JPH0635139B2 - Method for manufacturing resin molded body - Google Patents
Method for manufacturing resin molded bodyInfo
- Publication number
- JPH0635139B2 JPH0635139B2 JP60064475A JP6447585A JPH0635139B2 JP H0635139 B2 JPH0635139 B2 JP H0635139B2 JP 60064475 A JP60064475 A JP 60064475A JP 6447585 A JP6447585 A JP 6447585A JP H0635139 B2 JPH0635139 B2 JP H0635139B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- card
- base
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 45
- 239000011347 resin Substances 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 238000000034 method Methods 0.000 title description 7
- 239000000758 substrate Substances 0.000 claims description 32
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 2
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、樹脂基体の一面に基板を有してなる樹脂成
形体の製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for producing a resin molded product having a substrate on one surface of a resin base.
以下、樹脂成形体としてＩＣカードを例にとり説明す
る。ここでＩＣカードとは、従来の磁気ストライプ付の
キャッシュカード等に代わって用いられるものであり、
カードの基体内にメモリＩＣやＣＰＵその他の半導体片
を内蔵し、従来の磁気ストライプ付カードに比べて数桁
以上の大容量の記憶能力を持たせることができるほか、
任意の演算機能を持たせることができるものである。Hereinafter, an IC card will be described as an example of the resin molded body. Here, the IC card is used in place of the conventional cash card with a magnetic stripe or the like,
In addition to having a memory IC, CPU, or other semiconductor chip built into the base of the card, it can have a large-capacity storage capacity of several digits or more compared to conventional cards with magnetic stripes.
It is possible to have an arbitrary calculation function.
第５図はこのようなＩＣカードの断面構成図であり、図
において、６は塩化ビニール等の樹脂を成形してなるカ
ード基体、２ａ，２ｂはこのカード基体６の両面に配設
されたプリント基板（以下ＰＣＢと記す）、１０はＰＣ
Ｂ２ａ，２ｂ上に固着されたＩＣモジュールであり、こ
れはメモリＩＣ及びＣＰＵ等のＩＣチップ１，配線３，
及び上記ＩＣチップ１と配線３とを樹脂封止するプリコ
ート部４からなっている。以下、このＩＣモジュール１
０とこれが固着されたＰＣＢ２ａ，２ｂとをＩＣモジュ
ール付ＰＣＢ２ａ，２ｂと記す。５ａ，５ｂはこのＰＣ
Ｂ２ａ，２ｂの外表面に形成されたラミネートフィルム
である。FIG. 5 is a cross-sectional configuration diagram of such an IC card. In FIG. 5, 6 is a card base formed by molding resin such as vinyl chloride, and 2a and 2b are prints arranged on both sides of the card base 6. Substrate (hereinafter referred to as PCB), 10 is a PC
An IC module fixed on B2a, 2b, which is an IC chip such as a memory IC and a CPU 1, a wiring 3,
And a precoat portion 4 for sealing the IC chip 1 and the wiring 3 with resin. Below, this IC module 1
0 and the PCBs 2a and 2b to which they are fixed are referred to as PCBs 2a and 2b with an IC module. 5a and 5b are this PC
It is a laminated film formed on the outer surfaces of B2a and 2b.
次に上記ＩＣカードの従来の製造方法を第６図に従って
説明する。まず第６図(a)で示すように、ＰＣＢ２ａ，
２ｂにＩＣチップ１等を実装し、これらのエポキシ樹脂
等でプリコートしてＩＣモジュール１０を形成する。一
方第６図(b)に示すように、その両面に上記ＩＣモジュ
ール１０の収納される凹部６ａ，６ｂを有するカード基
体６を射出成形により形成する。そしてこのカード基体
６の凹部６ａ，６ｂにＩＣモジュール１０をはめ込むよ
うにしてＰＣＢ２ａ，２ｂを該基体６の両面に接着し、
第５図に示すようなＩＣカードを形成する。Next, a conventional method of manufacturing the above IC card will be described with reference to FIG. First, as shown in FIG. 6 (a), the PCB 2a,
The IC chip 1 or the like is mounted on 2b and precoated with an epoxy resin or the like to form the IC module 10. On the other hand, as shown in FIG. 6 (b), a card base 6 having recesses 6a and 6b for accommodating the IC module 10 on both sides thereof is formed by injection molding. Then, the IC modules 10 are fitted into the recesses 6a and 6b of the card base 6 to bond the PCBs 2a and 2b to both sides of the base 6,
An IC card as shown in FIG. 5 is formed.
