JP5755341B2 - Plating equipment - Google Patents

Description

  The present invention relates to a plating apparatus and the like, for example, a plating apparatus for forming a magnetostrictive film in a magnetostrictive torque sensor by magnetic alloy plating.

  The vehicle includes an electric power steering device, for example. The electric power steering apparatus generates an auxiliary torque that reduces a steering torque in a steering system generated by an operation by a driver on a steering handle. Due to the generation of the auxiliary torque, the electric power steering apparatus can reduce the burden on the driver. The electric power steering apparatus includes a steering torque sensor that detects steering torque, and a torque sensor that detects torque acting on a shaft-like member (also referred to as a rotation shaft, a pinion shaft, or an input shaft) such as steering torque is, for example, A magnetostrictive torque sensor that detects torque using the magnetostrictive effect of a plurality of magnetostrictive films having different magnetic anisotropies can be used.

  For example, Patent Document 1 discloses a plating apparatus that forms two magnetostrictive films before plating with different magnetic anisotropies on a portion to be plated of a shaft member by plating. Metal ions (for example, Ni ions and Fe ions) in the plating solution are caused to flow from the anode (metal rod, metal pellet) of the plating apparatus to the exposed part or non-mask part (cathode, plated part) of the shaft-like member. Can be deposited on the cathode side to form a magnetic alloy plating such as a magnetostrictive film.

  However, since the current lines (lines of electric force) are directed from the entire anode toward the portion to be plated (cathode), the current lines cannot flow uniformly into the portion to be plated depending on the pattern such as the length of the anode. In other words, depending on the type of specification required for the electric power steering apparatus, the current line needs to flow uniformly into the portion to be plated. That is, the plating apparatus disclosed in Patent Document 1 has a uniform current density distribution on the entire surface of the plated portion by forming the diameter of the central shielding jig smaller than the diameter of the upper and lower shielding jigs. Although the present inventors have disclosed that the current density distribution on the surface of the portion to be plated in the axial direction of the shaft-shaped member is actually dependent on the anode pattern, Depending on the position of the part, it was recognized that the variation in the thickness of the magnetic alloy plating did not fall within the allowable range depending on the type of specification.

JP 2008-101243 A

  The subject of this invention is providing the plating apparatus which can form the thickness of magnetic alloy plating more uniformly.

  According to a first aspect of the present invention, there is provided a plating apparatus having a plating tank for storing a plating solution, and performing magnetic alloy plating on the shaft-like member using the shaft-like member immersed in the plating solution as a cathode, A plurality of shielding jigs that are mounted on the outer peripheral surface of the shaft-shaped member and define a portion to be plated of the shaft-shaped member, and an output portion that is provided around the shaft-shaped member and faces the portion to be plated. And a plating apparatus in which a center position of the plated portion and a center position of the output portion coincide with each other within a predetermined allowable value regarding the center position in the axial direction of the shaft-shaped member. The

  In the axial direction of the shaft-shaped member, when the center position of the plated portion of the shaft-shaped member coincides with the center position of the output portion of the anode, the current line flowing into the plated portion is relative to the center position of the plated portion. It becomes symmetric. Therefore, the variation in the thickness of the magnetic alloy plating is also symmetric with respect to the center position of the portion to be plated, and the thickness of the magnetic alloy plating can be formed more uniformly.

  In other words, the magnetic line at the position where the current line flowing into the plated portion is not symmetrical with respect to the central position of the plated portion and is farthest from the central position of the plated portion (one end position of the plated portion). When the thickness of the gold plating is the thinnest or thickest, the difference between the thickness and the thickness of the magnetic alloy plating at one end position of the plated portion is that the current line flowing into the plated portion is the center position of the plated portion. It becomes larger than the difference when it becomes symmetric. Therefore, the variation in the thickness of the magnetic alloy plating when the current line flowing into the plated portion is not symmetrical with respect to the center position of the plated portion, for example, is within an allowable range at one end position of the plated portion. Sometimes not.

  Therefore, the central position of the plated portion of the shaft-like member and the central position of the output portion of the anode are set to a predetermined value with respect to the central position so that the variation in the thickness of the magnetic alloy plating is within the allowable range of the entire plated portion. By matching within the allowable value, the thickness of the magnetic alloy plating can be formed more uniformly.

  In the first aspect, preferably, in the axial direction of the shaft-like member, the length of the portion to be plated and the length of the output portion of the anode coincide with each other within a predetermined allowable value regarding the length.

