JPH1140895A - Method and apparatus for assembling optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for the assembling operation of an optical module, in which a high-integration hybrid optical integrated circuit can be manufactured at low cost. SOLUTION: An optical module substrate 1 to which a component 11 and a component 12 as optical module constituent components are fixed by a fixing agent of low heat resistance is heated. Remaining components 21, 22, 23 as optical module constituent components are mounted. At this time, nitrogen gas from a cooling nozzle 50 is blown onto region on the optical module substrate 11 to which the components 11, 12 as the optical module constituent components are fixed, or a cooling plate is brought into contact. Accordingly, while the optical module substrate 1 is being cooled, it is heated by a heater 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module assembling method and an assembling apparatus for realizing a highly integrated hybrid optical integrated circuit.

[0002]

2. Description of the Related Art In recent years, a hybrid optical module in which a plurality of components such as a semiconductor optical element and an interference film filter are mounted on an optical module substrate has attracted attention.

FIG. 10 is a configuration diagram showing an example of such a conventional hybrid optical module. As shown in the figure, this hybrid optical module is inserted into a quartz planar lightwave circuit formed on the optical module substrate 1 and a groove (not shown) formed on the optical module substrate 1 in the middle of the lightwave circuit. And a semiconductor laser (hereinafter referred to as L) mounted on the optical module substrate 1 at the rear end of the lightwave circuit.
Indicated as D. ) 21 and a monitoring photodiode (hereinafter referred to as MPD) 22 for monitoring the optical output of the LD 21.
And a receiving photodiode (hereinafter referred to as RPD) 23 for receiving a signal.
(Hereinafter, the LD 21, the MPD 22, the RPD 23, and the like are collectively referred to as a semiconductor optical element 20.) Further, an optical fiber is connected to the tip of the light wave circuit, and a yato plate 11 for this is attached to the optical module substrate 1. Installed.

Each component of the hybrid optical module is attached to the optical module substrate 1 by three kinds of fixing agents (adhesive or solder) having different fixing temperatures (adhesion or soldering temperatures) or heat-resistant temperatures. That is, the optical module substrate 1 and the filter 12 are respectively mounted on the optical module substrate 1 using two different types of adhesives.
, And the heat resistance temperatures of these two types of adhesives are both 250 ° C. or less. On the other hand, the three types of semiconductor optical devices 20 are all fixed to the optical module substrate 1 with AuSn solder, and the fixing temperature is about 300 ° C.

Since the heat-resistant temperature or the fixing temperature differs for each component as described above, it is necessary to individually set the temperature when fixing each component to the optical module substrate 1.

FIG. 11 is a diagram showing an example of a conventional component mounting process when a hybrid optical module is manufactured. As shown in the figure, first, a jaw plate 11 is fixed to the tip of the optical module substrate 1 using an adhesive. Then
The filter 12 is fixed on the optical module substrate 1 using another kind of adhesive. Then, the three types of semiconductor optical devices 20
Are fixed to the optical module substrate 1 by AuSn solder.

As described above, in the above-described conventional mounting process, the heat resistance temperature of the yato plate 11 and the filter 12 is set to 250 ° C.
After fixing to the optical module substrate 1 using the following adhesive, the semiconductor optical element 20 is fixed to AuSn at a fixing temperature of about 300 ° C.
It is fixed to the optical module substrate 1 by soldering. For this reason, in the conventional mounting process of the semiconductor optical device 20,
It was necessary to melt and fix the solder using the “local heating method”.

FIG. 12 is an explanatory view of a conventional typical local heating method. FIG. 12A shows a method in which a semiconductor optical device 20 is held by using a tool 30 and heated by a heater 31 via the tool 30. 2B shows a method of holding the semiconductor optical device 20 using the tool 30 and irradiating a light beam 32 to melt the solder immediately below the semiconductor optical device 20.
If these local heating methods are used, it is possible to suppress the temperature around the yatoy board 11 and the filter 12 to be lower than the heat resistant temperature of the adhesive.

