JPH1144834A - Optical element moving device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize in a space saved state with high cleanness an optical element moving device accurately driving an optical element for adjusting the optical characteristic of a projection optical system on an optical axis by providing a damper means between a movable part and a fixed part. SOLUTION: This device is provided with the damper means between the movable part and the fixed part. Namely, in this device, the driving element 4 is constituted of a bellows 9, etc., and its one end is fixed on a fixed base and the other end is fixed on a clamp top board coupled with a movable base. The element 4 is constituted of the bellows 9, two flanges 10a and 10b, columns 11a and 11b and a viscous body 12 interposed in a gap between the columns 11a and 11b. One flange 10a is coupled with the clamp top board through the gap of a leaf spring piece and the other flange 10b is arranged in the fixed base, so that air pressure applied to the inside of the bellows 9 is transmitted to the movable base. By using such a driving element 4, damping characteristic is added to the operation of a mechanism.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element moving device for adjusting optical characteristics such as magnification, aberration and distortion of a projection optical system such as an exposure device, and more particularly, to a semiconductor printing apparatus (mask aligner). In the projection optical system used in (1) and the like, when an image of an original (eg, a mask and a reticle) is projected and exposed on an object (eg, a wafer), an optical system used for an additional optical system for obtaining a more accurate imaging relationship It relates to an element moving device.

[0002]

2. Description of the Related Art A semiconductor exposure apparatus is an apparatus for transferring an original (reticle) having many different types of patterns onto a silicon wafer (substrate). In order to create a highly integrated circuit, it is essential to improve not only the resolution performance but also the overlay accuracy.

[0003] Overlay errors in a semiconductor exposure apparatus are classified into alignment errors, image distortions, and magnification errors. The alignment error is reduced by adjusting the relative position between the original (reticle) and the substrate (wafer). On the other hand, the magnification error can be adjusted by moving a part of the projection optical system in the optical axis direction. When moving in the direction of the optical axis, components other than the moving direction, in particular, parallel eccentricity and inclination error must be prevented from increasing.

Heretofore, as a projection magnification adjusting device for a semiconductor exposure apparatus, an optical element moving device using a mechanism using a parallel leaf spring as disclosed in Japanese Patent Application Laid-Open No. 9-106944 has been devised. FIG. 1 is an overall view of an exposure apparatus on which this kind of optical element moving device is mounted, and FIG. 2 is a partially cutaway plan view and a cross-sectional view showing a mechanism disclosed in the above publication. As shown in FIG. 2, this optical element moving device includes a movable table 1 on which an adjustment lens 7 for adjusting magnification, aberration, etc., and a cell 8 supporting the same, and a part of a fixed portion of the projection optical system 104 of FIG. Is provided. Drive element 4
Is constituted by a bellows or the like, one end of which is fixed to the fixed base 2 and the other end is fixed to a clamp top plate 5 connected to the movable base 1. Movable table 1 and fixed table 2
Are connected by a spring mechanism having a pair of leaf spring members having two or more leaf spring pieces 3 and a leaf spring retainer 6 supporting the pair. One leaf spring material is disposed on each of both end surfaces of the movable base 1 and the fixed base 2. The driving element 4 is arranged in a gap between the leaf spring pieces 3, equidistant from the center of the movable base 1, and symmetrically with respect to the optical axis 20.

FIG. 22 shows a driving element 4 disclosed in the above publication.
The outline of is shown. The drive element 4 in FIG.
It is constituted by a plurality of flanges 10a and 10b. As shown in FIG. 2, one flange 10 a is connected to the clamp top plate 5 through a gap between the leaf spring pieces 3,
The other flange 10 b is arranged in the fixed base 2, and transmits the air pressure applied inside the bellows 9 to the movable base 1.

In such a conventional example, the position of the lens can be controlled with high accuracy, and the lens can be realized in a lighter weight and in a smaller space.

