JPH11354899A - Printed wiring board and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance bonding strength between conductive layers by applying a phosphorus compound to the surface of fibers composing a basic material at the time of laminating a plurality of conductive layers through an insulating layer formed by impregnating a basic material with an insulating resin layer. SOLUTION: This printed wiring board comprises two or more conductive layers laminated with an insulating layer composed of a composite material of a base material and an insulating resin wherein a phosphorus compound is present on the interface between the base material and the insulating resin of the insulating layer. A porous material for carrying the insulating resin is principally comprises fibers. The phosphorus compound includes phosphate, phosphite, or the like. The process for introducing a phosphorus compound into the base material is a process for applying the phosphorus compound to the surface of fibers composing the base material, e.g. a nonwoven fabric, and preferably forming a phosphorus compound on the surface of fibers. The phosphorus compound is applied by 0.1-10 wt.% to the base material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller, lighter, and more sophisticated, printed circuit boards have been required to be smaller, lighter, have higher densities, and have higher speed signal processing.
Various devices have been devised to meet such demands, and the structures and manufacturing methods of printed wiring boards have been diversified. For example, JP-A-6-268345 proposes a printed wiring board having an inner via hole (IVH) structure. The IVH structure is similar to the conventional through-hole structure in that it has a structure in which two or more conductive layers are stacked with an insulating layer interposed therebetween, but the electrical connection between the conductive layers is made by a conductive paste filled in via holes. It differs from the through-hole structure in that it is secured.

In addition, the materials used have been diversified with the diversification of the structure and manufacturing method of the printed wiring board. For example, in general, a material obtained by impregnating an insulating resin into a base material is used for an insulating layer. In addition to a conventional glass base material, an aramid base material having characteristics such as low thermal expansion and light weight is used as the base material. Is used.

[0004]

It is a common problem in printed wiring boards of any structure to ensure a sufficient peel strength of the conductive layer, that is, a sufficient adhesive strength between the conductive layers. Possible causes of the peeling of the conductive layer include interface destruction between the conductive layer and the insulating layer and destruction occurring inside the insulating layer. In particular, the former tends to be more and more likely to occur because the contact area between the circuit pattern and the insulating material decreases with the recent trend toward finer circuits.

[0005] The latter type of breakdown inside the insulating layer is mainly caused by interfacial destruction occurring between the base material constituting the insulating layer and the insulating resin. A method for improving the adhesion between the base material and the insulating resin by performing a specific treatment on the base material has been proposed. Chemical treatment with a silane coupling agent has been proposed as a surface treatment for glass substrates, but physical methods typified by ultraviolet, corona, plasma treatments, etc. are mainly used as surface treatments for organic substrates. And no effective chemical treatment has been proposed. Moreover, in the surface treatment by the above-mentioned physical method, a sufficient effect on the adhesive strength of the conductive layer is not actually obtained.

An object of the present invention is to provide a printed wiring board having improved adhesion strength between conductive layers and a method of manufacturing the same.

[0007]

In order to achieve the above object, a first printed wiring board according to the present invention is characterized in that two or more conductive layers formed of a metal foil impregnate a base material with an insulating resin. A printed wiring board formed by laminating via an insulating layer formed as described above, wherein a phosphorus compound is attached to a surface of a fiber constituting the base material. With this configuration, it is possible to suppress interfacial destruction occurring between the fibers constituting the base material and the insulating resin, and to improve the adhesive strength between the conductive layers. Further, since the phosphorus compound also has a property as a flame retardant, the flame retardancy of the printed wiring board can be improved.

In order to achieve the above object, a second printed wiring board according to the present invention is characterized in that an insulating layer formed by impregnating an insulating resin into a base material comprises two or more conductive layers formed of a metal foil. Wherein the phosphorous compound layer is interposed between the conductive layer and the insulating layer. With such a structure, interface destruction occurring between the conductive layer and the insulating layer can be suppressed, and the adhesive strength between the conductive layers can be improved.
Further, since the phosphorus compound has properties as a flame retardant and a rust preventive, it can improve the flame retardancy of the printed wiring board and prevent rust of the conductive layer.

