KR100374289B1 - An attach method wafer and the apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer touch method and an apparatus thereof. The object of the present invention is to divide the touch process for one wafer into a plurality of blocks, and at the same time preliminarily inspect the surface of the wafer to check for defective areas and Not only does not supply lead to the solder but also supplies the lead to the wafer accurately in the dot method rather than the blow method, thereby minimizing the defect rate of the wafer due to wafer flatness and incorrect lead supply, significantly improving productivity, and at the same time, defecting the wafer. The present invention provides a method for attaching a wafer and a device for lowering the manufacturing cost by not supplying lead solder on the surface, and the configuration of the lead solder in a plurality of suction holes of the touch plate for supplying lead solder on the wafer, respectively. Suction and ball solder stored in suction hole by touching touch plate on wafer In the touch-control method of a conventional wafer that radiate supplying bolnap once the entire top surface of the wafer by the compressed air, and pre-surface geonsa The method includes pre-scan of the wafer process, and transmits the data to the controller; A ball lead suction step of sucking ball lead into the suction hole of the touch plate having a predetermined size; The wafer is divided into a plurality of blocks of a predetermined size, characterized in that it consists of an touch step of supplying the ball lead contained in the suction hole of the touch plate sequentially on each block.

Description

Touch method of wafer and its apparatus {An attach method wafer and the apparatus}

The present invention relates to a wafer touch method and an apparatus thereof. More specifically, the touch process for a single wafer is divided into a plurality of blocks, and at the same time, the surface of the wafer is preliminarily inspected to check the defective area and the defective area. Not only does not supply lead to the solder but also supplies the lead to the wafer accurately in the dot method rather than the blow method, thereby minimizing the defect rate of the wafer due to wafer flatness and incorrect lead supply, significantly improving productivity, and at the same time, defecting the wafer. The present invention relates to a wafer touch method and apparatus therefor configured to reduce manufacturing costs by not supplying lead solder on the surface.

In general, semiconductor fixing includes an touch process for supplying lead solder on a wafer to form electrodes.

In the touch process, after fixing the wafer, the solder is sucked into and accommodated in the suction holes of the touch plate in which a plurality of suction holes spaced apart from each other are formed. Then, the touch plate is disposed on the wafer and the upper surface of the wafer is disposed. It is carried out by supplying the solder at a time, wherein the solder is discharged from the suction hole by compressed air and is configured to be supplied onto the wafer.

In the conventional touch method and apparatus having such a structure, since the touch step is performed on the entire upper surface of the wafer without inspecting the surface of the wafer at one time, the solder is supplied on the damaged surface of the wafer, and unnecessary solder is consumed. Since the lead is blown from the suction hole of the touch plate and supplied to the wafer, the solder lead is not supplied to the exact position of the wafer, so the defect rate is very high, and the flatness of the wafer is performed because the touch step is performed all over the top surface of the wafer. In other words, when the flatness of the wafer is poor, defects are generated such that the ball lead discharged from the intake hole by the compressed air is not supplied to the correct position of the wafer, which significantly lowers the productivity of the work as well as the high manufacturing cost and the reliability of the product. There was a problem of being lowered.

The present invention has been made in view of the above-described conventional problems, and its object is to divide the touch process for one wafer into a plurality of blocks, and at the same time preliminarily inspect the surface of the wafer to check for unnecessary areas and to eliminate Not only do not supply lead to the site, but also supply lead on the wafer accurately in the dot method, not the blow method, which minimizes the defect rate of the wafer due to wafer flatness and incorrect lead supply and significantly improves the productivity of the wafer. The present invention provides a wafer touch method that can reduce manufacturing cost by not supplying lead solder on a defective surface.

In addition, another object of the present invention is to provide a touch apparatus for a wafer which can perform an touch process on the wafer by the touch method of the wafer.

