JPH1166644A - Production of optical disk and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the film thickness of an adhesive layer uniform within a prescribed range and to obviate the occurrence of a reading defect of recording by supplying an adhesive between two sheets of disk substrates, superposing these substrates on each other, rotating the two disk substrates at a high speed to form the adhesive layer, pressurizing the adhesive layer via the disk substrates before curing of the adhesive layer. SOLUTION: The adhesive 1 is supplied annularly onto the disk substrate 3 by a dispenser 2 and the disk substrate 4 is placed thereon. Deposition is then executed by high-speed rotation. The film thickness of the adhesive layer 5 is thickest in the position of a radius 40 to 50 mm in this state. Next, the disk substrates are pressurized by a pressurizing means 6 having an annular projection in a position of a radius 40 to 50 mm to hold down the bonding disk 7 in such a manner that the thickness of the adhesive layer 5 in the position of the radius 40 to 50 mm attains 4 to 10 μm. The pressurization is thereafter stopped and the disk is exposed by a UV irradiation machine 12. As a result, the entire film thickness is confined within the target range and the film thickness is made uniform.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an optical disk by bonding two disk substrates.

[0002]

2. Description of the Related Art FIG. 12 is a schematic view showing the steps of a conventional optical disk manufacturing method. In this example, two optical disk substrates are bonded to manufacture an optical disk. As a bonding material, an acrylic UV-curable adhesive 1 is generally used.

In this conventional method, first, as shown in FIG. 12A, an adhesive 1 is supplied to one disk substrate 3 from above by a dispenser 2 in a ring shape. Next, as shown in FIG. 12B, the second disk substrate 4 is placed thereon, and as shown in FIG. 12C, the film is formed by rotating at high speed. Thereafter, as shown in FIG.
Exposure curing is performed.

[0004]

In the above-mentioned conventional configuration,
During film formation, high-speed rotation is performed, and the adhesive 1 flows and diffuses in the outer peripheral direction due to centrifugal force during rotation. in this case,
At the inner peripheral portion, the adhesive 1 spreads toward the outer peripheral portion, so that the film thickness becomes thinner, but at the outer peripheral portion, the adhesive is supplied from the inner peripheral portion, so that the film thickness becomes thinner than the inner peripheral portion. Hateful. Therefore, the thickness of the adhesive layer 5 is generally not uniform, and the outer peripheral portion is thicker. FIG. 2 shows the state at this time, and the outer peripheral portion (radius 40 to 50 mm) exceeds the target range of the film thickness (40 to 55 μm).

In the optical disc having a two-layer structure manufactured as described above, especially when a method of reading two-layer data through the adhesive layer 5 is used, strict accuracy is required for the thickness of the adhesive layer 5. Has been requested. The reason is that unless the film thickness satisfies the predetermined range, it is impossible to accurately read the record of the second layer via the adhesive layer 5.

In order to reduce the difference in film thickness between the inner peripheral portion and the outer peripheral portion, it is effective to increase the time of high-speed rotation. However, in that case, the film thickness becomes thinner as a whole, and again falls outside the predetermined target range. The situation is shown below FIG.

The present invention has been made in view of the above circumstances, and a main object of the present invention is to make the thickness of an adhesive layer uniform within a predetermined range so as not to cause a reading error in recording. To provide an optical disk manufacturing method and an apparatus therefor.

[0008]

According to a first aspect of the present invention, an adhesive is supplied between two disk substrates to rotate the two disk substrates at a high speed. In the method of manufacturing an optical disk by forming an adhesive layer by curing the adhesive layer and then curing the adhesive layer, the adhesive layer is applied via the disk substrate after the adhesive layer is formed and before the optical disk is cured. Pressing.

In such a method, after the adhesive layer is formed by high-speed rotation, the thickness of the adhesive layer on the outer peripheral side, which is inevitably increased by rotation, is pressed in through a disk substrate, and the thickness is increased. The adhesive at the point where it is formed is caused to flow to a relatively thin part before and after the part. Therefore, the overall film thickness can be kept within the target range, and the uniformity of the film thickness can be improved.

As a result, it is possible to manufacture an optical disk which is less likely to cause a recording read error.

