JP3445105B2 - Optical element moving device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element moving device for adjusting optical characteristics such as magnification, aberration and distortion of a projection optical system such as an exposure device, and more particularly to a semiconductor printing device (mask aligner). ), Etc., is used in an additional optical system for obtaining a more accurate imaging relationship when projecting and exposing an image of an original plate (eg, mask and reticle) onto an object (eg, wafer). Element moving device.

[0002]

2. Description of the Related Art A semiconductor exposure apparatus is an apparatus for transferring an original plate (reticle) having many different types of patterns onto a silicon wafer (substrate). In order to create highly integrated circuits, not only resolution performance but also overlay accuracy is essential.

The overlay error in the semiconductor exposure apparatus is classified into alignment error, image distortion, and magnification error. The alignment error is reduced by adjusting the relative position between the original plate (reticle) and the substrate (wafer). On the other hand, the magnification error can be adjusted by moving a part of the projection optical system in the optical axis direction. When moving in the optical axis direction, it is necessary to prevent other components other than the moving direction, especially parallel eccentricity and tilt error from increasing.

Conventionally, as a projection magnification adjusting apparatus for a semiconductor exposure apparatus, an optical element moving apparatus having a mechanism using parallel leaf springs has been devised as disclosed in Japanese Patent Laid-Open No. 9-106944. FIG. 1 is an overall view of an exposure apparatus equipped with this type of optical element moving device, and FIG. 2 is a partially cutaway plan view and a sectional view showing the mechanism disclosed in the above publication. As shown in FIG. 2, this optical element moving device includes a movable table 1 on which a lens 7 for adjusting magnification, aberration, etc., and a cell 8 supporting the lens are mounted, and a part of a fixed portion of the projection optical system 104 of FIG. It has a fixed base 2. Drive element 4
Is constituted by a bellows or the like, and one end thereof is fixed to the fixed base 2 and the other end thereof is fixed to the clamp top plate 5 connected to the movable base 1. Movable table 1 and fixed table 2
Is connected by a spring mechanism having a pair of leaf spring members having two or more leaf spring pieces 3 and a leaf spring retainer 6 supporting the pair. One leaf spring material is arranged on each of both end faces of the movable base 1 and the fixed base 2. The drive element 4 is disposed in the gap between the leaf spring pieces 3 at an equal distance from the center of the movable table 1 and at a position symmetrical to the optical axis 20.

FIG. 22 shows the drive element 4 described in the above publication.
The outline of is shown. The drive element 4 of the same figure includes bellows 9 and 2
It is constituted by individual flanges 10a and 10b. Further, the one flange 10a is connected to the clamp top plate 5 through the gap of the leaf spring piece 3 as shown in FIG.
The other flange 10b is arranged in the fixed base 2 and transmits the air pressure applied inside the bellows 9 to the movable base 1.

[0006] In such a conventional example, the position of the lens can be controlled with high accuracy, and it can be realized in a lighter weight and in a smaller space.

[0007]

However, in the optical element moving device based on the mechanism using the parallel leaf springs described above,
There is a problem that it may not be possible to drive the optical element on the optical axis with high accuracy. For example, in the case of a mechanism in which a lens having a large weight and a large diameter is used as a movable part and a leaf spring is used as a guide, since the natural frequency is relatively low, there is a problem that the movable part including the lens vibrates greatly due to disturbance or the like. is there. As a result, the transfer performance of the exposure apparatus tends to deteriorate, and it has been found that it is desirable to provide the optical element moving device with damping characteristics.

In view of the problems of the prior art, an object of the present invention is to drive an optical element for adjusting optical characteristics such as magnification, aberration, distortion of a projection optical system on the optical axis with high accuracy. It is to realize an optical element moving device with space saving and high cleanliness.

[0009]

In order to achieve the above object, in the present invention, a fixed portion and a movable portion fixed with an optical element are provided.
If, have a driving means and guiding means is moved in the optical axis direction the movable portion relative to said fixed portion, said drive means
Is a flange fixed to each of the fixed part and the movable part.
And a pair of flange portions formed by a flange portion, and the movable portion is driven by the action of an internal fluid.
A moving drive bellows and a drive bellows inside the drive bellows.
It is characterized in that it is configured by a damper means placed .

