JPH1149947A - Moisture-proof insulation treated composition and electric and electron product using same - Google Patents
Moisture-proof insulation treated composition and electric and electron product using sameInfo
- Publication number
- JPH1149947A JPH1149947A JP9211097A JP21109797A JPH1149947A JP H1149947 A JPH1149947 A JP H1149947A JP 9211097 A JP9211097 A JP 9211097A JP 21109797 A JP21109797 A JP 21109797A JP H1149947 A JPH1149947 A JP H1149947A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- hydroxyl group
- hydride
- proof insulation
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気電子部品の防
湿絶縁処理に好適な防湿絶縁処理組成物及びこれを用い
た電気電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moisture-proof insulation treatment composition suitable for moisture-proof insulation treatment of electric and electronic parts, and an electric and electronic part using the same.
【０００２】[0002]
【従来の技術】電気機器は、年々小型軽量化及び多機能
化の傾向にあり、多機能を制御する、各種電気機器に搭
載した実装回路板は、湿気、ほこり等から保護する目的
で絶縁処理が施されている。この絶縁処理法には、アク
リル樹脂、シリコン樹脂等の塗料による保護コーティン
グ処理、あるいはウレタン樹脂、エポキシ樹脂、シリコ
ーンゲル等による注型処理が広く採用されている。この
ような実装回路板は、過酷な環境下、特に高湿度下で使
用され、例えば、洗濯機、自動車等の機器に搭載されて
使用されている。しかしながら、前記塗料は、実装回路
板に搭載された電子部品のピン足を完全に保護コーティ
ングすることができず、耐水性が劣るという問題があっ
た。一方、注型処理に用いられるウレタン樹脂やエポキ
シ樹脂は、優れた絶縁性及び耐水性を有するが、高温の
条件下で長時間放置されると、酸化劣化により硬化物が
硬くなり、部品、実装回路板等に応力がかかり、クラッ
ク、剥離が発生し、信頼性が低下するおそれがあった。
また、シリコーンゲルは、硬化物が低硬度となり、耐熱
性に優れているが、価格が高く、経済性に問題があっ
た。2. Description of the Related Art Electrical equipment is becoming smaller and lighter and more multifunctional year by year. Circuit boards mounted on various electric equipment for controlling multifunctions are insulated for the purpose of protecting from moisture, dust and the like. Is given. As this insulating treatment, a protective coating treatment with a paint such as an acrylic resin or a silicone resin, or a casting treatment with a urethane resin, an epoxy resin, a silicone gel, or the like is widely used. Such a mounted circuit board is used under a severe environment, particularly under a high humidity, and is used by being mounted on, for example, a machine such as a washing machine and an automobile. However, there is a problem that the paint cannot completely protect the pin feet of the electronic components mounted on the mounting circuit board, resulting in poor water resistance. On the other hand, urethane resin and epoxy resin used for casting have excellent insulation and water resistance, but when left for a long time under high temperature conditions, the cured product becomes hard due to oxidative deterioration, and parts and mounting There is a possibility that stress is applied to the circuit board and the like, cracks and peeling occur, and the reliability is reduced.
Further, the silicone gel has a cured product having low hardness and excellent heat resistance, but is expensive and has a problem in economical efficiency.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、前記従来技
術の問題点を解消し、防湿絶縁等に適し、耐熱性及び難
燃性に優れた硬化物を形成しうる防湿絶縁処理組成物及
びこれを用いた電気電子部品を提供するものである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and provides a moisture-proof insulation treatment composition which is suitable for moisture-proof insulation and the like and can form a cured product having excellent heat resistance and flame retardancy. It is intended to provide an electric / electronic component using this.