  In the axial direction of the shaft-shaped member, when the length of the portion to be plated of the shaft-shaped member matches the length of the output portion of the anode, the current line flowing into the portion to be plated is perpendicular to the surface of the portion to be plated. . Therefore, the current density distribution on the entire surface of the portion to be plated becomes uniform, and the thickness of the magnetic alloy plating can be formed more uniformly.

  Therefore, the length of the portion to be plated of the shaft-like member and the length of the output portion of the anode are predetermined tolerances regarding the length so that the variation in the thickness of the magnetic alloy plating is within the allowable range of the entire portion to be plated. By making them coincide with each other, the thickness of the magnetic alloy plating can be formed more uniformly.

  In the first aspect, the plating apparatus preferably further includes a shield provided between the anode and the shaft-shaped member.

  The shielding object can form the output part of the anode with a part of the anode without using the whole anode as the output part.

  In the first aspect, preferably, the pattern of the shielding object may define a pattern of the output portion of the anode, and the variation of the thickness of the magnetic alloy plating is within an allowable range. The pattern of the shield may be determined.

  Depending on the type of the anode, the center position of the portion to be plated of the shaft-shaped member may not match the center position of the output portion of the anode. Or depending on the kind of anode, the length of the to-be-plated part of a shaft-shaped member and the length of the output part of an anode may be unable to correspond. Therefore, by adjusting the pattern of the shield, the pattern (center position, length) of the output portion of the anode can be adjusted, and the thickness of the magnetic alloy plating can be formed more uniformly.

  Further, depending on the type of the shaft-shaped member, the pattern such as the length of the portion to be plated is different. Even in such a case, the thickness of the magnetic alloy plating can be formed more uniformly while adjusting the pattern of the shielding object with one anode while adapting to various types of shaft-shaped members or parts to be plated. Can do.

  In the first aspect, preferably, the shield is an assembly type that can be attached to and detached from the anode.

  By making the shields replaceable, the thickness of the magnetic alloy plating can be formed more uniformly while adapting to various types of shaft-shaped members or parts to be plated.

  In the first aspect, preferably, the plating apparatus may further include a plating solution ejection nozzle having a plating solution ejection port facing the portion to be plated, and the plating solution ejection nozzle is detachable from the plating tank. It may be an assembly type.

  Depending on the type of the shaft-shaped member, the pattern of the center position of the portion to be plated is different. Even in such a case, the thickness of the magnetic alloy plating can be adapted to various types of shaft-like members or parts to be plated by replacing with a plating liquid jet nozzle having a plating liquid jet nozzle facing the part to be plated. Can be formed more uniformly.

  In the first aspect, preferably, in the axial direction of the shaft-shaped member, the center position of the plated portion and the center position of the plating solution outlet coincide with each other within a predetermined allowable value related to the center position.

  In the axial direction of the shaft-shaped member, when the center position of the plated portion of the shaft-shaped member coincides with the center position of the plating solution ejection port (output portion of the plating solution ejection nozzle), the flow of the plating solution flowing into the plated portion The line is symmetric with respect to the center position of the portion to be plated. Therefore, the variation in the thickness of the magnetic alloy plating is also symmetric with respect to the center position of the portion to be plated, and the thickness of the magnetic alloy plating can be formed more uniformly. Even when the shaft member is rotated to stir the plating solution in the plating tank, the composition of the magnetic alloy plating can be formed more uniformly.

  In the first aspect, preferably, in the axial direction of the shaft-shaped member, the length of the portion to be plated and the length of the plating solution jet outlet coincide with each other within a predetermined allowable value related to the length.

  In the axial direction of the shaft-shaped member, when the length of the portion to be plated of the shaft-shaped member and the length of the plating solution ejection port (the output portion of the plating solution ejection nozzle) match, the density of metal ions flowing into the portion to be plated is It becomes uniform over the entire portion to be plated. Therefore, the thickness of the magnetic alloy plating can be formed more uniformly. Even when the shaft member is rotated to stir the plating solution in the plating tank, the composition of the magnetic alloy plating can be formed more uniformly.

  Those skilled in the art will readily understand that the illustrated embodiments according to the present invention can be further modified without departing from the spirit of the present invention.

