JPH1154517A - Method and device for arrangement of microscopic balls - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a trouble wherein microscopic balls are vacuum-sucked in dumpling form on the center part of an arrangement substrate when the microscopic balls are re-vacuum-sucked to the arrangement substrate, and to shorten the time required for re-vacuum-suction when the vacuum-suction failure is caused. SOLUTION: A plurality of ball vacuum-suction holes 3a to 3d which are formed on an arrangement substrate 1 are divided into a plurality of area 11 to 14, and a plurality of pressure reducing/pressure adding systems 2a to 2d are provided corresponding to the areas 11 to 14. A pressure reducing/adding operation is conducted independently for the ball attracting holes 3a to 3d of the area 11 to 14, the vacuum-suction failure of balls is prevented as much as possible, and the re-vacuum-suction processing can be made for microscopic ball 4 on the pressure reducing/adding systems 2a to 2d only where the balls are incorrectly vacuum-sucked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine ball arranging head and a fine ball arranging method using the same, and more particularly, to a method of holding a plurality of fine balls collectively on an array substrate having a plurality of ball suction holes formed therein. Thus, the present invention is suitable for use in an apparatus and a method for batch arrangement on electrodes of electronic components such as a printed board and a semiconductor chip.

[0002]

2. Description of the Related Art Conventionally, vapor deposition bumps and stud bumps have been known as bumps formed on electrodes of semiconductor chips and the like. The vapor deposition bump is used to form a bump on a semiconductor element at a wafer stage, and it is necessary to repeatedly perform a complicated process as a wafer process many times. For this reason, the cost is increased due to the vacuum process, so that there is a problem that it cannot be applied to a small-quantity multi-product.

On the other hand, stud bumps are formed by performing ball bonding at the time of primary bonding of wire bonding to electrode pads of a semiconductor chip one by one, and cutting the neck portion of the wire after bonding.

Therefore, in the case of the stud bump, there has been a problem that the rest of the wire has a convex shape at the cut portion and the height of the wire remains uneven. Further, since the ball diameter of the wire is two to three times as large as the diameter of the wire due to the use of wire ball bonding, it is difficult to form minute bumps.

On the other hand, there is a method of forming bumps by plating. However, since this method is also performed for each wafer, it is difficult to apply the method to a small number of products of various types. Therefore, as a technique for forming uniform and fine bumps, a bump forming technique using minute metal balls has been proposed in, for example, Japanese Patent Application Laid-Open No. 7-153765.

In the bump forming method proposed in the above publication, at least one metal ball group of a semiconductor chip is sucked and held. Then, in order to adsorb and hold a plurality of metal ball groups, a ball array substrate having suction holes formed at all positions corresponding to the bump forming positions on the semiconductor chip is used. After sucking and holding, the ball array substrate is transported to a bonding stage and bonded to a portion to be bonded.

Therefore, in this case, the uniformly formed minute metal balls can be joined together at the bump formation position, so that ball bumps with high reliability can be easily and efficiently formed. .

In FIG. 6, reference numeral 61 denotes an array substrate, 62 denotes a ball suction hole, 63 denotes a metal ball, and 64 denotes an array head to which the array substrate 61 is attached. Reference numeral 65 denotes a vacuum chamber provided between the array substrate 61 and the array head 64;
Reference numeral 6 denotes a vent hole communicating with the vacuum chamber 65, and reference numeral 67 denotes a vent pipe provided between the vacuum chamber 65 and the pressure reducing / pressurizing device.

In the conventional arrangement apparatus for micro balls arranged as described above, ball suction holes 62 are formed at all positions corresponding to the bump formation positions in order to collectively hold a plurality of metal balls 63 by suction. After the plurality of metal balls 63 are collectively held on the arrangement substrate 61, the arrangement substrate 61 is transported to a joining stage (not shown) to be joined to a portion to be joined of the electronic component. .