In the first and second printed wiring boards, the insulating layer has a through hole, and the conductive layers are electrically connected by a conductive paste filled in the through hole. preferable. This preferred example is
This is a printed wiring board having an IVH structure, and has an advantage that the structure is effective for reducing the size and weight. Further, it is preferable that a phosphorus compound layer is formed between the conductive layer and the conductive paste. This is because the adhesive strength between the conductive layer and the conductive paste is improved, so that the reliability of the electrical connection between the conductive layers can be improved.

In the first and second printed wiring boards, it is preferable that the phosphorus compound is at least one ester selected from the group consisting of a phosphate ester and a phosphite ester.

Further, in the first and second printed wiring boards, it is preferable that the base material is mainly composed of glass fiber or organic fiber. Further, as the organic fiber, at least one kind of organic fiber selected from a wholly aromatic polyamide and a wholly aromatic polyester is preferable.

In the first and second printed wiring boards, the insulating resin contains at least one resin selected from the group consisting of an epoxy resin, a bismaleimide triazine resin, a polyester resin and a polyimide resin. Is preferred.

In order to achieve the above object, a first method of manufacturing a printed wiring board according to the present invention comprises a step of impregnating a base material with an insulating resin to produce a prepreg, and laminating a metal foil body on the prepreg. And a step of patterning the metal foil body to form a circuit, and before the step of producing the prepreg, performing a step of attaching a phosphorus compound to the surface of the fiber constituting the base material. It is characterized by. With such a configuration, it is possible to suppress the interface destruction occurring between the fibers constituting the insulating layer and the insulating resin, and it is possible to obtain a printed wiring board having a high adhesive strength between the conductive layers. Another advantage is that the flame retardancy of the printed wiring board is improved.

In order to achieve the above object, a second method of manufacturing a printed wiring board according to the present invention comprises a step of impregnating a base material with an insulating resin to produce a prepreg, and laminating a metal foil body on the prepreg. And a step of patterning the metal foil body to form a circuit, and in the step of laminating the metal foil body on the prepreg, interposing a phosphorus compound layer between the prepreg and the metal foil body. It is characterized by. With such a configuration, it is possible to suppress interface destruction occurring between the conductive layer and the insulating layer,
A printed wiring board having high adhesive strength between conductive layers can be obtained. In addition, the flame retardancy of the printed wiring board can be improved and the conductive layer can be prevented from rusting.

In the second manufacturing method, it is preferable to carry out a step of attaching a phosphorus compound to the surface of the fiber constituting the base material before the step of preparing the prepreg. According to this preferred example, it is possible to suppress both the interfacial breakdown generated between the fiber inside the insulating layer and the insulating resin and the interfacial breakdown generated between the conductive layer and the insulating layer. A printed wiring board having higher adhesive strength can be obtained.

In the first and second production methods, it is preferable that the phosphorus compound is at least one ester selected from the group consisting of a phosphoric ester and a phosphite.

In the first and second manufacturing methods, it is preferable that the base material is mainly made of glass fiber or organic fiber. Further, as the organic fiber, at least one kind of organic fiber selected from a wholly aromatic polyamide and a wholly aromatic polyester is preferable.

In the first and second manufacturing methods, the insulating resin may include at least one resin selected from the group consisting of an epoxy resin, a bismaleimide triazine resin, a polyester resin, and a polyimide resin. Is preferred.

[0019]

(First Embodiment) A first embodiment of the present invention.
In the embodiment, two or more conductive layers are laminated via an insulating layer composed of a composite material of a base material and an insulating resin, and an interface at which the base material and the insulating resin in the insulating layer are in contact with each other. Is a printed wiring board in which a phosphorus compound is interposed. Hereinafter, an example of a method for manufacturing the printed wiring board will be described.

First, a step of introducing a phosphorus compound into a substrate is performed. The base material functions as a reinforcing material for the insulating layer, and is made of a porous material capable of supporting an insulating resin, specifically, paper, a fiber such as a woven fabric or a nonwoven fabric, and a main component. Material is used. The fibers constituting the base material include glass fibers and organic fibers. Examples of the organic fiber include a wholly aromatic polyamide (aramid resin), a wholly aromatic polyester, polybutylene oxide (PBO), and the like. Among them, a wholly aromatic polyamide and a wholly aromatic polyester are preferable. The thickness of the base material is about 50 to 110 μm, and the basis weight is 25 to 150.
g / m ² is appropriate.