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In a preferred embodiment of the present invention, the damper means may be a viscous body, a vibrating rubber, a shock absorber, or the like. Such damper means is preferably arranged symmetrically with respect to the optical axis. Further, although it can be provided inside the drive means, it is preferable to arrange the damper means inside the bellows in order to prevent dust generation from the damper means, particularly when the damper means is provided separately from the drive means.

When the damper means has a viscous body, oil, grease, gel or the like can be used as the viscous body. Further, the viscous means may be sandwiched between planes, or may be arranged between the cylinder and the piston. When the damper means is provided inside the drive means, an opening for attaching the damper means is provided in the flange portion of the drive means, and after the damper means is attached to this opening, an O-ring fitted in a groove provided in the flange portion is used. , The gap between the damper means and the opening is sealed.

When the damper means is provided with a vibration-proof rubber, the vibration-proof rubber may have a cylindrical shape or a hollow cubic shape. It is preferable to provide one or more holes in the vibration-proof rubber. The anti-vibration rubber may be fitted or adhered by providing a groove or a step in the flange portion or the fixed portion and the movable portion of the drive means, or may be combined with them to be fixed to the flange portion or the fixed portion and the movable portion. preferable. Further, it is preferable that the anti-vibration rubber has the same size as the bellows which is a part of the driving means.

When the damper means is provided with a shock absorber and is provided inside the drive means,
An opening for attaching the shock absorber is provided in the flange portion of the drive means, and after the shock absorber is attached to this opening, the O-ring fitted in the groove provided in the flange portion seals the gap between the shock absorber and the opening.

[0014]

By providing the damper means between the fixed portion and the movable portion, it is possible to suppress the vibration when the optical element is driven,
It is possible to realize highly accurate optical element driving while saving space. Further, a high degree of cleanliness can be realized by providing the damper means inside the driving means or by covering it with a bellows or the like.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. [Embodiment 1] FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus to which the present invention is applied. In the figure, reference numeral 101 denotes a semiconductor wafer coated with a photosensitive agent, which is held on a wafer stage 102 having precise positioning performance. The position of the wafer stage with respect to the reference of the exposure apparatus is measured by the laser interferometer 113. Reference numeral 103 is a reticle on which a pattern serving as an original plate is drawn. Projection optical system 10
Reference numeral 4 has an optical element moving means 110 according to the present invention, which images the pattern on the reticle onto the wafer. 1
Reference numeral 05 is an illumination optical system for illuminating the reticle. 1
Reference numeral 06 is an alignment optical system that detects a positional deviation between the pattern on the wafer and the pattern on the reticle created in the previous step. The alignment optical system 106 and the wafer stage 102 superimpose the pattern on the reticle and the pattern on the wafer before exposure. Reference numeral 107 is a control device that manages the operation of such an exposure apparatus. The alignment optical system and the laser interferometer that measures the position of the wafer stage and the wafer stage cooperate with each other to measure the dimensions of the pattern on the wafer. The controller sets the position of the optical element that obtains optimum optical characteristics from this dimension. On the other hand, a change factor of the projection magnification, which is one of the optical characteristics of the projection optical system, is a change in atmosphere such as atmospheric pressure. The control device 107 determines the optimum position of the projection magnification adjusting lens, which is one of the optical elements, from the information on the atmospheric pressure obtained by the atmospheric pressure sensor 108 and the value of the optimum exposure magnification, and issues a command for that position. It is given to the control unit 111 of the optical element moving means. In FIG. 1, 10
Reference numeral 9 is a surface plate (lower) that supports the projection optical system 104, and 112 is a surface plate (upper) that is supported by the surface plate (lower) 109 and supports the illumination optical system 105 and the alignment optical system 106.

FIG. 2 shows a plan view and a sectional view of a parallel spring type optical element moving mechanism according to an embodiment of the present invention. The mechanism shown in FIG. 1 has a movable base 1 on which a lens 7 for adjusting magnification, aberration and the like and a cell 8 supporting the same are mounted, and a fixed base 2 which is a part of a fixed portion of the projection optical system 104 in FIG. The drive element 4 is composed of a bellows or the like, and one end thereof is fixed to the fixed base 2 and the other end thereof is fixed to a clamp top plate 5 connected to the movable base 1. The movable base 1 and the fixed base 2 are connected by a spring mechanism having a pair of leaf spring materials having two or more leaf spring pieces 3 and a leaf spring retainer 6 supporting the pair. One leaf spring material is arranged on each of both end faces of the movable base 1 and the fixed base 2. The drive element 4 is disposed in the gap between the leaf spring pieces 3 at an equal distance from the center of the movable table 1 and at a position symmetrical to the optical axis 20. In FIG. 2, 16 is a joint, 21 is a locking screw, 22 is a target plate, 23 is a balance plate, 24
Is a position sensor, and 25 is a sensor holder.