Therefore, in this case, the uniformly formed fine metal balls 63 can be collectively joined to the bump forming position of the electronic component, so that ball bumps having high reliability can be easily and efficiently obtained. Can be formed.

In recent years, semiconductor devices have been increasingly miniaturized, and the wiring pitch of electrodes has become extremely small. For this reason, metal balls used for forming ball bumps on the electrodes have become extremely fine in accordance with the miniaturization of the wiring pitch of the electrodes. It is an effective method to change the conventional side-arranged pins to the surface-arranged pins in order to improve the reliability of the narrow pitch and multi-pin connection. However, when a plurality of metal balls 63 are collectively sucked and held on the array substrate 61 for the surface-arranged pins, the following problems occur.

That is, when ball bumps are formed using the array substrate 61, as shown in FIG. 7, the array head 64 is first moved onto the container 36 in which the metal balls 63 are housed. A vacuum chamber 65 formed inside the array head 64 is connected to a decompression / pressurization device (not shown) through a ventilation pipe 67, and the inside thereof is depressurized / pressurized by the decompression / pressurization device. Pressurized.

The container 36 is fixed on a vibration generator 37 such as a parts feeder, and the metal ball 63 jumps when the vibration generator 37 vibrates. The frequency of the vibration performed by the vibration generator 37 is, for example, 0 to 0 depending on the size of the metal ball 63 and the like.
It is variable up to 1 kHz. Further, the container 36 can be detached from the vibration generator 37.

Next, in order to adsorb the metal balls 63 on the adsorbing surface of the array substrate 61, the array head 64 is lowered to the vicinity of the container 36 to make it swing, and the jumping metal balls 63 are moved to the ball of the array substrate 61. Vacuum suction is performed on the suction holes 62. Here, the descending distance and the amplitude distance of the array head 64 can be controlled, for example, in units of 0.1 mm, and the number of amplitudes can be controlled.

[0015]

As described above, when the metal balls 63 are vacuum-sucked into the ball suction holes of the array substrate 61, as shown in FIG. 63 may be adsorbed on the dumplings. This is because when the arrangement substrate 61 approaches the container 36 and attracts the metal balls 63, the air flowing from the peripheral portion of the arrangement substrate 61 causes the air in the facing space between the arrangement substrate 61 and the container 36. Because it is easy to approach the center.

If a plurality of metal balls 63 are vacuum-adsorbed at the center of the array substrate 61 in a dumpling manner, the ball suction step must be performed again from the beginning, so that the efficiency of manufacturing ball bumps is reduced. Not preferred.

Further, even when the metal balls 63 are re-adsorbed, all the metal balls 63 have to be adsorbed in the past, so that there is a problem that the malfunction of the adsorbed state is likely to occur again. Furthermore, all the metal balls 6
Since the metal balls 3 are re-adsorbed, there is a problem that it takes a lot of time to remove / adsorb the metal balls 63.

In view of the above-mentioned problems, the present invention prevents fine balls from being intensively attracted to the central portion of the array substrate, so that the fine balls can be uniformly vacuum-sucked on the entire surface of the array substrate. The first purpose is to do so. It is a second object of the present invention to reduce the probability of occurrence of a problem when re-adsorbing the fine balls on the array substrate and to reduce the time required for the re-adsorption process.

[0019]

According to the present invention, there is provided an apparatus for arranging fine balls, comprising: an array substrate having a plurality of ball suction holes formed on a suction surface of the fine balls; and a fine ball array holding the array substrate. A decompression / pressurization system for depressurizing / pressurizing a vacuum chamber formed inside the head so as to adsorb / remove the fine ball in each of the ball suction holes; In an apparatus for arranging micro balls, which collectively holds micro balls and arranges them on electrodes of electronic components including at least a printed circuit board and a semiconductor chip, a plurality of vacuum chambers formed inside the arrangement head are provided. In addition to dividing into areas, the decompression / pressurization system is provided for each of the plurality of areas, and the decompression timing and the magnitude of the decompression in each area are controlled for each area. It is characterized in that was possible.

