JPH113737A - Connection terminal structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase mounting density by arranging a plurality of conducting parts and insulating parts connected to terminals of a first and a second substrates on the U-shaped top and bottom surfaces, and passing the intermediate part connecting the top and bottom surfaces through the insulating parts. SOLUTION: A connection terminal 80 is a multipole terminals having a plurality of contacts, and formed by blanking a metal plate and working in a U-shaped cross section. Each of a top surface 821 and a bottom surface 822 has an insulating part 81 having a conducting part 82 and an opening part 810, connected to a terminal 200 of a first substrate 2 which is a sub-substrate and a second substrate 1 which is the main substrate and integrally formed with a resin. In order to interpose the end of the substrate 2 between the opening parts 810 in the thickness direction for fixing, the substrate end is interposed between the upper inner surface of the insulating part 81 in the upper part of the opening part 810 and the upper surface 821 of the conducting part 82 in the lower part of the opening part 810 and engaged. By engaging the opening part 810 of the connecting terminal 80 with the substrate 2, the connecting terminal 80 is held easily, and simply to the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a connection terminal for connecting a sub-board and a main board.

[0002]

2. Description of the Related Art The use of connection terminals between wiring boards to which the present invention is directed will be described with reference to FIG. In an integrated circuit known as a hybrid IC, a multi-chip module, or the like, that is, an electronic circuit device in which a first substrate 2 which is a small sub-substrate is mounted on a second substrate 1 which is a main substrate, the two substrates are usually Is provided with a plurality of terminals (lands) receiving soldering connection arranged in a line. Usually, between the terminals (lands) 200 of the first substrate 2 and the terminals (lands) 100 of the second substrate 1, An electrical connection is made by soldering with a multi-pole terminal (micro connector) in which a plurality of connection terminals 92 are integrally formed.

The second substrate 1 is a substrate 1 serving as a main substrate of a circuit of an electronic device. The first substrate 2 previously manufactured separately as a circuit component is replaced with the second substrate 1. In the mounting process, the semiconductor device is mounted and soldered together with other electronic components to complete the second wiring board 1. In addition,
First substrate 2 using conventional terminals described above with reference to FIG.
Is shown. On the first substrate 2, for example, an electronic component 4 such as a semiconductor bare chip 3 or a chip component is mounted and soldered to complete the first substrate 2. The connection terminals 9 are usually mounted on the first substrate 2 at the stage of mounting and soldering the first substrate 2. The connection terminals 9 are formed by arranging and arranging conductive portions 92 punched from a metal plate as shown in FIG. 10 and fixing them by an insulating portion 91 made of a rod-shaped resin portion.

In order to reliably fix the relative position of the connection terminals 9 with respect to the first substrate 2, fixing pins 93 are provided at both ends of an insulating portion 91 made of a rod-shaped resin. A fixing through-hole (same position as 93) is provided at a corresponding position on the side of the first substrate 2 to form a terminal (land) 200 on the first substrate 2 side.
And the connection terminal 92 is engaged so that the relative position does not shift. This is for maintaining the position of the connection terminal 92 in the reflow soldering step of the first substrate 2.
Furthermore, this is a countermeasure taken in order to prevent the displacement when the first substrate 2 is surface-mounted as a component on the second substrate 1 and the solder portion is re-melted in the reflow soldering process.

[0005] As described above, in the conventional connection terminal 9, the plurality of conductive portions 92 are aligned and formed. Therefore, the first substrate 2, which is a small sub-substrate, is replaced with the substrate 1 constituting a circuit of an electronic device.
Even when the number of terminals to be connected is large when connecting with each other, the terminals of the gull-wing type lead shape suitable for surface mounting are used, so that a plurality of connection terminals 92 are closely spaced. Has been realized.

[0006]

As described above, according to the conventional connection terminal 9 described above, since the gull wing shape suitable for surface mounting is adopted, as shown in FIG. The portion 92 has a shape in which the leads are spread from one end to the other, and requires a space on the first substrate 2 and the second substrate 1 according to the size of the conductive portion 92.

