JPH1138109A - Magnetic sensor - Google Patents
Magnetic sensorInfo
- Publication number
- JPH1138109A JPH1138109A JP9209740A JP20974097A JPH1138109A JP H1138109 A JPH1138109 A JP H1138109A JP 9209740 A JP9209740 A JP 9209740A JP 20974097 A JP20974097 A JP 20974097A JP H1138109 A JPH1138109 A JP H1138109A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic sensor
- sensor element
- paint layer
- conductive paint
- electrode pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000012943 hotmelt Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 2
- 239000012778 molding material Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は磁気センサに関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic sensor.
【0002】[0002]
【従来の技術】従来、磁気抵抗を利用して磁界の状態を
検出する磁気センサが開発され、種々の電子機器に利用
されている。2. Description of the Related Art Conventionally, magnetic sensors for detecting the state of a magnetic field using a magnetic resistance have been developed and used for various electronic devices.
【0003】図8はこの種の従来の磁気センサの1使用
例を示す図であり、同図(a)は平面図、同図(b)は
同図(a)のa−a断面図である。FIG. 8 is a view showing one example of use of a conventional magnetic sensor of this type. FIG. 8A is a plan view, and FIG. 8B is a sectional view taken along a line aa in FIG. is there.
【0004】同図において100は面対向型ブラシレス
DCモータであり、その上面には回転駆動されるロータ
ヨーク111が取り付けられている。In FIG. 1, reference numeral 100 denotes a surface-facing brushless DC motor, on which a rotatable rotor yoke 111 is mounted.
【0005】ロータヨーク111の外周側面には、ロー
タヨーク111の回転速度を検出するための磁石113
が取り付けられており、磁石113の外周側面近傍の固
定ヨーク101上には、磁石113の磁気を検出する磁
気センサ117が取り付けられている。A magnet 113 for detecting the rotational speed of the rotor yoke 111 is provided on the outer peripheral side of the rotor yoke 111.
A magnetic sensor 117 for detecting the magnetism of the magnet 113 is mounted on the fixed yoke 101 near the outer peripheral side surface of the magnet 113.
【0006】磁気センサ117は平板状に形成された磁
気センサ素子117aを樹脂製のホルダ117bに取り
付けると共に、磁気センサ素子117aの前面に半田1
17dにて接続された4本の金属端子117cをホルダ
117bの裏面側に引き出して固定ヨーク101上に設
けた図示しない回路パターンに半田119で接続する。The magnetic sensor 117 has a plate-shaped magnetic sensor element 117a mounted on a resin holder 117b and a solder 1 on the front surface of the magnetic sensor element 117a.
The four metal terminals 117c connected at 17d are pulled out to the back side of the holder 117b and connected to a circuit pattern (not shown) provided on the fixed yoke 101 by solder 119.
【0007】[0007]
【発明が解決しようとする課題】しかしながら上記従来
の磁気センサ117にあっては以下のような問題点があ
った。 上記構造の磁気センサ117を製造するには、磁気セ
ンサ素子117aに金属端子117cを固定する工程
と、モールド樹脂製のホルダ117bを成型する工程
と、ホルダ117bに磁気センサ素子117aを取り付
ける工程の3工程必要となり、その製造が煩雑で、特に
量産時の製造コストの低減化を阻害していた。However, the conventional magnetic sensor 117 has the following problems. In order to manufacture the magnetic sensor 117 having the above structure, there are three steps: a step of fixing the metal terminal 117c to the magnetic sensor element 117a, a step of molding the mold resin holder 117b, and a step of attaching the magnetic sensor element 117a to the holder 117b. This necessitates a process, which complicates the production, and hinders a reduction in the production cost, especially during mass production.
【0008】磁気センサ素子117aへの金属端子1
17cの固定は半田117dで行なわれるが、その接続
強度は十分と言えず、従って図8(b)に示すように半
田117dの上に補強剤117fを塗布する必要があ
り、この点からも製造コストの低減化を阻害していた。[0008] Metal terminal 1 to magnetic sensor element 117a
Although the fixing of 17c is performed by the solder 117d, the connection strength is not sufficient. Therefore, as shown in FIG. 8B, it is necessary to apply a reinforcing agent 117f on the solder 117d. This hindered cost reduction.
【0009】本発明は上述の点に鑑みてなされたもので
ありその目的は、製造が容易で且つ金属端子の磁気セン
サ素子への固定も確実に行なえる磁気センサを提供する
ことにある。The present invention has been made in view of the above points, and an object of the present invention is to provide a magnetic sensor which is easy to manufacture and can securely fix a metal terminal to a magnetic sensor element.
