JP2001158993A - Plating apparatus of cylindrical member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating apparatus of cylindrical member by which a plating film is prevented from being stuck to a seal surface of a cylinder block. SOLUTION: A groove 9a to store a lower half portion 50a of an O-ring 50 is provided in a placement member 9, the cylinder block 2 with the intermediate diameter d1 between the inside diameter d and the outside diameter D of the O-ring 50 as the inside diameter thereof is placed on the placement member 9, a space S2 of V-shaped section is formed by the cylinder inner surface 3a and the O-ring 50 by squeezing the O-ring 50 by the seal surface 5 of the cylinder block 2, a cylindrical electrode 10 is disposed in a hollow part 3 of the cylinder block 2, the plating solution runs in a space S1 between the cylinder inner surface 3a and the outer surface of the cylindrical electrode 10, and a plating film is formed on the cylinder inner surface 3a by energizing the cylinder block 2 and the cylindrical electrode 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for a cylindrical member for applying a plating film to a cylinder inner surface of a cylinder block, for example.

[0002]

2. Description of the Related Art As a cylinder block for an internal combustion engine, there is a cylinder block in which a cylinder is cast and formed integrally with a cylinder block, and a plating film is applied to an inner surface of the cylinder. A conventional example of a plating apparatus for forming a plating film on the inner surface of the cylinder will be described below.

FIG. 11 is a sectional view of a conventional cylinder block plating apparatus. In the plating apparatus, a groove 106a is provided in the mounting member 106, and an O-ring 107 is placed in the groove 106a. Therefore, the cylinder block 100 having an inner diameter d6 smaller than the inner diameter d5 of the O-ring 107 is mounted on the mounting member 1.
06, the gap between the sealing surface 101 of the cylinder block 100 and the mounting member 106 can be sealed by the O-ring 107.

According to this plating apparatus, a plating solution flows through the gap 110 between the cylinder inner surface 103 of the cylinder block 100 and the cylindrical electrode 108 as shown by an arrow, and the cylinder block 100 and the cylindrical electrode 108 are energized. Thereby, the plating film 104 can be formed on the cylinder inner surface 103 of the cylinder block 100.

[0005]

Since the inner diameter d6 of the inner surface 103 of the cylinder is smaller than the inner diameter d5 of the O-ring 107, the vicinity of the corner 102 of the sealing surface 101 is located in the inner range H of the O-ring 107. Therefore, the sealing surface 10
The vicinity of one corner 102 only comes into contact with the mounting member 106. For this reason, the vicinity of the corner 102 of the sealing surface 101 cannot be sufficiently sealed, and the plating film 104 may adhere to the vicinity of the corner 102 of the sealing surface 101 in some cases.

FIG. 12 is a sectional view showing a state where a plating film is formed on a cylinder block by a conventional plating apparatus.
The sealing surface 101 of the cylinder block 100 is a surface on which a cylinder head (not shown) is mounted via a gasket. Therefore, it is necessary to flatten the sealing surface 101 and prevent a gap from being generated between the sealing surface 101 and the cylinder head when the cylinder head is assembled to the sealing surface 101 via a gasket. For this reason, the plating film 104 attached near the corner 102 of the sealing surface 101
It is necessary to peel a from the sealing surface 101, and the trouble is a factor that hinders cost reduction.

It is an object of the present invention to provide a plating apparatus for a tubular member that can prevent a plating film from adhering to a sealing surface of a cylinder block.

[0008]

According to a first aspect of the present invention, a groove for accommodating the lower half of the seal ring is provided in the mounting member, and the seal ring is accommodated in the groove. When the seal ring is crushed on the bottom surface of the cylindrical member whose inner diameter is the intermediate diameter between the inner diameter and the outer diameter of the ring, the inner surface of the cylindrical member is sealed so that the gap between the seal ring and the V-shaped cross section is opened. Placing the crushed cylindrical upper member on the mounting member, disposing the cylindrical electrode in the hollow portion of the cylindrical member, flowing the plating solution into the gap between the inner surface of the cylindrical member and the outer surface of the cylindrical electrode,
A plating film is formed on the inner surface of the cylindrical member by energizing the cylindrical member and the cylindrical electrode.

