JPH1164303A - Ultrasonic inspection method for joint of electronic parts - Google Patents
Ultrasonic inspection method for joint of electronic partsInfo
- Publication number
- JPH1164303A JPH1164303A JP9251237A JP25123797A JPH1164303A JP H1164303 A JPH1164303 A JP H1164303A JP 9251237 A JP9251237 A JP 9251237A JP 25123797 A JP25123797 A JP 25123797A JP H1164303 A JPH1164303 A JP H1164303A
- Authority
- JP
- Japan
- Prior art keywords
- joining
- ultrasonic
- electronic component
- tool
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【0001】[0001]
【発明に属する利用分野】本発明は超音波発振器から送
信された超音波の電子部品マイクロ接合部からの反射波
を用いて、良好な接合条件を決める際の加工前の予備実
験の接合部の検査、接合中の接合状態の監視および検
査、接合された製品の接合後の検査などに使用される電
子部品接合部の超音波検査法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a reflected wave of an ultrasonic wave transmitted from an ultrasonic oscillator from a micro-joined part of an electronic component to determine a good joining condition in a preliminary experiment before processing when determining good joining conditions. The present invention relates to an ultrasonic inspection method for a joint of electronic components used for inspection, monitoring and inspection of a joining state during joining, inspection after joining of joined products, and the like.
【0002】[0002]
【従来の技術】電子部品マイクロ接合部の良否は製品の
信頼性や生産性を左右することから、従来のマイクロ接
合では良好な接合状態を維持するためにあらかじめ予備
実験を行い、良好な接合条件を決めてからプロパー加工
が行われている。さらにプロパー加工中の接合状態の監
視には接合された製品を抜き取り、接合部をせん断工具
で押し付けて接合部が破壊するときの荷重で接合状態を
判定するプッシュテスト、ワイヤボンディングにおける
接合された金線などのワイヤをフックに引っかけてワイ
ヤの破断する位置から接合状態を判定するプルテスト、
接合部を削って断面状態を顕微鏡で観察する方法などが
広く用いられている。2. Description of the Related Art The quality of a micro-joined part of an electronic component affects the reliability and productivity of a product. Therefore, in the conventional micro-joining, preliminary experiments are performed in advance to maintain a good joining state, and good joining conditions are obtained. After determining the proper processing has been performed. In addition, to monitor the bonding state during proper processing, the bonded product is extracted, the joint is pressed with a shearing tool to determine the bonding state based on the load when the joint breaks, and the bonded metal in wire bonding Pull test to determine the bonding state from the position where the wire breaks by hooking a wire such as a wire on the hook,
A method in which a cross section is observed with a microscope by shaving a joint portion is widely used.
【0003】[0003]
【発明が解決しようとする課題】しかし、予備実験や品
質管理や生産性を上げるための抜き取り検査に従来から
用いられている上記のプルテスト、プッシュテストによ
る強度試験や接合界面の顕微鏡観察は、接合部を破壊す
る試験法であり、検査した製品は商品として利用できな
い問題があった。また検査において正確な判定を行うた
めには熟練者を要し、また判定結果がでるまで長い時間
を要する問題があった。However, the strength test by the pull test and the push test and the microscopic observation of the bonding interface, which have been conventionally used for preliminary experiments, sampling tests for quality control and productivity enhancement, are not performed by the bonding. This is a test method that destroys the part, and there is a problem that the inspected product cannot be used as a product. In addition, a skilled worker is required to make an accurate determination in the inspection, and a long time is required until a determination result is obtained.
【0004】本発明者は、このような問題点を解決する
事を目的に多くの実験と検討を試みた結果、電子部品を
接合するための荷重や振動をマイクロ接合部に付与する
接合工具に超音波発振器を接着し、その接合工具を超音
波発振器から発信された超音波の伝達媒体として利用す
ることによって、電子部品マイクロ接合の微小領域に超
音波を集中して送信し、マイクロ接合部から反射され、
受信された反射波の振幅を正常状態の振幅と比較して、
異常な接合状態を非破壊的に判定することができる事を
知見した。また、超音波送受信部である超音波発振器を
接着したマイクロ接合用工具をマイクロ接合機械にその
まま搭載できることから、接合プロセス中の反射波の振
幅を用いることによって接合中の異常な接合状態を監視
することができる事も知見した。[0004] The inventor of the present invention has conducted many experiments and studies for the purpose of solving such problems, and as a result, has found that a joining tool for applying a load or vibration for joining electronic components to a micro joining portion has been developed. By gluing the ultrasonic oscillator and using the joining tool as a transmission medium of the ultrasonic wave transmitted from the ultrasonic oscillator, the ultrasonic waves are concentrated and transmitted to the micro area of the electronic component micro-joining, and from the micro-joining part Reflected,
Compare the amplitude of the received reflected wave with the amplitude of the normal state,
It has been found that an abnormal joining state can be determined nondestructively. In addition, since the micro-joining tool to which the ultrasonic oscillator, which is the ultrasonic transmitter / receiver, is attached, can be directly mounted on the micro-joining machine, the abnormal joining state during joining is monitored by using the amplitude of the reflected wave during the joining process. I learned that I can do it.
