JPH1154355A - Chip type capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To abolish a mounting structure directly soldering and fixing a lead wire and a printed wiring substrate, by a method wherein there is provided a metal plate for a pair of electrodes provided with a substrate mounting electrode formed by bending from a side part of an outer frame along a bottom. SOLUTION: A metal plate 53 for electrodes having an L-shaped section is secured to a pair of side parts in parallel to a center axis of a receiving spacer 56 of a substrate mounting face 29. In this metal plate 53 for electrodes, one piece 53a bent on a bottom of an outer frame 55 forms a substrate mounting electrode. A slit 35 is formed at a tip side of a bent piece 57 at a tip of this metal plate 53 for electrodes. If assembled, a lead wire 23 is brought into pressure contact with the slit 35 and is in a conductive state in the metal plate 53 for electrodes. Accordingly, the one piece 53a of the metal plate 53 for electrodes is brazed to a conductor of the printed wiring substrate, so that surface mounting of a chip type capacitor 51 to the printed wiring substrate is performed. As a result, it is possible to obtain high fixing strength and make sufficient mounting strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type capacitor mounted on a surface of a printed circuit board or the like.

[0002]

2. Description of the Related Art Conventionally, surface mounting of a chip type capacitor on a printed wiring board or the like has been performed by soldering a lead wire led out of a capacitor body to a conductor of the printed wiring board. For this reason, since a sufficient fixed area cannot be obtained, the mounting strength is low, and the capacitor may detach from the printed wiring board due to external force such as vibration or impact.

An example of this type of chip type capacitor in which mounting strength is improved by providing an auxiliary lead for increasing a fixing area with a substrate is described in Japanese Patent Application Laid-Open No. 2-65207 with reference to FIG. . FIG. 7 is an exploded perspective view of a conventional chip capacitor. The capacitor body 1 is formed by drawing out a pair of lead wires 5 from one end surface of a cylindrical housing 3 containing a capacitor element. The capacitor body 1 is housed in an outer frame 7. The exterior frame 7 has a cylindrical housing space 9 formed therein.
The capacitor body 1 is housed therein, and the wall 11 provided at one end opening is in contact with the end face of the capacitor body 1 to prevent the capacitor body 1 from falling out of the housing space.

A step portion 1 is provided on the outer periphery on the other end side of the exterior frame 7.
The U-shaped auxiliary lead 15 made of a solderable metal can be fitted to the step portion 13. A pair of cutout grooves 17 are formed in the wall portion 11 of the exterior frame 7, and the lead wire 5 of the capacitor body 1 led out from one opening of the exterior frame 7 is bent into a predetermined shape in the notch groove 17. It is to be accommodated.

[0005] The chip type capacitor 1 configured as described above.
According to No. 9, when mounting on a printed wiring board (not shown), both ends of the exterior frame 7 can be fixed to the printed wiring board by soldering the lead wire 5 and the auxiliary lead 15 together, and a strong surface mounting is possible. And reliability could be improved.

[0006]

However, in the above-mentioned conventional chip-type capacitor, the other end of the outer frame 7 is fixed to the printed wiring board by the auxiliary lead 15, but one end of the lead wire 5 is directly soldered to the printed wiring board. The fixing strength at this portion is low because a large fixing area cannot be obtained, and the mounting strength cannot be made sufficient.

Further, since the mounting strength of the chip type capacitor is obtained through the solder fixing portion of the lead wire 5, an external force applied by vibration or impact is applied to the fixing portion between the lead wire 5 and the printed wiring board, ie, the fixing portion. It acts on the electrical connection, which reduces the reliability of the electrical connection.

Further, in the above-mentioned conventional chip type capacitor, the lead wire 5 is accommodated in the cutout groove 17 and must be bent a plurality of times into a predetermined shape. There was a problem.

The present invention has been made in view of the above circumstances, and by eliminating a mounting structure for directly fixing a lead wire and a printed wiring board by soldering, a strong fixing can be performed.
Provides a chip-type capacitor that can prevent external force from acting on the electrical connection part and that does not require bending of lead wires in a complicated shape, improving mounting strength, reliability of electrical connection, and ease of assembly work. The purpose is to plan.

