JPH1167576A - Laminated material for ceramic capacitor conductor formation use and manufacture of ceramic capacitor using that - Google Patents
Laminated material for ceramic capacitor conductor formation use and manufacture of ceramic capacitor using thatInfo
- Publication number
- JPH1167576A JPH1167576A JP24336197A JP24336197A JPH1167576A JP H1167576 A JPH1167576 A JP H1167576A JP 24336197 A JP24336197 A JP 24336197A JP 24336197 A JP24336197 A JP 24336197A JP H1167576 A JPH1167576 A JP H1167576A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic
- conductive particle
- ceramic capacitor
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セラミックコンデ
ンサーの導体形成用積層体とそれを用いたセラミックコ
ンデンサーの製造方法に関する。The present invention relates to a laminate for forming a conductor of a ceramic capacitor and a method for manufacturing a ceramic capacitor using the same.
【０００２】[0002]
【従来の技術】従来のセラミックコンデンサーの導体形
成方法としては、誘電体となるセラミック基板の所望の
位置に、所望の回路で、銀ペースト・ニッケルペースト
などの導電性材料をスクリーン印刷し、乾燥したのち、
導体を形成したセラミック基板を導体が交互になるよう
に重ね合わせ、電極を形成することにより製造してい
た。しかしながら、通常厚さ１ｍｍ前後の薄いセラミッ
ク誘電体に、導体厚み１〜２μｍという導体をスクリー
ン印刷するという作業は大変手間が掛かり、技術的にも
極めて高いレベルを要求されるという問題点があった。2. Description of the Related Art As a conventional method for forming a conductor of a ceramic capacitor, a conductive material such as a silver paste or a nickel paste is screen-printed in a desired circuit at a desired position on a ceramic substrate serving as a dielectric and dried. Later
It has been manufactured by laminating ceramic substrates on which conductors are formed so that conductors are alternately formed, and forming electrodes. However, the work of screen-printing a conductor having a conductor thickness of 1 to 2 μm on a thin ceramic dielectric having a thickness of usually about 1 mm is very troublesome, and there is a problem that an extremely high technical level is required. .
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、スク
リーン印刷手段を用いることなく、簡単な方法でセラミ
ックコンデンサーの導体をセラミック誘電体上に形成す
るためのセラミックコンデンサーの導体形成用積層体お
よびそれを用いたセラミックコンデンサーの製造方法を
提供する点にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic capacitor conductor forming laminate for forming a ceramic capacitor conductor on a ceramic dielectric by a simple method without using screen printing means. It is an object of the present invention to provide a method for manufacturing a ceramic capacitor using the same.
【０００４】[0004]
【課題を解決するための手段】本発明の第一は、（ａ）
支持体層、（ｂ）剥離層および（ｃ）導電性粒子と熱接
着性を有する樹脂とを含有する導電性粒子含有層の順で
積層されていることを特徴とするセラミックコンデンサ
ーの導体形成用積層体に関する。この積層体のモデル断
面図を図１に示す。１は支持体層、２は剥離層、３は導
電性粒子含有層である。Means for Solving the Problems The first aspect of the present invention is that (a)
A conductive layer for a ceramic capacitor, comprising: a support layer, (b) a release layer, and (c) a conductive particle-containing layer containing conductive particles and a resin having thermal adhesiveness. It relates to a laminate. FIG. 1 shows a model sectional view of this laminate. 1 is a support layer, 2 is a release layer, and 3 is a conductive particle-containing layer.
【０００５】本発明の第二は、セラミック基板の焼成
時には焼失する性質をもつ支持体層および導電性粒子
と熱接着性を有する樹脂とを含有する導電性粒子含有層
よりなることを特徴とするセラミックコンデンサーの導
体形成用積層体に関する。この積層体のモデル断面図を
図２に示す。５は支持体層、６は導電性粒子含有層であ
る。[0005] A second aspect of the present invention is characterized in that the ceramic substrate comprises a support layer having a property of being burned out during firing and a conductive particle-containing layer containing a conductive particle and a resin having thermal adhesiveness. The present invention relates to a laminate for forming a conductor of a ceramic capacitor. FIG. 2 shows a model cross-sectional view of this laminate. 5 is a support layer and 6 is a layer containing conductive particles.
