JPH11513533A - 半晶質の共重合体接着剤を使用した電子アセンブリ - Google Patents
半晶質の共重合体接着剤を使用した電子アセンブリInfo
- Publication number
- JPH11513533A JPH11513533A JP9513405A JP51340597A JPH11513533A JP H11513533 A JPH11513533 A JP H11513533A JP 9513405 A JP9513405 A JP 9513405A JP 51340597 A JP51340597 A JP 51340597A JP H11513533 A JPH11513533 A JP H11513533A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- adhesive
- electronic assembly
- substrate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.(a)少なくとも一つの第一の導電性結合サイト(14)を持つ第一の基 板(12)と、 (b)少なくとも一つの第二の導電性結合サイト(18)を持つ第二の基板(1 6)と、 (c)前記第一と第二の基板、前記第一と第二の結合サイトの間にある重合体接 着剤組成物(20)と、 を含有する電子アセンブリ(10)であり、ここで 1rad/secondでDMAにより測定された接着剤組成物の損失弾性率(G")の貯 蔵弾性率(G')に対する比、tan δ、が約90℃から約150℃において約1 であり、tan δが1である温度においてこの接着剤組成物が約2x105 dynes/cm2 未満の貯蔵弾性率(G')を持ち、tan δが1である温度より20℃下の温度で は、この接着剤組成物が約5x105 dynes/cm2を越える貯蔵弾性率(G")を持つ、電 子アセンブリ(10)。 2.前記接着剤組成物のTgが約-10℃から約40℃である請求項1に記載の 電子アセンブリ。 3.前記第一の基板と第二の基板がプリント回路板、集積回路およびフレキシ ブル回路からなる群から選択される請求項1に記載の電子アセンブリ。 4.(a)少なくとも一つの第一の導電性結合サイト(14)を持つ第一の基 板(12)と、 (b)少なくとも一つの第二の導電性結合サイト(18)を持つ第二の基板(1 6)と、 (c)前記第一と第二の基板、前記第一と第二の結合サイトの間にある重合体接 着剤組成物(20)と、 を含有する電子アセンブリ(10)であり、ここで 接着剤組成物がポリエーテルおよびポリアミドモノマー単位を含有する半晶質共 重 合体と、 粘着性付与剤と、 導電性粒子(22)と、 を含有している、電子アセンブリ(10)。 5.前記共重合体が式(I)の反復単位、 ここでPAはポリアミドモノマー単位でありPEはポリエーテルモノマー単位で ある、 を含有する請求項4に記載の電子アセンブリ。 6.PAがポリ(ラウリルラクタム)でありPEがポリ(テトラメチレングリ コール)である請求項5に記載の電子アセンブリ。 7.前記共重合体と前記粘着性付与剤が重量比で約1:1の割合で存在する請求 項4に記載の電子アセンブリ。 8.前記粘着性付与剤がテルペンフェノール樹脂である請求項4に記載の電子 アセンブリ。 9.前記導電性粒子が全組成物に対して約1から約15容量%の割合で存在す る請求項4に記載の電子アセンブリ。 10.前記接着剤組成物がフィルムである請求項4に記載の電子アセンブリ。 11.(a)(i)式(I)の反復単位、 を含有する半晶質共重合体であって、PAはポリアミドモノマー単位でありPE はポリエーテルモノマー単位であり、 前記共重合体が共重合体と粘着性付与剤の総重量に対し、約60から約30重量 % の割合で存在する半晶質共重合体と、 (ii)前記共重合体と前記粘着性付与剤の総重量に対し、約40から約70重量 %の割合で存在する粘着性付与剤と、 (iii)組成物全量に対して約1から約15容量%の導電性粒子と、 を含有する接着剤組成物を提供するステップと、 (b)前記の接着剤組成物を前記の一つあるいはそれ以上の導電性デバイスの前 記の導電性結合表面のそれぞれと前記の第一と第二の導電性結合サイトのそれぞ れとの間に配置するステップと、さらに (c)各導電性結合サイトと各導電性結合表面の間に接着性結合を形成するのに 十分な時間、十分な熱および/または圧力を加えるステップと、 を含有する、 第一の導電性結合サイトを持つ第一の基板と、第二の導電性結合サイトを持つ第 二の基板の間に電気的相互接続を形成する方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US421995P | 1995-09-25 | 1995-09-25 | |
US60/004,219 | 1995-12-21 | ||
US08/576,710 US5672400A (en) | 1995-12-21 | 1995-12-21 | Electronic assembly with semi-crystalline copolymer adhesive |
US08/576,710 | 1995-12-21 | ||
PCT/US1996/013267 WO1997012503A1 (en) | 1995-09-25 | 1996-08-16 | Electronic assembly with semi-crystalline copolymer adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11513533A true JPH11513533A (ja) | 1999-11-16 |
JP3824651B2 JP3824651B2 (ja) | 2006-09-20 |
Family
