JPH11348073A - Resin molded body with incorporated electronic module and molding method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding method of a resin molded body with an incorporated electronic module which is free of a positional slippage or impairment of the electronic module at the time of molding and of warpage of a card due to a residual stress and which endures an environment of 100 deg.C without deformation and enables execution of four-or-more-shot molding by one shot, and the resin molded body with the incorporated electronic module, a thin-wall IC card or IC tag in particular, obtained by the method. SOLUTION: In a molding method of a resin molded body with an electronic module incorporated in a resin base, a film is laid on the inner surface of a cavity at least on one side of a mold, the electronic module is set at a prescribed position inside the mold and polybutylene terephthalate resin or polybutylene terephthalate copolymer resin of which the melt index is 80-200 is injected into the mold cavity so that the electronic module be molded integrally with the resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a resin molded article with a built-in electronic module in which an electronic module is built in a resin substrate using a polybutylene terephthalate resin having a melt index of 80 to 200 or a copolymer resin thereof. And a resin molded product with a built-in electronic module obtained thereby, particularly an IC card or an IC tag.

[0002]

2. Description of the Related Art Hereinafter, an IC card will be described as an example of a resin molded body with a built-in electronic module. An IC card includes an electronic module (memory IC, CP) in a resin base of the card.
U, and other components such as semiconductor chips, wiring, antennas, etc. are assembled on a printed circuit board and sealed with resin to form one chip). It has a remarkably large storage capacity and advanced computer functions.

FIG. 2 is a cross-sectional view of a mold and a molded IC card at the time of molding a conventional IC card.
In FIG. 2, an IC card (1) has an IC card base (2) and an electronic module (3) built therein, and (4) and (5) are provided on the outer surface of the IC card base (2). It is a laminated film. Conventionally, a mold cavity (1
Resin films (4) on both inner surfaces of 3) and (14),
After setting (5), the molten resin is injected into a narrow space of 0.3 to 0.9 mm in the mold cavities (13) and (14) to form the IC card base (2). At this time, in the case of a multi-cavity mold having four or more molds, the end of the IC card base (2) is connected through the resin inlet (16).
It is necessary to fill the molten resin up to the bending of the electronic module (3), so that the flow distance of the molten resin becomes longer, and in addition, the filling of the narrow gap portion, the bent portion, and the like with the resin is completely and stable. ABS and PET
Such a resin has insufficient fluidity and causes a problem that the resin is not completely filled. To compensate for this, the injection pressure of the molding machine is increased. However, since an electronic module is mounted on the inner surface of the film, application of excessive pressure will cause displacement or damage of the electronic module. In addition, residual stress is generated in the resin due to excessive pressure, and a problem such as warpage of the card occurs. Therefore, it is possible to operate stably up to two pieces per one shot, and if four or more pieces are taken, non-standard products increase. In addition, when a card is used, it is required that the card be resistant to an environment of 100 ° C. and not be deformed in consideration of the inside of a car such as a car in the middle of summer. However, the conventionally used PVC resin and filler-containing PVC resin have a problem of deformation at a high temperature, and the ABS resin has a problem of deformation when exposed to this temperature for a long time. Thus, an appropriate molding method capable of taking four or more pieces has not been known.

[0004]

There is no displacement or damage of the electronic module during molding, no warp deformation of the card due to residual stress, no endurance to 100 ° C. environment, and no deformation of four cards per shot. Method for molding resin molded body with built-in electronic module capable of performing the above steps and resin molded body with built-in electronic module obtained by the method, especially thin IC
To provide a card or IC tag.

[0005]

Means for Solving the Problems As a result of intensive studies, the present inventors have found that such a problem can be solved by using a polybutylene terephthalate resin having a melt index of 80 to 200 or a copolymer resin thereof. This led to the completion of the present invention.