On a circuit board of an electronic device to be surface-mounted, the mounting density is further increased to reduce the required space.
As a result, there is a need to reduce costs, and it is necessary to reconsider what was previously a reasonable space. Further, in order to reduce the cost of fixing pins 93 for fixing the connection terminals 9 to the first substrate 2 and through-hole processing corresponding to the pins 93, a method capable of easily holding the connection terminals 9 is desired. ing.

SUMMARY OF THE INVENTION It is an object of the present invention to improve the mounting density and to improve the holding and mounting properties between a connection terminal and a substrate.

[0009]

In order to achieve the above-mentioned object, the structure of the connection terminal includes a first substrate which is a sub-substrate,
In a structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, a cross-sectional shape is A plurality of conductive portions each having an approximately U-shape, and an upper surface and a lower surface in the U-shape respectively connected to the terminal of the first substrate and the terminal of the second substrate; and an insulating portion. And an intermediate portion connecting the upper surface and the lower surface of each conductive portion is penetrated by the insulating portion.

[0010] Further, a first substrate as a sub-substrate and a second substrate as a main substrate on which the first substrate is mounted are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting the terminals, the cross-sectional shape has a substantially I-shape, and the upper surface and the lower surface of the I-shape are the terminals of the first substrate and the second substrate, respectively. A plurality of conductive portions connected to the terminals and an insulating portion are provided, and an intermediate portion connecting the upper surface and the lower surface of each conductive portion is penetrated by the insulating portion. In addition, the first sub-substrate
And a connection terminal interposed between the first substrate and the second substrate, which is the main substrate on which the first substrate is mounted, and electrically connecting the first substrate and the second substrate. The cross-sectional shape has a substantially U-shape, and the upper surface and the lower surface of the U-shape are respectively formed by the terminals of the first substrate and the second
A plurality of conductive tapes connected to the terminals of the substrate, and an insulating portion having a substantially prismatic shape, wherein the conductive tape is adhered over the upper surface, the side surface, and the lower surface of the insulating portion.

[0011] Further, the first substrate, which is a sub-substrate, and a second substrate, which is a main substrate on which the first substrate is mounted, are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting the terminals, the cross-sectional shape has a substantially O-shaped shape, and the upper surface and the lower surface of the O-shaped shape are the terminals of the first substrate and the second substrate, respectively. A plurality of conductive portions connected to the terminals, and a substantially prismatic insulating portion, wherein the upper surface of the conductive portion is connected to the upper surface of the insulating portion, and the upper surface and the lower surface of each conductive portion are connected to the side surface of the insulating portion. The intermediate portion is abutted.

[0012] Further, the first substrate, which is a sub-substrate, and a second substrate, which is a main substrate on which the first substrate is mounted, are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting
An upper surface and a lower surface each include a plurality of conductive portions connected to the terminals of the first substrate and the terminals of the second substrate, and an insulating portion, wherein each of the conductive portions is formed from an upper surface of the insulating portion. It is characterized by being vertically penetrated over the lower surface.

[0013] Further, a first substrate as a sub-substrate and a second substrate as a main substrate on which the first substrate is mounted are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting the conductive portion, the insulating portion comprises a cylindrical insulating portion, and a conductive portion in which a plurality of ring-shaped metal platings are provided on a circumferential surface of the insulating portion, and upper and lower surfaces of the conductive portion Are connected to the terminals of the first substrate and the terminals of the second substrate, respectively.

[0014] Further, the first substrate, which is a sub-substrate, and the second substrate, which is a main substrate on which the first substrate is mounted, are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting the conductive terminals, the conductive terminal includes a plurality of spherical conductive portions and a rod-shaped insulating portion, and the plurality of conductive portions are inserted through the insulating portions in a state where they are separated from each other and are arranged and fixed. Wherein the upper and lower surfaces of the plurality of conductive portions are respectively connected to terminals of the first substrate and terminals of the second substrate.