According to a second aspect of the present invention, an adhesive layer is formed by supplying an adhesive between two disk substrates and rotating the two disk substrates stacked one upon another at a high speed. A method of manufacturing an optical disk by curing a layer, wherein the adhesive layer is pressed through the disk substrate during the formation of the adhesive layer.

In such a method, during the formation of the adhesive layer by high-speed rotation, the thickness of the adhesive layer on the outer peripheral side, which is inevitably increased by the rotation, is pressed in through the disk substrate, and the thickness is increased. The adhesive at the point where it is formed is caused to flow to a relatively thin part before and after the part. Therefore, the overall film thickness can be kept within the target range, and the uniformity of the film thickness can be improved. In this case, since the flowing adhesive layer is deformed under pressure, the energy required for pressurization is relatively small.

As a result, it is possible to manufacture an optical disk which is less likely to cause a recording read error with less energy.

According to a third aspect of the present invention, an adhesive is supplied between two disk substrates to form an adhesive layer by rotating the two superposed disk substrates at a high speed. A method of manufacturing an optical disk by curing a layer, wherein the adhesive layer is pressed through the disk substrate while the adhesive layer is being cured.

In such a method, during the curing of the adhesive layer,
The thickness of the adhesive layer on the outer peripheral side, which was inevitably increased by high-speed rotation during the formation of the adhesive layer prior to this, was pressed and pushed through the disk substrate to bond the thickened portion. The agent is caused to flow to a relatively thin portion before and after the agent. Therefore, the overall film thickness can be kept within the target range, and the uniformity of the film thickness can be improved. In this case, since the adhesive layer being cured is deformed by pressing, the energy required for pressing is relatively large, but the film thickness can be more reliably made uniform.

As a result, it is possible to manufacture an optical disk which is less likely to cause a recording read failure.

According to a fourth aspect of the present invention, there is provided a forming means for forming an adhesive layer by supplying an adhesive between two disk substrates and rotating the two superposed disk substrates at a high speed. An optical disk manufacturing apparatus comprising: a curing unit for curing an adhesive layer; and a pressure unit for pressing the adhesive layer via the disk substrate.

With such an apparatus, the above-described first to third invention methods can be realized.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. The following embodiments are examples in which the present invention is embodied, and do not limit the technical scope of the present invention.

(Embodiment 1) FIG. 1 is a schematic view showing each procedure of an optical disk manufacturing method according to Embodiment 1 of the present invention. As shown in FIG. 1A, supply of the adhesive 1 and film formation by high-speed rotation are the same as in the conventional example. As a bonding material, an acrylic UV-curable adhesive 1 is used also here. First, the adhesive 1 is supplied to one disk substrate 3 by a dispenser 2 in a ring shape from above. Next, as shown in FIG.
The first disk substrate 4 is placed thereon, and a film is formed by high-speed rotation as shown in FIG.

In this state, as shown in FIG. 2, the thickness of the adhesive layer 5 is largest at a position having a radius of 40 to 50 mm as in the conventional example. Next, as shown in FIG. 1D, pressure is applied from above by a pressing tool 6 having an annular projection at a position of a radius of 40 to 50 mm, and the thickness of the adhesive layer 5 at a position of a radius of 40 to 50 mm is reduced. The bonded disk 7 is pressed down to 4 to 10 μm. The adhesive 1 in the pressed portion flows to a portion having a smaller thickness (around a radius of 30 mm and the outermost periphery) where no pressure is applied. The pressing time is 0.1 to 1 second. After that, the pressurization is stopped, the bonded disk 7 is moved, and as shown in FIG.

The thickness of the adhesive layer 5 is as shown in FIG.
At the time of film formation in (c), the thickest radius was 40 to 50 mm.
At the same time, the thickness before and after (thickness around 30 mm and the outermost circumference) becomes thicker, so that the difference in film thickness becomes smaller as a whole and the target range (40 to
55 μm). This is shown in FIG.

FIG. 4 is a schematic configuration diagram of an apparatus that embodies the optical disk manufacturing method according to the first embodiment. In FIG. 4, a film forming stage 8 and a curing stage 9 are provided side by side, and a pressing tool 6 is provided above the film forming stage 8. The film forming stage 8 includes a disk suction plate 10 and a hood 11 for receiving an excess liquid of the adhesive 1 which is shaken off during high-speed rotation. The disk suction plate 10 suctions the disk by a suction source and a driving source (not shown), and
High-speed rotation can be performed at a rotation speed of about m.