【０００４】[0004]
【課題を解決するための手段】本発明は、（ａ）水酸基
含有液状ポリイソプレンの水素化物、（ｂ）ポリイソシ
アネート、（ｃ）水和アルミナ、（ｄ）リン酸エステル
及び（ｅ）ヒマシ油誘導体を含有してなる防湿絶縁処理
組成物及びこの絶縁処理組成物を用いて防湿絶縁処理さ
れた電気電子部品に関する。The present invention provides (a) a hydride of a hydroxyl group-containing liquid polyisoprene, (b) a polyisocyanate, (c) a hydrated alumina, (d) a phosphate ester, and (e) a castor oil. The present invention relates to a moisture-proof insulating treatment composition containing a derivative and an electric and electronic component subjected to moisture-proof insulation treatment using the insulating treatment composition.
【０００５】[0005]
【発明の実施の形態】本発明の防湿絶縁処理組成物は、
前記のように、（ａ）水酸基含有液状ポリイソプレンの
水素化物、（ｂ）ポリイソシアネート、（ｃ）水和アル
ミナ、（ｄ）リン酸エステル及び（ｅ）ヒマシ油誘導体
を含有してなるものである。（ａ）成分である水酸基含
有液状ポリイソプレンの水素化物は、分子中又は分子末
端に水酸基を有し、水酸基含有量が０．６〜１．５meq/
gのものが好ましく、０．８〜１．３meq/gのものがさら
に好ましい。水酸基含有量が０．６meq/g未満では樹脂
組成物の硬化性が劣る傾向があり、１．５meq/gを超え
ると、硬化物の可撓性が低下する傾向にある。水酸基含
有液状ポリイソプレンの水素化物の数平均分子量は、５
００〜１００００の範囲内が好ましく、１０００〜５０
００の範囲内であることがさらに好ましい。数平均分子
量が５００未満では硬化物の可撓性が劣る傾向があり、
１００００を超えると樹脂組成物中の粘度が高くなり、
注型作業性に劣る傾向にある。数平均分子量は蒸気圧浸
透法により測定したものである。水酸基含有液状ポリイ
ソプレンの水素化物の水素化率の指標である臭素価（ｇ
／１０ｇは、１０以下であることが好ましい。水素化率
が小さすぎると、加熱により硬化物の可撓性が低下する
傾向にある。BEST MODE FOR CARRYING OUT THE INVENTION The moisture-proof insulating treatment composition of the present invention comprises:
As described above, it comprises (a) a hydride of a hydroxyl group-containing liquid polyisoprene, (b) a polyisocyanate, (c) a hydrated alumina, (d) a phosphate ester, and (e) a castor oil derivative. is there. The hydride of the hydroxyl group-containing liquid polyisoprene as the component (a) has a hydroxyl group in a molecule or at a molecular terminal, and has a hydroxyl group content of 0.6 to 1.5 meq /.
g, and more preferably 0.8 to 1.3 meq / g. If the hydroxyl group content is less than 0.6 meq / g, the curability of the resin composition tends to be poor, and if it exceeds 1.5 meq / g, the flexibility of the cured product tends to decrease. The number average molecular weight of the hydride of hydroxyl group-containing liquid polyisoprene is 5
It is preferably in the range of 00 to 10,000,
More preferably, it is within the range of 00. If the number average molecular weight is less than 500, the flexibility of the cured product tends to be inferior,
If it exceeds 10,000, the viscosity in the resin composition increases,
It tends to be poor in castability. The number average molecular weight is measured by a vapor pressure osmosis method. Bromine value (g), which is an index of the hydrogenation rate of the hydride of a hydroxyl group-containing liquid polyisoprene
/ 10 g is preferably 10 or less. If the hydrogenation rate is too small, the flexibility of the cured product tends to decrease by heating.