FIG. 3 shows a cross section of a drive element according to a first embodiment of the invention. The drive element 4 in the figure is a bellows 9.
And two flanges 10a and 10b and a post 11a
And 11b, and the viscous body 12 sandwiched between the columns 11a and 11b. Further, as shown in FIG. 2, one flange 10 a is connected to the clamp top plate 5 through the gap of the leaf spring piece 3 and the other flange 10 a.
The b is arranged in the fixed base 2 and transmits the air pressure applied to the inside of the bellows 9 to the movable base 1.

In the case of the drive element 4 in which the viscous body 12 such as grease, oil or gel is arranged inside the bellows 9 as in the present embodiment, a damping characteristic can be added to the operation of the mechanism, and the viscous body 12 generates the damping characteristic. A high degree of cleanliness can be achieved in that dust that does not come out of the compressed air portion is discharged.

The free length of the bellows 9 is longer than the set length for stable operation during driving, but the thickness of the viscous body 12 disposed inside the bellows 9 is the same as the effective stroke length of the bellows 9. It is desirable to adjust so that

As shown in FIG. 3, the viscous body 12 is arranged in such a manner that the column 11 is provided with the flanges 10a and 10b on both sides.
In addition to being able to be placed in the gap between a and 11b, FIG.
As shown in (a), it can be arranged in the gap between the column 11 provided from the flange 10a on one side and the flange 10b on the other side. FIG. 4A shows an example in which the support 11 is provided from the upper flange 10a. The column 11 may be formed integrally with the flange 10a as shown in the figure, or may be formed as a separate component.

FIG. 4B shows the case where the viscous body 12 is provided in the cylinder arrangement. That is, one flange 10
This is an example in which the viscous body 12 is arranged between the piston 13 which is a column provided in a and the cylinder 14 which is provided from the other flange 10b.

FIG. 4C shows an example in which a hole is provided in the flange 10b so that the viscous body 12 can be injected into the drive element 4 later. This hole is plugged with an O-ring 15 and a lid 17 after pouring the viscous body 12. This example is effective when the bellows 9 has a high temperature during molding, such as a welding type.

FIG. 5 (a) shows the cylinder 14 with a flange l.
It is a configuration example that can be attached to 0b later. After inserting the viscous body 12, the cylinder 14 is fixed to the flange 10b using a screw and an O-ring 15. This example is also effective when the bellows 9 has a high temperature during molding, such as a welding type. In the case of this example, the piston may be screwed to the flange 10a or integrally formed.

FIG. 5B shows that the viscous body 1 is placed inside the cylinder 14.
The holes are drilled so that 2 can be injected later. This hole is plugged with an O-ring 15 and a lid 17 after injecting the viscous body 12. This example is also effective when the bellows 9 has a high temperature during molding, such as a welding type. In the case of this example, the piston may be screwed to the flange 10a or integrally formed.

FIG. 5C shows an example of a structure in which a hole is formed in the piston 13 so that the viscous body 12 can be injected later. This hole is for the O-ring 1 after the viscous body 12 is injected.
Cap with 5 and lid 17. This example is also effective when the bellows 9 has a high temperature during molding, such as a welding type.
In the case of this example, the piston may be screwed to the flange 10a or integrally formed.

As described above, in the case of the damper using the viscous body 12, the damping effect is greater when the thickness of the viscous body 12 is reduced or when the contact area with the viscous body 12 is increased. However, when the space for arranging the damper is small as in the present embodiment, particularly in the case of the cylinder type damper,
The contact area with the viscous body 12 is increased by providing a plurality of notches as shown in FIG. 6B rather than the tip shape of the piston as shown in FIG. 6A, and a large damping effect is obtained. be able to.

[Embodiment 2] FIG. 7 shows a plan view and a sectional view of an optical element moving mechanism according to a second embodiment of the present invention. In this embodiment, since the dust or the like generated from the viscous body 12 does not affect the surrounding environment, a vibration control mechanism covered with a metal bellows (not shown) is attached to the clamp top plate 5 as a target plate. 22 or fixing bracket 23 and fixing base 2
It is arranged between the sensor holder 25 or the fixing metal fitting 26 attached to. The example of FIG. 7 shows a case where three damping mechanisms are attached.