Further, another feature of the arrangement apparatus of the present invention is that the arrangement substrate has a plurality of ball suction holes formed on the suction surface of the fine balls, and the arrangement substrate is held. A pressure reducing / pressurizing system for depressurizing / pressurizing a vacuum chamber formed inside the fine ball arranging head so as to adsorb / remove the fine ball to / from each of the ball suction holes; A plurality of micro-balls are collectively held on the electrodes of an electronic component including at least a printed circuit board and a semiconductor chip. Is divided into a plurality of areas, and the decompression / pressurization system is provided for each of the plurality of areas so that the suction / release of the fine ball can be controlled for each of the areas. It is characterized in.

Another feature of the arrangement apparatus for fine balls of the present invention is that the arrangement substrate has a plurality of ball suction holes formed on the suction surface of the fine balls, and holds the arrangement substrate. A pressure reducing / pressurizing system for depressurizing / pressurizing a vacuum chamber formed inside the fine ball arranging head so as to adsorb / remove the fine ball to / from each of the ball suction holes; A plurality of micro-balls are collectively held on the electrodes of an electronic component including at least a printed circuit board and a semiconductor chip. Is divided into a plurality of areas, and the decompression / pressurization system is provided for each of the plurality of areas. It is characterized in that the adsorption / separation of the fine balls was controllable to said each area.

Further, the method for arranging fine balls of the present invention
A vacuum chamber formed inside a fine ball array head holding an array substrate in which a plurality of ball suction holes are formed on the suction surface of the fine balls is decompressed / pressurized, and each of the ball suction holes is The method of arranging fine balls, wherein a plurality of fine balls are collectively held on the array substrate so as to attract / release the fine balls and are collectively arrayed on electrodes of an electronic component including at least a printed circuit board and a semiconductor chip. A vacuum chamber formed inside the array head is divided into a plurality of areas,
Using an array head provided with a decompression / pressurization system for each of the plurality of areas, the decompression timing and the magnitude of the decompression in each of the areas are collectively adsorbed on the adsorption surface while being controlled for each of the plurality of areas. In which a plurality of fine balls are collectively arranged.

Another feature of the method for arranging fine balls of the present invention is that a fine ball arranging head which holds an array substrate having a plurality of ball suction holes formed on a suction surface of the fine balls is provided. The vacuum chamber formed therein is depressurized / pressurized so that the fine balls are sucked / released from the respective ball sucking holes. In a method of arranging micro balls at a time on an electrode of an electronic component including at least a semiconductor chip, a vacuum chamber formed inside the ball arranging head is divided into a plurality of areas, and the plurality of areas are separated from each other. Using an array head provided with a decompression / pressurization system, the suction / release of the fine balls is controlled collectively on the suction surface while controlling for each of the plurality of areas. Wear to is characterized by collectively arranging a plurality of micro balls.

Another feature of the method for arranging fine balls of the present invention is that a fine ball arranging head which holds an array substrate having a plurality of ball suction holes formed on a suction surface of the fine balls is provided. The vacuum chamber formed therein is depressurized / pressurized so that the fine balls are sucked / released from the respective ball sucking holes. In a method of arranging micro balls at a time on an electrode of an electronic component including at least a semiconductor chip, a vacuum chamber formed inside the ball arranging head is divided into a plurality of areas, and the plurality of areas are separated from each other. The pressure reduction timing and the magnitude of the pressure reduction in each of the areas, and the fine balls It is characterized by collectively arranging a plurality of fine balls collectively adsorbed on the suction surface while controlling the suction / detachment for each of the plurality of areas.

