JP2002060457A - Moistureproofing and insulating treatment composition and moistureproofed and insulated electric and electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a moistureproofing and insulating composition suitable for a moistureproofing and insulating treatments of electric and electronic parts and to provide electric and electronic parts obtained by using the same. SOLUTION: The composition contains (a) a hydrogenation product of a hydroxyl-group-containing liquid polyisoprene polyol, (b) a polyisocyanate, (c) crystalline silica, (d) a halogen-containing phosphoric ester, (e) antimony trioxide, and (f) a hollow microspherical filler. Electric and electronic parts moistureproofed and insulated with the composition are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moisture-proof insulating composition suitable for moisture-proof insulating treatment of electric and electronic parts, and an electric and electronic part using the same.

[0002]

2. Description of the Related Art Electrical equipment is becoming smaller and lighter and more multifunctional year by year. Circuit boards mounted on various electric equipment for controlling multifunctions are insulated for the purpose of protecting from moisture, dust and the like. Is given. As this insulating treatment, a protective coating treatment with a paint such as an acrylic resin or a silicone resin, or a casting treatment with a urethane resin, an epoxy resin, a silicone gel, or the like is widely used. Such a mounted circuit board is used under a severe environment, particularly under a high humidity, and is used by being mounted on, for example, a machine such as a washing machine and an automobile. However, with the above-mentioned paint, there was a problem that the pin feet of the electronic components mounted on the mounting circuit board could not be completely protectively coated, resulting in poor water resistance. On the other hand, urethane resin and epoxy resin used for casting have excellent insulation and water resistance,
If left for a long time under high temperature conditions, the cured product becomes hard due to oxidative deterioration, and stress is applied to parts, mounted circuit boards, etc.
Cracks and peeling may occur, and the reliability may be reduced. Further, the silicone gel has a cured product having a low hardness and excellent heat resistance, but is expensive and has a problem in economy. In each case, it is required to improve the thermal reliability of the equipment by increasing the heat dissipation and to reduce the specific gravity of the cured product corresponding to the weight reduction. It has not been.

[0003]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, provides a cured product suitable for moisture-proof insulation, and has excellent workability, heat resistance, flame retardancy and heat dissipation. An object of the present invention is to provide a heat-resistant resin composition having a low specific gravity of a cured product and an electric / electronic component which has been subjected to moisture-proof insulation treatment using the composition.

[0004]

The present invention provides (a) a hydride of a hydroxyl group-containing liquid polyisoprene polyol, (b)
A moisture-proof insulating treatment composition comprising a polyisocyanate, (c) crystalline silica, (d) a halogen-containing phosphate, (e) antimony trioxide and (f) a hollow microsphere filler, and a moisture-proof insulating treatment composition The present invention relates to an electric and electronic component subjected to moisture-proof insulation treatment.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The moisture-proof insulating treatment composition of the present invention comprises:
As described above, (a) a hydride of a hydroxyl group-containing liquid polyisoprene polyol, (b) a polyisocyanate,
It comprises (c) crystalline silica, (d) a halogen-containing phosphate, (e) antimony trioxide, and (f) a hollow microsphere filler. The hydride of the hydroxyl group-containing liquid polyisoprene polyol of the component (a) used in the present invention has a hydroxyl group in the molecule or at the molecular terminal, and the hydroxyl group content is 0.6 to 1.5 me in consideration of the properties of the cured product.
q / g, preferably 0.8 to 1.3 meq /
g is more preferable.

The number average molecular weight of the hydride of the hydroxyl group-containing liquid polyisoprene polyol is 500 to 10,000.
00, preferably 1,000 to 5,
More preferably, it is in the range of 000. If the number average molecular weight is less than 500, the flexibility of the cured product tends to be inferior, and if it exceeds 10,000, the viscosity of the resin composition tends to be high and the casting workability tends to be inferior. In the present invention, the number average molecular weight is measured by a vapor pressure osmosis method. As a commercial product of this polymer, for example, Epol (trade name, manufactured by Idemitsu Petrochemical Industry Co., Ltd.) can be mentioned.