[0007]

However, in the optical element moving device using the mechanism using the above-mentioned parallel leaf spring,
There is a problem that the optical element cannot be driven on the optical axis with high accuracy. For example, in the case of a mechanism using a heavy, large-diameter lens as a movable part and a leaf spring as a guide, the natural frequency is relatively low, so that the movable part including the lens vibrates greatly due to disturbance or the like. is there. As a result, the transfer performance of the exposure device tends to decrease, and it has been found that it is desirable to provide the optical element moving device with attenuation characteristics.

An object of the present invention is to drive an optical element for adjusting optical characteristics such as magnification, aberration, and distortion of a projection optical system on the optical axis with high accuracy in view of the problems of the prior art. An object of the present invention is to realize an optical element moving device with a small space and high cleanness.

[0009]

In order to achieve the above object, according to the present invention, there is provided an optical element having drive means and guide means for moving an optical element attached to a movable part relative to a fixed part in an optical axis direction. In the moving device, damper means is provided between the movable portion and the fixed portion.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a preferred embodiment of the present invention, as a damper means, one having a viscous material, one having a vibration-proof rubber, a shock absorber and the like can be used. Such damper means is preferably arranged symmetrically with respect to the optical axis. Although it is also possible to provide the damper means separately from the drive means, it is preferable to dispose the damper means in a bellows in order to prevent dust generation from the damper means.

When the damper means has a viscous material, the viscous material may be oil, grease, gel or the like. Further, the viscous means may be interposed between the planes, or may be arranged between the cylinder and the piston. Further, when the damper means is provided inside the drive means, an opening for mounting the damper means is provided in a flange portion of the drive means, and after the damper means is attached to this opening, an O-ring is fitted into a groove provided in the flange portion. The gap between the damper means and the opening is sealed.

When the damper means is provided with an anti-vibration rubber, the anti-vibration rubber may have a cylindrical shape or a hollow cubic shape. It is preferable to provide one or more holes in the vibration-proof rubber. The anti-vibration rubber can be fixed to the flange portion or the fixed portion and the movable portion by providing a groove or a step in the flange portion or the fixed portion and the movable portion of the driving means, fitting or bonding them, or combining them. preferable. Further, it is preferable that the vibration-proof rubber has the same size as the bellows which is a part of the driving means.

When the damper means has a shock absorber and is provided inside the driving means,
An opening for mounting a shock absorber is provided in a flange portion of the driving means. After the shock absorber is mounted in this opening, a gap between the shock absorber and the opening is sealed by an O-ring fitted in a groove provided in the flange portion.

[0014]

[Function] By providing damper means between the fixed part and the movable part, it is possible to suppress the vibration at the time of driving the optical element,
It is possible to realize high-precision optical element driving while saving space. Further, by providing the damper means inside the driving means or covering it with bellows or the like, high cleanliness can be realized.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. [Embodiment 1] FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus to which the present invention is applied. In FIG. 1, reference numeral 101 denotes a semiconductor wafer to which a photosensitive agent has been applied, which is held on a wafer stage 102 having precise positioning performance. The position of the wafer stage with respect to the reference of the exposure apparatus is measured by the laser interferometer 113. Reference numeral 103 denotes a reticle on which a pattern serving as an original is drawn. Projection optical system 10
Numeral 4 has an optical element moving means 110 according to the present invention, and forms a pattern on a reticle on a wafer. 1
Reference numeral 05 denotes an illumination optical system for illuminating the reticle. 1
Reference numeral 06 denotes an alignment optical system for detecting a positional shift between the pattern on the wafer and the pattern on the reticle created in the previous process. The alignment optical system 106 and the wafer stage 102 expose the pattern on the reticle and the pattern on the wafer after being superimposed on each other. A control device 107 manages the operation of the exposure apparatus. The dimensions of the pattern on the wafer can be measured by the cooperation of the alignment optical system and the wafer stage and the laser interferometer for measuring the position of the wafer stage. The controller sets the position of the optical element at which the optimum optical characteristics are obtained from the dimensions. On the other hand, as a factor of fluctuation of the projection magnification, which is one of the optical characteristics of the projection optical system, there is a change in atmosphere such as atmospheric pressure. The control device 107 determines an optimal position of a lens for adjusting the projection magnification, which is one of the optical elements, from the information on the atmospheric pressure obtained by the atmospheric pressure sensor 108 and the value of the optimal exposure magnification. This is given to the control unit 111 of the optical element moving means. In FIG. 1, 10
9 is a surface plate (lower) supporting the projection optical system 104, and 112 is a surface plate (upper) supported by the surface plate (lower) 109 and supporting the illumination optical system 105 and the alignment optical system 106.

