JP2003147197A - Moistureproof-insulation-treating composition and moistureproof-insulation-treated electric and electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which solves the problems of the conventional technique, gives a cured product suitable for moistureproof-insulation, is excellent in workability, heat resistance, flame retardance and heat dissipation, and gives a cured product of a low specific weight, to provide a method of manufacturing moistureproof-insulation-treated electric and electronic parts from the composition. SOLUTION: The moistureproof-insulation-treating composition comprises (a) a hydride of a liquid hydroxylated polyisoprenepolyol, (b) a polyisocyanate, (c) hydrated alumina, (d) a phosphate ester, (e) a hollow microspherical filler and (f) a castor oil derivative.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moisture-proof insulating composition suitable for moisture-proof insulating treatment of electric / electronic parts and electric / electronic parts using the same.

[0002]

2. Description of the Related Art Electric equipment tends to be smaller and lighter and has more and more functions year by year. The mounted circuit boards mounted on various electric equipment for controlling multi-functions are insulated to protect them from moisture and dust. Has been applied. As the insulation treatment method, a protective coating treatment with a paint such as an acrylic resin or a silicone resin, or a casting treatment with a urethane resin, an epoxy resin, a silicone gel or the like is widely adopted. Such a mounting circuit board is used under a harsh environment, particularly under high humidity, and is mounted and used in equipment such as a washing machine and an automobile.

However, the above-mentioned coating composition has a problem in that the pin legs of the electronic components mounted on the mounting circuit board cannot be completely protected and the water resistance is poor. On the other hand, the urethane resin and epoxy resin used for the casting treatment have excellent insulation and water resistance, but when left for a long time under high temperature conditions, the cured product becomes hard due to oxidative deterioration, There is a risk that stress will be applied to the components, the mounting circuit board, etc., causing cracks and peeling, resulting in reduced reliability. Further, the silicone gel has a low hardness as a cured product and is excellent in heat resistance, but it is expensive and has a problem in economy. In addition, in each case, it is required to further improve the heat dissipation by improving the thermal reliability of the equipment and the low specific gravity of the cured product corresponding to the weight reduction. It has not been.

[0004]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art and provides a cured product suitable for moisture-proof insulation,
To provide a heat-resistant resin composition which is excellent in workability, heat resistance, flame retardancy and heat dissipation and has a low specific gravity of a cured product, and a method for producing a moisture-proof insulation-treated electric / electronic component using the composition. To aim.

[0005]

The present invention provides (a) a hydride of a hydroxyl group-containing liquid polyisoprene polyol, (b)
Using a moisture-proof insulation treatment composition containing polyisocyanate, (c) hydrated alumina, (d) phosphate ester, (e) hollow microsphere filler and (f) castor oil derivative, and this moisture-proof insulation treatment composition The present invention relates to an electric / electronic component that has been subjected to a moisture-proof insulation treatment.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, the moisture-proof insulating composition of the present invention comprises (a) a hydride of a hydroxyl group-containing liquid polyisoprene polyol, (b) a polyisocyanate, (c) a hydrated alumina, and (d). It comprises a phosphoric acid ester, (e) hollow microsphere filler, and (f) castor oil derivative.

The hydride of the liquid polyisoprene polyol having a hydroxyl group, which is the component (a) used in the present invention, has a hydroxyl group in the molecule or at the terminal of the molecule, and the hydroxyl group content is from 0.6 to 10 in consideration of the characteristics of the cured product. It is preferably 1.5 meq / g, and particularly preferably 0.8 to 1.3 meq / g. Moreover, the number average molecular weight of the hydroxyl group-containing liquid polyisoprene polyol is preferably in the range of 500 to 10,000, more preferably in the range of 1,000 to 5,000. If the number average molecular weight is less than 500, the flexibility of the cured product tends to be poor, and 10,000
If it exceeds, the viscosity of the resin composition tends to be high, and casting workability tends to be poor. In the present invention, the number average molecular weight is measured by the vapor pressure permeation method. Examples of commercially available products of this polymer include Epol (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.).

The component (b) polyisocyanate used in the present invention is used as a curing agent for the hydride of the above-mentioned component (a) hydroxyl group-containing liquid polyisoprene, and examples thereof include tolylene diisocyanate and diphenylmethane diisocyanate. , Naphthalene diisocyanate,
Xylylene diisocyanate, diphenyl sulfone diisocyanate, triphenylmethane diisocyanate,
Hexamethylene isocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3,5,5-triethylcyclohexyl isocyanate, diphenyl Propane diisocyanate,
Polyisocyanates such as phenylene diisocyanate, cyclohexylylene diisocyanate, 3,3′-diisocyanate propyl ether, triphenylmethane triisocyanate, diphenyl ether-4,4′-diisocyanate or the above isocyanates are phenols, oximes, imides, mercaptans, Alcohols, ε-caprolactam, ethyleneimine, α-pyrrolidone, diethyl malonate, sodium bisulfite, compounds blocked with boric acid and the like, cardodiimide-modified diphenylmethane diisocyanate and the like having a terminal isocyanate group-derived pre-isocyanate group derived from Examples thereof include polymers, and these can be used alone or in combination of two or more kinds.