When the seal ring is crushed on the bottom surface of the tubular member, a gap having a V-shaped cross section is formed between the inner surface of the tubular member and the seal ring. For this reason, the seal ring can be securely brought into close contact with the inner surface corner of the tubular member, so that it is possible to prevent the plating solution from adhering to the bottom surface of the tubular member. Therefore, it is possible to prevent the plating film from adhering to the bottom surface of the tubular member.

According to a second aspect of the present invention, the cylindrical electrode is provided with an insulating seal at a portion facing the seal ring.

Since the insulating seal is provided on the cylindrical electrode facing the seal ring, it is possible to prevent electricity from flowing between the cylindrical member and the portion where the insulating seal is provided. Therefore, the plating thickness on the inner surface of the tubular member near the seal ring can be reduced. Therefore, it is possible to reliably prevent the plating film from adhering to the corners of the tubular member.

[0012]

Embodiments of the present invention will be described below with reference to the accompanying drawings. The drawings should be viewed in the direction of reference numerals. FIG. 1 is a cross-sectional view of a tubular member plating apparatus (first embodiment) according to the present invention. The plating apparatus 1 for a cylindrical member is provided in a work mounting table 7 mounted on a main body 6 for mounting a cylindrical member (cylinder block) 2 and in a hollow portion 3 of the cylinder block 2 mounted on the work mounting table 7. Cylindrical electrode 10 and a cylindrical electrode 10
, A plating solution circulation mechanism 30 for supplying a plating solution 28 to the inner hole 11 of the cylindrical electrode 10, a cylinder block 2 and the cylindrical electrode 10.
And an energizing mechanism 45 for energizing.

The plating apparatus 1 includes a gap S between an inner surface (cylinder inner surface) 3a of a cylindrical member and an outer surface of a cylindrical electrode 10.
1, a plating film is formed on the inner surface 3a of the cylinder by flowing a plating solution 28 and energizing the cylinder block 2 and the cylindrical electrode 10. 2a is a water jacket serving as a cooling water passage, 2b is a crank chamber, 8 is an annular passage of a gap S1 formed by the cylinder inner surface 3a and the cylindrical electrode 10.

The work mounting table 7 has a mounting member (insulating member) 9 on the upper surface and a recovery hole 7a for the plating solution 28. The insulating member 9 is a plate material formed of, for example, ceramic or synthetic resin. The reason why the insulating member 9 is provided is that the cylinder block 2 is insulated from the work mounting table 7 and only the cylinder block 2 is energized to efficiently form a plating film on the cylinder inner surface 3a of the cylinder block 2.

The work mounting table 7 is provided with the recovery hole 7a because the plating solution 28 hitting the cylinder inner surface 3a of the cylinder block 2 is recovered from the recovery hole 7a and the plating solution 28 is smoothly circulated. Cylinder block 2
This is for efficiently forming a plating film on the cylinder inner surface 3a.

Next, the rotation mechanism 20 will be described. The rotating mechanism 20 is a mechanism that is applied to a cylinder block for a four-cylinder engine and rotates four cylindrical electrodes 10... The details of rotating the shaped electrode 10 will be described.

The rotation mechanism 20 includes a motor 21 mounted on the main body 6 and a drive shaft 22 connected to the motor 21.
A drive gear 23 attached to the drive shaft 22;
It comprises a gear 24 meshed with the drive gear 23, and a rotating shaft 25 having the gear 24 mounted substantially at the center and the upper end to which the screw portion 15 of the cylindrical electrode 10 is mounted. The mechanism for rotating the four cylindrical electrodes 10 will be described in detail with reference to FIG.

The plating solution circulation mechanism 30 includes a tank 31 for storing the plating solution 28 and a supply port 3 from the tank 31.
2 and a first supply path 33 extending to
, A chamber 35 formed on the outlet side of the supply port 32, and an inlet 36
a supply path 36 opened to the rotating shaft 25 so that
, An inner hole 11 of the cylindrical electrode 10 communicating with the outlet side of the second supply passage 36, an annular passage 8 communicating with the inner hole 11 through a through hole 13, and a work load on the annular passage 8. A collection port 37 communicating with the collection hole 7a of the mounting table 7;
It comprises a recovery path 38 extending from 7 to the tank 31, a control valve 39 provided in the middle of the recovery path 38, and a stirrer 40 attached to the tank 31.