しかるに、上記のような従来のＩＣカードの製造方法で
は、両者の嵌合部分に隙間が生じないように、また表面
に凹凸が生じないように、ＩＣモジュール１０と基体６
のそれぞれを高精度に仕上げる必要があり、その製造は
困難である。特に、ＩＣモジュール１０のプリコート部
４を所望の形状に製造することは非常に困難であり、従
って従来の製造方法では精度の良いＩＣカードを得るこ
とができないという問題があった。However, in the conventional method for manufacturing an IC card as described above, the IC module 10 and the base member 6 are so arranged that no gap is formed in the fitting portion between them and no unevenness is generated on the surface.
Each of these must be finished with high precision, and their manufacture is difficult. In particular, it is very difficult to manufacture the precoat portion 4 of the IC module 10 into a desired shape, and therefore, there is a problem that an accurate IC card cannot be obtained by the conventional manufacturing method.
さらに従来の製造方法では、ＩＣモジュール付ＰＣＢ２
ａ，２ｂとカード基体６とを粘着シートにより接着する
ようにしており、その接着強度は低く、耐久性にも乏し
い。また両者を接着した際、その嵌合部分に隙間が生じ
ると、そこから水等が浸入して接着部分が剥離すること
があり、カードの信頼性が低いという問題があった。Furthermore, in the conventional manufacturing method, the PCB 2 with an IC module is used.
A and 2b and the card base 6 are adhered to each other with an adhesive sheet, and the adhesive strength is low and the durability is poor. Further, when the both are bonded, if a gap is created in the fitting portion, water or the like may enter from there and the bonded portion may be peeled off, resulting in a problem that the reliability of the card is low.
この発明は、かかる点に鑑みてなされたもので、ＩＣカ
ード等の樹脂成形体の製造が従来に比し非常に容易にな
るとともに、信頼性の高い樹脂成形体を得ることのでき
る樹脂成形体の製造方法を提供することを目的としてい
る。The present invention has been made in view of the above points, and it is much easier to manufacture a resin molded product such as an IC card than in the past, and a resin molded product that is highly reliable can be obtained. It is intended to provide a manufacturing method of.
この発明に係る樹脂成形体の製造方法は、型合わせを行
なった時に互いの凹部により形成される空間が平板状に
なりかつ該凹部底面の基板載置部が互いに平行になる第
１，第２の金型に、少なくとも一方に電子部品が実装さ
れた第１，第２の基板を、該電子部品の実装面が対向す
る基板側に向くように載置するとともに、上記第１，第
２の金型の空間内に樹脂を射出して上記第１，第２の基
板と一体成形された樹脂基体を形成し、その際該樹脂基
体に上記基板との抜止め部を形成するようにしたもので
ある。In the method for manufacturing a resin molded body according to the present invention, the spaces formed by the recesses are flat when the molds are aligned, and the substrate mounting portions on the bottom surfaces of the recesses are parallel to each other. The first and second substrates having electronic components mounted on at least one of them are placed on the mold of (1) so that the mounting surfaces of the electronic components face the facing substrate side, and the first and second substrates are mounted. Resin is injected into the space of the mold to form a resin base integrally formed with the first and second substrates, and at this time, a retaining portion for the base is formed on the resin base. Is.