An object of the present invention is to suck the lead in each of the plurality of suction holes of the touch plate for supplying the lead on the wafer and to approach the touch plate on the wafer to discharge the ball lead stored in the suction hole by compressed air. A conventional wafer touch method for supplying all the upper solder surfaces at one time, the method comprising: a preliminary surface drying step of preliminarily inspecting a surface of a wafer and transmitting the data to a control unit; A ball lead suction step of sucking ball lead into the suction hole of the touch plate having a predetermined size; It can be achieved by the touch method of the wafer, characterized in that it comprises a touch step of dividing the wafer into a plurality of blocks of a predetermined size and sequentially supplying the lead solder contained in the suction hole of the touch plate on each block. have.

In addition, another object of the present invention is a touch device for a wafer, wherein the touch device is a plate having a predetermined size, and is formed on a bottom surface of the dot member storage portion and a dot member storage portion which are formed to have a predetermined size on an upper surface thereof. An touch plate having a plurality of suction holes formed in a predetermined pattern and penetrating at predetermined intervals, and a plurality of coupling holes formed at predetermined intervals along an upper surface edge thereof; A plurality of dot members for hexahedron having a predetermined size and arranged to be vertically operable in the dot member storage portion of the touch plate to release the ball solder stored in the suction hole; A plurality of assembling holes disposed coaxially with the coupling holes of the plurality of dot members, each having a predetermined diameter, having a predetermined diameter, having a protrusion formed therein and protruding inwardly on an inner circumferential surface of the upper end, and having a predetermined distance between the upper edges thereof; An intermediate plate coupled to an upper surface of the touch plate, the intermediate plate having a plurality of coupling holes penetratingly formed to be coaxially disposed with the plurality of coupling holes of the touch plate, and a plurality of through holes formed at predetermined positions on the upper surface of the touch plate; A plate-shaped plate having a predetermined size and having a predetermined diameter on the upper surface and the plurality of assembling holes of the intermediate plate and the through-hole formed so as to be disposed coaxially with each other, and a plurality of coupling holes of the intermediate plate at predetermined intervals at the upper edge A support top plate having a plurality of coupling holes formed to be coaxially disposed respectively, and a plurality of main vacuum tube assembly holes formed in communication with the through hole of the intermediate plate at a predetermined position and fixed to the bracket; A plurality of coupling bolts which are assembled to the coupling hole uniaxially to stack and combine an touch plate, an intermediate plate and a support top plate; A dot operation unit which is assembled in the assembly hole of the intermediate plate and the vacuum tube assembly hole of the support upper plate so as to be operated up and down and operates the dot member up and down; A plurality of working vacuum tubes which are respectively assembled to the vacuum tube assembly holes of the support upper plate to discharge the ball solder sucked up and down by operating the dot operation unit by pneumatic pressure, and selectively block the suction holes; It can be achieved by the touch device of the wafer, characterized in that it is composed of a plurality of main vacuum tubes are respectively assembled in the main vacuum tube assembly hole of the support plate to suck the lead solder in the suction hole of the touch plate.

1 is a block diagram schematically illustrating an touch method according to the present invention;

Figure 2 is an exemplary diagram illustrating a block division state of a wafer for performing an touch step by dividing the wafer into a plurality of blocks by the touch method according to the present invention.

3 is an exploded perspective view showing the structure of the touch device according to the present invention;

Figure 4 is a plan view partially showing the touch device according to the present invention.

Figure 5 is a front view showing a partial cross-sectional view of the touch device according to the present invention.

Figure 6 is a side view showing a cross-sectional view of the touch device according to the present invention.

Fig. 7 is a partially cutaway enlarged sectional view showing the assembled state of the dot operation unit of the touch device according to the present invention;

8 is an operation state diagram showing a structure of a suction hole formed in the touch plate of the touch device according to the present invention, and a state in which the ball lead stored in the suction hole is discharged by the dots;

9 is an exemplary view illustrating a state in which the suction hole of the touch plate of the touch device according to the present invention has a predetermined pattern and is formed therethrough.

