips 13 further proceeds. When the cross-sectional area of the concave portion 15 on the bonding portion side becomes large, the transition from the intermediate layer 17 to the lower layer portion 18 is made, and the sharpness of the upper layer portion 16 is restored. In this way, a stable sharpness can be maintained from the beginning to the end of use.
【００２４】さらに本実施形態においては、セグメント
チップ１３の外周面側の一対の凹部１４ａと１４ｂの断
面積の和が、接着部側の凹部１５の断面積とほぼ同じと
なるようにしたことにより、使い始めにおける被加工物
に当たる砥粒数と、外周面側の一対の凹部１４ａ，１４
ｂが消失して接着部側の凹部１５が出現した後における
被加工物に当たる砥粒数とを、実質上同じレベルに維持
することが可能となり、加工の均一性を維持することが
できるという効果が得られる。Furthermore, in the present embodiment, the sum of the cross-sectional areas of the pair of concave portions 14a and 14b on the outer peripheral surface side of the segment chip 13 is made substantially the same as the cross-sectional area of the concave portion 15 on the bonding portion side. The number of abrasive grains hitting the workpiece at the beginning of use, and the pair of recesses 14a, 14 on the outer peripheral surface side.
It is possible to maintain the number of abrasive grains hitting the workpiece after b disappears and the concave portion 15 on the bonding portion side appears at substantially the same level, thereby maintaining the uniformity of processing. Is obtained.
【００２５】なお上記の実施形態においては、上部層１
６と下部層１８の磨耗度を同じものとしているが、凹部
１４ａ，１４ｂ，１５の形状寸法によっては、上部層１
６と下部層１８の磨耗度を変えて、切れ味の安定性を保
持するようにすることもできる。また、セグメントチッ
プ１３の側面形状を逆台形状にして、セグメントチップ
１３の側面抵抗を低減させることもできる。In the above embodiment, the upper layer 1
6 and the lower layer 18 have the same degree of wear, but depending on the shape and size of the recesses 14a, 14b, and 15, the upper layer 1
6 and the degree of wear of the lower layer 18 can be changed so as to maintain the stability of sharpness. Also, the side surface shape of the segment chip 13 can be reduced by making the side surface shape of the segment chip 13 inverted trapezoidal.
【００２６】[0026]
【実施例】図１に示した本発明になるダイヤモンド切断
砥石（実施例）と、セグメントチップの凹部以外は同じ
形状寸法とし、セグメントチップの砥粒の集中度を実施
例の上下部層と同じ３０とし、結合剤の耐磨耗性を実施
例の上下部層と同じ１００とした実開昭６２−１７２５
６０５号に記載のダイヤモンド切断砥石（比較例）を用
いて、つぎに示す切断条件で比較切断試験を行った。 切断条件 切断機 ：ザンボン社 ＳＡＥ−３ 周速度 ：１６５０ｍ／ｍｉｎ 切込み量：５．５ｍｍ 送り速度：４０００ｍｍ 冷却水量：５０Ｌ／ｍｉｎ 被加工材：天山御影石 １３１０Ｌ×８００Ｗ×４５０
ＨDESCRIPTION OF THE PREFERRED EMBODIMENTS The diamond cutting whetstone (embodiment) according to the present invention shown in FIG. 1 has the same shape and dimensions except for the concave portions of the segment chips, and the concentration of the abrasive grains of the segment chips is the same as that of the upper and lower layers of the embodiment. 30, and the abrasion resistance of the binder was set to 100 which is the same as that of the upper and lower layers of the embodiment.