[0009]

However, the above-mentioned local heating method has two problems.

The first problem is that heating is repeatedly performed for each semiconductor optical element 20 in sequence, and when a large number of semiconductor optical elements 20 are mounted, it takes a long time to fix each semiconductor optical element 20. That is,

The second problem is that when the distance between the semiconductor optical devices 20 is small, when the solder for the subsequent semiconductor optical device 20 is heated, the solder for the preceding semiconductor optical device 20 is also heated. Is likely to be conducted and melted, which means that the mounting density of the semiconductor optical device 20 is limited. In particular, when a silicon substrate is used as the optical module substrate 1, since silicon has high thermal conductivity, heat is conducted around the heated portion and the temperature easily rises, and the solder of the fixed semiconductor optical element 20 is soldered. Is likely to be re-melted, and the interval between the semiconductor optical elements 20 cannot be reduced.

In order to solve the first and second problems at the same time and to increase the mounting density of the semiconductor optical device 20, the solder of all the semiconductor optical devices 20 is collectively melted by one heating and soldering is performed. Just do it. However, in this case, there is another problem that the component fixed in advance using an adhesive and the adhesive are thermally damaged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides an optical module assembling method and an assembling apparatus capable of manufacturing a highly integrated hybrid optical integrated circuit at low cost. The purpose is to:

[0014]

According to a method for assembling an optical module according to the present invention, a part of an optical module component is fixed to a part of an optical module substrate by a fixing agent having low heat resistance. In the optical module assembling method of performing the heating step on the optical module substrate and mounting and fixing the remaining part of the optical module component on the optical module substrate, in the heating step, the fixing component with the low heat-resistant fixing agent is used. The optical module substrate is heated while cooling the part of the optical module substrate to which a part is fixed.

In this case, the part of the optical module substrate is cooled by blowing nitrogen gas.

In this case, the part of the optical module substrate is cooled by bringing a cooling plate into contact therewith.

According to another aspect of the present invention, there is provided an optical module assembling method, comprising: an optical module substrate; and one or more components mounted and fixed at a predetermined position on the optical module substrate with a first fixing agent. A first component group consisting of: a single component mounted or fixed at a predetermined position different from the predetermined position on the optical module substrate by a second fixing agent requiring a heating temperature higher than the heat resistance temperature of the first fixing agent; In the method for assembling an optical module including a second component group including a plurality of components, the first component group is mounted and fixed with the first fixing agent, and then the second module of the optical module substrate is fixed. The lower surface of the part on which the component group is mounted is placed in contact with the upper surface of the heater, and the optical module substrate is heated by the heater while locally cooling the vicinity of the first component group. And wherein the mounting fixing the second components group.

According to the optical module assembling apparatus of the present invention for achieving the above object, a heating step is performed on an optical module substrate in which a part of an optical module component is partially fixed by a fixing agent having low heat resistance. An optical module assembling apparatus for mounting and fixing the rest of the optical module components on the optical module substrate, wherein the optical module assembling apparatus includes a heater for heating the optical module substrate, and a fixing agent having low heat resistance. A mechanism for locally cooling the vicinity of a part of the optical module substrate to which a part of the product is fixed, and a mechanism for filling the periphery of the optical module substrate with a nitrogen atmosphere are provided.

In this case, the mechanism for locally cooling is as follows.
It is a cooling nozzle that blows nitrogen gas locally.

In this case, the mechanism for locally cooling is a cooling plate for cooling by contact.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment: FIG. 1 is a diagram showing a structure of a hybrid optical module according to a first embodiment of the present invention, which relates to an optical module assembling method and an assembling apparatus, and a heater of an optical module assembling apparatus. It is a top view which shows arrangement | positioning.