On the other hand, the curing stage 9 includes the ultraviolet irradiator 1
2, a pallet 13 for receiving the bonded disc 7 (see FIG. 1), and a conveyor 14 for carrying the pallet 13. The pressing tool 6 has a radius of 4 as shown in FIG.
A projection 6a is provided at a position of 0 to 50 mm, and the position of the bonding disk 7 can be effectively pressed at the position of the projection 6a. For this purpose, the pressing tool 6 is arranged coaxially with the film forming stage 8 so that the position of the protrusion 6a and the portion having a large film thickness coincide with each other. The pressing tool 6 can be moved up and down by a driving source (not shown). Further, a handling member 15 for moving the disk substrates 3 and 4 is provided on the upstream and downstream sides of the film forming stage 8.

By the handling member 15 on the upstream side of the film forming stage 8, the bonded disk 7 is
It is arranged on the film forming stage 8 in a state as shown in FIG. The film forming stage 8 sucks the disk substrate 3 and
Leveling and pressurization as shown in (c) and (d) are performed. Thereafter, the bonded disc 7 is moved by the downstream handling member 15 and mounted on the pallet 13. The pallet 13 passes below the ultraviolet irradiator 12 by the conveyor 14, and at this time, exposure curing is performed as shown in FIG.

As described above, according to the first embodiment, the maximum film thickness is corrected while the minimum film thickness is kept within the target range, so that the entire film thickness is within the target range and the film thickness is corrected. Can be made more even.

In the first embodiment, the adhesive 1 is of the ultraviolet curing type, but other materials having a curing reaction may be used as long as the required quality is obtained. For example,
A thermosetting material or a two-component reaction type material may be used. However,
In that case, it goes without saying that the curing stage 9 does not include the ultraviolet irradiator 12, but includes a furnace set at a predetermined temperature.

In the first embodiment, the bonded disk 7 is arranged on the film forming stage 8 in the state shown in FIG. 1B. However, the bonded disk 7 may be in an earlier state. . It does not matter how the adhesive 1 is supplied or the timing at which the second disk substrate 4 is opposed to the first disk substrate 3. The film forming procedure (FIGS. 1A to 1C) in the first embodiment is merely an example, and other procedures may be used.

Further, the pressing tool 6 of the first embodiment is directly connected to the driving source, and the pressing amount may be controlled by the driving source, but is not connected to the driving source. The pushing amount may be determined by the weight of the pressing tool 6. In the first embodiment, the pressing means 6 is used as the pressing means, but other means may be used.

Further, in the first embodiment, the pressure is applied after the film formation and before the curing, but the pressure may be applied during the film formation. In that case, pressure deformation of the flowing adhesive 1 is performed,
The energy required for pressurization can be relatively small. If necessary, pre-curing with lower energy may be performed before pressing. Further, in the first embodiment, an example of the position in the radial direction, the indented amount of the film thickness, and the shape of the pressing tool 6 has been described.
Needless to say, the values and shapes described above may be changed as needed.

(Embodiment 2) FIG. 6 is a schematic diagram showing each procedure of an optical disk manufacturing method according to Embodiment 2. As shown in FIGS. 6A and 6B, the second embodiment is the same as the conventional example and the first embodiment until the second disk substrate 4 is mounted. Thereafter, leveling by high-speed rotation is performed. At this time, as shown in FIG. 6C, pressure is applied by blowing gas using the gas discharge nozzle 21 with the aim of a position having a radius of 45 mm from above.
When the rotation film formation is performed without pressurization, the film thickness distribution as shown in FIG. 2 is obtained as in the conventional example. However, the flow of the adhesive at a position near a radius of 45 mm due to such pressurization is caused. It is regulated, and the film thickness near the radius of 45 mm becomes thin. In this state, when exposure is performed as shown in FIG.
The distribution is similar to that shown in FIG.

FIG. 7 is a schematic configuration diagram of an apparatus embodying the second embodiment. As shown in FIG. 7, here also, a film forming stage 8 and a curing stage 9 are provided side by side. Further, a gas discharge nozzle 21 is provided on the film forming stage 8. Other configurations of the film forming stage 8 and the curing stage 9 are the same as those in the first embodiment.