As the phosphorus compound, phosphate esters, phosphite esters, and the like can be used. Examples of the phosphate include monoalkyl (or aryl) phosphates such as butyl acid phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, dialkyl (or aryl) phosphate, and trialkyl (or aryl). ) Phosphate esters and the like can be used. Examples of the phosphite include a trialkyl (or aryl) phosphate such as triphenyl phosphite, a monoalkyl (or aryl) phosphite, a dialkyl (or aryl) phosphate, and the like. In addition, a polyphosphoric acid ester or a polyphosphorous acid ester can be used, and examples of such an ester include tetraphenyldipropylene glycol diphosphite.

The step of introducing the phosphorus compound into the base material is, in other words, a step of adhering the phosphorus compound to the surface of the fibers constituting the nonwoven fabric or the like as the base material, preferably forming a phosphorus compound layer on the fiber surface. is there. It is appropriate that the amount of the phosphorus compound to be attached is about 0.1 to 10% by weight based on the substrate. This step can be performed by dissolving a phosphorus compound such as a phosphoric ester or a phosphite in a suitable solvent, immersing the substrate in the solution, and then drying the substrate. According to such a method,
The surface of a fiber constituting a nonwoven fabric or the like serving as a base material can be covered with a phosphorus compound layer. The solvent is not particularly limited as long as it can dissolve the phosphorus compound, but a volatile solvent is preferable, and for example, ethanol, methyl ethyl ketone, diethyl ether and the like can be used. Although not particularly limited, it is appropriate that the concentration of the phosphorus compound solution is about 0.05 to 15% by weight, and the immersion time is about several seconds.

Next, the substrate into which the phosphorus compound has been introduced is impregnated with a resin varnish and then dried to prepare a prepreg to be an insulating layer of a printed wiring board. The resin varnish can be produced by dissolving an insulating resin in a volatile solvent such as ethanol or methyl ethyl ketone together with a curing agent if necessary. Examples of the insulating resin include thermosetting resins such as an epoxy resin, a bismaleimide triazine resin, a polyester resin, a polyimide resin, and a phenol resin. The resin varnish is preferably impregnated so that the proportion of the insulating resin in the entire prepreg is about 45 to 60% by weight.

A through-hole is formed in the prepared prepreg, and the through-hole is filled with a conductive paste. As the conductive paste, a paste obtained by kneading a powder of a conductive substance such as copper, silver, gold, or silver palladium and a thermosetting resin such as an epoxy resin can be used. The content of the conductive substance in the conductive paste is suitably about 85 to 95% by weight.
In this step, a release film such as polyester is pasted on the surface of the prepreg in advance, a through hole is formed at a predetermined position of the prepreg provided with this film by a laser processing method, and the film remaining on the prepreg surface is masked. After printing the conductive paste, the method can be performed by a method of peeling the film.

After filling the conductive paste, a metal foil to be a conductive layer is attached to the surface of the prepreg and laminated by thermocompression bonding. As the metal foil, a copper foil, a silver foil, a nickel foil, a foil body of an alloy thereof or the like can be used, and the thickness of the metal foil is suitably about 9 to 40 μm. The conditions for thermocompression bonding are a temperature of 180 to 230 ° C. and a pressure of 45 to 60 k.
g / cm ² is appropriate. After the thermocompression bonding, the metal foil laminated on the prepreg surface is etched to form a circuit pattern.

If a conductive layer is formed on both surfaces of the prepreg in the above-described manufacturing method, a two-layer wiring board can be manufactured. When a multilayer wiring board is further manufactured, a through-hole is formed in a prepreg manufactured in the same manner as described above, and after filling the through-hole with a conductive paste, a two-layer wiring board or a multilayer serving as a core is formed. The prepreg may be laminated on a wiring board, and a metal foil may be thermocompression-bonded and patterned on the surface to form a conductive layer. At this time, the two-layer wiring board or the multilayer wiring board serving as the core is not particularly limited, and a core manufactured by a conventional manufacturing method can be used.
It is preferably produced by the production method of the present invention.

As described above, the printed wiring board of the present invention which can be manufactured by the above method is obtained by laminating two or more conductive layers via an insulating layer composed of a composite material of a base material and an insulating resin. In addition, the phosphorus compound is interposed at the interface between the base material and the insulating resin in the insulating layer. Therefore, the adhesive strength between the fiber constituting the base material and the insulating resin is improved, so that the destruction inside the insulating layer can be suppressed, and the peeling of the conductive layer of the printed wiring board can be suppressed. Further, since the phosphorus compound has a property as a flame retardant, it is possible to impart flame retardancy to the printed wiring board by introducing the phosphorus compound into the base material.