A comparative cutting test was performed using the diamond cutting wheel described in No. 605 (comparative example) under the following cutting conditions. Cutting conditions Cutting machine: Zambon SAE-3 Peripheral speed: 1650 m / min Cutting depth: 5.5 mm Feeding speed: 4000 mm Cooling water amount: 50 L / min Work material: Amayama granite 1310 L × 800 W × 450
H
【００２７】セグメントチップが高さ５ｍｍ分磨耗する
まで馴らし切断を行った後、セグメントチップの高さが
１０ｍｍから５ｍｍまで磨耗するまでの間の消費電力の
推移を図３に示す。切断時の消費電力は切断抵抗、すな
わち砥石の切れ味に比例するので、消費電力の推移は砥
石の切れ味の変化を示すものとなる。FIG. 3 shows the transition of the power consumption until the segment chips are worn down from 10 mm to 5 mm after the break-in and cutting are performed until the segment chips are worn by 5 mm in height. Since the power consumption during cutting is proportional to the cutting resistance, that is, the sharpness of the grindstone, the transition of the power consumption indicates a change in the sharpness of the grindstone.
【００２８】図３に示すように、実施例の砥石において
は、セグメントチップの高さが１０ｍｍから５ｍｍまで
磨耗するまでの間の消費電力の変化は小さく、この間に
おける切れ味が安定していることがわかる。これに対し
て比較例の砥石においては、セグメントチップの高さ方
向の中央部、すなわち実施例の砥石の中間層に相当する
領域で消費電力が上昇し、とくに中心部における消費電
力の上昇が著しく、切れ味が低下していることがわか
る。As shown in FIG. 3, in the grindstone of the embodiment, the change in power consumption is small until the height of the segment chip wears from 10 mm to 5 mm, and the sharpness during this period is stable. Recognize. On the other hand, in the grindstone of the comparative example, the power consumption increases in the central portion in the height direction of the segment chip, that is, in the region corresponding to the intermediate layer of the grindstone of the example, and the power consumption in the central portion is particularly remarkable. It can be seen that the sharpness is reduced.
【００２９】また、セグメントチップの高さが８ｍｍか
ら７ｍｍまで磨耗するまでの間、すなわち中心部の切断
時における砥石の寿命性能（＝切断面積ｍ2 ／セグメン
トチップ磨耗量ｍｍ）は、実施例の砥石は１２．３２ｍ
2 ／ｍｍ、比較例の砥石は１０．１１ｍ2 ／ｍｍであ
り、実施例の砥石は比較例の砥石に比して寿命性能が約
２０％向上していることが確認された。The life performance (= cutting area m 2 / segment tip wear amount mm) of the grinding wheel until the height of the segment tip wears from 8 mm to 7 mm, that is, at the time of cutting the center portion, is as shown in FIG. The whetstone is 12.32m
2 / mm, the grindstone of the comparative example was 10.11 m 2 / mm, and it was confirmed that the life performance of the grindstone of the example was improved by about 20% as compared with the grindstone of the comparative example.
【００３０】さらに、加工精度を表すものとして、所定
の切込み方向とのズレを測定したところ、実施例の砥石
は０．４８ｍｍ、比較例の砥石は１．２０ｍｍであり、
実施例の砥石は比較例の砥石に比して加工精度も優れて
いることが確認された。Further, when the deviation from a predetermined cutting direction was measured to indicate the processing accuracy, the whetstone of the example was 0.48 mm and the whetstone of the comparative example was 1.20 mm.
It was confirmed that the grindstones of the examples had better processing accuracy than the grindstones of the comparative examples.
【００３１】[0031]
【発明の効果】本発明によって以下の効果を奏すること
ができる。According to the present invention, the following effects can be obtained.
【００３２】（１）セグメントチップの外周面両端部の
一対の凹部と基板との接着部側の凹部とをその底面がセ
グメントチップの高さ方向のほぼ中心位置にくるように
配置し、さらにセグメントチップの高さ方向の中間部領
域を他の部位よりも磨耗度を高くすることにより、中間
層における砥粒の自生作用が促進されて切れ味が低下す
ることがなく、これによって砥石の使い始めから終わり
まで安定した切れ味を持続することが可能となる。(1) A pair of concave portions at both ends of the outer peripheral surface of the segment chip and a concave portion on the side of the bonding portion with the substrate are arranged such that the bottom surface thereof is substantially at the center in the height direction of the segment chip. By increasing the degree of wear in the middle area in the height direction of the tip compared to other parts, the self-generation of abrasive grains in the intermediate layer is promoted and the sharpness does not decrease, and from this the beginning of use of the grinding wheel It is possible to maintain stable sharpness until the end.
