JP4130200B2 - Laminated optical disk manufacturing equipment - Google Patents

Description

  The present invention relates to an optical disk recording medium manufacturing method and manufacturing apparatus configured by bonding a plurality of substrates, and more particularly to a method and an apparatus for bonding two substrates.

  In order to increase the recording density of the optical disk recording medium, it is necessary to shorten the wavelength of the recording / reproducing laser and increase the numerical aperture (NA) of the objective lens. However, when the disc is tilted with respect to the laser optical axis due to rotation or deformation, the focal point of the laser is shifted from the correct position on the information signal surface of the disc. The tilt is a so-called radial tilt in which the substrate of the optical disk recording medium hangs down in a conical shape when the disk is set in the optical disk drive apparatus. Further, the mounting dimensional accuracy between the optical disk drive apparatus and the optical disk recording medium or the optical disk drive apparatus itself The so-called tangential tilt in which the substrate of the optical disk recording medium depending on the posture is inclined in the circumferential direction is mainly known.

  In order to compensate the laser focus shift due to tilt, it is necessary to enlarge the recording pits, and it is very difficult to increase the recording density. If the thickness of the optical disk recording medium substrate is reduced, the laser focus shift can be reduced. However, if the substrate of the optical disk recording medium is made thinner, the rigidity of the substrate is lowered, so that a larger tilt is easily generated, not only detracting from the effect of thinning the substrate, but also the deviation of the laser focus is enlarged.

  In order to prevent the tilt of the disk caused by the thinning of the substrate, it is very effective to increase the mechanical strength of the optical disk recording medium by bonding two substrates. Further, by providing an information signal surface on each of the bonded substrates, the recording capacity of the optical disk recording medium alone can be doubled. For example, when an optical disk recording medium is made by laminating two substrates, a single-sided disk OD1 having a method signal surface on only one side of the disk, a single-sided dual-layer disk OD2 having two information signal surfaces on the same side of the disk, It is possible to manufacture a double-sided disk OD3 in which information signal surfaces are provided on opposite sides. FIG. 13 shows an example of a single-sided disk OD1, FIG. 14 shows a single-sided dual-layer disk OD2, and FIG. 15 shows an example of a double-sided single-layer disk OD3. In each figure, Ls indicates a recording / reproducing laser beam, RS indicates an information recording surface, AS indicates an adhesive layer, and PL indicates a protective layer.

  In the case of the single-sided dual-layer disc OD2 shown in FIG. 14, the laser light LS2 for recording / reproducing the information signal surface RS1 in FIG. 1 must pass through the adhesive layer AS. Further, in the case of the double-sided disc OD3 shown in FIG. 15, a label layer for displaying the contents of the disc such as a title cannot be provided. In this way, a method for manufacturing an optical disk recording medium by bonding a plurality of substrates can be roughly classified into a printing method and a spin coating method based on an adhesive application method for bonding the substrates. Hereinafter, first, the printing method will be described with reference to FIGS. 11 and 12, and then the spin coating method will be described with reference to FIGS. 16, 17, 18, and 19. FIG.

  11 and 12 briefly show an optical disk recording medium manufacturing method using a printing method. While moving the spatula 60 in the predetermined direction Ds, the thermoplastic resin PP of the two substrates that apply the adhesive PP uniformly over the entire surface of the substrate 6 through the screen SP using a thermoplastic resin having a high viscosity at room temperature was applied. When the thermoplastic resin is softened by heating with the surface facing inward, the two substrates are pressed against each other to bond the two substrates to produce an optical disk recording medium.

  However, since the thermoplastic resin is opaque and non-light transmissive, it cannot be used for manufacturing the one-sided double-layer disc OD2. Further, when the other substrate is pressed against the thermoplastic resin PP applied to the entire surface of the substrate, the resin PP and the substrate are brought into surface contact with each other. The substrate is adhered while being confined to the adhesive layer. Since the bubbles confined in the adhesive layer scatter laser light and interfere with data recording / reproduction, even if a transparent thermoplastic resin becomes a real thing in the future, the printing method of the one-sided dual-layer disc OD2 Such an optical disc recording medium having an information recording layer that reads and writes with a laser beam through an adhesive layer cannot be applied.

  Furthermore, because thermoplasticity is a reversible reaction, even if it is pasted once and finished as an optical disk recording medium, when it is exposed to a temperature higher than the plasticizing temperature at a later date, the adhesive layer loosens and the bonded substrate warps due to its own weight, The worst upper and lower substrates are displaced or detached. Due to the high viscosity of the thermoplastic material, the adhesive that protrudes during bonding must be mechanically scraped off. Further, as shown in FIG. 12, as a result of application by printing, the thickness distribution of the printed layer PP varies in the diameter direction of each substrate or in the moving direction Ds of the spatula 60. That is, assuming that the distance between the screen SP and the substrate 6 at both ends of the diameter of the substrate 6 is S1 and S2, respectively, the thickness of the adhesive layer on the substrate 6 varies in the diameter direction by | D1-D2 |. . As a result, the thickness in the radial direction and on the same circumference varies, and there is a problem in the quality of the disk used by rotating.

  Furthermore, as one of the printing methods, there is a method of using a light-transmitting photocurable resin as an adhesive instead of a thermoplastic resin. In this case, the photo-curing resin is printed on the substrate by the method shown in FIGS. 11 and 12 using a high-viscosity resin similar to the thermoplastic resin. Thereafter, light is applied to the bonding surface of the substrate to slightly cure the adhesive, and then the two substrates are pressed against each other to bond the two substrates to produce an optical disk recording medium. In this method, a light-transmitting resin can be used as the adhesive, but since the printing is performed on the entire surface of the substrate, bubbles are also enclosed in the adhesive layer when the substrates are overlapped. That is, it cannot be applied to the manufacture of the single-sided dual-layer disc OD2. Furthermore, since the adhesive layer thickness varies in the radial direction of the substrate and on the same circumference, there is a problem in quality of the completed optical disk recording medium.

  Next, with reference to FIGS. 16, 17, 18, 19, and 20, a method of manufacturing the single-sided dual-layer disc OD2 by the spin coating method that has been conventionally performed will be briefly described. Note that the optical disk recording medium OD2 is prepared by pasting the first substrate 6 and the second substrate 9 which are previously prepared by an injection molding method using a transparent resin such as polycarbonate. A first information signal surface RS1 is provided on one surface of the first substrate 6, and a reflective film is formed on the information signal surface RS1 by means such as sputtering or vacuum deposition. Aluminum is mainly used for the reflective film. Similarly, a second information signal surface RS2 and a reflective film are formed on one surface of the second substrate 9. The substrate 6 and the substrate 9 thus prepared are bonded together in the following procedure to complete the optical disc recording medium OD2.