The detailed structural example of the plating apparatus according to this invention is shown. 2A shows a schematic configuration example of the plating apparatus of FIG. 1, and FIG. 2B shows a detailed configuration example showing the inside of the plating tank shown in FIG. 3A shows another schematic configuration example of the plating apparatus of FIG. 1, and FIG. 3B shows another detailed configuration example showing the inside of the plating tank shown in FIG. The top view of the plating tank shown in FIG. 1 is shown. 5A shows an example of the appearance of the plating solution ejection nozzle shown in FIG. 2B, and FIG. 5B shows a schematic configuration example of the output part of the plating solution ejection nozzle shown in FIG. . 6A shows an external appearance example of the plating solution ejection nozzle shown in FIG. 3B, and FIG. 6B shows a modification of the anode of the plating apparatus shown in FIG. An example of the exploded perspective view of the metal cage and shield of FIG. 3 (B) is shown. 8A shows a modification of the shield in FIG. 7, and FIG. 8B shows a modification of the anode in FIG. 3B. FIGS. 9A to 9H are explanatory views when the center position of the portion to be plated and the center position of the output portion are substantially matched. FIGS. 10A to 10H show another explanatory view when the center position of the portion to be plated and the center position of the output portion are substantially matched.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. One skilled in the art should note that the present invention is not unduly limited by the examples described below.

  FIG. 1 shows a detailed configuration example of a plating apparatus according to the present invention, and FIG. 2A mainly shows a schematic configuration example (or enlarged view) of a plating apparatus (or an output part of an anode) according to the present invention. In the example of FIG. 1, the plating apparatus 1 includes a shielding object 10 m provided between the anode 10 and the shaft-like member 5, and in the example of FIG. 2A, the output 10 s of the anode 10 with the shielding object 10 m. It is characterized in that it stipulates. In other words, the plating apparatus 1 of FIG. 1 is characterized in that the plating apparatus of Patent Document 1 is improved. However, as will be described later, depending on the type of the anode 10, the plating apparatus 1 may not include the shielding object 10m as long as the thickness of the magnetic alloy plating can be more uniformly formed by the output portion 10s.

  In the example of FIG. 1, the plating apparatus 1 includes a plating tank 3 that stores a plating solution 2, and performs magnetic alloy plating on the shaft-like member 5 using the shaft-like member 5 immersed in the plating solution 3 as a cathode. In the example of FIG. 2A, the plating apparatus 1 is mounted on the outer peripheral surface of the shaft-like member 5, and includes a plurality of shielding jigs 13, 14, 15 that define the portion to be plated 5 s of the shaft-like member 5, and the shaft And an anode 10 having an output part 10 s provided around the shaped member 5 and facing the part to be plated 5 s.

  As shown in FIG. 2A, the plurality of shielding jigs 13, 14, 15 are intermediate shielding treatments provided between the shielding jigs 13, 15 at both upper and lower ends and the shielding jigs 13, 15 at both ends. The portion to be plated 5 s is a portion that is inside the shielding jigs 13 and 15 at both ends of the shaft-like member 5 and is not covered with the shielding jig 14. In other words, the portion to be plated 5 s is located between adjacent shielding jigs (adjacent shielding jigs 13, 14, adjacent shielding jigs 14, 15) among the plurality of shielding jigs 13, 14, 15. These are two parts of the shaft-like member 5. The portion to be plated 5s is composed of, for example, two portions of the shaft-like member 5, but the space between the two portions (the portion covered with the shielding jig 14) is ignored, and the portion to be plated 5s. Is the distance 5l from one end of the portion to be plated 5s to the other end. In the axial direction J of the shaft-shaped member 5, one end (bottom) position of the shaft-shaped member 5 is 0 (origin), and the center position of the portion to be plated 5s is 5c.

  Referring to FIG. 2A, the shielding object 10m is composed of a plurality of members, and the output portion 10s of the anode 10 is defined by a plurality of members, similar to the portion to be plated 5s. It is an uncovered part or an unshielded part. The length (outer length) of the output portion 10s is a distance 10l from one end portion of the output portion 10s to the other end portion, and the center position of the output portion 10s in the axial direction J of the shaft-like member 5 is 10c. When the center position 5c of the portion to be plated 5s of the shaft-like member 5 and the center position 10c of the output portion 10s of the anode 10 match, the current line flowing into the portion to be plated 5s is relative to the center position of the portion to be plated 5s. It becomes symmetric. Therefore, the variation in the thickness of the magnetic alloy plating is also symmetric with respect to the center position of the portion to be plated 5s, and the thickness of the magnetic alloy plating can be formed more uniformly. However, the center position 5c and the center position 10c of the output portion 10s of the anode 10 do not have to be completely coincident with each other as long as they are substantially coincident as described later.

  In the example of FIG. 2A, in the axial direction J of the shaft-shaped member 5, the length 5l of the portion 5s to be plated of the shaft-shaped member 5 and the length 10l of the output portion 10s of the anode 10 are described later. The length 5l of the portion to be plated 5s may be slightly longer than the length 10l of the output portion 10s, or both may be completely coincident with each other. The length 5l may be slightly shorter than the length 10l of the output portion 10s.