【0005】[0005]
【課題を解決するための手段】本発明はこのような知見
に基づいて構成したもので、その要旨は、超音波発振器
から発信される超音波パルスを、電子部品接合用工具を
介して電子部品の接合部に送信し、反射される超音波を
受信して変換した検出波形振幅のピーク出力電圧と、接
合前に接合部と接触していない離隔状態で測定した接合
工具から反射された超音波の検出波形振幅のピーク出力
電圧との差を演算し、予め設定した正常状態時の接合状
態を基準とした電圧差・剥離強度関係線とを比較してそ
の偏差量から接合部の剥離強度を推定する電子部品接合
部の超音波検査法である。SUMMARY OF THE INVENTION The present invention has been made on the basis of such knowledge, and the gist of the present invention is that an ultrasonic pulse transmitted from an ultrasonic oscillator is transmitted to an electronic component through an electronic component joining tool. The peak output voltage of the detected waveform amplitude that is transmitted to the joint and reflected and received and converted, and the ultrasonic wave reflected from the welding tool measured in a separated state where it is not in contact with the joint before welding Calculate the difference between the detected waveform amplitude and the peak output voltage, and compare it with the voltage difference-peeling strength relationship line based on the bonding state in the normal state set in advance to determine the peeling strength of the joint from the deviation. This is an ultrasonic inspection method for an electronic component joint to be estimated.
【0006】また、このような本発明は、抜き取り検査
において検査前の電子部品接合用工具が接合部に接触し
ていない離隔状態での接合工具からの反射波の検出波形
振幅のピーク出力電圧と、電子部品接合用工具が接合部
と接触している検査中の反射波の検出波形振幅のピーク
出力電圧との差を求めると、抜き取り検査にも利用でき
る検査法でもある。According to the present invention, the peak output voltage of the detected waveform amplitude of the reflected wave from the joining tool in the separated state in which the electronic component joining tool before the inspection is not in contact with the joint in the sampling inspection is provided. If the difference between the detected waveform amplitude of the reflected wave during the inspection in which the electronic component joining tool is in contact with the joint and the peak output voltage is obtained, this is also an inspection method that can be used for sampling inspection.
【0007】[0007]
【発明の実施の形態】以下、本発明について図面を参照
しながら詳細に説明する。図1は本発明を判り易く説明
するために提示したもので、本発明における超音波検査
法の一実施例を示す。図1において1は電子部品被接合
部材で、その表面にマイクロ接合部材2が接合されてい
る。3は超音波発振器である。超音波発振器3は各種の
周波数の超音波パルスを発振し、反射された超音波を受
信する素子で、電子部品接合用工具4に接着されてい
る。超音波発振器3から発信された超音波パルスは電子
部品接合用工具4を介して、電子部品被接合部材1の接
合部に送信される。電子部品接合用工具4は電子部品被
接合材1とマイクロ接合部材2を接合する際に必要とな
る負荷力(接合荷重)や振動などをマイクロ接合部材2
に付与する工具で、ワイヤボンディングの接合部材であ
る金線やアルミニウム線に接合荷重と振動を付加するキ
ャピラリー、集積回路部品(チップ)と接合するTAB
テープに接合荷重を付加するボンディングヘッド、電子
部品はんだ付部に負荷力を与える加圧ヘッドなどの工具
が使用される。すなわち、超音波発振器3から発信され
た超音波パルスが電子部品接合用工具4を介して、電子
部品被接合部材1に送信され、反射される超音波を受信
するように構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is provided for easy understanding of the present invention, and shows an embodiment of an ultrasonic inspection method according to the present invention. In FIG. 1, reference numeral 1 denotes a member to be joined to an electronic component, on which a micro joining member 2 is joined. 3 is an ultrasonic oscillator. The ultrasonic oscillator 3 oscillates ultrasonic pulses of various frequencies and receives reflected ultrasonic waves. The ultrasonic oscillator 3 is bonded to the electronic component bonding tool 4. The ultrasonic pulse transmitted from the ultrasonic oscillator 3 is transmitted to the joint of the electronic component joined member 1 via the electronic component joining tool 4. The electronic component joining tool 4 applies a load force (joining load), vibration, and the like necessary for joining the electronic component workpiece 1 and the micro joining member 2 to the micro joining member 2.