[0015] Further, the first substrate, which is a sub-substrate, and the second substrate, which is a main substrate on which the first substrate is mounted, are interposed between the first substrate and the second substrate. In the structure of the connection terminal for electrically connecting the terminals, the cross-sectional shape has a substantially U-shape, and the upper surface and the lower surface in the U-shape are the terminals of the first substrate and the second substrate, respectively. A plurality of conductive portions connected to the terminals, and a prismatic insulating portion having a substantially U-shaped opening in cross-section are provided, and the upper surfaces of the plurality of conductive portions are exposed on the lower surface of the opening. In addition, the opening is for holding the first substrate in the thickness direction thereof.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing the structure of a connection terminal 10 according to a first embodiment of the present invention, and the shape thereof is shown in FIG.
They are shown in plan view, (b) front view, and (c) AA cross-sectional view when mounted on the board. The connection terminal 10 is a multi-pole terminal having a plurality of connections as shown in FIGS. 7A and 7B, and is punched out of a metal plate as shown in FIG. It is formed into a U-shaped cross section (a shape in which the U-shape is inverted by 180 ° in the figure), and the upper surface 121 and the lower surface 122 of the terminal 200 of the first substrate 2 which is a sub-substrate and the main substrate, respectively. A conductive portion 12 connected to a terminal 100 of a certain second substrate 1 and an insulating portion 11 formed of a plate-like resin are provided. An intermediate portion 123 connecting an upper surface 121 and a lower surface 122 of the conductive portion 12 is insulated. Part 1
The conductive parts 12 are arranged and fixed in a state of penetrating into one, and are integrally molded. The conductive portion 12 having a U-shaped cross section and the plate-shaped insulating portion 11 are joined together, and when viewed as a whole, at the AA position shown in FIG. It has a shape.

As shown in FIG. 1C, the upper surface 121 of the connection terminal 10 is connected to the terminal (land) 20 of the first substrate 2.
0, and the lower surface 122 is also soldered to the terminals (lands) of the second substrate 1 to form the terminals 2 of the first substrate 2.
Since the terminals 100 of the second substrate 1 are electrically connected, the terminals (lands) 200 of the first substrate 2 and the terminals (lands) 100 of the second substrate 1 are provided at horizontal positions facing each other. That is, the component mounting density on the first substrate 2 is improved.

That is, since the cross section of the conductive portion 12 is U-shaped, the required area occupied on the second substrate 1 is, for example, 1/3 to 1 / compared to the conventional connection terminal 9 shown in FIG. It is reduced to about 4. Also, at the time when the solder is melted during the reflow process and the connection terminals 10 are not fixed between the first substrate 2 and the second substrate 1, the connection terminals 10 receive the load of the first substrate 2. The connection terminal 10 transmits the load to the first substrate 2 on the upper surface 12.
The second substrate 1 which is received on the horizontal surface of the first substrate 1 and has the same horizontal surface as the lower surface 122 which is the horizontal surface.
To the first terminal 2 of the connection terminal 10 because the holding property is improved without generating a horizontal moving force or a rotational moment between the connection terminal 10 and the first substrate 2 or the second substrate 1. It is not necessary to particularly provide the holding means for holding the connection 2 (the pin 93 and the through hole are used in the connection terminal 9 shown in FIG. 9).

FIG. 2 is a view showing the structure of a connection terminal 20 according to a second embodiment of the present invention, wherein the shapes are (a) a plan view, (b) a front view, and (c) a substrate. A when installed
This is shown by each figure in the A-sectional view. The connection terminal 20 is a multipolar terminal having a plurality of connections as shown in FIGS. 7A and 7B, and has an I-shaped cross section as shown in FIG. 2) shaped metal,
The upper surface 221 and the lower surface 222 are each formed of a resin in a rectangular shape with the conductive portion 22 connected to the terminal 200 of the first substrate 2 as the sub-substrate and the terminal 100 of the second substrate 1 as the main substrate. It has an insulating part 21 and is integrally formed. The upper surface 221 and the lower surface 222 of the conductive portion 22 having an I-shaped cross section are electrically connected to each other by a vertical (middle) portion 223 of the I-shaped cross section so as to penetrate the rectangular insulating portion 21. In the AA position shown in FIG.
It has a rectangular cross-sectional shape as shown by.