As shown in the figure, this hybrid optical module comprises a quartz-based planar lightwave circuit 100 formed on an optical module substrate 1 made of silicon,
00, an interference film filter (hereinafter, referred to as a filter) 12 inserted and fixed in a groove (not shown) formed on the optical module substrate 1 in the middle of the optical module substrate 1, and an optical module substrate at the rear end of the planar lightwave circuit 100. 1 and a monitoring photodiode (hereinafter referred to as MPD) for monitoring the optical output of the LD 21.
It is written. ) 22 and a receiving photodiode (hereinafter referred to as RPD) 23 for receiving a signal. (Hereinafter LD21, MPD22, RPD23
These are collectively referred to as a semiconductor optical device 20. Further, an optical fiber (not shown) is connected to the distal end of the planar lightwave circuit 100, and a stop plate 11 for this is attached to the optical module substrate 1.

Each component of the hybrid optical module is mounted on the optical module substrate 1 with three types of fixing agents having different fixing temperatures and heat-resistant temperatures. That is, the yat plate 11 and the filter 12 are respectively fixed to the optical module substrate 1 using two different types of adhesives, and the heat-resistant temperatures of these two types of adhesives are both 250 ° C. or less. On the other hand, three types of semiconductor optical devices 2
No. 0 is fixed to the optical module substrate 1 by AuSn solder, and the fixing temperature is about 300 ° C.

Hereinafter, a component group fixed with an adhesive having a heat-resistant temperature of 250 ° C. or less is referred to as a first component group, and a fixing temperature of about 300 ° C.
Is referred to as a second component group.

In order to manufacture the hybrid optical module having the above configuration at low cost, the second component group having a high fixing temperature is fixed in a single solder reflow step, and is simultaneously fixed in advance using an adhesive. It is necessary to prevent the first component group having a low heat-resistant temperature from being thermally damaged.

FIG. 2 is a side sectional view showing the configuration of the hybrid optical module assembling apparatus of the present embodiment.

As shown in FIGS. 1 and 2, a heater 31 is provided in a lower part of the hybrid optical module assembling apparatus, and a portion of the optical module substrate 1 excluding a portion where the first component group is mounted is removed. The heater 31 is mounted in contact with the upper surface of the heater 31. The whole including the heater 31 and the optical module substrate 1 on which the first and second component groups are mounted is housed in the chamber 40. The chamber 40 is provided with a nitrogen inlet 41 for introducing a nitrogen gas to fill the inside of the chamber 40 with a nitrogen atmosphere.

Further, a cooling nozzle 50 for blowing nitrogen gas onto the first component group and its periphery is provided in the chamber 40.
Attach.

In this embodiment, the structure of the heater 31, the chamber 40 and the nitrogen inlet 41 is the same as that of a known solder reflow apparatus. The region having low heat resistance including the portion where the one component group is mounted is arranged so as not to directly contact the heater 31, and the nitrogen gas supplied from the cooling nozzle 50 on the first component group and the periphery thereof By flow
Since the region having low heat resistance including the portion on which the first component group is mounted is cooled, the portion of the optical module substrate 1 on which the second component group is mounted is heated by the heater 31 to form the second component group. Even if the soldering is carried out collectively, the first component group is not thermally damaged.

FIG. 3 is a diagram showing a temperature distribution of the optical module substrate 1 of the present embodiment. In the figure, A to D correspond to the parts indicated by A to D in FIG. As shown in the figure,
The temperature between AB on which the second component group is mounted is 300
Since the temperature rises to about ° C and the AuSn solder melts, components such as the LD21, MPD22, and RPD23 belonging to the second component group can be simultaneously soldered onto the substrate by a single heating. On the other hand, C ~ on which the first component group is mounted
The temperature between D can be maintained at 250 ° C. or less, which is the heat-resistant temperature, and the components such as the filter 12 and the toy plate 11 belonging to the second component group and the adhesive thereof can be prevented from being thermally damaged. . The cooling effect of the optical module substrate 1 can be controlled by the flow rate of the nitrogen gas from the cooling nozzle 50 and the spray position.