【００３３】（２）砥粒集中度、結合剤のいずれかまた
は双方を調整して中間層の磨耗度を特定の範囲に調整す
るとともにこの中間層の厚みを特定の関係を満足する範
囲とし、さらに、外周面両端部の一対の凹部と基板との
接着部側の凹部の断面積及び深さを特定の関係を満足す
る範囲とすることにより、切断の過程において中間層に
おける砥粒の自生作用を促進して切れ味の低下を防ぎ、
被加工物に当たる砥粒数を同じレベルに維持して加工の
均一性を維持しながら、良好な加工精度と砥石寿命の向
上を図ることができる。(2) The degree of abrasive grain concentration and / or the binder are adjusted to adjust the degree of wear of the intermediate layer to a specific range, and the thickness of the intermediate layer is set to satisfy a specific relationship; Furthermore, by setting the cross-sectional area and the depth of the pair of concave portions at both ends of the outer peripheral surface and the concave portion on the side of the bonding portion between the substrate and the substrate within a range that satisfies a specific relationship, the autogenous action of the abrasive grains in the intermediate layer during the cutting process Promotes sharpness and prevents sharpness loss,
It is possible to improve the processing accuracy and improve the life of the grinding wheel while maintaining the uniformity of processing by maintaining the number of abrasive grains hitting the workpiece at the same level.
【図１】本発明の一実施の形態を示す切断砥石の正面図
である。FIG. 1 is a front view of a cutting whetstone showing one embodiment of the present invention.
【図２】図１の部分拡大図である。FIG. 2 is a partially enlarged view of FIG.
【図３】切断中の消費電力の推移を示すグラフである。FIG. 3 is a graph showing transition of power consumption during disconnection.
１０ 切断砥石 １１ スリット １２ 基板 １３ セグメントチップ １４ａ，１４ｂ，１５ 凹部 １６ 上部層 １７ 中間層 １８ 下部層 DESCRIPTION OF SYMBOLS 10 Cutting whetstone 11 Slit 12 Substrate 13 Segment chip 14a, 14b, 15 Depression 16 Upper layer 17 Intermediate layer 18 Lower layer
Claims (6)
チップの外周面両端部に一対の凹部を形成するととも
に、前記セグメントチップの長さ方向のほぼ中間位置で
あって前記基板との接着部に第２の凹部を形成してなる
ダイヤモンド切断砥石において、 前記外周面側の一対の凹部の底面と前記接着部側の凹部
の底面を前記基板を中心とするほぼ同一円周上に配置
し、さらに前記セグメントチップの高さ方向の中間部で
あって前記外周面側の一対の凹部の底部及び接着部側の
凹部の底部を含む領域に、他の部位よりも磨耗度が高い
中間層を形成したことを特徴とするダイヤモンド切断砥
石。1. A pair of recesses are formed at both ends of an outer peripheral surface of a segment chip fixed to the outer periphery of a disk-shaped substrate, and a pair of recesses are formed at substantially intermediate positions in the length direction of the segment chip and at a bonding portion with the substrate. In a diamond cutting whetstone formed with a second concave portion, the bottom surfaces of the pair of concave portions on the outer peripheral surface side and the bottom surface of the concave portion on the bonding portion side are arranged on substantially the same circumference around the substrate, An intermediate layer having a higher degree of wear than other portions was formed in a region including the bottom of the pair of concave portions on the outer peripheral surface side and the bottom of the concave portion on the bonding portion side, which was the intermediate portion in the height direction of the segment chip. A diamond cutting whetstone, characterized in that:
の１０５〜１８０％の範囲であることを特徴とする請求
項１記載のダイヤモンド切断砥石。2. The diamond cutting wheel according to claim 1, wherein the degree of wear of the intermediate layer is in the range of 105 to 180% of the degree of wear of other parts.