【０００６】本発明に用いられる（ｂ）成分のポリイソ
シアネートは、前記（ａ）水酸化含有液状ポリイソプレ
ンの水素化物の硬化剤として使用されるものであり、例
えば、トリレンジイソシアネート、ジフェニルメタンジ
イソシアネート、ナフタレンジイソシアネート、キシリ
レンジイソシアネート、ジフェニルスルホンジイソシア
ネート、トリフェニルメタンジイソシアネート、ヘキサ
メチレンジイソシアネート、３−イソシアネートメチル
−３，５，５−トリメチルシクロヘキシルイソシアネー
ト、３−イソシアネートエチル−３，５，５−トリメチ
ルシクロヘキシルイソシアネート、３−イソシアネート
エチル−３，５，５−トリエチルシクロヘキシルイソシ
アネート、ジフェニルプロパンジイソシアネート、フェ
ニレンジイソシアネート、シクロヘキシリレンジイソシ
アネート、３，３′−ジイソシアネートジプロピルエー
テル、トリフェニルメタントリイソシアネート、ジフェ
ニルエーテル−４，４′−ジイソシアネートなどのポリ
イソシアネート又は上記イソシアネートをフェノール
類、オキシム類、イミド類、メルカプタン類、アルコー
ル類、ε−カプロラクタム、エチレンイミン、α−ピロ
リドン、マロン酸ジエチル、亜硫酸水素ナトリウム、ホ
ウ酸などでブロック化したもの、カルボジイミド変性ジ
フェニルメタンジイソシアネート等のこれらのイソシア
ネートから誘導される末端イソシアネート基を有するプ
レポリマーなどが挙げ、これらを単独で又は２種以上組
み合わせて使用することができる。The polyisocyanate of the component (b) used in the present invention is used as a curing agent for the hydride of the above-mentioned (a) hydration-containing liquid polyisoprene, and examples thereof include tolylene diisocyanate, diphenylmethane diisocyanate, and the like. Naphthalene diisocyanate, xylylene diisocyanate, diphenyl sulfone diisocyanate, triphenylmethane diisocyanate, hexamethylene diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene diisocyanate Polyisocyanates such as cyclohexylylene diisocyanate, 3,3'-diisocyanate dipropyl ether, triphenylmethane triisocyanate, diphenyl ether-4,4'-diisocyanate or the above isocyanates as phenols, oximes, imides, mercaptans Having terminal isocyanate groups derived from these isocyanates, such as alcohols, ε-caprolactam, ethyleneimine, α-pyrrolidone, diethyl malonate, sodium bisulfite, those blocked with boric acid, and carbodiimide-modified diphenylmethane diisocyanate. Prepolymers and the like can be mentioned, and these can be used alone or in combination of two or more.
【０００７】（ｂ）成分であるポリイソシアネートの配
合割合は、組成物の硬化性及び特性から、ポリイソシア
ネート中のイソシアネート基が、前記（ａ）水酸基含有
液状ポリイソプレンの水素化物の水酸基に対して、０．
７〜１．５当量とすることが好ましく、０．８〜１．３
当量とすることがより好ましく、０．９〜１．１当量と
することが特に好ましい。この配合量が０．７当量未満
では、硬化性及び耐湿性が劣る傾向があり、１．５当量
を超えると、硬化物が硬くなり、耐熱衝撃性が低下する
傾向がある。The mixing ratio of the polyisocyanate as the component (b) is such that the isocyanate groups in the polyisocyanate are based on the hydroxyl groups of the hydride of the (a) hydroxyl group-containing liquid polyisoprene, due to the curability and properties of the composition. , 0.
It is preferably 7 to 1.5 equivalents, and 0.8 to 1.3 equivalents.
It is more preferably equivalent, and particularly preferably 0.9 to 1.1 equivalent. If the amount is less than 0.7 equivalent, the curability and moisture resistance tend to be inferior. If the amount exceeds 1.5 equivalent, the cured product tends to be hard and the thermal shock resistance tends to decrease.
【０００８】本発明に用いられる（ｃ）成分の水和アル
ミナは、難燃剤として使用されるものであり、０．１〜
１００μｍの粒子径のものを使用することが好ましい。
水和アルミナの配合割合は、絶縁処理組成物の粘度及び
難燃性から、組成物中の５０〜８５重量％とすることが
好ましく、６０〜８０重量％とすることがより好まし
く、６５〜７５重量％とすることが特に好ましい。この
配合割合が５０重量％未満であると、難燃性が劣る傾向
があり、８５重量％を超えると、組成物の粘度が高くな
り、注型作業性が悪くなるおそれがある。[0008] The hydrated alumina of the component (c) used in the present invention is used as a flame retardant.