As described above, by using the optical module assembling apparatus of the present embodiment, the optical elements of the second component group are fixed collectively on the substrate, and the first component group and the adhesive of the first component group are fixed together. Heat damage can be prevented.

The temperature distribution of the optical module substrate 1 is as follows:
The control can be performed most accurately when a silicon substrate is used as the substrate. This is because silicon has a high thermal conductivity, and heat supply from the heater 31 and heat radiation in the cooling unit are efficiently performed.

Further, in this embodiment, a substrate including a silicon substrate having a high thermal conductivity and a high heat radiation effect is used as the optical module substrate 1, and the vicinity of the first component group mounting region of the optical module substrate 1 is disconnected from the heater. If the contact state is maintained, the tip of the optical module substrate 1 is cooled by the atmosphere. Therefore, even if the cooling is not performed by blowing nitrogen gas, as shown in FIG. It is possible to lower the temperature of the product group mounting area to some extent.

The purpose and function of the cooling nozzle 50 of the present embodiment and the nitrogen inlet of the known solder reflow chamber are as follows. That is,
The nitrogen inlet of the known solder reflow chamber is intended only to introduce nitrogen gas evenly throughout the chamber, and to prevent the nitrogen gas flow from directly hitting the optical module substrate and lowering the temperature of the substrate, a nitrogen gas inlet is used. The flow rate of the gas is reduced, and the inlet is arranged so that the nitrogen gas does not directly hit the substrate. On the other hand, the cooling nozzle 50 in the present embodiment has a purpose and a function of cooling the optical module substrate 1 by blowing nitrogen gas onto the optical module substrate 1.

FIG. 4 is a view showing an optical module assembling process by the optical module assembling apparatus of the present embodiment.

As shown in the figure, first, a stop plate 11 is fixed to the optical module substrate 1 with an adhesive.

Next, the end face of the optical module substrate 1 is cut or polished.

Next, after a filter insertion groove is formed on the optical module substrate 1 using, for example, a dicing saw,
Immediately insert the filter 12 and fix with an adhesive. The reason why the filter 12 is inserted immediately after the formation of the groove is to prevent dust and the like from entering the groove.

Next, the LD 21 and the MPD 2 of the second component group are placed at predetermined positions on the optical module substrate 1 having undergone the above-described steps.
2. The RPD 23 and the like are arranged and housed in the chamber 40.
At that time, the portion of the substrate 1 excluding the portion where the first component group is mounted and fixed is placed on the heater 31 in contact with the upper surface of the heater 31. Thereafter, nitrogen gas is introduced into the chamber 40 from the nitrogen inlet 41 to fill the inside of the chamber 40 with a nitrogen atmosphere, and if necessary, nitrogen gas is blown from the cooling nozzle 50 onto the first component group and the periphery thereof. While cooling, the second component group mounting location is heated by the heater 31, and the LD21, MPD22, RPD23, etc. are collectively soldered and fixed.

According to the present embodiment, the LD 21, MPD 22, and RPD of the second component group are cooled while cooling the portion of the first component group on which the heat-resistant temperature is low, such as the Yato plate 11 and the filter 12.
23 and the like can be collectively soldered and fixed, so that the LD 21 of the second component group can be heated without damaging the adhesive and the like together with the jaw board 11 and the filter 12 of the first component group. , MPD22, RPD23, etc., can be efficiently fixed, and the degree of integration of the semiconductor optical device can be increased.

Although the figure shows an example in which the number of semiconductor optical elements is three, the number is not limited to three and may be three or less or three or more.