The control valve 39 is connected to the crank chamber 2
This is a valve for adjusting the liquid level 28a of the plating solution 28 in b. The stirrer 40 stirs the plating solution 28 in the tank 31 with the wing 41. The energizing mechanism 45 has a rotary connector 46 for energization attached to the lower end of the rotating shaft 25, an anode 47 connected to the rotary connector 46, and a cathode 48 connected to the cylinder block 2.

FIG. 2 is an enlarged view of a part 2 of FIG. 1. A groove 9a is provided in the insulating member 9 for accommodating the lower half 50a of the seal ring (O-ring) 50. The O-ring 50 is accommodated in the groove 9a.
The state where the O-ring 50 is crushed by the cylinder block 2 is shown. The cylinder block 2 has an inner diameter (cylinder inner surface 3a).
Of the O-ring 50 is set to an intermediate diameter d1 between the inner diameter d and the outer diameter D of the O-ring 50.

In the annular passage 8 between the inner surface 3a of the cylinder and the cylindrical electrode 10, in order to allow the plating solution to flow smoothly as shown by the arrow, the protrusion amount δ of the insulating member 9 is set to a specified value (for example, 0.
5 mm). Therefore, the O-ring 50 cannot be greatly extended inward from the cylinder inner surface 3a.

Therefore, by forming a chamfered portion (width w, height h) 4 at the end of the cylinder inner surface 3a, the bottom surface (seal surface) 5 of the cylinder block 2 and the chamfered portion 4 intersect. The corner 5a is moved outward by w from the cylinder inner surface 3a. Therefore, the O on the sealing surface 5 of the cylinder block 2
A suitable portion of the ring 50 (shown in FIG. 7) can be crushed.

Thus, the non-crushed portion 5 of the O-ring 50
Ob protrudes above the corner 5a to form a gap S2 having a V-shaped cross section between the inner surface (cylinder inner surface) 3a of the tubular member and the O-ring 50. Therefore, the corner 5a of the seal surface 5 is
It is possible to reliably prevent the plating film from adhering to the corners 5a of the sealing surface 5, which can be securely adhered to the ring 50.

Here, the height h of the chamfered portion 4 is defined from the top dead center of the engine, and the width w of the chamfered portion 4 is defined so that a suitable portion of the O-ring 50 can be crushed. is there. In the present embodiment, as an example, the height h of the chamfered portion 4 is 1.5 mm and the width w is 0.87 mm.

The cylindrical electrode 10 has an insulating seal 55 provided on the peripheral wall 12 at a position facing the O-ring 50.
The insulating seal 55 is formed of, for example, a thermosetting synthetic resin, and has a width set to h, similarly to the height h of the chamfered portion 4. Accordingly, it is possible to prevent electricity from flowing between the cylinder block 2 and the portion of the cylindrical electrode 10 to which the insulating seal 55 is attached, and to reduce the plating thickness of the portion near the seal ring 55 (that is, the chamfered portion 4). . As a result, it is possible to more reliably prevent the plating film from adhering to the corners 5a of the sealing surface 5.

FIG. 3 is a sectional view taken along line 3-3 of FIG. The drive gear 23 of the rotating mechanism 20 meshes with the inner gears 24, 24, and the inner gears 24, 24 mesh with the first and second transmission gears 26, 27, respectively, and the first and second transmission gears 26, 27 respectively.
27 meshes with the outer gears 24,24. Therefore, the rotational force of the motor 21 is first transmitted from the drive gear 23 to the inner gears 24, 24 as shown by arrows, and then from the inner gears 24, 24 to the first and second transmission gears 26, 24 as shown by arrows. 27, and then the first and second transmission gears 2
The gears are transmitted from the gears 6 and 27 to the outer gears 24 and 24 as indicated by arrows.

As a result, the rotating shafts 25 to which the gears 24 are attached rotate as shown by the white arrows, respectively, and the cylindrical electrodes 10 attached to the rotating shafts 25 (FIG. 1) ) Rotate in the same manner as the rotation shafts 25.