  First, in step # 100P, work conditions are set. The working conditions mainly include the rotational speed N of the substrate when the photocurable resin PP is dropped onto the substrate, the weight V (g) of the photocurable resin PP dropped onto the substrate, and the photocurable resin PP dropped onto the substrate. The weight v per second, the rotation speed r1 (rpm) of the substrate when the photocurable resin PP is dropped on the substrate, the viscosity ν (cps) of the photocurable resin PP, and the substrate when the photocurable resin PP is spread The rotation speed r2 (rpm) and the rotation time t (sec) of the substrate when the photocurable resin PP is extended are included. The significance of these conditions will be described in the following steps. After these conditions are set to predetermined values, the process proceeds to the next step # 300.

  In the next step # 300, as shown in FIG. 16, as an adhesive for laminating the substrate on the opposite surface of the recording surface RS1 during a period in which the first substrate 6 is rotated N times at a low rotation speed r1. The photocurable resin PP of Vg to be used is applied in a donut shape so as to be concentric with the center hole H of the substrate 6. The operation at this step is called an adhesive application process. Then, the process proceeds to next Step # 400.

  In step # 400, as shown in FIG. 17, the substrate 9 is overlaid on the substrate 6 with the information signal surface RS2 facing the photo-curing resin PP. The operation at this step is called a substrate overlapping process. Then, the process proceeds to next Step # 500P.

  In step # 500P, as shown in FIG. 18, the substrate 6 and the substrate 9 are integrally rotated at a rotational speed r2 for a period of time t, and the photocurable resin PP is applied to the substrate 6 and the substrate 9 by centrifugal force. Spread it in between. Then, the process proceeds to next Step # 700P. This process is called adhesive spreading. Note that the photo-curing resin PP that has not been used due to spilling from the substrate in the process of applying the photo-curing resin PP shown in this step and FIG. 16 is collected and then filtered to remove dust and the mixed bubbles are removed. Defoamed and reused.

  In step # 700P, as shown in FIG. 19, ultraviolet light is irradiated through the second substrate 9 toward the RS photocurable resin 1 of the first substrate 6 to cure the photocurable resin PP, so that the two substrates 6 And 9 are fixed together and bonded together. This process is called adhesion. In this way, the production of the optical disk recording medium is completed.

  However, even if the working conditions are set in step # 100P, the optimum conditions are constantly fluctuating due to changes in ambient temperature, deterioration of the recovered photocured resin PP, and the like. Further, the amount of the photocurable resin PP that is dropped onto the inner peripheral portion of the substrate 6 changes due to subtle fluctuations such as the dropping position, the dropping amount, and the coating environment temperature of the photocurable resin PP. Therefore, even if the photocurable resin PP reaches the inner peripheral portion of the disk evenly, the position of the inner peripheral end of the photocurable resin PP layer with respect to the substrate 6 varies, and the thickness of the layer of the photocurable resin PP varies. Therefore, it is not possible to obtain a good product stably.

  In addition, when the photocurable resin PP is dropped in Step # 300, if the viscosity of the dropped photocurable resin PP is low, the dropped light is caused by a reaction when the dropped substrate 6 is transported to the next spreading process. A force acts on the cured resin PP, and the photocurable resin PP spreads and hangs down on the substrate 6. As a result, since the photo-curing resin PP diffuses in the transport direction, the thickness of the photo-curing resin PP varies in the circumferential direction and the transport direction of the substrate, and the photo-curing resin PP reaches the inner periphery of the disc evenly. It becomes difficult.

  When the photocurable resin PP hangs down and is distributed unevenly in this way, when the substrate 9 is superimposed on the substrate 6, the photocurable resin PP cannot be brought into linear contact with the substrate 9, and the contact area is expanded. When the non-uniformly spread photocurable resin PP and the substrate 9 are combined, air bubbles are easily mixed between the photocurable resin PP and the substrate 9. If bubbles remain in the adhesive layer obtained by curing the photo-curing resin PP, the laser is scattered, and the information recording surface cannot be correctly irradiated and reflected, so that the recording on the lower substrate 6 is transmitted through the adhesive layer. In a single-sided dual-layer disc that performs recording / reproduction on the surface RS1, it is a fatal wound.

  Even if the bubbles can be removed before curing of the photo-curing resin PP, that is, at the time of spreading, the thickness of the photo-curing resin PP varies in the circumferential direction and the conveyance direction, so that the recording / reading accuracy of the disc is remarkably improved. It is a loss. In other words, because the disk irradiates a laser on a data track that is wound in the circumferential direction of the disk during recording and reproduction, the irradiation angle of the laser to the track fluctuates irregularly with the rotation of the disk. .

  Further, when the photo-curing resin PP is spread and applied by a spin coating method, the layer thickness of the photo-curing resin PP in the inner periphery of the disc tends to be thinner than that in the inner periphery of the disc. Therefore, in order to reduce the unevenness of the thickness of the photo-curing resin PP layer, the photo-curing resin PP is dropped as much as possible on the inner peripheral side of the substrate 6, and the spread photo-curing resin PP layer becomes thicker at the inner peripheral portion of the disc. It is necessary to do so. However, even if the photocurable resin PP is dropped as much as possible on the inner periphery of the substrate, if the viscosity of the photocurable resin PP is low, the photocurable resin PP spreads on the substrate, and the photocurable resin PP protrudes from the center hole H of the substrate. It becomes a state. If the photo-curing resin PP is cured in this state, the roundness of the center hole H deteriorates due to the photo-curing resin PP protruding from the center hole, which causes the eccentricity of the disk. However, when the thickness of the photo-curing resin PP varies in the radial direction of the disk, the layer thickness of the curing resin PP in the circumferential direction is kept uniform, and the laser irradiation angle and the signal surface are in the unit of one data track. Since the aperture is also kept constant, the recording / reading accuracy can be compensated.

  Therefore, it is necessary to increase the viscosity of the photo-curing resin PP in order to prevent air bubbles from being mixed into the photo-curing resin layer, to allow the photo-curing resin PP to reach the inner periphery of the disk evenly, and to reduce unevenness in the intermediate layer thickness. There is. However, the higher the viscosity of the photo-curing resin PP, the more time is required for filtering and defoaming of the recovered photo-curing resin PP, and the operating efficiency of the apparatus becomes worse.

  In addition, a load may be applied to the uncured photo-curing resin layer during conveyance of the disk after spreading, and air bubbles may enter the uncured photo-curing resin layer on the inner periphery of the disk, which may deteriorate the appearance of the disk. Further, there has been no simple and effective method for accurately suppressing the misalignment between the centers of the two substrates to be bonded to about several tens of μm.

  Accordingly, the present invention is free from defects in the conventional optical disc pasting and manufacturing method as described above, has no bubbles in the adhesive layer, does not hinder laser transmission, and varies in the diameter direction or circumferential direction of the optical disc recording medium with the adhesive layer thickness. It is an object of the present invention to provide an optical disk recording medium affixing manufacturing method and apparatus for which dimensional accuracy is guaranteed while suppressing the above-described problem.