Although the present embodiment has been described by taking an IVH structure as an example, the present invention is not limited to this structure. For example, the present invention can be applied to a printed wiring board having a through-hole structure. .

(Second Embodiment) In a second embodiment of the present invention, two or more conductive layers are laminated via an insulating layer which is a composite material of a base material and an insulating resin, and the conductive layer is insulated. The printed wiring board has a phosphorus compound layer interposed between the layers. Hereinafter, an example of a method for manufacturing the printed wiring board will be described.

First, a prepreg is prepared by impregnating a base material with an insulating resin. As the substrate, the materials exemplified in the first embodiment, such as a wholly aromatic polyamide or a wholly aromatic polyester nonwoven fabric, can be used. Also, the first
It is preferable to use a substrate into which a phosphorus compound has been introduced in the same manner as in the embodiment. As the insulating resin, the same materials as those in the first embodiment, such as an epoxy resin, a bismaleimide triazine resin, a polyester resin, and a polyimide resin, can be used. The amount of the insulating resin impregnated is suitably about 45 to 60% by weight of the entire prepreg.

A phosphorus compound layer is formed on the surface of the prepared prepreg. As the phosphorus compound, the same phosphoric acid ester or phosphite as exemplified in the first embodiment can be used. The method for forming the phosphorus compound layer is not particularly limited. For example, a method in which a solution in which a phosphorus compound is dissolved in an appropriate solvent is sprayed on the prepreg surface, or a method in which the prepreg is immersed in the phosphorus compound solution can be adopted. . As the solvent, a volatile solvent is preferable, and for example, ethanol, diethyl ether and the like can be used. The concentration of the solution is not particularly limited, but is suitably about 0.05 to 10% by weight.
Note that the thickness of the phosphorus compound layer is suitably about 1 to 10 μm.

Next, through holes are formed in predetermined portions of the prepreg by a laser processing method or the like, and the through holes are filled with a conductive paste. This step can be performed in the same manner as in the first embodiment. Further, a metal foil is attached to the surface of the prepreg on which the phosphorus compound layer is formed, and laminated by thermocompression bonding. Thermocompression bonding temperature 180-230
It is appropriate to carry out the reaction at a temperature of 45 ° C. and a pressure of 45 to 60 kg / cm ² . After thermocompression bonding, the metal foil laminated on the prepreg surface is etched to form a circuit pattern.

If a conductive layer is formed on both surfaces of the prepreg in the above method, a two-layer wiring board can be manufactured.
When a multi-layer wiring board is to be produced, a prepreg on which a phosphorus compound layer is formed is laminated on a two-layer wiring board or a multilayer wiring board as a core in the same manner as described above, and a metal foil is laminated on the surface. do it. At this time, the two-layer wiring board or the multilayer wiring board serving as the core is not particularly limited, but is preferably manufactured by the manufacturing method of the present invention.

As described above, the printed wiring board of the present invention which can be manufactured by the above method has a phosphorus compound interposed between the conductive layer and the insulating layer. Accordingly, since the adhesive strength between the insulating layer and the conductive layer is improved, peeling between the conductive layers of the printed wiring board can be suppressed. Further, since the phosphorus compound has properties as a flame retardant and a rust preventive, the flame retardancy of the printed wiring board and the insulation reliability in the circuit pattern can be improved.

In this embodiment, the IVH structure is described as an example. However, the present invention is not limited to this structure, and can be applied to, for example, a printed wiring board having a through-hole structure. .

(Third Embodiment) In a third embodiment of the present invention, as in the second embodiment, two or more conductive layers are laminated via an insulating layer. A phosphorus compound layer is interposed between the layers. The third embodiment relates to a printed wiring board having an IVH structure in which electrical connection between conductive layers is ensured by a conductive paste filled in a through hole formed in an insulating layer. A phosphorus compound layer is also formed at the interface where the phosphorous compound contacts. Hereinafter, an example of a method for manufacturing the printed wiring board will be described.