A tool that applies bonding load and vibration to gold and aluminum wires, which are bonding members for wire bonding, and a TAB that bonds to integrated circuit components (chips)
Tools such as a bonding head for applying a bonding load to the tape and a pressure head for applying a load to the soldered portion of the electronic component are used. That is, the ultrasonic pulse transmitted from the ultrasonic oscillator 3 is transmitted to the electronic component bonded member 1 via the electronic component bonding tool 4 and receives the reflected ultrasonic wave.
【0008】5は超音波測定装置である。超音波測定装
置5は超音波発振器3に超音波を発振させるための電気
パルスを出力したり、超音波発振器3で受信、変換され
た反射波の電気信号を増幅して出力する機能を有するも
のである。該超音波測定装置5は、超音波発振器3に超
音波を発振させるための電気パルス信号を出力するタイ
ミングや電気パルス信号の大きさを制御するパルサー
6、超音波発振器3で変換された反射波の電気信号を増
幅するレシーバー7、レシーバー7で増幅された反射波
の電気信号の出力や反射波の電気信号から検出したい特
定の時間帯を設定する機能を有するゲート8、ゲート8
で設定された特定の時間帯の検出波形振幅のピーク電圧
を出力するピークディテクター9から構成されている。
なお、本発明においては、従来から開発されている超音
波測定装置5を使用してもよい。超音波測定装置5の出
力端子を用いることによって、次のような測定が可能と
なる。 (1)超音波発振器3で受信、変換され、レシーバー7
で増幅された電子部品接合部からの反射波の電気信号
と、超音波発振器3を発信させるために用いたパルサー
6の電気パルス信号は、ゲート8の波形出力端子から出
力され、これとパルサー6の出力端子から出力されるト
リガー信号をオシロスコープ10に接続すると、受信さ
れた反射波が観測できる。 (2)超音波発振器3で受信された反射波には電子部品
被接合部材1とマクロ接合部材2の接合境界面から反射
波が含まれている。電子部品被接合部材1とマクロ接合
部材2の接合境界面から反射波が現れる時間帯をゲート
8で設定すると、その時間帯だけに一定電圧が付与され
る矩形波電気信号がゲート8からピークディテクター9
に送られる。この矩形波電気信号とレシーバー7で増幅
されゲート7を経た反射波の電気信号から、ピークディ
テクター9では設定された時間帯の検出波形振幅のピー
ク電圧を検出し、ピークディテクター9の出力端子から
出力されて電子部品マイクロ接合部を評価するための出
力信号となる。Reference numeral 5 denotes an ultrasonic measuring device. The ultrasonic measuring device 5 has a function of outputting an electric pulse for causing the ultrasonic oscillator 3 to oscillate an ultrasonic wave or amplifying and outputting an electric signal of a reflected wave received and converted by the ultrasonic oscillator 3. It is. The ultrasonic measuring device 5 includes a pulser 6 for controlling the timing of outputting an electric pulse signal for causing the ultrasonic oscillator 3 to oscillate ultrasonic waves and a magnitude of the electric pulse signal, and a reflected wave converted by the ultrasonic oscillator 3. 7, a gate 8 having a function of setting a specific time zone to be detected from the output of the electric signal of the reflected wave amplified by the receiver 7 and the electric signal of the reflected wave.
And a peak detector 9 that outputs a peak voltage of the detected waveform amplitude in a specific time zone set by the above.