  Further, the present invention determines the manufacturing process quality from the accuracy of the adhesive layer thickness of the manufactured optical disk recording medium, automatically compensates the manufacturing conditions based on the determination result, and the manufacturing process quality has the compensation capability. The object of the present invention is to provide a method and a device for judging that an abnormality has occurred and stopping the production.

In order to achieve the above object, a bonded optical disk manufacturing apparatus (ODB) according to the present invention manufactures an optical disk (OD) by bonding at least a first substrate (6) and a second substrate (9). A bonded optical disc manufacturing apparatus (ODB),
Adhesive application means for applying an adhesive (PP) between the first and second substrates (6, 9) to form an adhesive layer (CA, AS) having a predetermined thickness (Da). 100, 300, 400, 500),
An adhesive supply means (100) for supplying an adhesive (PP) managed at a first predetermined temperature (T) to the adhesive application means (300, 500, 500);
In said first predetermined temperature (T) higher than the third predetermined temperature (T2), have a defoaming means (13) for removing air bubbles that are mixed into the adhesive (PP),
The adhesive supply means (100) recovers an adhesive (PP) that has not been used to form the adhesive layer (AS) from the adhesive application means (300, 400, 500). 11) and
Characterized in that it further chromatic and filtering means for filtering (12) said recovered adhesive (PP) at said first predetermined temperature (T) higher than a second predetermined temperature (T1).

  The bonded optical disk manufacturing apparatus according to the present invention can ensure the light transmittance of the adhesive layer, so that the optical disk recording medium can be easily multi-layered in the future and further based on the adhesive layer thickness of the bonded optical disk. Process operating conditions can be automatically adjusted.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the element which is common in each figure, and the overlapping description is abbreviate | omitted.

  The present invention will be described in detail with reference to the accompanying drawings. FIG. 1 schematically shows the structure of an optical disc pasting and manufacturing apparatus according to the present invention. The optical disc pasting and manufacturing apparatus ODB includes a coating apparatus 300, a superimposing apparatus 400, a spreading apparatus 500, a temporary fixing apparatus 600, a bonding apparatus 700, a measuring apparatus 800, a quality determining apparatus 900, an abnormal signal generating apparatus 1000, and a correction signal generating apparatus 1100. A recovery tank 11, a filter 12, a defoaming tank 13, a drip tank 2, and a control device 2000. The dripping tank 2, the recovery tank 11, the filter 12, and the defoaming tank 13 constitute an adhesive supply source 100. The dripping tank 2 manages the adhesive so as to have a predetermined viscosity ν by storing the photocurable resin PP at a predetermined temperature T. In this specification, as an adhesive, in this example, a case is described in which a photo-curing resin that is normally a gel but is cured when irradiated with ultraviolet rays is used as an adhesive. An adhesive having the same effect may also be used by radiation such as a photocurable resin or gamma rays. As the ultraviolet curable resin, resins mainly composed of acrylate oligomers and acrylate monomers can be used.

  The control device 2000 sets work parameters of each device of the optical disc pasting and manufacturing apparatus ODB, controls its operation, and controls the entire operation of the optical disc pasting and manufacturing device ODB. This parameter includes the number N of rotations of the substrate when the photocurable resin PP is dropped onto the substrate, the weight V (g) of the photocurable resin PP dropped onto the substrate, and the photocurable resin PP dropped onto the substrate per second. The weight v of the substrate, the rotation speed r1 (rpm) of the substrate when the photocurable resin PP is dropped onto the substrate, the viscosity ν (cps) of the photocurable resin PP, and the rotation speed r2 of the substrate when the photocurable resin PP is spread. (Rpm), rotation time t (sec) of the substrate when the photocuring resin PP is spread, and suction force P (mmHg) that pulls the photocuring resin PP to the inner periphery during the spreading.

  The first substrate 6 and the second substrate 9 prepared in the previous process are supplied to the coating apparatus 300, respectively. The first substrate 6 is supplied with the information recording surface RS1 facing upward, that is, with the protective layer facing downward. On the other hand, the second substrate 9 is usually set with the information signal surface RS2 facing down, that is, with the protective layer facing up. While the first substrate 6 is rotated at a predetermined rotation speed r1 at a low speed for a predetermined N times, a predetermined weight Vg of a photocurable resin PP used as an adhesive for bonding the substrate is dropped on the protective layer. It is dropped from the dropping nozzle 2 n of the tank 2, and the photo-curing resin PP is applied so as to form an annular wrinkle concentrically with respect to the center hole H of the substrate 6. The formed photo-curing resin PP has a longitudinal cross-sectional shape that is a ridge shape, that is, a curved surface with a sharp tip. And the 2nd board | substrate 9 and the 1st board | substrate 6 which apply | coated the photocurable resin PP are supplied to the superposition apparatus 400 by a conveyance means (not shown).

  The superimposing device 400 superimposes on the first substrate 6 in parallel with the protective layer PS2 of the second substrate 9 facing downward. At this time, after the protective layer PL2 of the second substrate 9 is in line contact with the tip of the annular ridge CA of the photo-curing resin PP having a spindle-shaped upper section formed on the first substrate 6, By pressing the second substrate 9 against the first substrate 6 by a predetermined amount, the annular ridge CA spreads in close contact with the protective layer PL2 of the second substrate 9 and the protective layer PL2 of the first substrate 6, Since the surface contact is made, it is possible to prevent air bubbles from being mixed between the photocurable resin PP and the protective layers PL1 and PL2. Thus, the 1st board | substrate 6 and the 2nd board | substrate 9 which were piled up are supplied to the spreading apparatus 500 by a conveyance means (not shown).

  The spreading device 500 integrally rotates the superposed first substrate 6 and second substrate 9 at a predetermined rotational speed r2 for a period of time t, and the photocurable resin PP and the substrate 6 by centrifugal force. Spread between the substrates 9. In this case, the inner peripheral side of the photocurable resin PP is moved to the inner peripheral portion so that the inner peripheral photocurable resin PP is not insufficient, and the inner peripheral side of the photocurable resin PP is subjected to a predetermined suction force p (mmHg). ). This inner peripheral suction will be described later with reference to FIG. Then, the extended integrated substrates 6 and 9 are supplied to the temporary fixing device 600 by a conveying means (not shown). Note that the photo-curing resin PP that has not been used by being spilled from the substrate in the coating apparatus 300, the overlay apparatus 400, and the spreading apparatus 500 is collected in the collection tank 11 of the adhesive supply source 100, and then filtered. The dust is removed at 12, the air bubbles mixed in the defoaming tank 13 are removed, and the viscosity is controlled while being maintained at a predetermined temperature T by the dropping tank 2. The adhesive supply source 100 will be described in detail later with reference to FIG.