A through-hole is formed in a prepreg formed by impregnating a base material with an insulating resin by a laser processing method or the like, and the through-hole is filled with a conductive paste. The above steps can be performed in the same manner as in the second embodiment except that the phosphorus compound layer is not formed on the prepreg surface.

On the other hand, a phosphorus compound layer is formed on the surface of the metal foil to be the conductive layer. As the metal foil and the phosphorus compound, the same materials as those exemplified in the first embodiment can be used. The thickness of the phosphorus compound layer is suitably about 1 to 5 μm. The method of forming the phosphorus compound layer is not particularly limited, and examples thereof include a method of applying a phosphorus compound solution to the surface of the metal foil using a spin coater or the like. As the solvent, a volatile solvent is preferable, and for example, ethanol, diethyl ether and the like can be used.
Further, the concentration of the solution is not particularly limited,
About 1.0 to 20% by weight is appropriate.

In the prepreg filled with the conductive paste,
The metal foil on which the phosphorus compound layer is formed is attached and laminated by thermocompression bonding. Thermocompression bonding can be performed under the same conditions as in the second embodiment. After thermocompression bonding, the metal foil laminated on the prepreg surface is etched to form a circuit pattern.

If a conductive layer is formed on both sides of the prepreg in the above method, a two-layer wiring board can be manufactured.
Further, in the case of producing a multilayer wiring board, a prepreg is laminated on a two-layer wiring board or a multilayer wiring board serving as a core,
A metal foil having a phosphorus compound layer formed thereon may be laminated on the surface in the same manner as described above. At this time, the two-layer wiring board or the multilayer wiring board serving as the core is not particularly limited, but is preferably manufactured by the manufacturing method of the present invention.

According to the above-described method, not only is the peeling of the conductive layer of the printed wiring board suppressed, but also the phosphorus compound layer is formed between the metal foil and the conductive paste. The adhesive strength between a certain metal foil and a conductive paste can be improved, and the reliability of connection between conductive layers can be improved. Further, similarly to the second embodiment, the flame retardancy of the printed wiring board can be improved and the rust prevention of the circuit pattern can be achieved.

[0042]

The present invention will be described below in detail with reference to examples and comparative examples.

Comparative Example 1 30 parts by weight of a brominated bisphenol A type epoxy resin, 35 parts by weight of a trifunctional epoxy resin, 30 parts by weight of a novolak type phenol resin, 0.1 parts by weight of carbonyldiimidazole and 67 parts by weight of methyl ethyl ketone were dissolved. By mixing, a resin varnish was prepared. This resin varnish was impregnated into an aramid nonwoven fabric ("Technola (trade name)" manufactured by Teijin Limited) and then dried to obtain a prepreg. For impregnation, the total amount of resin in the prepreg is 50 ± 1% by weight.
The drying condition was 140 ° C. for 3 minutes. Laminate copper foil on both sides of this prepreg, 200 ° C,
Thermocompression bonding was performed with a vacuum hot press at 50 kg / cm ² for 1 hour to obtain a copper-clad laminate (Sample No. 1).

Example 1 A 1% by weight ethanol solution of a phosphorus compound was prepared, and an aramid nonwoven fabric was immersed in the solution and dried. Comparative Example 1 except that a prepreg was prepared using the aramid nonwoven fabric treated as described above.
A copper-clad laminate was produced in the same manner as described above. As the phosphorus compound, butyl acid phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, triphenyl phosphite, and tetraphenyldipropylene glycol diphosphite were used.
Various types of samples were prepared (Sample Nos. 2 to 6).

Example 2 A copper-clad laminate was prepared in the same manner as in Comparative Example 1, except that a phosphorus compound layer was formed on the prepreg surface. The phosphorus compound layer was formed by applying an ethanol solution of the phosphorus compound to the surface of the prepreg by spraying, and the layer thickness was adjusted to 3 μm. Five kinds of samples were prepared using the same five kinds of compounds as those used in Example 1 as the phosphorus compounds (sample N).
o. 7-11).

Example 3 A copper-clad laminate was produced in the same manner as in Comparative Example 1, except that a phosphorus compound layer was formed on a copper foil surface. The phosphorus compound layer was formed by applying an ethanol solution of the phosphorus compound to the surface of the copper foil using a spin coater, and the layer thickness was adjusted to 3 μm. Five kinds of samples were prepared using the same five kinds of compounds as those used in Example 1 as the phosphorus compounds (Sample No. 12).
~ 16).