【０００６】本発明の第三は、前記請求項１記載のセラ
ミックコンデンサーの導体形成用積層体を、焼成または
未焼成のセラミック誘電体の少なくとも片面に所望の回
路形態で仮接着し、前記（ｂ）の剥離層により前記
（ａ）の支持体層を剥離し、前記（ｃ）の導電性粒子含
有層と前記セラミック誘電体とを所定枚数積層してなる
セラミック誘電体積層物を焼成して前記導電性粒子含有
層中の樹脂成分を焼失させることを特徴とするセラミッ
クコンデンサーの製造方法に関する。A third aspect of the present invention is that the laminate for forming a conductor of the ceramic capacitor according to the first aspect is temporarily bonded to at least one surface of a fired or unfired ceramic dielectric in a desired circuit form, and The support layer of (a) is peeled off by the release layer of (a), and a ceramic dielectric laminate formed by laminating a predetermined number of the conductive particle-containing layer of (c) and the ceramic dielectric is fired, The present invention relates to a method for manufacturing a ceramic capacitor, wherein a resin component in a conductive particle-containing layer is burned off.
【０００７】本発明の第四は、前記請求項２記載のセラ
ミックコンデンサーの導体形成用積層体を、焼成または
未焼成のセラミック誘電体の少なくとも片面に所望の回
路形態で仮接着した後、これを所定枚数積層してなるセ
ラミック誘電体積層物を焼成して前記の支持体層およ
び前記の導電性粒子含有層中の樹脂成分をそれぞれ焼
失させることを特徴とするセラミックコンデンサーの製
造方法に関する。A fourth aspect of the present invention is that the laminated body for forming a conductor of a ceramic capacitor according to the second aspect is temporarily bonded in at least one surface of a fired or unfired ceramic dielectric in a desired circuit form, and then this is bonded. The present invention relates to a method for manufacturing a ceramic capacitor, characterized by firing a ceramic dielectric laminate formed by laminating a predetermined number of layers to burn out the resin components in the support layer and the conductive particle-containing layer, respectively.
【０００８】本発明の第五は、前記請求項１記載のセラ
ミックコンデンサーの導体形成用積層体を所望の回路の
形に切り抜き、この切り抜き片を焼成または未焼成のセ
ラミック誘電体の少なくとも片面に仮接着し、前記
（ｂ）の剥離層により前記（ａ）の支持体層を剥離し、
前記（ｃ）の導電性粒子含有層と前記セラミック誘電体
とを所定枚数積層してなるセラミック誘電体積層物を焼
成して前記導電性粒子含有層中の樹脂成分を焼失させる
ことを特徴とするセラミックコンデンサーの製造方法に
関する。According to a fifth aspect of the present invention, a laminate for forming a conductor of a ceramic capacitor according to claim 1 is cut into a desired circuit shape, and the cut piece is temporarily formed on at least one surface of a fired or unfired ceramic dielectric. Bonding, peeling off the support layer of (a) with the peeling layer of (b),
(C) firing a ceramic dielectric laminate formed by laminating a predetermined number of the conductive particle-containing layer and the ceramic dielectric to burn off the resin component in the conductive particle-containing layer. The present invention relates to a method for manufacturing a ceramic capacitor.
【０００９】本発明の第六は、前記請求項２記載のセラ
ミックコンデンサーの導体形成用積層体を所望の回路の
形に切り抜き、この切り抜き片を焼成または未焼成のセ
ラミック誘電体の少なくとも片面に仮接着した後、これ
を所定枚数積層してなるセラミック誘電体積層物を焼成
して前記の支持体層および前記の導電性粒子含有層
中の樹脂成分をそれぞれ焼失させることを特徴とするセ
ラミックコンデンサーの製造方法に関する。According to a sixth aspect of the present invention, a laminate for forming a conductor of a ceramic capacitor according to claim 2 is cut into a desired circuit shape, and the cut piece is temporarily formed on at least one surface of a fired or unfired ceramic dielectric. After bonding, a ceramic dielectric laminate formed by laminating a predetermined number of the ceramic dielectric laminates is fired to burn off the resin components in the support layer and the conductive particle-containing layer, respectively. It relates to a manufacturing method.