  The temporary fixing device 600 partially irradiates the spread substrates 6 and 9 with ultraviolet rays to partially harden the adhesive layer AS, and then temporarily fixes the adhesive layers AS. Supply. The temporary fixing device 600 will be described in detail later with reference to FIG.

  The bonding apparatus 700 irradiates the temporarily fixed substrates 6 and 9 with ultraviolet rays, cures the photocurable resin PP, and fixes the two substrates 6 and 9 together to complete the optical disc recording medium OD. This optical disk recording medium OD is supplied to the measuring apparatus 800 by a conveying means (not shown).

  The measuring device 800 measures the thickness D of the adhesive layer of the optical disc recording medium OD and outputs the measurement result to the quality determining device 900.

  The quality determination apparatus 900 determines whether the measured adhesive layer thickness D is within an allowable range, that is, Dmin ≦ D ≦ Dmax. When the adhesive layer thickness D is outside the allowable range, the measurement result is output to the abnormal signal generating apparatus 1000, and when the adhesive layer thickness D is within the allowable range, the measurement result is output to the correction signal generating apparatus 1100.

  The abnormal signal generation apparatus 1000 receives the output from the quality determination apparatus 900, generates an abnormal signal Sd, and outputs it to the control apparatus 2000.

  The abnormal signal generation apparatus 1000 receives the output from the quality determination apparatus 900, generates a correction signal for correcting each work condition parameter N, V, v, r1, ν, r2, t, and P, and supplies an adhesive. Output to the source 100, the coating apparatus 300, and the spreading apparatus 500. As described above, the quality determination unit 900, the abnormal signal generation unit 1000, and the correction signal generation unit 1100 include a guarantee unit that guarantees the thickness of the adhesive layer AS of the generated optical disc recording medium and the normal operation of the optical disc pasting and manufacturing apparatus ODB. 3000.

  The control device 2000 exchanges various signals with the optical disc pasting / manufacturing device ODB in order to control the operation of the entire optical disc pasting / manufacturing device ODB, and also receives the abnormal signal Sd from the bonding device 700 and receives the optical signal pasting / manufacturing device ODB. Control is performed so that the optical disc recording medium OD having an abnormal adhesive layer thickness D is separated and carried out.

  Next, the operation of the optical disc pasting and manufacturing apparatus ODB will be described with reference to the flowchart shown in FIG.

  When optical disc sticking manufacture is started in step # 100, the aforementioned operation parameters N, V, v, r1, ν, r2, t, and P are set. The significance of these conditions will be described in the following steps.

  This parameter includes the number N of rotations of the substrate when the photocurable resin PP is dropped onto the substrate, the weight V (g) of the photocurable resin PP dropped onto the substrate, and the photocurable resin PP dropped onto the substrate per second. The weight v of the substrate, the rotation speed r1 (rpm) of the substrate when the photocurable resin PP is dropped onto the substrate, the viscosity ν (cps) of the photocurable resin PP, and the rotation speed r2 of the substrate when the photocurable resin PP is spread. (Rpm), rotation time t (sec) of the substrate when the photocuring resin PP is spread, and suction force P (mmHg) that pulls the photocuring resin PP to the inner periphery during the spreading. The significance of these conditions will be described in the following steps. After these conditions are set to predetermined values, the process proceeds to the next step # 200.

  In step 200, in response to the correction signal Sc from the adhesive supply source 100, the operation parameters N, V, v, r1, ν, r2, t, and P are set to N ′, V ′, v ′, r1 ′, Update to ν ′, r2 ′, t ′, and P ′. A method for calculating these update parameters will be described with reference to step # 1100. Needless to say, since the correction signal Sc is not generated immediately after the start of the optical disc pasting and manufacturing apparatus ODB, the operation parameter is not updated and the process proceeds to the next step # 300.

In step # 300, as shown in FIG. 3, a photo-curing resin used as an adhesive for bonding the substrate onto the protective layer while rotating the first substrate 6 at a rotation speed r1 at a low speed for a predetermined N times. A predetermined weight Vg is dropped from the tip 17 of the dropping nozzle 2n (FIG. 1) of the dropping tank 2 so that the photocurable resin PP forms an annular peak concentrically with respect to the center hole H of the substrate 6. Apply as follows. In addition, the mutual relationship of the working parameter at the time of application | coating can be represented by the following 1 formula.
N = α · r1 · V / 60 · v (1)

  As an example, if V = 3.3 g, v = 1.65 g, r1 = 60 rpm, and coefficient α = 1, N = 2. That is, by rotating the first substrate 6 twice between the start and end of dropping the photocurable resin PP, it is possible to form the annular ridge CA having a predetermined shape. In this way, after forming the annular ridge CA, the process proceeds to the next step # 400.

  In Step # 400, as described above, the two substrates 6 and 9 are overlapped so that air bubbles are not mixed between the annular ridge CA of the photo-curing resin PP and the protective layers PL1 and PL2. Then, the process proceeds to next Step # 500.

In step # 500, the substrates 6 and 9 that are integrally overlapped with the annular ridge CA are sucked from the inner peripheral side with a predetermined suction force p while sucking the photocurable resin PP at a predetermined rotational speed r2 for a time t. After rotating the photocurable resin PP at a high speed for a period, the process proceeds to the next step # 600. In addition, the mutual relationship between the work parameters at the time of spreading can be expressed by the following two formulas and three formulas.
D = α1 · p · V · ν / r2 · t (2)
α1 is a coefficient.
ν = α2 / T (3)
α2 is a coefficient, and T is the absolute temperature ° K.
When the coefficient α is α = α1 · α2, the following equation 3 can be derived from the equation (1).
D = α · p · V / r2 · t · T (4)

  FIG. 4 shows the applied adhesive peak CA and the state of the adhesive layer AS in which the same peak CA is spread between the substrate 6 and the substrate 9.

  In step # 600, the spread substrates 6 and 9 are irradiated with ultraviolet rays to temporarily fix them, and then the process proceeds to next step # 700. The temporary fixing device 600 will be described in detail later with reference to FIG.

  In step # 700, the temporarily fixed substrates 6 and 9 are irradiated with ultraviolet rays, the photo-curing resin PP is cured and the two substrates 6 and 9 are fixed together, and the optical disc recording medium OD is completed. Proceed to the next step # 800.

  In Step # 800, the thickness Da of the adhesive layer AL is measured with a laser focus displacement meter, and an adhesive layer thickness signal Sd indicating the measurement result is generated. Then, the process proceeds to next Step # 900.

  In Step # 900, it is determined whether or not the measured adhesive layer thickness D is within an allowable range, that is, Dmin ≦ Da ≦ Dmax. If the adhesive layer thickness D is out of the allowable range, it is considered that the optical disk sticking / manufacturing apparatus ODB is abnormal, so NO is determined and the process proceeds to step # 1000.