【0010】[0010]
【課題を解決するための手段】上記問題点を解決するた
め本発明は、基板の表面に磁気抵抗パターンと該磁気抵
抗パターンから引き出した電極パターンとを設けてなる
磁気センサ素子と、一端が前記磁気センサ素子の電極パ
ターンに接続される金属板製の端子と、前記磁気抵抗パ
ターン形成面を露出すると共に前記端子の他端を外部に
突出した状態で前記磁気センサ素子と端子とをインサー
ト成型してなる成型品とを具備して磁気センサを構成し
た。また本発明は、前記磁気センサ素子の電極パターン
の表面に、導電塗料層を形成することとした。また本発
明は、前記電極パターンと端子の間に、弾性導電塗料層
を介在せしめることとした。また本発明は、前記電極パ
ターンと端子の間に、ホットメルトタイプの導電性接着
剤を介在せしめることとした。According to the present invention, there is provided a magnetic sensor element comprising a magnetoresistive pattern provided on a surface of a substrate and an electrode pattern drawn from the magnetoresistive pattern, and one end of which is provided with the magnetic sensor element. A metal plate terminal connected to the electrode pattern of the magnetic sensor element, and the magnetic sensor element and the terminal are insert-molded while exposing the magnetoresistive pattern forming surface and projecting the other end of the terminal to the outside. And a molded product comprising the magnetic sensor. According to the present invention, a conductive paint layer is formed on the surface of the electrode pattern of the magnetic sensor element. According to the present invention, an elastic conductive paint layer is interposed between the electrode pattern and the terminal. In the present invention, a hot-melt type conductive adhesive is interposed between the electrode pattern and the terminal.
【0011】[0011]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。図1は本発明の一実施形態に
かかる磁気センサ10を示す斜視図であり、図2は図1
のA−A断面図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing a magnetic sensor 10 according to an embodiment of the present invention, and FIG.
It is AA sectional drawing of.
【0012】両図に示すように磁気センサ10は、平板
状の磁気センサ素子15の下部(下記する電極パターン
155)に、4本の金属端子20の一端を接続した状態
で、その周囲に直接成型品30をモールド成型して構成
されている。以下各構成部材について説明する。As shown in FIGS. 1 and 2, the magnetic sensor 10 has one end of four metal terminals 20 connected to a lower portion (an electrode pattern 155 described below) of a flat magnetic sensor element 15 and directly connected to the periphery thereof. The molded product 30 is formed by molding. Hereinafter, each component will be described.
【0013】ここで図3は磁気センサ素子15を示す拡
大斜視図である。同図に示すように磁気センサ素子15
は、平板状のガラス,シリコン若しくはセラミックから
なる基板151の表面に、所望の磁気抵抗パターン15
3と、該磁気抵抗パターン153から引き出された4本
の電極パターン155とを形成することによって構成さ
れている。各電極パターン155は基板151の下辺近
傍に設けられている。なお磁気抵抗パターン153部分
はパーマロイ薄膜の上に保護膜をコートすることにより
形成され、また電極パターン155はその最上層として
ニッケル層や銅層を蒸着や無電解メッキにて形成するこ
とで構成されている。FIG. 3 is an enlarged perspective view showing the magnetic sensor element 15. As shown in FIG. As shown in FIG.
A desired magnetoresistive pattern 15 is formed on the surface of a substrate 151 made of flat glass, silicon or ceramic.
3 and four electrode patterns 155 drawn from the magnetoresistive pattern 153. Each electrode pattern 155 is provided near the lower side of the substrate 151. The magnetoresistive pattern 153 is formed by coating a protective film on a permalloy thin film, and the electrode pattern 155 is formed by forming a nickel layer or a copper layer as an uppermost layer by vapor deposition or electroless plating. ing.
【0014】図1,図2に戻って、成型品30は略凸形
状に成型されており、その中央には磁気センサ素子15
をその磁気抵抗パターン153形成面を露出した状態で
モールドする素子保持部31と、該素子保持部31の両
側に設けられる固定部33,35とによって構成されて
いる。固定部33には突起34が、固定部35には貫通
孔36が設けられている。Returning to FIGS. 1 and 2, the molded product 30 is molded in a substantially convex shape, and the magnetic sensor element 15 is provided at the center thereof.
Is formed with an element holding part 31 in which the surface on which the magnetoresistive pattern 153 is formed is exposed, and fixing parts 33 and 35 provided on both sides of the element holding part 31. The fixing portion 33 has a projection 34, and the fixing portion 35 has a through hole 36.
【0015】なお素子保持部31の磁気センサ素子15
の周囲3か所には、凹部32が設けられている。またそ
の一端が成型品30内で磁気センサ素子15の電極パタ
ーン155(図3参照)に接続された金属端子20の他
端は、成型品30から外部に突出して後側に折り曲げら
れている。The magnetic sensor element 15 of the element holding section 31
The recess 32 is provided in three places around the. The other end of the metal terminal 20 whose one end is connected to the electrode pattern 155 (see FIG. 3) of the magnetic sensor element 15 in the molded product 30 protrudes outside from the molded product 30 and is bent rearward.