【００１０】本発明の支持体としては、格別の制限はな
いが、通常仮接着の一つの手段であるホットスタンピン
グに耐えられる程度の耐熱性をもちかつ熱伝導性に優れ
た支持体であることが好ましく、その具体例としては、
アルミニウム箔や金属箔、ポリエチレンテレフタレート
のような２００℃以上の融点を有する合成樹脂フィルム
などを挙げることができる。Although the support of the present invention is not particularly limited, the support must have heat resistance enough to withstand hot stamping, which is one means of temporary bonding, and excellent heat conductivity. Is preferable, and as a specific example,
Examples include aluminum foil, metal foil, and synthetic resin films having a melting point of 200 ° C. or more, such as polyethylene terephthalate.
【００１１】また、セラミック基板の焼成時には焼失す
る性質をもつ支持体層としては、前記ホットスタンピン
グに耐えられる程度の耐熱性をもちかつ熱伝導性にも優
れているものが好ましく、その具体例としては、三酢酸
セルロース、二酢酸セルロース、セロファンおよびグラ
シン紙のような浸透性のない紙などを挙げることができ
る。As the support layer having the property of burning out when the ceramic substrate is fired, a support layer having heat resistance enough to withstand the hot stamping and excellent heat conductivity is preferable. Examples thereof include non-permeable papers such as cellulose triacetate, cellulose diacetate, cellophane and glassine paper.
【００１２】前記導電性粒子としては、銀、銅、ニッケ
ル、スズなどの金属、酸化亜鉛、酸化スズのような導電
性酸化物などの粒子を挙げることができる。導電性粒子
ペーストのなかで導電性粒子が占める配合割合は３０〜
９０重量％であり、塗膜の厚みは乾燥した状態で０．５
〜５μｍ、好ましくは０．８〜１．２μｍであり、導電
性粒子の形状は鱗片状、粉末状など任意の形状をとるこ
とができ、Ａｇの場合は鱗片状、Ｃｕの場合は粒子状で
あることが好ましいが、一般的には粒子状であることが
好ましい。導電性粒子の大きさは、とくに限定されるも
のではないが、通常０．２〜５μｍ、好ましくは０．５
〜１μｍである。Examples of the conductive particles include particles such as metals such as silver, copper, nickel and tin, and conductive oxides such as zinc oxide and tin oxide. The mixing ratio of the conductive particles in the conductive particle paste is 30 to
90% by weight, and the thickness of the coating film was 0.5% in a dry state.
To 5 μm, preferably 0.8 to 1.2 μm, and the shape of the conductive particles may be any shape such as flakes, powders, etc., Ag is a flake, and Cu is a particle. Although it is preferable that it is present, it is generally preferable that it is in the form of particles. Although the size of the conductive particles is not particularly limited, it is usually 0.2 to 5 μm, preferably 0.5 to 5 μm.
１1 μm.
【００１３】前記熱接着性を有する樹脂としては、とく
に制限はないが、エポキシ樹脂、フェノキシ樹脂、フェ
ノール樹脂などの熱硬化性樹脂のＢ状態のものあるいは
ポリエチレンテレフタレートなどのポリエステル類のよ
うな熱可塑性樹脂など、ホットスタンピングに耐えられ
る程度の耐熱性をもつものが好ましい。The resin having the thermal adhesive property is not particularly limited, but may be a B-state thermosetting resin such as an epoxy resin, a phenoxy resin or a phenol resin, or a thermoplastic resin such as a polyester such as polyethylene terephthalate. It is preferable to use a material such as resin having heat resistance enough to withstand hot stamping.
【００１４】前記剥離層を形成するための剥離剤として
は、各種のシリコーンやふっ素樹脂などを使用すること
ができる。As the release agent for forming the release layer, various types of silicones and fluororesins can be used.
【００１５】本発明の請求項１の電極形成用積層体を製
造するためには、前記支持体１の上に剥離剤を塗布、乾
燥して剥離層２を形成した後、熱接着性を有する樹脂、
すなわち熱硬化性樹脂（初期縮合物）または熱可塑性樹
脂２〜２０重量部、溶剤６〜４８重量部、硬化剤（熱硬
化性樹脂の場合）２〜１重量部、導電性粒子８８〜３１
重量部、好ましくは８０〜６５重量部および必要に応じ
てポリエステル系等のヒートシール性付与剤３〜３０重
量部、好ましくは５〜２０重量部よりなる導電性粒子ペ
ーストを塗布し、熱硬化性樹脂がＢ状態にとどまる程度
の温度で溶剤が残らない程度に乾燥し、導電性粒子含有
層３を形成することにより電極形成用積層体を製造す
る。なお、導電性粒子ペースト中には、セラミック基板
の焼成時に溶融する無機物質粉末例えばガラス粉、フリ
ットなどを最大２０重量％まで混合しておくこともでき
る。In order to manufacture the laminate for forming an electrode according to the first aspect of the present invention, after a release agent is applied on the support 1 and dried to form a release layer 2, the support 1 has a thermal adhesive property. resin,
That is, 2 to 20 parts by weight of a thermosetting resin (initial condensate) or a thermoplastic resin, 6 to 48 parts by weight of a solvent, 2 to 1 part by weight of a curing agent (in the case of a thermosetting resin), and 88 to 31 of conductive particles.