Example 4 A copper-clad laminate was produced in the same manner as in Example 1 except that a phosphorus compound layer was formed on the prepreg surface. The phosphorus compound layer was formed by applying an ethanol solution of the phosphorus compound to the surface of the prepreg by spraying, and the layer thickness was adjusted to 3 μm. As a phosphorus compound, butyl acid phosphate,
Two types of samples were prepared using each of triphenyl phosphites (Sample Nos. 17 and 18).

Example 5 A copper-clad laminate was produced in the same manner as in Example 1, except that a phosphorus compound layer was formed on the surface of the copper foil. The phosphorus compound layer was formed by applying an ethanol solution of the phosphorus compound to the surface of the copper foil using a spin coater, and the layer thickness was adjusted to 3 μm. As the phosphorus compound, two kinds of compounds similar to those used in Example 4 were used, and two kinds of samples were prepared (sample N).
o. 19 and no. 20).

For the samples prepared in Examples 1 to 5 and Comparative Example 1, the adhesive strength between the conductive layers was measured.

The procedure for measuring the adhesive strength was as follows. First, a test piece having a width of 1 cm was cut out from the prepared sample, and the conductive layer (metal foil layer) was torn from the end of the test piece by an appropriate length. The torn ends were sandwiched between two chuck portions of a tensile tester, and a tensile stress was applied to the other end while one end was fixed, and the tensile strength was measured. In addition,
The tensile direction was adjusted so that the angle formed between the length direction of the part of the test piece that was not torn and the tensile direction was 180 °. The results are shown in Table 1 together with the phosphorus compound used and the treatment site. The treated sites are indicated by (○) in the column of the members that have been treated with the phosphorus compound, and (-) in the column of the members that have not been treated.

[0051]

[Table 1]

As shown in Table 1, the adhesive strength between the conductive layers of all of the samples (Samples Nos. 2 to 20) manufactured in Examples 1 to 5 was compared with the sample (Sample No. 1) manufactured in Comparative Example 1. Has been confirmed to have improved. In particular, the samples of Examples 4 and 5 in which both the nonwoven fabric and the prepreg or the metal foil were treated with the phosphorus compound (Sample Nos. 17 to 2)
In 0), excellent adhesive strength was obtained.

Next, according to the third embodiment of the present invention, the phosphorus compound layer existing at the interface between the conductive layer and the conductive paste
The following test was performed to investigate the effect of a phosphorus compound on the characteristics of the interface between a conductive layer and a conductive paste in a printed wiring board having a VH structure.

Test Example 1 A conductive paste was prepared by kneading a copper powder having an average particle diameter of 2 μm and a solventless epoxy resin with three rolls. In addition, the copper powder content of this conductive paste was 90% by weight. Next, 1
A cushion material having an opening of 10 cm was placed, and the opening was filled with the conductive paste. Another copper foil is further laminated on this cushion material, and 200 ° C., 50 kg
Thermocompression bonding with a vacuum hot press under the condition of / cm ² for 1 hour,
A sample was prepared (Sample No. 21).

(Test Example 2) An ethanol solution of a phosphorus compound was applied to the surface of a copper foil by a spin coater to obtain a layer thickness of 3
A phosphorus compound layer having a thickness of μm was formed. A sample was prepared in the same manner as in Test Example 1 except that a copper foil subjected to such treatment was used. The same five compounds as in Example 1 were used as the phosphorus compounds, and five types of samples were obtained (Sample No.
22-26).

With respect to the samples prepared in Test Examples 1 and 2, the portion where the conductive paste was present was cut out to a width of 1 cm to form a test piece, and the adhesive strength was measured. The measuring method is the same as the method described above. Table 2 shows the results.

[0057]

[Table 2]

As shown in Table 2, the adhesion between the conductive layer and the conductive paste was higher in the samples (Samples Nos. 22 to 26) manufactured in Test Example 2 than in the samples (Sample No. 21) manufactured in Test Example 1. It was confirmed that the strength was high. From this result, it was confirmed that according to the third embodiment of the present invention, the adhesive strength between the conductive layer and the conductive paste can be improved.