【0016】なお本実施形態の場合、図2に示すよう
に、磁気センサ素子15の電極パターン155(図では
その厚みを示さず)上には導電塗料層161及びその上
に弾性導電塗料層163が印刷されており、前記金属端
子20は弾性導電塗料層163上に何ら接着剤なしで押
し付けられることで接続されている。In this embodiment, as shown in FIG. 2, a conductive paint layer 161 is formed on the electrode pattern 155 (the thickness is not shown in the figure) of the magnetic sensor element 15, and an elastic conductive paint layer 163 is formed thereon. Are printed, and the metal terminals 20 are connected by being pressed onto the elastic conductive paint layer 163 without any adhesive.
【0017】ここで導電塗料層161の材質としては例
えばフェノール系熱硬化性樹脂に銀粉を混練したものな
どを用いる。なお導電塗料層161の材質は電極パター
ン155上に印刷形成できるものであればどのようなも
のであっても良い。Here, as the material of the conductive paint layer 161, for example, a material obtained by kneading silver powder with a phenolic thermosetting resin is used. The material of the conductive paint layer 161 may be any material as long as it can be printed on the electrode pattern 155.
【0018】また弾性導電塗料層163の材質として
は、熱硬化性の架橋型ウレタン樹脂に銀粉を混練したも
のなどを用いる。この弾性導電塗料層163は印刷乾燥
後であっても所定のゴム弾性を有する性質を有する。な
お弾性導電塗料層163の材質は乾燥後にゴム弾性を有
する性質を有するものであればどのような材質のもので
も良い。As the material of the elastic conductive paint layer 163, a material obtained by kneading silver powder with a thermosetting crosslinked urethane resin is used. The elastic conductive paint layer 163 has a predetermined rubber elasticity even after printing and drying. The material of the elastic conductive paint layer 163 may be any material as long as it has a property of having rubber elasticity after drying.
【0019】次にこの磁気センサ10の製造方法を説明
する。即ち磁気センサ10を製造するには、図4に示す
ようにまず下金型E上に4本の金属端子20(図4では
1本のみ示す)を載置する。Next, a method of manufacturing the magnetic sensor 10 will be described. That is, to manufacture the magnetic sensor 10, first, four metal terminals 20 (only one is shown in FIG. 4) are placed on the lower mold E as shown in FIG.
【0020】次に予め磁気センサ素子15の4つの電極
パターン155上にそれぞれ導電塗料層161と弾性導
電塗料層163を印刷乾燥形成しておいたものを用意
し、この磁気センサ素子15をその磁気抵抗パターン1
53形成面を下にして下金型E上に載置する。その際磁
気センサ素子15は下金型Eに設けた3つのガイド突起
E1(図には2つのみ示すが、もう1本のガイド突起E
1は図4に示す右側のガイド突起E1の紙面手前側であ
って磁気センサ素子15の紙面手前側の外周側面をガイ
ドする位置に設けられている)の間にガイドされて位置
決めされる。即ち図1に示す3つの凹部32は、3つの
ガイド突起E1を設けることによって形成される。この
とき前記4つの弾性導電塗料層163の表面が各金属端
子20の一端面に直接当接する。Then, a conductive paint layer 161 and an elastic conductive paint layer 163 are formed on the four electrode patterns 155 of the magnetic sensor element 15 in advance by printing and drying, respectively. Resistance pattern 1
It is placed on the lower mold E with the 53 forming surface facing down. At this time, the magnetic sensor element 15 has three guide projections E1 provided on the lower mold E (only two are shown in FIG.
Numeral 1 is positioned on the front side of the right guide projection E1 shown in FIG. 4 and provided at a position to guide the outer peripheral side of the magnetic sensor element 15 on the front side of the paper surface). That is, the three concave portions 32 shown in FIG. 1 are formed by providing three guide projections E1. At this time, the surfaces of the four elastic conductive paint layers 163 directly contact one end surfaces of the metal terminals 20.
【0021】なお磁気センサ素子15を下金型E上に載
置した際、図4に示す矢印B方向にエアを吹きかけるこ
とによって、磁気センサ素子15の上端部分bをガイド
突起E1の根元a部分に確実に当接せしめて両者間に隙
間が生じることを防止し、確実に磁気センサ素子15の
位置決めを行なうようにしても良い。When the magnetic sensor element 15 is placed on the lower mold E, the upper end b of the magnetic sensor element 15 is blown in the direction of arrow B shown in FIG. The magnetic sensor element 15 may be reliably positioned so that a gap is not formed between the magnetic sensor element 15 and the magnetic sensor element 15.