この発明においては、上述のように、樹脂基体を射出成
形する際、型合わせを行なった時に互いの凹部により形
成される空間が平板状になりかつ該凹部底面の基板載置
部が互いに平行になる第１，第２の金型内に基板を互い
に平行に配置しているので、該基板が一体成形されて板
状の部材とするのに樹脂基体と基板とを接着する工程が
不要となり、従来のように両者の嵌合部の形状寸法を高
精度に仕上げる必要がなくなり、さらにその際樹脂基体
に抜け止め部が同時に形成され、該抜け止め部により基
体と基板との接着強度が著しく大きくなる樹脂成形体の
製造方法が提供される。In the present invention, as described above, when injection molding a resin substrate, the spaces formed by the recesses are flat when the molds are aligned, and the substrate mounting portions on the bottoms of the recesses are parallel to each other. Since the substrates are arranged in parallel with each other in the first and second molds, the step of adhering the resin base and the substrate is not necessary to form the substrate integrally into a plate-shaped member. It is no longer necessary to finish the shape and dimension of the fitting part of both with high precision as in the conventional case, and at the same time, the retaining part is formed on the resin base at the same time, and the retaining part significantly increases the adhesive strength between the base and the substrate. There is provided a method for producing the resin molded body.
以下、本発明の実施例を図について説明する。第１図は
本発明の一実施例による樹脂成形体の製造方法を示す図
であり、本実施例方法は、基体両面にプリント基板を有
してなるＩＣカードの製造において、カード基体を射出
成形する際に、その金型内にＩＣモジュール付ＰＣＢを
設置しておき、該ＰＣＢを一体成形するとともに、基体
に抜止め部を形成するようにしたものである。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, a card base is injection-molded in the manufacture of an IC card having printed boards on both sides of the base. At this time, the PCB with the IC module is set in the mold, the PCB is integrally molded, and the retaining portion is formed on the base.
ここで、本実施例の製造方法を実現するための装置につ
いて、第１図を用いて簡単に説明する。第１図(a)にお
いて、１１，１２はそれぞれ凹部１１ａ，１２ａが形成
された上金型，下金型であり、該両金型１１，１２を型
合わせしたとき、その両凹部１１ａ，１２ａによりカー
ド基体１３（第１図(b)参照）と同形状の空間が形成さ
れるようになっている。そして上記両金型１１，１２に
は、ＰＣＢ吸着用の孔１１ｂ，１２ｂが複数個設けられ
ており、この吸着用孔１１ｂ，１２ｂは真空ポンプ（図
示せず）に接続されている。なお、１４はカード基体成
形用の樹脂が注入される注入口である。Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly described with reference to FIG. In FIG. 1 (a), reference numerals 11 and 12 denote an upper mold and a lower mold, respectively, in which recesses 11a and 12a are formed. When the molds 11 and 12 are matched, the recesses 11a and 12a are formed. As a result, a space having the same shape as the card base 13 (see FIG. 1 (b)) is formed. The molds 11 and 12 are provided with a plurality of PCB adsorption holes 11b and 12b, and the adsorption holes 11b and 12b are connected to a vacuum pump (not shown). Reference numeral 14 is an injection port through which a resin for molding a card base is injected.
次に本実施例のＩＣカードの製造方法を第１図(a)〜(c)
に従ってより詳細に説明する。Next, a method of manufacturing the IC card of this embodiment will be described with reference to FIGS. 1 (a) to (c).
Will be described in more detail.
