JPH11350195A - Composite plating apparatus - Google Patents

Composite plating apparatus

Info

Publication number
JPH11350195A
JPH11350195A JP15503398A JP15503398A JPH11350195A JP H11350195 A JPH11350195 A JP H11350195A JP 15503398 A JP15503398 A JP 15503398A JP 15503398 A JP15503398 A JP 15503398A JP H11350195 A JPH11350195 A JP H11350195A
Authority
JP
Japan
Prior art keywords
composite plating
plating solution
cylindrical electrode
cylinder block
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15503398A
Other languages
Japanese (ja)
Other versions
JP3351511B2 (en
Inventor
Yoshimitsu Ogawa
義光 小川
Hitoshi Karasawa
均 唐澤
Takayasu Nishiyama
貴康 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP15503398A priority Critical patent/JP3351511B2/en
Publication of JPH11350195A publication Critical patent/JPH11350195A/en
Application granted granted Critical
Publication of JP3351511B2 publication Critical patent/JP3351511B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a composite plating apparatus which deposits a metallic matrix at a regulated thickness and uniformly codeposits ceramic particles on the metallic matrix. SOLUTION: This apparatus consists of a work stage 6 on which a cylinder block 2 having a hollow part 2a is placed, a cylindrical electrode 10 which is arranged apart a spacing S1 in the hollow part 2a of the cylinder block 2 placed on the work stage 6, is provided with a cap part 14 and has through- holes 13 at the peripheral wall facing the inside surface 2b of the hollow part 2a, a rotating mechanism 20 which rotates the cylindrical electrode 10 around its axis 10a, a plating liquid circulating mechanism 30 which supplies a composite plating liquid 29 into the inner holes 13 of the cylindrical electrode 10, injects the liquid through the through-holes 13 and recovers the liquid from the outer side of the cylindrical electrode 10 and an energizing mechanism 45 which energizes the cylinder block 2 and the cylindrical electrode 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はワークの中空部内面
に複合メッキ皮膜を施す複合メッキ装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite plating apparatus for forming a composite plating film on the inner surface of a hollow portion of a work.

【0002】[0002]

【従来の技術】内燃機関用のシリンダブロックには、例
えばピストンリングの摺動面となるシリンダ内面をシリ
ンダブロックと一体に鋳造成形し、このシリンダ内面に
Ni/SiC複合メッキ皮膜を施したものがある。Ni
/SiC複合メッキ皮膜は、金属相であるNiマトリク
ス中に炭化ケイ素(SiC)粒子を共析したもので、シ
リンダ内面の耐摩耗性を高めたものである。
2. Description of the Related Art A cylinder block for an internal combustion engine is, for example, one in which a cylinder inner surface serving as a sliding surface of a piston ring is cast and formed integrally with the cylinder block, and a Ni / SiC composite plating film is applied to the cylinder inner surface. is there. Ni
The / SiC composite plating film is obtained by co-depositing silicon carbide (SiC) particles in a Ni matrix, which is a metal phase, and has improved wear resistance on the inner surface of the cylinder.

【0003】一方、特開平7−118891号公報「表
面処理装置」に高速メッキ処理方法が開示されている。
この高速メッキ処理方法によれば、シリンダ内面に沿っ
て複合メッキ液を強制的に流動させて、シリンダ内面に
高速に複合メッキ皮膜を施すことができる。次図に同公
報の装置によるNi/SiC複合メッキ皮膜処理を示
す。
On the other hand, a high-speed plating method is disclosed in Japanese Unexamined Patent Publication No. Hei 7-118891, "Surface treatment apparatus".
According to this high-speed plating method, the composite plating solution can be forcibly flowed along the inner surface of the cylinder, and the composite plating film can be applied to the inner surface of the cylinder at high speed. The following figure shows the Ni / SiC composite plating film treatment by the apparatus of the publication.

【0004】図9は従来のNi/SiC複合メッキ処理
の説明図である。シリンダブロック100の開孔101
内に隙間Sを開けて筒形の電極102を配置することに
より、開孔101と電極102との間に環状通路104
を形成する。この環状通路104に複合メッキ液を矢印
の如く流し、次に電極102の頂部を廻って電極10
2の内側へ矢印の如く折り返した流れとする。この複
合メッキ液の、の流れを継続しながら、電極102
とシリンダブロック100とに通電して、複合メッキ皮
膜105のNiマトリクス106中にSiC粒子107
…(…は複数(個)を示す。以下同様。)を共析させ
る。
FIG. 9 is an explanatory view of a conventional Ni / SiC composite plating process. Opening 101 of cylinder block 100
By disposing a cylindrical electrode 102 with a gap S in the inside, an annular passage 104 is formed between the opening 101 and the electrode 102.
To form A composite plating solution is flowed through the annular passage 104 as shown by the arrow, and then around the top of the electrode 102, the electrode 10
The flow is turned inward as shown by the arrow in FIG. While continuing the flow of the composite plating solution, the electrode 102
And the cylinder block 100, the SiC particles 107 in the Ni matrix 106 of the composite plating film 105.
... (... indicates a plurality (number). The same shall apply hereinafter).

【0005】[0005]

【発明が解決しようとする課題】しかし、図9に示した
複合メッキ皮膜105には次図に示す不具合がある。図
10は図9の10部拡大図である。複合メッキ液が環状
通路104に沿って矢印方向に流れるので、下流側のN
iマトリクス106中に多量のSiC粒子107…が共
析する。従って、複合メッキ液が上方向(下流側)に流
れるに従って、複合メッキ液中のSiC粒子107…が
減少してしまい、SiC粒子107…の共析量は下流側
に向って徐々に減少する。このため、複合メッキ皮膜の
耐摩耗性が下流側で小さくなるという問題がある。
However, the composite plating film 105 shown in FIG. 9 has a problem shown in the following figure. FIG. 10 is an enlarged view of part 10 of FIG. Since the composite plating solution flows in the direction of the arrow along the annular passage 104, the N
A large amount of SiC particles 107 are eutectoid in the i matrix 106. Therefore, as the composite plating solution flows upward (downstream side), the SiC particles 107 in the composite plating solution decrease, and the eutectoid amount of the SiC particles 107 gradually decreases toward the downstream side. For this reason, there is a problem that the wear resistance of the composite plating film decreases on the downstream side.

【0006】図11は従来のNi/SiC複合メッキ液
の流速の説明図である。複合メッキ液109が環状通路
104に沿って白抜き矢印の如く流れる。このとき、開
孔101表面側の複合メッキ液109は、白抜き矢印
の如く開孔101表面の抵抗で流速が小さくなる。この
ため、複合メッキ液109中のNiイオン108…が流
速の大きい中央側に集り、開孔101表面側のNiイオ
ン濃度が規定濃度より低くなる。この結果、複合メッキ
皮膜105のNiマトリクス106を規定厚さに析出さ
せることができない虞れがある。
FIG. 11 is an illustration of the flow rate of a conventional Ni / SiC composite plating solution. The composite plating solution 109 flows along the annular passage 104 as shown by a white arrow. At this time, the flow rate of the composite plating solution 109 on the surface side of the opening 101 becomes small due to the resistance of the surface of the opening 101 as shown by the white arrow. Therefore, the Ni ions 108 in the composite plating solution 109 are collected at the central side where the flow velocity is large, and the Ni ion concentration on the surface side of the opening 101 becomes lower than the specified concentration. As a result, there is a possibility that the Ni matrix 106 of the composite plating film 105 cannot be deposited to a specified thickness.