【0022】次に下金型Eの上に上金型Fを載置して金
属端子20を挟持し、この状態で上金型F側に設けたピ
ンゲートF1から例えば260℃程度で射出圧力例えば
100〜600kgf/cm2程度の高温高圧の溶融モ
ールド樹脂、例えばポリブチレンテレフタレート(PB
T)やポリエチレンテレフタレート(PET)やポリフ
ェニレンスルフイド(PPS)等を圧入して、上下金型
F,Eにそれぞれ設けたキャビティーF3,E3内をモ
ールド樹脂で満たす。Next, the upper mold F is placed on the lower mold E to clamp the metal terminal 20. In this state, the injection pressure is, for example, about 260 ° C. from the pin gate F1 provided on the upper mold F side. A high-temperature and high-pressure molten mold resin of about 100 to 600 kgf / cm 2 , for example, polybutylene terephthalate (PB
T), polyethylene terephthalate (PET), polyphenylene sulfide (PPS) or the like is press-fitted, and the cavities F3 and E3 provided in the upper and lower molds F and E are filled with a mold resin.
【0023】この溶融モールド樹脂の射出圧力によって
各金属端子20はそれぞれ弾性導電塗料層163に押し
付けられるので、図5に示すように、弾性導電塗料層1
63が厚み方向に若干押圧されて弾性変形した状態でそ
の周囲にモールド樹脂(即ち成型品30)が満たされる
こととなる。なお弾性導電塗料層163と金属端子20
の当接面は何ら接着剤で接着されておらず、単に機械的
に圧接(弾接)されているだけであるが、その電気的接
続は十分なものである。Each metal terminal 20 is pressed against the elastic conductive paint layer 163 by the injection pressure of the molten mold resin. As shown in FIG.
63 is slightly pressed in the thickness direction and is elastically deformed, so that the periphery thereof is filled with the mold resin (that is, the molded product 30). The elastic conductive paint layer 163 and the metal terminals 20
The contact surface is not bonded with any adhesive and is merely mechanically pressed (elastic contact), but the electrical connection is sufficient.
【0024】そして前記溶融モールド樹脂が固化した後
に上下金型F,Eを取り外し、その後、図1,図2に示
すように金属端子20を成型品30の後側に折り曲げれ
ば磁気センサ10が完成する。After the molten mold resin has solidified, the upper and lower molds F and E are removed, and then the metal terminal 20 is bent to the rear side of the molded product 30 as shown in FIGS. Complete.
【0025】なお上記実施形態においてピンゲートF1
の位置を図示の位置、即ち磁気センサ素子15の下部近
傍位置(図4では磁気センサ素子15の右端近傍位置)
にしたのは、ピンゲートF1から溶融モールド樹脂を射
出した際に、該溶融モールド樹脂が磁気センサ素子15
を上方向(図4では左方向)に押し上げて、常に磁気セ
ンサ素子15の上端部分bがガイド突起E1の根元a部
分に当接するようにして、確実に磁気センサ素子15の
金型E,F内での位置決めが行なえるようにするためで
ある。ピンゲートF1をこの位置にした場合は、前述の
エアの吹き付け等による位置決め手段は必ずしも必要な
く、また逆に前記エアの吹き付け等による他の位置決め
手段を行なう場合はピンゲートF1の位置は別の場所と
しても良いが、両者を行なうとさらに効果的であること
は言うまでもない。In the above embodiment, the pin gate F1
Is the position shown in the figure, that is, a position near the lower portion of the magnetic sensor element 15 (in FIG. 4, a position near the right end of the magnetic sensor element 15).
The reason is that when the molten mold resin is injected from the pin gate F1, the molten mold resin
Is pushed upward (to the left in FIG. 4) so that the upper end portion b of the magnetic sensor element 15 is always in contact with the base a of the guide projection E1, so that the dies E and F of the magnetic sensor element 15 are surely formed. This is because the positioning in the inside can be performed. When the pin gate F1 is at this position, the above-described positioning means by air blowing or the like is not necessarily required. Conversely, when another positioning means by air blowing or the like is performed, the position of the pin gate F1 is set to another location. It is good, but it goes without saying that both are more effective.
【0026】ところでこの実施形態において、電極パタ
ーン155と金属端子20の間に弾性導電塗料層163
を介在させたのは以下の理由による。即ち、成型品30
が周囲の温度変化に伴って多少熱膨張・収縮を行なうこ
とで前記弾性導電塗料層163と金属端子20の圧接部
分周囲のモールド樹脂が膨張・収縮を行なったとして
も、該膨張・収縮量は前記弾性導電塗料層163の弾性
変形量の変化が吸収し、金属端子20と弾性導電塗料層
163は常に適正な弾接力で弾接状態を保つことがで
き、従って両者間に接続不良が生じる恐れがなくなるか
らである。In this embodiment, the elastic conductive paint layer 163 is provided between the electrode pattern 155 and the metal terminal 20.