FIG. 2 shows a plan view and a sectional view of a parallel spring type optical element moving mechanism according to an embodiment of the present invention. The mechanism shown in the figure has a movable base 1 on which an adjusting lens 7 for adjusting magnification, aberration and the like and a cell 8 supporting the same are mounted, and a fixed base 2 which forms a part of a fixed part of the projection optical system 104 in FIG. The driving element 4 is formed of a bellows or the like, and has one end fixed to the fixed base 2 and the other end fixed to the clamp top plate 5 connected to the movable base 1. The movable table 1 and the fixed table 2 are connected to each other by a spring mechanism having a pair of leaf spring members having two or more leaf spring pieces 3 and a leaf spring retainer 6 supporting the pair. One leaf spring material is disposed on each of both end surfaces of the movable base 1 and the fixed base 2. The driving element 4 is arranged in a gap between the leaf spring pieces 3, equidistant from the center of the movable base 1, and symmetrically with respect to the optical axis 20. In FIG. 2, 16 is a joint, 21 is a lock screw, 22 is a target plate, 23 is a balance plate, 24
Is a position sensor, and 25 is a sensor holder.

FIG. 3 shows a cross section of the driving element according to the first embodiment of the present invention. The drive element 4 in FIG.
And two flanges 10a and 10b and a support 11a.
And 11b, and a viscous body 12 sandwiched in a gap between the columns 11a and 11b. As shown in FIG. 2, one flange 10a is connected to the clamp top plate 5 through a gap between the leaf spring pieces 3 and the other flange 10a.
b is arranged in the fixed base 2 and transmits the air pressure applied inside the bellows 9 to the movable base 1.

In the case of the driving element 4 in which the viscous body 12 such as grease, oil or gel is disposed inside the bellows 9 as in the present embodiment, a damping characteristic can be added to the operation of the mechanism and the viscous body 12 generates the vibration. High cleanliness can be realized in that dust generated from the compressed air portion is not emitted.

The free length of the bellows 9 is longer than the set length in order to stabilize the operation at the time of driving. However, the thickness of the viscous body 12 disposed inside the bellows 9 is the same as the effective stroke length of the bellows 9. It is desirable to adjust so that

As shown in FIG. 3, the viscous body 12 is arranged by a column 11 provided from flanges 10a and 10b on both sides.
In addition to the arrangement shown in FIG.
As shown in (a), it can be arranged in the gap between the support 11 provided from one flange 10a and the other flange 10b. FIG. 4A shows an example in which a support 11 is provided from an upper flange 10a. The support 11 may be formed integrally with the flange 10a as shown in the figure, or may be formed as a separate part.

FIG. 4B shows a case in which the viscous body 12 is provided in a cylinder arrangement. That is, one flange 10
This is an example in which a viscous body 12 is arranged between a piston 13 which is a support provided on a and a cylinder 14 provided from the other flange 10b.

FIG. 4C shows an example in which a hole is provided in the flange 10b so that the viscous body 12 can be injected into the driving element 4 later. This hole is plugged with the O-ring 15 and the lid 17 after the injection of the viscous material 12. This example is effective when the bellows 9 becomes a high temperature at the time of molding such as a welding type.

FIG. 5A shows that the cylinder 14 is
This is an example of a configuration that can be attached later to Ob. After the viscous body 12 is put in the cylinder 14, the cylinder 14 is fixed to the flange 10b using a screw and a Ο ring 15. This example is also effective when the temperature becomes high during molding, such as when the bellows 9 is a welding type. In this example, the piston may be screwed to the flange 10a or may be formed integrally.