【0007】そこで、本発明の目的は、金属マトリクス
を規定厚さに析出させることができ、さらに金属マトリ
ックスにセラミックス粒子を均一に共析させることがで
きる複合メッキ装置を提供することにある。
Accordingly, an object of the present invention is to provide a composite plating apparatus capable of depositing a metal matrix to a specified thickness, and capable of uniformly depositing ceramic particles on the metal matrix.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に本発明の請求項1は、中空部を有するワークを載せる
ワーク載置台と、このワーク載置台に載せたワークの中
空部内に隙間を開けて配置し、有底又は蓋付きで且つ前
記中空部の内面と対向する周壁に複数の貫通孔を有する
筒形電極と、この筒形電極を電極の軸廻りに回転させる
回転機構と、筒形電極の内側にメッキ液にセラミックス
粒子を混合した複合メッキ液を供給し、周壁の貫通孔を
通じて噴射させ、筒形電極の外側から回収するメッキ液
循環機構と、ワークと筒形電極とに通電する通電機構と
から複合メッキ装置を構成する。
According to a first aspect of the present invention, there is provided a work mounting table on which a work having a hollow portion is mounted, and a gap formed in the hollow portion of the work mounted on the work mounting table. A tubular electrode having a plurality of through-holes in a peripheral wall opposed to the inner surface of the hollow portion having a bottom or a lid, which is disposed open, a rotating mechanism for rotating the tubular electrode around the axis of the electrode, and a tube. Supplying a composite plating solution in which ceramic particles are mixed with a plating solution inside the shaped electrode, spraying it through through holes in the surrounding wall, and recovering the plating solution from the outside of the cylindrical electrode, and energizing the work and the cylindrical electrode A composite plating apparatus is constituted by the energizing mechanism to be used.

【0009】複合メッキ液を複数の貫通孔から筒形電極
の外側に噴射して、噴射した複合メッキ液を中空部の内
面にほぼ直角に当てる。このため、中空部の内面に当っ
た複合メッキ液は乱流になり、金属イオンやセラミック
ス粒子を複合メッキ液中に均一に分散することができ
る。この結果、内面近傍において複合メッキ液中の金属
イオン濃度を規定濃度に保つことができ、また内面近傍
において複合メッキ液中のセラミックス粒子を均一に分
散させることができる。
The composite plating solution is sprayed from a plurality of through holes to the outside of the cylindrical electrode, and the sprayed composite plating solution is applied substantially perpendicularly to the inner surface of the hollow portion. For this reason, the composite plating solution that hits the inner surface of the hollow portion becomes turbulent, and metal ions and ceramic particles can be uniformly dispersed in the composite plating solution. As a result, the metal ion concentration in the composite plating solution can be maintained at a specified concentration near the inner surface, and the ceramic particles in the composite plating solution can be uniformly dispersed near the inner surface.

【0010】さらに、筒形電極を回転させることによ
り、複数の貫通孔から噴射した複合メッキ液を中空部の
内面全域に均一に当てることができる。このため、内面
全域に金属相マトリックスをより均一な厚さに析出させ
ることができ、さらに金属相マトリックス中にセラミッ
クス粒子をより均一に共析させることができる。
Further, by rotating the cylindrical electrode, the composite plating solution sprayed from the plurality of through holes can be uniformly applied to the entire inner surface of the hollow portion. For this reason, the metal phase matrix can be deposited to a more uniform thickness over the entire inner surface, and the ceramic particles can be more uniformly co-deposited in the metal phase matrix.

【0011】請求項2は、ワーク載置台は、ワーク受け
面に絶縁部材或いは絶縁コーティングを備えたことを特
徴とする。ワーク受け面に絶縁部材或いは絶縁コーティ
ングを備えたので、ワークをワーク載置台から絶縁させ
てワークのみに通電させることができる。この結果、ワ
ークの中空部の内面に複合メッキ皮膜を効率よく施すこ
とができる。
According to a second aspect of the present invention, the work mounting table is provided with an insulating member or an insulating coating on the work receiving surface. Since the work receiving surface is provided with an insulating member or an insulating coating, the work can be insulated from the work mounting table and only the work can be energized. As a result, the composite plating film can be efficiently applied to the inner surface of the hollow portion of the work.

【0012】請求項3は、ワーク載置台に、複合メッキ
液の回収孔を開けたことを特徴とする。ワーク載置台に
複合メッキ液の回収孔を開けたので、中空部の内面に当
った複合メッキ液を中空部の下側から回収することがで
きる。この結果、複合メッキ液をスムーズに循環させる
ことができるので、中空部の内面に複合メッキ皮膜を効
率よく施すことができる。
According to a third aspect of the present invention, a hole for collecting a composite plating solution is formed in the work mounting table. Since the recovery hole for the composite plating solution is opened in the work mounting table, the composite plating solution that has hit the inner surface of the hollow portion can be recovered from below the hollow portion. As a result, the composite plating solution can be smoothly circulated, so that the composite plating film can be efficiently applied to the inner surface of the hollow portion.

【0013】請求項4は、複数の貫通孔は、筒形電極の
周壁に螺旋状に配置したことを特徴とする。複数の貫通
孔を筒形電極の周壁に螺旋状に配置したので、筒形電極
を回転することにより周壁に対向するワークの中空部の
内面に複合メッキ液をより均一に当てることができる。
この結果、複合メッキ液中の金属イオン濃度を規定濃度
に保って金属相マトリックスを規定厚さに析出させるこ
とができる。また、中空部の内面にセラミックス粒子が
より均一に当るので、セラミックス粒子を金属相マトリ
クス中に均一に共析させることができる。
According to a fourth aspect of the present invention, the plurality of through holes are spirally arranged on the peripheral wall of the cylindrical electrode. Since the plurality of through holes are spirally arranged on the peripheral wall of the cylindrical electrode, the composite plating solution can be more uniformly applied to the inner surface of the hollow portion of the work facing the peripheral wall by rotating the cylindrical electrode.
As a result, the metal phase matrix can be deposited to a specified thickness while maintaining the metal ion concentration in the composite plating solution at a specified concentration. Further, since the ceramic particles more uniformly hit the inner surface of the hollow portion, the ceramic particles can be co-deposited uniformly in the metal phase matrix.

【0014】[0014]

【発明の実施の形態】本発明の実施の形態を添付図に基
づいて以下に説明する。なお、図面は符号の向きに見る
ものとする。図1は本発明に係る複合メッキ装置を示す
全体図である。複合メッキ装置1は、内燃機関用のシリ
ンダブロック(ワーク)2を載せるために本体4に取付
けたワーク載置台6と、このワーク載置台6に載せたシ
リンダブロック2の中空部2a内に配置した筒形電極1
0と、この筒形電極10を筒形電極10の軸線10aの
廻りに回転させる回転機構20と、筒形電極10の内側
孔(内側)11に複合メッキ液29を供給するメッキ液
循環機構30と、シリンダブロック2と筒形電極10と
を通電する通電機構45とからなる。なお、筒形電極1
0については図3(a),(b)及び図4で詳しく説明
する。2bは中空部2aの内面、2cは冷却水の通路と
なるウォータジャケット、2dはクランク室、3は内面
2bと筒形電極10とで形成した隙間S1の環状通路で
ある。
Embodiments of the present invention will be described below with reference to the accompanying drawings. The drawings should be viewed in the direction of reference numerals. FIG. 1 is an overall view showing a composite plating apparatus according to the present invention. The composite plating apparatus 1 is arranged in a work mounting table 6 mounted on a main body 4 for mounting a cylinder block (work) 2 for an internal combustion engine, and in a hollow portion 2a of the cylinder block 2 mounted on the work mounting table 6. Cylindrical electrode 1
0, a rotation mechanism 20 for rotating the cylindrical electrode 10 around the axis 10 a of the cylindrical electrode 10, and a plating solution circulation mechanism 30 for supplying a composite plating solution 29 to the inner hole (inside) 11 of the cylindrical electrode 10. And an energizing mechanism 45 for energizing the cylinder block 2 and the cylindrical electrode 10. In addition, the cylindrical electrode 1
0 will be described in detail with reference to FIGS. 2b is an inner surface of the hollow portion 2a, 2c is a water jacket serving as a cooling water passage, 2d is a crank chamber, and 3 is an annular passage of a gap S1 formed by the inner surface 2b and the cylindrical electrode 10.