The reason for intervening is as follows. That is, the molded product 30
Even if the mold resin expands and contracts around the pressure contact portion between the elastic conductive paint layer 163 and the metal terminal 20 by slightly expanding and contracting with the surrounding temperature change, the amount of expansion and contraction is The change in the amount of elastic deformation of the elastic conductive paint layer 163 is absorbed, and the metal terminal 20 and the elastic conductive paint layer 163 can always maintain an elastic contact state with an appropriate elastic contact force. Is no longer there.
【0027】なお電極パターン155と金属端子20の
接続部分は、図7(a)に示すように導電塗料層161
を省略して弾性導電塗料層163のみとしても良いし、
また逆に図7(b)に示すように弾性導電塗料層163
を省略して導電塗料層161のみとしても良い。これら
の場合も金属端子20との接着剤による接着は不要であ
る。The connection between the electrode pattern 155 and the metal terminal 20 is formed by a conductive paint layer 161 as shown in FIG.
May be omitted and only the elastic conductive paint layer 163 may be provided.
On the contrary, as shown in FIG. 7B, the elastic conductive paint layer 163 is formed.
May be omitted and only the conductive paint layer 161 may be used. Also in these cases, bonding with the metal terminal 20 by an adhesive is unnecessary.
【0028】導電塗料層161のみの場合は、弾性導電
塗料層163のようにゴム弾性は期待できないが、導電
塗料層161を構成する樹脂材の樹脂弾性は期待でき、
この場合は成型品30をモールドした後に該成型品30
が固化して冷える際の永久収縮力を利用して金属端子2
0との接続を強固に行なう。成型品30の材質として熱
膨張・収縮量の少ないものを選べばその接続状態は何ら
問題なく良好に保てる。When only the conductive paint layer 161 is used, rubber elasticity cannot be expected as in the case of the elastic conductive paint layer 163, but resin elasticity of the resin material constituting the conductive paint layer 161 can be expected.
In this case, after molding the molded article 30, the molded article 30
Metal terminal 2 utilizing the permanent shrinkage force when the material solidifies and cools
The connection with 0 is made firmly. If a material having a small amount of thermal expansion and contraction is selected as the material of the molded product 30, the connection state can be maintained well without any problem.
【0029】なお導電塗料層161と弾性導電塗料層1
63の両者を省略して、金属端子20を直接図3に示す
電極パターン155を構成する銅層やニッケル層の上に
接続するようにした場合は、銅層やニッケル層の表面が
平滑で硬いので、これに金属端子20を直接当接して
も、両者間が全くクッション性のない状態で当接し、従
ってその接続状態は良好とは言えない。一方上述のよう
に表面があまり平滑でなくしかも前記銅層などに比べて
クッション性のある導電塗料層161及び/又は弾性導
電塗料層163を印刷しておけば、接着剤なしでも金属
端子20との接続状態が確実に良好に保てる。The conductive paint layer 161 and the elastic conductive paint layer 1
When the metal terminal 20 is directly connected to the copper layer or the nickel layer constituting the electrode pattern 155 shown in FIG. 3 by omitting both of the layers 63, the surface of the copper layer or the nickel layer is smooth and hard. Therefore, even if the metal terminal 20 is directly in contact with the metal terminal 20, the metal terminal 20 and the metal terminal 20 are brought into contact with no cushioning property at all, and the connection state is not good. On the other hand, as described above, if the conductive paint layer 161 and / or the elastic conductive paint layer 163 whose surface is not very smooth and which has a cushioning property as compared with the copper layer or the like are printed, the metal terminals 20 can be formed without an adhesive. Can be reliably maintained in a good condition.
【0030】なお図1に示す成型品30に設けた突起3
4はこの磁気センサ10を固定する固定部材(図8にお
いては固定ヨーク101)に設けた孔内に回動自在に挿
入するためのものであり、また貫通孔36はこれに挿入
する図示しないビス(図8(a)に示すビス118がこ
れに相当する)にてこの磁気センサ10を固定部材に固
定するためのものである。The protrusion 3 provided on the molded product 30 shown in FIG.
Numeral 4 is for rotatably inserting the magnetic sensor 10 into a hole provided in a fixing member (fixed yoke 101 in FIG. 8) for fixing the magnetic sensor 10. A through hole 36 (not shown) is inserted into the through hole 36. (The screw 118 shown in FIG. 8A corresponds to this) for fixing the magnetic sensor 10 to the fixing member.
【0031】図9は本発明の他の実施形態にかかる磁気
センサ10−2の側断面図である。この実施形態におい
て前記実施形態と相違する点は、図2に示す弾性導電塗
料層163の代わりに、ホットメルトタイプの導電性接
着剤層200を用いた点のみである。他の構成部材と製
造方法は全く同一なのでその説明は省略する。FIG. 9 is a side sectional view of a magnetic sensor 10-2 according to another embodiment of the present invention. This embodiment is different from the above embodiment only in that a hot melt type conductive adhesive layer 200 is used instead of the elastic conductive paint layer 163 shown in FIG. Since the manufacturing method is completely the same as the other components, the description thereof will be omitted.