It is preferable to use one having a particle diameter of 100 μm.
The mixing ratio of the hydrated alumina is preferably 50 to 85% by weight, more preferably 60 to 80% by weight, and more preferably 65 to 75% by weight in the composition from the viewpoint of the viscosity and flame retardancy of the insulating treatment composition. It is particularly preferable to set the weight%. If the compounding ratio is less than 50% by weight, the flame retardancy tends to be inferior. If the compounding ratio exceeds 85% by weight, the viscosity of the composition becomes high and the casting workability may be deteriorated.
【０００９】本発明に（ｄ）成分として用いられるリン
酸エステルは、液状難燃剤として使用されるものであ
り、例えば、トリクレジルホスフェート、クレジルジフ
ェニルホスフェート、トリキシレニルホスフェートなど
が挙げられ、これらのうち１種又は２種以上を使用する
ことができる。リン酸エステルの配合割合は、絶縁処理
組成物の難燃性及び耐湿性から、組成物中の１〜２０重
量％とすることが好ましく、３〜１５重量％とすること
がより好ましく、５〜１３重量％とすることが特に好ま
しい。この配合量が１重量％未満であると、硬化物の難
燃性が劣る傾向があり、２０重量％を超えると、耐湿性
が低下する傾向がある。The phosphate ester used as the component (d) in the present invention is used as a liquid flame retardant, and includes, for example, tricresyl phosphate, cresyl diphenyl phosphate, trixylenyl phosphate and the like. One or more of these can be used. The proportion of the phosphate ester is preferably 1 to 20% by weight, more preferably 3 to 15% by weight, and more preferably 5 to 15% by weight, based on the flame retardancy and moisture resistance of the insulating composition. It is particularly preferred to be 13% by weight. If the amount is less than 1% by weight, the flame retardancy of the cured product tends to be inferior, and if it exceeds 20% by weight, the moisture resistance tends to decrease.
【００１０】（ｅ）成分のヒマシ油誘導体とは、ヒマシ
油誘導体とメタノール、エタノール、ブタノール等の炭
素数１〜１２のアルコールとのエステル交換によって得
られるものである。アルコールの使用量は、ヒマシ油脂
肪酸に対して１／３〜１当量が好ましく、特にほぼ同当
量が好ましい。また、ヒマシ油誘導体としてヒマシ油脂
肪酸とアルコールとの反応物を使用してもよい。ヒマシ
油誘導体の市販品としては、例えば、ＵＲＩＣ Ｈ−３
１、ＵＲＩＣ Ｙ−４０３、ＵＲＩＣ Ｙ−４０６（い
ずれも伊藤製油社製）などが挙げられる。ヒマシ油誘導
体の配合割合は、硬化物の硬度、耐熱性及び耐湿性か
ら、前記の水酸基含有ポリイソプレンの水素化物を１０
０重量％としたとき、１〜３０重量％とすることが好ま
しく、１〜２０重量％とすることがより好ましく、１〜
１５重量％とすることが特に好ましい。この配合量が１
重量％未満であると、硬化物の硬度が高くなる傾向があ
り、３０重量％を超えると、耐湿性が低下する傾向があ
る。The castor oil derivative as the component (e) is obtained by transesterification of a castor oil derivative with an alcohol having 1 to 12 carbon atoms such as methanol, ethanol and butanol. The amount of the alcohol to be used is preferably 1/3 to 1 equivalent, and particularly preferably about the same, relative to castor oil fatty acid. Further, a reaction product of castor oil fatty acid and alcohol may be used as the castor oil derivative. Commercial products of castor oil derivatives include, for example, URIC H-3
1, URIC Y-403, URIC Y-406 (all manufactured by Ito Oil Co., Ltd.) and the like. The compounding ratio of the castor oil derivative is 10% based on the hardness, heat resistance and moisture resistance of the cured product.