Further, as shown in FIG.
0, the first board 2 as a sub board, the connection state with the second board 1 as a main board, and the second board as a main board.
The state of improvement of the mounting density of the substrate 1 is the same as that of the first embodiment, and a description thereof will be omitted. That is, since the whole including the conductive portion 21 is square, the required area occupied on the second substrate 1 which is the main substrate is, for example, 1/3 to 1/1 as compared with the conventional connection terminal 9 shown in FIG. It is reduced to about 4.
In addition, the retention of the connection terminals 20 during the mounting process on the first substrate 1 and the second substrate 1 has been improved, and means for retaining the connection terminals 20 on the first substrate 2 (shown in FIG. 9). The connection terminal 9 uses the pin 93 and the through hole).

FIG. 3 is a view showing the structure of a connection terminal 30 according to a third embodiment of the present invention, wherein the shapes are (a) a plan view, (b) a front view, and (c) a substrate. A when installed
This is shown by each figure in the A-sectional view. The connection terminal 30 is a multi-pole terminal having a plurality of connections as shown in FIGS. 1A and 1B, and has a rectangular insulating portion 31 made of resin as shown in FIG. 1C. A conductive tape is attached around the insulating portion 31 in a U-shaped cross section, and the upper surface 321 and the lower surface 322 of the conductive tape are attached to the terminals 200 of the first substrate 2 which is a sub-substrate and the second substrate 1 which is a main substrate, respectively. Terminal 10 of
And a conductive portion 32 connected to the first portion. The conductive portion 32 having a U-shaped cross section is adhered over the upper surface, the side surface, and the lower surface of the rectangular insulating portion 31 to form the conductive portion 3.
The upper surface 321 and the lower surface 322 are electrically connected to each other via the side surface. At the AA position shown in FIG. Present.

Further, as shown in FIG.
The state of connection between the first substrate 2 and the first substrate 2 and the second substrate 1 and the state of improvement in the mounting density of the two substrates are the same as in the first embodiment, and a description thereof will be omitted. That is, since the whole including the conductive portion 31 fits in a square shape, the required area occupied on the second substrate 1 as the main substrate is, for example, 1/3 to 1/1, as compared with the conventional connection terminal 9 shown in FIG. It is reduced to about 4.

Further, the first substrate 2 and the second substrate
Of the connection terminals 30 on the first substrate 2 (the pins 93 and the through holes are used in the connection terminals 9 shown in FIG. 9).
Need not be particularly provided. FIG. 4 is a diagram showing a structure of a connection terminal 40 according to a fourth embodiment of the present invention.
The shape is shown by (a) a plan view, (b) a front view, and (c) a cross-sectional view taken along the line AA when mounted on a substrate. The connection terminal 40 is a multi-pole terminal having a plurality of connections as shown in FIGS. 3A and 3B, and has an insulating portion 41 formed of a rectangular resin as shown in FIG. , Having an O-shaped cross section (specifically, the shape shown in FIG. 4) stamped out of a metal plate, and having an upper surface 421 and a lower surface 422 each having a terminal 200 of a first substrate 2 and a main substrate Conductive part 4 connected to the terminal 100 of the second substrate 1
2 and are integrally formed. The conductive portion 42 having the O-shaped cross section was fitted to the rectangular insulating portion 41, and the upper surface 421 of the conductive portion 42 was in contact with the upper surface of the insulating portion 41, and the side surface 423 of the conductive portion 42 was in contact with the side surface of the insulating portion 41. In the state shown in FIG.
Has a substantially rectangular cross-sectional shape shown in FIG. Also, as shown in FIG. 3C, the connection state between the connection terminal 40 and the first substrate 2 and the second substrate 1 and the improvement state of the mounting density in the two substrates are almost the same as in the first embodiment. is there.

However, the conductive portion 42 extends to the right in FIG. 4C as compared with the first embodiment, and the terminal 2 of the second substrate 1
It is easy to visually inspect the soldering of the connection terminal 00 and the lower surface 422 of the connection terminal 40. Note that the terminal positions of the two substrates are shifted from each other by an amount corresponding to the overhang, and the effect of improving the mounting density is smaller than that of the first embodiment.