  In the example of FIG. 2A, in the axial direction J of the shaft-like member 5, the center position 5c of the portion to be plated 5s of the shaft-like member 5 and the output portion (plating solution outlet 26 of the plating solution jet nozzle 9 described later). ) Is preferably substantially coincident with the center position 26c. Furthermore, in the axial direction J of the shaft-shaped member 5, the length 5l of the portion to be plated 5s of the shaft-shaped member 5 and the length 26l of the output portion of the plating solution ejection nozzle 9 are substantially the same. preferable.

  In the example of FIG. 1, the plating apparatus 1 includes a plating solution adjustment tank 4 for adjusting the temperature of the plating solution 2, and a rotation holding device 6 that rotatably holds a shaft-like member 5 having a portion to be plated 5 s. Is further provided. The shaft-like member 5 is a steering shaft made of, for example, chrome molybdenum steel, and is held in the vertical direction at the center of the plating tank 3 by the holding member 12 of the rotation holding device 6. A liquid chamber 7 is provided outside the lower part of the plating tank 3, a recovery part 8 is provided outside the upper part of the plating tank 3, and not only the anode 10 and the part to be plated 5 s (cathode) but also, for example, A plating solution jet nozzle 9 made of an insulating resin is also provided. In addition, it is preferable that the plating liquid ejection nozzle 9 is an assembly type that can be attached to and detached from the plating tank 3 or the liquid chamber 7 as described later.

  The plating solution 2 is an alloy plating solution containing at least two metal ions (for example, Ni ions and Fe ions) in a predetermined ratio, and is maintained at a predetermined temperature by the plating solution adjusting tank 4. On the outer peripheral surface of the shaft-like member 5, for example, shielding jigs 13, 14, 15 made of insulating resin are mounted. The shielding jigs 13, 14, and 15 have a cylindrical shape that is preferably, for example, 10 [mm] or more, and can be divided in the diameter direction so as to be detachable from the shaft-like member 5. is there. The diameter of the intermediate shielding jig 14 provided between the shielding jigs 13 and 15 at both ends is preferably smaller than the diameter of the shielding jigs 13 and 15 at both ends, but the intermediate shielding jig 14 is omitted. May be.

  The rotation holding device 6 is provided at a metal rotation shaft 18 provided in a vertical direction, a vertical mechanism 19 provided at an intermediate portion of the rotation shaft 18, and a joint portion between the rotation shaft 18 and the vertical mechanism 19. The bearing 20, the holding member 12 provided at one end of the rotating shaft 18, the motor 21 provided at the other end of the rotating shaft 18, and the power supply provided near the motor 21 and electrically connected to the negative electrode of the power source 22. A brush 23. The rotation holding device 6 is configured to immerse the shaft-like member 5 in the plating solution 2 by moving the rotating shaft 18 up and down by the up-and-down mechanism 19 or to lift the shaft-like member 5 from the plating solution 2. The rotation holding device 6 is configured to rotate the shaft-like member 5 by rotating the rotation shaft 18 by the motor 21.

  The plating solution adjustment tank 4 includes a stirrer 29, a temperature adjuster 30, and a heater 31, and the plating solution 2 is stored inside the plating solution adjustment tank 4. The stirrer 29 stirs the plating solution 2 to uniformly disperse, for example, Ni ions and Fe ions in the plating solution 2 and to make the temperature of the plating solution 2 uniform. The temperature regulator 30 measures the temperature of the plating solution 2 and controls the heater 31 to maintain the plating solution 2 at a predetermined temperature.

  The plating solution 2 in the plating solution adjustment tank 4 is supplied into the liquid chamber 7 through a plating solution supply pipe 32 that allows the inside of the plating solution adjustment tank 4 and the solution chamber 7 to communicate with each other. In the middle of the plating solution supply pipe 32, a pump 33, a strainer 34, and a flow meter 35 are provided. A controller 36 for adjusting the flow rate of the plating solution 2 is provided, and the controller 36 is connected to the pump 33 via an inverter 37. The flow rate of the plating solution 2 passing through the plating solution supply pipe 32 is measured by the flow meter 35, the measured value is compared with a preset value by the controller 36, and the inverter 37 is controlled. By adjusting the pump flow rate of 33, the flow rate of the plating solution 2 supplied into the solution chamber 7, that is, the flow rate of the plating solution 2 ejected from the plating solution outlet 26 (FIG. 2B) is adjusted. Further, foreign substances such as dust in the plating solution 2 in the plating solution supply pipe 32 are filtered by the strainer 34.