In the present invention, an ultrasonic measuring device 5 that has been conventionally developed may be used. The use of the output terminal of the ultrasonic measurement device 5 enables the following measurement. (1) Received and converted by the ultrasonic oscillator 3, and the receiver 7
The electric signal of the reflected wave from the joint of the electronic components amplified by the above and the electric pulse signal of the pulser 6 used for transmitting the ultrasonic oscillator 3 are outputted from the waveform output terminal of the gate 8 and the pulser 6 When the trigger signal output from the output terminal is connected to the oscilloscope 10, the received reflected wave can be observed. (2) The reflected wave received by the ultrasonic oscillator 3 includes the reflected wave from the joining boundary surface between the electronic component joined member 1 and the macro joined member 2. When a time zone in which a reflected wave appears from the joining boundary surface between the electronic component member-to-be-joined 1 and the macro-joining member 2 is set by the gate 8, a rectangular wave electric signal to which a constant voltage is applied only in that time zone is output from the gate 8 to the peak detector. 9
Sent to From the square wave electric signal and the electric signal of the reflected wave amplified by the receiver 7 and passed through the gate 7, the peak detector 9 detects the peak voltage of the detected waveform amplitude in the set time zone, and outputs from the output terminal of the peak detector 9. The output signal is used to evaluate the electronic component micro-joint.
【0009】11はパーソナルコンピュータである。パ
ーソナルコンピュータ11はピークディテクター9から
出力された接合前と接合中の検出波形振幅のピーク電圧
の差を演算し、予め設定した電圧差・剥離強度関係曲線
と比較して接合部の剥離強度を推定すると共に、異常接
合状態を判定する。推定や判定の結果はディスプレイ1
2に表示し、必要な場合にはプリンター13に出力する
こともできる。Reference numeral 11 denotes a personal computer. The personal computer 11 calculates the difference between the peak voltages of the detected waveform amplitudes before and during joining output from the peak detector 9 and compares them with a preset voltage difference / peeling strength relation curve to estimate the peeling strength of the joint. And an abnormal joining state is determined. Display 1 for estimation and judgment results
2 and output to the printer 13 if necessary.
【0010】上記のような測定装置において、本発明の
超音波検査法について詳細に説明する。図2は、接合中
に超音波発振器3から送信された超音波が電子部品接合
用工具4を介してマイクロ接合部に送信されて、反射さ
れる経路を示す説明図である。図2において、超音波発
振器3は電子部品接合用工具4と接着されている。接合
中に超音波発振器3から発信された超音波は、電子部品
接合用工具4を伝播してマイクロ接合部材2と電子部品
接合用工具4との接触界面で一部が反射され、接合部に
透過した残りの超音波はマイクロ接合部材2の中を伝播
した後、マイクロ接合部材2と電子部品被接合部材1の
接合境界面で反射され、さらに電子部品被接合部材1に
透過した超音波は電子部品被接合材1の底面で反射され
る。これらの反射波は送信で用いた電子部品接合用工具
4を伝播して超音波発振器3と同じ素子である受信器3
に受信される。電子部品接合用工具4とマイクロ接合部
材2の接触界面で反射される反射波とマイクロ接合部材
2の接合境界面や電子部品被接合部材1の底面から反射
される反射波は相互の往復時間間隔が短いために受信器
3で受信される反射波は接触界面、接合境界面、電子部
品底面から反射された反射波が重なった反射波となる。The ultrasonic inspection method of the present invention in the above-described measuring apparatus will be described in detail. FIG. 2 is an explanatory diagram showing a path in which ultrasonic waves transmitted from the ultrasonic oscillator 3 during the welding are transmitted to the micro-joining portion via the electronic component joining tool 4 and reflected. In FIG. 2, the ultrasonic oscillator 3 is bonded to an electronic component joining tool 4. The ultrasonic wave transmitted from the ultrasonic oscillator 3 during the bonding propagates through the electronic component bonding tool 4 and is partially reflected at the contact interface between the micro-joining member 2 and the electronic component bonding tool 4, and The remaining transmitted ultrasonic wave propagates through the micro-joining member 2 and is reflected at the joining boundary surface between the micro-joining member 2 and the electronic component-joined member 1, and further transmitted through the electronic component-joined member 1. The light is reflected by the bottom surface of the electronic component material 1. These reflected waves propagate through the electronic component bonding tool 4 used in the transmission, and the receiver 3 is the same element as the ultrasonic oscillator 3.
Is received. The reflected wave reflected at the contact interface between the electronic component joining tool 4 and the micro joining member 2 and the reflected wave reflected from the joining boundary surface of the micro joining member 2 and the bottom surface of the electronic component joined member 1 are reciprocating time intervals. Is short, the reflected wave received by the receiver 3 is a reflected wave in which the reflected waves reflected from the contact interface, the junction boundary surface, and the bottom surface of the electronic component overlap.