That is, since the entire structure including the conductive portion 41 fits in a substantially rectangular shape, the required area occupying on the second substrate 1 is, for example, 1/3 to 1/1 as compared with the conventional connection terminal 9 shown in FIG.
It is reduced to about 2. In addition, the retention of the connection terminals 40 on the first substrate 2 and the second substrate 1 has been improved, and means for retaining the connection terminals 40 on the first substrate 2 (the connection terminals 9 shown in FIG. (Using the pin 93 and the through hole) may be omitted.

FIG. 5 is a diagram showing the structure of a connection terminal 50 according to a fifth embodiment of the present invention, wherein the shapes are (a) a plan view, (b) a front view, and (c) a substrate. A when installed
This is shown by each figure in the A-sectional view. The connection terminal 50 is a multi-pole terminal having a plurality of connections as shown in FIGS. 7A and 7B, and has a rectangular insulating portion 51 made of resin as shown in FIG. , Metal wire pieces (lead pins), the upper surface 521 and the lower surface 522 of which are connected to the terminal 200 of the first substrate 2 which is a sub-substrate and the terminal 100 of the second substrate 1 which is a main substrate, respectively. It has a conductive part 52 and is formed integrally. In addition, as shown in the front view of FIG. 4B, the insulating portion 51 has a height at both ends equal to the height of the wire, and is in contact with the first substrate 2 and the second substrate 1 at both ends. The surface is provided. In other words, the wire (lead pin) penetrates above and below the insulating part 51.
A connection terminal 50 having a conductive portion 52 protruding from the head,
At the AA position shown in FIG. 9A, the cross-sectional shape shown in FIG.

Further, as shown in FIG.
The state of connection between the first substrate 2 and the first substrate 2 and the second substrate 1 and the state of improvement in the mounting density of the two substrates are the same as in the first embodiment, and a description thereof will be omitted. That is, since the whole including the conductive portion 51 fits in a square, the required area occupied on the second substrate 1 is reduced to, for example, about 1/4 to 1/3 as compared with the conventional connection terminal 9 shown in FIG. I do.

Also, the first substrate 2 and the second
Of the connection terminal 50 to the first substrate 2 (the pin 93 and the through hole are used in the connection terminal 9 shown in FIG. 9) may not be provided. . Next, FIG. 6 is a view showing a structure of a connection terminal 60 according to a sixth embodiment of the present invention.
They are shown by plan views, (b) perspective views, and (c) sectional views taken along the line AA when mounted on the board. The connection terminal 60 is a multi-pole terminal having a plurality of connections as shown in FIGS. 7A and 7B, and is a rod-shaped insulating portion made of a cylindrical resin as shown in FIG. 61 and the surface of the insulating portion 61 are metal-plated in a ring shape, and the upper surface 621 and the lower surface 622 thereof have terminals 200 of the first substrate 2 as a sub-substrate and terminals 100 of the second substrate 1 as a main substrate, respectively. And a conductive portion 62 connected thereto, and is configured integrally. FIG.
In the AA position shown in (a), the sectional shape shown in FIG.

Further, as shown in FIG.
The state of connection between the first substrate 2 and the first substrate 2 and the second substrate 1 and the state of improvement in the mounting density of the two substrates are the same as in the first embodiment, and a description thereof will be omitted. That is, since the entire structure including the conductive portion 61 fits in a substantially rectangular shape, the required area occupied on the substrate 1 is reduced to, for example, about 1/3 to 1/2 as compared with the conventional connection terminal 9 shown in FIG.

Further, the first substrate 2 and the second substrate
Of the connection terminal 60 to the first substrate 2 (the pin 93 and the through hole are used in the connection terminal 9 shown in FIG. 9) may not be provided. . Next, FIG. 7 is a view showing a structure of a connection terminal 70 according to a seventh embodiment of the present invention.
They are shown in plan view, (b) front view, and (c) AA cross-sectional view when mounted on the board. The connection terminal 70 is a multipolar terminal having a plurality of connections as shown in FIGS. 3A and 3B, and has a spherical connection having a metal piece or a metal plating surface as shown in FIG. A terminal 72, the upper surface 721 and the lower surface 722 of which are the first
Terminal 200 of substrate 2 and second substrate 1 as a main substrate
And an insulating portion 71 serving as a mandrel connecting the conductive portions 72, and is integrally formed. At the position AA shown in FIG. 6A, a spherical cross-sectional shape as shown in FIG.