FIG. 5B shows the viscous material 1 in the cylinder 14.
Holes are drilled so that 2 can be injected later. This hole is plugged with an O-ring 15 and a lid 17 after the viscous material 12 is injected. This example is also effective when the temperature becomes high during molding, such as when the bellows 9 is a welding type. In this example, the piston may be screwed to the flange 10a or may be formed integrally.

FIG. 5C shows an example of a configuration in which a hole is formed in the piston 13 so that the viscous body 12 can be injected later. After the viscous material 12 is injected, the O-ring 1
Plug 5 and lid 17. This example is also effective when the temperature becomes high during molding, such as when the bellows 9 is a welding type.
In this example, the piston may be screwed to the flange 10a or may be formed integrally.

As described above, in the case of a damper using the viscous body 12, the vibration damping effect is greater when the thickness of the viscous body 12 is reduced or when the contact area with the viscous body 12 is increased. However, when the space for disposing the damper is narrow as in the present embodiment, particularly in the case of a cylinder type damper,
Providing a plurality of notches as shown in FIG. 6 (b) increases the contact area with the viscous body 12 and obtains a large vibration damping effect, as compared with the piston tip shape as shown in FIG. 6 (a). be able to.

Embodiment 2 FIG. 7 shows a plan view and a sectional view of an optical element moving mechanism according to a second embodiment of the present invention. In this embodiment, a target plate in which a damping mechanism covered with a metal bellows (not shown) or the like is attached to the clamp top plate 5 so that dust generated from the viscous body 12 does not affect the surrounding environment. 22 or fixture 23 and fixture 2
It is configured to be arranged between the sensor holder 25 or the fixture 26 attached to the sensor holder 25. FIG. 7 shows an example in which three vibration damping mechanisms are attached.

As shown in FIG. 8, the vibration damping mechanism sandwiches a viscous body 12 such as oil, grease or gel between planes, or forms a cylinder and places the viscous body 12 between a cylinder 14 and a piston 13. It is desirable to put. Also,
The cylinder 14 and the piston 13
Alternatively, it may be formed integrally with the fixing bracket 23, the sensor holder 25 or the fixing bracket 26, or may be formed separately. 27a. 27b is a relay block.

In the optical element moving mechanism shown in FIG. 7, the clamp top plate 5 is provided with eight chamfers around the optical axis.
A target plate 22 of a sensor 24 for measuring the position of the movable base 1 is mounted at two positions, and a fixing bracket 23 for fixing the movable unit 1 is disposed at two positions. For this reason, the mounting position of the vibration damping mechanism depends on the target plate 2 of these sensors.
2 and the sensor holder 25, and two fixing brackets 2
It is desirable to arrange it at any position between the base 3 and the fixing base 2 or at any one of the remaining five chamfered places of the clamp top plate 5. Here, as the former example, a configuration in which the fixing bracket 23 and the relay block 27a for attaching the vibration damping mechanism are integrated is adopted, and the space efficiency is high. FIG. 9 shows, as an example of the latter, 3
An example in which individual vibration suppression mechanisms are attached is shown.

[Embodiment 3] FIG. 10 shows a cross section of a driving element according to a third embodiment of the present invention. Driving element 4 in FIG.
Is constituted by a bellows 9, two flanges 10 a and 10 b, and an anti-vibration rubber 31. As shown in FIG. 2, one flange 10 a is connected to the clamp top plate 5 through a gap between the leaf spring pieces 3, and the other flange 10 b is disposed in the fixed base 2 and provided inside the bellows 9. The air pressure is transmitted to the movable base 1.

In the case of the driving element 4 in which the anti-vibration rubber 31 is disposed inside the bellows 9 as in this embodiment, it is possible to add a damping characteristic to the operation of the mechanism, and to compress dust and the like generated from the anti-vibration rubber 31. A high degree of cleanliness can be realized in that it is not discharged from the air portion.