【0032】ここで図10は金属端子20と電極パター
ン155の接続部分の拡大断面図である。本実施形態の
場合は前記実施形態と同様に予め電極パターン155上
に熱硬化性の導電塗料層161を印刷乾燥し、その上に
ホットメルトタイプの導電性接着剤層200を印刷乾燥
しておく。導電性接着剤層200としてはこの実施形態
ではポリエステル系の樹脂に導電粉を混入したものであ
って、120℃程度から軟化を始める性質のものを使用
した。FIG. 10 is an enlarged sectional view of a connection portion between the metal terminal 20 and the electrode pattern 155. In the case of the present embodiment, a thermosetting conductive paint layer 161 is printed and dried on the electrode pattern 155 in advance, and a hot-melt type conductive adhesive layer 200 is printed and dried thereon in advance, as in the above embodiment. . In this embodiment, as the conductive adhesive layer 200, a conductive resin mixed with a polyester resin and having a property of starting to soften at about 120 ° C. is used.
【0033】そして導電性接着剤層200の上に金属端
子20を載せた状態で図4に示すと同様の方法でその周
囲に成型品30となる溶融モールド樹脂を射出成型すれ
ば、金属端子20は導電性接着剤層200に押し付けら
れると同時に該溶融モールド樹脂の熱によって導電性接
着剤層200が溶けて金属端子20と導電塗料層161
間を接着する。そして該溶融モールド樹脂が冷えて固化
することで磁気センサ10−2が完成するが、導電性接
着剤層200も固化するので、金属端子20と導電塗料
層161間の接着が確実に行なえる。With the metal terminal 20 placed on the conductive adhesive layer 200, a molten molding resin to be a molded product 30 is injection-molded around the metal terminal 20 in the same manner as shown in FIG. Is pressed against the conductive adhesive layer 200, and at the same time, the conductive adhesive layer 200 is melted by the heat of the molten mold resin, so that the metal terminals 20 and the conductive paint layer 161 are formed.
Glue in between. The magnetic sensor 10-2 is completed when the molten mold resin cools and solidifies, but the conductive adhesive layer 200 also solidifies, so that the adhesion between the metal terminal 20 and the conductive paint layer 161 can be reliably performed.
【0034】なおこの実施形態においても図11に示す
ように、導電塗料層161を省略して電極パターン15
5上に直接ホットメルトタイプの導電性接着剤200を
形成しても良い。In this embodiment, as shown in FIG. 11, the conductive paint layer 161 is omitted and the electrode pattern 15 is omitted.
The hot-melt type conductive adhesive 200 may be formed directly on 5.
【0035】以上本発明の実施形態を詳細に説明したが
本発明はこれに限定されるものではなく、例えば以下の
ような種々の変形が可能である。 磁気センサ素子15の成型品30からの離脱を防止す
るために、図6(a)に示すように磁気センサ素子15
の側面25を粗面化(例えば凹凸の山から谷までの長さ
を5〜10μm程度)しておいても良いし、また図6
(b)に示すように該側面25を裏面側に向かって広が
るようなテーパ面(例えば傾斜角度0.5〜1.0°)
としておいても良い。Although the embodiments of the present invention have been described in detail, the present invention is not limited to these embodiments, and various modifications such as those described below are possible. In order to prevent the magnetic sensor element 15 from separating from the molded product 30, as shown in FIG.
6 may be roughened (for example, the length from the peak to the valley of the unevenness is about 5 to 10 μm), or FIG.
(B) As shown in (b), the side surface 25 is tapered so as to expand toward the back side (for example, an inclination angle of 0.5 to 1.0 °).
You may leave it.
【0036】磁気センサ素子15や金属端子20や成
型品30の形状・材質の種々の変形が可能であることは
言うまでもない。Needless to say, the shape and material of the magnetic sensor element 15, metal terminal 20, and molded product 30 can be variously modified.
【0037】[0037]
【発明の効果】以上詳細に説明したように本発明によれ
ば以下のような優れた効果を有する。 磁気センサ素子と端子間の電気的・機械的接続と、そ
の周囲を覆う成型品による機械的固定とが1工程で行な
えるので、その製造が容易且つ迅速に行なえ、量産時の
製造コスト低減化が図れる。As described in detail above, the present invention has the following excellent effects. Since the electrical and mechanical connection between the magnetic sensor element and the terminal and the mechanical fixing by a molded product covering the periphery thereof can be performed in one step, the manufacturing can be performed easily and quickly, and the manufacturing cost during mass production can be reduced. Can be achieved.
