JPH1140966A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPH1140966A
JPH1140966A JP18959797A JP18959797A JPH1140966A JP H1140966 A JPH1140966 A JP H1140966A JP 18959797 A JP18959797 A JP 18959797A JP 18959797 A JP18959797 A JP 18959797A JP H1140966 A JPH1140966 A JP H1140966A
Authority
JP
Japan
Prior art keywords
chassis
circuit board
printed circuit
hole
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP18959797A
Other languages
Japanese (ja)
Inventor
Masashi Suzuki
正志 鈴木
Norio Suzuki
典雄 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP18959797A priority Critical patent/JPH1140966A/en
Publication of JPH1140966A publication Critical patent/JPH1140966A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Abstract

PROBLEM TO BE SOLVED: To mount a heating part and a chassis at the same time and to improve workability in assembling them by placing heating part on the surface of a printed board, placing the other surface of the printed board on a chassis and by screwing a screw into a threaded hole of the chassis through the holes of the heating part and the board to mount the heating part. SOLUTION: A heating part 3 is placed on a printed board with the surface of the main part 3b down thereon. A hole 3a made in the main part 3b is soldered to the hole 2b of the board 2. The board 2 is placed on the bottom plate 1a of a chassis 1, in a state where the hole 2b conforms with the screw hole 1b of the bottom plate 1a. A screw 5 is passed through matches a washer, the hole 3a of the main part 3b the hole 2b of the board 2, and is screwed into the screw hole 1b of the chassis 1 for mounting the heating part 3 and the board 2 on the chassis 1. In this way, the heating part 3 and the chassis 1 are mounted concurrently to improve workability in assembling them.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はパーソナルコンピュ
ータのディスプレイを利用してTV放送を受信し、表示
するのに使用されるチューナ等に適用して好適な電子機
器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus suitable for use in a tuner or the like used for receiving and displaying a TV broadcast using a display of a personal computer.

【0002】[0002]

【従来の技術】従来における電子機器は、図5に示すよ
うに、金属板から成る箱形のシャーシ11の内部に、電
子部品(図示せず)を取り付けたプリント基板12が適
宜手段で取り付けられている。また、パワートランジス
タ等の発熱部品13は、本体部13aと端子部13bと
を有し、この発熱部品13は、端子部13bをプリント
基板12の導電パターン(図示せず)に半田付けされ、
プリント基板12に対して直立状態で取り付けられてい
る。また、発熱部品13の本体部13aは、シャーシ1
1の側板11aに重ね合わされ、ネジ14で側板11a
に取り付けられ、発熱部品13の発熱を、側板11aを
介して放熱するようになっている。
2. Description of the Related Art As shown in FIG. 5, in a conventional electronic device, a printed circuit board 12 on which electronic components (not shown) are mounted is mounted by a suitable means inside a box-shaped chassis 11 made of a metal plate. ing. The heat-generating component 13 such as a power transistor has a main body 13a and a terminal 13b. The heat-generating component 13 has the terminal 13b soldered to a conductive pattern (not shown) on the printed circuit board 12.
It is mounted upright on the printed circuit board 12. The main body 13a of the heat generating component 13 is
1 side plate 11a, and the side plate 11a
The heat generated by the heat generating component 13 is radiated through the side plate 11a.

【0003】[0003]

【発明が解決しようとする課題】従来の電子機器は、発
熱部品13がプリント基板12に対して直立状態で取り
付けられているため、電子機器が大型に成るという問題
がある。また、プリント基板1は、ネジ14とは別部品
による取付が必要で、部品点数が多くなって、生産性が
悪く、コスト高に成るという問題がある。
The conventional electronic equipment has a problem that the electronic equipment becomes large because the heat-generating component 13 is mounted upright on the printed circuit board 12. In addition, the printed circuit board 1 needs to be attached by a component other than the screw 14, and the number of components is increased, so that there is a problem that productivity is deteriorated and cost is increased.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
の第1の解決手段として、ネジ孔を有する金属板から成
るシャーシと、導電パターンを有するプリント基板と、
本体部を有する発熱部品と、前記発熱部品を取り付ける
ためのネジとを備え、前記プリント基板の一面に前記発
熱部品の本体部の一面を載置し、また、前記プリント基
板の他面を前記シャーシに載置し、前記ネジを、前記発
熱部品と前記プリント基板の孔に挿通して前記シャーシ
のネジ孔にねじ込みして、前記発熱部品を取り付けた構
成とした。更に、第2の解決手段として、前記発熱部品
のプリント基板への載置面と、前記シャーシの前記プリ
ント基板への載置面とにおいて、前記プリント基板に前
記導電パターンを設けた構成とした。
As a first means for solving the above problems, a chassis made of a metal plate having screw holes, a printed circuit board having a conductive pattern,
A heat-generating component having a main body, and a screw for attaching the heat-generating component, wherein one surface of the main body of the heat-generating component is mounted on one surface of the printed circuit board, and the other surface of the printed circuit board is mounted on the chassis. And the screw is inserted into the hole of the heat-generating component and the printed circuit board and screwed into the screw hole of the chassis to attach the heat-generating component. Further, as a second solution, the conductive pattern is provided on the printed circuit board on the surface on which the heat-generating component is mounted on the printed circuit board and on the surface on which the chassis is mounted on the printed circuit board.