[0025]

Since the present invention comprises the above technical means, it is possible to make the suction timing and the suction force of the fine balls different according to the positions of the plurality of ball suction holes formed on the suction surface of the arrayed substrate. By controlling the pressurizing system, the suction of fine balls is started at an early timing in the ball suction holes located in the peripheral portion of the array substrate, and a large suction force is obtained. By delaying the suction timing and reducing the suction force in the ball suction hole formed in the above, it is possible to prevent the inconvenience that the fine balls are intensively sucked at the center of the array substrate. it can.

According to another feature of the present invention, fine balls are sucked and held in a plurality of ball sucking holes formed on an array substrate, and these fine balls are collectively placed on electrodes of an electronic component. If there is a problem with the suction of the fine balls during the arrangement, it is sufficient to perform the re-suction process only on the decompression / pressurization system corresponding to the area where the problem has occurred. It is possible to greatly reduce the probability of occurrence of a problem again when re-adsorbing, and to shorten the time required for the re-adsorption process.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a device for arranging fine balls according to an embodiment of the present invention. 1 and 2 show an example in which the vacuum chamber of the array head 10 is divided into a plurality of areas and a decompression / pressurization system is provided for each area. FIG. 1 illustrates an example of area division. 2 is a cross-sectional view showing a schematic configuration of a main part.

As shown in FIG. 1, the ball arranging apparatus of the present embodiment comprises an arranging head 10 and a ball arranging substrate 1. The ball array substrate 1 is held on the array head 10 by being vacuum-sucked by a suction system different from a system for sucking balls. The ball array substrate 1 may be integrally formed with the array head 10 by bonding or the like.

In the present embodiment, the suction surface of the array substrate 1 is divided into four first areas 11 to fourth areas 14 (actually, it is formed inside the array head 10). Although the inside of the vacuum chamber 5 is divided,
Is shown as if the adsorption surface is divided). And
As shown in FIG. 2, a plurality of decompression / pressurization systems 2 provided on the back side of the array substrate 1 are provided corresponding to the areas 11 to 14.

In the example of FIG. 2, the ball suction holes 3 are 3a to 3a.
As shown as d, four are provided, corresponding to each of these ball suction holes 3a to 3d,
An example is shown in which four decompression / pressurization systems 2a to 2d are provided. That is, in this case, an example is shown in which one ball suction hole 3 is provided in each of the four areas, but in reality, hundreds or thousands of ball suction holes are provided in each of the areas 11 to 14. 3 are provided.

In FIG. 2, the vacuum chamber 5 formed inside the array substrate 1 is divided into four, namely, a first vacuum chamber 5a to a fourth vacuum chamber 5d by a partition plate 6. Each of the first to fourth vacuum chambers 5a to 5d is provided with a decompression / pressurization system 2a to 2d.

That is, the first vacuum chambers 5a to 4th are attached to the array head 10 attached to the back side of the array substrate 1.
Ventilation holes 10a to 10d communicating with the respective vacuum chambers 5d
d are formed, and these ventilation holes 10a to 10d are connected to a decompression device and a pressurization device (both not shown) via ventilation pipes (not shown), respectively. To 2d.

In this embodiment, the pressure reduction /
Each area 11 is controlled by controlling the pressurizing system 2a to 2d.
14 and the pressurization timing (decompression timing) can be independently controlled. This makes it possible to obtain an optimum suction timing (separation timing) in each of the areas 11 to 14 and also obtain an optimum suction force.

In the arrangement apparatus for fine balls according to the present embodiment, the fine balls 4 are independently sucked into the ball suction holes 3a to 3d for each of the pressure reducing / pressurizing systems 2a to 2d, The fine balls 4 adsorbed in the holes 3a to 3d can be separated from the array substrate 1.

Next, referring to FIG. 3, the fine balls 4 are adsorbed onto the array substrate 1 by using the fine ball arranging apparatus of the present embodiment configured as described above, and formed on the semiconductor chip 20. The operation of adhesively bonding on the electrode 21 is described.