When it is 0% by weight, it is preferably 1 to 30% by weight, more preferably 1 to 20% by weight,
It is particularly preferred to be 15% by weight. This compounding amount is 1
If the amount is less than 30% by weight, the hardness of the cured product tends to increase, and if it exceeds 30% by weight, the moisture resistance tends to decrease.
【００１１】本発明の絶縁処理組成物には、必要に応じ
て可塑剤、粘着付与剤、硬化促進剤、着色剤などの各種
の添加剤を通常の使用量で配合してもよい。Various additives such as a plasticizer, a tackifier, a curing accelerator, and a coloring agent may be added to the insulation treatment composition of the present invention in a usual amount, if necessary.
【００１２】本発明の絶縁処理組成物を用いて電気電子
部品を絶縁処理するには、一般に知られている注型法に
よって、本発明の絶縁処理組成物を電気電子部品に注型
し、その組成物を硬化させればよい。注型後の硬化は、
室温であるいは加熱によって行われる。加熱硬化を行う
場合、通常６０〜１２０℃の温度で加熱することが好ま
しい。To insulate electric and electronic parts using the insulating composition of the present invention, the insulating composition of the present invention is cast into electric and electronic parts by a generally known casting method. The composition may be cured. Curing after casting,
It is performed at room temperature or by heating. When performing heat curing, it is usually preferable to heat at a temperature of 60 to 120 ° C.
【００１３】[0013]
【実施例】次に、実施例により本発明をさらに詳述する
が、本発明はこれによって制限されるものではない。Next, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.
【００１４】実施例１〜２及び比較例１ 表１に示す配合組成及び配合量で絶縁処理組成物を調製
し、その硬化物の特性を下記の方法で測定し、結果を表
１に示す。なお、使用した物質は下記のとおりである。 水酸基含有液状ポリイソプレン：エポール（出光石油化
学(株)製、商品名） 数平均分子量：２５００、 水酸基含有量：０．９０meq/g、 臭素価（ｇ／１００ｇ）：５ ヒマシ油交換エステル：ＵＲＩＣ Ｙ−４０３（伊藤製
油株式会社商品名） 水酸基含有液状１，４−ポリブタジエン：PolybdＲ−４
５ＨＴ（出光石油化学(株)製、商品名） 数平均分子量：２８００ 水和アルミナ：ほとんどの粒子の粒子径が０．１〜１０
０μｍてある粒子状のもの リン酸エステル：トリクレジルホスファイト ポリイソシアネート：カルボジイミド変性ジフェニルメ
タンジイソシアネート(ＯＮＣ−Ｐｈ−ＣＨ2−Ｐｈ＝Ｎ
＝Ｃ＝Ｎ−ＣＨ2−Ｐｈ−ＮＣＯ)（ただし、Ｐｈはフェ
ニレン基を示す）：ミリオネートＭＴＬ（日本ポリウレ
タン工業株式会社製）Examples 1 and 2 and Comparative Example 1 Insulating compositions were prepared according to the compositions and amounts shown in Table 1, and the properties of the cured products were measured by the following methods. The results are shown in Table 1. The substances used are as follows. Hydroxy group-containing liquid polyisoprene: Epol (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) Number average molecular weight: 2500, hydroxyl group content: 0.90 meq / g, bromine value (g / 100 g): 5 Castor oil exchange ester: URIC Y-403 (trade name of Ito Oil Co., Ltd.) Hydroxy group-containing liquid 1,4-polybutadiene: PolybdR-4
5HT (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) Number average molecular weight: 2800 Alumina hydrate: Most of the particles have a particle size of 0.1 to 10.
0 μm particle size Phosphate ester: tricresyl phosphite Polyisocyanate: carbodiimide-modified diphenylmethane diisocyanate (ONC-Ph-CH 2 -Ph = N
= C = N-CH 2 -Ph -NCO) ( However, Ph represents a phenylene group): Milionate MTL (manufactured by Nippon Polyurethane Industry Co., Ltd.)