Parts by weight, preferably 80 to 65 parts by weight, and if necessary, 3 to 30 parts by weight of a heat sealability imparting agent such as polyester, and preferably 5 to 20 parts by weight. The electrode-forming laminate is manufactured by drying the resin at a temperature at which the resin stays in the B state to the extent that no solvent remains, and forming the conductive particle-containing layer 3. Note that the conductive particle paste may contain up to 20% by weight of an inorganic substance powder, such as glass powder and frit, which melts when the ceramic substrate is fired.
【００１６】本発明の請求項２の電極形成用積層体を製
造するためには、前記の支持体上に熱接着性を有する
樹脂、すなわち熱硬化性樹脂（初期縮合物）または熱可
塑性樹脂２〜２０重量部、溶剤６〜４８重量部、硬化剤
（熱硬化性樹脂の場合）２〜１重量部、導電性粒子８８
〜３１重量部、好ましくは８０〜６５重量部および必要
に応じてポリエステル系等のヒートシール性付与剤３〜
３０重量部、好ましくは５〜２０重量部よりなる導電性
粒子ペーストを塗布し、熱硬化性樹脂がＢ状態にとどま
る程度の温度で溶剤が残らない程度に乾燥し、前記の
導電性粒子含有層を形成することにより電極形成用積層
体を製造する。なお、導電性粒子ペースト中には、セラ
ミック基板の焼成時に溶融する無機物質粉末例えばガラ
ス粉、フリットなどを最大２０重量％まで混合しておく
こともできる。In order to manufacture the laminate for forming an electrode according to the second aspect of the present invention, a resin having a thermal adhesive property on the support, that is, a thermosetting resin (initial condensate) or a thermoplastic resin 2 -20 parts by weight, 6-48 parts by weight of solvent, 2-1 part by weight of curing agent (for thermosetting resin), conductive particles 88
To 31 parts by weight, preferably 80 to 65 parts by weight and, if necessary, a heat-sealing agent 3 to 3
30 parts by weight, preferably 5 to 20 parts by weight of a conductive particle paste is applied, dried at such a temperature that the thermosetting resin stays in the B state and no solvent remains, and the conductive particle-containing layer is formed. Is formed to produce an electrode forming laminate. Note that the conductive particle paste may contain up to 20% by weight of an inorganic substance powder, such as glass powder and frit, which melts when the ceramic substrate is fired.
【００１７】前記溶剤としては、メチルエチルケトン
（ＭＥＫ）、メチルイソブチルケトン、メチルイソプロ
ピルケトン、シクロヘキサノンなど、使用する熱接着性
を有する樹脂に対応した溶剤を使用することができる。As the solvent, there can be used a solvent corresponding to the resin having thermal adhesiveness to be used, such as methyl ethyl ketone (MEK), methyl isobutyl ketone, methyl isopropyl ketone, and cyclohexanone.
【００１８】導電性粒子含有層のうえに、必要に応じて
接着剤層を別途形成することもできるが、当然この層中
にも導電性粒子を含有させることが必要であるから、導
電性粒子含有層自体で仮接着できるようにすることが好
ましい。An adhesive layer can be separately formed on the conductive particle-containing layer, if necessary. However, since it is necessary to include the conductive particles in this layer, the conductive It is preferable that the containing layer itself can be temporarily bonded.
【００１９】[0019]
【実施例】以下に実施例を挙げて本発明を説明するが、
本発明はこれにより何ら限定されるものではない。EXAMPLES The present invention will be described below with reference to examples.
The present invention is not limited thereby.