♣ Explanation of symbols for main parts of drawing ♣

10: touch device 11: dot member storing part

12: suction hole 13, 17, 21: coupling hole

14: touch plate 15: dot member

16: Assembler 18: Through Hole

19: intermediate plate 20: vacuum tube assembly

22: main vacuum tube assembly 23: support top plate

24: coupling bolt 25: dot operation unit

26: working vacuum tube 27: main vacuum tube

50: Vol Na

Hereinafter, with reference to the accompanying drawings will be described in the wafer touch method and apparatus according to a preferred embodiment of the present invention.

1 is a block diagram schematically illustrating an touch method according to the present invention, and FIG. 2 is a block division state of a wafer for performing an touch step by dividing the wafer into a plurality of blocks by the touch method according to the present invention. 3 is an exploded perspective view showing the structure of the touch device according to the present invention, FIG. 4 is a plan view partially showing the touch device according to the present invention, and FIG. 5 is the present invention. Figure 6 is a front view showing a partial cross-sectional view of the touch device according to the present invention, Figure 6 is a side view showing a cross-sectional view of the touch device according to the present invention, Figure 7 is an assembly state of the dot operation unit of the touch device according to the present invention 8 is an enlarged cross-sectional view of a partially cut away view, and FIG. 8 is a structure of a suction hole formed in the touch plate of the touch device according to the present invention, and a state in which the ball solder stored in the suction hole is discharged by dots. 9 is an exemplary view illustrating a state in which the suction hole of the touch plate of the touch device according to the present invention has a predetermined pattern therethrough.

1 to 9, the touch method according to the present invention includes a preliminary surface inspection step 100, a ball lead suction step 101, and an touch step 102.

The preliminary surface inspection step 100 preliminarily inspects the wafer surface to be subjected to the touch process and transmits the data to the controller.

The ball solder suction step 101 sucks the lead solder into the suction hole of the touch plate having a predetermined size, stores the lead solder in the suction hole, and the touch step 102 on the wafer with the touch plate loaded with the lead solder. Conduct.

The touch step 102 does not perform the touch process on the entire upper surface of the wafer at one time, but divides the wafer into a plurality of blocks of a predetermined size, and has an area capable of touching only the divided blocks. Each block is touched in sequence. That is, after supplying the ball solder contained in the suction hole of the touch plate on the block of the wafer to be touched, the ball solder suction step 101 is performed again to store the lead solder in the suction hole of the touch plate. The soldering step 101 and the touching step 102 are successively alternated by the number of divided blocks in such a manner as to supply the solder on the next block of the wafer, thereby completing the touch processing on the wafer. At this time, the method for discharging the ball solder contained in the suction hole is not a blow method for discharging onto the wafer by compressed air as in the prior art, but a dot installed on the upper side of the suction hole so as to be operated up and down operates downward so that the ball solder in the suction hole can be operated. In this way, the solder is supplied to the correct position of the wafer, and the wafer is preferably divided into a plurality of blocks to perform the touch step.

In addition, the touch method of the wafer according to the present invention further includes a suction tolerance blocking step (103).

The suction hole blocking step 103 is performed by the touch plate before the ball solder suction step 101 for the touch of each block according to the surface inspection data for each block of the wafer obtained in the preliminary surface inspection step 100. Blocking the suction hole corresponding to the defective part of the wafer block in the suction hole of the wafer block to prevent the solder lead into the suction hole corresponding to the defective part, and not only blocks the suction hole corresponding to the defective part of the wafer block but also the wafer By blocking the suction hole outside the effective surface by the dot, it is possible to prevent unnecessary consumption of the lead solder even when performing the touch step on the corner block.

In the touch method of the wafer according to the present invention having the configuration as described above, since the touch step 102 is performed by dividing the wafer into a plurality of blocks having a predetermined size, even if the flatness of the wafer is poor, the soldering of the wafer is accurate. The defect rate can be minimized by supplying it to the location, and the ball lead stored in the suction hole is pushed to the dot and supplied on the wafer, thereby minimizing the defect rate by supplying the lead by preventing the lead solder from diffusing and leaving the correct position on the wafer. It can be done.

Hereinafter, the structure of the touch apparatus for implementing the touch method of the wafer which concerns on the said invention is demonstrated concretely.