【0005】[0005]

【発明の実施の形態】本発明の電子機器を図1、図2に
基づいて説明すると、図1は本発明の電子機器の要部の
側面図、図2はその断面図である。そして、本発明の電
子機器は、図1、図2に示すように、金属板から成る箱
形のシャーシ1の底板1aには、ネジ孔1bが設けられ
ている。また、プリント基板2には、その両面に導電パ
ターン2aが形成され、この導電パターン2aには、各
種の電子部品(図示せず)が半田付けされて取り付けら
れている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic apparatus according to the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a side view of a main part of the electronic apparatus according to the present invention, and FIG. As shown in FIGS. 1 and 2, in the electronic device of the present invention, a screw hole 1b is provided in a bottom plate 1a of a box-shaped chassis 1 made of a metal plate. Further, conductive patterns 2a are formed on both sides of the printed board 2, and various electronic components (not shown) are attached to the conductive patterns 2a by soldering.

【0006】また、パワートランジスタ、レギュレータ
等から成る発熱部品3は、孔3aを有する本体部3b
と、本体部3bから導出された端子部3cとを備えてい
る。そして、発熱部品3は、その本体部3bの一面をプ
リント基板2の一面に載置した伏せ型の状態とし、本体
部3bに設けた孔3aを、プリント基板2の孔2bに合
わせた状態で、端子部3cを導電パターン2aに半田付
けして取り付けられている。そして、このように、発熱
部品3を取り付けたプリント基板2は、孔2bを底板1
aのネジ孔1bに合わした状態で、その他面をシャーシ
1の底板1aに載置し、ワッシャー4と本体部3の孔3
aとプリント基板2の孔2bとにネジ5を挿通し、この
ネジ5をシャーシ1のネジ孔1bにねじ込んで、発熱部
品3とプリント基板2をシャーシ1に取り付けている。
そして、発熱部品3の発熱は、プリント基板2、及びシ
ャーシ1と通して放熱するようになっている。
Further, a heat generating component 3 including a power transistor, a regulator, and the like includes a main body 3b having a hole 3a.
And a terminal 3c derived from the main body 3b. The heat-generating component 3 is in a state in which one surface of the main body 3b is placed on one surface of the printed circuit board 2 in a face-down state, and the holes 3a provided in the main body 3b are aligned with the holes 2b of the printed circuit board 2. The terminal 3c is attached to the conductive pattern 2a by soldering. The printed board 2 on which the heat-generating component 3 is attached is formed with the hole 2b in the bottom plate 1 as described above.
a, the other surface is placed on the bottom plate 1a of the chassis 1, and the washer 4 and the hole 3 of the main body 3 are fitted.
a, and the screw 5 is inserted into the hole 2b of the printed circuit board 2, and the screw 5 is screwed into the screw hole 1b of the chassis 1 to attach the heat generating component 3 and the printed circuit board 2 to the chassis 1.
The heat generated by the heat generating component 3 is radiated through the printed circuit board 2 and the chassis 1.

【0007】また、図3、図4は、本発明の電子機器の
他の実施形態を示し、図3は電子機器の要部の断面図、
図4は本発明の電子機器に係るプリント基板の要部の平
面図であって、プリント基板2における発熱部品3の載
置部分、及びシャーシ1の載置部分とに導電パターン2
aを形成し、発熱部品3の本体部3b、及びシャシー1
を導電パターン2aに当接した構成としたものである。
そして、このプリント基板2を使用した場合は、プリン
ト基板2の一面では、発熱部品3の本体部3bの一面が
導電パターン2aに、更に、プリント基板2の他面で
は、シャーシ1の底板1aが導電パターン2aに接触し
た構成となるものである。このような構成においては、
この導電パターン2aが金属で構成されているために、
熱伝導が良好となり、一層放熱効果を向上することが出
来る。
FIGS. 3 and 4 show another embodiment of the electronic apparatus of the present invention. FIG. 3 is a sectional view of a main part of the electronic apparatus.
FIG. 4 is a plan view of a main part of a printed circuit board according to the electronic apparatus of the present invention, in which a conductive pattern 2 is provided on a mounting part of a heat generating component 3 and a mounting part of a chassis 1 on the printed circuit board 2.
a, the main body 3b of the heat generating component 3 and the chassis 1
Is in contact with the conductive pattern 2a.
When the printed circuit board 2 is used, on one surface of the printed circuit board 2, one surface of the main body 3 b of the heat generating component 3 is connected to the conductive pattern 2 a, and on the other surface of the printed circuit board 2, the bottom plate 1 a of the chassis 1 is connected. It is configured to be in contact with the conductive pattern 2a. In such a configuration,
Since the conductive pattern 2a is made of metal,
The heat conduction becomes good, and the heat radiation effect can be further improved.