That is, the first aspect of the present invention is a method for molding a resin molded article having an electronic module built in a resin substrate, wherein a film is laid on at least one side of a cavity inside a mold, and a predetermined position in the mold is formed. The electronic module is placed in the mold cavity, and the melt index in the mold cavity is 80 to 2
The present invention provides a method for molding a resin molded article with a built-in electronic module, characterized by injecting the polybutylene terephthalate resin or the polybutylene terephthalate copolymer resin of No. 00 and integrally molding the electronic module with the resin.
A second aspect of the present invention is the resin molded article with a built-in electronic module according to the first aspect of the present invention, wherein the integral molding is performed by injection compression molding in which a part of or the whole of a mold or a mold cavity is moved after injecting the resin. The present invention provides a molding method A third aspect of the present invention provides the method for molding a resin molded article with a built-in electronic module according to the first or second aspect of the present invention, wherein the electronic module is fixed to one surface of a film in advance. A fourth aspect of the present invention is:
The method for molding a resin molded article with a built-in electronic module according to any one of the first to third aspects of the present invention, wherein the resin molded article with a built-in electronic module is obtained by using a mold obtained by molding four or more pieces by injection molding of one shot. I do. A fifth aspect of the present invention provides a resin molded article with a built-in electronic module obtained by any one of the first to fourth aspects of the present invention. A sixth aspect of the present invention provides the electronic module-containing resin molded product according to the fifth aspect, wherein the electronic module-containing resin molded product is an IC card or an IC tag.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method for molding a resin molded article with a built-in electronic module according to the present invention will be described in detail by way of an example of a method for molding an IC card. FIG. 1 is a diagram showing a molding example of a multi-cavity (four or more obtained by one-shot injection molding) IC card according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a mold and a molded IC card at the time of molding an IC card according to the prior art. As an example of the molding method of the present invention, one part of the IC card is illustrated for simplicity. 2 can be explained. FIG. 2 shows an example in which one electronic module is incorporated in one IC card for simplicity, but a plurality of electronic modules may be incorporated.

In FIG. 2, an upper mold (11) and a lower mold (12) have concave upper mold cavities (13) and lower mold cavities (14) at their central portions, respectively. When the two dies are matched, a space having the same shape as that of the IC card (1) is formed by the two cavities (13) and (14). Films (4) and (5) are laid on the inner surfaces of the upper mold cavity (13) and the lower mold cavity (14), and the electronic module (3) is placed on the film (5). The upper die (11) and / or the lower die (12) are provided with holes (17) for attaching and detaching the film (4) and (5) or the electronic module (3) where they are placed. The holes for suction and desorption are connected to a vacuum pump (not shown), and when the resin is injected by suction, the films (4) and (5) or the electronic module (3) are in a predetermined position. Do not shift from the position. The resin (6) for molding the card base (2) is injected from the injection molding machine (15) into the mold cavity via the injection port (16). In this case, the card base (2)
IC card (1) in which an electronic module (3) is built in, and films (4) and (5) are laminated
Are integrally formed. After cooling, compressed air is blown through the suction / detachment hole (17) to form a molded body in which four IC cards (1) integrally molded from a mold are connected (corresponding to multi-cavity in FIG. 1). Is taken out and cut off to obtain four IC cards (1). An example of the injection compression molding can be similarly described with reference to FIG. Before injecting the resin, a part (13a) of the cavity forming the upper mold cavity (13) is moved to prepare a space larger than a desired thickness, and after the resin is injected into the space, the cavity of the mold is removed. By moving a part (13a) of the cavity so as to reduce the size, the molded body is integrally molded to have a desired thickness. According to this method, even when an electronic module having a large thickness is integrally molded, an integrally molded article free from defective filling can be obtained.

In the present invention, the electronic module (3), which is previously fixed at a predetermined position on the film (5) by adhesion or fusion, for example, is used as the lower mold cavity (12).
May be laid at a predetermined position in the inside. In this case, an IC card (4) on which a film (5) containing an electronic module is laminated is integrally formed. Alternatively, a mold having a cavity in only one of the upper mold and the lower mold may be used. Instead of providing a film for each cavity in advance, it is also possible to provide one or several films in a cavity in which a large number of films are arranged.

In the present invention, the electronic module (3) is directly placed at a predetermined position in the lower mold cavity (12) without laying a film on the inner surface of the mold cavity, and resin is injected. After molding the card base (2) in which the electronic module is built, a film may be laminated on one side and / or both sides of the card base (2).

The resin for injection molding is preferably a polybutylene terephthalate (PBT) resin or a polybutylene terephthalate copolymer resin. However, simply having good fluidity is not enough, so that when a force is applied during molding or during use of the IC card, it is not deformed.
Since mechanical strength is required, the range of the molecular weight distribution is limited. Particularly, the melt index (MI: extrusion amount of resin for 10 minutes from a nozzle having a diameter of 2.095 mm when a load of 2.16 kg is applied at 235 ° C. for 10 minutes) of 80 to 200 polybutylene terephthalate resin or polybutylene terephthalate is used. Polymer resins are preferred. As polybutylene terephthalate copolymer resin, terephthalic acid,
And, if necessary, isophthalic acid, an aromatic dicarboxylic acid such as 2,6-naphthalenedicarboxylic acid, and 1,4-butanediol as a glycol component, and if necessary, ethylene glycol, diethylene glycol,
Copolymer resins composed of diols such as 1,3-propanediol, 1,6-hexanediol, and 1,4-cyclohexanedimethanol are exemplified. By using such a resin, the flow is good and the mounted IC
It is possible to stably fill a multi-cavity mold without causing displacement of an electronic module including a chip, an antenna and the like, and without causing deformation due to residual stress of a molding resin. In particular, when using an electronic module fixed on a film, it is preferable to use such a resin. This resin has no problem even in the environment of 100 ° C. described above. Therefore, by using a polybutylene terephthalate resin having a melt index of 80 to 200 or a copolymer thereof, deformation during molding does not occur, multi-cavity stable molding can be performed, and heat resistance and mechanical strength of a molded product can be satisfied. .