The touch device 10 of the wafer according to the present invention includes an touch plate 14, a plurality of dot members 15, an intermediate plate 19, a support top plate 23, and a plurality of coupling bolts 24. ), A dot operating unit 25, a plurality of working vacuum tubes 26, and a plurality of main vacuum tubes 27.

The touch plate 14 is a plate having a predetermined size, and includes a dot member housing 11, a plurality of suction holes 12, and a plurality of coupling holes 13.

The dot member accommodating part 11 is formed to have a predetermined size on the upper surface of the touch plate 14, and the plurality of suction holes 12 have a predetermined pattern on the bottom surface of the dot member accommodating part 11. The plurality of coupling holes 13 are formed at predetermined intervals from each other, and the plurality of coupling holes 13 are formed at predetermined intervals along the upper edge of the touch plate 14.

The plurality of dot members 15 are hexahedral bodies having a predetermined size and are stored in the dot member housing 11 of the touch plate 14 in a vertically aligned state so as to be accommodated in the suction hole 12. For discharging 50, a plurality of dots 15a, coupling holes, and a plurality of ventilation grooves 15c are provided.

The plurality of dots 15a have a predetermined pattern on the lower surface of the dot member 15 and are formed to protrude downwardly at predetermined intervals from each other to be detachably fitted to the suction hole 12, respectively, and the coupling hole 15b is provided. Silver is formed in the central portion of the upper surface of the dot member 15, the plurality of ventilation grooves (15c) are formed to be recessed to face each other in the middle portion on both sides of the dot member (15).

The intermediate plate 19 is provided with a plurality of assembling holes 16, a plurality of coupling holes 17, and a plurality of through holes 18 as a flat plate having a predetermined size, and is disposed on an upper surface of the touch plate 14. Laminated and joined.

The plurality of assembly holes 16 have a predetermined diameter and are formed to be coaxially disposed with the coupling holes 15b of the dot member 15 at predetermined intervals from each other on the upper surface of the intermediate plate 19, and have an upper side. The inner circumferential surface is integrally formed with protrusions projecting inwardly.

The plurality of coupling holes 17 are formed so as to be coaxially disposed with the plurality of coupling holes 13 of the touch plate 14 at predetermined intervals on the upper edge of the intermediate plate 19, respectively. The through hole 18 is formed through a predetermined position on the upper surface of the intermediate plate (19).

The support upper plate 23 is a plate having a predetermined size and is provided with a plurality of vacuum tube assembly holes 20, a plurality of coupling holes 21, and a plurality of main vacuum tube assembly holes 22 and fixed horizontally to the bracket 51. Is installed.

The plurality of vacuum tube assembly holes 20 have a predetermined diameter on the upper surface of the support upper plate 23 and are formed to be coaxially disposed with the plurality of assembly holes 16 of the intermediate plate 19, respectively, and the plurality of couplings The balls 21 are formed to be coaxially arranged with the plurality of coupling holes 17 of the intermediate plate 19 so as to be spaced apart from each other at the upper edge of the support upper plate 23, respectively, the main vacuum tube assembly hole 22 Is formed in communication with the through hole 18 of the intermediate plate 19 at a predetermined position of the intermediate plate 19.

The plurality of coupling bolts 24 are assembled uniaxially in the coupling holes 13, 17, 21 of the touch plate 14, the intermediate plate 19, and the support upper plate 23, and then the touch plate 14. ), The intermediate plate 19 and the support top plate 23 are bonded in a stacked state.

The dot operation unit 25 is assembled to the up and down operation in the assembly hole 16 of the intermediate plate 19 and the vacuum tube assembly hole 20 of the support upper plate 23 to operate the dot member 15 up and down. And a main body 25a, a cap 25b, a plurality of elastic members 25c and 25e, an upper member 25d and a link member 25f.

The main body 25a is a tubular shape having a predetermined diameter and a length, and has a locking protrusion 25a 'at a predetermined position on an outer circumferential surface thereof, and is assembled upwardly through the through hole 18 of the intermediate plate 19, and the cap 25b. Has a through hole 25b 'having an assembly groove formed at an opposite inner circumference thereof, and is assembled to an upper end portion of the main body 25a, and the elastic member 25c is assembled to a lower outer circumferential surface of the main body 25a and thus the main body 25a. Is elastically supported upward, and the upper member 25d is a round bar having a predetermined diameter and length, the upper end of which is assembled to the tube assembly hole 20 of the support upper plate 23, and the lower end of the cap 25b is formed in the through hole of the cap 25b. It is assembled to operate up and down, and the elastic member 25e is assembled to the lower outer peripheral surface of the upper member 25d to elastically support the upper member 25d upward, and the link member 25f has a predetermined diameter and length. Block having protruding outward along the outer circumferential surface of the middle part 25f 'and the upper end is assembled below the through hole 18 of the intermediate plate 19, and the lower end is assembled to the engaging hole 15b of the dot member 15 to provide the dot member 15 and the dot operation unit ( 25) are connected.

The plurality of working vacuum tubes 26 are assembled to the vacuum tube assembly holes 20 of the support upper plate 23, respectively, to operate the dot operating unit 25 up and down by pneumatic pressure to discharge the sucked ball lead 50, and suction The ball 12 is selectively blocked.

The plurality of main vacuum tubes 27 are respectively assembled to the main vacuum tube assembly holes 22 of the support upper plate 23 to suck and receive the ball lead 50 into the suction holes 12 of the touch plate 14.

According to the present invention described above, the touch process for one wafer is divided into a plurality of blocks, and at the same time, the surface of the wafer is preliminarily inspected to check the defective area and not to supply solder to unnecessary parts. By supplying the wafer accurately on the wafer, not the blow method, it minimizes the defect rate of the wafer due to wafer flatness and incorrect lead supply, significantly improves the productivity, and does not supply the solder on the defective surface of the wafer. Has the effect of lowering.

Claims (9)