The polyisocyanate (b) used in the present invention is used as a curing agent for the hydride of the hydroxyl group-containing liquid polyisoprene polyol (a). Examples thereof include tolylene diisocyanate and diphenylmethane. Diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, diphenylsulfone diisocyanate, triphenylmethane diisocyanate, hexamethylene isocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexylisocyanate, 3-isocyanateethyl-3,
5,5-trimethylcyclohexyl isocyanate, 3
-Isocyanate ethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene diisocyanate, cyclohexylylene diisocyanate, 3,3'-diisocyanate propyl ether, triphenylmethane triisocyanate, diphenyl ether-4,4'-diisocyanate Polyisocyanate or a compound obtained by blocking the above isocyanate with phenols, oximes, imides, mercaptans, alcohols, ε-caprolactam, ethyleneimine, α-pyrrolidone, diethyl malonate, sodium bisulfite, boric acid, etc., cardodiimide Prepolymers having terminal isocyanate groups derived from the above polyisocyanates such as modified diphenylmethane diisocyanate And these can be used alone or in combination of two or more.

The mixing ratio of the polyisocyanate of the component (b) is such that the isocyanate group in the polyisocyanate is based on the hydroxyl group of the hydride of the (a) hydroxyl group-containing liquid polyisoprene polyol in view of the curability and properties of the composition. 0.7 to 1.5 equivalents, preferably 0.8 to 1.5 equivalents.
1.3 equivalents are more preferred, and 0.9 to 1.1 equivalents.
More preferably, it is equivalent. This compounding amount is 0.7
If it is less than the equivalent, the curability and moisture resistance tend to be inferior,
If it exceeds 1.5 equivalents, the cured product becomes hard and the thermal shock resistance tends to decrease.

The crystalline silica of component (c) used in the present invention is used as a filler.
It is preferable to use one having a particle size of 50 μm.
The compounding ratio of the crystalline silica of the component (c) is 20 to 85% by weight in the composition based on the viscosity and the thermal conductivity of the insulating composition.
Is preferably 30 to 75% by weight, more preferably 40 to 65% by weight. If the amount is less than 20% by weight, the thermal conductivity tends to be low. If the amount exceeds 85% by weight, the viscosity of the resin composition tends to be high, and the casting workability tends to be poor.

The halogen-containing phosphoric acid ester (d) used in the present invention is used as a flame retardant, for example, trischloroethyl phosphate, trischloropropyl phosphate, trisdichloropropyl phosphate and the like. Is mentioned. The proportion of the halogen-containing phosphate ester is preferably 1 to 20% by weight, more preferably 3 to 15% by weight in the composition, from the flame retardancy and moisture resistance of the insulating composition. More preferably, the content is 5 to 12% by weight. If the amount is less than 1% by weight, the effect of flame retardancy of the cured product cannot be obtained, and if it exceeds 20% by weight, the moisture resistance of the resin composition tends to decrease.

The antimony trioxide of the component (e) used in the present invention is used as a flame retardant auxiliary,
It is preferable to use one having a particle diameter of 0.1 to 10 μm. The proportion of antimony trioxide is preferably from 5 to 60% by weight, and more preferably from 10 to 50% by weight, based on the halogen-containing phosphate of component (d), from the viewpoint of flame retardancy and viscosity of the insulating composition. %, More preferably 15 to 45% by weight. If the amount is less than 5% by weight, the flame retardancy of the cured product tends to be inferior. If the amount exceeds 60% by weight, the viscosity of the resin composition tends to be high and the casting workability tends to be inferior.

The hollow microsphere filler of the component (f) used in the present invention is used for reducing the weight of the cured product and improving the impact strength, and has a particle diameter of 1 to 600 μm. Is preferred. Examples of the hollow microsphere filler include a glass balloon, a silica balloon, and an alumina balloon. The compounding ratio of the hollow microsphere filler is preferably from 1 to 20% by weight, more preferably from 3 to 15% by weight, and more preferably from 5 to 12% by weight, based on the viscosity of the insulating composition. More preferably, When the amount is less than 1% by weight, the effect of reducing the weight of the cured product is reduced. When the amount is more than 20% by weight, the viscosity of the resin composition tends to be high, and the castability tends to be poor.