【0015】ワーク載置台6は、ワーク受け面6aに絶
縁部材7を備え、かつ複合メッキ液の回収孔6bを備え
た部材である。絶縁部材7は、例えばセラッミックや合
成樹脂で形成した板材である。絶縁部材7を備えた理由
は、シリンダブロック2をワーク載置台6から絶縁させ
てシリンダブロック2のみに通電させることにより、シ
リンダブロック2の内面2bに複合メッキ皮膜を効率よ
く施すためである。ワーク載置台6に回収孔6bを備え
た理由は、シリンダブロック2の内面2bに当った複合
メッキ液29を回収孔6bから回収して、複合メッキ液
29をスムーズに循環させることにより、シリンダブロ
ック2の内面2bにに複合メッキ皮膜を効率よく施すた
めである。
The work mounting table 6 is a member provided with an insulating member 7 on a work receiving surface 6a and a recovery hole 6b for a composite plating solution. The insulating member 7 is a plate material formed of, for example, ceramic or synthetic resin. The reason why the insulating member 7 is provided is to insulate the cylinder block 2 from the work mounting table 6 and apply electricity only to the cylinder block 2, thereby efficiently applying a composite plating film to the inner surface 2 b of the cylinder block 2. The reason why the work mounting table 6 is provided with the recovery hole 6b is that the composite plating solution 29 hitting the inner surface 2b of the cylinder block 2 is recovered from the recovery hole 6b, and the composite plating solution 29 is smoothly circulated. This is because the composite plating film is efficiently applied to the inner surface 2b of the substrate 2.

【0016】次に、回転機構20について説明する。回
転機構20は、4気筒エンジン用のシリンダブロックに
適用させて4本の筒形電極10…を回転させる機構であ
るが、ここでは1本の筒形電極10を回転させる内容に
ついて説明する。回転機構20は、本体4に取付けたモ
ータ21と、このモータ21につないだ駆動シャフト2
2と、この駆動シャフト22に取付けた駆動ギヤ23
と、駆動ギヤ23に噛み合ったギヤ24と、このギヤ2
4を略中央に取付け且つ上端に筒形電極10のねじ部1
4を取付けた支持軸25とからなる。なお、4本の筒形
電極10…を回転させる機構については図2で詳しく説
明する。
Next, the rotation mechanism 20 will be described. The rotating mechanism 20 is a mechanism that is applied to a cylinder block for a four-cylinder engine and rotates four cylindrical electrodes 10. Here, the description will be made on the content of rotating one cylindrical electrode 10. The rotation mechanism 20 includes a motor 21 attached to the main body 4 and a drive shaft 2 connected to the motor 21.
2 and a drive gear 23 attached to the drive shaft 22
, A gear 24 meshed with the drive gear 23, and the gear 2
4 is attached substantially at the center and the threaded portion 1 of the cylindrical electrode 10 is provided at the upper end.
4 to which a support shaft 25 is attached. The mechanism for rotating the four cylindrical electrodes 10 will be described in detail with reference to FIG.

【0017】メッキ液循環機構30は、複合メッキ液2
9を蓄えるタンク31と、このタンク31から供給ポー
ト32まで延ばした第1供給路33と、この第1供給路
33の途中に設けたポンプ34と、供給ポート32の出
側に形成したチャンバ35と、このチャンバ35に入側
36aが通じるように支持軸25に開けた第2供給路3
6と、この第2供給路36の出側に通じた筒形電極10
の内側孔11と、この内側孔11に貫通孔13…で通じ
た環状通路3と、この環状通路3にワーク載置台6の回
収孔6bで通じた回収ポート37と、この回収ポート3
7からタンク31まで延ばした回収路38と、この回収
路38の途中に設けたコントロールバルブ39と、タン
ク31に取付けた攪拌機40とからなる。
The plating solution circulating mechanism 30 is provided with the composite plating solution 2
9, a first supply path 33 extending from the tank 31 to the supply port 32, a pump 34 provided in the middle of the first supply path 33, and a chamber 35 formed on the outlet side of the supply port 32. And a second supply passage 3 opened in the support shaft 25 so that the entrance side 36a communicates with the chamber 35.
6 and a cylindrical electrode 10 communicating with the outlet side of the second supply path 36.
, An annular passage 3 communicating with the inner hole 11 through a through-hole 13, a collecting port 37 communicating with the annular passage 3 through a collecting hole 6 b of the work mounting table 6, and a collecting port 3.
It comprises a recovery path 38 extending from 7 to the tank 31, a control valve 39 provided in the middle of the recovery path 38, and a stirrer 40 attached to the tank 31.

【0018】コントロールバルブ39は、クランク室2
d内の複合メッキ液29の液面高さ29aを調整するバ
ルブである。攪拌機40は、タンク31の複合メッキ液
29を翼部41で攪拌するものである。通電機構45
は、支持軸25の下端部に通電用のロータリコネクタ4
6を取付け、このロータリコネクタ46に陽極47を接
続し、シリンダブロック2に陰極48を接続したもので
ある。
The control valve 39 is connected to the crank chamber 2
This is a valve for adjusting the liquid level 29a of the composite plating solution 29 in d. The stirrer 40 stirs the composite plating solution 29 in the tank 31 with the wing 41. Power supply mechanism 45
Is connected to the lower end of the support shaft 25 by a rotary connector 4 for energization.
6, an anode 47 is connected to the rotary connector 46, and a cathode 48 is connected to the cylinder block 2.

【0019】図2は図1の2−2線断面図である。回転
機構20の駆動ギヤ23は、内側のギヤ24,24に噛
み合い、内側ギヤ24,24はそれぞれ第1、第2伝達
ギヤ26,27に噛み合い、第1、第2伝達ギヤ26,
27は外側のギヤ24,24に噛み合っている。このた
め、モータ21の回転力は、先ず矢印,の如く駆動
ギヤ23から内側のギヤ24,24に伝わり、次に内側
のギヤ24,24から矢印,の如く第1、第2伝達
ギヤ26,27に伝わり、次いで第1、第2ギヤ26,
27から矢印,の如くから外側のギヤ24,24に
伝わる。この結果、ギヤ24…を取付けた回転軸25…
がそれぞれ白抜き矢印の如く回転して、回転軸25…に
取付けた筒形電極10…(図1参照)が回転軸25…と
同様にそれぞれ白抜き矢印の如く回転する。
FIG. 2 is a sectional view taken along line 2-2 of FIG. The drive gear 23 of the rotating mechanism 20 meshes with the inner gears 24, 24, and the inner gears 24, 24 mesh with the first and second transmission gears 26, 27, respectively, and the first and second transmission gears 26, 27 respectively.
27 meshes with the outer gears 24,24. Therefore, the rotational force of the motor 21 is first transmitted from the drive gear 23 to the inner gears 24, 24 as shown by arrows, and then from the inner gears 24, 24 to the first and second transmission gears 26, 24 as shown by arrows. 27, and then the first and second gears 26,
27 to the outer gears 24, 24 as indicated by arrows. As a result, the rotating shafts 25 to which the gears 24 are attached
Are rotated as indicated by the white arrows, and the cylindrical electrodes 10 (see FIG. 1) attached to the rotating shafts 25 are respectively rotated as indicated by the white arrows, similarly to the rotating shafts 25.