まず、第１図(a)に示すように、その上にＩＣチップ等
が樹脂封止されたＩＣモジュール付ＰＣＢ２１，２２
を、それぞれ上金型１１，下金型１２に設置し、真空ポ
ンプを作動させて吸着用孔１１ｂ，１２ｂにより上記Ｉ
Ｃモジュール付ＰＣＢ２１，２２を吸引固定する。ここ
で、第２図で詳細に示すように、ＰＣＢ２１，２２の両
端部２１ａ，２２ａは逆テーパー状にアンダーカットさ
れている。この状態で第１図(b)に示すように上金型１
１と下金型１２とを型合わせし、図示しないプランジャ
により樹脂を注入口１４から型内に射出して該樹脂によ
りＩＣモジュール１０付ＰＣＢ２１，２２を一体成形す
る。つまり、ＩＣモジュール付ＰＣＢ２１，２２とカー
ド基体１３とが１ショットで一体成形される。このと
き、上記樹脂はＰＣＢ２１，２２の両端部２１ａ，２２
ａのアンダーカット部にも充填され、これによりＰＣＢ
２１，２２の抜けを防止するための抜止め部１３ａ，１
３ｂが形成される。First, as shown in FIG. 1 (a), PCBs 21 and 22 with IC modules on which IC chips and the like are resin-sealed
Are installed in the upper mold 11 and the lower mold 12, respectively, and the vacuum pump is operated to operate the above-mentioned I through the suction holes 11b and 12b.
The PCBs 21 and 22 with the C module are fixed by suction. Here, as shown in detail in FIG. 2, both ends 21a and 22a of the PCBs 21 and 22 are undercut in a reverse taper shape. In this state, as shown in Fig. 1 (b), the upper die 1
1 and the lower mold 12 are matched with each other, and a resin (not shown) is used to inject a resin into the mold from the injection port 14 to integrally mold the PCBs 21 and 22 with the IC module 10 by the resin. That is, the IC module-attached PCBs 21 and 22 and the card base 13 are integrally molded in one shot. At this time, the resin is applied to both end portions 21a and 22 of the PCBs 21 and 22.
It is also filled in the undercut part of a.
The retaining portions 13a, 1 for preventing the detachment of the 21, 22
3b is formed.
そして所定時間後に型を分離して上記一体成形されたカ
ード基体１３を取り出す。次に必要に応じて該カード基
体１３の両面に第１図(c)に示すように化粧用のラミネ
ートフィルム５ａ，５ｂを貼付する。After a predetermined time, the mold is separated and the integrally molded card base 13 is taken out. Next, as required, laminate films 5a and 5b for makeup are attached to both surfaces of the card base 13 as shown in FIG. 1 (c).
このような本実施例によれば、ＰＣＢ２１，２２を金型
内にセットし、射出成形で１ショットでカード化するよ
うにしたので、従来の製造方法におけるＰＣＢとカード
基体との接着工程を省略することができる。またこのよ
うな一体成形によれば、ＩＣモジュール１０に寸法誤差
があってもこれを樹脂によりカバーでき、従って従来の
ようにＩＣモジュール１０とカード基体１３（金型）の
各々の寸法を高精度にする必要は全くなく、ただＩＣモ
ジュール１０がカード基体１３の厚み以内となるように
管理するだけでよい。特にＩＣモジュール１０のプリコ
ート部４の寸法に精度が不要なので、その製造は従来に
比し著しく容易となり、大幅なコストダウンを図ること
ができる。According to the present embodiment as described above, the PCBs 21 and 22 are set in the mold, and injection molding is used to form a card in one shot. Therefore, the step of bonding the PCB and the card base in the conventional manufacturing method is omitted. can do. Further, according to such integral molding, even if there is a dimensional error in the IC module 10, it can be covered with resin, and therefore, as in the conventional case, the dimensions of the IC module 10 and the card base 13 (mold) can be accurately adjusted. The IC module 10 need only be managed so as to be within the thickness of the card base 13. Especially, since the dimensions of the precoat portion 4 of the IC module 10 are not required to be accurate, the manufacture thereof is significantly easier than the conventional one, and a significant cost reduction can be achieved.
