JPH113903A - Device and method for mounting solder ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for mounting solder balls by which whether or not the solder balls picked up by means of a pickup head have been accurately mounted on a work without mistakes can be discriminated easily. SOLUTION: A solder ball mounting device which mounts solder balls provided in a supplying section on a work by picking up the solder balls by vacuum chuck with a plurality of vacuum holes 64 formed on the lower surface of a pickup head 11 is provided with the pickup head 11, constituted of a black box, a nozzle 65 which emits light from a light source 67 and is provided in the black box, and a photoreceptor which receives light leaking out of the black box through the holes 64. The presence/absence of mis-mounting of solder balls can be discriminated by emitting light from the light source 67, while the pickup head 11 returns to the supplying section after the head 11 mounts the solder balls on the work and receives the light leaking out of the black box through the holes 64.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus and a mounting method for mounting a solder ball on a work by vacuum-sucking the ball with a pickup head.

[0002]

2. Description of the Related Art It is known that solder balls are mounted on the surface of a work such as a chip or a substrate, and then the solder balls are heated and melted, then cooled and solidified to form bumps (protruding electrodes). ing. Generally, many bumps are formed on a work, and thus a large number of solder balls are mounted on the work. Hereinafter, a conventional solder ball mounting apparatus for mounting a large number of solder balls on a work at once will be described.

FIG. 9 is a side view of a conventional solder ball mounting apparatus. Solder balls 1 as a material of bumps are stored in a container 2. Reference numeral 3 denotes a pickup head, which is driven by a vertical movement means (not shown) to perform vertical movement, thereby vacuum-adsorbing the solder ball 1 into a suction hole formed on the lower surface thereof, and reciprocating movement means (FIG. (Not shown) to move horizontally, thereby moving above the work such as the substrate 5 clamped and positioned by the clamper 6, and performing vertical movement again there to move the solder ball 1 to a predetermined position on the substrate. It is designed to be mounted on.

[0004]

However, not all of the solder balls picked up by the pickup head are necessarily mounted on the work, and the solder balls that remain and adhere to the suction holes of the pickup head due to mounting errors. Balls also occur, but in such a case, the work becomes a defective product with missing solder balls. However,
Since there was no means for automatically detecting such mounting errors, troubles due to mounting errors and defective workpieces were likely to occur.

Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to provide a solder ball mounting device and a mounting method with high operation reliability. More specifically, it is an object of the present invention to provide a solder ball mounting apparatus and a mounting method that can easily determine whether or not all the solder balls picked up by a pickup head are mounted on a work without errors.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for mounting a solder ball, wherein a plurality of solder balls provided in a supply portion of a solder ball are vacuum-adsorbed to suction holes formed on a lower surface of a pickup head. An apparatus for mounting a solder ball to be picked up and mounted on a work, wherein the pickup head is formed of a dark box having a plurality of suction holes formed on a lower surface, and a light emitting unit is provided in the dark box, and a moving path of the pickup head is provided. A light receiver for receiving the light of the light emitting unit leaking from the suction hole to the outside of the dark box was provided in the middle of the step.

According to a second aspect of the present invention, there is provided a method for mounting a solder ball.
A method of mounting a solder ball, wherein a plurality of solder balls provided in a solder ball supply unit are vacuum-sucked into suction holes formed on a lower surface of a pickup head to be picked up and mounted on a work. After picking up and transferring the solder ball provided to the workpiece to the work, and returning to the supply section, the light emitting section provided in the dark box constituting the pickup head emits light, and the pickup head is moved from the suction hole to the pickup head. Is detected, and if light is emitted from all the suction holes, it is determined that there is no mounting error.

According to the present invention, while the pickup head is returning to the supply section after the solder ball is mounted, the light emitting section provided in the dark box constituting the pickup head emits light, and the suction hole is provided. By detecting the light of the light emitting portion leaking out of the dark box from the above, it is possible to easily determine the presence or absence of a mounting error of the solder ball.

[0009]

Next, an embodiment of the present invention will be described. FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a pickup head of the solder ball mounting apparatus, and FIG. FIG. 4 is a perspective view of a pickup head, a light emitting device, and a light receiving device of the solder ball mounting device, FIGS. 5 and 6 are explanatory diagrams of the transmission film, and FIGS. 7 and 8 are explanatory diagrams of the reflective film. It is.