[0010]

In order to achieve the above object, according to one aspect of the present invention, a capacitor body, an outer frame made of an insulator for accommodating the capacitor body, and two sides of the outer frame. A slit which is fixed and whose leading end is bent substantially in parallel with the lead lead-out surface of the capacitor body, and which inserts and press-contacts the lead wire led out from the capacitor body with the bent leading end while being led out from the capacitor body. And a pair of electrode metal plates having a substrate mounting electrode portion formed by bending along the bottom from the side of the exterior frame, and a chip-type capacitor characterized by comprising: Provided.

In this case, the metal plate for an electrode forms a pair of elastic holding plates at portions extending from a side portion of the outer housing frame to a bottom portion and a head portion of the outer housing frame, respectively. The metal plate for an electrode may be fixed to the exterior frame by sandwiching a frame.

In the chip type capacitor configured as described above, soldering can be performed via the metal plate for the electrode, and the fixing area is increased, and the fixing strength is increased. Also, no external force acts on the electrical connection between the lead wire and the electrode metal plate. Further, processing of the lead wire becomes unnecessary.

In a chip type capacitor in which the metal plate for an electrode is fixed to the outer frame by sandwiching the outer frame with the elastic holding plate, it is possible to surely fix without using insert molding or the like.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a chip type capacitor according to the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an external perspective view of a chip type capacitor according to an embodiment of the present invention, and FIG. 2 is an explanatory view showing steps (a) to (c) for assembling the chip type capacitor according to the present invention.

The capacitor body 21 is, for example, an electrolytic capacitor, a film capacitor or the like, and has a pair of lead wires 23 led out from one end surface of a cylindrical housing. The capacitor body 21 is housed in a rectangular parallelepiped outer frame 55. The outer frame 55 is formed of resin, rubber, or another insulating material. A cylindrical housing space 56 is formed in the exterior frame 55, and the accommodation space 56 is open at both longitudinal end surfaces of the exterior frame 55. The capacitor body 2
1 is an electronic component other than a capacitor, for example, a resistor, a coil,
It may be a crystal oscillator or the like.

The outer frame 55 has one side surface (the lower surface of the outer frame 55 shown in FIG. 1) serving as the substrate mounting surface 29. An electrode metal plate 53 having an L-shaped cross section is fixed to a pair of sides of the substrate mounting surface 29 parallel to the central axis of the housing space 56.
The metal plate 53 for an electrode has one corner 53 a bent at the bottom of the exterior frame 55 so that the corner is aligned with the corner of the exterior frame 55.
Are parallel to the substrate mounting surface 29 to form a substrate mounting electrode, and the other piece 53b is parallel to both side surfaces of the exterior frame. In this embodiment, the metal plate 53 for an electrode is fixed to the exterior frame 55 by insert molding when the exterior frame 55 made of a resin material is molded. In the insert molding, a fixing hole (not shown) is formed in the metal plate 53 for the electrode, and a projection (not shown) which is a part of the outer frame 55 is welded to the fixing hole. The bonding strength with the metal plate 53 can be further increased.

At the tip of the electrode metal plate 53, an exterior frame 5 is provided.
A bent piece 57 bent in parallel with one end face of the fifth member 5 is formed. A slot or slit 35 whose edge is cut out in a U-shape is formed at the tip side of the bent piece 57. More specifically, the slit section 35 has a blade section 33. The blade portion 33 has a press-fitting opening 34 slightly smaller than the diameter of the lead wire 23. By press-fitting the lead wire 23, the blade portion 33 is brought into pressure contact with the lead wire 23 so that electrical connection can be made.

In order to assemble the chip-type capacitor 51 having the above-described components, as shown in FIG. 2, the capacitor body 21 is inserted from the other end of the outer frame 55 to which the electrode metal plate 53 is fixed. The lead wire 23 is led out from one end surface side of the outer frame 55. Next, by moving the lead wire 23 led out from between the pair of opposing bent pieces 57 in a direction orthogonal to the center of the line axis, each of the left and right blade portions 3 is moved.
3 is pressed. Next, an unnecessary portion protruding from the blade portion 33 on the lead wire tip side is removed by cutting. Thus, the assembly of the chip type capacitor 51 is completed.