  FIG. 2B shows a detailed configuration example showing the inside of the plating tank 3 shown in FIG. 3A mainly shows another schematic configuration example (enlarged view) of the output portion 10s of the anode 10 of the plating apparatus 1 shown in FIG. 1, and FIG. 3B shows the plating apparatus 1 shown in FIG. The other detailed structural example which shows the inside of the plating tank 3 is shown. In the example of FIG. 3, the shielding jig 14 provided between the shielding jigs 13 and 15 at both ends is omitted. In other words, the space between the two magnetostrictive films before the magnetic anisotropy different from each other is given is omitted, and a single magnetic alloy plating is formed on the single plated portion 5s, and then a single magnetic alloy plating is formed. A magnetostrictive film having two functions may be formed by giving different magnetic anisotropies to the magnetic alloy plating. Further, in the example of FIG. 3, the portion to be plated 5 s is located above the plating solution 2 compared to the example of FIG. 2.

  In the example of FIG. 2B and the example of FIG. 3B, the plating solution ejection nozzle 9 is an assembly type that can be attached to and detached from the plating tank 3 through the solution chamber 7, and is attached to the bottom of the plating solution ejection nozzle 9. A flange 9f is provided, and the plating solution ejection nozzle 9 or the flange 9f is fixed to the liquid chamber 7 by a plurality of bolts 9b. The flange 9f and the bolt 9b are an example of a fixture, and the fixture may be constituted by other members or other components.

  Depending on the type of the shaft-like member 5, the position (center position 5c) at which the portion to be plated 5s is provided on the shaft-like member 5 differs, and the portion to be plated 5s in the example of FIG. Compared to the example, it is located above the plating solution 2. Even in such a case, by replacing with the plating solution ejection nozzle 9 having the plating solution ejection port 26 facing the portion to be plated 5s, the magnetic material is adapted to various types of shaft-like members 5 or the portion to be plated 5s. The thickness of the alloy plating can be formed more uniformly. In other words, the length of the plating solution ejection nozzle 9 shown in FIG. 2B is extended, and the plurality of plating solution ejection ports 26 are positioned upward. For example, the replacement plating solution ejection nozzle 9 shown in FIG. Can be prepared.

  As will be described later, the shielding object 10m can also be adapted to various types of shaft-like members 5 or to-be-plated parts 5s by exchanging in the same manner as the plating solution ejection nozzle 9.

  In the example of FIG. 2 (B) and the example of FIG. 3 (B), the plating tank 3 is a cylindrical tank made of, for example, an insulating resin or a metal having an insulating coating applied to the inner surface. The plating liquid 2 is supplied from the liquid chamber 7 into the plating tank 3 through the plating liquid jet nozzle 9, overflows from the upper end portion of the plating tank 3 into the recovery unit 8, and is provided at the bottom of the recovery unit 8. It is collected in the plating solution adjusting tank 4 of FIG.

  When the power supply 22 is ON, the plating solution 2 is ejected from the plating solution ejection port 26 toward the portion to be plated 5 s of the rotating shaft-shaped member 5. Thereby, the plating solution 2 is supplied to the entire surface of the portion to be plated 5s, and a uniform liquid flow can be obtained over the entire surface of the portion to be plated 5s. Further, since the shaft-like member 5 is rotating, the Ni ion concentration and the Fe ion concentration of the plating solution 2 are kept constant over the entire surface of the portion to be plated 5s.

  In the example of FIG. 2B and the example of FIG. 3B, the outer peripheral surface of the shaft-like member 5 is masked on a portion above the upper shielding jig 13 and a portion below the lower shielding jig 15. The tape 16 is wound (see FIGS. 5A and 6A). The plated portion 5 s of the shaft-like member 5 is a portion that is not covered with the shielding jigs 13, 14, 15 or the shielding jigs 13, 15 and the masking tape 16.

  In the example of FIG. 2B and the example of FIG. 3B, the anode 10 includes a cylindrical metal rod 27 having an open upper end and a closed lower end, and a plurality of pieces accommodated inside the metal rod 27. And metal pellets 28. The metal rod 27 is disposed inside the circumferential surface so as to surround the plating solution ejection nozzle 9 and is supported by a fixture (not shown) so as not to contact the inner circumferential surface and the bottom surface of the plating tank 3. The metal rod 27 is formed of, for example, a metal mesh made of Ti so that it does not dissolve in the plating solution 2 when energized, and is electrically connected to the positive electrode of the power source 22 (FIG. 1). On the other hand, the metal pellet 28 is, for example, a pellet made of Ni—Fe alloy that can be dissolved in the plating solution 2, a mixed pellet of a metal pellet made of Ni alone and a metal pellet made of Fe alone, or the like. Although the metal pellet 28 is used as the anode 10, it may have any shape such as a sphere as long as it is accommodated in the metal rod 27 and does not leak from the eyes of the metal rod 27.