The free length of the bellows 9 is longer than the set length in order to stabilize the operation at the time of driving, but the vibration-isolating rubber 31 disposed inside the bellows 9 has the same size as the effective length of the bellows 9. It is desirable.

Both ends of the vibration-isolating rubber 31 are fitted into grooves provided in the flanges 10a and 10b as shown in FIG. 11A, or the flanges 10a and 10b as shown in FIG.
11c or by bonding with an adhesive 32 as shown in FIG. 11 (c) to reduce the displacement in directions other than the driving, and to reduce the flanges 10a, 1b of the bellows 9.
This is desirable in preventing thermal deformation during welding with Ob. Also,
A plurality of methods may be used in combination, such as applying the adhesive 32 to both ends of the vibration-proof rubber 31 and fitting it into the groove.

The anti-vibration rubber 31 preferably has one or more holes in the side surface as shown in FIG. In this case, the effective area of the bellows 9 can be largely used, and the driving force can be increased.

Fourth Embodiment FIG. 13 shows a cross section of a driving element according to a fourth embodiment of the present invention. Driving element 4 in FIG.
Is constituted by a bellows 9, two flanges 10a and 10b, and a shock absorber (buffer) 51. One flange 10a is, as shown in FIG.
The other flange 10 b is connected to the fixed top 2 through the gap between the leaf spring pieces 3, and transmits the air pressure applied to the inside of the bellows 9 to the movable base 1.

In the case of the drive element 4 in which the shock absorber 51 is disposed inside the bellows 9 as in the present embodiment, it is possible to add an attenuation characteristic to the operation of the mechanism and to remove dust and the like generated from the sliding portion into the compressed air portion. It is possible to realize a high degree of cleanliness in that it does not get out of the way.

In order to prevent the compressed air from leaking to the joint between the flanges 10a, 10b and the shock absorber 51,
For example, as shown in FIG. 13, it is also possible to prevent leakage by sealing with an O-ring 53 and fastening the other end with a screw hole that does not penetrate the flange portion.

The shock absorber 51 may have a structure other than the structure using a single hole orifice 52 and oil as shown in FIG.

[Embodiment 5] FIG. 14 is a plan view and a sectional view of an optical element moving mechanism according to a fifth embodiment of the present invention. In this embodiment, a shock absorber such as a shock absorber 51 covered with a metal bellows 54 or the like as shown in FIG. 15 is mounted on a clamp top plate in order to prevent dust and the like generated from the sliding portion from affecting the surrounding environment. 5 and the relay block 27b mounted on the fixed base 2. FIG. 14 shows an example in which three shock absorbers are attached. With this arrangement, the shock absorber 51 can be easily replaced. The shock absorber 51 may have a structure other than the structure using the single-hole orifice 52 and oil as shown in FIG.

In the optical element moving mechanism shown in FIG. 14, the clamp top plate 5 is provided with eight chamfers around the optical axis, and one of them is provided with a sensor target for measuring the position of the movable base 1, and two movable parts are provided. In this configuration, a fixing member 23 for fixing the fixing member 1 is arranged. Therefore, the mounting position of the shock absorber 51 depends on the sensor target 2.
2 and the sensor holder 25, and two fixing brackets 2
It is desirable to arrange it at any position between the base 3 and the fixing base 2 or at any one of the remaining five chamfered places of the clamp top plate 5. Here, as an example of the former, the fixing bracket 23 and the shock absorber 51
Is integrated with the relay block 27a for mounting the, so that space efficiency is good.

FIG. 16 shows an example in which three shock absorbers 51 are attached as one of the latter.

[Embodiment 6] FIG. 17 shows a plan view and a sectional view of an optical element moving mechanism according to a sixth embodiment of the present invention. In this embodiment, the anti-vibration rubber 21 covered with a metal bellows 61 or the like as shown in FIG. 18 is attached to the clamp top plate 5 so that dust generated from the sliding portion does not affect the surrounding environment. It is configured to be disposed between the attached relay block 27a and the relay block 27b attached to the fixed base 2. The example of FIG. 17 shows a case where three vibration isolation rubbers 21 are attached. With this arrangement, the vibration isolating rubber 2
1 can be easily replaced.