【００２０】実施例１ その１：導体形成用積層体の製造 熱可塑性ポリエステル樹脂３０重量％（樹脂分３０重量
％、溶剤ＭＥＫ７０重量％）に顆粒状のニッケル粒子
（粒径 １μｍ）を７０重量％になるように加え良く撹
拌し、樹脂中に分散した。この塗料を２軸延伸した厚さ
２５μｍのポリエチレンテレフタレート（ＰＥＴ）フィ
ルム１に１μｍ厚のシリコーン剥離層２を有する積層体
上に３μｍ厚で塗工した。この積層体を１００℃のオー
ブンに入れ、乾燥し、導電性粒子含有層（ｃ）３を形成
して、導体形成用積層体を作った。この時導電性粒子含
有層（ｃ）３の厚みは０．９μｍであった。 その２：セラミックコンデンサーの製造 その１で製造した導体形成用積層体を４ｍｍ幅のスリッ
ト状に切断して導体形成用積層体回路材（４ｍｍ幅のテ
ープとしてロール状に巻きとったもの）を作り、セラミ
ックチップ、すなわちセラミック誘電体（５ｍｍ×５ｍ
ｍ 厚み２μｍ）の片面に導電性粒子含有層（ｃ）がセ
ラミックチップに接するようにセットし、支持体層
（ａ）側から１８０℃、２Ｋｇ／ｃｍ2、２ｓｅｃ．の
熱圧着条件で、セラミックチップと導体形成用積層体回
路材とを熱接着（仮接着）させた。次に支持体層（ａ）
を、剥離層（ｂ）を利用してセラミックチップから剥離
した。このようにして形成したチップを交互に重ね合わ
せセラミック誘電体積層物を作った。前記セラミック誘
電体積層物を５００℃の炉に３時間入れ、焼成した後、
図３のようにチップの両側に電極８を付け、コンデンサ
ーを作成した。Example 1 Part 1: Preparation of Laminate for Conductor Formation 30% by weight of thermoplastic polyester resin (resin content 30% by weight, solvent MEK 70% by weight) and 70% by weight of granular nickel particles (particle size 1 μm) And stirred well, and dispersed in the resin. This coating material was applied in a thickness of 3 μm on a laminate having a 1 μm thick silicone release layer 2 on a biaxially stretched 25 μm thick polyethylene terephthalate (PET) film 1. This laminate was placed in an oven at 100 ° C. and dried to form a conductive particle-containing layer (c) 3 to prepare a conductor-forming laminate. At this time, the thickness of the conductive particle-containing layer (c) 3 was 0.9 μm. Part 2: Manufacture of ceramic capacitor The laminate for conductor formation manufactured in Step 1 is cut into a slit shape of 4 mm width to make a laminate circuit material for conductor formation (rolled as a 4 mm tape in a roll). , A ceramic chip, that is, a ceramic dielectric (5 mm × 5 m
The conductive particle-containing layer (c) was set on one side of a 2 m thick layer at a temperature of 180 ° C., 2 kg / cm 2 , 2 sec. from the support layer (a) side. Under the thermocompression bonding conditions described above, the ceramic chip and the laminate-forming circuit material for conductor formation were thermally bonded (temporarily bonded). Next, the support layer (a)
Was separated from the ceramic chip by using the release layer (b). The chips thus formed were alternately stacked to form a ceramic dielectric laminate. After placing the ceramic dielectric laminate in a furnace at 500 ° C. for 3 hours and firing,
Electrodes 8 were attached to both sides of the chip as shown in FIG. 3 to form a capacitor.