As shown in FIG. 3, the array substrate 1 is moved onto a container 22 containing fine balls 4 (for example, it is made of a noble metal such as Au or a metal having a low melting point), and a predetermined close distance To lower. This container 22
Is vibrated with a small amplitude, and the fine ball 4 accommodated therein is jumping due to the vibration.

Accordingly, when a pressure reducing device (not shown) connected to the array substrate 1 is operated to bring all the ball suction holes 3a to 3d into a suction state, the fine balls jumping on the container 22 4 can be sucked into each of the ball suction holes 3a to 3d.

In this embodiment, the pressure reduction / pressure system 2
When the air in each of the vacuum chambers 5a to 5d is sucked through the holes a to 2d, the decompression is started from the vacuum chambers 5a and 5d located in the peripheral portion of the array substrate 1. For this reason,
The fine balls 4 accommodated in the container 22 are sucked from the ball suction holes 3a and 3d located in the peripheral portion of the array substrate 1. By adjusting the pressure reduction timing, the fine balls 4 can be simultaneously adsorbed in the vacuum chambers 5b and 5c at the center of the array substrate 1 and the vacuum chambers 5a and 5d at the peripheral part.

In this embodiment, the array substrate 1
In the central portion and the peripheral portion, the force for attracting the fine balls 4 can be balanced, so that the inconvenience that the fine balls 4 are intensively attracted only to the central portion of the array substrate 1 unlike the related art hardly occurs. Thus, the fine balls 4 can be satisfactorily sucked over the entire surface of the array substrate 1.

As described above, each of the ball suction holes 3a to 3a
After the fine balls 4 are sucked and held in each of the 3d, next, the alignment substrate 1 is moved to a predetermined position on the semiconductor chip 20 for alignment. Then, when the array substrate 1 is adjusted to a predetermined position, it is lowered to a short distance from the semiconductor chip 20 and the fine ball 4 held by suction is bonded to a specific portion of the electrode 21 by thermocompression or the like. I do.

Here, the stage on which the semiconductor chip 20 is mounted may have a heating mechanism. If a flux is supplied on the electrode 21 in advance, the fine balls 4 made of a low-melting-point alloy such as solder may be temporarily bonded and then transferred to a furnace for reflow. In this case, the stage need not be heated.

As described above, when a plurality of fine balls 4 are collectively arranged on the semiconductor chip 20, in addition to the above-described dumpling-like suction, the fine balls 4 are inserted into one ball suction hole 3.
May be adsorbed, or leakage of the fine balls 4 may be caused.

The arrangement apparatus for fine balls according to the present embodiment can perform pressure reduction / pressure independently for each of the pressure reduction / pressure systems 2a to 2d. Only the re-adsorption can be performed.

For example, when an extra fine ball 4 is adsorbed in the first ball suction hole 3a, the first pressure reduction /
The pressurizing system 2a is pressurized to release the fine balls 4 adsorbed thereon. At this time, since the second to fourth decompression / pressurization systems 2b to 2d that normally adsorb the fine balls 4 are not pressurized, these depressurization / pressurization systems 2b
The fine ball 4 adsorbed to the area 2d is not released.

Therefore, in the case of the arrangement apparatus for fine balls according to the present embodiment, only the first depressurizing / pressing system 2a has the fine balls in the depressurizing / pressing system in which a problem occurs with the suction of the balls. Since the re-adsorption may be performed, it is possible to greatly reduce the probability of occurrence of a problem at the time of re-adsorption, and to significantly reduce the time required for the re-adsorption.

In the above-described embodiment, for ease of explanation, four ball suction holes 3a to 3d are formed on the array substrate 1, and these ball suction holes 3a to 3d are formed.
Although the example in which the decompression / pressurization systems 2a to 2d are provided for each is shown,
In practice, a very large number of fine balls 4 such as 50 to 500 are collectively held on the array substrate 1.

The manner of dividing the inside of the vacuum chamber 5 into a plurality of areas can be set arbitrarily. For example, it may be divided into meshes as shown in FIG. 4 or may be divided in the vertical direction as shown in FIG.