FIGS. 4A and 4B are explanatory views of a cylindrical electrode of a plating apparatus (first embodiment) according to the present invention.
(A) is a cross-sectional view, and (b) is a view on arrow b of (a).
In (a), the cylindrical electrode 10 is made of, for example, titanium (T
i) An electrode or platinum coated with platinum (Pt)
An electrode having a substrate coated with iridium oxide (IrO ₂ ) clad, and having an inner hole 11 formed along an axis 10a.
, A cylindrical peripheral wall 12 facing the cylinder inner surface 3a (shown in FIG. 2) of the cylinder block 2, a plurality of through holes 13 spirally arranged in the peripheral wall 12, and formed at the upper end. It comprises a lid 14 and a screw 15 formed at the lower end.

In (b), the cylindrical electrode 10 is attached to the peripheral wall 1.
2 is set to the height H (see (a)) and the circumference L,
Are arranged at a fixed angle θ (24 °). The arrangement of the through holes 13 will be described in detail with reference to FIG.

FIG. 5 is a developed view of the cylindrical electrode of the plating apparatus (first embodiment) according to the present invention. Through hole 13 ...
Are arranged at a pitch P on the peripheral wall 12 in a staggered manner and along a spiral with an inclination angle θ1. The reason why the through holes 13 are spirally arranged is to uniformly apply the plating solution 28 to the cylinder inner surface 3a (shown in FIG. 2) of the cylinder block 2 facing the peripheral wall 12. Also, the through hole 13
.. Are arranged in a staggered manner because the distance between the through-holes 13 is smaller than that in the grid pattern, and the through-holes 13 are densely arranged on the peripheral wall 12. is there.

Next, a comparative example and an example of the plating apparatus 1 will be described with reference to FIGS. FIG. 6 (a), (b)
FIG. 3 is a first operation explanatory view of the plating apparatus (first embodiment) according to the present invention, showing a comparative example. In (a), in order for the plating solution to flow smoothly as indicated by the arrow, the protrusion amount δ of the insulating member 9 needs to be suppressed to a specified value (0.5 mm).
The inner surface 9b cannot be largely separated inward from the cylinder inner surface 3a. Therefore, the O-ring 50 cannot be largely extended inward from the cylinder inner surface 3a. For this reason, the corner 5 where the cylinder inner surface 3a and the sealing surface 5 intersect
Since b is located inside the center 51 of the cross section of the O-ring 50, the corner 5 b is located inside the top 52 of the O-ring 50. In this state, the cylinder block 2 is moved as shown by the arrow.

In (b), the O-ring 50 is crushed by the sealing surface 5 of the cylinder block 2 and the cylinder block 2 is placed on the insulating member 9. Corner 5 of cylinder block 2
Since b is located inside the center 51 of the cross section of the O-ring 50, even if the O-ring 50 is crushed by the sealing surface 5, the non-crushed portion 53 of the O-ring 50 is located below the corner 5b. Therefore, the gap S between the corner 5b and the O-ring 50
3 occurs, the plating film adheres near the corner 5b of the sealing surface 5, and the state of FIG.

FIGS. 7A and 7B are explanatory views of a second operation of the plating apparatus (first embodiment) according to the present invention, and show an example. In FIG. 6A, similarly to FIG. 6A, in order to make the plating solution flow smoothly as indicated by the arrow, it is necessary to suppress the protrusion amount δ of the insulating member 9 to a specified value (for example, 0.5 mm). The inner surface of the groove 9a cannot be largely separated inside the cylinder inner surface 3a. Therefore, the O-ring 50 cannot be greatly extended inside the cylinder inner surface 3a.

However, by forming the chamfered portion 4 at the end of the cylinder inner surface 3a and setting the width of the chamfered portion 4 to w, the corner at which the sealing surface 5 of the cylinder block 2 intersects the chamfered portion 4 is formed. The portion 5a can be disposed outside the center 51 of the cross-section of the O-ring 50 (that is, the “suitable portion of the O-ring 50” described with reference to FIG. 2). In this state, the cylinder block 2
Move like an arrow.

In FIG. 3B, the cylinder block 2 is placed on the insulating member 9 by crushing the O-ring 50 with the sealing surface 5 of the cylinder block 2. Since the corner 5a of the cylinder block 2 is located outside the center 51 of the cross-section of the O-ring 50, the non-crushed portion of the seal ring 50 53 is located above the corner 5a.

Therefore, a gap S2 having a V-shaped cross section can be formed between the cylinder inner surface 3a (that is, the chamfered portion 4) and the O-ring 50, so that the corner portion 5a can be securely brought into close contact with the O-ring 50. Can be. As a result, it is possible to prevent the plating film from adhering to the sealing surface 5. In addition, by forming a gap S2 having a V-shaped cross section between the cylinder inner surface 3a (that is, the chamfered portion 4) and the O-ring 50, a plating film can be formed on the chamfered portion 4.