Further, in the present embodiment, as an example, the jaw plate 1 fixed with an adhesive having a heat-resistant temperature of 250 ° C. or less is used.
1 and the filter 12, and the second component group consisting of the semiconductor optical element 20 fixed with solder at a fixed temperature of about 300 ° C., the heat-resistant temperature and the fixing temperature are 250 The temperature is not limited to about 300 ° C. or lower, and is not limited to about 300 ° C., and when the heat resistant temperature of the first component group is lower than the fixed temperature of the second component group, the heat resistant temperature and the fixed temperature are 2
The present invention is also applicable to cases where the temperature is not higher than 50 ° C. and about 300 ° C. Further, the components of the first component group are not limited to the Yatoi plate 11 and the filter 12, but may be other components. The components of the second component group are not limited to the semiconductor optical device. Other components may be used.

Further, in this embodiment, the portion of the optical module substrate 1 excluding the portion where the first component group is mounted and fixed is mounted on the heater 31 and heated by the heater 31. The optical module substrate 1 including the part where the product group is mounted and fixed may be heated by the heater 31 and cooled by blowing nitrogen gas onto the first component product group and its periphery.

Second Embodiment FIG. 5 is a side sectional view showing a configuration of a hybrid optical module assembling apparatus according to a second embodiment of the present invention, which relates to an optical module assembling method and an assembling apparatus. Note that the configuration of the hybrid optical module is the same as that of the first embodiment, and a description thereof will be omitted. Further, the optical module assembling method and the assembling apparatus of the present embodiment have many points in common with those of the first embodiment, and therefore, differences from the first embodiment will be mainly described here.

As shown in the figure, in the present embodiment, a cooling plate 51 is used in place of the cooling nozzle 50 of the first embodiment.

The cooling plate 51 is formed of a metal block, and has a cooling function by flowing cooling water or cooling gas therein.

The lower surface of the portion of the optical module substrate 1 on which the first component group is mounted is the cooling plate 51.
The hybrid optical module assembling apparatus is disposed in a lower part of the chamber 40 so as to be placed in contact with the upper surface of the apparatus. The portion of the optical module substrate 1 on which the second component group is mounted is placed on the heater 31 in contact with the upper surface of the heater 31 as in the first embodiment.
While the part on which the component group is mounted is cooled, the portion on which the second component group is mounted is heated by the heater 31, and the LD 21, M
PD22, RPD23, etc. are collectively soldered and fixed.

In this manner, the same temperature distribution as that of the first embodiment can be formed on the optical module substrate 1, so that the first component group
1 and the filter 12 as well as the second component group LD21, MPD22, R
The PD 23 and the like can be efficiently fixed collectively, and the degree of integration of the semiconductor optical device can be increased.

FIG. 6 is a plan view of an optical module assembling apparatus according to the present invention, showing an example in which semiconductor optical elements are simultaneously fixed to a large number of optical module substrates. In this way, a large number of optical modules can be assembled at a time, and the optical modules can be manufactured at low cost. Although the figure shows an example in which semiconductor optical elements are simultaneously fixed to six optical module substrates, the number is not limited to six, and may be six or less or six or more. Further, although the figure shows an example in which there are three semiconductor optical elements, the number is not limited to three, and may be three or less or three or more.

Third Embodiment FIG. 7 is a plan view showing an example of the configuration of a hybrid optical module to which the third embodiment according to the optical module assembling method and apparatus according to the present invention is applied.

This embodiment also has many points in common with the first and second embodiments, and therefore, the differences from the first and second embodiments will be mainly described here.

As shown in the figure, in the hybrid optical module to which the present embodiment is applied, four groups, each including four optical modules, are provided on the optical module substrate 1 for a total of 1 group.
Six planar lightwave circuits 100 are formed, and four chips each having four arrays of semiconductor optical amplifiers 24 formed as semiconductor optical elements are mounted in the middle of each of the planar lightwave circuits 100. These semiconductor optical amplifiers 24 are fixed on the optical module substrate 1 by soldering using AuSn solder, and the fixing temperature is about 300 ° C.