In FIG. 1, reference numeral 11 denotes a pickup head. The pickup head 11 is held by a block 12. The block 12 is mounted on a guide rail 14 provided on a front surface of a bracket 13 so as to be vertically movable. A nut 15 is provided integrally with the block 12, and a vertical feed screw 16 is screwed to the nut 15. Therefore, when the motor 17 is driven forward and backward to rotate the feed screw 15 forward and backward, the pickup head 11 is guided by the guide rail 14 and moves up and down.

A nut (not shown) provided on the back surface of the bracket 13 is screwed to a horizontal feed screw 18.
19 is a holding table for the feed screw 18. Accordingly, when the motor 20 is driven forward and backward, the feed screw 18 rotates forward and backward, and the pickup head 1 held by the bracket 13 is rotated.
1 moves horizontally in the X direction.

A supply section 21 for the solder balls 1 is provided below a moving path of the pickup head 11. The supply unit 21 is formed of a container, and is supported by a box 22. A hole 23 is formed at the bottom of the supply unit 21. The box 22 is placed on a base 24 and the base 2
A gas blower 25 is installed in the inside of 4. Gas such as air blown from the gas blower 25 is supplied from the hole 23 to the supply unit 21 (see the broken arrow), and the gas pressure causes the solder ball 1 to fluidize. By performing the operation, the pickup head 11 vacuum-adsorbs and picks up the solder ball 1 on its lower surface. As means for fluidizing the solder ball 1 so that the pickup head 11 easily sucks the solder ball 1 in vacuum, in addition to the above-described means for sending gas to the supply unit 21, means for vibrating the supply unit 21 with a vibrator may be used. Can be

A positioning section 26 for the substrate 5 is provided beside the supply section 21. The positioning section 26 is configured by stacking a Y table section 28 on an X table section 27 and installing a clamper 29 for clamping the substrate 5 above the Y table section 28. When the motor Mx of the X table unit 27 is driven, the substrate 5 moves in the X direction, and the Y table unit 28
Is driven, the substrate 5 moves in the Y direction. Thus, the position of the substrate 5 is adjusted by moving the substrate 5 horizontally.

In FIG. 2, the pickup head 11 has a dark box structure composed of an upper case 62 and a lower case 63, and a plurality of suction holes 64 are formed in a lower surface of the lower case 63 in a matrix. Upper case 62 and lower case 63
Is partitioned by a translucent plate 55, the inside of the lower case 63 is an airtight chamber, and is connected to the suction device 9 (FIG. 1) via the tube 8.

In FIG. 2, a transmission film 56 is provided immediately above the film 55. A reflection plate 57 is disposed on the right side of the upper case 52 with a slight inclination, and a reflection film 58 is disposed on the left side with a slight inclination. As shown in FIG. 3, a light detection sensor 59 is provided on a side portion of the reflection film 58. The optical sensor 59 is connected to a light leakage detector and a controller (not shown). A translucent plate 55 and a transmissive film 56 are provided between the upper case 62 and the lower case 63. The first reflective film 58a is provided on both sides inside the upper case 62.
And a second reflection film 58b. Therefore, the light entering from the suction hole 64 as shown by the arrow in FIG. 2 is condensed and reflected by the first reflection film 58a to the second reflection film 58b, and further, as shown in FIG. The optical sensor 59 is provided by the film 58b.
Is collected and reflected.

5 and 6 show the optical characteristics of the transmission film 56. FIG. 5 is a sectional view of the transmission film 56, and FIG. 6 is an enlarged sectional view of the same. As shown in FIG.
The upper surface of the transmission film 56 is a prism surface, and light incident from below is refracted by the prism surface and exits to both sides. Therefore, as shown in FIG. 5, the light incident from below is emitted to both sides at an acute angle a1 as a whole. a1 is approximately 2 ° to 20 °.