As described above, according to the embodiment, the corner 5a of the cylinder block 2 is fixed to the O-ring 50 while the overhang amount δ of the insulating member 9 is suppressed to a specified value (for example, 0.5 mm). Can be surely brought into close contact with each other. As a result, it is possible to prevent the plating film from adhering to the sealing surface 5 without obstructing the flow of the plating solution.

Returning to (a), assuming that the cross-sectional diameter of the O-ring 50 is a and the amount of the O-ring 50 protruding from the insulating member 9 is b, b / a is set to 0.2 to 0.3. If b / a is less than 0.2, the protrusion amount of the O-ring 50 is too small, and when the O-ring 50 is crushed by the sealing surface 5, a gap having a V-shaped cross section between the chamfered portion 4 and the O-ring 50. S2 cannot be formed. Therefore, the corner portion 5 a cannot be brought into close contact with the O-ring 50, and the plating film adheres to the sealing surface 5. Therefore, by setting b / a to 0.2 or more, the corner 5a is brought into close contact with the O-ring 50 so that the plating film does not adhere to the sealing surface 5.

On the other hand, when b / a exceeds 0.3, the amount of protrusion of the O-ring 50 is too large and the O-ring 50
Is crushed, the O-ring 50 comes into contact with the chamfer 4. Therefore, a plating film cannot be formed on the chamfered portion 4. Therefore, by setting b / a to 0.3 or less, the O-ring 50 is separated from the chamfered portion 4 to form a plating film on the chamfered portion 4.

FIG. 8 is a view for explaining the third operation of the plating apparatus (first embodiment) according to the present invention, and shows the principle of the plating method. The cylinder block 2 is placed on the insulating member 9, and the cylinder block 2 is placed over the cylindrical electrode 10 with a gap S1 therebetween. In this state, the motor 21 is driven to
Is transmitted to the driving gear 23 → the gear 24 → the rotating shaft 25 to rotate the cylindrical electrode 10 around the axis 10a.

Next, the blade 41 of the stirrer 40 is rotated to stir the plating solution 28 in the tank 31. In this state, the pump 34 is driven to change the plating solution 28 in the tank 31 from the first supply path 33 to the supply port 32 as shown by arrows a1 to a3.
It is supplied from the chamber 35 to the inner hole 11 of the cylindrical electrode 10 through the second supply path 36.

The plating solution 28 in the inner hole 11 is provided in the through hole 13.
.. Are injected to the outside of the cylindrical electrode 10 as shown by arrows b... And strike the cylinder inner surface 3a of the cylinder block 2 at right angles. Then, the plating solution 28 that has hit the cylinder inner surface 3a is recovered in the tank 31 through the annular passage 8 → the recovery port 37 → the recovery path 38 as shown by arrows c1 and c2. Plating solution 28
Is operated to operate the energizing mechanism 45 while the cylindrical electrode 1 is circulated.
0 and the cylinder block 2 are energized.

FIG. 9 is a view for explaining a fourth operation of the plating apparatus (first embodiment) according to the present invention, and shows a state where a plating solution 28 is sprayed from the through holes 13 of the cylindrical electrode 10. .
By injecting the plating solution 28 from the through holes 13 and hitting the cylinder inner surface 3a of the cylinder block 2 almost at right angles as indicated by arrows b, the plating solution 28 hitting the cylinder inner surface 3a becomes turbulent. . In addition, by making the spraying speed of the plating solution 28 from the through holes 13... Substantially the same, the collision conditions of the plating solution 28 on the cylinder inner surface 3a are averaged.

For this reason, metal ions (Ni ions, Cu ions)
.. Can be uniformly dispersed in the plating solution. As a result, the concentration of metal ions (Ni ions, Cu ions) in the plating solution 28 in the vicinity of the cylinder inner surface 3a can be kept at a specified concentration, so that Ni-C
The plating film 29 of the u alloy can be deposited to a specified thickness T.