  Even if Ni ions and Fe ions in the plating solution 2 are consumed due to the Ni-Fe alloy plating, the Ni ions and Fe ions are dissolved in the plating solution 2 from the metal pellets 28 by electrolysis, and plating is performed. Since the Ni ion concentration and the Fe ion concentration in the liquid 2 are kept constant, the plating liquid 2 can be easily managed. Further, since the metal pellet 28 is accommodated in the metal rod 27, the metal pellet 28 can be easily supplied into the metal rod 27 even during the plating.

  FIG. 4 shows a top view of the plating tank 3 shown in FIG. 5A shows an example of the appearance of the plating solution ejection nozzle 9 shown in FIG. 2B, and FIG. 6A shows an example of the appearance of the plating solution ejection nozzle 9 shown in FIG. FIG. 5B mainly shows a schematic configuration example of the output part of the plating solution ejection nozzle 9 of FIG. 5A, and FIG. 6B shows a modification of the anode 10 of the plating apparatus 1 shown in FIG. Indicates. In the example of FIG. 4, for example, four plating solution ejection nozzles 9 are provided at equal intervals on the circumference with the shaft-shaped member 5 as the center. The number of the plating solution ejection nozzles 9 may be a plurality other than four or one.

  In the example of FIG. 6B, the whole anode 10 is directed to the portion to be plated (cathode) 5s. In other words, the anode 10 in FIG. 6B as a whole constitutes the output portion 10s of the anode 10 in FIG. 2A, and the center position 5c of the plated portion 5s and the center position 10c of the output portion 10s coincide with each other. Moreover, the anode 10 in FIG. 6B is fixed. In the example of FIG. 6B, the plating apparatus 1 or the plating tank 3 does not include the shielding object 10m shown in FIG.

  In the example of FIG. 5 (A) and the example of FIG. 5 (B), the plurality of plating solution ejection ports 26 are provided on the outer peripheral surface of the plating solution ejection nozzle 9 so as to face the portion to be plated 5s, and are axial members. 5 is arranged in parallel with the axial direction. In the example of FIG. 5A, the plurality of plating solution outlets 26 have a plurality of regions corresponding to the individual plated portions 5s, 5s (for example, two sub-plated portions 5s, 5s in the entire plated portion). (For example, an upper region and a lower region). It is preferable that the lengths 26l1 and 26l2 of the individual regions (upper region and lower region) substantially coincide with the lengths 5l1 and 5l2 of the corresponding sub-plated portion 5s. Furthermore, it is preferable that the centers 26c1 and 26c2 of the individual regions (upper region and lower region) substantially coincide with the centers 5c1 and 5c2 of the corresponding sub-plated portion 5s. Accordingly, the thickness of the magnetic alloy plating can be formed more uniformly, and the composition of the magnetic alloy plating can be achieved even when the shaft member 5 is rotated and the plating solution 2 in the plating tank 3 is stirred. Can be formed more uniformly.

  In the example of FIG. 5B, for example, two sub-output portions in the entire output portion 10s of the anode 10 are classified into a plurality of regions (for example, an upper region and a lower region) corresponding to each sub-plated portion 5s. The lengths 10l1 and 10l2 of the individual regions (upper region and lower region) are preferably substantially equal to the lengths 5l1 and 5l2 of the corresponding sub-plated portion 5s. Furthermore, it is preferable that the centers 10c1 and 10c2 of the individual regions (upper region and lower region) substantially coincide with the centers 5c1 and 5c2 of the corresponding sub-plated portion 5s. Accordingly, the thickness of the magnetic alloy plating can be more uniformly formed in each of the plated portions 5s and 5s (for example, two sub-plated portions 5s and 5s in the entire plated portion).

  FIG. 7 shows an example of an exploded perspective view of the metal rod 27 and the shield 10m of FIG. In the example of FIG. 7, for example, a cylindrical shielding object 10 m having three openings is fixed to the inner surface (circumferential surface) of the metal rod 27 with a fixture such as a bolt 10 b, a frame 10 f 1, and a nut (not shown). can do. The pattern of the shielding object 10m defines the pattern of the output portion 10s of the anode 10, and the shielding object 10m is preferably an assembly type that can be attached to and detached from the anode 10 or the metal rod 27, for example. In other words, the portion corresponding to the anode 10 or the metal pellet 28 in the opening of the shielding object 10m defines the output part 10s of the anode 10, and the shielding object 10m is preferably exchangeable. Alternatively, the metal rod 27 or the anode 10 may be replaceable.