On the other hand, at the end of the waveguide at the end of the optical module substrate 1, a jaw plate 11 is attached, and the semiconductor optical amplifier is located close to the end of the optical module substrate 1 orthogonal to the end at which the jaw plate 11 is attached. 24 driver ICs 13 are mounted. Note that the driver IC 13 is an arrayed driver IC in which four elements are formed per chip. The jaw board 11 is fixed with an adhesive having a heat resistant temperature of about 200 ° C. The driver IC 13 may be thermally damaged at a temperature of 280 ° C. or higher. Therefore, the driver IC 13 is fixed at about 220 ° C. using SnPb solder. As described above, the optical module according to the present embodiment has three components having different fixed temperatures and heat-resistant temperatures, that is, the yato plate 11 and the driver IC 13 (hereinafter, referred to as a first component group) having relatively low heat-resistant temperatures. And a semiconductor optical amplifier 24 having a fixed temperature of about 300 ° C. (hereinafter referred to as a second component group).

FIG. 8 is a side sectional view showing the structure of the hybrid optical module assembling apparatus according to the present embodiment, and FIG.
Is a cross-sectional view taken along the line AA ′ of FIG. 7, and FIG.
It is sectional drawing in the -B 'line.

When viewed in a cross-sectional view taken along the line AA ′, as shown in FIG. 8A, a semiconductor optical amplifier 24 is mounted at the center on the optical module substrate 1, and both ends thereof are provided. A toy plate 11 is attached to the rim. Therefore, the heater 31 is provided below the center of the chamber 40 of the hybrid optical module assembling apparatus, and the cooling plates 51 are provided below the both ends, and the center of the optical module substrate 1 on which the semiconductor optical amplifier 24 is mounted is provided. The lower surface contacts the upper surface of the heater 31, and the
The optical module substrate 1 is mounted on the heater 31 and the cooling plate 51 so as to be housed in the chamber 40 such that the lower surfaces of both ends of the optical module substrate 1 on which the optical module 1 is mounted are in contact with the upper surface of the cooling plate 51.

When viewed in a cross-sectional view along the line BB ', as shown in FIG. 8B, a semiconductor optical amplifier 24 is mounted at the center on the optical module substrate 1, and Driver ICs 13 are attached to both ends. Therefore, the heater 31 is provided at the lower part of the center of the chamber 40 of the hybrid optical module assembling apparatus, and the cooling nozzle 50 is provided at the upper part of both ends, and the central part of the optical module substrate 1 on which the semiconductor optical amplifier 24 is mounted. The optical module substrate 1 is placed on the heater 31 so that the lower surface is in contact with the upper surface of the heater 31,
Further, the optical module substrate 1 on which the driver IC 13 is mounted is housed in the chamber 40 such that nitrogen gas from the cooling nozzle 50 is blown around the upper surfaces of both ends.

FIG. 9 is a diagram showing a temperature distribution of the optical module substrate 1 of the present embodiment. As shown in the figure, the temperature distribution along the line AA ′ in FIG. 7 is about 300 ° C. at the center where the semiconductor optical amplifier 24 is mounted, and the adhesive is bonded at both ends where the Yatoi plate 11 is mounted. The temperature is sufficiently lower than the heat resistant temperature of the agent. Also, BB ′ in FIG.
The temperature distribution along the line is about 300 ° C. at the center where the semiconductor optical amplifier 24 is mounted, and the driver IC 1
3 is higher than 200 ° C. which is sufficient for melting the SnPb solder at both ends where the driver IC 13 is mounted.
At a temperature of 250 ° C. or less that does not cause thermal damage to the substrate. These temperatures can be optimized by controlling the temperature of the cooling plate 51, the amount of the nitrogen gas blown from the cooling nozzle 50, and the position of the blow.