As shown in FIG. 8, the gas discharge nozzle 21 has a gas discharge port 22 having an annular slit shape with a radius of 45 mm and a width of 0.5 mm. The gas discharge nozzle 21 is arranged coaxially with the film forming stage 8 so that the gas discharge position coincides with the portion where the film thickness is likely to be large. The gas discharge nozzle 21 can be moved in the vertical direction by a drive source (not shown). On the upstream and downstream sides of the film forming stage 8, a handling member 15 for moving the disk substrate is provided.

By the handling member 15 on the upstream side of the film forming stage 8, the bonded disk 7 is
It is arranged on the film forming stage 8 in a state as shown in FIG. The film forming stage 8 sucks the disk substrate 3 and
Leveling and pressurization are performed as shown in FIG. At this time, the gas discharge nozzle 21 discharges gas at a pressure of ² to 4 kg / cm ² at a position of about 100 μm from the upper surface of the disk substrate 4. The discharged gas is blown vertically and cylindrically to the disk substrate 4,
Is pressed at a position with a radius of 45 mm. Thereafter, the bonded disc 7 is moved by the downstream handling member 15 and mounted on the pallet 13. Pallet 13
Is passed under the ultraviolet irradiator 12 by the conveyor 14, and at this time, exposure curing is performed as shown in FIG.

As described above, according to the second embodiment, by controlling the maximum film thickness while securing the minimum film thickness within the target range, the total film thickness can be kept within the target range.
The film thickness can be made more uniform. Further, the second embodiment is superior to the first embodiment in that there is no contact of the pressurizing means with the disk substrate, so that there is no possibility of damaging the substrate.

In the second embodiment, the adhesive 1 is of the ultraviolet curing type. However, if the required quality is obtained, a material having another reaction may be used. This is the same as in the first embodiment.

In the second embodiment, the bonded disk 7 is arranged on the film forming stage 8 in a state as shown in FIG. 6B. I don't care. The method of supplying the adhesive 1 and the timing at which the second disk substrate 4 is opposed to the first disk substrate 3 are the same as those in the first embodiment, regardless of how they are performed. is there.

In the second embodiment, the gas discharge nozzle 21 having a specific shape is used as the pressurizing means. However, the gas discharge nozzle 21 may have another shape. For example, a plurality of nozzles having a discharge port of φ0.5 mm may be arranged concentrically.
In this case, each nozzle moves in the radial direction with time according to the rotation, and the flow of the adhesive 1 can be continuously controlled at a predetermined width. Further, as the pressurizing means, other means may be used instead of the gas pressure.

Further, in the second embodiment, an example of the position in the radial direction and the gas discharge condition has been described. However, it is needless to say that the described value may be changed as needed.

(Embodiment 3) FIG. 9 is a schematic diagram showing each procedure of an optical disk manufacturing method according to Embodiment 3 of the present invention. As shown in FIGS. 9A to 9C, the processes up to film formation by high-speed rotation are the same as those in the conventional example and the first embodiment. Also, the shape of the pressing tool 31 has a radius of 40 to 50.
It has a protrusion at a position of mm, and is the same as that of the first embodiment (pressing tool 6) as shown in FIG. However,
Here, the pressing tool 31 is formed of a light transmissive material, for example, a glass material. After the film formation is completed, the pressing tool 31 is placed on the bonding disk 7 and the exposure is performed as it is as shown in FIG. UV light is applied to the pressing tool 3
Irradiation is performed from above, but it can penetrate through the pressing tool 31 and cure the adhesive 1.

FIG. 10 is a schematic configuration diagram of an apparatus that embodies the third embodiment. As shown in FIG. 10, here also, a film forming stage 8 and a curing stage 9 are provided side by side. Further, the curing stage 9 is provided with a plurality of pressing tools 31. In other respects, the film forming stage 8 and the curing stage 9 have the same configuration as in the first embodiment. Further, on the upstream and downstream sides of the film forming stage 8, a handling member 15 for moving the disk substrate is provided.

The pressing tool 31 has the same shape as the pressing tool 6 of the first embodiment shown in FIG. 4, but here, it moves on the film forming stage 8 as in the first embodiment. Instead, it can be mounted on the pallet 13 by the second handling member 32.