  The metal rod 27 can be fixed to the plating tank 3 of FIG. 1 with a fixture such as a frame 10f2 and a member or component not shown. The shielding object 10m and the fixtures (bolts 10b, frame 10f1, frame 10f2, etc.) are insulators, and both are made of, for example, an insulating material, or an insulating coating film is applied to the surfaces of both.

  When the metal rod 27 and the shielding object 10m of FIG. 7 are applied to FIG. 2B, for example, three openings are provided below the cylindrical shielding object 10m and correspond to the shielding jig 14. The opening of the part is closed, in other words, for example, six openings (not shown) are provided in the cylindrical shield 10m.

  8A shows a modified example of the shielding object 10m in FIG. 7, and FIG. 8B shows a modified example of the anode 10 in FIG. 3B. In the example of FIG. 8A, the shielding object 10m is composed of two cylindrical members. When the shielding objects 10m, 10m of FIG. 8A are fixed to the metal rod 27, the shielding objects 10m, 10m The space in between defines the output portion 10 s of the anode 10 or the metal pellet 28. In other words, the pattern of the shielding objects 10m and 10m defines the pattern of the output portion 10s of the anode 10 or the metal pellet 28.

  The shields 10m and 10m in FIG. 8A are not fixed to the metal rod 27, but are, for example, six plates with a fixture such as a bolt 10b and a nut 10n as shown in the example of FIG. 8B. You may fix to the six anodes 10, 10, 10, 10, 10, 10 comprised by a shape-shaped member. In other words, the plating apparatus 1 may employ the plate-like undissolved anode 10 instead of the anode 10 composed of the metal rod 27 and the metal pellet 28.

  When the shielding objects 10m and 10m in FIG. 8A are applied to FIG. 2B, the shielding object 10m includes a cylindrical member corresponding to the shielding jig 14, for example, three cylindrical shapes. It is composed of members (not shown), and a space between adjacent members is provided on the lower side.

  9A to 9H respectively show the center position 5c of the portion to be plated 5s (or the center positions 5c1 and 5c2 of the portion to be plated 5s) and the center position 10c of the output portion 10s (or the sub output portion). An explanatory view when the center positions 10c1 and 10c2) of 10s are substantially matched is shown. FIG. 9C shows a variation in the film thickness of, for example, Ni—Fe alloy plating when the center position 5c of the portion to be plated 5s and the center position 10c of the output portion 10s completely coincide, for example, FIG. ) Represents the film thickness at six different positions in the axial direction J of the shaft-like member 5 of the portion to be plated 5s. Further, a range indicated by two dotted lines in FIG. 9C is an allowable range related to the film thickness determined by the specification. 9A and 9B show variations in film thickness when the center position 10c of the output portion 10s is higher than the center position 5c of the portion to be plated 5s, and the center position 10c in FIG. 9A. Is higher than the center position 10c in FIG. FIGS. 9D to 9H show the variation in film thickness when the center position 10c of the output portion 10s is lower than the center position 5c of the portion to be plated 5s, and FIGS. The center position 10c of H) gradually becomes lower in the order of FIGS. 9D to 9H, and the center position 10c of FIG. 9H is the lowest.

  In each of FIGS. 9A to 9F, all the film thicknesses at the six positions fall within the allowable range, while in each of FIGS. 9G to 9H, the six positions are All of the film thickness is not within the acceptable range. Therefore, not only the center position 5c of the portion to be plated 5s and the center position 10c of the output portion 10s completely coincide (FIG. 9C), but the center position 10c of the output portion 10s is the center position of the portion to be plated 5s. It may be slightly higher than 5c (FIGS. 9A and 9B), and the center position 10c of the output portion 10s may be slightly lower than the center position 5c of the plated portion 5s (FIG. 9D ), FIG. 9 (E), FIG. 9 (F)), the center position 5c (or center) of the plated portion 5s so that the variation in the thickness of the magnetic alloy plating is within the allowable range of the entire plated portion 5s. The positions 5c1, 5c2) and the center position 10c of the anode 10 (or the center positions 10c1, 10c2) have only to coincide with each other within a predetermined permissible value regarding the center position.

  Similarly, the length 5l of the portion to be plated 5s may be slightly longer than the length 10l of the output portion 10s, or they may completely match, and the length 5l of the portion to be plated 5s is equal to the length of the output portion 10s. The length 5l (or lengths 5l1, 5l2) of the portion to be plated 5s may be slightly shorter than the length 10l so that the variation in the thickness of the magnetic alloy plating is within the allowable range of the entire portion to be plated 5s. ) And the length 10 l (or length 10 l 1, 10 l 2) of the output portion 10 s of the anode 10 only have to coincide with each other within a predetermined allowable value regarding the length.