The blending ratio of the polyisocyanate as the component (b) is such that the isocyanate group in the polyisocyanate is 0 with respect to the hydroxyl group of the hydride of the liquid hydroxyl group-containing polyisoprene (a) because of the curability and characteristics of the composition. .7-
The amount is preferably 1.5 equivalents, more preferably 0.8 to 1.3 equivalents, and particularly preferably 0.9 to 1.1 equivalents. If the amount is less than 0.7, the curability and moisture resistance tend to be poor, and if it exceeds 1.5 equivalents, the cured product tends to be hard and the thermal shock resistance tends to be low.

The hydrated alumina of the component (c) used in the present invention is used as a flame retardant,
It is preferable to use particles having a particle size of 100 μm.
The blending ratio of the hydrated alumina as the component (c) is 15 to 85% by weight based on the viscosity and flame retardancy of the resin composition.
Is preferable, and it is more preferable that it is 20 to 80% by weight, and it is particularly preferable that it is 25 to 75% by weight. If the content is less than 15% by weight, the flame retardancy tends to be poor, and if it exceeds 85% by weight, the viscosity of the resin composition tends to be high and casting workability tends to be poor.

The phosphoric acid ester as the component (d) used in the present invention is used as a liquid flame retardant and a softening agent. For example, tricresyl phosphate, cresyl diphenyl phosphate, xylenyl phosphate. And the like, and one or more of these can be used. Due to the flame resistance and moisture resistance of the insulation treatment composition, the compounding ratio of the phosphoric acid ester is 1 to 2 in the composition.
It is preferably 0% by weight, more preferably 3 to 15% by weight, and particularly preferably 5 to 13% by weight. If the content is less than 1% by weight, the flexibility of the cured product tends to be poor, and if it exceeds 20% by weight, the moisture resistance of the resin composition tends to decrease.

The hollow microsphere filler as the component (e) used in the present invention is used for reducing the weight of the cured product and improving the impact strength, and has a particle size of 1 to 600 μm. It is preferable. Examples of the hollow microsphere filler include glass balloons, silica balloons, alumina balloons and the like. The blending ratio of the hollow microsphere filler is preferably 1 to 20% by weight, more preferably 3 to 15% by weight, and more preferably 5 to 12% by weight based on the viscosity of the insulating treatment composition. Is particularly preferable. If the blending amount is less than 1% by weight, the effect of reducing the weight of the cured product cannot be obtained, and if it exceeds 20% by weight, the viscosity of the resin composition increases and the casting workability deteriorates.

The castor oil derivative (g) used in the present invention is obtained by a transesterification reaction between castor oil and an alcohol having 1 to 12 carbon atoms such as methanol, ethanol and butanol. The amount of alcohol used is preferably 1/3 to 1 equivalent, and particularly preferably 3/5 to 1 equivalent, based on the castor oil fatty acid equivalent of castor oil. Further, as a castor oil derivative, a reaction product of castor oil fatty acid and alcohol may be used. Commercially available castor oil derivatives include URIC Y-403, URIC H-31 and URI.
CY-331, URIC Y-332, URIC Y-
406 (all manufactured by Ito Oil Co., Ltd.) and the like.

From the hardness, heat resistance, moisture resistance and thermal shock resistance of the cured product, the proportion of the castor oil derivative is 1 to 40% by weight when the hydride of the hydroxyl group-containing polyisoprene is 100% by weight. It is preferably 1 to 30% by weight, more preferably 1 to 20% by weight. If the blending amount is less than 1% by weight, the hardness of the cured product tends to be high and the thermal shock resistance tends to be low.
If it exceeds 0% by weight, the moisture resistance tends to decrease. The moisture-proof insulation treatment composition of the present invention, if necessary, a plasticizer,
You may mix | blend various additives, such as a tackifier, a hardening accelerator, and a coloring agent, with a usual use amount. The moisture-proof insulation treatment composition of the present invention is suitable for insulation treatment of electric and electronic devices such as capacitors, transformers and other parts, and mounting circuit boards. As the insulating treatment, the composition may be cast into an electric / electronic component and cured by a generally known casting method. Curing after casting is done at room temperature or by heating. When heat-curing, it is usually preferable to heat at a temperature of 60 to 120 ° C.