剤の差異のいずれかまたは双方により達成していること
を特徴とする請求項１，２記載のダイヤモンド切断砥
石。3. The diamond cutting wheel according to claim 1, wherein the difference in the degree of wear is achieved by one or both of the degree of concentration of abrasive grains and the difference in binder.
が、前記接着部側の凹部の断面積の８０〜１５０％の範
囲となるようにしたことを特徴とする請求項１〜３記載
のダイヤモンド切断砥石。4. The method according to claim 1, wherein the sum of the cross-sectional areas of the pair of concave portions on the outer peripheral surface is in the range of 80 to 150% of the cross-sectional area of the concave portion on the bonding portion side. 3. The diamond cutting whetstone according to 3.
記接着部側の凹部の深さが、セグメントチップの全高さ
の４５〜５５％の範囲であることを特徴とする請求項１
〜４記載のダイヤモンド切断砥石。5. The depth of the pair of concave portions on the outer peripheral surface side and the depth of the concave portion on the bonding portion side are in the range of 45 to 55% of the total height of the segment chip.
5. The diamond cutting whetstone according to any one of items 4 to 4.
全高さの１０〜４０％の範囲であることを特徴とする請
求項１〜５記載のダイヤモンド切断砥石。6. The diamond cutting wheel according to claim 1, wherein the thickness of the intermediate layer is in the range of 10 to 40% of the total height of the segment chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23493697A JP3325500B2 (en) | 1997-08-29 | 1997-08-29 | Diamond cutting whetstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23493697A JP3325500B2 (en) | 1997-08-29 | 1997-08-29 | Diamond cutting whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1170473A true JPH1170473A (en) | 1999-03-16 |
| JP3325500B2 JP3325500B2 (en) | 2002-09-17 |
Family
ID=16978603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23493697A Expired - Fee Related JP3325500B2 (en) | 1997-08-29 | 1997-08-29 | Diamond cutting whetstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3325500B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1108508A2 (en) * | 2001-03-10 | 2001-06-20 | didia Diamanttechnik GmbH | Cutting segments for cutting tools |
| WO2004078440A1 (en) | 2003-03-06 | 2004-09-16 | Ehwa Diamond Ind. Co., Ltd. | Gear type machining tip and tool attaching the same thereon |
| KR100643217B1 (en) | 2005-02-01 | 2006-11-10 | 이창현 | Wave type tip and machining wheel having the same |
| US9192746B2 (en) | 2010-06-07 | 2015-11-24 | Cook Medical Technologies Llc | Reperfusion catheter system |
| JP2016209993A (en) * | 2015-05-08 | 2016-12-15 | サンーゴバン アブレイシブズ，インコーポレイティド | Cutting article having laminar segment |
-
1997
- 1997-08-29 JP JP23493697A patent/JP3325500B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1108508A2 (en) * | 2001-03-10 | 2001-06-20 | didia Diamanttechnik GmbH | Cutting segments for cutting tools |
| EP1108508A3 (en) * | 2001-03-10 | 2001-10-04 | didia Diamanttechnik GmbH | Cutting segments for cutting tools |
| WO2004078440A1 (en) | 2003-03-06 | 2004-09-16 | Ehwa Diamond Ind. Co., Ltd. | Gear type machining tip and tool attaching the same thereon |
| KR100643217B1 (en) | 2005-02-01 | 2006-11-10 | 이창현 | Wave type tip and machining wheel having the same |
| US9192746B2 (en) | 2010-06-07 | 2015-11-24 | Cook Medical Technologies Llc | Reperfusion catheter system |
| JP2016209993A (en) * | 2015-05-08 | 2016-12-15 | サンーゴバン アブレイシブズ，インコーポレイティド | Cutting article having laminar segment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3325500B2 (en) | 2002-09-17 |
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