  In step # 1000, an abnormality signal Sm indicating that the optical disk sticking / manufacturing apparatus ODB is abnormal is generated, and the process ends.

  On the other hand, if YES in step # 900, that is, if the adhesive layer thickness D is within the allowable range, the process proceeds to step # 1100.

  In Step # 1100, a difference ΔD between the prescribed layer thickness D and Da is obtained. From this ΔD and the above-mentioned formulas 2, 3, and 4, parameters N ′, V ′, v ′, r1 ′, ν corrected to bring the actual adhesive layer Da of the optical disk recording medium OD closer to the standard thickness D After obtaining ', r2', t ', and P' and generating the correction signal Sc, the process returns to step # 200. Although the corrected values are obtained for all parameters here, it goes without saying that corrected values may be obtained for specific parameters. For example, first, after correcting the rotational speeds of r1 and r2, the temperature T may be corrected if necessary to adjust the viscosity ν of the photocurable resin PP.

  In general, if a correction signal Sc for correcting the rotational speeds r1, r2 and time t is output, the correction result is immediately reflected in the adhesive layer thickness D. However, even if the correction signal Sc for correcting the temperature T is output, it takes time for the photo-curing resin PP in the tank to reach the instructed temperature, and it takes time for the photo-curing resin PP to reach a desired viscosity. Therefore, it takes time to confirm the correction result. That is, the correction parameters include an immediate effect parameter typified by the rotation speed T and a slow effect parameter typified by the temperature T. The accuracy of the adhesive layer thickness D can be guaranteed by correcting these immediate effect parameter and slow effect parameter individually, in combination, or alternately.

  In step # 200, as described above, the value of the target parameter is updated with the correction value generated in step # 1100, and sticking manufacture of the optical disc recording medium OD is continued. Unless an abnormality or the like of the optical disc pasting / manufacturing apparatus ODB is detected, the processing from step # 200 to step # 1100 is repeated, and the variation of the working condition is always monitored based on the adhesive layer thickness of the actually manufactured optical disc recording medium OD. At the same time, by performing feedback control for correcting the monitored work condition, it is possible to correct the fluctuation of the work condition and always produce an optical disc recording medium OD having a stable quality under the optimum work condition. it can.

  Although not specifically displayed as steps, during operation of the optical disc pasting and manufacturing apparatus ODB, the adhesive coating step # 300, the overlaying step # 400, and the spreading step # 500 are spilled from the substrate. The photo-curing resin PP that has not been used is recovered in the recovery tank 11 of the adhesive supply source 100, dust is removed by the filter 12, air bubbles mixed in by the defoaming tank 13 are removed, and a predetermined tank tank is used. Viscosity management to keep the temperature T is performed.

  Below, with reference to FIG.5, FIG.6, FIG.7, FIG.8, FIG.9 and FIG. 10, the specific structure of the optical disk sticking manufacturing apparatus ODB based on this invention shown in FIG. FIG. 5 is a plan view schematically showing the arrangement of each process execution unit for holding, transporting, processing, and measuring a substrate in the bonded optical disk manufacturing apparatus. The optical disk pasting / manufacturing apparatus ODB is cured by irradiating the entire surface of the primary laminating unit 33 for temporarily fixing (step # 600) from the adhesive application (step # 300) and the temporarily bonded substrate adhesive layer with ultraviolet rays. Bonding unit 34 for completing the optical disk recording medium OD (step # 700), tilt inspection unit 35 for detecting the tilt amount of the completed optical disk recording medium OD, and a disk for checking the presence or absence of defects other than the tilt of the optical disk recording medium OD. Defect inspection unit 36, adhesive layer thickness inspection unit 37 that measures the quality of the optical disk recording medium by measuring the adhesive layer thickness D of the optical disk recording medium OD and generates a work parameter correction signal Sc or abnormal signal Sm if necessary. Steps # 800, # 900, # 1000, # 1100), the finished disc collecting unit 38, and the optical disc pasting and manufacturing apparatus A control unit 2000 for controlling the ODB entire operation.

  Next, the structure of the primary bonding part 33 is demonstrated using FIG.6, FIG.7, FIG.8 and FIG. FIG. 6 schematically shows the structure of the adhesive supply source 100 that collects the adhesive from the primary laminating unit 33 and performs filtering, and then supplies the primary laminating unit 33 with viscosity management together with a new adhesive. . In the figure, 1 is an ultraviolet curable resin PP, 2 is a dropping tank for storing a resin to be dropped, 3 is a tube, 4 is a circulator (for example, a circulator FC-301 manufactured by Iuchi), 5 is a turntable, and 6 is a lower substrate. , 7 is a dispenser, 8 is a turntable, 9 is an upper substrate, 10 is a cup, 11 is a collection tank, 12 is a filter, 13 is a defoaming tank, and 14 is a heater.

  The UV curable resin PP (hereinafter referred to as the resin PP) is adjusted to a predetermined temperature T by the circulator 4 while passing through the dripping tank 2 and the tube 3 so that the viscosity ν is adjusted (for example, to a temperature lower than room temperature). In this way, the viscosity ν is adjusted to 100 to 10000 cps, more preferably 300 to 1000 cps), and it is dropped into a donut shape by the dispenser 7 on the lower substrate 6 placed on the turntable 5. For example, when the substrate has a diameter of 120 mm, it is dropped so as to form a donut-shaped annular ridge CA at a radius of 15 to 50 mm, more preferably a radius of 25 to 35 mm. Although the lower substrate 6 is conveyed to the turntable 8, since the viscosity ν of the resin PP is several hundreds cps or more, the distribution of the dropped resin amount is not disturbed by the rapid acceleration of the substrate during conveyance.

  Next, the upper substrate 9 is overlaid on the lower substrate 6 so that the bonding surfaces face each other. After a predetermined time required for the resin PP to diffuse between the lower substrate 6 and the upper substrate 9, the turntable 8 is rotated at a high speed of 10 to 10000 rpm, more preferably 3000 to 4000 rpm, until the resin layer AS becomes about 40 to 70 μm. The spreading process (step # 500) is completed.

  Desirable rotation speed r2 and rotation time t vary depending on conditions such as the viscosity of the resin PP. For example, the rotation speed when the viscosity ν of the resin PP is 700 cps and the rotation time is 5 seconds is preferably about 3000 to 3500 rpm.