In the optical element moving mechanism shown in FIG. 17, the clamp top plate 5 is provided with eight chamfers around the optical axis, one of which is provided with a sensor target for measuring the position of the movable base 1, and the other two movable parts. In this configuration, a fixing member 23 for fixing the fixing member 1 is arranged. For this reason, the mounting position of the vibration-proof rubber 21 may be any of the positions between the sensor target 22 and the sensor holder 25 and between the two fixing brackets 23 and the fixing base 2 (in this case, 2
Each of the relay blocks 27a and 27b can be replaced with a sensor target, a sensor holder, and the fixing bracket 23), or it is desirable to arrange the clamp top plate 5 at any of the remaining five chamfered portions. FIG. 17 shows an example in which the fixing bracket 23 and the relay block 27a for attaching the shock absorber 51 are integrated as an example of the former, and the space efficiency is high.

FIG. 19 shows an example in which three anti-vibration rubbers 21 are attached as one of the latter.

[0045]

[Embodiment of Device Production Method] Next, an embodiment of a device production method using the above-described exposure apparatus or exposure method will be described. FIG. 20 shows a flow of manufacturing a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 21 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the exposure apparatus having the above-described optical element moving device to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a highly integrated device, which was conventionally difficult to produce, at low cost.

[0048]

According to the present invention, an optical element moving device for driving an optical element for adjusting optical characteristics such as magnification, aberration and distortion of a projection optical system with high accuracy on an optical axis can be realized in a space-saving manner. It can be realized with high cleanliness.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an exposure apparatus to which the present invention is applied.

FIG. 2 is a plan view and a sectional view of an optical element moving device using a parallel leaf spring mechanism to which the present invention is applied.

FIG. 3 is a diagram showing a configuration of a damper means according to a first embodiment of the present invention in which a viscous body is disposed in a bellows of a driving element.

FIG. 4 is a diagram showing a modification of the first embodiment.

FIG. 5 is a diagram showing a further modification of the first embodiment.

FIG. 6 is a view showing a modification of the piston in the first embodiment.

FIG. 7 is a plan view and a sectional view of an optical element moving device according to a second embodiment of the present invention in which damper means having a viscous body is disposed outside the mechanism.

FIG. 8 is a diagram showing a detailed configuration of a damper unit in FIG. 7;

FIG. 9 is a plan view and a sectional view of an optical element moving device showing a modification of the second embodiment.

FIG. 10 is a view showing a configuration of a damper means according to a third embodiment of the present invention in which a vibration isolating rubber is disposed in a bellows of a driving element.

FIG. 11 is a diagram showing a modification of the third embodiment.

FIG. 12 is a diagram showing details of an anti-vibration rubber according to a third embodiment.

FIG. 13 is a view showing a configuration of a damper means according to a fourth embodiment of the present invention in which a shock absorber is disposed in a bellows of a driving element.

FIG. 14 is a plan view and a sectional view of an optical element moving device according to a fifth embodiment of the present invention in which damper means having a shock absorber is arranged outside the mechanism.

FIG. 15 is a diagram showing details of damper means in the fifth embodiment.

FIG. 16 is a plan view and a cross-sectional view of an optical element moving device showing a modification of the fifth embodiment.

FIGS. 17A and 17B are a plan view and a sectional view of an optical element moving device according to a sixth embodiment of the present invention in which damper means having an anti-vibration rubber is arranged outside the mechanism.

18 is a diagram showing a detailed configuration of a damper unit in FIG.

FIG. 19 is a plan view and a sectional view of an optical element moving device showing a modification of the sixth embodiment.

FIG. 20 is a diagram showing a flow of manufacturing a micro device.

FIG. 21 is a diagram showing a detailed flow of the wafer process in FIG. 20;

FIG. 22 is a diagram showing a configuration of a conventional driving element.