【0020】図3(a),(b)は本発明に係る筒形電
極の説明図であり、(a)は断面図、(b)は(a)の
b矢視図である。(a)において、筒形電極10は、例
えばチタン(Ti)基材に白金(Pt)をクラッド被覆
した電極やTi基材に酸化イリジウム(IrO2)をク
ラッド被覆した電極であって、軸線10aに沿って開け
た内側孔11と、シリンダブロック2の内面2b(図1
に示す。)に対向する筒状の周壁12と、この周壁12
に螺旋状に配置した複数の貫通孔13…と、上端部に形
成した蓋部14と、下端部に形成したねじ部15とから
なる。(b)において、筒形電極10は、周壁12の高
さH((a)参照)、周長Lに設定し、周壁12に貫通
孔13…を一定の角度θ(24°)で配置したものであ
る。なお、貫通孔13…の配列については図4で詳しく
説明する。
FIGS. 3A and 3B are explanatory views of a cylindrical electrode according to the present invention, wherein FIG. 3A is a cross-sectional view, and FIG. In (a), the cylindrical electrode 10 is, for example, an electrode in which a titanium (Ti) base material is clad with platinum (Pt) or an electrode in which a Ti base material is clad with iridium oxide (IrO 2 ). 1 and the inner surface 2b of the cylinder block 2 (FIG. 1).
Shown in ) And a cylindrical peripheral wall 12 facing the peripheral wall 12.
, A plurality of through holes 13 spirally arranged, a lid portion 14 formed at an upper end portion, and a screw portion 15 formed at a lower end portion. In (b), the cylindrical electrode 10 is set to a height H (see (a)) and a circumferential length L of the peripheral wall 12, and the through holes 13 are arranged in the peripheral wall 12 at a constant angle θ (24 °). Things. The arrangement of the through holes 13 will be described in detail with reference to FIG.

【0021】図4は本発明に係る筒形電極の展開図であ
る。貫通孔13…は、周壁12に千鳥状に且つ傾斜角θ
の螺旋に沿ってピッチPで配列したものである。貫通孔
13…を螺旋状に配置した理由は、周壁12に対向する
シリンダブロック2の内面2b(図1に示す。)により
均一に複合メッキ液29を当てるためである。また、貫
通孔13…を略千鳥配置とした理由は、碁盤目配置と比
較して貫通孔13と貫通孔13との間隔を小さくして、
貫通孔13…を周壁12に密に配置するためである。
FIG. 4 is a developed view of a cylindrical electrode according to the present invention. The through holes 13 are staggered in the peripheral wall 12 and have an inclination angle θ.
Are arranged at a pitch P along the spiral. The reason why the through holes 13 are spirally arranged is to uniformly apply the composite plating solution 29 to the inner surface 2b (shown in FIG. 1) of the cylinder block 2 facing the peripheral wall 12. Moreover, the reason why the through holes 13 are arranged in a staggered manner is that the distance between the through holes 13 is smaller than that in the grid pattern,
This is because the through holes 13 are densely arranged in the peripheral wall 12.

【0022】次に、複合メッキ方法を図5〜図7に基づ
いて説明する。図5は本発明に係る複合メッキ装置の第
1作用説明図であり、複合メッキ装置1の原理図を示
す。先ず、シリンダブロック2をワーク載置台6の絶縁
部材7に載せて筒形電極10に隙間S1を開けて被せ
る。次に、モータ21を駆動して、モータ21の回転力
を駆動ギヤ23→ギヤ24→支持軸25に伝えて筒形電
極10を軸線10aの廻りに回転させる。次いで、撹拌
機40の翼部41を回転してタンク31の複合メッキ液
29を撹拌する。この状態で、ポンプ34を駆動してタ
ンク31内の複合メッキ液29を矢印a1〜a3の如
く、第1供給路33→供給ポート32→チャンバ35→
第2供給路36を通じて筒形電極10の内側孔11に供
給する。
Next, the composite plating method will be described with reference to FIGS. FIG. 5 is a first operation explanatory view of the composite plating apparatus according to the present invention, and shows a principle diagram of the composite plating apparatus 1. First, the cylinder block 2 is mounted on the insulating member 7 of the work mounting table 6 and is placed over the cylindrical electrode 10 with a gap S1 therebetween. Next, the motor 21 is driven to transmit the rotational force of the motor 21 to the driving gear 23 → the gear 24 → the support shaft 25 to rotate the cylindrical electrode 10 around the axis 10a. Next, the wing portion 41 of the stirrer 40 is rotated to stir the composite plating solution 29 in the tank 31. In this state, the pump 34 is driven to move the composite plating solution 29 in the tank 31 from the first supply path 33 to the supply port 32 to the chamber 35 as shown by arrows a1 to a3.
It is supplied to the inner hole 11 of the cylindrical electrode 10 through the second supply path 36.

【0023】内側孔11の複合メッキ液29は貫通孔1
3…を通じて矢印b…の如く筒形電極10の外側に噴射
してシリンダブロック2の内面2bに直角に当る。そし
て、シリンダブロック2の内面2bに当った複合メッキ
液29を矢印c1,c2の如く環状通路3→回収ポート
37→回収路38を通じてタンク31に回収する。複合
メッキ液29を循環させた状態で通電機構45を操作し
て筒形電極10とシリンダブロック2とを通電する。
The composite plating solution 29 in the inner hole 11 is
3, and is ejected to the outside of the cylindrical electrode 10 as shown by an arrow b and strikes the inner surface 2 b of the cylinder block 2 at right angles. Then, the composite plating solution 29 that has hit the inner surface 2b of the cylinder block 2 is recovered in the tank 31 through the annular passage 3 → the recovery port 37 → the recovery path 38 as shown by arrows c1 and c2. With the composite plating solution 29 circulated, the energizing mechanism 45 is operated to energize the cylindrical electrode 10 and the cylinder block 2.

【0024】図6は本発明に係る複合メッキ装置の第2
作用説明図であり、筒形電極10の貫通孔13…から複
合メッキ液29を噴射させた状態を示す。貫通孔13…
から複合メッキ液29を噴射して矢印b…の如くシリン
ダブロック2の内面2bにほぼ直角に当てることによ
り、内面2bに当った複合メッキ液29は乱流になる。
加えて、噴射孔13…からの複合メッキ液29の噴射速
度をほぼ同一にすることにより、内面2bへの複合メッ
キ液29の衝突条件を平均にする。このため、金属イオ
ン51a…やセラミックス粒子52…を複合メッキ液2
9中に均一に分散することができる。
FIG. 6 shows a second embodiment of the composite plating apparatus according to the present invention.
FIG. 4 is an operation explanatory view showing a state in which a composite plating solution 29 is sprayed from through holes 13 of the cylindrical electrode 10. Through hole 13 ...
Is sprayed on the inner surface 2b of the cylinder block 2 at substantially right angles as shown by arrows b, so that the composite plating solution 29 hitting the inner surface 2b becomes turbulent.
In addition, by making the injection speed of the composite plating solution 29 from the injection holes 13 approximately the same, the collision conditions of the composite plating solution 29 on the inner surface 2b are averaged. Therefore, the metal ions 51a and the ceramic particles 52 are combined with the composite plating solution 2
9 can be uniformly dispersed.