ID=26672759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51340597A Expired - Lifetime JP3824651B2 (ja) | 1995-09-25 | 1996-08-16 | 半晶質の共重合体接着剤を使用した電子アセンブリ |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP0870418B1 (ja) |
JP (1) | JP3824651B2 (ja) |
DE (1) | DE69617738T2 (ja) |
WO (1) | WO1997012503A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164140A (ja) * | 1999-12-07 | 2001-06-19 | Dainippon Ink & Chem Inc | 有機顔料組成物 |
JP2017066267A (ja) * | 2015-09-30 | 2017-04-06 | 三菱マテリアル株式会社 | 熱伝導性組成物 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
DE102009011538A1 (de) | 2009-03-03 | 2010-09-09 | Pp-Mid Gmbh | Leiterplatten-Anordnung, sowie Verfahren zu deren Herstellung |
DE102008061051A1 (de) | 2008-12-08 | 2010-06-10 | Pp-Mid Gmbh | Leiterplatten-Anordnung und leitfähige Klebstoffe zum Verbinden von Bauteilen mit der Leiterplatte sowie Verfahren zu deren Herstellung |
JP6120884B2 (ja) | 2012-03-08 | 2017-04-26 | スリーエム イノベイティブ プロパティズ カンパニー | クリーンリリース、引き伸ばし剥離可能テープ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3937752A (en) * | 1969-03-06 | 1976-02-10 | Toyo Seikan Kabushiki Kaisha | Homopolyamide and terpolyamide blend |
FR2497518A1 (fr) * | 1981-01-05 | 1982-07-09 | Ato Chimie | Compositions adhesives thermofusibles a base de copolyetheramides sequences |
FR2627776B1 (fr) * | 1988-02-26 | 1990-09-07 | Asulab Sa | Melange adhesif electriquement conducteur |
US5061549A (en) * | 1990-03-20 | 1991-10-29 | Shores A Andrew | Substrate attach adhesive film, application method and devices incorporating the same |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
JPH05279644A (ja) * | 1992-03-31 | 1993-10-26 | Sekisui Finechem Co Ltd | 異方導電性接着シート |
-
1996
- 1996-08-16 DE DE69617738T patent/DE69617738T2/de not_active Expired - Lifetime
- 1996-08-16 EP EP96930522A patent/EP0870418B1/en not_active Expired - Lifetime
- 1996-08-16 EP EP01109106A patent/EP1143775A2/en not_active Withdrawn
- 1996-08-16 WO PCT/US1996/013267 patent/WO1997012503A1/en active IP Right Grant
- 1996-08-16 JP JP51340597A patent/JP3824651B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164140A (ja) * | 1999-12-07 | 2001-06-19 | Dainippon Ink & Chem Inc | 有機顔料組成物 |
JP2017066267A (ja) * | 2015-09-30 | 2017-04-06 | 三菱マテリアル株式会社 | 熱伝導性組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP3824651B2 (ja) | 2006-09-20 |
EP0870418B1 (en) | 2001-12-05 |
EP1143775A2 (en) | 2001-10-10 |
WO1997012503A1 (en) | 1997-04-03 |
EP0870418A1 (en) | 1998-10-14 |
DE69617738T2 (de) | 2002-09-26 |
DE69617738D1 (de) | 2002-01-17 |
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