  The resin PP discharged from the outer periphery of the substrate at the time of spreading is collected by the cup 10 and collected in the collection tank 11. In the filter 12 or the defoaming tank 13, the temperature of the resin PP is adjusted by the heater 14 so that the viscosity ν is adjusted to be low. The resin PP is pressure-fed from the recovery tank 11 to the filter 12 for filtering. Then, after defoaming for a certain time in the defoaming tank 13, it is sent to the dropping tank 2 and used again for dropping onto the lower substrate 6. For example, the resin PP is adjusted to a viscosity ν of 10 to 1000 cps, more preferably 50 to 300 cps, which is lower than that at room temperature by setting the temperature higher than room temperature. It can be made shorter. That is, assuming that the predetermined temperatures in the filtering and defoaming steps are T1 and T2, respectively, the dropping temperature T is lower than T1 and T2, and T1 and T2 may be the same temperature.

  The same effect can be obtained by adjusting the temperature of the atmosphere around the turntable 5 and the turntable 8 using an air conditioner instead of the circulator 4. Further, by using the turntable 5 and the turntable 8 in common, it is possible to reduce the disturbance in the distribution of the amount of resin dripped on the substrate caused by the substrate transport.

  FIG. 7 is a schematic diagram illustrating an outline of the primary bonding unit 33 for bonding. The primary bonding unit 33 includes a substrate supply unit 15, a static elimination blower 16, a substrate supply arm 17, a pre-process table 18, a burr removal and static elimination blow processing unit 19, an adhesive dripping unit 20, a substrate reversing unit 21, and a turntable 23. , A boss 24, a transfer arm 25, a temporary fixing ultraviolet irradiator 26, a pallet 27, and a boss 30. Further, a lower correction plate 28 and an upper correction plate 29 are provided to correct the warpage of the substrate by sandwiching the substrate from above and below. The turntable 8 is provided with a disk body 22 in which an upper substrate 6 and a lower substrate 9 are integrally overlapped with a resin layer AS interposed therebetween.

  The substrates to be bonded are supplied to the substrate supply unit 15 using separate stack poles for the lower substrate 6 and the upper substrate 9, respectively. The neutralization blow is performed from the side surface of the substrate stacked on the stack pole by using the neutralization blower 16 to remove dust adhering to the substrate and to prevent the substrates from sticking when taking out the stacked substrates. Perform separation. The substrate supply arm 17 is used to take out the lower substrate 6 and the upper substrate 9 from the stack pole and supply them to the pre-process table 18.

  The lower substrate 6 and the upper substrate 9 are burrs removal and static elimination blow processing unit 19, and the inner peripheral portion of the substrate bonding surface is pressed with a press to crush the burrs on the substrate bonding surface generated during molding. The substrate surface is blown with static elimination while rotating the substrate, and the bonded surface of the substrate is cleaned. The blown dust is discharged from the dust suction port, and the cleanliness in the chamber of the processing unit 19 for removing burrs and discharging blow is maintained.

  The lower substrate 6 is placed on the turntable of the resin dropping unit 20 with the bonding surface facing upward, and an ultraviolet curable resin PP (hereinafter referred to as resin PP) is formed in a donut shape on the bonding surface by a dispenser 7 (FIG. 6). It is dripped. For example, in the case of a disk with a diameter of 120 mm, it is dropped into a donut shape at a radius of 15 to 50 mm, more preferably at a radius of 25 to 35 mm. The upper substrate 9 is reversed by the substrate reversing unit 21 so that the bonding surface faces downward. Next, the lower substrate 6 is transferred from the pre-process table 18 to the turntable 8, and then the upper substrate 9 is laminated on the lower substrate 6 so that the bonding surfaces are aligned with each other, and the resin PP is provided between the lower substrate 6 and the upper substrate 9. Wait for it to spread. At this time, diffusion is performed quickly by keeping the distance between the lower substrate 6 and the upper substrate 9 constant.

  After the dropped resin PP diffuses from 0 to 10 mm outer circumference side, more preferably from 0 to 2 mm outer circumference side from the target position at the innermost circumference when the disc is completed, the resin layer AS becomes about 40 to 70 μm. The disk body 22 is manufactured by rotating the turntable 8 at a high speed at r2 of 10 to 10000 rpm, more preferably r2 of 3000 to 4000 rpm. Note that the desired rotation speed r2 and rotation time t vary depending on the viscosity ν of the resin PP or the rotation time t. For example, when the viscosity ν of the resin PP is 700 cps and the rotation time t is 5 seconds, the rotation speed r2 is preferably about 3000 to 3500 rpm.

  During the high-speed rotation, the resin PP between the lower substrate 6 and the upper substrate 9 moves to the outer periphery of the substrate by centrifugal force. When the high-speed rotation time t is increased or the rotation speed r2 is increased, the amount of the moving resin PP increases, and a gap where the resin PP is not filled is formed in the inner peripheral portion between the lower substrate 6 and the upper substrate 9. End up. Due to this gap, the appearance of the disk body 22 deteriorates, and the variation in the resin layer thickness also increases.

  FIG. 8 shows the structure of the periphery of the boss 30 of the turntable 8. The resin PP that has diffused and protruded from the central hole of the lower substrate 6 or the upper substrate 9 is sucked by the suction pump 32 through the suction port 31 provided in the boss 30. Using this mechanism, while the substrates 6 and 9 are rotated at a high speed, the resin PP between the lower substrate 6 and the upper substrate 9 is applied from the center side of the substrate with a force p stronger than the centrifugal force applied to the resin PP by the high-speed rotation. By performing suction (hereinafter referred to as inner peripheral suction), it is possible to suppress the extreme movement of the resin PP located on the inner peripheral side of the substrate toward the outer peripheral side of the substrate.

  Next, the disk body 22 that has been rotated at a high speed is transported to the turntable 23 and passed through a boss 24 having a predetermined diameter, thereby performing a centering step for correcting the misalignment between the lower substrate 6 and the upper substrate 9. The center misalignment amount between the two substrates by this centering step is equal to or less than the difference between the center hole diameter of the lower substrate 6 and the upper substrate 9 and the boss diameter. For example, the center hole diameter of both substrates is φ15.070 mm and the diameter of the boss 24 is If φ15.055 mm, the amount of deviation can be suppressed to about 15 μm or less.

  Air bubbles may be mixed into the resin layer on the inner periphery of the disk due to the load on the uncured resin layer due to the conveyance and centering of the disk body 22 after spreading. In such a case, the bubbles can be removed by performing suction on the inner periphery (hereinafter referred to as “re-suction”) again with the turntable 23. In addition, the protrusion of the resin to the end face of the center hole of the disk body 22 due to the variation in the amount of the resin dripping, or the unfilled gap between the substrates can be prevented by performing suction again.

  Then, using the temporarily fixing ultraviolet irradiator 26 attached to the transfer arm 25, the inner periphery of the disk is irradiated with ultraviolet rays to cure the resin, and the lower substrate 6 and the upper substrate 9 are partially integrated. Then, both substrates are temporarily fixed. As a result, the positions of the lower substrate 6 and the upper substrate 9 do not shift thereafter, and the disc body 22 can be transported while preventing air bubbles from entering the inner periphery. In this case, the boss 24 of the turntable 23 has the same structure as the boss 30 shown in FIG. The resin PP that has diffused and protruded from the central hole of the lower substrate 6 or the upper substrate 9 is sucked by the suction pump 32 through the suction port 31 provided in the boss 30.