【0025】この結果、内面2b近傍において複合メッ
キ液29中の金属イオン濃度を規定濃度に保つことがで
きるので、複合メッキ皮膜50の金属マトリックス51
を規定厚さTに析出させることができる。また、内面2
b近傍において複合メッキ液29中のセラミックス粒子
52…を均一に分散させることができるので、セラミッ
クス粒子52…を金属マトリックス51中に均一に共析
させることができる。
As a result, the metal ion concentration in the composite plating solution 29 can be maintained at a specified concentration in the vicinity of the inner surface 2b, so that the metal matrix 51 of the composite plating film 50 can be maintained.
Can be deposited to a specified thickness T. Also, inner surface 2
Since the ceramic particles 52 in the composite plating solution 29 can be uniformly dispersed in the vicinity of “b”, the ceramic particles 52 can be co-deposited uniformly in the metal matrix 51.

【0026】さらに、筒形電極10を回転させることに
より、貫通孔13…から噴射した複合メッキ液29をシ
リンダブロック2の内面2b全域に均一に当てることが
できる。このため、内面2b全域に金属マトリックス5
1を均一の厚さに析出させることができ、さらに金属マ
トリックス51中にセラミックス粒子52…を均一に共
析させることができる。
Furthermore, by rotating the cylindrical electrode 10, the composite plating solution 29 sprayed from the through holes 13 can be uniformly applied to the entire inner surface 2b of the cylinder block 2. Therefore, the metal matrix 5 is formed over the entire inner surface 2b.
1 can be deposited to a uniform thickness, and the ceramic particles 52 can be co-deposited uniformly in the metal matrix 51.

【0027】図7は本発明に係る複合メッキ装置の第3
作用説明図であり、シリンダブロック2の断面図の右側
に筒形電極を展開した状態を示す。なお、便宜上貫通孔
13…にa〜jを付して説明する。貫通孔13a〜13
jから複合メッキ液29(図5参照)を噴射させながら
筒形電極10を回転させる。この結果、先ず、貫通孔1
3aから噴射した複合メッキ液29を矢印の如くシリ
ンダブロック2の内面2bの位置P1に当て、貫通孔1
3bから噴射した複合メッキ液29を位置P1の僅か上
方にズラして当てる。次に、貫通孔13cから噴射した
複合メッキ液29を矢印の如く位置P2に当て、貫通
孔13dから噴射した複合メッキ液29を位置P2の僅
か上方に当て、さらに貫通孔13eから噴射した複合メ
ッキ液29を矢印の如く位置P3に当てる。
FIG. 7 shows a third embodiment of the composite plating apparatus according to the present invention.
FIG. 4 is an operation explanatory view showing a state in which a cylindrical electrode is developed on the right side of a sectional view of the cylinder block 2. For convenience, the through holes 13 are described with a to j. Through holes 13a to 13
The cylindrical electrode 10 is rotated while spraying the composite plating solution 29 (see FIG. 5) from j. As a result, first, the through hole 1
The composite plating solution 29 sprayed from 3a is applied to the position P1 on the inner surface 2b of the cylinder block 2 as shown by an arrow,
The composite plating solution 29 sprayed from 3b is applied slightly above the position P1. Next, the composite plating solution 29 sprayed from the through hole 13c is applied to the position P2 as indicated by an arrow, the composite plating solution 29 sprayed from the through hole 13d is applied slightly above the position P2, and the composite plating solution sprayed from the through hole 13e is further applied. The liquid 29 is applied to the position P3 as indicated by an arrow.

【0028】さらに、貫通孔13fから噴射した複合メ
ッキ液29を矢印の如くシリンダブロック2の内面2
bの位置P4に当て、貫通孔13g,13hから噴射し
た複合メッキ液29を順次位置P4の僅か上方にズラし
て当てる。次に、貫通孔13jから噴射した複合メッキ
液29を矢印の如く位置P5に当てる。
Further, the composite plating solution 29 sprayed from the through hole 13f is applied to the inner surface 2 of the cylinder block 2 as shown by the arrow.
The composite plating solution 29 sprayed from the through holes 13g and 13h is sequentially shifted slightly above the position P4 and applied to the position P4 of b. Next, the composite plating solution 29 sprayed from the through holes 13j is applied to the position P5 as shown by the arrow.

【0029】このため、シリンダブロック2の内面2b
の位置P1〜位置P6のエリアEに複合メッキ液29を
均一に当てることができる。この結果、複合メッキ液2
9中の金属イオン濃度を規定濃度に保って金属マトリッ
クス51を規定厚さに析出させることができ、さらに複
合メッキ液29中のセラミックス粒子52…を均一に保
ってセラミックス粒子52…を金属マトリクス51中に
均一に共析させることができる。
For this reason, the inner surface 2b of the cylinder block 2
The composite plating solution 29 can be uniformly applied to the area E of the positions P1 to P6. As a result, the composite plating solution 2
9, the metal matrix 51 can be deposited to a specified thickness while maintaining the metal ion concentration in the specified concentration, and the ceramic particles 52... It can be uniformly eutectoid therein.

【0030】図8は本発明に係る複合メッキと従来の複
合メッキとを対比したグラスである。横軸はシリンダブ
ロック2の内面2bのシリンダヘッド側端部P7〜クラ
ンク室側端部P8間のメッキ処理位置を示し、縦軸は複
合メッキ皮膜50中のセラミックス粒子(Si34
子)52…(図6参照)の共析量を示す。太い実線は本
発明に係るの複合メッキ装置1(図1に示す)でNi/
SiC複合メッキ皮膜50を施した実施例のグラフで、
細い実線は図9に示す従来の装置でNi/SiC複合メ
ッキ皮膜50を施した比較例のグラフである。なお、複
合メッキ液29は、金属イオンとしてNiイオンやPイ
オンを含み、かつセラミックス粒子として窒化ケイ素
(Si34)粒子を懸濁させたメッキ液を使用した。
FIG. 8 is a glass in which the composite plating according to the present invention is compared with the conventional composite plating. The horizontal axis shows the plating position between the cylinder head side end P7 and the crankcase side end P8 of the inner surface 2b of the cylinder block 2, and the vertical axis shows the ceramic particles (Si 3 N 4 particles) 52 in the composite plating film 50. .. (See FIG. 6). The thick solid line indicates the Ni / Ni plating ratio in the composite plating apparatus 1 (shown in FIG. 1) according to the present invention.
In the graph of the example in which the SiC composite plating film 50 is applied,
The thin solid line is a graph of a comparative example in which the Ni / SiC composite plating film 50 is applied by the conventional apparatus shown in FIG. As the composite plating solution 29, a plating solution containing Ni ions and P ions as metal ions and suspending silicon nitride (Si 3 N 4 ) particles as ceramic particles was used.