Various additives such as a plasticizer, a tackifier, a curing accelerator, and a coloring agent may be added to the moisture-proof insulating composition of the present invention, if necessary, in usual amounts. The moisture-proof insulation treatment composition of the present invention is suitable for moisture-proof insulation treatment of electric and electronic components such as components such as capacitors and transformers and mounted circuit boards. As the insulation treatment, the composition may be cast into an electric / electronic component by a generally known casting method, and the composition may be cured. Curing after casting is performed at room temperature or by heating. When performing heat curing, it is usually preferable to heat at a temperature of 60 to 120 ° C.

[0014]

Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

Examples 1 and 2 and Comparative Example 1 An insulating composition was prepared with the composition and the amount (parts by weight) shown in Table 1, and the properties of the cured product were measured by the following methods. It is shown in FIG. The substances used are as follows. Hydrogenated hydroxyl group-containing liquid polyisoprene polyol: having a number average molecular weight of 2,500 and a hydroxyl group content of 0.90 meq / g (manufactured by Idemitsu Petrochemical Co., Ltd.
Product name Epol) Hydroxyl group-containing 1,4-polybutadiene: number average molecular weight 2,
800 (made by Idemitsu Petrochemical Co., Ltd., trade name Pol
ybdR-45HT) Crystalline silica: Most of the particles having a particle diameter of 0.1 to 150 μm (Crystalite AA, trade name of Tatsumori Corporation). Glass balloon: Cellstar Z27 (trade name of Tokai Kogyo Co., Ltd., average particle size: 60 μm) Halogen-containing phosphate ester: trischloroethyl phosphate polyisocyanate: carbodiimide-modified diphenylmethane diisocyanate OCN-Ph-CH ₂ -Ph represented by the following formula -N = C = N-Ph- CH 2
-Ph-NCO (In the formula, Ph represents a paraphenylene group.)

(1) Hardness The insulating composition was placed in a metal dish having a diameter of 60 mm.
g was injected and cured at 80 ° C. for 4 hours, and then the cured product was taken out of the metal petri dish to obtain a sample. Immediately after curing (initial stage) and after heat deterioration at 125 ° C. for 168 hours, each was left to a measurement temperature of 25 ° C. and measured with a Shore A hardness meter. (2) Flame retardancy A 127 × 12.7 × 2 mm test piece cured at 80 ° C. for 4 hours was prepared, and measured in accordance with the UL94 flame retardancy test method at the initial stage and after heat deterioration at 125 ° C. for 168 hours. . (3) Specific gravity of cured product A 50 × 50 × 2 mm test piece cured at 80 ° C. for 4 hours was prepared and measured with an electronic hydrometer. (4) Thermal conductivity A test piece having a diameter of 50 × 10 mm was prepared by curing at 80 ° C. for 4 hours, and measured by a rapid thermal conductivity meter. (5) Degree of Sedimentation of Filler After collecting 300 g of each resin composition in a 300 ml round can, the resin composition was allowed to stand in an atmosphere of 100 ° C. for 24 hours to observe whether or not the filler had settled.

[0017]

[Table 1]

[0018]

Industrial Applicability The resin moisture-proof insulating treatment composition of the present invention can produce a cured product excellent in workability and excellent in heat resistance, flame retardancy and heat dissipation, thereby providing highly reliable insulation. A processed electrical and electronic component can be provided.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 75/04 C08L 75/04 H01B 3/44 H01B 3/44 Z H01L 23/29 H01L 23/30 R 23 / 31 F term (reference) 4J002 CK051 DE128 DJ016 DJ019 DL009 EW077 FA109 FD016 FD137 FD138 FD209 GQ00 4J034 AA01 DQ09 HC11 HC12 HC17 HC22 HC46 HC52 HC53 HC61 HC63 HD03 HD04 HD07 HD09 HD12 HD13 QB06 EA14 EBEB EB01 EB04 EB13 EB18 EC05 EC06 EC20 GA10 5G305 AA07 AA13 AB23 AB24 AB25 AB26 AB36 BA09 CA08 CB15 CB22 CB23 CC02 CC14 CD01

Claims (2)

[Claims] 1. A hydride of a hydroxyl group-containing liquid polyisoprene polyol, (b) a polyisocyanate,
A moisture-proof insulation treatment composition comprising (c) crystalline silica, (d) a halogen-containing phosphate, (e) antimony trioxide, and (f) a hollow microsphere filler. 2. An electric and electronic component which has been subjected to moisture-proof insulation treatment using the moisture-proof insulation treatment composition according to claim 1.