According to the present embodiment, the fixed temperature is about 30
Since the central portion of the optical module substrate 1 on which a plurality of semiconductor optical amplifiers 24 at 0 ° C. are mounted is heated by the heater 31, the temperature of the portion can be set to about 300 ° C. At the same time, the end of the optical module substrate 1 to which the yato plate 11 is attached is cooled by the cooling plate 51, so that the temperature can be sufficiently lower than the heat resistant temperature of the yato plate 11 and its adhesive, and the driver IC 13 Is cooled by blowing nitrogen gas from the cooling nozzle 50, so that the SnPb solder for fixing the driver IC 13 is higher than 200 ° C., which is higher than the heat-resistant temperature of the driver IC 13. Lower temperatures can be used.

For this purpose, a plurality of semiconductor optical amplifiers 24 and a plurality of driver ICs 13 are mounted on the optical module substrate 1 on which the yato plate 11 is mounted, and these are collectively assembled with AuSn solder and SnPb solder. 1 can be fixed.

Further, since a plurality of semiconductor optical amplifiers 24 and a plurality of driver ICs 13 can be fixed on the optical module substrate 1 in one heating step, the mounting density can be increased.

In the present embodiment, as an example, a total of 16 plane lightwave circuits 100 are formed on the optical module substrate 1, ie, 4 groups, each including 4 groups,
In the middle of each planar lightwave circuit 100, four arrays of semiconductor optical amplifiers 24 are formed as semiconductor optical elements, respectively.
Although the case where chips are mounted has been described, the number of planar lightwave circuits and the number of chips on which semiconductor optical amplifiers are formed are not limited to 16 and 4 chips, but may be other numbers.

Further, in the present embodiment, as an example, the jaw board 11 fixed with an adhesive having a heat resistance temperature of about 200 ° C.
And driver IC 13 fixed at a fixed temperature of about 220 ° C.
And the second component group consisting of the semiconductor optical amplifier 24 fixed with solder at a fixed temperature of about 300 ° C., the heat-resistant temperature and the fixing temperature are each about 200 ° C. , About 220 ° C. or about 300 ° C. If the heat resistant temperature of the first component group is lower than the fixed temperature of the second component group, the heat resistant temperature and the fixed temperature are each about 200 ° C. About 220 ° C or about 300 ° C
It is also applicable to other cases. Further, the components of the first component group are not limited to the jaw board 11 and the driver IC 13 but may be other components. The components of the second component group are not limited to the semiconductor optical amplifier 24. Instead, other components may be used.

Further, in the present embodiment, only the central portion of the optical module substrate 1 on which the semiconductor optical amplifier 24 is mounted is placed on the heater 31 and heated by the heater 31, but the driver of the optical module substrate 1 is heated. The optical module substrate 1 including the portion on which the IC 13 is mounted is mounted on the heater 31 and heated, and the portion on which the driver IC 13 is mounted is cooled by blowing nitrogen gas, and the portion on which the yato board 11 is mounted. May be cooled by the cooling plate 51.

[0064]

According to the present invention, the optical module substrate is heated by the heater, and at the same time, is cooled by blowing nitrogen gas from a cooling nozzle to a predetermined portion of the optical module substrate or by bringing the cooling plate into contact with the predetermined portion. So
There is an effect that a desired temperature distribution can be formed on the optical module substrate.

For this reason, it is possible to keep the temperature of the area where the first component group having a low heat-resistant temperature is mounted low and raise the temperature of the area where the second component group having a high fixed temperature is mounted to the fixed temperature. It is possible to collectively mount and fix a plurality of types and a plurality of components having different heat-resistant temperatures and fixing temperatures simultaneously on the optical module substrate.

Accordingly, there is an effect that a high-integration hybrid optical integrated circuit can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a plan view showing the configuration of a hybrid optical module according to a first embodiment of the optical module assembling method and the assembling apparatus of the present invention and the arrangement of heaters in the optical module assembling apparatus.

FIG. 2 is a side sectional view showing a configuration of a hybrid optical module assembling apparatus according to a first embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 3 is a diagram showing a temperature distribution of the optical module substrate according to the first embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 4 is a diagram showing an optical module assembling process of the first embodiment according to the optical module assembling method and the assembling apparatus of the present invention.