【0031】実施例によれば、シリンダブロック2の内
面2bのシリンダヘッド側端部P7からクランク室側端
部P8まで、セラミックス粒子(Si34粒子)52…
の共析量が一定に保たれていることがわかる。一方、比
較例によれば、シリンダブロック2の内面2bのシリン
ダヘッド側端部P7からクランク室側端部P8に近づく
に従って、セラミックス粒子(Si34粒子)52…の
共析量が漸次減少することがわかる。
According to the embodiment, the ceramic particles (Si 3 N 4 particles) 52... From the cylinder head side end P7 of the inner surface 2b of the cylinder block 2 to the crank chamber side end P8.
It can be seen that the amount of eutectoid was kept constant. On the other hand, according to the comparative example, the eutectoid amount of ceramic particles (Si 3 N 4 particles) 52 gradually decreases from the cylinder head side end P7 of the inner surface 2b of the cylinder block 2 to the crank chamber side end P8. You can see that

【0032】また、実施例によれば、複合メッキ皮膜5
0の金属マトリックス(Ni―9Pマトリックス)51
(図6に示す。)を規定厚さTに析出させることがで
き、一方、比較例によれば、複合メッキ皮膜50の金属
マトリックス(Ni―9Pマトリックス)51を規定厚
さTに析出させることができないことが判明した。従っ
て、実施例によれば、シリンダブロック2の内面2bの
耐摩耗性を均一に高めることができる。
According to the embodiment, the composite plating film 5
0 metal matrix (Ni-9P matrix) 51
(Shown in FIG. 6) can be deposited to a specified thickness T. On the other hand, according to the comparative example, the metal matrix (Ni-9P matrix) 51 of the composite plating film 50 is deposited to a specified thickness T. Turned out to be impossible. Therefore, according to the embodiment, the wear resistance of the inner surface 2b of the cylinder block 2 can be uniformly increased.

【0033】なお、複合メッキ液29は、金属イオンと
してNiイオンを含み、かつセラミックス粒子として炭
化ケイ素(SiC)粒子を懸濁させたメッキ液を使用し
ても同様の効果を得た。
The same effect was obtained when the composite plating solution 29 used a plating solution containing Ni ions as metal ions and suspending silicon carbide (SiC) particles as ceramic particles.

【0034】[0034]

【実施例】以下に、本発明に係る実験例を表1、表2を
参照の上説明する。しかし、本発明はこれらの実験例に
限るものではない。
EXAMPLES Examples of the present invention will be described below with reference to Tables 1 and 2. However, the present invention is not limited to these experimental examples.

【0035】[0035]

【表1】 [Table 1]

【0036】実験No.1;複合メッキ液29(図1参
照)は、硫酸ニッケル(NiSO4)45〜70g/l
(リットル)、硫酸ナトリウム(Na2SO4)250g
/l、ホウ酸40g/l、亜リン酸40g/lを加えた
pH=2.5のものに、窒化ケイ素(Si34)粒子4
5g/lを懸濁させたものである。筒形電極10(図1
参照)は、周壁12に孔径2.0mmの貫通孔13…を
169個開けてたものである。
Experiment No. 1: the composite plating solution 29 (see FIG. 1) is nickel sulfate (NiSO 4 ) 45 to 70 g / l
(Liter), 250 g of sodium sulfate (Na 2 SO 4 )
/ L, boric acid 40 g / l and phosphorous acid 40 g / l, pH = 2.5, and silicon nitride (Si 3 N 4 ) particles 4
It is a suspension of 5 g / l. A cylindrical electrode 10 (FIG. 1)
) Has 169 through holes 13 with a hole diameter of 2.0 mm in the peripheral wall 12.

【0037】筒形電極を5rpmで回転させながら複合
メッキ液29を流量30 l/分で循環させ、電流密度
を10A/dm2〜12.5A/dm2の範囲に設定して
筒形電極10とシリンダブロック2とを72分間通電し
た。その結果、複合メッキ皮膜を規定厚さ100μmと
することができ、この複合メッキ皮膜のNi―9Pマト
リックスにSi34粒子を均一に共析させることができ
た。従って、シリンダブロック2の内面2bの耐摩耗性
を均一に高めることができる。
While rotating the cylindrical electrode at 5 rpm, the composite plating solution 29 is circulated at a flow rate of 30 l / min, and the current density is set in the range of 10 A / dm 2 to 12.5 A / dm 2 to form the cylindrical electrode 10. And the cylinder block 2 were energized for 72 minutes. As a result, the composite plating film could have a specified thickness of 100 μm, and Si 3 N 4 particles could be co-deposited uniformly in the Ni-9P matrix of the composite plating film. Therefore, the wear resistance of the inner surface 2b of the cylinder block 2 can be uniformly increased.

【0038】[0038]

【表2】 [Table 2]

【0039】実験No.2;複合メッキ液29は、硫酸
ニッケル(NiSO4)400g/l、ホウ酸35g/
l、サッカリンナトリウム2.5g/lを加えたpH=
2.5のものに、炭化ケイ素(SiC)粒子60gを懸
濁させたものである。筒形電極10は、実験No.1と
同様に、周壁12に孔径2.0mmの貫通孔13…を1
69個開けてたものである。実験No.1と同様に、筒
形電極を5rpmで回転させながら複合メッキ液29を
流量30 l/分で循環させ、電流密度を64A/dm2
に設定して筒形電極10とシリンダブロック2とを7分
間通電した。その結果、実験No.1と同様に、複合メ
ッキ皮膜を規定厚さ100μmとすることができ、この
複合メッキ皮膜のNiマトリックスにSiC粒子を均一
に共析させることができた。従って、シリンダブロック
2の内面2bの耐摩耗性を均一に高めることができる。
Experiment No. 2: The composite plating solution 29 is composed of nickel sulfate (NiSO 4 ) 400 g / l and boric acid 35 g /
l, pH with addition of 2.5 g / l of saccharin sodium =
2.5 is obtained by suspending 60 g of silicon carbide (SiC) particles. The cylindrical electrode 10 was used in Experiment No. 1, a through hole 13 having a hole diameter of 2.0 mm is formed in the peripheral wall 12.
69 were opened. Experiment No. 1, the composite plating solution 29 was circulated at a flow rate of 30 l / min while rotating the cylindrical electrode at 5 rpm, and the current density was 64 A / dm 2.
And the cylinder electrode 10 and the cylinder block 2 were energized for 7 minutes. As a result, Experiment No. As in the case of No. 1, the composite plating film could have a specified thickness of 100 μm, and SiC particles could be uniformly co-deposited in the Ni matrix of the composite plating film. Therefore, the wear resistance of the inner surface 2b of the cylinder block 2 can be uniformly increased.