【0011】接合前は電子部品接合用工具4とマイクロ
接合部材2が接触していないために、超音波発振器3か
ら発信された超音波は電子部品接合用工具4の下端から
の反射波のみが現れ、受信される反射波にはマイクロ接
合部材2の接合界面や電子部品被接合部材1の底面から
の反射波は含まれていない。マイクロ接合部材2の接合
状態はマイクロ接合部材2の接合境界面と電子部品被接
合部材1の底面からの反射波に含まれており、これらの
反射波が現れる時間帯はマイクロ接合用工具4の長さや
測定する電子部品被接合部材4によって異なるために、
あらかじめ計測してその時間帯を求めておく。Before the joining, since the electronic component joining tool 4 and the micro joining member 2 are not in contact with each other, the ultrasonic wave transmitted from the ultrasonic oscillator 3 is only a reflected wave from the lower end of the electronic component joining tool 4. The reflected waves that appear and are received do not include the reflected waves from the bonding interface of the micro bonding member 2 or the bottom surface of the electronic component bonded member 1. The bonding state of the micro bonding member 2 is included in the reflected waves from the bonding boundary surface of the micro bonding member 2 and the bottom surface of the electronic component bonded member 1, and the time when these reflected waves appear is determined by the time of the micro bonding tool 4. Because it differs depending on the length and the electronic component to be joined 4 to be measured,
Measure in advance to find the time zone.
【0012】電子部品接合部の超音波検査法では、まず
接合前のマイクロ接合用工具4の先端からの反射波を測
定し、続いて接合中の反射波を測定する。レシーバー7
によって増幅された接合前と接合中のそれぞれの反射波
は、パルサー6の出力端子からのトリガー信号を用いる
と、ゲート8の出力信号としてオシロスコープ10で観
察できる。また、ゲート8を用いて予め測定したマイク
ロ接合部材2の接合境界面と電子部品被接合部材1の底
面からの反射波が現れる時間帯を設定すると、設定時間
帯だけが一定電圧となるゲート8からの矩形波電気信号
とレシーバー7によって増幅された反射波の電気信号か
ら設定した時間帯の検出波形振幅のピーク出力電圧がピ
ークディテクター9の出力端子から出力され、それをパ
ーソナルコンピュータ11に入力する。パーソナルコン
ピュータ11では接合前と接合中のピーク出力電圧の差
を演算し、予め設定した電圧差・剥離強度関係曲線と比
較して、接合強度を推定すると共に、推定された接合強
度が正常状態の剥離強度以下の場合には異常接合状態と
判定する。判定に利用する電圧差・剥離強度関係曲線は
使用するマイクロ接合用工具の材質、形状によって異な
るために、使用するマイクロ接合用工具ごとに予め測定
しておく。出力電圧差、剥離強度の推定値、接合状態の
判定結果はディスプレイ12に表示し、必要な場合には
プリンター13に出力することもできる。この測定法は
マイクロ接合中の測定ばかりでなく、マイクロ接合が終
了した電子部品接合部の抜き取り検査にも適用すること
ができる。In the ultrasonic inspection method of the joint of electronic parts, first, a reflected wave from the tip of the micro joining tool 4 before joining is measured, and then a reflected wave during joining is measured. Receiver 7
The respective reflected waves amplified before and during the joining can be observed on the oscilloscope 10 as the output signal of the gate 8 by using the trigger signal from the output terminal of the pulser 6. Further, when a time zone in which the reflected wave from the bonding boundary surface of the micro-joined member 2 and the bottom surface of the electronic component-joined member 1 is measured which is measured in advance using the gate 8 is set, the gate 8 having a constant voltage only in the set time zone. The peak output voltage of the detected waveform amplitude in the set time zone is output from the output terminal of the peak detector 9 from the square wave electric signal from the receiver and the electric signal of the reflected wave amplified by the receiver 7 and is input to the personal computer 11. . The personal computer 11 calculates the difference between the peak output voltage before joining and during the joining, compares the peak output voltage with a preset voltage difference / peeling strength relationship curve, estimates the joining strength, and determines whether the estimated joining strength is normal. In the case where the peel strength is less than or equal to the peel strength, it is determined that the joint is abnormal. Since the voltage difference / peeling strength relation curve used for the judgment differs depending on the material and shape of the micro joining tool to be used, it is measured in advance for each micro joining tool to be used. The output voltage difference, the estimated value of the peel strength, and the determination result of the bonding state are displayed on the display 12 and can be output to the printer 13 if necessary. This measuring method can be applied not only to the measurement during the micro-joining but also to the sampling inspection of the joined electronic parts after the micro-joining.