Each of the lead solders is sucked into a plurality of suction holes of the touch plate for supplying lead solders on the wafer, and the touch plate is approached on the wafer to release the lead solder stored in the suction holes by compressed air to the entire upper surface of the wafer. A conventional wafer touch method for supplying lead solders, the method comprising: a preliminary surface inspection step (100) of preliminarily inspecting a surface of a wafer and transmitting the data to a control unit; A ball lead suction step (101) for sucking the lead into the suction hole of the touch plate having a predetermined size; And a touch step (102) for dividing the wafer into a plurality of blocks of a predetermined size and supplying the lead solder contained in the suction hole of the touch plate sequentially on each block. The method according to claim 1, wherein the method includes suction corresponding to an unnecessary part of the suction hole of the touch plate in the ball solder suction step for the touch of each block according to the surface inspection data for each block obtained in the preliminary surface inspection step 100. Touching the wafer, characterized in that it comprises a suction hole blocking step (103) for blocking the ball to be stored in the ball lead into the suction hole corresponding to the unnecessary area. The method according to claim 1, wherein the touch step (102) pushes each ball contained in the suction hole of the touch plate to a dot to supply the ball lead onto the wafer. The method according to claim 1, wherein the touch step (102) is performed by dividing the wafer into a plurality of blocks. The method according to claim 2, wherein the suction hole blocking step (103) is also carried out with respect to the suction hole of the touch plate outside the effective surface of the wafer in the touch step. In the touch device for wafers, the touch device 10 is a plate having a predetermined size, and has a dot member storage portion 11 that is formed to have a predetermined size on a top surface thereof, and a bottom surface of the dot member storage portion 11. A touch plate (14) having a plurality of suction holes (12) formed in a predetermined pattern at a predetermined interval therebetween, and a plurality of coupling holes (13) formed at predetermined intervals along an upper surface edge thereof; A hexahedron having a predetermined size is stored in the dot member storage portion 11 of the touch plate 14 in a state of being aligned up and down so as to discharge the ball storage 50 stored in the suction hole 12. A dot member 15; A plurality of assembling holes, each having a predetermined diameter, having a predetermined diameter and having a protrusion formed through the inner peripheral surface of the upper side and protruding inwardly, and arranged coaxially with the coupling holes 15b of the plurality of dot members 15, respectively. 16 and a plurality of coupling holes 17 formed to be coaxially disposed with the plurality of coupling holes 13 of the touch plate 14 at predetermined intervals on the upper edge thereof, and penetrating at predetermined positions on the upper surface. An intermediate plate (19) having a plurality of through holes (18) formed therein and coupled to an upper surface of the touch plate (14); A plurality of vacuum tube assembly holes 20 formed in a plate shape having a predetermined size and having a predetermined diameter on the upper surface thereof and are formed to be coaxially disposed with the plurality of assembly holes 16 of the intermediate plate 19, respectively, and a predetermined distance between the upper edges thereof. A plurality of coupling holes 21 formed through the plurality of coupling holes of the intermediate plate 19 so as to be disposed coaxially with each other, and a plurality of coupling holes 21 formed in communication with the through hole 18 of the intermediate plate 19 at a predetermined position. A support top plate 23 having two main vacuum tube assembly holes 22 and fixed to the bracket 51 horizontally; A plurality of coupling bolts 24 which are assembled to the coupling holes 13, 17, 21 uniaxially to stack and attach the touch plate 14, the intermediate plate 19, and the support top plate 23; A dot operation unit (25) which is assembled in the assembly hole (16) of the intermediate plate (19) and the vacuum tube assembly hole (20) of the support upper plate (23) so as to be operated up and down and operates the dot member (15) up and down; Assembled in each of the vacuum tube assembly hole 20 of the support top plate 23, the dot operation unit 25 is operated up and down by pneumatic to discharge the sucked ball lead 50, and selectively block the suction hole 12 A plurality of working vacuum tubes 26 for; The main vacuum tube assembly hole 22 of the support upper plate 23, respectively, is composed of a plurality of main vacuum tube 27 for sucking and storing the ball lead 50 in the suction hole 12 of the touch plate 14 Touch device for wafers, characterized in that. According to claim 6, The dot member 15 is a plurality of dots (15a) having a predetermined pattern on the lower surface and are formed to be protruded downwardly spaced apart from each other to be detachably fitted in the suction hole 12, respectively, A coupling device (15b) formed in the upper center portion, and a plurality of vent grooves (15c) formed on the opposite side to be opposed to each other in the middle portion, the touch device of the wafer. The method of claim 6, wherein the plurality of suction holes 12 of the touch plate 14 is formed through a predetermined diameter, the predetermined width in the upper end in order to prevent the stored ball lead 50 is discharged upwards And an ejection preventing protrusion (12a) each integrally formed to protrude inwardly. 7. The dot operation unit (25) according to claim 6, wherein the dot operation unit (25) has a locking protrusion at a predetermined position on an outer circumferential surface thereof, and a main body (25a) assembled upwardly through the through hole (18) of the intermediate plate (19), and an assembly groove at an opposite inner circumference thereof. Cap 25b having a formed through hole 25b 'and assembled to an upper end of the main body 25a, and an elastic member 25c assembled to a lower outer peripheral surface of the main body 25a to elastically support the main body 25a upwardly. ), The upper end is assembled to the tube assembly hole 20 of the support upper plate 23, the lower end is an upper member (25d) is assembled to enable the vertical operation in the through hole of the cap (25b), and the upper member (25d) An elastic member 25e that is assembled to the lower outer peripheral surface of the upper member 25d to elastically support the upper member 25d upwardly, and has a predetermined diameter and length as an annular bar 25b 'which protrudes outwardly along the outer peripheral surface of the middle portion. The upper end is assembled below to the through hole 18 of the intermediate plate 19 and the lower end is the dot Touch control system of the wafer, characterized in that incorporated into the fitting hole (15b) of the material (15) consisting of a link member (25f) connecting the dots member 15 and the operation unit dot 25.