【0040】前記実験No.1では、金属イオン(Ni
イオン、Pイオン)51aやセラミックス粒子(Si3
4粒子)52を含んだ複合メッキ液29を使用して金
属マトリックス(Ni―9Pマトリックス)にSi34
粒子を共析させる内容について説明し、また、実験N
o.2では、金属イオン(Niイオン)51aやセラミ
ックス粒子(SiC粒子)52を含んだ複合メッキ液2
9を使用して金属マトリックス(Niマトリックス)5
1にセラミックス粒子(SiC粒子)52を共析させる
内容について説明したが、その他の金属イオンやセラミ
ックス粒子を含んだ複合メッキ液を使用してもよい。前
記実験例では、シリンダブロック2の内面2bに複合メ
ッキ皮膜を施す内容について説明したが、その他のワー
クの中空部内面に複合メッキ皮膜を施すことも可能であ
る。前記実験例では、4本の筒形電極10…を使用して
4気筒エンジンのシリンダブロック2に複合メッキ皮膜
を施す内容について説明したが、筒形電極10…の本数
を変えて、例えば6気筒エンジンのシリンダブロック等
に適用することも可能である。
In the above Experiment No. 1, the metal ion (Ni
Ions, P ions) 51a and ceramic particles (Si 3
The metal matrix (Ni-9P matrix) is made of Si 3 N 4 using a composite plating solution 29 containing N 4 particles) 52.
The content of eutectoid particles was explained, and experiment N
o. 2, a composite plating solution 2 containing metal ions (Ni ions) 51a and ceramic particles (SiC particles) 52
9 using a metal matrix (Ni matrix) 5
Although the content of co-depositing the ceramic particles (SiC particles) 52 in the embodiment 1 has been described, a composite plating solution containing other metal ions or ceramic particles may be used. In the above-described experimental example, the content of applying the composite plating film to the inner surface 2b of the cylinder block 2 has been described. However, it is also possible to apply the composite plating film to the inner surface of the hollow portion of another work. In the above-described experimental example, the description has been given of the case where the composite plating film is applied to the cylinder block 2 of the four-cylinder engine using the four cylindrical electrodes 10. However, the number of the cylindrical electrodes 10 is changed to, for example, six cylinders. It is also possible to apply to a cylinder block or the like of an engine.

【0041】前記実験例では、筒形電極10の内側孔1
1を蓋部14で塞いだ内容について説明したが、内側孔
11を筒形電極の底部で塞いでもよい。このとき、複合
メッキ液を底部と反対側の頂部側から内側孔11に供給
する。前記実験例では、ワーク載置台6のワーク受け面
6aに絶縁部材7を取付けた内容について説明したが、
その他にセラミックスコーティングや樹脂コーティング
などの絶縁コーティングを施しても同様の効果を得るこ
とができる。
In the experimental example, the inner hole 1 of the cylindrical electrode 10 was used.
Although the description has been given of the content in which 1 is closed by the lid 14, the inner hole 11 may be closed by the bottom of the cylindrical electrode. At this time, the composite plating solution is supplied to the inside hole 11 from the top side opposite to the bottom. In the above-described experimental example, the content in which the insulating member 7 is attached to the work receiving surface 6a of the work mounting table 6 has been described.
In addition, the same effect can be obtained by applying an insulating coating such as a ceramic coating or a resin coating.

【0042】[0042]

【発明の効果】本発明は上記構成により次の効果を発揮
する。請求項1は、複合メッキ液を複数の貫通孔から筒
形電極の外側に噴射して、噴射した複合メッキ液を中空
部の内面に当てる。このため、金属イオンやセラミック
ス粒子を複合メッキ液中に均一に分散することができ
る。
According to the present invention, the following effects are exhibited by the above configuration. According to a first aspect of the present invention, the composite plating solution is injected from a plurality of through holes to the outside of the cylindrical electrode, and the injected composite plating solution is applied to the inner surface of the hollow portion. For this reason, metal ions and ceramic particles can be uniformly dispersed in the composite plating solution.

【0043】この結果、内面近傍において複合メッキ液
中の金属イオン濃度を規定濃度に保つことができるの
で、複合メッキ皮膜の金属相マトリックスを規定厚さに
析出させることができる。また、内面近傍において複合
メッキ液中のセラミックス粒子を均一に分散させること
ができるので、セラミックス粒子を金属相マトリクス中
に均一に共析させることができる。さらに、筒形電極を
回転させることにより、複数の貫通孔から噴射した複合
メッキ液を中空部の内面全域に均一に当てることができ
る。このため、内面全域に金属相マトリックスを均一の
厚さに析出させることができ、さらに金属相マトリック
ス中にセラミックス粒子を均一に共析させることができ
る。
As a result, the metal ion concentration in the composite plating solution can be maintained at a specified concentration in the vicinity of the inner surface, so that the metal phase matrix of the composite plating film can be deposited to a specified thickness. Further, since the ceramic particles in the composite plating solution can be uniformly dispersed in the vicinity of the inner surface, the ceramic particles can be co-deposited uniformly in the metal phase matrix. Further, by rotating the cylindrical electrode, the composite plating solution sprayed from the plurality of through holes can be uniformly applied to the entire inner surface of the hollow portion. For this reason, the metal phase matrix can be deposited to a uniform thickness over the entire inner surface, and the ceramic particles can be uniformly co-deposited in the metal phase matrix.

【0044】請求項2は、ワーク受け面に絶縁部材或い
は絶縁コーティングを備えたので、ワークをワーク載置
台から絶縁させてワークのみに通電させることができ
る。この結果、ワークの中空部の内面に複合メッキ皮膜
を効率よく施すことができる。
According to the second aspect of the present invention, since the work receiving surface is provided with an insulating member or an insulating coating, the work can be insulated from the work mounting table and only the work can be energized. As a result, the composite plating film can be efficiently applied to the inner surface of the hollow portion of the work.

【0045】請求項3は、ワーク載置台に複合メッキ液
の回収孔を開けたので、中空部の内面に当った複合メッ
キ液を中空部の下側から回収することができる。この結
果、複合メッキ液をスムーズに循環させることができる
ので、中空部の内面に複合メッキ皮膜を効率よく施すこ
とができる。
According to a third aspect of the present invention, since a recovery hole for the composite plating solution is formed in the work mounting table, the composite plating solution that has hit the inner surface of the hollow portion can be recovered from below the hollow portion. As a result, the composite plating solution can be smoothly circulated, so that the composite plating film can be efficiently applied to the inner surface of the hollow portion.

【0046】請求項4は、複数の貫通孔を筒形電極の周
壁に螺旋状に配置したので、筒形電極を回転することに
より周壁に対向するワークの中空部の内面に複合メッキ
液を均一に当てることができる。この結果、複合メッキ
液中の金属イオン濃度を規定濃度に保って金属相マトリ
ックスを規定厚さに析出させることができる。また、中
空部の内面にセラミックス粒子が均一に当るので、セラ
ミックス粒子を金属相マトリクス中に均一に共析させる
ことができる。
According to a fourth aspect of the present invention, since the plurality of through holes are spirally arranged on the peripheral wall of the cylindrical electrode, the composite plating solution is uniformly applied to the inner surface of the hollow portion of the work facing the peripheral wall by rotating the cylindrical electrode. Can be used. As a result, the metal phase matrix can be deposited to a specified thickness while maintaining the metal ion concentration in the composite plating solution at a specified concentration. Further, since the ceramic particles uniformly hit the inner surface of the hollow portion, the ceramic particles can be co-deposited uniformly in the metal phase matrix.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る複合メッキ装置を示す全体図FIG. 1 is an overall view showing a composite plating apparatus according to the present invention.

【図2】図1の2−2線断面図FIG. 2 is a sectional view taken along line 2-2 of FIG.

【図3】本発明に係る筒形電極の説明図FIG. 3 is an explanatory view of a cylindrical electrode according to the present invention.

【図4】本発明に係る筒形電極の展開図FIG. 4 is a development view of a cylindrical electrode according to the present invention.

【図5】本発明に係る複合メッキ装置の第1作用説明図FIG. 5 is a diagram illustrating a first operation of the composite plating apparatus according to the present invention.