  The disk body 22 that has finished the ultraviolet spot irradiation process is conveyed to the pallet 27, and is sandwiched from above and below by a glass lower correction plate 28 and an upper correction plate 29 that suppress warpage of the substrate, and is sent to the ultraviolet irradiation process. It is better if each correction plate is made of a material having a high ultraviolet transmittance (for example, quartz glass). Further, the shape of the lower correction plate 28 and the upper correction plate 29 on the disk contact surface side is a convex portion of the substrate surface such as a stack rib, or a step between the surface of the clamp region and the surface of the signal region RS of the substrate caused by molding conditions. In order to ensure the flatness of the bonded substrate surfaces, it is preferable that the shape conforms to.

  Further, the shape of the lower correction plate 28 and the upper correction plate 29 on the disk contact surface side is formed so as to avoid the signal regions RS1 and RS2 of the disk body 22 and correct the clamp portion, the outer peripheral portion, or both. As a result, it is possible to prevent a situation in which foreign matter is caught between the correction plates and the disk body 22 and the substrate surface corresponding to the signal areas RS1 and RS2 of the disk body 22 is damaged.

  Furthermore, returning to FIG. 5, each process part after the primary bonding part 33 is demonstrated. The disc body 22 that has been temporarily fixed (step # 600) by the primary bonding unit 33 is conveyed to the bonding unit 34 together with the pallet 27. In the bonding part 34, the upper and lower substrates 6 and 9 are united by irradiating the disk body 22 with ultraviolet rays and finally curing the resin layer AS. Since the bonding portion 34 becomes high temperature due to heat generated from the ultraviolet lamp, cooling air is blown onto the disk body 22 to prevent the temperature of the disk body 22 from increasing.

  When the resin PP on the end surface of the outer peripheral portion of the disk body 22 is not sufficiently cured, the tilt of the disk body 22 is increased. Therefore, the end surface of the outer peripheral portion must be irradiated with ultraviolet rays to sufficiently harden the resin PP. Therefore, in order to guide the ultraviolet rays irradiated from the upper surface or the lower surface of the disk body 22 to the outer peripheral end portion of the disk body 22, the outer periphery of the disk body 22 is surrounded by the transport pallet 27 and the mirror surface is directed substantially parallel to the end surface of the disk outer peripheral portion. A reflector is provided. The material of the reflecting mirror is preferably aluminum that has been mirror-finished with a high ultraviolet reflectance.

  The disk body 22 that has been fully cured by the ultraviolet irradiation is transported to each inspection unit, and the tilt inspection unit 35 inspects the tilt with an appropriate tilt inspection machine (for example, SH3DL-12NE manufactured by Admon Science). In the defect inspection unit 36, the presence or absence and degree of defects are inspected by an appropriate defect inspection machine (for example, VCD120C manufactured by Dr. Schenk). Also in the adhesive layer thickness inspection section 37, the thickness D of the adhesive layer AS is measured using a measuring instrument such as a laser focus displacement meter (for example, LT-800 manufactured by Keyence Corporation). Then, as described above, the measured adhesive layer thickness D is compared with a predetermined reference value, and together with the quality of the optical disk recording medium, the operating state of the optical disk pasting and manufacturing apparatus ODB is within an allowable range that can be corrected by correcting the parameters. It is determined whether there is an abnormal situation that cannot be corrected by parameter correction. If the optical disk recording medium is defective, the disk collection unit 38 sorts the non-defective product and defective product and collects them on the stack pole. Of the defective products, defective inspection defective products require a cause analysis, and are collected separately from other defective products. If correction is possible, a parameter correction signal is generated, and the primary bonding unit 33 is fed back to perform servo control control. If it is an abnormal situation, an abnormal signal Sd is generated and necessary measures such as stopping the optical disc pasting and manufacturing apparatus ODB are taken.

  The structure of the boss 24 used in the centering process will be described with reference to FIGS. FIG. 9 is a plan view of the boss 24, and FIG. 10 is a schematic view showing a state in which the disk body 22 is set on the turntable 23. The pin 39 has a length that can contact the inner peripheral end surfaces of the lower substrate 6 and the upper substrate 9 at the same time, and is provided so that the major axis direction thereof is substantially parallel to the thickness direction of the upper and lower substrates 6 and 9. . Reference numeral 40 denotes an air cylinder, and 41 denotes a pump capable of sucking and exhausting air. When centering is performed, air is sent from the pump 41 to the cylinder 40, the cylinder 40 is extended, and the pins 39 are pushed out in the outer peripheral direction of the upper and lower substrates 6 and 9. The pins 39 align the end surfaces of the upper and lower substrates 6 and 9 and align the centers of the upper and lower substrates 6 and 9. The same effect can be obtained by providing a pin having the same means on the transfer arm 25 itself. It should be noted that the number of pins 39 is two or more, but preferably three. Furthermore, by providing the boss 24 with the suction structure shown in FIG. 8, it is possible to effectively correct the center shift amount while preventing air bubbles from entering the adhesive layer AS.

  In this way, the adhesive layer AS is locally irradiated by irradiating the adhesive layer AS of the disk body 22 centered while being suctioned by the configured bath 24 with a predetermined suction force P1 (mmHg). Then, the disk body 22 is temporarily fixed. However, preferably, the inner end portion of the adhesive layer AS is cured and temporarily fixed. Further, if necessary, the outer peripheral portion of the adhesive layer AS is irradiated to cure the inner peripheral side and the outer peripheral side.

  Next, referring to FIG. 12, based on the measured value of the optical disc recording medium adhesive layer thickness D according to the present invention, the optical disc recording medium quality and the operating state of the optical disc pasting and manufacturing apparatus are detected, and based on the detection result. A description will be given of a case where servo control control for changing the operating condition of the optical disk pasting and manufacturing apparatus is applied to optical disk manufacturing by a printing method. Since the printing method and apparatus are known, a description thereof will be omitted. The steps are basically the same as those in the above-described spin coating method except for the steps unique to the printing method adhesive application method described with reference to FIGS.

As described above, as a result of application by printing, the thickness of the adhesive layer AS varies in the diameter direction by | D1-D2 |. When the diameter of the substrate is DM, the parallelism with respect to the direction of application of the adhesive to the substrate, that is, the inclination θ can be expressed by the following equation (5).
tan θ = | D1-D2 | / DM (5)

Further, the relationship between the distance S between the screen SP and the substrate and the adhesive layer thickness D can be expressed by the following formula 6.
D = α3 ・ V ・ S (6)
α3 is a coefficient.