FIGS. 7 and 8 show the optical characteristics of the reflection film 58. FIG. 7 is a sectional view of the reflection film 58, and FIG. 8 is an enlarged sectional view of the same. As shown in FIG.
The reflection film 58 has an adhesive layer 582 on a plate 581.
An aluminum vapor-deposited layer 583 is formed between the layers, and a prism layer 584 is further laminated on the upper surface thereof. Therefore, the light incident from above is refracted and incident on the prism layer 584, is reflected by the aluminum deposition layer 583, and is refracted from the prism layer 584 and exits. Therefore, FIG.
As shown in (1), light incident from above is reflected sideways at an acute angle a2 as a whole. a2 is 2 ° to 15 °.

Since the transmission film 56 has the above-mentioned optical characteristics, the light incident from the suction hole 54 in FIG. The light emitted to the right is reflected by the reflection plate 57 toward the reflection film 58 on the left. The light emitted to the left directly enters the reflection film 58. As described above, the transmissive film 56 has a characteristic of emitting the incident light at the acute angle a1, so that the height of the upper case 62 in FIG. 2 can be reduced to make the upper case 62 compact.

In FIG. 3, light incident on the reflection film 58 from the transmission film 56 or the reflection plate 57 is reflected laterally at an acute angle a2 and enters the light detection sensor 59.
As described above, the reflection film 58 converts the incident light into the acute angle a2.
Therefore, the reflection film 58 is disposed at an acute angle a3, the length D of the reflection film 58 is reduced, and the upper case 62 can be made compact. That is, the transmission film 56 and the reflection film 58 are directional optical elements for refracting and reflecting light in an acute angle direction in order to make the pickup head 11 compact and compact.

As described above, the suction hole 64 of the lower case 63
By using the above-mentioned transmission film 56 and reflection film 58 as an optical element for making light incident from the light incident on the photodetection sensor 59, the upper case 62 can be made compact, and the pickup head 61 can be made compact.

In FIG. 3, a nozzle 65 that emits light toward the first reflection film 58a is provided on a side surface of the upper case 62.
Is installed. The nozzle 65 holds the end face of the optical fiber 66 connected to the light source 67 toward the dark box. A control unit 77 controls the light source unit 67. The end face of the optical fiber 66 held by the nozzle 65 corresponds to the light emitting section. Note that a light source may be provided in the upper case 62 instead of using the external light source unit 67 as the light emitting unit.

In FIG. 4, reference numeral 70 denotes a light emitter, which has a line light source 72 on the upper surface of a base 71. Reference numeral 73 denotes a light receiver, which has a line sensor 75 on the upper surface of a base 74. The light emitting device 70 and the light receiving device 73 are installed below the moving path of the pickup head 11. 76 is a recognition unit connected to the light receiver 73, and 77 is a control unit that controls the light emitter 70, the light receiver 73, and the recognition unit 76.

This solder ball mounting device is configured as described above, and the operation will be described next. In FIG.
In a state where the pickup head 11 is located above the supply unit 21, the motor 17 is driven forward / reverse, whereby the pickup head 11 performs a descending / upward operation, and the supply unit 21 is provided in the suction hole 32 on the lower surface thereof. The solder ball 1 is picked up by vacuum suction. At this time, the gas is blown out from the gas blower 25 to make the solder balls 1 in the supply unit 21 flow so that the pickup head 11 can easily vacuum-suck the solder balls 1 in all the suction holes 64.

Next, the pickup head 11 picking up the solder balls 1 of the supply unit 21 moves above the light emitter 70 as shown in FIG. At this time, the line light source 7
Light is irradiated from 2 to the lower surface of the pickup head 11. 2 and 3, one of the suction holes 6
4, when the solder ball 1 is not vacuum-sucked, the light leaked from the suction hole 64 is emitted from the transmission film 56 to the second reflection film 58b at an acute angle a1, as indicated by a solid arrow in the drawing. Then, the light is further reflected laterally at an acute angle a2 by the second reflection film 58b and enters the light detection sensor 59. The output signal of the optical sensor 59 is input to the light leakage detection unit, and it is found that the suction hole 32 that does not vacuum-suck the solder ball 1 exists, that is, that the pick-up of the solder ball 1 has occurred. Also in this case, by using the transmissive film 56 and the reflective films 58a and 58b, the height H2 and the lateral width D2 of the upper case 62 can be reduced and the size can be reduced.