[0015]

EXAMPLES The present invention will now be described with reference to examples, but the present invention is not limited thereto. Examples 1 and 2 and Comparative Examples 1 and 2 An insulating treatment composition was prepared with the blending composition and blending amount (parts by weight) shown in Table 1, the properties of the cured product were measured by the following methods, and the results are shown in Table 1. Shown in. The substances used are as follows. Hydroxyl group-containing liquid polyisoprene hydride: Number average molecular weight of 2,500, hydroxyl group content of 0.90 meq / g (Idemitsu Petrochemical Co., Ltd., trade name Epol) Hydroxyl group-containing 1.4-polybutadiene: Number average molecular weight of 2,
800 (made by Idemitsu Petrochemical Co., Ltd., trade name Pol
ybdR-45HT) Polyisocyanate: carbodiimide-modified diphenylmethane diisocyanate represented by the following formula

[0016]

## STR1 ## _{OCN-Ph-CH 2 -Ph-} N = C = N-P
(wherein, Ph represents a para-phenylene _{group.) h-CH 2 -Ph-} NCO hydrated alumina: Most particle size 0.1~100μm
Is in the form of particles. Phosphate ester: tricresyl phosphate (manufactured by Daihachi Chemical Co., Ltd., trade name TCP) Glass balloon: Cellstar Z27 (trade name of Tokai Kogyo Co., Ltd., average particle size 60 μm) Castor oil derivative: Y-403 (Ito Oil Co., Ltd. stock) (Made by company) (1) 30 pieces of hardness insulating treatment composition in a metal dish having a diameter of 60 mm
After injecting g and curing at 80 ° C. for 4 hours, the cured product was taken out from the metal petri dish and used as a sample. The measurement was carried out immediately after curing (initial stage) and after heating and aging at 125 ° C. for 168 hours.
It was measured with a Shore A hardness meter. (2) Flame retardance 127 × 12.7 × 2 mm test piece was prepared by curing at 80 ° C. for 4 hours, and measured according to UL94 flame retardancy test method after initial heating and after deterioration by heating at 125 ° C. for 168 hours. did. (3) Cured product specific gravity A test piece of 50 × 50 × 2 mm cured at 80 ° C. for 4 hours was prepared and measured with an electronic hydrometer. (4) Thermal shock resistance 10 g of each resin composition in a metal dish having a diameter of 60 mm.
After injecting and curing at 80 ° C for 1 hour, stainless steel (JISB 1
251) Spring washer No. 2 (outer diameter 22.7 mm, inner diameter 13 m
m), 10 g of each resin composition is further injected, and the temperature is 80 ° C.
After curing for 4 hours, prepare a cured product test piece from a metal petri dish and leave it in a thermal cycle test (-1 hour at -40 ° C, 1 hour at 125 ° C) to peel and crack the cured product at each time. Was observed. This test was performed on 10 test pieces.

[0017]

[Table 1]

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/29 H05K 3/28 C 23/31 C08G 18/62 H05K 3/28 H01L 23/30 R // C08G 18/62 F-term (reference) 4J002 AE052 CK051 DE146 DL008 EW047 FD027 FD136 FD137 GH00 GQ00 GQ01 4J034 DA01 DB05 DP19 DP20 EA12 GA05 GA08 HA07 HA08 HA11 HA13 HC03 HC08 HC12 HC13 HC22 HC61 HC64 HC65 HC67 HC68 HC70 HC71 HC73 HD01 HD03 HD04 HD05 HD06 HD07 HD12 HD13 HD15 MA03 MA04 MA16 QA03 QB11 QB14 QB16 QB17 QD03 RA14 RA19 4J038 BA202 DG191 HA216 HA446 HA486 JC24 KA08 KA12 KA20 KA21 NA07 NA14 NA21 NA23 PB09 PC08 4M109 AA01 CA21 EA01 EB02 EB07 EB18 5E314 AA01 AA24 BB02 BB11 BB12 FF01 GG01

Claims (2)

[Claims] 1. A hydride of a liquid polyisoprene polyol having a hydroxyl group, and a polyisocyanate,
A moisture-proof insulation treatment composition comprising (c) hydrated alumina, (d) phosphate ester, (e) hollow microsphere filler, and (f) castor oil derivative. 2. A method for producing a heat-resistant resin composition that has been subjected to a moisture-proof insulation treatment using the moisture-proof insulation treatment composition according to claim 1 and an insulation-treated electric / electronic component.