また、本実施例ではＰＣＢ２１，２２の両端にアンダー
カット部を設け、この部分に樹脂を充填して抜止め部１
３ａ，１３ｂを形成したので、従来に比し接着強度は著
しく大となり、耐久性も向上し、カードの信頼性は著し
く向上する。In addition, in this embodiment, undercut portions are provided at both ends of the PCBs 21 and 22, and the portions are filled with resin to prevent the retaining portion 1.
Since 3a and 13b are formed, the adhesive strength is remarkably higher than the conventional one, the durability is also improved, and the reliability of the card is remarkably improved.
さらに、従来装置ではＩＣモジュール１０，ＰＣＢ２
１，２２の形状が異なれば、それに応じてカード基体１
３の形状、即ち金型を変更する必要があったが、本実施
例ではＩＣカード全体の形状が変更されない限り全ての
共通の金型で製造することができる。Furthermore, in the conventional device, the IC module 10 and the PCB 2
If the shapes of 1 and 22 are different, the card base 1
Although it was necessary to change the shape of No. 3, that is, the mold, in this embodiment, all common molds can be used unless the shape of the entire IC card is changed.
第３図は本発明の第２の実施例を示し、これは上，下の
金型（図では下金型のみを示している）のＰＣＢ載置部
の側部に抜け止め用の凹部１２ｃを設け、カード基体成
形時にこの凹部１２ｃに樹脂を埋めて抜止め部１３ｂ′
を形成したものである。他の構成は上記第１図に示した
第１実施例と同様であり、このような実施例によっても
上記実施例と同様の効果が得られる。FIG. 3 shows a second embodiment of the present invention, in which recesses 12c are provided on the sides of the PCB mounting portions of the upper and lower molds (only the lower mold is shown in the drawing) to prevent slippage. And a resin is filled in the concave portion 12c at the time of molding the card substrate to prevent the retaining portion 13b '.
Is formed. The other structure is the same as that of the first embodiment shown in FIG. 1, and the same effect as the above embodiment can be obtained by such an embodiment.
また第４図は本発明の第３の実施例を示し、これはＰＣ
Ｂ２１，２２に複数のテーパ穴２２ｂを形成し、カード
基体１３成形時にこのテーパ穴２２ｂに樹脂を埋めて抜
止め部１３″を形成したものである。このテーパ穴２２
ｂとしては、射出成形条件によっても異なるが、径が
０．３ｍｍ以上のテーパ穴にしておけば充分樹脂は入り
込み、これにより上記実施例と同様に基体１３と基板の
接着強度は著しく大きくなる。FIG. 4 shows a third embodiment of the present invention, which is a PC
A plurality of taper holes 22b are formed in B21 and B22, and resin is filled in the taper hole 22b when the card base 13 is molded to form the retaining portion 13 ".
Although b depends on the injection molding conditions, if a taper hole having a diameter of 0.3 mm or more is used, resin can sufficiently enter, and as a result, the adhesive strength between the base body 13 and the substrate can be remarkably increased as in the above embodiment.
なお、上記各実施例ではカード基体の両面にＰＣＢを設
けるようにしたが、これは片面だけに、また片面の一部
のみにＰＣＢを有してなるＩＣカードにも適用できるの
は勿論である。Although the PCBs are provided on both sides of the card base in each of the above-described embodiments, it is needless to say that this is applicable to an IC card having a PCB on only one side or only a part of one side. .
また、上記実施例では本発明をＩＣカードの製造方法に
適用した場合について説明したが、本発明は樹脂基体に
基板を有してなる樹脂成形体の製造方法の全てに適用で
きるものである。Further, although the case where the present invention is applied to the method for manufacturing an IC card has been described in the above embodiments, the present invention can be applied to all the methods for manufacturing a resin molded body having a substrate on a resin base.