【００１５】（１）硬度 絶縁処理組成物を直径６０mmの金属シャーレ中に２０ｇ
注入し、８０℃で４時間硬化させた後、金属シャーレよ
り硬化物を取り出し、試料とした。測定は、硬化直後
（初期）及び１２５℃で１６８時間加熱劣化した後、い
ずれも、２５℃の測定温度まで放置し、ショアＡ硬度計
で測定した。 （２）難燃性 ８０℃で４時間硬化させた１２７×１２．７×２mmの試
験片を作製し、ＵＬ９４燃焼試験法に準じて、初期及び
１２５℃で１６８時間加熱劣化した後に測定した。(1) Hardness 20 g of the insulating composition is placed in a metal dish having a diameter of 60 mm.
After pouring and curing at 80 ° C. for 4 hours, a cured product was taken out from the metal dish to prepare a sample. Immediately after curing (initial stage) and after heat deterioration at 125 ° C. for 168 hours, each was left to a measurement temperature of 25 ° C. and measured with a Shore A hardness meter. (2) Flame retardancy A 127 × 12.7 × 2 mm test piece cured at 80 ° C. for 4 hours was prepared and measured at the initial stage and after heating and deterioration at 125 ° C. for 168 hours according to the UL94 combustion test method.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【発明の効果】本発明の絶縁処理組成物を用いれば、酸
化劣化による硬度上昇が少なく、耐熱性及び難燃性に優
れ、信頼性の高い防湿絶縁処理された電気電子部品を提
供することができる。As described above, the use of the insulating composition of the present invention makes it possible to provide a highly reliable moisture-proof insulation-resistant electric and electronic component which has a small increase in hardness due to oxidative deterioration, is excellent in heat resistance and flame retardancy. it can.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｋ 5/521 Ｃ０８Ｋ 5/521 Ｃ０９Ｄ 5/25 Ｃ０９Ｄ 5/25 175/04 175/04 Ｈ０１Ｌ 23/29 Ｈ０１Ｌ 23/30 Ｒ 23/31 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI C08K 5/521 C08K 5/521 C09D 5/25 C09D 5/25 175/04 175/04 H01L 23/29 H01L 23/30 R 23 / 31
Claims (2)
水素化物、（ｂ）ポリイソシアネート、（ｃ）水和アル
ミナ、（ｄ）リン酸エステル及び（ｅ）ヒマシ油誘導体
を含有してなる防湿絶縁処理組成物。1. A moisture-proof insulation comprising (a) a hydride of a hydroxyl group-containing liquid polyisoprene, (b) a polyisocyanate, (c) a hydrated alumina, (d) a phosphate ester and (e) a castor oil derivative. Treatment composition.
いて防湿絶縁処理された電気電子部品。2. An electric and electronic component which has been subjected to moisture-proof insulation treatment using the moisture-proof insulation treatment composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211097A JPH1149947A (en) | 1997-08-06 | 1997-08-06 | Moisture-proof insulation treated composition and electric and electron product using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211097A JPH1149947A (en) | 1997-08-06 | 1997-08-06 | Moisture-proof insulation treated composition and electric and electron product using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1149947A true JPH1149947A (en) | 1999-02-23 |
Family
ID=16600371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9211097A Pending JPH1149947A (en) | 1997-08-06 | 1997-08-06 | Moisture-proof insulation treated composition and electric and electron product using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1149947A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003051954A1 (en) * | 2001-12-18 | 2003-06-26 | Henkel Kommanditgesellschaft Auf Aktien | Highly flame-resistant polyurethane adhesives |
-
1997
- 1997-08-06 JP JP9211097A patent/JPH1149947A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003051954A1 (en) * | 2001-12-18 | 2003-06-26 | Henkel Kommanditgesellschaft Auf Aktien | Highly flame-resistant polyurethane adhesives |
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