In the state shown in FIG. 9 (b), the bonded disk 7 arranged on the film forming stage 8 is sucked on the film forming stage 8 and leveled as shown in FIG. 9 (c). Then, the downstream handling member 1
5 and mounted on the pallet 13. Further, the pressing tool 31 is coaxially mounted thereon by the second handling member 32. The pallet 13 on which the bonding disk 7 and the pressing tool 31 are placed passes under the ultraviolet irradiator 12 by the conveyor 14, and at this time, as shown in FIG.
Exposure curing is performed as shown in FIG.

As described above, according to the third embodiment, by controlling the maximum film thickness while securing the minimum film thickness within the target range, the total film thickness can be kept within the target range and the film thickness can be further reduced. Can be even. Third Embodiment
As compared with the first embodiment, since the exposure and curing are performed while the bonding disk 7 is being pressed, the energy required for the pressing is relatively large, but the film thickness can be more reliably made uniform. It is excellent in that it can be done.

In the third embodiment, the adhesive 1 is of the ultraviolet curing type. However, if the required quality can be obtained, a material having another reaction may be used. This is the same as in the first embodiment.

In the third embodiment, the bonded disk 7 is arranged on the film forming stage 8 in a state as shown in FIG. 9B, but it may be in an earlier state. Absent. Regarding the method of supplying the adhesive 1 and the timing at which the second disk substrate 4 is opposed to the first disk substrate 3, it does not matter how it is performed.
This is the same as in the first embodiment.

Further, in the third embodiment, the pressurizing tool 31 is used as the pressurizing means, but other means may be used. Further, in Embodiment 3, the pressure is applied after the film formation and before the curing, but the pressure may be applied during the film formation. In that case,
The adhesive 1 under flow is deformed under pressure, and the energy required for pressurization can be relatively small. If necessary,
Prior to pressurization, pre-curing with lower energy may be performed. In the third embodiment, the position in the radial direction and the material of the pressing tool 31 have been described. However, it is needless to say that the values and the material described may be changed if necessary.

(Embodiment 4) In Embodiment 3 described above,
Although the pressing tool 31 and the ultraviolet irradiator 12 are separate, the pressing tool 31 may be connected to the ultraviolet irradiator 12. FIG. 11 is a schematic configuration diagram of an example of an apparatus according to the fourth embodiment of the present invention having such features.

In FIG. 11, a shutter 41 is provided at the connection between the ultraviolet irradiator 12 and the light-transmitting pressurizing tool 31, and the shutter 41 is opened and closed as required.

Here, there is no conveyor 14 as in the first embodiment, the pallet 13 is fixed at a predetermined position, and the pallet 13 and the pressing tool 31 are coaxially arranged. The pressing tool 31 is vertically movable by a driving source 42. In addition, around the pallet 13 and at a connection portion between the ultraviolet irradiation device 12 and the pressing tool 31,
A light shielding cover 4 so that ultraviolet rays do not leak to the surroundings during exposure.
3 are deployed.

The operation of the apparatus in such a state will be described.
This will be described below. The fourth embodiment is also the same as the conventional example and the third embodiment until the bonding disk 7 completes the leveling as shown in FIG. 9C on the film forming stage 8.

Thereafter, the position of a radius of 40 to 50 mm of the bonded disk 7 moved onto the pallet 13 is pushed by the pressing tool 31 by 4 to 10 μm. at this point,
The shutter 41 on the pressing tool 31 is opened to perform exposure. The ultraviolet light is prevented from leaking outside by the light shielding cover 43. Exposure is completed in about 3 seconds, the shutter 41 is closed, and the pressing tool 31 is raised. As described above, the curing of the adhesive 1 is completed.

As described above, according to the fourth embodiment, by controlling the maximum film thickness while securing the minimum film thickness within the target range, the total film thickness can be kept within the target range and the film thickness can be reduced. It can be more even. Further, in the fourth embodiment, as compared with the first embodiment, exposure and curing are performed while the bonding disk 7 is pressed, so that the film thickness can be more reliably made uniform. Embodiment 4
Is excellent in that the required space of the curing stage 9 can be reduced because the conveyor 14 is unnecessary, as compared with the third embodiment.