【0013】抜き取り検査では、検査前に電子部品接合
用工具4がマイクロ接合部材2と接触していない離隔状
態での測定が接合前の測定となり、電子部品接合用工具
4がマイクロ接合部材2と接触している検査中の状態が
接合中の測定となって、測定結果の処理と判定はマイク
ロ接合中の処理、判定と同じ方法が利用できる。In the sampling inspection, the measurement in the separated state where the electronic component joining tool 4 is not in contact with the micro joining member 2 before the inspection is the measurement before joining, and the electronic component joining tool 4 is connected to the micro joining member 2 before the inspection. The state during the inspection that is in contact is the measurement during the bonding, and the processing and determination of the measurement result can use the same method as the processing and the determination during the micro bonding.
【0014】[0014]
【実施例】以下、本発明をワイヤボンディング部の抜き
取り検査に適用した一実施例について図面を参照しなが
ら説明する。図2におけるワイヤボンディング用の接合
工具4は直径1.5mm、長さ11.3mmのセラミッ
ク製キャピラリーで、超音波発振器3には直径6mm、
周波数20MHzの探触子を用いている。マイクロ接合
部材2は直径25μmの金線をICチップ上に接合した
もので、接合部の直径は約100μmである。図3はワ
イヤボンディング用接合工具(キャピラリー)4を金線
のマイクロ接合部4に測定荷重60gで押し付けて測定
したワイヤボンディング部からの反射波の測定例を示し
た図である。この反射波にはワイヤボンディング用接合
工具(キャピラリー)4と金線のマイクロ接合部材2の
接触界面で反射される反射波、金線のマイクロ接合部材
2と電子部品被接合材(ICチップ)1の接合境界面や
電子部品被接合部材(ICチップ)1の底面から反射さ
れる反射波が重なって検出されている。金線の接合状態
を含む金線のマイクロ接合部材2と電子部品被接合材
(ICチップ)1の接合境界面や電子部品被接合部材
(ICチップ)1の底面から反射される反射波は2.4
〜2.6μsの時間帯に現れ、この時間帯をゲート8を
用いて検出波形の時間帯とする。ピークデテクター9の
出力端子には2.4〜2.6μsの時間帯の検出波形振
幅のピーク電圧が出力されるので、測定はワイヤボンデ
ィング用接合工具(キャピラリー)4が金線のマイクロ
接合部材2に接触していない離隔状態とワイヤボンディ
ング用接合工具(キャピラリー)4と金線のマイクロ接
合部材2に接触している抜き取り検査中に行い、それぞ
れの検出波形振幅のピーク出力電圧はパーソナルコンピ
ュータ11に入力される。パーソナルコンピュータ11
はワイヤボンディング用接合工具(キャピラリー)4が
金線マイクロ接合部2と接触している状態と接触してい
ない状態での出力電圧の差を演算し、予めあらかじめ測
定によって求めた電圧差とプッシュテストにおけるはく
離荷重の関係と比較して剥離荷重を推定する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a sampling inspection of a wire bonding portion will be described below with reference to the drawings. 2 is a ceramic capillary having a diameter of 1.5 mm and a length of 11.3 mm. The ultrasonic oscillator 3 has a diameter of 6 mm.
A probe having a frequency of 20 MHz is used. The micro joining member 2 is formed by joining a gold wire having a diameter of 25 μm on an IC chip, and the diameter of the joining portion is about 100 μm. FIG. 3 is a diagram showing a measurement example of a reflected wave from the wire bonding portion measured by pressing the bonding tool (capillary) 4 for wire bonding against the micro-joining portion 4 of the gold wire with a measurement load of 60 g. The reflected wave is reflected at the contact interface between the wire bonding joining tool (capillary) 4 and the gold wire micro-joining member 2, the gold wire micro-joining member 2 and the electronic component bonding material (IC chip) 1. The reflected waves reflected from the bonding boundary surface and the bottom surface of the electronic component bonded member (IC chip) 1 are detected in an overlapping manner. The reflected wave reflected from the bonding boundary surface of the gold wire micro bonding member 2 including the bonding state of the gold wire and the electronic component bonded material (IC chip) 1 and the bottom surface of the electronic component bonded member (IC chip) 1 are 2 .4
Appears in a time zone of .about.2.6 .mu.s, and this time zone is used as the time zone of the detected waveform by using the gate 8. FIG. Since the peak voltage of the detected waveform amplitude in the time zone of 2.4 to 2.6 μs is output to the output terminal of the peak detector 9, the bonding tool (capillary) 4 for wire bonding is measured using the gold bonding member 2. Is performed during the sampling inspection in which the wire is not in contact with the wire bonding tool (capillary) 4 and the gold wire micro-joining member 2, and the peak output voltage of each detected waveform amplitude is transmitted to the personal computer 11. Is entered. Personal computer 11
Calculates the difference between the output voltage when the wire bonding tool (capillary) 4 is in contact with the gold wire micro-joined part 2 and the state when the wire tool is not in contact with the gold wire micro-joined part 2. The peeling load is estimated by comparing with the relationship of the peeling load in.