【００２１】実施例２ その１：導体形成用積層体の製造 エポキシ樹脂３０重量％（樹脂分３０重量％、溶剤ＭＥ
Ｋ７０重量％）に顆粒状のニッケル粒子（粒径 １μ
ｍ）を７０重量％になるように加え良く撹拌し、樹脂中
に分散した。この塗料を２軸延伸した厚さ２５μｍのポ
リエチレンテレフタレート（ＰＥＴ）フィルム１に１μ
ｍ厚のシリコーン剥離層２を有する積層体上に３μｍ厚
に塗工した。この積層体を１００℃のオーブンに入れ、
乾燥し、導電性粒子含有層（ｃ）３を形成して、導体形
成用積層体を作った。この時の導電性粒子含有層（ｃ）
は厚みは０．９μｍであった。また、この時の導電性粒
子含有層（ｃ）のエポキシ樹脂はＢステージの状態にな
るように乾燥条件を設定した。 その２：セラミックコンデンサーの製造 その１で製造した導体形成用積層体を４ｍｍ幅のスリッ
ト状に切断して導体形成用積層体回路材（４ｍｍ幅のテ
ープとしてロール状に巻きとったもの）を作り、セラミ
ックチップ（５ｍｍ×５ｍｍ 厚み２μｍ）の片面に導
電性粒子含有層（ｃ）がセラミックチップに接するよう
にセットし、支持体層（ａ）側から１８０℃、２Ｋｇ／
ｃｍ2、２ｓｅｃ．の熱圧着条件で、セラミックチップ
と導体形成用積層体回路材とを熱接着（仮接着）させ
た。次に支持体層（ａ）を、剥離層（ｂ）を利用してセ
ラミックチップから剥離した。このようにして形成した
チップを交互に重ね合わせセラミック誘電体積層物を作
った。前記セラミック誘電体積層物を５００℃の炉に３
時間入れ、焼成した後、図３のようにチップの両側に電
極８を付け、コンデンサーを作成した。Example 2 Part 1: Production of Laminated Body for Conductor Formation 30% by weight of epoxy resin (resin content 30% by weight, solvent ME
K70% by weight) and granular nickel particles (particle size 1μ)
m) was added to 70% by weight, and the mixture was stirred well and dispersed in the resin. This paint was biaxially stretched to 1 μm on a 25 μm thick polyethylene terephthalate (PET) film 1.
It was applied to a thickness of 3 μm on a laminate having an m-thick silicone release layer 2. Put this laminate in a 100 ° C oven,
After drying, the conductive particle-containing layer (c) 3 was formed to form a laminate for forming a conductor. At this time, the conductive particle-containing layer (c)
Had a thickness of 0.9 μm. At this time, the drying conditions were set so that the epoxy resin of the conductive particle-containing layer (c) was in the B-stage state. Part 2: Manufacture of ceramic capacitor The laminate for conductor formation manufactured in Step 1 is cut into a slit shape of 4 mm width to make a laminate circuit material for conductor formation (rolled as a 4 mm tape in a roll). The conductive particle-containing layer (c) was set on one side of a ceramic chip (5 mm × 5 mm, 2 μm in thickness) so as to be in contact with the ceramic chip, and 180 ° C., 2 Kg / cm from the support layer (a) side.
cm 2 , 2 sec. Under the thermocompression bonding conditions described above, the ceramic chip and the laminate-forming circuit material for conductor formation were thermally bonded (temporarily bonded). Next, the support layer (a) was separated from the ceramic chip by using the release layer (b). The chips thus formed were alternately stacked to form a ceramic dielectric laminate. The ceramic dielectric laminate is placed in a furnace at 500 ° C. for 3 hours.
After a certain period of time and firing, electrodes 8 were attached to both sides of the chip as shown in FIG. 3 to form a capacitor.
【００２２】実施例３ その１：導体形成用積層体の製造 鱗片状の銀粒子（１５×１５×２μｍ）７５重量％を含
むエポキシ樹脂組成物を、三酢酸セルロースフィルム
（３８μｍ厚）５上に塗布し、８０℃以下の温度で乾燥
して、厚さ４０μｍの銀粒子含有層６を形成して、導体
形成用積層体を作った。 その２：セラミックコンデンサーの製造 その１で製造した導体形成用積層体を４ｍｍ幅のスリッ
ト状に切断して導体形成用積層体回路材（４ｍｍ幅のテ
ープとしてロール状に巻きとったもの）を作り、セラミ
ックチップ、すなわちセラミック誘電体（５ｍｍ×５ｍ
ｍ 厚み２μｍ）の片面に導電性粒子含有層（ｃ）がセ
ラミックチップに接するようにセットし、支持体層
（ａ）側から１８０℃、２Ｋｇ／ｃｍ2、２ｓｅｃ．の
熱圧着条件で、セラミックチップと導体形成用積層体回
路材とを熱接着（仮接着）させた。このようにして形成
したチップを交互に重ね合わせセラミック誘電体積層物
を作った。前記セラミック誘電体積層物を５００℃の炉
に３時間入れ、焼成した後、図３のようにチップの両側
に電極８を付け、コンデンサーを作成した。Example 3 1: Preparation of Laminate for Conductor Formation An epoxy resin composition containing 75% by weight of flaky silver particles (15 × 15 × 2 μm) was placed on a cellulose triacetate film (38 μm thickness) 5. The layer was coated and dried at a temperature of 80 ° C. or less to form a silver particle-containing layer 6 having a thickness of 40 μm, thereby forming a laminate for forming a conductor. Part 2: Manufacture of ceramic capacitor The laminate for conductor formation manufactured in Step 1 is cut into a slit shape of 4 mm width to make a laminate circuit material for conductor formation (rolled as a 4 mm tape in a roll). , A ceramic chip, that is, a ceramic dielectric (5 mm × 5 m
The conductive particle-containing layer (c) was set on one side of a 2 m thick layer at a temperature of 180 ° C., 2 kg / cm 2 , 2 sec. from the support layer (a) side. Under the thermocompression bonding conditions described above, the ceramic chip and the laminate-forming circuit material for conductor formation were thermally bonded (temporarily bonded). The chips thus formed were alternately stacked to form a ceramic dielectric laminate. The ceramic dielectric laminate was placed in a furnace at 500 ° C. for 3 hours and fired, and then electrodes 8 were attached to both sides of the chip as shown in FIG. 3 to form a capacitor.