In the above embodiment, the pressure reduction /
A pressurizing device may be provided for each decompression / pressurization system.
Only one pressurizing device is provided, a solenoid valve is interposed in the pressure reducing / pressurizing pipe, and the opening / closing operation of each solenoid valve is controlled, so that the pressure reducing / pressurizing operation is performed independently for each area. May be performed. Further, in the present invention, the array substrate may include means for removing an extra ball made of minute vibration (for example, ultrasonic vibration).

[0049]

According to the present invention, as described above, according to the present invention, the timing and the suction force for sucking the fine balls are changed according to the positions of the plurality of ball suction holes formed on the suction surface of the array substrate. Because it can be different, in the ball suction hole located in the peripheral part of the array substrate, the suction of the fine ball is started at an early timing and a large suction force is obtained, and the ball suction hole is formed in the center of the array substrate. In the ball suction holes, the suction timing can be delayed and the suction force can be reduced, so that the inconvenience of intensive suction of fine balls at the center of the array substrate can be prevented, and the ball arrangement can be prevented. Fine balls can be satisfactorily adsorbed over the entire surface of the substrate.

According to another feature of the present invention, the plurality of ball suction holes provided on the array substrate are divided into a plurality of areas, and the pressure of the ball suction holes is reduced / pressurized for each area. Because of this, it is possible to perform re-suction only in an area where a problem has occurred with respect to ball suction. Therefore, according to the apparatus and method for arranging fine balls of the present invention, it is possible to reduce the probability of occurrence of the problem of ball suction at the time of re-sucking to a fraction or less, and to reduce the time required for re-sucking to several minutes. It can be reduced to 1 or less.

[Brief description of the drawings]

FIG. 1 is a front view of an arrangement head and a substrate for explaining an example of dividing an adsorption surface into areas.

FIG. 2 is a sectional view showing a schematic configuration of a main part of an array head and a substrate.

FIG. 3 is a diagram for explaining the operation of the arrangement apparatus for fine balls according to the embodiment;

FIG. 4 is a diagram showing an example in which a plurality of ball suction holes provided on an array substrate are divided into a plurality of areas.

FIG. 5 is a diagram showing another example of dividing a plurality of ball suction holes provided on an array substrate into a plurality of areas.

FIG. 6 is a cross-sectional view showing a configuration example of a conventional array head.

FIG. 7 is a diagram showing a state in which fine balls are sucked using a conventional fine ball arrangement device.

[Description of Signs] 1 Array substrate 2a to 2d Decompression / pressurization system 3a to 3d Ball suction hole 4 Fine ball 5a to 5d Vacuum chamber 6 Partition plate 10 Substrate body 10a to 10d Vent hole 11 First area 12 Second Area 13 Third area 14 Fourth area

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 21/92 604Z (72) Inventor Toshio Yamamoto 3-35-1 Ida, Nakahara-ku, Kawasaki Nippon Steel Corporation

Claims (6)