【0015】図4はワイヤボンディング用接合工具(キ
ャピラリー)4が金線マイクロ接合部2と接触している
状態と接触していない状態での出力電圧の差とプッシュ
テストにおけるはく離荷重の関係を直径1.5mm、長
さ11.3mmのセラミック製キャピラリーを用いて予
め測定した結果の一例を示した図である。図4において
用いたワイヤボンディング用接合工具(キャピラリー)
4では、電圧差が0.08V以上でははく離荷重が60
g以上であり、正常な接合状態であること示している。
反射波の振幅による電圧差が0.08V以下を異常接合
状態と判定し、不良品の判定は電圧差から推定できる。FIG. 4 shows the relationship between the difference between the output voltage when the bonding tool (capillary) 4 for wire bonding is in contact with the gold wire micro-joining part 2 and the state where it is not in contact with the peeling load in the push test. It is a figure showing an example of the result of having measured beforehand using a 1.5-mm and 11.3-mm-length ceramic capillary. Bonding tool (capillary) for wire bonding used in FIG.
In the case of No. 4, when the voltage difference is 0.08 V or more, the peeling load is 60
g or more, indicating a normal bonding state.
If the voltage difference due to the amplitude of the reflected wave is 0.08 V or less, it is determined that the connection is abnormal, and the defective product can be estimated from the voltage difference.
【0016】[0016]
【発明の効果】以上のように本発明は電子部品接合用工
具を超音波の伝達媒体として利用し、電子部品接合用工
具を介してマイクロ接合部材に超音波を送り込み、マイ
クロ接合部材の接合面で反射された超音波を電子部品接
合用工具中を伝播させて受信するために、直径約100
μmの微小領域の測定を可能にしている。また、超音波
発振器を接着したマイクロ接合用工具をマイクロ接合機
械に組み込んで測定するために、接合プロセス中の測定
が可能になる。あらかじめ、受信された接合境界面や電
子部品底面からの検出波形振幅のピーク電圧差と剥離強
度の関係を測定し、電圧差・剥離強度関係曲線を用いる
と、検出波形のピーク電圧から剥離強度を非破壊的に推
定でき、正常な接合状態の電圧変化と比較して異常状態
も判定できる。この検査法をマイクロ接合中や接合終了
後の抜き取り検査に利用することもでき、接合プロセス
中のマイクロ接合部の監視及び接合中の接合条件の制御
ができるようになる。したがって、本発明は良好な接合
条件を決定する際のプルテストやプッシュテストなどの
強度試験や界面の顕微鏡観察などによる品質評価が不要
になる。As described above, the present invention utilizes the electronic component joining tool as an ultrasonic transmission medium, sends ultrasonic waves to the micro joining member via the electronic component joining tool, and joins the joining surface of the micro joining member. In order to propagate the ultrasonic wave reflected in the electronic component bonding tool and receive the ultrasonic wave, a diameter of about 100 mm
Measurement of a micro area of μm is enabled. Also, since the micro-joining tool to which the ultrasonic oscillator is bonded is incorporated into the micro-joining machine for measurement, the measurement can be performed during the joining process. Measure the relationship between the peak voltage difference of the detected waveform amplitude and the peel strength from the received bonding interface or the bottom of the electronic component and the peel strength in advance, and use the voltage difference / peel strength relationship curve to calculate the peel strength from the peak voltage of the detected waveform. It can be estimated non-destructively, and an abnormal state can be determined by comparing with a voltage change in a normal junction state. This inspection method can also be used for sampling inspection during micro-joining or after completion of joining, and it becomes possible to monitor the micro-joined portion during the joining process and control joining conditions during joining. Therefore, in the present invention, there is no need for quality evaluation by a strength test such as a pull test or a push test or a microscope observation of an interface when determining good bonding conditions.