【0008】[0008]

【発明の効果】本発明の電子機器は、プリント基板2の
一面に発熱部品3の本体部3bの一面を載置して伏せ型
としたため、薄型となり、小型で扁平な電子機器を提供
できる。また、ネジ5で発熱部品3と共にプリント基板
2をシャーシ1に取り付けるため、発熱部品3の取付と
シャーシ1の取付が兼用できて、組立作業性が良く、安
価な電子機器を提供できる。更に、発熱部品3とシャー
シ1とを導電パターン2aに当接することにより、熱伝
導が良好となり、一層放熱効果を向上することが出来、
電気的性能の安定した電子機器を提供できる。
According to the electronic apparatus of the present invention, one surface of the main body 3b of the heat-generating component 3 is mounted on one surface of the printed circuit board 2 to be a prone type, so that a thin, small and flat electronic device can be provided. In addition, since the printed circuit board 2 is attached to the chassis 1 together with the heat-generating components 3 with the screws 5, the mounting of the heat-generating components 3 and the chassis 1 can be used together, so that the assembling workability is good and an inexpensive electronic device can be provided. Further, by bringing the heat generating component 3 and the chassis 1 into contact with the conductive pattern 2a, heat conduction is improved, and the heat radiation effect can be further improved.
An electronic device with stable electric performance can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電子機器の要部の側面図。FIG. 1 is a side view of a main part of an electronic device according to the present invention.

【図2】本発明の電子機器の要部の断面図。FIG. 2 is a cross-sectional view of a main part of the electronic device of the invention.

【図3】本発明の電子機器の他の実施形態を示す要部の
断面図。
FIG. 3 is a cross-sectional view of a main part showing another embodiment of the electronic apparatus of the present invention.

【図4】本発明の電子機器の他の実施形態に係るプリン
ト基板の要部の平面図。
FIG. 4 is a plan view of a main part of a printed circuit board according to another embodiment of the electronic device of the present invention.

【図5】従来の電子機器の要部断面側面図。FIG. 5 is a cross-sectional side view of a main part of a conventional electronic device.

【符号の説明】[Explanation of symbols]

1 シャーシ 1a 底板 1b ネジ孔 2 プリント基板 2a 導電パターン 2b 孔 3 発熱部品 3a 孔 3b 本体部 3c 端子部 4 ワッシャー 5 ネジ DESCRIPTION OF SYMBOLS 1 Chassis 1a Bottom plate 1b Screw hole 2 Printed circuit board 2a Conductive pattern 2b Hole 3 Heating component 3a Hole 3b Main body 3c Terminal 4 Washer 5 Screw

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ネジ孔を有する金属板から成るシャーシ
と、導電パターンを有するプリント基板と、本体部を有
する発熱部品と、前記発熱部品を取り付けるためのネジ
とを備え、前記プリント基板の一面に前記発熱部品の本
体部の一面を載置し、また、前記プリント基板の他面を
前記シャーシに載置し、前記ネジを、前記発熱部品と前
記プリント基板の孔に挿通して前記シャーシのネジ孔に
ねじ込みして、前記発熱部品を取り付けたことを特徴と
する電子機器。
1. A printed circuit board comprising: a chassis made of a metal plate having a screw hole; a printed board having a conductive pattern; a heat generating component having a main body; and screws for attaching the heat generating component. One surface of the main body of the heat-generating component is placed, and the other surface of the printed circuit board is placed on the chassis, and the screw is inserted into the hole of the heat-generating component and the printed circuit board to screw the chassis. An electronic device, wherein the heat-generating component is attached by screwing into a hole.
【請求項2】 前記発熱部品のプリント基板への載置面
と、前記シャーシの前記プリント基板への載置面とにお
いて、前記プリント基板に前記導電パターンを設けたこ
とを特徴とする請求項1記載の電子機器。
2. The printed circuit board according to claim 1, wherein the conductive pattern is provided on a surface on which the heat-generating component is mounted on the printed circuit board and on a surface on which the chassis is mounted on the printed circuit board. Electronic device as described.
JP18959797A 1997-07-15 1997-07-15 Electronic device Withdrawn JPH1140966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18959797A JPH1140966A (en) 1997-07-15 1997-07-15 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18959797A JPH1140966A (en) 1997-07-15 1997-07-15 Electronic device

Publications (1)

Publication Number Publication Date
JPH1140966A true JPH1140966A (en) 1999-02-12

Family

ID=16243985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18959797A Withdrawn JPH1140966A (en) 1997-07-15 1997-07-15 Electronic device

Country Status (1)

Country Link
JP (1) JPH1140966A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020003423A1 (en) * 2018-06-27 2020-01-02 三菱電機株式会社 Power supply device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020003423A1 (en) * 2018-06-27 2020-01-02 三菱電機株式会社 Power supply device
JPWO2020003423A1 (en) * 2018-06-27 2021-04-22 三菱電機株式会社 Power supply

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