  That is, when correcting the thickness distribution (parallelism) of the adhesive layer on the substrate, the correction angle Δθ for adjusting the relative angle between the screen SP and the substrate is calculated based on Equation 5 and corrected. A signal Sc is generated.

  If the thickness distribution of the adhesive layer is so small that it can be ignored, but it is necessary to correct the thickness D itself, ΔS is calculated based on Equation 6 to generate a correction signal Sc.

  The present invention controls the temperature of the adhesive when forming a disk by forming an adhesive layer between the first substrate and the second substrate and bonding the first substrate and the second substrate together. By changing the viscosity according to each step, a disk having a good appearance can be stably produced, and the operating efficiency of the production apparatus can be improved.

  In the present invention, when the adhesive layer is formed between the first substrate and the second substrate and the first substrate and the second substrate are bonded together, the first substrate and the second substrate are bonded together. After adjusting the thickness of the adhesive layer by rotating it at a high speed integrally, by sucking the adhesive layer between the first substrate and the second substrate from the inner peripheral edge of the substrate, a disc with a good appearance free of bubbles etc. It can be manufactured stably.

  Further, in the present invention, when the first substrate and the second substrate are bonded together by forming an adhesive layer between the first substrate and the second substrate, the first substrate and the second substrate are bonded together. After the high-speed rotation is integrally performed, the misalignment between the centers of the first substrate and the second substrate is corrected, whereby the misalignment between the centers of the two substrates to be bonded can be easily and accurately suppressed.

  In addition, in the present invention, since air bubbles can be prevented from being mixed into the adhesive layer, all structures including single-sided single-layer discs, double-sided single-sided discs, etc. It can be used for laminating discs. Since the thickness at the radial position can be kept uniform, that is, the thickness on the same circumference can be made constant.

  Furthermore, in the present invention, based on the measured value Da of the adhesive layer thickness D of the manufactured optical disk recording medium, the optical disk recording medium quality and the operating state of the optical disk application manufacturing apparatus are detected, and the optical disk application is performed based on the detected result. Since servo control control is performed to change the operating conditions of the manufacturing apparatus, an optical disk with stable quality can always be manufactured even if the operating environment and other conditions vary.

  As described above, the bonded optical disk manufacturing apparatus according to the present invention can ensure the light transmittance of the adhesive layer, so that the optical disk recording medium can be easily multilayered in the future, and further the adhesive layer thickness of the bonded optical disk. Therefore, the operating conditions of the previous process can be automatically adjusted, which is suitable for the production of an optical disc with stable quality.

It is a block diagram which shows the structure of the optical disk sticking manufacture apparatus based on this invention. It is a flowchart which shows operation | movement of the optical disk sticking manufacturing apparatus shown in FIG. It is explanatory drawing of adhesive application shown in FIG. It is explanatory drawing of the adhesive agent spreading shown in FIG. It is a block diagram which shows the modification of the optical disk sticking manufacturing apparatus shown in FIG. It is explanatory drawing of the adhesive supply source part in the pre-bonding process part shown in FIG. It is explanatory drawing of the board | substrate process part of the pre-bonding process part shown in FIG. It is a schematic diagram which shows the board | substrate inner periphery suction mechanism used for the extending part shown in FIG. It is a top view which shows typically the board | substrate centering mechanism used for the temporary fix | fixed part shown in FIG. It is explanatory drawing of centering of the two board | substrates piled up integrally by the board | substrate centering mechanism shown in FIG. It is explanatory drawing of the application method of the adhesive agent by a printing system. It is explanatory drawing of the distribution state on the board | substrate of the adhesive agent by a printing system. It is a schematic diagram which shows the structure of a single-sided single layer disc. It is a schematic diagram which shows the structure of a single-sided double layer disc. It is a schematic diagram which shows the structure of a double-sided single layer disc. It is explanatory drawing of adhesive application based on a spin coat system. It is explanatory drawing of the superimposition of the board | substrate after adhesive agent application based on a spin coat system. It is explanatory drawing of adhesive spreading based on a spin coat system. It is explanatory drawing of the board | substrate adhesion | attachment after adhesive spreading based on a spin coat system. It is a flowchart which shows the conventional optical disk sticking method based on a spin coat system.

Explanation of symbols

6,9 Substrate, 100 Adhesive supply means, 12 Filtration means, 13 Defoaming means, 30 Suction means, 300 Annular application means, 400 Superimposing means, 500 Spreading means, 600 Temporary fixing means, OD optical disk, AS adhesive layer , CA annular ridge, PP adhesive

Claims (4)

A bonded optical disc manufacturing apparatus (ODB) for manufacturing an optical disc (OD) by laminating at least a first substrate (6) and a second substrate (9),
Adhesive application means for applying an adhesive (PP) between the first and second substrates (6, 9) to form an adhesive layer (CA, AS) having a predetermined thickness (Da). 300, 400, 500),
An adhesive supply means (100) for supplying an adhesive (PP) managed at a first predetermined temperature (T) to the adhesive application means (300, 400, 500);
In said first predetermined temperature (T) higher than the third predetermined temperature (T2), have a defoaming means (13) for removing air bubbles that are mixed into the adhesive (PP),
The adhesive supply means (100) recovers an adhesive (PP) that has not been used to form the adhesive layer (AS) from the adhesive application means (300, 400, 500). 11) and
Laminating type, characterized by further organic and filtering means for filtering (12) with said recovered adhesive above (PP) to said first predetermined temperature (T) a second predetermined temperature (T1) Optical disc manufacturing equipment (ODB). The adhesive application means (300, 400, 500) applies the adhesive (PP) to a first predetermined rotation speed at a predetermined radial position on the first surface (RS1) of the first substrate (6). An annular application means (300) that is applied in (r1) to form an annular ridge (CA) having a narrow ridge-like cross section at the tip;
Superimposing means (400) for superimposing the second substrate (9) on the first substrate (6) so as to be in contact with the tip of the annular flange (CA);
The superposed first and second substrates (6, 9) are integrally rotated at a second predetermined rotational speed (r2), and the annular ridge (CA) is moved from the predetermined radial position toward the outer peripheral portion. The bonded optical disk manufacturing apparatus (ODB) according to claim 1, further comprising: a spreading means (500) that spreads to form an adhesive layer (AS). A suction means (30) for sucking the annular ridge (CA) with a first predetermined suction force (p) during the spreading and retaining an end of the adhesive layer (AS) in the vicinity of the first predetermined radius position. The bonded optical disk manufacturing apparatus (ODB) according to claim 2 , wherein While adhering the sucked adhesive layer AS with a second predetermined suction force (p1) and correcting the misalignment between the centers of the first substrate (6) and the second substrate (9), the adhesion is performed. Temporary fixing means (600) for temporarily fixing the layer (AS) by partially curing the first and second substrates (6, 9; 22) partially. The bonded optical disk manufacturing apparatus (ODB) according to claim 3 .

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