  FIGS. 10A to 10H show another explanatory diagram when the center position 5c of the portion to be plated 5s and the center position 10c of the output portion 10s are substantially matched. FIG. 10C shows the variation in the iron composition or the ratio of iron in, for example, Ni—Fe alloy plating when the center position 5c of the portion to be plated 5s and the center position 10c of the output portion 10s completely coincide. Further, a range indicated by two dotted lines in FIG. 10C is an allowable range regarding the iron composition defined by the specification. The center position 10c in FIGS. 10A to 10H corresponds to the center position 10c in FIGS. 9A to 9H, and the center position 10c in FIG. 10A is the highest. The center position 10c in FIG. 10H is the lowest. In each of FIGS. 10 (B) to 10 (F), all of the iron compositions at the six positions fall within the allowable range, while each of FIGS. 10 (A), 10 (G) to 10 (H). In this case, all of the iron compositions at the six positions do not fall within the allowable range.

  It is preferable to consider not only the film thickness but also the iron composition, and the center position 5c (or center) of the portion to be plated 5s so that the variation of each component of the magnetic alloy plating is within the allowable range of the entire portion to be plated 5s. The positions 5c1 and 5c2) and the center position 10c of the anode 10 (or the center positions 10c1 and 10c2) can coincide with each other within a predetermined allowable value regarding the center position (FIGS. 10B to 10F). FIG. 9B to FIG. 9F). Similarly, in consideration of not only the film thickness but also the iron composition, the length 5l (or length 5l1, 5l2) of the portion to be plated 5s and the length 10l (or length 10l1, 10l2) of the output portion 10s of the anode 10 are considered. ) Preferably match within a predetermined tolerance for length.

  The present invention is not limited to the above-described exemplary embodiments, and those skilled in the art can easily change the above-described exemplary embodiments to the technical scope included in the claims.

  DESCRIPTION OF SYMBOLS 0 ... Origin, 1 ... Plating apparatus, 2 ... Plating solution, 3 ... Plating tank, 5 ... Shaft member, 5c ... Center position of to-be-plated part, 5l ... Length of the portion to be plated, 5 s... Plated portion, 6... Rotating means, 9... Plating solution ejection nozzle, 9 b and 9 f. 10b, 10n, 10f1... Shield fixing tool, 10c... Center position of output part, 10l... Output part length, 10f2. 10 s... Output part, 13, 15... Shielding jigs at both ends, 14... Shielding jig provided between the shielding jigs at both ends, 26. ... Center position of plating solution outlet, 27 ... Metal bowl, 28 ... Metal pellet.

Claims (8)

A plating apparatus having a plating tank for storing a plating solution, and performing magnetic alloy plating on the shaft-shaped member using the shaft-shaped member immersed in the plating solution as a cathode;
A plurality of shielding jigs mounted on an outer peripheral surface of the shaft-shaped member and defining a portion to be plated of the shaft-shaped member;
An anode provided around the shaft-like member and having an output portion facing the plated portion;
With
In the axial direction of the shaft-like member, the plating apparatus is characterized in that a center position of the plated portion and a center position of the output portion coincide with each other within a predetermined allowable value related to the center position.   2. The plating apparatus according to claim 1, wherein in the axial direction of the shaft-shaped member, the length of the portion to be plated and the length of the output portion of the anode coincide with each other within a predetermined allowable value related to the length.   The plating apparatus according to claim 1, further comprising a shield provided between the anode and the shaft-like member.   The pattern of the shielding object defines a pattern of the output portion of the anode, and the pattern of the shielding object is determined so that a variation in thickness of the magnetic alloy plating is within an allowable range. 4. The plating apparatus according to 3.   The plating apparatus according to claim 3 or 4, wherein the shield is an assembly type that can be attached to and detached from the anode.   The plating apparatus further includes a plating solution ejection nozzle having a plating solution ejection port facing the portion to be plated, and the plating solution ejection nozzle is an assembly type that can be attached to and detached from the plating tank. The plating apparatus according to any one of 1 to 5.   The plating apparatus according to claim 6, wherein in the axial direction of the shaft-shaped member, a center position of the plated portion and a center position of the plating solution jet outlet coincide with each other within a predetermined allowable value regarding the center position.   The plating according to claim 7, wherein in the axial direction of the shaft-shaped member, the length of the portion to be plated and the length of the plating solution jet outlet coincide with each other within a predetermined allowable value related to the length. apparatus.

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