Further, by rotating the cylindrical electrode 10 as shown by the arrow, the plating solution 28 sprayed from the through holes 13... Can be uniformly applied to the entire cylinder inner surface 3a of the cylinder block 2. For this reason, the cylinder inner surface 3
The plating film 3 of the Ni—Cu alloy can be deposited to a uniform thickness over the entire area a.

Here, as described with reference to FIG. 7, since the corner 5a of the seal surface 5 can be securely brought into close contact with the O-ring 50, it is possible to prevent the plating film from adhering to the seal surface 5 near the corner. Can be prevented. In addition, O
When the ring 50 is crushed, the cylinder inner surface 3a (that is, the chamfered portion 4) is separated from the O-ring 50 by a gap S having a V-shaped cross section.
2 can be opened. Therefore, a plating film can be formed on the chamfered portion 4.

Further, since the insulating seal 55 is attached to the cylindrical electrode 10 facing the O-ring 50, it is possible to prevent the energization between the cylinder block 2 and the portion of the cylindrical electrode 10 where the insulating seal 55 is attached. For this reason, the seal ring 5
Plating film 29 at a portion near 5 (that is, chamfered portion 4)
The plating thickness of a can be reduced. As a result, it is possible to reliably prevent the plating film from adhering to the seal surface 5 near the corner.

Next, a second embodiment will be described. In addition,
The same members as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. FIGS. 10A and 10B are enlarged views of a seal ring of a plating apparatus (second embodiment) according to the present invention. The plating apparatus of the second embodiment has the same configuration as the first embodiment except that the seal ring 60 is a square ring.

In (a), in order to allow the plating solution to flow smoothly as indicated by the arrow, it is necessary to suppress the overhang δ to a specified value (0.5 mm), so that the inner surface 9b of the groove 9a is
Can not be greatly separated inside. Therefore, the angular ring 60 cannot be greatly extended inside the cylinder inner surface 3a.

Therefore, by forming the chamfered portion 4 at the end of the cylinder inner surface 3a, the corner 5a where the sealing surface 5 of the cylinder block 2 and the chamfered portion 4 intersect is formed at the cross-sectional center 61 of the corner ring 60. It can be arranged outside (a suitable part of the corner ring 60). In this state, the cylinder block 2 is moved as shown by the arrow.

In (b), the cylinder block 2 is placed on the insulating member 9 by crushing the square ring 60 with the sealing surface 5 of the cylinder block 2. Since the corner 5a of the cylinder block 2 is located outside the center 61 of the cross-section of the corner ring 60, the corner ring 60 is crushed at a suitable portion, so that the non-crushed portion 62 of the seal ring is relatively large. Can be left. Therefore, when the corner ring 60 is crushed by the seal surface 5, the non-crushed portion 62 of the seal ring can be kept in a state of protruding above the corner 5a.

Accordingly, since the inner surface 3a of the cylinder (that is, the chamfered portion 4) can form a gap S4 having a V-shaped cross section with the square ring 60, the corner 5a of the sealing surface 5 is securely adhered to the square ring 60. Can be done. As a result, it is possible to prevent the plating film from adhering to the seal surface near the corner. In addition, since the cylinder inner surface 3a (that is, the chamfered portion 4) can open a gap S4 having a V-shaped cross section with the square ring 60, a plating film can be formed on the chamfered portion 4.

By using the square ring 60 as the seal ring, the ring surface 63 can be flattened, so that a suitable portion of the square ring 60 is set wider than in the case where the O-ring 50 is used. be able to. For this reason, even if the corner 5a is arranged inside the center 61 of the cross section of the corner ring 60, if the corner 5a is near the center 61 of the cross section, the corner 5a is brought into close contact with the corner ring 60 and the sealing surface near the corner is formed. 5 can be prevented from adhering to the plating film. As a result, the cylinder block 2 can be set relatively rough, so that the working time can be relatively shortened.

In the above embodiment, the seal ring is
Although the example using the ring 50 and the corner ring 60 has been described,
Other elastic rings may be used. Further, the example in which the width of the insulating seal 55 is set to h in the same manner as the height h of the chamfered portion 4 has been described, but the width of the insulating seal 55 is not limited to h.
That is, the width of the insulating seal 55 that regulates the plating thickness of the chamfered portion 4 may be set so as to prevent the plating film from adhering to the corner portion 5a.