In this case, the pickup head 11 turns back above the supply section 21 and performs the lowering / upward operation again to pick up again. Then, the pickup head 11 moves above the line light source 72 again, and determines again whether or not there is light leakage. If no light leakage is detected, it is determined that the solder balls 1 are correctly vacuum-sucked in all the suction holes 64 (that is, there is no pick-up error), and the solder balls 1 are directly moved above the substrate 5.
Then, the pickup head 1 performs the lowering / upward operation again and releases the vacuum suction state, thereby mounting the solder ball 1 on the substrate 5. Note that a flux is applied to the substrate 5 in advance.

After the pickup head 11 mounts the solder ball 1 on the substrate 5, the pickup head 11 passes above the light receiver 73 while returning to the supply section 21. At this time, the nozzle 6
5 irradiates light to the first reflective film 58a. FIG.
The dashed arrows in FIG. 3 and FIG. 3 indicate this light. The light is uniformly scattered by the light diffusion plate 69 and enters the first reflection film 58a at an acute angle a2, and is reflected by the first reflection film 58a and transmitted to the transmission film 56 at an acute angle a1 as shown in FIG. Then, the light enters the lower case 63 side, and the suction holes 64
Light is emitted downward from.

In FIG. 4, the line sensor 75 of the light receiver 74 receives the light emitted from the suction hole 64, and the output signal is input to the recognition unit 76. The control unit 77 determines whether there is a mounting error by analyzing the light that has entered the recognition unit 76. That is, if light is emitted from all the suction holes 64, it is determined that there is no mounting error. If no light is emitted from any of the suction holes 64, the suction holes 6
4 has the solder ball 1 attached thereto, and it is determined that there is a mounting error. The substrate 5 determined to have a mounting error is removed from the line as a defective product. The non-defective substrate 5 is sent to a reflow device, where the solder balls 1 are heated to generate bumps.

It is to be noted that the recognition unit 76 and the control unit 77 detect that the suction hole 64 is clogged with dust and does not emit light.
Therefore, for example, when the light is not continuously emitted from the same suction hole 64 a plurality of times, there is a possibility that the suction hole 64 is clogged with dust. In this case, a notification element such as a buzzer informs the operator to that effect. You may make it.

[0029]

As described above, according to the present invention, after the pickup head mounts the solder balls on the substrate, the presence or absence of a mounting error can be easily and reliably detected while the pickup head is returning to the supply section. .

[Brief description of the drawings]

FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a pickup head of the solder ball mounting device according to one embodiment of the present invention;

FIG. 3 is a plan sectional view of a pickup head of the solder ball mounting device according to one embodiment of the present invention;

FIG. 4 is a perspective view of a pickup head, a light emitting device, and a light receiving device of the solder ball mounting device according to one embodiment of the present invention.

FIG. 5 is an explanatory view of a transmission film according to an embodiment of the present invention.

FIG. 6 is an explanatory view of a transmission film according to an embodiment of the present invention.

FIG. 7 is an explanatory view of a reflective film according to an embodiment of the present invention.

FIG. 8 is an explanatory diagram of a reflective film according to an embodiment of the present invention.

FIG. 9 is a side view of a conventional solder ball mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 5 Substrate (work) 11 Pickup head 21 Supply part 56 Transmission film 58a First reflection film 58b Second reflection film 64 Suction hole 70 Light emitting device 72 Line light source 73 Light receiving device

Claims (2)

[Claims] 1. A solder ball mounting device for vacuum-sucking a plurality of solder balls provided on a lower surface of a pickup head, picking up solder balls provided in a solder ball supply section, and mounting the solder balls on a work. The pickup head is composed of a dark box having a plurality of suction holes formed on the lower surface,
A light emitting unit provided in the dark box; and a light receiver for receiving light of the light emitting unit leaking out of the dark box from the suction hole to the outside of the dark box in a movement path of the pickup head. Mounting equipment. 2. A method of mounting a solder ball, wherein a plurality of solder balls provided on a lower surface of a pickup head are picked up by vacuum suction of solder balls provided in a solder ball supply section, and picked up and mounted on a work. While the pickup head picks up the solder ball provided in the supply unit, transfers and mounts the solder ball to the work, and returns to the supply unit, the light emitting unit provided in the dark box constituting the pickup head emits light, and A method of mounting a solder ball, comprising detecting light emitted from a hole to the outside of the pickup head, and determining that there is no mounting error if light is emitted from all the suction holes.