【００２３】[0023]
【効果】本発明にかかる新規なセラミックコンデンサー
の導体形成用積層体を使用することにより、コンデンサ
ー製造工程自体の技術が簡単、かつ容易になり、大幅に
製造コストを低減できた。By using the laminate for forming a conductor of a novel ceramic capacitor according to the present invention, the technology of the capacitor manufacturing process itself is simple and easy, and the manufacturing cost can be greatly reduced.
【図１】本発明請求項１の電極形成用積層体の積層構造
を示す断面図である。FIG. 1 is a cross-sectional view showing a laminated structure of an electrode-forming laminated body according to claim 1 of the present invention.
【図２】本発明請求項２の電極形成用積層体の積層構造
を示す断面図である。FIG. 2 is a cross-sectional view showing a laminated structure of the laminated body for forming an electrode according to claim 2 of the present invention.
【図３】セラミックコンデンサーの断面図を示す。FIG. 3 shows a sectional view of a ceramic capacitor.
１ 支持体層 ２ 剥離層 ３ 導電性粒子含有層または銀粒子含有層（銀粒子層） ５ 支持体層 ６ 導電性粒子含有層または銀粒子含有層 ７ セラミックチップ（セラミック誘電体） ８ 電極 Reference Signs List 1 support layer 2 release layer 3 conductive particle-containing layer or silver particle-containing layer (silver particle layer) 5 support layer 6 conductive particle-containing layer or silver particle-containing layer 7 ceramic chip (ceramic dielectric) 8 electrode
Claims (6)
（ｃ）導電性粒子と熱接着性を有する樹脂とを含有する
導電性粒子含有層の順で積層されていることを特徴とす
るセラミックコンデンサーの導体形成用積層体。1. A conductive particle-containing layer comprising (a) a support layer, (b) a release layer, and (c) a conductive particle-containing layer containing conductive particles and a resin having thermal adhesiveness. A laminate for forming a conductor of a ceramic capacitor.
性質をもつ支持体層および導電性粒子と熱接着性を有
する樹脂とを含有する導電性粒子含有層よりなることを
特徴とするセラミックコンデンサーの導体形成用積層
体。2. A conductor forming method for a ceramic capacitor, comprising: a support layer having a property of being burned out when a ceramic substrate is fired; and a conductive particle-containing layer containing a conductive particle and a resin having a thermal adhesive property. For laminate.
サーの導体形成用積層体を、焼成または未焼成のセラミ
ック誘電体の少なくとも片面に所望の回路形態で仮接着
し、前記（ｂ）の剥離層により前記（ａ）の支持体層を
剥離し、前記（ｃ）の導電性粒子含有層と前記セラミッ
ク誘電体とを所定枚数積層してなるセラミック誘電体積
層物を焼成して前記導電性粒子含有層中の樹脂成分を焼
失させることを特徴とするセラミックコンデンサーの製
造方法。3. The conductor-forming laminated body of the ceramic capacitor according to claim 1 is temporarily bonded in a desired circuit form to at least one surface of a fired or unfired ceramic dielectric, and the release layer of (b) is used. The support layer of (a) is peeled off, and a ceramic dielectric laminate formed by laminating a predetermined number of the conductive particle-containing layer of (c) and the ceramic dielectric is fired to form the conductive particle-containing layer. A method for producing a ceramic capacitor, characterized by burning out a resin component therein.