As shown in FIG. 8, the damping mechanism has a viscous body 12 such as oil, grease or gel sandwiched between planes, or is formed into a cylinder so that the viscous body 12 is provided between a cylinder 14 and a piston 13. It is desirable to put it in. Also,
The cylinder 14 and the piston 13 are connected to the target plate 22.
Alternatively, it may be formed integrally with the fixing member 23, or the sensor holder 25 or the fixing member 26, or may be formed separately. 27a. 27b is a relay block.

In the optical element moving mechanism shown in FIG. 7, the chamfer top plate 5 is provided with eight chamfers around the optical axis.
The target plate 22 of the sensor 24 for measuring the position of the movable table 1 is attached to the two places, and the fixing fittings 23 for fixing the movable part 1 are arranged in two places. For this reason, the mounting position of the vibration damping mechanism is set at the target plate 2
2 and the sensor holder 25, and two fixing brackets 2
It is desirable to dispose it at any position between 3 and the fixed base 2, or at any of the five chamfered positions where the clamp top plate 5 remains. Here, as an example of the former, the fixing bracket 23 and the relay block 27a to which the vibration damping mechanism is attached are integrated, and the space efficiency is good. FIG. 9 shows an example of the latter, 3
An example in which individual vibration damping mechanisms are attached is shown.

[Embodiment 3] FIG. 10 shows a cross section of a drive element according to a third embodiment of the present invention. Drive element 4 in FIG.
Is composed of a bellows 9, two flanges 10a and 10b, and a vibration-proof rubber 31. As shown in FIG. 2, one flange 10 a is connected to the clamp top plate 5 through the gap of the leaf spring piece 3, and the other flange 10 b is arranged in the fixed base 2 and provided inside the bellows 9. The air pressure is transmitted to the movable table 1.

In the case of the drive element 4 in which the vibration isolating rubber 31 is arranged inside the bellows 9 as in the present embodiment, it is possible to add a damping characteristic to the operation of the mechanism and to compress dust and the like generated from the vibration isolating rubber 31. High cleanliness can be achieved in that it does not come out of the air section.

The free length of the bellows 9 is set longer than the set length in order to stabilize the operation during driving, but the antivibration rubber 31 arranged inside the bellows 9 has the same size as the effective length of the bellows 9. Is desirable.

Both ends of the anti-vibration rubber 31 are fitted into the grooves formed in the flanges 10a and 10b as shown in FIG. 11 (a), or the flanges 10a and 10b are shown in FIG. 11 (b).
It is possible to reduce the deviation in the direction other than the driving by fitting it into the step provided on the base plate or by adhering it with the adhesive 32 as shown in FIG.
It is desirable to prevent thermal deformation during welding with 0b. Also,
A plurality of methods may be used in combination, such as applying the adhesive 32 to both ends of the antivibration rubber 31 and then fitting the adhesive 32 into the groove.

As shown in FIG. 12, the vibration-proof rubber 31 preferably has one or more holes on its side surface. In this case, a large effective area of the bellows 9 can be used, and the driving force can be increased.

[Fourth Embodiment] FIG. 13 is a sectional view of a drive element according to a fourth embodiment of the present invention. Drive element 4 in FIG.
Is composed of a bellows 9, two flanges 10a and 10b, and a shock absorber (shock absorber) 51. One flange 10a, as shown in FIG.
The flange 10b is connected to the clamp top plate 5 through the gap of the leaf spring piece 3, and the other flange 10b is arranged in the fixed base 2 and transmits the air pressure applied inside the bellows 9 to the movable base 1.

In the case of the drive element 4 in which the shock absorber 51 is arranged inside the bellows 9 as in the present embodiment, damping characteristics can be added to the operation of the mechanism, and dust generated from the sliding portion can be compressed air portion. A high degree of cleanliness can be achieved in that it does not get out of the room.

In order to prevent compressed air from leaking to the joint between the flanges 10a and 10b and the shock absorber 51,
For example, as shown in FIG. 13, it may be possible to prevent leakage by sealing with an O-ring 53 and fastening the other end with a screw hole that does not penetrate the flange portion.

The shock absorber 51 may have a structure other than the structure using the single hole orifice 52 and oil as shown in FIG.