In the chip type capacitor 51 assembled as described above, the lead wire 23 is electrically connected to the electrode metal plate 53. Accordingly, by soldering one piece 53a of the electrode metal plate 53 disposed on the substrate mounting surface 29 of the exterior frame 55 to the conductor of the printed wiring board, the chip-type capacitor 51 is interposed through the electrode metal plate 53. Thus, electrical connection and fixation to the printed wiring board are achieved at the same time, and surface mounting is achieved.

According to the chip type capacitor 51, soldering can be performed through the metal plate 53 for electrodes fixed to the outer frame 55, so that a high fixing strength can be obtained and a sufficient mounting strength can be obtained. .

Further, since no external force due to vibration or impact acts on the electrical connection between the lead wire 23 and the electrode metal plate 53, the reliability of the electrical connection can be improved.

Furthermore, the connection between the lead wire 23 and the metal plate 53 for the electrode can be performed only by press-fitting the lead wire 23 into the slit portion 35 in a state of being led out from the capacitor body. The complicated processing of bending the wire a plurality of times is eliminated, and assembling workability can be improved.

Further, since the bent piece 57 is bent in parallel with one end face of the exterior frame 55 and the slit section 35 is provided in the bent piece 57, the metal plate 53 for an electrode does not protrude from one end face of the exterior frame 55. The lead wire 23 can be pressed.

Next, another embodiment of the chip type capacitor according to the present invention will be described with reference to FIG. FIG. 3 is a front view of the chip-type capacitor according to the embodiment as viewed from a lead wire lead-out direction. Note that the same members or parts as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description will be omitted.

The chip type capacitor 6 according to this embodiment
In FIG. 1, a pair of parallel elastic holding pieces 63 bent in a substantially U-shape in the same direction are formed on upper and lower sides of a base 65a of an electrode metal plate 65. On one edge of the base 65a,
As in the previous embodiment, a bent piece 57 bent in parallel with one end surface of the exterior frame 55 is formed. This bent piece 57
A slit portion similar to that described above is formed at the tip side of. The slit portion 35 has a blade portion 33, and the slit portion 35 has a press-fitting opening 34 formed slightly smaller than the diameter of the lead wire 23.

A notch 49 is provided at the side edges of the upper and lower surfaces of the outer frame 55. The upper and lower cutouts 49
It is convenient to form the side portion of the outer frame 55 between them so as to have a slightly wedge-shaped cross section so that the elastic holding piece 63 of the metal plate for electrode 65 is fitted.

In such a configuration, the metal plate 65 for an electrode is inserted into the side surface of the exterior frame 55 to deform the elastic holding piece 63 outward against the elastic force, and then elastically return by the elastic returning force. The metal plate 65 for an electrode can be fixed to the outer frame 55 by fitting the holding piece 63 into the notch 49.

After the electrode metal plate 65 is fixed to the outer frame 55, the lead wire 23 led out from one end surface of the outer frame 55 is press-fitted in a direction orthogonal to the center of the wire axis in the same manner as in the above-described embodiment. The wire 23 is pressed against the blade portion 33. Next, the unnecessary portion protruding from the slit portion 35 on the leading end side of the lead wire is removed by cutting. Thus, the assembly of the chip type capacitor 61 is completed.

The chip type capacitor 6 according to this embodiment
According to 1, the mounting strength can be made sufficient,
In addition to the same effects as the above-described chip-type capacitor 51, which can improve the reliability of the electrical connection and improve the workability of the assembly, the metal plate 6
Since the elastic holding piece 63 is provided on the metal frame 5, the metal plate 65 for the electrode can be fixed to the outer frame 55 without using insert molding, and the manufacturing equipment can be simplified.

Alternatively, according to the chip-type capacitor 61, the capacitor body 21 is housed in the outer frame 55 in advance, and the metal plates 65 for electrodes are fitted on both side surfaces of the outer frame 55, and at the same time, the metal plate for electrodes is Slit 3 provided on 65
5 can be pressed into the lead wire 23. As a result,
Since the fixing of the electrode metal plate 65 and the connection of the lead wire 23 can be performed simultaneously, the number of assembling work steps can be further reduced.

As shown in FIG. 4, the chip-type capacitor 61 is formed by connecting the bent piece 57 of the electrode metal plate 65 to the outer frame 55.
After the metal plate 65 for an electrode is fitted to the outer frame 55 and the bent piece 57 is bent, the slit 35 is press-fitted into the lead wire 23 and the blade 3
3 and the lead wire 23 may be pressed against each other.