サーの導体形成用積層体を、焼成または未焼成のセラミ
ック誘電体の少なくとも片面に所望の回路形態で仮接着
した後、これを所定枚数積層してなるセラミック誘電体
積層物を焼成して前記の支持体層および前記の導電
性粒子含有層中の樹脂成分をそれぞれ焼失させることを
特徴とするセラミックコンデンサーの製造方法。4. A laminated body for forming a conductor of a ceramic capacitor according to claim 2 is temporarily bonded in a desired circuit form to at least one surface of a fired or unfired ceramic dielectric, and a predetermined number of these are laminated. A method of manufacturing a ceramic capacitor, comprising firing a ceramic dielectric laminate to burn out the resin components in the support layer and the conductive particle-containing layer.
サーの導体形成用積層体を所望の回路の形に切り抜き、
この切り抜き片を焼成または未焼成のセラミック誘電体
の少なくとも片面に仮接着し、前記（ｂ）の剥離層によ
り前記（ａ）の支持体層を剥離し、前記（ｃ）の導電性
粒子含有層と前記セラミック誘電体とを所定枚数積層し
てなるセラミック誘電体積層物を焼成して前記導電性粒
子含有層中の樹脂成分を焼失させることを特徴とするセ
ラミックコンデンサーの製造方法。5. The conductor forming laminate of the ceramic capacitor according to claim 1, which is cut into a desired circuit shape,
The cut-out piece is temporarily bonded to at least one surface of a fired or unfired ceramic dielectric, the support layer of (a) is peeled off by the peeling layer of (b), and the conductive particle-containing layer of (c) is fired. And baking a ceramic dielectric laminate formed by laminating a predetermined number of the ceramic dielectrics and the ceramic dielectric to burn off a resin component in the conductive particle-containing layer.
サーの導体形成用積層体を所望の回路の形に切り抜き、
この切り抜き片を焼成または未焼成のセラミック誘電体
の少なくとも片面に仮接着した後、これを所定枚数積層
してなるセラミック誘電体積層物を焼成して前記の支
持体層および前記の導電性粒子含有層中の樹脂成分を
それぞれ焼失させることを特徴とするセラミックコンデ
ンサーの製造方法。6. A conductor forming laminate of the ceramic capacitor according to claim 2, which is cut into a desired circuit shape.
The cut-out piece is temporarily bonded to at least one surface of a fired or unfired ceramic dielectric, and then a ceramic dielectric laminate formed by laminating a predetermined number of the cut pieces is fired to contain the support layer and the conductive particles. A method for producing a ceramic capacitor, wherein each resin component in a layer is burned off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24336197A JPH1167576A (en) | 1997-08-25 | 1997-08-25 | Laminated material for ceramic capacitor conductor formation use and manufacture of ceramic capacitor using that |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24336197A JPH1167576A (en) | 1997-08-25 | 1997-08-25 | Laminated material for ceramic capacitor conductor formation use and manufacture of ceramic capacitor using that |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1167576A true JPH1167576A (en) | 1999-03-09 |
Family
ID=17102705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24336197A Pending JPH1167576A (en) | 1997-08-25 | 1997-08-25 | Laminated material for ceramic capacitor conductor formation use and manufacture of ceramic capacitor using that |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1167576A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459377B2 (en) * | 2000-07-14 | 2002-10-01 | Sharp Kabushiki Kaisha | Abnormal condition detecting system detecting abnormal condition of user at residence |
| US9898464B2 (en) | 2014-11-19 | 2018-02-20 | Kabushiki Kaisha Toshiba | Information extraction supporting apparatus and method |
| CN109273259A (en) * | 2018-09-13 | 2019-01-25 | 广东风华高新科技股份有限公司 | A kind of preparation method of multilayer ceramic capacitor |
-
1997
- 1997-08-25 JP JP24336197A patent/JPH1167576A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459377B2 (en) * | 2000-07-14 | 2002-10-01 | Sharp Kabushiki Kaisha | Abnormal condition detecting system detecting abnormal condition of user at residence |
| US9898464B2 (en) | 2014-11-19 | 2018-02-20 | Kabushiki Kaisha Toshiba | Information extraction supporting apparatus and method |
| CN109273259A (en) * | 2018-09-13 | 2019-01-25 | 广东风华高新科技股份有限公司 | A kind of preparation method of multilayer ceramic capacitor |
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