【0038】モールド樹脂によって確実に磁気センサ
素子と端子とをインサート成型して固定するので、半田
や通常の接着剤による固定に比べて両者間の機械的接続
強度が強くなる。Since the magnetic sensor element and the terminal are securely fixed by insert molding with the mold resin, the mechanical connection strength between the two is increased as compared with the case of fixing with solder or an ordinary adhesive.
【0039】磁気センサ素子の電極パターンの表面に
導電塗料層を形成した場合は、金属端子との接続が確実
になる。When a conductive paint layer is formed on the surface of the electrode pattern of the magnetic sensor element, the connection with the metal terminal is ensured.
【0040】また電極パターンと端子の間に弾性導電
塗料層を介在した場合は、その弾性力によっての場合
以上に金属端子との接続が確実になる。When an elastic conductive paint layer is interposed between the electrode pattern and the terminal, the connection with the metal terminal can be made more secure than by the elastic force.
【0041】また電極パターンと端子の間にホットメ
ルトタイプの導電性接着剤層を介在した場合は、その接
着力によっての場合以上に金属端子との接続が確実に
なる。When a hot-melt type conductive adhesive layer is interposed between the electrode pattern and the terminal, the connection with the metal terminal is more reliable than the case where the adhesive force is applied.
【図1】本発明の一実施形態にかかる磁気センサ10を
示す斜視図である。FIG. 1 is a perspective view showing a magnetic sensor 10 according to an embodiment of the present invention.
【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】磁気センサ素子15を示す斜視図である。FIG. 3 is a perspective view showing a magnetic sensor element 15;
【図4】磁気センサ10の製造方法の説明図である。FIG. 4 is an explanatory diagram of a method of manufacturing the magnetic sensor 10.
【図5】金属端子20と電極パターン155の接続部分
の拡大断面図である。FIG. 5 is an enlarged sectional view of a connection portion between a metal terminal 20 and an electrode pattern 155.
【図6】図6(a),(b)は他の磁気センサ素子を示
す斜視図である。FIGS. 6A and 6B are perspective views showing another magnetic sensor element.
【図7】図7(a),(b)は金属端子20と電極パタ
ーン155の他の接続構造を示す接続部拡大断面図であ
る。FIGS. 7A and 7B are enlarged cross-sectional views of a connection portion showing another connection structure of the metal terminal 20 and the electrode pattern 155. FIGS.
【図8】従来の磁気センサの1使用例を示す図であり、
同図(a)は平面図、同図(b)は同図(a)のa−a
断面図である。FIG. 8 is a diagram showing one usage example of a conventional magnetic sensor;
FIG. 3A is a plan view, and FIG. 3B is aa of FIG.
It is sectional drawing.
【図9】本発明の他の実施形態にかかる磁気センサ10
−2の側断面図である。FIG. 9 is a magnetic sensor 10 according to another embodiment of the present invention.
2 is a side sectional view of FIG.
【図10】金属端子20と電極パターン155の接続部
分の拡大断面図である。FIG. 10 is an enlarged sectional view of a connection portion between a metal terminal 20 and an electrode pattern 155.
【図11】金属端子20と電極パターン155の他の接
続構造を示す接続部拡大断面図である。FIG. 11 is an enlarged sectional view of a connection part showing another connection structure of the metal terminal 20 and the electrode pattern 155.
10 磁気センサ 15 磁気センサ素子 151 基板 153 磁気抵抗パターン 155 電極パターン 161 導電塗料層 163 弾性導電塗料層 20 金属端子 30 成型品 200 ホットメルトタイプの導電性接着剤層 DESCRIPTION OF SYMBOLS 10 Magnetic sensor 15 Magnetic sensor element 151 Substrate 153 Magnetic resistance pattern 155 Electrode pattern 161 Conductive paint layer 163 Elastic conductive paint layer 20 Metal terminal 30 Molded product 200 Hot melt type conductive adhesive layer
Claims (4)
抵抗パターンから引き出した電極パターンとを設けてな
る磁気センサ素子と、一端が前記磁気センサ素子の電極
パターンに接続される金属板製の端子と、前記磁気抵抗
パターン形成面を露出すると共に前記端子の他端を外部
に突出した状態で前記磁気センサ素子と端子とをインサ
ート成型してなる成型品とを具備してなることを特徴と
する磁気センサ。1. A magnetic sensor element having a magnetoresistive pattern and an electrode pattern drawn from the magnetoresistive pattern provided on a surface of a substrate, and a metal plate terminal having one end connected to the electrode pattern of the magnetic sensor element. And a molded product obtained by insert-molding the magnetic sensor element and the terminal with the other end of the terminal protruding outside while exposing the magnetoresistive pattern forming surface. Magnetic sensor.
面に、導電塗料層を形成したことを特徴とする請求項1
記載の磁気センサ。2. A conductive paint layer is formed on a surface of an electrode pattern of the magnetic sensor element.