In the chip type capacitors 51 and 61 according to the above embodiments, the lead wire 23 is pressed against the slit 35 of the bent piece 57 by forming the bent piece 57 with a large area as shown in FIG. Then, the bent piece 57 is attached to the substrate mounting surface 2.
By soldering to the conductor of the printed wiring board as 9, it is possible to conduct and fix in a standing posture via the bent piece 57 as shown in FIG. 6. According to such a modification, the lead wires 23 can be arranged without being exposed, and damage to the lead wires 23 due to interference with other components can be prevented.

In each of the above-described embodiments, it is possible to use the metal plates 53 and 65 for electrodes which are plated with solder. According to the chip type capacitor using such electrode metal plates 53, 65, the slit 35 and the lead wire 23 can be soldered at the time of reflow, and the lead wire 23 and the electrode metal plates 53, 65 can be soldered. Connection reliability can be improved.

[0035]

As described above in detail, according to the chip-type capacitor of the present invention, the slit-shaped portion having the pressure contact with the lead wire led out from the capacitor main body is provided, and at least a part of the slit-shaped portion is formed on the substrate mounting surface of the outer frame. Since the pair of metal plates for electrodes to be provided are fixed to the outer frame, soldering can be performed via the metal plates for electrodes, high fixing strength can be obtained, and sufficient mounting strength can be obtained. Further, since no external force acts on the electrical connection between the lead wire and the electrode metal plate, the reliability of the electrical connection can be improved. Furthermore, since connection can be performed only by press-fitting the lead wire into the slit portion, the assembling workability can be improved.

When the exterior frame is made of a resin material and the electrode metal plate is fixed to the exterior frame by insert molding, the electrode metal plate can be securely fixed simultaneously with the formation of the exterior frame.

Further, in the case where a pair of parallel elastic holding plates are formed on the electrode metal plate, and the outer metal frame is sandwiched by the elastic holding plates and the electrode metal plate is fixed to the outer metal frame, insert molding is performed. The fixation can be performed with simple equipment as compared with the case.

Further, by performing solder plating on the electrode metal plate, the blade or slit can be soldered to the lead wire during reflow, and the connection reliability between the lead wire and the electrode metal plate can be improved. Can be increased.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a chip capacitor according to an embodiment of the present invention.

2 (a) to 2 (c) are explanatory views showing a procedure for assembling the chip-type capacitor according to the embodiment of FIG. 1;

FIG. 3 is a front view of a chip-type capacitor according to another embodiment of the present invention as viewed from a lead wire lead-out direction.

FIG. 4 is a side view of a chip-type capacitor showing an example of an electrode metal plate in which a bent piece is bent.

FIG. 5 is a bottom view of a chip-type capacitor showing an example of an electrode metal plate in which a bent piece is formed with a large area.

6 is an external perspective view of the chip-type capacitor shown in FIG.

FIG. 7 is an exploded perspective view of a conventional chip-type capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Capacitor main body 23 Lead wire 55 Exterior frame 29 Substrate mounting surface 53, 65 Metal plate for electrode 33 Blade part 34 Press-fit opening 35 Slit part 51, 61 Chip-type capacitor 63 Elastic holding plate 57 Bending piece

Claims (2)

[Claims] 1. A capacitor body, an outer frame made of an insulator for accommodating the capacitor body, fixed to both sides of the outer frame, and a tip portion is bent substantially parallel to a lead lead-out surface of the capacitor body. At the bent front end, a lead wire derived from the capacitor main body has a slit portion that is inserted and pressed against the capacitor main body while being led out from the capacitor main body, and is bent from a side portion of the exterior frame along a bottom portion. A chip-type capacitor comprising: a pair of electrode metal plates provided with a substrate mounting electrode portion formed as described above. 2. The metal plate for an electrode forms a pair of elastic holding plates at portions extending from a side portion of the outer housing frame to a bottom portion and a head portion of the outer housing frame, respectively. 2. The chip-type capacitor according to claim 1, wherein the metal plate for an electrode is fixed to the outer frame by sandwiching the metal plate.