[Explanation of symbols]

1: movable table, 2: fixed table, 3: leaf spring, 4: drive element,
5: clamp top plate, 6: leaf spring holding, 7: lens,
8: cell, 9: bellows, 10a, 10b: flange,
11: Support, 12: Viscous body, 13: Piston, 14: Cylinder, 15, 53: O-ring, 16: Joint, 17: Lid, 22: Target plate, 23: Balance plate, 25: Sensor holder, 26: Fixed Metal fittings, 27a, 27b: relay block, 31: anti-vibration rubber, 32: adhesive, 51: shock absorber, 54, 61: bellows.

Claims (22)

[Claims] A fixed section, a movable section to which an optical element is fixed, a driving section and a guide section for moving the movable section in an optical axis direction with respect to the fixed section, and the fixed section and the movable section. An optical element moving device having damper means disposed therebetween. 2. The optical element moving device according to claim 1, wherein said damper means is arranged symmetrically with respect to an optical axis. 3. The optical element moving device according to claim 1, wherein said damper means is disposed in a dustproof bellows. 4. The optical element moving device according to claim 1, wherein said damper means is provided inside said driving means. 5. The optical element moving device according to claim 1, wherein said damper means includes a viscous body. 6. The optical element moving device according to claim 4, wherein said damper means includes a viscous body. 7. The optical element moving device according to claim 1, wherein the viscous body is sandwiched between flat surfaces. 8. An optical element moving device according to claim 7, wherein said damper means comprises a cylinder and a piston and a viscous body disposed between said cylinder and said piston. 9. The method according to claim 5, wherein the viscous body is oil, grease, or gel.
4. The optical element moving device according to claim 1. 10. The driving means comprises a pair of flange portions fixed to the fixed portion and the movable portion, respectively, and an actuator disposed between the flange portions, and the damper means is provided on at least one of the flange portions. 7. The optical element moving device according to claim 6, further comprising an opening for mounting, a groove and an O-ring for sealing a gap with the opening after the damper means is mounted. 11. The optical element moving device according to claim 1, wherein said damper means comprises a cylindrical or hollow rubber vibration insulator. 12. A method according to claim 1, wherein said vibration-proof rubber is fixed to said fixed part and movable part by providing a groove or a step in a vibration-proof rubber mounting part of said fixed part and movable part, or fitted by bonding. The optical element moving device according to claim 11, wherein: 13. The optical element moving device according to claim 4, wherein said damper means comprises a cylindrical or hollow vibration-proof rubber. 14. The driving means comprises a pair of flange portions fixed to the fixed portion and the movable portion, respectively, and an actuator disposed between the flange portions, and the vibration-proof rubber is provided on the flange portions. 14. The optical element moving device according to claim 13, wherein the optical element moving device is fixed to the flange portion by being fitted into a groove or a step provided or being adhered to the flange portion. 15. The driving means has a driving bellows for driving the movable portion by an action of an internal fluid, and a length of the vibration isolating rubber in the optical axis direction is the same as that of the driving bellows. The optical element moving device according to claim 13, wherein: 16. The optical element moving device according to claim 11, wherein the vibration isolating rubber has one or more holes. 17. The optical element moving device according to claim 1, wherein said damper means comprises a shock absorber. 18. The optical element moving device according to claim 4, wherein said damper means comprises a shock absorber. 19. The drive means comprises a pair of flange portions fixed to the fixed portion and the movable portion, respectively, and an actuator disposed between the flange portions, and the shock absorber is attached to at least one of the flange portions. 19. The optical element moving device according to claim 18, further comprising an opening for attachment, a groove and an O-ring for sealing a gap between the shock absorber and the opening after attaching the shock absorber. 20. A bellows having damper means therein. 21. An exposure apparatus, comprising: an optical device having the optical element moving device according to claim 1 as a projection optical system, and a unit for projecting and exposing a reticle pattern onto a wafer. apparatus. 22. A semiconductor device manufactured by using the exposure apparatus according to claim 21.