[0055]

According to the present invention, the following effects are exhibited by the above configuration. According to the first aspect, when the seal ring is crushed on the bottom surface of the tubular member, the inner surface of the tubular member and the seal ring have a V.
A gap having a U-shaped cross section was formed. For this reason, the seal ring can be securely brought into close contact with the inner surface corner of the tubular member, so that it is possible to prevent the plating solution from adhering to the bottom surface of the tubular member. Therefore, it is possible to prevent the plating film from adhering to the bottom surface of the tubular member. As a result,
Since it is not necessary to remove the plating film from the bottom surface of the tubular member, the cylinder head can be mounted without trouble on the engine block.

According to the second aspect, since the insulating seal is provided on the cylindrical electrode facing the seal ring, it is possible to prevent the energization between the portion of the cylindrical member provided with the insulating seal and the cylindrical member.
Therefore, the plating thickness on the inner surface of the tubular member near the seal ring can be reduced. Therefore, it is possible to reliably prevent the plating film from adhering to the corners of the tubular member.
As a result, there is no need to peel off the plating film from the bottom surface of the tubular member, so that the cylinder head can be mounted without trouble on the engine block.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a tubular member plating apparatus (first embodiment) according to the present invention.

FIG. 2 is an enlarged view of a part of FIG. 1;

FIG. 3 is a sectional view taken along line 3-3 in FIG. 1;

FIG. 4 is an explanatory view of a cylindrical electrode of the plating apparatus (first embodiment) according to the present invention.

FIG. 5 is a development view of a cylindrical electrode of the plating apparatus (first embodiment) according to the present invention.

FIG. 6 is a first operation explanatory view of the plating apparatus (first embodiment) according to the present invention;

FIG. 7 is a diagram illustrating a second operation of the plating apparatus (first embodiment) according to the present invention.

FIG. 8 is a third operation explanatory view of the plating apparatus (first embodiment) according to the present invention.

FIG. 9 is an explanatory view of a fourth operation of the plating apparatus (first embodiment) according to the present invention.

FIG. 10 is a plating apparatus according to the present invention (second embodiment).
Enlarged view of seal ring

FIG. 11 is a sectional view of a conventional cylinder block plating apparatus.

FIG. 12 is a sectional view showing a state where a plating film is formed on a cylinder block by a conventional plating apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Plating apparatus of a cylindrical member, 2 ... Cylindrical member (cylinder block), 3 ... Hollow part, 3a ... Inner surface of a cylindrical member (Cylinder inner surface), 4 ... Chamfer part, 5 ... Bottom (seal surface), 8: annular passage, 9: mounting member (insulating member), 9a: groove, 10 ...
Cylindrical electrode, 28 ... Plating solution, 29 ... Plating film, 50 ...
Seal ring (O-ring), 60: seal ring (square ring), d: inner diameter of seal ring, d1: inner diameter of cylindrical member (inner diameter of cylinder inner surface), D: outer diameter of seal ring,
S1: gap, S2, S4: V-shaped cross section gap.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Nobuhiko Yoshimoto, Inventor 1-10-1 Shinsayama, Sayama City, Saitama Prefecture Honda Engineering Co., Ltd. (72) Inventor Toshiyuki Higashi 1-10-1, Shinsayama, Sayama City, Saitama Prefecture DA Engineering Co., Ltd. F term (reference) 4K024 AA03 AA09 AB01 BA02 BB01 BB04 BC10 CB11 GA01

Claims (2)

[Claims] A mounting member is provided with a groove for accommodating a lower half portion of a seal ring, a seal ring is accommodated in the groove, and a cylindrical member having an inner diameter between the inner diameter and the outer diameter of the seal ring. When the seal ring is crushed on the bottom surface, the inner surface of the tubular member is placed on the mounting member such that the seal ring is crushed to such an extent that a gap having a V-shaped cross section opens from the seal ring, and the hollow portion of the tubular member is placed. A plating electrode is disposed on the inner surface of the cylindrical member, and a plating solution is caused to flow through a gap between the inner surface of the cylindrical member and the outer surface of the cylindrical electrode, and the inner surface of the cylindrical member is plated by energizing the cylindrical member and the cylindrical electrode. An apparatus for plating a tubular member, wherein a coating is formed. 2. The cylindrical electrode according to claim 1, wherein an insulating seal is provided at a portion facing the seal ring.
An apparatus for plating a tubular member according to the above.