[Embodiment 5] FIG. 14 shows a plan view and a sectional view of an optical element moving mechanism according to a fifth embodiment of the present invention. In this embodiment, since the dust generated from the sliding portion does not affect the surrounding environment, a shock absorber 51 covered with a metal bellows 54 or the like as shown in FIG. 5 is arranged between the relay block 27a attached to the No. 5 and the relay block 27b attached to the fixed base 2. In the example of FIG. 14, the case where three shock absorbers are attached is shown. With this arrangement, the shock absorber 51 can be easily replaced. The shock absorber 51 may have a structure other than the structure using the single hole orifice 52 and oil as shown in FIG.

In the optical element moving mechanism shown in FIG. 14, the clamp top plate 5 is provided with eight chamfers around the optical axis, one of which is provided with a sensor target for measuring the position of the movable table 1, and two movable parts are provided. The fixing metal fitting 23 for fixing 1 is arranged. For this reason, the mounting position of the shock absorber 51 is set to the sensor target 2
2 and the sensor holder 25, and two fixing brackets 2
It is desirable to dispose it at any position between 3 and the fixed base 2, or at any of the five chamfered positions where the clamp top plate 5 remains. Here, as an example of the former, the fixing bracket 23 and the shock absorber 51
The relay block 27a for mounting is integrated, and space efficiency is good.

FIG. 16 shows an example in which three shock absorbers 51 are attached as an example of the latter.

[Embodiment 6] FIG. 17 shows a plan view and a sectional view of an optical element moving mechanism according to a sixth embodiment of the present invention. In this embodiment, since the dust or the like generated from the sliding portion does not affect the surrounding environment, the vibration damping rubber 21 covered with the metal bellows 61 or the like is attached to the clamp top plate 5 as shown in FIG. It is configured to be arranged between the attached relay block 27a and the relay block 27b attached to the fixed base 2. In the example of FIG. 17, the case where three anti-vibration rubbers 21 are attached is shown. With this arrangement, the anti-vibration rubber 2
It is also easy to replace 1.

In the optical element moving mechanism shown in FIG. 17, the clamp top plate 5 is provided with eight chamfers around the optical axis, one of which is provided with a sensor target for measuring the position of the movable table 1, and two movable parts are provided. The fixing metal fitting 23 for fixing 1 is arranged. For this reason, the mounting position of the anti-vibration rubber 21 should be set between the sensor target 22 and the sensor holder 25, and between the two fixing fittings 23 and the fixing base 2 (in this case, Two
The individual relay blocks 27a and 27b can be respectively substituted by the sensor target, the sensor holder, and the fixing metal fitting 23), or it is desirable to arrange the relay blocks 27a and 27b at any of the five chamfered positions where the clamp top plate 5 remains. As an example of the former, FIG. 17 has a configuration in which the fixing bracket 23 and the relay block 27a to which the shock absorber 51 is attached are integrated, and space efficiency is good.

FIG. 19 shows an example in which three anti-vibration rubbers 21 are attached as an example of the latter.

[0045]

[Embodiment of Device Manufacturing Method] Next, an embodiment of a device manufacturing method using the above-described exposure apparatus or exposure method will be described. FIG. 20 shows a flow of manufacturing minute devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. In step 2 (mask manufacturing), a mask having the designed pattern is manufactured. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip by using the wafer manufactured in step 4, such as an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

FIG. 21 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus having the above-described optical element moving device. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, a highly integrated device, which has been difficult to produce in the past, can be produced at a low cost.

[0048]

According to the present invention, there is provided a space-saving optical element moving device for driving an optical element for adjusting optical characteristics such as magnification, aberration and distortion of a projection optical system with high accuracy on an optical axis. It can be realized with high cleanliness.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an exposure apparatus to which the present invention is applied.

FIG. 2 is a plan view and a sectional view of an optical element moving device using a parallel leaf spring mechanism to which the present invention is applied.

FIG. 3 is a diagram showing a configuration of a damper means according to a first embodiment of the present invention in which a viscous body is arranged in a bellows of a drive element.

FIG. 4 is a diagram showing a modification of the first embodiment.

FIG. 5 is a diagram showing a further modification of the first embodiment.

FIG. 6 is a diagram showing a modified example of the piston in the first embodiment.

7A and 7B are a plan view and a cross-sectional view of an optical element moving device according to a second embodiment of the present invention, in which damper means having a viscous body is arranged outside the mechanism.

FIG. 8 is a diagram showing a detailed configuration of damper means in FIG.

9A and 9B are a plan view and a sectional view of an optical element moving device showing a modified example of the second embodiment.