Although the pressing tool 31 is used as the pressing means in the fourth embodiment, other means may be used. In the fourth embodiment, the timing of pressing the pressing tool 31 and opening and closing the shutter 41 is specified.
If necessary, the timing may be reversed. For example, the pressing tool 31 may be pushed in while the shutter 41 is opened and the adhesive 1 is cured. In the fourth embodiment, the position in the radial direction, the indentation of the film thickness, and the material of the pressing tool 31 are described. However, if necessary, the values and the material described may be changed. Needless to say.

[0055]

As is apparent from the above description, according to the present invention, after film formation by high-speed rotation, the film thickness on the outer peripheral side, which is inevitably thickened by rotation, is pressed by a pressing tool or gas pressure. The adhesive at the thicker portion is caused to flow to relatively thin portions before and after the thicker portion. Therefore, the overall film thickness can be kept within the target range, and the uniformity of the film thickness can be improved.

As a result, it is possible to manufacture an optical disk which is less likely to cause a recording read failure.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing each procedure of an optical disc manufacturing method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a film thickness distribution before pressing.

FIG. 3 is an explanatory diagram showing a film thickness distribution after pressing.

FIG. 4 is a schematic configuration diagram of an apparatus to which the optical disc manufacturing method according to the first embodiment can be applied;

FIG. 5 is a conceptual diagram of a pressing tool according to the first embodiment.

FIG. 6 is a schematic diagram showing each procedure of an optical disc manufacturing method according to a second embodiment of the present invention.

FIG. 7 is a schematic configuration diagram of an apparatus to which the optical disk manufacturing method according to the second embodiment can be applied;

FIG. 8 is a conceptual diagram of a gas discharge nozzle according to a second embodiment.

FIG. 9 is a schematic diagram showing each procedure of an optical disc manufacturing method according to the third embodiment of the present invention.

FIG. 10 is a schematic configuration diagram of an apparatus to which the optical disc manufacturing method according to the third embodiment can be applied;

FIG. 11 is a conceptual diagram of a curing stage according to a fourth embodiment.

FIG. 12 is a schematic diagram showing each procedure in an example of a conventional optical disc manufacturing method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesive 2 Dispenser 3 Disk substrate (lower side) 4 Disk substrate (upper side) 5 Adhesive layer 6 Pressing tool 7 Laminated disk 8 Film forming stage 9 Curing stage 10 Suction plate 11 Hood 12 Ultraviolet irradiation device 13 Pallet 14 Conveyor 15 Handling Member 21 Gas Discharge Nozzle 22 Gas Discharge Port 31 Pressing Tool 32 Second Handling Member 41 Shutter 42 Drive Source 43 Light Shielding Cover

Continuation of the front page (72) Inventor Norihide Higaki 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (7)

[Claims] An adhesive is supplied between two disk substrates, and an adhesive layer is formed by rotating the superposed two disk substrates at a high speed, and then the adhesive layer is cured. A method for manufacturing an optical disk, comprising: after forming the adhesive layer and before curing, pressing the adhesive layer via the disk substrate. 2. An adhesive is supplied between two disk substrates to form an adhesive layer by rotating the superposed two disk substrates at a high speed, and then the adhesive layer is cured. A method of manufacturing an optical disk, comprising: pressing the adhesive layer via the disk substrate during the formation of the adhesive layer. 3. An adhesive is supplied between two disk substrates to form an adhesive layer by rotating the superposed two disk substrates at a high speed, and then the adhesive layer is cured. A method for manufacturing an optical disk, comprising: pressing the adhesive layer via the disk substrate while the adhesive layer is being cured. 4. A forming means for forming an adhesive layer by supplying an adhesive between two disk substrates and rotating the superposed two disk substrates at a high speed, and curing the adhesive layer. An optical disk manufacturing apparatus, comprising: a hardening means for causing the adhesive layer to be pressed via the disk substrate. 5. The optical disk according to claim 4, wherein said pressing means applies a uniform pressure in a circumferential direction at a desired position in a radial direction of said disk substrate by coming into contact with an outer surface of said disk substrate. Manufacturing equipment. 6. The pressure means applies a uniform pressure in a circumferential direction at a desired radial position of the disk substrate by blowing gas onto an outer surface of the disk substrate. Optical disk manufacturing equipment. 7. The optical disk manufacturing apparatus according to claim 4, wherein said pressing means is made of a light transmissive material.