A magnetic sensor as described.
電塗料層を介在したことを特徴とする請求項1または2
記載の磁気センサ。3. The method according to claim 1, wherein an elastic conductive paint layer is interposed between the electrode pattern and the terminal.
A magnetic sensor as described.
メルトタイプの導電性接着剤層を介在したことを特徴と
する請求項1または2記載の磁気センサ。4. The magnetic sensor according to claim 1, wherein a hot-melt type conductive adhesive layer is interposed between the electrode pattern and the terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09209740A JP3136401B2 (en) | 1997-07-18 | 1997-07-18 | Magnetic sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09209740A JP3136401B2 (en) | 1997-07-18 | 1997-07-18 | Magnetic sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1138109A true JPH1138109A (en) | 1999-02-12 |
JP3136401B2 JP3136401B2 (en) | 2001-02-19 |
Family
ID=16577861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP09209740A Expired - Fee Related JP3136401B2 (en) | 1997-07-18 | 1997-07-18 | Magnetic sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3136401B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002181909A (en) * | 2000-12-12 | 2002-06-26 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing magnetic sensor |
WO2006008799A1 (en) * | 2004-07-16 | 2006-01-26 | C & N Inc | Magnetic sensor assembly, geomagnetic sensor, element assembly and portable terminal |
-
1997
- 1997-07-18 JP JP09209740A patent/JP3136401B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002181909A (en) * | 2000-12-12 | 2002-06-26 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing magnetic sensor |
WO2006008799A1 (en) * | 2004-07-16 | 2006-01-26 | C & N Inc | Magnetic sensor assembly, geomagnetic sensor, element assembly and portable terminal |
US7173420B2 (en) | 2004-07-16 | 2007-02-06 | C & N Inc. | Magnetic detection device and method for manufacture |
EP1770406A1 (en) * | 2004-07-16 | 2007-04-04 | C & N Inc. | Magnetic sensor assembly, geomagnetic sensor, element assembly and portable terminal |
CN100454033C (en) * | 2004-07-16 | 2009-01-21 | 阿莫善斯有限公司 | Magnetic sensor assembly, earth magnetism detector, element assembly and mobile terminal unit |
EP1770406A4 (en) * | 2004-07-16 | 2010-03-03 | Amosense Co Ltd | Magnetic sensor assembly, geomagnetic sensor, element assembly and portable terminal |
Also Published As
Publication number | Publication date |
---|---|
JP3136401B2 (en) | 2001-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9444153B2 (en) | Composite molding and method of manufacturing the same | |
WO2007072812A1 (en) | Structure for mounting electronic parts on circuit board, and mounting method | |
JPH0748330B2 (en) | Electronic component resin molded case with built-in flexible substrate and method of manufacturing the same | |
JP7551489B2 (en) | Method for manufacturing three-dimensional structure and three-dimensional structure | |
JP3994683B2 (en) | Memory card manufacturing method | |
JP3136401B2 (en) | Magnetic sensor | |
JP3563640B2 (en) | Method of insert molding magnetic sensor element into mold resin | |
WO2004072993A1 (en) | Electronic parts board and method of producing the same | |
JP3533162B2 (en) | Method of connecting and fixing terminal plate to electrode pattern of magnetic sensor substrate with mold resin and electronic component with terminal plate | |
JP3101866B2 (en) | Structure for connecting metal terminal plate to substrate in molded article and method of connecting the same | |
JP3371206B2 (en) | Method and structure for connecting and fixing terminals to substrate using mold resin | |
JPH0714114B2 (en) | Case mounting method for electronic parts using flexible board | |
JPH10172713A (en) | Method for connecting metal terminal plate to substrate in molded article, and method for fixing electronic parts and the substrate in the molded article | |
JP3355482B2 (en) | Method of connecting metal plate to conductive part of member using mold resin | |
JP2736966B2 (en) | Method of fixing metal terminal plate to substrate and method of molding electronic component and substrate | |
JP2002160521A (en) | Window made of plastic resin for vehicles and its manufacturing method | |
JP3328688B2 (en) | Structure for connecting metal terminal plate to substrate in molded article and method of connecting the same | |
JP2002181909A (en) | Method of manufacturing magnetic sensor | |
JPH10321987A (en) | Printed wiring board and manufacture thereof | |
JPH054836B2 (en) | ||
JP3388429B2 (en) | Method of connecting metal plate to conductive pattern of member in molded product | |
JP3331463B2 (en) | Structure for connecting metal plate to substrate in molded article and method of connecting the same | |
JP2001249170A (en) | Sensor element and its manufacturing method | |
JPS6360512B2 (en) | ||
JPH0563111B2 (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101208 Year of fee payment: 10 |
|
LAPS | Cancellation because of no payment of annual fees |