[0059]

As described above, according to the first printed wiring board of the present invention, two or more conductive layers formed of a metal foil are formed by impregnating a base material with an insulating resin. Are laminated via an insulating layer, and the phosphorus compound is attached to the surface of the fiber constituting the base material, thereby suppressing interface destruction occurring between the fiber inside the insulating layer and the insulating resin. Thus, the adhesive strength between the conductive layers can be improved.

Further, according to the second printed wiring board of the present invention, two or more conductive layers formed of a metal foil are interposed via an insulating layer formed by impregnating a base material with an insulating resin. Laminated, the interposition of the phosphorus compound layer between the conductive layer and the insulating layer, suppresses the interface breakdown between the conductive layer and the insulating layer, the adhesive strength between the conductive layers Can be improved.

Further, according to the first method of manufacturing a printed wiring board of the present invention, a step of producing a prepreg by impregnating a base material with an insulating resin, and a step of laminating a metal foil body on the prepreg; Forming a circuit by patterning the metal foil body, prior to the step of preparing the prepreg, by performing a step of attaching a phosphorus compound to the surface of the fiber constituting the substrate, insulation It is possible to provide a printed wiring board having high adhesive strength between conductive layers by suppressing interfacial destruction occurring between fibers in the layer and the insulating resin.

Further, according to the second method of manufacturing a printed wiring board of the present invention, a step of producing a prepreg by impregnating a base material with an insulating resin, and a step of laminating a metal foil on the prepreg; Patterning the metal foil body to form a circuit, in the step of laminating the metal foil body on the prepreg, by interposing a phosphorus compound layer between the prepreg and the metal foil body, conductive The printed circuit board having a high adhesive strength between the conductive layers can be suppressed by suppressing the interface destruction generated between the layers and the insulating layer.

Claims (14)

[Claims] 1. A printed wiring board comprising two or more conductive layers formed by a metal foil body laminated via an insulating layer formed by impregnating a base material with an insulating resin, A printed wiring board, wherein a phosphorus compound is attached to a surface of a fiber constituting the material. 2. A printed wiring board comprising two or more conductive layers formed of a metal foil body laminated via an insulating layer formed by impregnating a base material with an insulating resin. A printed wiring board, wherein a phosphorus compound layer is interposed between a layer and the insulating layer. 3. The printed wiring board according to claim 1, wherein the insulating layer has a through-hole, and the conductive layers are electrically connected by a conductive paste filled in the through-hole. 4. The printed wiring board according to claim 1, wherein the phosphorus compound is at least one ester selected from the group consisting of a phosphate ester and a phosphite ester. 5. The printed wiring board according to claim 1, wherein said base material mainly comprises glass fibers or organic fibers. 6. The printed wiring board according to claim 5, wherein the base material is mainly composed of at least one organic fiber selected from the group consisting of wholly aromatic polyamides and wholly aromatic polyesters. 7. The printed wiring according to claim 1, wherein the insulating resin includes at least one resin selected from the group consisting of an epoxy resin, a bismaleimide triazine resin, a polyester resin, and a polyimide resin. substrate. 8. A method for producing a prepreg by impregnating a base material with an insulating resin, laminating a metal foil body on the prepreg, and forming a circuit by patterning the metal foil body. And a step of adhering a phosphorus compound to the surface of the fiber constituting the base material before the step of producing the prepreg. 9. A method for producing a prepreg by impregnating a base material with an insulating resin, laminating a metal foil on the prepreg, and forming a circuit by patterning the metal foil. And a step of laminating a metal foil on the prepreg, wherein a phosphorus compound layer is interposed between the prepreg and the metal foil. 10. The method for producing a printed wiring board according to claim 9, wherein a step of attaching a phosphorus compound to the surface of the fiber constituting the base material is performed before the step of producing the prepreg. 11. The method according to claim 8, wherein the phosphorus compound is at least one ester selected from the group consisting of a phosphoric ester and a phosphite. 12. The printed wiring board according to claim 8, wherein the base material mainly comprises glass fibers or organic fibers. 13. The method for manufacturing a printed wiring board according to claim 12, wherein the base material is mainly composed of at least one organic fiber selected from the group consisting of wholly aromatic polyamides and wholly aromatic polyesters. . 14. The printed wiring according to claim 8, wherein the insulating resin contains at least one resin selected from the group consisting of an epoxy resin, a bismaleimide triazine resin, a polyester resin, and a polyimide resin. Substrate manufacturing method.