Further, as shown in FIG.
The state of connection between the first substrate 2 and the first substrate 2 and the second substrate 1 and the state of improvement in the mounting density of the two substrates are the same as in the first embodiment, and a description thereof will be omitted. That is, the required area occupied on the substrate 1 is reduced to, for example, about 1/3 to 1/4 as compared with the conventional connection terminal 9 shown in FIG.

The connection terminals 70, the first substrate 2, and the second
Of the connection terminal 70 on the first substrate 2 (pins 93 and through holes are used in the connection terminal 9 shown in FIG. 9) may not be provided. . Next, FIG. 8 is a view showing the structure of a connection terminal 80 according to an eighth embodiment of the present invention.
A plan view, (b) front view, (c) cross-sectional view taken along line AA when mounted on a board, (d) a cross-sectional view taken along line BB when mounted on a board, and (e) a perspective view are shown. . The connection terminal 80 is a multi-pole terminal having a plurality of connections as shown in FIGS. 7A and 7B, and is stamped out of a metal plate as shown in FIG. And the upper surface 821 and the lower surface 822 of the first substrate 2 as a sub-substrate and the terminal 10 of the second substrate 1 as a main substrate, respectively.
0, and a conductive portion 82 connected to A- 0 shown in FIG.
At the position A, the shape becomes rectangular as shown in FIG. 7C, and at the position B-B shown in FIG. 7A, it is formed of a resin having a U-shaped opening 810 as shown in FIG. It has an insulating portion 81 and is integrally formed.

Therefore, when the opening 810 of the connection terminal 80 is fixedly held between the ends of the first substrate 2 in the plate thickness direction, the insulating portion 81 located above the opening 810 is provided.
And the upper end 821 of the conductive portion 82 below the opening 810 shown in FIG. The positional relationship between the inner surfaces of the openings 810 to be engaged can be seen also in the perspective view of FIG.

As described above, the eighth embodiment is similar to FIG.
The U-shaped cross-section opening 81 of the connection terminal 80 shown in FIG.
0 and has a characteristic of engaging with the first substrate 2, and can be easily and easily held on the first substrate 2. For example, the pin 93 and the through hole will be described with reference to FIGS. 9 and 10. It does not require conventional methods. Also, as shown in FIG. 3C, the connection terminal 80 and the first substrate 2,
The connection status with the second substrate 1 and the improvement status of the mounting density on both substrates are the same as those in the first embodiment, and the description is omitted.

That is, in the eighth embodiment, the required area occupied on the first substrate 1 is reduced to, for example, about 1/3 to 1/4 as compared with the conventional connection terminal 9 shown in FIG.

[0036]

As described in detail above, according to the present invention, the connection terminals are formed in such a shape that the terminals of the first substrate and the terminals of the second substrate are provided at positions facing each other.
The mounting density is improved. In addition, compared to the conventional connection terminal, the connection terminal has a better holding and mounting property to the first substrate.
The method using pins and through holes can be omitted. In particular, according to the eighth embodiment, since the connection terminal 80 is engaged with the first substrate 2 at the U-shaped cross-sectional opening, the holding to the first substrate 2 is simple and easy. Easy to do.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure of a connection terminal according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a structure of a connection terminal according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a structure of a connection terminal according to a third embodiment of the present invention.

FIG. 4 is a diagram showing a structure of a connection terminal according to a fourth embodiment of the present invention.

FIG. 5 is a view showing a structure of a connection terminal according to a fifth embodiment of the present invention.

FIG. 6 is a view showing a structure of a connection terminal according to a sixth embodiment of the present invention.

FIG. 7 is a view showing a structure of a connection terminal according to a seventh embodiment of the present invention.

FIG. 8 is a view showing a structure of a connection terminal according to an eighth embodiment of the present invention.

FIG. 9 is a view showing a structure of a conventional terminal.