【図1】本発明を電子部品接合部に適用した一実施例
で、本発明の構成を示す説明図である。FIG. 1 is an explanatory view showing a configuration of the present invention in one embodiment in which the present invention is applied to an electronic component joint.
【図2】電子部品接合用工具と接着した超音波発振器か
ら送信された超音波が電子部品接合部で反射される経路
を示す説明図である。FIG. 2 is an explanatory diagram showing a path where ultrasonic waves transmitted from an ultrasonic oscillator bonded to an electronic component bonding tool are reflected at an electronic component bonding portion.
【図3】ワイヤボンディング部からの反射波の測定例を
示した図である。FIG. 3 is a diagram showing a measurement example of a reflected wave from a wire bonding unit.
【図4】ワイヤボンディング部の抜き取り検査における
検出波形振幅のピーク出力電圧差とはく離荷重の関係の
一例を示した図である。FIG. 4 is a diagram showing an example of a relationship between a peak output voltage difference of a detected waveform amplitude and a peeling load in a sampling inspection of a wire bonding portion.
1 電子部品被接合部材 2 マイクロ接合部材 3 超音波発振器 4 接合工具 5 超音波測定装置 6 パルサー 7 レシーバー 8 ゲート 9 ピークディテクター 10 オシロスコープ 11 パーソナルコンピュータ 12 ディスプレイ 13 プリンター DESCRIPTION OF SYMBOLS 1 Electronic component joining member 2 Micro joining member 3 Ultrasonic oscillator 4 Joining tool 5 Ultrasonic measuring device 6 Pulser 7 Receiver 8 Gate 9 Peak detector 10 Oscilloscope 11 Personal computer 12 Display 13 Printer
Claims (1)
を、電子部品接合用工具を介して電子部品の接合部に送
信し、該接合部から反射される超音波を受信して変換し
た検出波形振幅のピーク出力電圧と、接合前に接合部と
接触していない状態で測定した接合工具から反射された
超音波の検出波形振幅のピーク出力電圧との差を演算
し、予め設定した正常状態時の接合状態を基準とした電
圧差・剥離強度関係線とを比較し、その偏差量から接合
部の剥離強度を推定することを特徴とする電子部品接合
部の超音波検査法。An ultrasonic pulse transmitted from an ultrasonic oscillator is transmitted to a joint of an electronic component via an electronic component joining tool, and a detection waveform obtained by receiving and converting an ultrasonic wave reflected from the joint is received. Calculate the difference between the peak output voltage of the amplitude and the peak output voltage of the detected waveform amplitude of the ultrasonic wave reflected from the welding tool measured in a state where it is not in contact with the joint before welding, and set it in the normal state set in advance. An ultrasonic inspection method for a joint part of an electronic component, comprising comparing a voltage difference / peeling strength relation line based on a joining state of the electronic part and estimating a peel strength of the joint part from an amount of deviation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9251237A JP3041680B2 (en) | 1997-08-11 | 1997-08-11 | Ultrasonic inspection method for joints of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9251237A JP3041680B2 (en) | 1997-08-11 | 1997-08-11 | Ultrasonic inspection method for joints of electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1164303A true JPH1164303A (en) | 1999-03-05 |
JP3041680B2 JP3041680B2 (en) | 2000-05-15 |
Family
ID=17219769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9251237A Expired - Lifetime JP3041680B2 (en) | 1997-08-11 | 1997-08-11 | Ultrasonic inspection method for joints of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3041680B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110887897A (en) * | 2018-09-11 | 2020-03-17 | 德尔福技术有限公司 | Method for the non-destructive testing of the engagement between a wire and an electrical terminal |
-
1997
- 1997-08-11 JP JP9251237A patent/JP3041680B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110887897A (en) * | 2018-09-11 | 2020-03-17 | 德尔福技术有限公司 | Method for the non-destructive testing of the engagement between a wire and an electrical terminal |
EP3623807A1 (en) * | 2018-09-11 | 2020-03-18 | Aptiv Technologies Limited | Method for nondestructive testing of joint between wire and electrical terminal |
Also Published As
Publication number | Publication date |
---|---|
JP3041680B2 (en) | 2000-05-15 |
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