FIG. 5 is a side sectional view showing a configuration of a hybrid optical module assembling apparatus according to a second embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 6 is a plan view showing an example in which semiconductor optical elements are simultaneously fixed to a large number of optical module substrates in the second embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 7 is a plan view showing an example of a configuration of a hybrid optical module to which a third embodiment according to an optical module assembling method and an assembling apparatus of the present invention is applied.

FIG. 8 is a side sectional view showing a configuration of a hybrid optical module assembling apparatus according to a third embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 9 is a diagram illustrating a temperature distribution of an optical module substrate 1 according to a third embodiment of the optical module assembling method and the assembling apparatus of the present invention.

FIG. 10 is a configuration diagram showing an example of a conventional hybrid optical module.

FIG. 11 is a view showing a state in which a hybrid optical module is manufactured.
It is a figure showing the example of each conventional component mounting process.

FIG. 12 is an explanatory diagram of a conventional typical local heating method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Optical module board 11 ... Toy plate 12 ... Filter 13 ... Driver IC 21 ... Semiconductor laser 22 ... Monitoring photodiode 23 ... Reception photodiode 24 ... Semiconductor optical amplifier 30 ... Tool 31 ... Heater 40 ... Chamber 41 ... Nitrogen introduction Mouth 50: Cooling nozzle 51: Cooling plate 100: Optical waveguide

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takaharu Oyama 3-19-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo Inside Japan Telegraph and Telephone Corporation (72) Inventor Yuji Akahori 3-192-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo No. Nippon Telegraph and Telephone Corporation (72) Inventor Takashi Yamada 3-19-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo Nippon Telegraph and Telephone Corporation

Claims (7)

[Claims] An optical module component is partially fixed to a part of an optical module substrate by a fixing agent having low heat resistance, and the remaining optical module component is subjected to a heating step on the optical module substrate. In the optical module assembling method of mounting and fixing on a module substrate, in the heating step, while cooling the part of the optical module substrate in which a part of the component is fixed by the fixing agent having low heat resistance, An optical module assembly method, comprising heating an optical module substrate. 2. The optical module assembling method according to claim 1, wherein said part of said optical module substrate is cooled by blowing nitrogen gas. 3. An optical module assembling method according to claim 1, wherein said part of said optical module substrate is cooled by contacting a cooling plate. 4. An optical module substrate, a first component group consisting of one or more components mounted and fixed at a predetermined position on the optical module substrate with a first fixing agent, and the predetermined component of the optical module substrate. And a second component group consisting of one or more components that is mounted and fixed at a predetermined position different from the position by a second fixing agent requiring a heating temperature higher than the heat resistance temperature of the first fixing agent. In the method for assembling an optical module, after the first component group is mounted and fixed by the first fixing agent, the lower surface of the portion of the optical module substrate on which the second component group is mounted contacts the upper surface of the heater. An optical module, wherein the optical module substrate is heated by the heater while the vicinity of the first component group is locally cooled, and the second component group is mounted and fixed. assembly Method. 5. A heating process is applied to an optical module substrate in which a part of the optical module component is partially fixed by a fixing agent having low heat resistance, and the rest of the optical module component is mounted and fixed on the optical module substrate. The optical module assembling apparatus comprises: a heater for heating the optical module substrate; and an optical module substrate to which a part of the optical module component is fixed by the fixing agent having low heat resistance. An optical module assembling apparatus comprising: a mechanism for locally cooling the vicinity of the unit; and a mechanism for filling the periphery of the optical module substrate with a nitrogen atmosphere. 6. The optical module assembling apparatus according to claim 5, wherein said mechanism for locally cooling is a cooling nozzle for locally blowing nitrogen gas. 7. An optical module assembling apparatus according to claim 5, wherein said mechanism for locally cooling is a cooling plate for cooling by contact.