Actually, one die can form, for example, four IC cards in one shot. In contrast to the conventional method, which has a limit of at most two-cavity, the present invention can perform three-to-36-cavity, preferably four-to-sixteen-cavity.

As the film for laminating the film on one or both sides of the card substrate, any suitable film can be used. For example, polybutylene terephthalate resin, polybutylene terephthalate copolymer resin, polyethylene terephthalate (PET) ) Resin, polyethylene terephthalate copolymer resin, polybutylene naphthalate (PBN) resin or polybutylene naphthalate copolymer resin, polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene resin (ABS),
Examples include polycarbonate (PC), various nylons, polyimides, polyethersulfone, polyetherketone, polyetheretherketone, polyarylate, and the like. When the film is fused to the printed board of the electronic module, a resin that is easily fused to the printed board is preferable. In the case of using a film in which an electronic module is fixed on a film, the film can be made of the same resin as that of the card substrate, and a polybutylene terephthalate resin or polybutylene terephthalate, which is the same type of resin as the card base. Resins containing polymer resins, such as P
BT alone or a mixed resin of ABS and PBT can also be used. In this case, the melt index of the resin constituting the film is not particularly limited.

Although the present invention has been described using an IC card as an example, the present invention can be used not only for an IC card but also when an electronic module is integrally formed with a resin such as an IC tag.

[0015]

EXAMPLES The present invention will now be described specifically with reference to examples, but the present invention is not limited to these examples.

[Examples 1 and 2 and Comparative Examples 1 to 3] Injection molding machine, 4-piece mold, resin for incorporating electronic module of the type shown in Table 1, electronic module for IC card (length 5 m)
m × width 5 mm × thickness 0.2 mm) Two films of the type shown in Table 1 having a thickness of 0.1 mm were laid in the upper and lower mold cavities, and the resin was injected at 220 ° C. and 90 kgf / cm ^2. An IC card was formed. Table 1 shows the results.

[0017]

[Table 1]

[0018]

According to the present invention, it is possible to injection-mold a resin molded body with a built-in electronic module such as an IC card in four shots or more by one shot, and the electronic module is displaced or damaged during molding. A method for molding a resin molded article with a built-in electronic module, which does not cause warpage of the card due to residual stress at the time of molding and does not deform withstand an environment of 100 ° C. × 24 hours, and a resin molded article with a built-in electronic module obtained by the method. Particularly, a thin IC card can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a molding example of a multi-cavity IC card according to an example of the present invention.

FIG. 2 is a cross-sectional view of a mold and a molded IC card at the time of molding an IC card according to a conventional technique.

[Description of Signs] 1 IC card 2 Card base 3 Electronic module 4 Film 5 Film 6 Resin 11 Upper mold 12 Lower mold 13 Upper mold cavity 13a Part of mold cavity 14 Lower mold cavity 15 Injection molding machine 16 Inlet 17 Adsorption hole

Claims (6)

[Claims] 1. A method of molding a resin molded body having an electronic module built in a resin substrate, wherein a film is laid on at least one inner surface of a cavity of a mold, and the electronic module is placed at a predetermined position in the mold. And injecting a polybutylene terephthalate resin or a polybutylene terephthalate copolymer resin having a melt index of 80 to 200 into a mold cavity, and integrally molding the electronic module with the resin. Body molding method. 2. The method of molding a resin molded article with a built-in electronic module according to claim 1, wherein the integral molding is performed by injection compression molding in which a part of or the whole of a mold or a mold cavity is moved after injecting the resin. 3. The method according to claim 1, wherein the electronic module is fixed to one surface of the film in advance. 4. The molding of a resin molded article with a built-in electronic module according to claim 1, wherein the resin molded article with a built-in electronic module is obtained by using a mold obtained by molding four or more pieces by one-shot injection molding. Method. 5. A resin molded article with a built-in electronic module obtained according to claim 1. 6. The resin molded article with a built-in electronic module according to claim 5, wherein the resin molded article with a built-in electronic module is an IC card or an IC tag.