【図6】本発明に係る複合メッキ装置の第2作用説明図FIG. 6 is a diagram illustrating a second operation of the composite plating apparatus according to the present invention.

【図7】本発明に係る複合メッキ装置の第3作用説明図FIG. 7 is an explanatory view of a third operation of the composite plating apparatus according to the present invention.

【図8】本発明に係る複合メッキと従来の複合メッキと
を対比したグラス
FIG. 8 shows a glass in which the composite plating according to the present invention is compared with the conventional composite plating.

【図9】従来のNi/SiC複合メッキ処理の説明図FIG. 9 is an explanatory view of a conventional Ni / SiC composite plating process.

【図10】図9の10部拡大図FIG. 10 is an enlarged view of part 10 in FIG. 9;

【図11】従来のNi/SiC複合メッキ液の流速の説
明図
FIG. 11 is an explanatory diagram of a flow rate of a conventional Ni / SiC composite plating solution.

【符号の説明】[Explanation of symbols]

1…複合メッキ装置、2…シリンダブロック(ワー
ク)、2a…中空部、2b…内面、6…ワーク載置台、
6a…ワーク受け面、6b…回収孔、7…絶縁部材、1
0…筒形電極、10a…軸、12…周壁、13…貫通
孔、14…蓋部、20…回転機構、29…複合メッキ
液、30…メッキ液循環機構、45…通電機構、、52
…セラミック粒子(Si34粒子、SiC粒子)、S1
…隙間。
DESCRIPTION OF SYMBOLS 1 ... Composite plating apparatus, 2 ... Cylinder block (work), 2a ... Hollow part, 2b ... Inner surface, 6 ... Work mounting table,
6a: Work receiving surface, 6b: Collection hole, 7: Insulating member, 1
Reference numeral 0: cylindrical electrode, 10a: shaft, 12: peripheral wall, 13: through hole, 14: lid, 20: rotating mechanism, 29: composite plating solution, 30: plating solution circulation mechanism, 45: energizing mechanism, 52
... Ceramic particles (Si 3 N 4 particles, SiC particles), S1
... a gap.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 中空部を有するワークを載せるワーク載
置台と、 このワーク載置台に載せたワークの中空部内に隙間を開
けて配置し、有底又は蓋付きで且つ前記中空部の内面と
対向する周壁に複数の貫通孔を有する筒形電極と、 この筒形電極を電極の軸廻りに回転させる回転機構と、 筒形電極の内側にメッキ液にセラミックス粒子を混合し
た複合メッキ液を供給し、前記周壁の貫通孔を通じて噴
射させ、筒形電極の外側から回収するメッキ液循環機構
と、 前記ワークと筒形電極とに通電する通電機構とからなる
複合メッキ装置。
1. A work mounting table on which a work having a hollow portion is mounted, and a gap disposed in the hollow portion of the work mounted on the work mounting table, the base having a bottom or a lid and facing the inner surface of the hollow portion. A cylindrical electrode having a plurality of through holes in a peripheral wall to be rotated, a rotation mechanism for rotating the cylindrical electrode around the axis of the electrode, and a composite plating solution in which ceramic particles are mixed with a plating solution are supplied to the inside of the cylindrical electrode. A composite plating apparatus comprising: a plating solution circulation mechanism that sprays through a through hole in the peripheral wall and collects the plating solution from outside the cylindrical electrode; and an energizing mechanism that energizes the work and the cylindrical electrode.
【請求項2】 前記ワーク載置台は、ワーク受け面に絶
縁部材或いは絶縁コーティングを備えたことを特徴とす
る請求項1記載の複合メッキ装置。
2. The composite plating apparatus according to claim 1, wherein the work mounting table has an insulating member or an insulating coating on a work receiving surface.
【請求項3】 前記ワーク載置台に、複合メッキ液の回
収孔を開けたことを特徴とする請求項1記載の複合メッ
キ装置。
3. The composite plating apparatus according to claim 1, wherein a hole for collecting a composite plating solution is formed in the work mounting table.
【請求項4】 前記複数の貫通孔は、筒形電極の周壁に
螺旋状に配置したことを特徴とする請求項1記載の複合
メッキ装置。
4. The composite plating apparatus according to claim 1, wherein the plurality of through holes are spirally arranged on a peripheral wall of the cylindrical electrode.
JP15503398A 1998-06-03 1998-06-03 Composite plating equipment Expired - Fee Related JP3351511B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15503398A JP3351511B2 (en) 1998-06-03 1998-06-03 Composite plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15503398A JP3351511B2 (en) 1998-06-03 1998-06-03 Composite plating equipment

Publications (2)

Publication Number Publication Date
JPH11350195A true JPH11350195A (en) 1999-12-21
JP3351511B2 JP3351511B2 (en) 2002-11-25

Family

ID=15597214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15503398A Expired - Fee Related JP3351511B2 (en) 1998-06-03 1998-06-03 Composite plating equipment

Country Status (1)

Country Link
JP (1) JP3351511B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001241354A (en) * 2000-02-28 2001-09-07 Suzuki Motor Corp Cylinder block structure of engine
JP2007169771A (en) * 2005-12-19 2007-07-05 Tadamasa Fujimura Method of plating inside wall of narrow tube and narrow tube manufactured by the same plating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001241354A (en) * 2000-02-28 2001-09-07 Suzuki Motor Corp Cylinder block structure of engine
JP2007169771A (en) * 2005-12-19 2007-07-05 Tadamasa Fujimura Method of plating inside wall of narrow tube and narrow tube manufactured by the same plating method

Also Published As

Publication number Publication date
JP3351511B2 (en) 2002-11-25

Similar Documents

Publication Publication Date Title
EP1461478B1 (en) Composite plating film and a process for forming the same
EP0339464A1 (en) Electroplating of fine particles with metal
CN1623013A (en) Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
US20090242418A1 (en) Coating method and electrolyzing apparatus used therefor
JP3351511B2 (en) Composite plating equipment
US6886520B2 (en) Cylinder for internal combustion engine and method of treating inner surface of the cylinder
JPH11350197A (en) Composite plating method
US4822468A (en) Barrel plating apparatus
JP3830758B2 (en) Ni-Cu alloy composite plating solution
JP3830759B2 (en) Ni-Cu alloy composite plating film
JP2000008191A (en) Plating device
JP4176953B2 (en) Ni-Cu alloy composite plating solution
US6183610B1 (en) Apparatus for composite plating the inner surface of a cylindrical body
JP2001158993A (en) Plating apparatus of cylindrical member
JP3489813B2 (en) Cylinder block for internal combustion engine
JP2001158992A (en) Piston engine
CN1028381C (en) Scroll-type compressor, scroll member and method and apparatus for macerating-plating thereof
JP2001158996A (en) Cylinder block for internal combustion engine
JP2002180284A (en) Ni-Cu ALLOY PLATED COAT
JP3516287B2 (en) Composite plating equipment
JP2001158989A (en) Plating liquid of plating device for cylinder block
JP3375549B2 (en) Composite plating method for cylindrical members
JP4323930B2 (en) Chemical treatment method
JP3516288B2 (en) Composite plating equipment
JPH09310196A (en) Device for plating inside surface of cavity hole and method for plating inside surface of cavity hole

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080920

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090920

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100920

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100920

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110920

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110920

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120920

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120920

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130920

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140920

Year of fee payment: 12

LAPS Cancellation because of no payment of annual fees