FIG. 10 is a diagram showing a configuration of a damper means according to a third embodiment of the present invention in which a vibration-proof rubber is arranged inside a bellows of a drive element.

FIG. 11 is a diagram showing a modification of the third embodiment.

FIG. 12 is a diagram showing details of a vibration-proof rubber according to a third embodiment.

FIG. 13 is a diagram showing a configuration of a damper means according to a fourth embodiment of the present invention in which a shock absorber is arranged inside a bellows of a drive element.

14A and 14B are a plan view and a sectional view of an optical element moving device according to a fifth embodiment of the present invention, in which a damper means having a shock absorber is arranged outside the mechanism.

FIG. 15 is a diagram showing details of damper means in the fifth embodiment.

FIG. 16 is a plan view and a sectional view of an optical element moving device showing a modification of the fifth embodiment.

17A and 17B are a plan view and a cross-sectional view of an optical element moving device according to a sixth embodiment of the present invention, in which a damper means having a vibration proof rubber is arranged outside the mechanism.

FIG. 18 is a diagram showing a detailed configuration of damper means in FIG.

FIG. 19 is a plan view and a cross-sectional view of an optical element moving device showing a modification of the sixth embodiment.

FIG. 20 is a diagram showing a flow of manufacturing a microdevice.

21 is a diagram showing a detailed flow of the wafer process in FIG. 20. FIG.

FIG. 22 is a diagram showing a configuration of a conventional drive element.

[Explanation of symbols]

1: movable base, 2: fixed base, 3: leaf spring, 4: drive element,
5: Clamp top plate, 6: Leaf spring holder, 7: Lens,
8: cell, 9: bellows, 10a, 10b: flange,
11: Strut, 12: Viscous body, 13: Piston, 14: Cylinder, 15, 53: O-ring, 16: Joint, 17: Lid, 22: Target plate, 23: Balance plate, 25: Sensor holder, 26: Fixed Metal fittings 27a, 27b: relay block, 31: anti-vibration rubber, 32: adhesive, 51: shock absorber, 54, 61: bellows.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-6-313833 (JP, A) JP-A-62-65243 (JP, A) JP-A-4-222928 (JP, A) JP-A-5- 134155 (JP, A) JP 3-154235 (JP, A) JP 8-63768 (JP, A) JP 9-128776 (JP, A) JP 6-204106 (JP, A) JP-A-3-100935 (JP, A) JP-A-9-106944 (JP, A) Actual development Shou 60-173126 (JP, U) Actual development HEI 5-67914 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) G02B ⁷ /00-7/16 H01L 21 / 30,21 / 46 G03F ⁷ /20-7/24 G03F 9/00-9/02 G11B 7/08-7/22

Claims (10)

(57) [Claims] And 1. A fixing unit includes a movable portion to fix the optical element, and a drive means and guide means for moving the movable part in the optical axis direction with respect to the fixed portion, the driving means
Is a flange fixed to each of the fixed part and the movable part.
A pair of flange portions formed of a flange portion, a driving bellows provided between the pair of flange portions and driving the movable portion by the action of an internal fluid, and a driving bellows disposed inside the driving bellows.
An optical element moving device , characterized in that the optical element moving device is configured by a mounted damper means. 2. The optical element moving device according to claim 1, wherein the damper means is arranged symmetrically about an optical axis. Wherein said damper means, optical element moving device according to claim 1, characterized by comprising a viscous material. 4. The optical element moving device according to claim 3 , wherein the viscous body is oil, grease or gel. An opening 5. A provided for attaching said damper means to at least one of the pair of flange portions, after attaching the damper, the flange to seal the gap between said damper means and opening Groove provided in the part
When the optical element moving device according to claim 3, characterized by having a O-ring for fitting to the groove. Wherein said damper means, optical element moving device according to claim 1, characterized by comprising a tubular or hollow rubber vibration insulator. 7. The optical element moving device according to claim 6 , wherein the anti-vibration rubber has one or more holes. 8. The damper means comprises a single hole orifice and an orifice.
Claim, characterized in that it comprises structures using yl 1
The described optical element moving device. 9. comprises an optical element moving device according to any one of claims 1-8, imaging the pattern of a reticle onto a wafer
An exposure apparatus having a projection optical system for 10. Using the exposure apparatus according to claim 9,
Exposing the exposed wafer and developing the exposed wafer
Of a device characterized by the following steps:
Method.