以上のように、この発明に係る樹脂成形体の製造方法に
よれば、型合わせを行なった時に互いの凹部により形成
される空間が平板状になりかつ該凹部底面の基板載置部
が互いに平行になる第１，第２の金型に、少なくとも一
方に電子部品が実装された第１，第２の基板を、該電子
部品の実装面が対向する基板側に向くように載置すると
ともに、上記第１，第２の金型の空間内に樹脂を射出し
て上記第１，第２の基板と一体成形された樹脂基体を形
成し、その際該樹脂基体に上記基板との抜止め部を形成
するようにしたので、互いに平行な基板間に射出樹脂が
一体に成形された構造の樹脂成形体の製造が従来に比し
非常に容易となり、しかも基体と基板との接着強度が著
しく大きくなり、樹脂成形体の信頼性を大きく向上でき
る製造方法が得られる効果がある。As described above, according to the method for manufacturing a resin molded product according to the present invention, the spaces formed by the recesses are flat when the molds are aligned, and the substrate mounting portions on the bottoms of the recesses are parallel to each other. In the first and second molds, the first and second substrates having electronic components mounted on at least one side are placed so that the mounting surfaces of the electronic components face the opposing substrate side, A resin is injected into the space of the first and second molds to form a resin base integrally formed with the first and second substrates, and at this time, the resin base is prevented from coming off from the substrate. As a result, it becomes much easier than before to manufacture a resin molded product in which the injection resin is integrally molded between parallel substrates, and the bonding strength between the base and the substrate is extremely large. Therefore, a manufacturing method that can greatly improve the reliability of the resin molding was obtained. There is that effect.
第１図(a)ないし(c)は本発明の一実施例によるＩＣカー
ドの製造方法を説明するための図、第２図はその製造工
程途中のＰＣＢ及び基体の一部拡大図、第３図及び第４
図は本発明の他の実施例を示す図、第５図は一般的な従
来のＩＣカードの断面構成図、第６図(a)，(b)は従来の
ＩＣカードの製造方法を説明するための図である。 １０……ＩＣモジュール、１１……上金型、１２……下
金型、１３……カード基体、１３ａ，１３ｂ，１３
ｂ′，１３ａ″……抜止め部、２１，２２……プリント
基板、２２ｂ……テーパ穴。 なお図中同一符号は同一又は相当部分を示す。1 (a) to 1 (c) are views for explaining a method of manufacturing an IC card according to an embodiment of the present invention, and FIG. 2 is a partially enlarged view of a PCB and a substrate during the manufacturing process, and FIG. Figure and Fourth
FIG. 5 is a diagram showing another embodiment of the present invention, FIG. 5 is a sectional configuration diagram of a general conventional IC card, and FIGS. 6 (a) and 6 (b) are diagrams for explaining a conventional IC card manufacturing method. FIG. 10 ... IC module, 11 ... upper mold, 12 ... lower mold, 13 ... card base, 13a, 13b, 13
b ′, 13a ″ ... Retaining portion, 21, 22 ... Printed circuit board, 22b ... Tapered hole The same reference numerals in the drawings indicate the same or corresponding portions.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 津田 真澄 兵庫県三田市三輪２丁目６番１号 菱電化 成株式会社内 (56)参考文献 特開 昭53−128678（ＪＰ，Ａ) 特開 昭57−38511（ＪＰ，Ａ) 特開 昭48−43454（ＪＰ，Ａ) 特開 昭49−78758（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masumi Tsuda Inventor Masumi Tsuda 2-6-1, Miwa, Mita City, Hyogo Prefecture Ryoden Kasei Co., Ltd. (56) References JP-A-53-128678 (JP, A) JP-A-SHO 57-38511 (JP, A) JP-A-48-43454 (JP, A) JP-A-49-78758 (JP, A)
Claims (4)
形成される空間が平板状になりかつ該凹部底面の基板載
置部が互いに平行になる第１，第２の金型に、少なくと
も一方が電子部品を実装した第１，第２の基板を、該電
子部品の実装面が対向する基板側に向くように載置する
工程と、 上記第１，第２の金型の空間内に樹脂を射出して上記第
１，第２の基板と一体成形された樹脂基体を形成し、そ
の際該樹脂基体に上記基板との抜け止め部を形成する工
程とを含むことを特徴とする樹脂成形体の製造方法。1. At least one of the first and second molds in which the space formed by the recesses when the molds are aligned is flat and the substrate mounting portions on the bottoms of the recesses are parallel to each other. Mounting the first and second substrates on which the electronic components are mounted so that the mounting surfaces of the electronic components face the facing substrate side, and the resin is placed in the spaces of the first and second molds. To form a resin base body integrally molded with the first and second substrates, and at that time, forming a retaining portion with the substrate on the resin base body. Body manufacturing method.