FIG. 10 is a diagram showing a mounting state using a conventional terminal.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... 2nd board | substrate (sub board | substrate) 2 ... 1st board | substrate (main board | substrate) 3 ... Semiconductor integrated circuit component 4 ... Electronic component 9 ... Conventional connection terminal 10, 20, 30, 40, 50, 60, 70, 80, 9
0 ··· Connection terminal 11, 21, 31, 41, 51, 61, 71, 81, 9
1. Insulating portions of connection terminals 12, 22, 32, 42, 52, 62, 72, 82, 9
2. Conductive portions of connection terminals 100, 200 ... terminals on first and second substrates

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazunori Sato 1-2-28, Goshodori, Hyogo-ku, Kobe City, Hyogo Prefecture Inside Fujitsu Ten Limited (72) Inventor Yuji Uno 1-chome, Goshodori, Hyogo-ku, Kobe City, Hyogo Prefecture No. 28 in Fujitsu Ten Limited

Claims (8)

[Claims] A first substrate which is a sub-substrate;
In a structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, the cross-sectional shape is substantially A plurality of conductive portions each having an upper surface and a lower surface in the U-shape connected to terminals of the first substrate and terminals of the second substrate, respectively, and an insulating portion. A structure of a connection terminal, wherein an intermediate portion connecting an upper surface and a lower surface of each conductive portion is penetrated by the insulating portion. A first substrate which is a sub-substrate;
In a structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, A plurality of conductive portions each having an upper surface and a lower surface in the I shape connected to the terminals of the first substrate and the terminals of the second substrate, respectively, and an insulating portion. A structure of a connection terminal, wherein an intermediate portion connecting an upper surface and a lower surface of each conductive portion is penetrated by the insulating portion. 3. A first substrate, which is a sub-substrate, and the first substrate
In a structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, the cross-sectional shape is substantially A plurality of conductive tapes each having an upper surface and a lower surface of the U-shape connected to the terminals of the first substrate and the terminals of the second substrate, respectively, and a substantially prismatic insulating portion. A connection terminal, wherein the conductive tape is adhered over an upper surface, a side surface, and a lower surface of the insulating portion. 4. A first substrate, which is a sub-substrate, and the first substrate
In the structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, the cross-sectional shape is substantially A plurality of conductive portions each having an upper surface and a lower surface in the U-shape connected to the terminals of the first substrate and the terminals of the second substrate, respectively, and a substantially prismatic insulating portion. A structure of a connection terminal, wherein an upper surface of the conductive portion is in contact with an upper surface of the insulating portion, and an intermediate portion connecting an upper surface and a lower surface of each conductive portion is in contact with a side surface of the insulating portion. 5. A first substrate, which is a sub-substrate, and the first substrate
A connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate; An upper surface and a lower surface each include a plurality of conductive portions connected to the terminals of the first substrate and the terminals of the second substrate, respectively, and an insulating portion. A connection terminal, characterized in that the connection terminal is vertically penetrated. 6. A first substrate, which is a sub-substrate, and said first substrate
A connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate; A conductive portion having a plurality of ring-shaped metal platings provided on a circumferential surface of the insulating portion, and an upper surface and a lower surface of the conductive portion correspond to terminals of the first substrate and terminals of the second substrate, respectively. A connection terminal structure characterized by being connected. 7. A first substrate, which is a sub-substrate, and said first substrate
A connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate; Part, and a rod-shaped insulating part,
The plurality of conductive parts are inserted and fixed in the insulating part in a state where they are separated from each other, and upper and lower surfaces of the plurality of conductive parts are respectively connected to terminals of the first substrate and terminals of the second substrate. A connection terminal structure which is connected to the terminal. 8. A first substrate as a sub-substrate;
In a structure of a connection terminal interposed between a second substrate which is a main substrate on which the first substrate is mounted and electrically connecting the first substrate and the second substrate, the cross-sectional shape is substantially A plurality of conductive portions having upper and lower surfaces in the U-shape connected to terminals of the first substrate and terminals of the second substrate, respectively; And a prismatic insulating portion having an opening having a shape, wherein the upper surface of the plurality of conductive portions is exposed at the lower surface of the opening, and the opening is provided in the thickness direction of the first substrate. The structure of the connection terminal, characterized in that the connection terminal is sandwiched between.