[Claims] 1. An array substrate in which a plurality of ball suction holes are formed on a suction surface of fine balls, and a vacuum chamber formed inside a micro ball array head holding the array substrate is decompressed / pressurized. A pressure reducing / pressurizing system for causing the fine balls to be sucked / released from each of the ball suction holes by pressurizing, and holding a plurality of the fine balls on the array substrate at a time, thereby forming a printed board and a semiconductor chip. An arrangement apparatus for fine balls, which is arranged at least on electrodes of electronic components including at least, wherein a vacuum chamber formed inside the arrangement head is divided into a plurality of areas, and the pressure reducing / pressurizing system is A minute ball arrangement device provided for each of a plurality of areas, wherein the pressure reduction timing and the magnitude of the pressure reduction in each area can be controlled for each of the areas. . 2. An array substrate in which a plurality of ball suction holes are formed on a suction surface of fine balls, and a vacuum chamber formed inside a fine ball array head holding the array substrate is decompressed / pressurized. A pressure reducing / pressurizing system for causing the fine balls to be sucked / released from each of the ball suction holes by pressurizing, and holding a plurality of the fine balls on the array substrate at a time, thereby forming a printed board and a semiconductor chip. In an arrangement apparatus for fine balls, which is arranged at least on electrodes of electronic components including at least, a vacuum chamber formed inside the arrangement head is divided into a plurality of areas, and the decompression is performed for each of the plurality of areas. An arrangement apparatus for fine balls, wherein a pressure system is provided, and suction / release of the fine balls can be controlled for each of the areas. 3. An array substrate in which a plurality of ball suction holes are formed on a suction surface of a fine ball, and a vacuum chamber formed inside a micro ball array head holding the array substrate is decompressed / pressurized. A pressure reducing / pressurizing system for causing the fine balls to be sucked / released from each of the ball suction holes by pressurizing, and holding a plurality of the fine balls on the array substrate at a time, thereby forming a printed board and a semiconductor chip. In an arrangement apparatus for fine balls, which is arranged at least on electrodes of electronic components including at least, a vacuum chamber formed inside the arrangement head is divided into a plurality of areas, and the decompression is performed for each of the plurality of areas. A pressure system is provided to control the pressure reduction timing and the pressure reduction in each area, and the suction / release of the fine ball for each area. Apparatus for arranging fine ball characterized. 4. A vacuum chamber formed inside a fine ball array head holding an array substrate having a plurality of ball suction holes formed on a suction surface of the fine ball, the pressure of the ball is reduced / pressurized. A plurality of micro-balls are collectively held on the array substrate by adsorbing / desorbing the micro-balls in each of the suction holes, and the micro-balls to be collectively arrayed on electrodes of electronic components including at least a printed board and a semiconductor chip. In the arranging method, a vacuum chamber formed inside the arranging head is divided into a plurality of areas, and an arranging head provided with a decompression / pressurizing system for each of the plurality of areas is used. While controlling the decompression timing and the magnitude of the decompression in each of the areas, the plurality of fine balls are collectively distributed by collectively adsorbing to the adsorption surface while controlling each of the plurality of areas. Method of arranging fine balls, which comprises. 5. A vacuum chamber formed inside a fine ball array head holding an array substrate having a plurality of ball suction holes formed on a suction surface of the fine ball, the pressure of the ball is reduced / pressurized. A plurality of micro-balls are collectively held on the array substrate by adsorbing / desorbing the micro-balls in each of the suction holes, and the micro-balls to be collectively arrayed on electrodes of electronic components including at least a printed board and a semiconductor chip. In the arrangement method, a vacuum chamber formed inside the ball arrangement head is partitioned into a plurality of areas, and an arrangement head provided with a decompression / pressurization system for each of the plurality of areas is used. A plurality of micro balls being collectively adsorbed on the adsorbing surface and a plurality of micro balls are arranged collectively while controlling the suction / release of the fine balls for each of the plurality of areas; Method of arranging Lumpur. 6. A vacuum chamber formed inside a fine ball array head holding an array substrate having a plurality of ball suction holes formed on a suction surface of the fine ball, the pressure of the ball is reduced / pressurized. A plurality of micro-balls are collectively held on the array substrate by adsorbing / desorbing the micro-balls in each of the suction holes, and the micro-balls to be collectively arrayed on electrodes of electronic components including at least a printed board and a semiconductor chip. In the arrangement method, a vacuum chamber formed inside the ball arrangement head is partitioned into a plurality of areas, and an arrangement head provided with a decompression / pressurization system for each of the plurality of areas is used. The decompression timing and the magnitude of the decompression in each area, and the suction / release of the fine ball are controlled collectively on the suction surface while controlling for each of the plurality of areas. Method of arranging fine balls, which comprises collectively arranging a plurality of micro balls and wear.