い、上記樹脂により該アンダーカット部の側部空間を埋
めることにより上記抜け止め部を形成することを特徴と
する特許請求の範囲第１項記載の樹脂成形体の製造方
法。2. The removal preventing portion is formed by using a substrate having an end portion undercut, and filling a side space of the undercut portion with the resin. A method for producing the resin molded body described.
け、この凹部を上記樹脂により埋めることにより上記抜
け止め部を形成することを特徴とする特許請求の範囲第
１項記載の樹脂成形体の製造方法。3. The recess according to claim 1, wherein a recess is provided on a side of the substrate mounting portion of the mold, and the recess is formed by filling the recess with the resin. The method for producing a resin molded body according to claim 1.
りこのテーパ穴を埋めることにより上記抜け止め部を形
成することを特徴とする特許請求の範囲第１項記載の樹
脂成形体の製造方法。4. The method for producing a resin molded product according to claim 1, wherein the substrate is provided with a tapered hole, and the retaining hole is formed by filling the tapered hole with the resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60064475A JPH0635139B2 (en) | 1985-03-28 | 1985-03-28 | Method for manufacturing resin molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60064475A JPH0635139B2 (en) | 1985-03-28 | 1985-03-28 | Method for manufacturing resin molded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61222714A JPS61222714A (en) | 1986-10-03 |
| JPH0635139B2 true JPH0635139B2 (en) | 1994-05-11 |
Family
ID=13259290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60064475A Expired - Lifetime JPH0635139B2 (en) | 1985-03-28 | 1985-03-28 | Method for manufacturing resin molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635139B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017170806A (en) * | 2016-03-24 | 2017-09-28 | 古河電気工業株式会社 | Composite body of metallic member and resin mold |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174430U (en) * | 1986-12-08 | 1988-11-11 | ||
| JP2539838B2 (en) * | 1987-07-14 | 1996-10-02 | 三菱電機株式会社 | IC card device |
| JPH0628875B2 (en) * | 1987-07-27 | 1994-04-20 | 株式会社荏原製作所 | Two-step insert molding and method for producing the same |
| AU2309388A (en) * | 1987-08-26 | 1989-03-31 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and method of producing the same |
| JPH03110198A (en) * | 1989-09-22 | 1991-05-10 | Rhythm Watch Co Ltd | Ic module for ic card |
| KR100209259B1 (en) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic card and method for manufacture of the same |
| JP4470818B2 (en) | 2005-06-10 | 2010-06-02 | 住友電装株式会社 | Plastic molded product with metal plate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843454A (en) * | 1971-10-04 | 1973-06-23 | ||
| JPS4978758A (en) * | 1972-12-05 | 1974-07-30 | ||
| JPS53128678A (en) * | 1977-04-16 | 1978-11-09 | Fumitoshi Nishimoto | Composite article and its molding method |
| JPS5738511A (en) * | 1980-08-20 | 1982-03-03 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of producing same |
-
1985
- 1985-03-28 JP JP60064475A patent/JPH0635139B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017170806A (en) * | 2016-03-24 | 2017-09-28 | 古河電気工業株式会社 | Composite body of metallic member and resin mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61222714A (en) | 1986-10-03 |
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| EXPY | Cancellation because of completion of term |