JPH11354659A - Power semiconductor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a power semiconductor module from being broken by a fixing screw at the time of fixing it to cooling fins, or the like. SOLUTION: The power semiconductor module 1 comprises a metal base 2, a power semiconductor element 10 arranged thereon, and a resin case 4 bonded to the end part of the metal base 2 through adhesive in order to seal the power semiconductor element 10. Holes for fixing the power semiconductor module 1 are made to communicate with the metal base 2 and the resin case 4. A metal bush 16 is provided at the fixing hole 2a of the resin case 4 while projecting by 0.1-0.2 mm above the fixing face of the resin case 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module, and more particularly to an improvement in mounting.

[0002]

2. Description of the Related Art A conventional power semiconductor module accommodating a power semiconductor element is shown in FIG. In FIG. 2, reference numeral 2 denotes a metal base of the power semiconductor module 1, on which an insulating plate 6 is soldered. Terminals 8 drawn out on the insulating plate 6
Further, a power semiconductor element 10 such as a thyristor, a diode, and a transistor is mounted thereon and soldered.

After that, a resin case 4 is adhered to the end of the metal base 2 with an adhesive such as silicon rubber, and a sealing agent 14 such as a silicon gel is injected into the case 4 so that the power semiconductor element is formed. 10 is sealed.

Incidentally, the metal base 2 and the resin case 4
In order to mount the power semiconductor module 1 to the cooling fins, the mounting holes 2 a of the metal base 2 and the mounting holes 4 a communicate with the resin case 4.

[0005]

In this power semiconductor module, screws (not shown) are passed through the mounting holes 4a and 2a, and the screws are mounted on a cooling fan (not shown). At this time, there is a problem that the head of the screw bites into the resin case 4 and the resin case 4 is broken.

[0006]

A power semiconductor module according to the present invention comprises a metal base, a power semiconductor element provided on the metal base, and an adhesive bonded to an end of the metal base by an adhesive. In a power semiconductor module provided with a resin case for encapsulating a power semiconductor element, an end face communicates with the metal base mounting hole, and an end face is provided on a mounting surface of the resin case for mounting the power semiconductor module. A metal bush protruding from the upper side by 0.1 to 0.2 mm is provided.

That is, when the power semiconductor module is mounted on an external cooling fin or the like, a screw is inserted into a mounting hole passing through the resin case and the metal base and tightened. At the time of this tightening, the screw head comes into contact with the end face of the metal bush, and there is no crack in the resin case due to the tightening of the screw.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIG. 1 showing an embodiment thereof. In FIG. 1, reference numeral 2 denotes a metal base of the power semiconductor module 1, on which an insulating plate 6 is soldered. This insulating plate 6
A terminal 8 extending to the outside and a power semiconductor element 10 such as a thyristor, a diode, and a transistor are mounted thereon and soldered thereon.

Thereafter, a resin case 4 is adhered to the end of the metal base 2 with an adhesive such as silicon rubber, and a sealing agent 14 such as a silicon gel is injected into the case 4.
The power semiconductor element 10 is sealed.

The metal base 2 and the resin case 4 are provided with mounting holes for communicating the power semiconductor module 1 to the cooling fins.
A hollow bush 16 made of metal is fitted in the mounting hole. The end face 16a of the bush 16 projects 0.1 to 0.2 mm higher than the mounting face 4b of the resin case 4.

Therefore, this power semiconductor module is
Screws (not shown) penetrate through the mounting holes 16b of the bush 16 and the mounting holes 2a of the metal base 2, and are mounted on cooling fins (not shown). At this time, since the head of the screw is in contact with the end face of the metal bush, the screw does not break the resin case.

In the embodiment of the present invention, the bush is fitted in the mounting hole of the resin case 2, but the bush may be formed integrally when the resin case is formed.

[0013]

According to the power semiconductor module of the present invention,
When the power semiconductor module is mounted on a cooling fin or the like, the power semiconductor module is not damaged by the mounting screws.

[Brief description of the drawings]

FIG. 1 is a partially broken external view showing an embodiment of a power semiconductor module of the present invention.

FIG. 2 is a partially broken external view of a conventional power semiconductor module.

[Explanation of symbols]

 2 Metal base 4 Resin case 4b Mounting surface 10 Semiconductor element for power 16 Bush 16a End face

Claims (1)

[Claims] 1. A power supply device comprising: a metal base; a power semiconductor element provided on the metal base; and a resin case bonded to an end of the metal base with an adhesive to seal the power semiconductor element. In power semiconductor modules,
A metal bush whose end face protrudes 0.1 to 0.2 mm above the mounting surface of the resin case is provided in the mounting hole of the resin case, which communicates with the mounting hole of the metal base and mounts the power semiconductor module. A power semiconductor module, characterized in that: