JPH11345784A - Device and method for extending wafer sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily fit an outside ring for extending and retaining a wafer sheet to an inside ring with less force. SOLUTION: At the upper part of an extension stage 11 where a wafer being subjected to full cut dicing and a wafer sheet being applied to the wafer are placed and at the same time an inside ring is mounted to the upper part of an outer periphery in an insertable manner, a double ring holder 1 for retaining an outside ring 15 for fitting to the outer periphery of the inside ring is provided while it can move up and down. Then, in the double ring holder 1, means 2a, 3, and 4 are provided, where the means position the outside ring 15 at a position where the outside ring 15 can be fit to the inside ring while the outside ring 15 is retained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor manufacturing process,
In particular, the present invention relates to a stretching apparatus and a stretching method for a wafer sheet used in a stretching step after dicing is performed.

[0002]

2. Description of the Related Art In general, in a semiconductor manufacturing process, a wafer is cut into dice in a dicing process.
In a subsequent process, the wafer cut is divided into a plurality of dies (or “chips”). There are two types of wafer cutting in the dicing process: half-cut or semi-full-cut dicing, which inserts a kerf leaving a part of the wafer, and full-cut dicing, which completely cuts the wafer. The wafer is diced while being attached to an adhesive resin sheet called a wafer sheet (or also referred to as a “dicing sheet”), and is divided into individual dies by stretching the wafer sheet in a subsequent stretching step.

Conventionally, when full-cut dicing is performed, the stretching of a wafer sheet in the subsequent stretching step is performed using a stretching apparatus as shown in FIGS. 2 to 5, for example. As shown in FIG. 2, this stretching device includes an extension stage 11, a lower clamp 12, and an upper clamp 13. Of these, the extension stage 11 has a built-in heater and is formed so as to be able to move in the up-down direction. Also,
The lower clamp 12 and the upper clamp 13 are arranged on the outer peripheral side of the extension stage 11 so as not to hinder the vertical movement of the extension stage 11.

More specifically, as shown in FIGS. 3 and 4, the extension stage 11 is for placing a full-cut dicing wafer 21 and a wafer sheet 22 attached thereto, and is made of aluminum or the like. , The upper surface of which is formed in a smooth disk shape, is fixed to the upper part of a shaft 11a connected to the elevating means (not shown), and moves up and down integrally with the shaft 11a. A small-diameter portion 11b is provided on the outer periphery of the upper portion of the extension stage 11, and a step 11c is formed on the outer peripheral surface by the small-diameter portion 11b.

The small diameter portion 11b forming the step 11c
Is for fitting a double ring. The double ring is composed of an inner ring 14 and an outer ring 15. The inner ring 14 is wrapped around the small-diameter portion 11b of the extension stage 11, and the outer ring 15 sandwiches the wafer sheet 22 outside the inner ring 14. It is formed so that it can be fitted and mounted in the state.

The lower clamp 12 and the upper clamp 13 are each formed in a ring shape outside the expansion stage 11, and are arranged at positions where they can abut each other. The upper clamp 13 is movable in the vertical direction with respect to the lower clamp 12, and is lowered toward the lower clamp 12 to be pressed against the lower clamp 12, whereby the wafer sheet 22 disposed between the upper clamp 13 and the lower clamp 12 is pressed. The outer periphery is clamped.

[0007] In the stretching apparatus having such a configuration, the following processing operation is performed when the wafer sheet 22 is stretched. First, with the inner ring 14 attached to the small diameter portion 11b of the extension stage 11 and positioned at the step 11c,
The extension stage 11 is moved up and down so that its upper surface is substantially the same height as the upper surface (positioning surface) of the lower clamp 12. Then, in a state where the upper surface of the extension stage 11 and the positioning surface of the lower clamp 12 are substantially at the same height, the wafer 21 subjected to full-cut dicing and the wafer sheet 22 stuck thereon are placed thereon. After the wafer 21 and the wafer sheet 22 are placed, the upper clamp 13 is lowered, and the periphery of the wafer sheet 22 is clamped by the upper clamp 13 and the lower clamp 12 (see FIG. 2).

Thereafter, in the stretching device, as shown in FIG. 4, the extension stage 11 is raised by the lifting means while the periphery of the wafer sheet 22 is clamped. As a result, the wafer sheet 22 is stretched, and as a result, the wafer 21 is divided into individual dies.

Furthermore, in the stretching device, the extension stage 11
Is raised, the outer ring 15 of the double rings is fitted to and mounted on the outer side of the inner ring 14 from above the wafer sheet 22 as shown by a dashed line in the figure. Thus, the extension of the wafer sheet 22 on the extension stage 11 is maintained, and thereafter, the lower clamp 1
This extension is maintained even if the clamp by the upper clamp 2 and the upper clamp 13 is released. When the outer ring 15 is attached, the extending step is completed by cutting the portion of the wafer sheet 22 protruding from the outer ring 15.

[0010]

However, when the stretching of the wafer sheet 22 is performed using the above-described conventional stretching apparatus, the mounting of the outer ring 15 for holding the stretching of the wafer sheet 22 is performed in the stretching step. The operator (operator of the stretching device) has to do this manually. In other words, the worker in the stretching process needs to position the outer ring 15 by hand in order to fit the outer ring 15 to the outside of the inner ring 14 and press the outer ring 15 by hand so as not to shift from that state. There is. In addition, since the inner ring 14 and the outer ring 15 are formed with appropriate fitting precision, performing these fittings manually requires skill (know-how) and a certain amount of force in the work. . In addition, when a force is not applied uniformly over the entire outer ring 15, a work error may be induced, and as a result, improvement in work efficiency is hindered.

SUMMARY OF THE INVENTION The present invention provides a wafer sheet stretching apparatus and a stretching method that can easily and with a small force fit and fit an outer ring for stretching and holding a wafer sheet. Aim.

[0012]

SUMMARY OF THE INVENTION The present invention is directed to a wafer sheet stretching apparatus devised to achieve the above object, which stretches a wafer sheet attached to a full-cut dicing wafer on an extension stage. And an outer ring fitted around the outer periphery of the extension stage and an outer ring fitted to the inner ring outside of the extension stage so as to maintain the stretched state of the wafer sheet. A double ring holder for holding the outer ring above and a positioning means for positioning the outer ring held by the double ring holder at a position where the outer ring can be fitted to the inner ring are provided.

[0013] According to the stretching apparatus having the above-described structure, when the double ring holder holds the outer ring, the positioning means:
With the double ring holder holding the outer ring, the outer ring is positioned at a position where it can be fitted with the inner ring. That is, the position of the outer ring is determined by the double ring holder holding the outer ring. Therefore, if the double ring holder is moved downward in this state, or the extension stage and the inner ring are moved upward, the position of the outer ring is always fixed, so that the position of the outer ring can be determined manually. It fits on the outside of the inner ring without requiring the skill of the work.

The present invention also provides a wafer sheet stretching method devised to achieve the above object, wherein a wafer sheet attached to a full-cut dicing wafer is stretched on an expansion stage, and A method used in a wafer sheet stretching apparatus configured to maintain a stretched state of the wafer sheet by an inner ring mounted on the outer periphery of the extension stage and an outer ring fitted to the inner ring outside the inner ring. There is provided a double ring holder for holding the outer ring above the extension stage, and at a position where the outer ring can be fitted to the inner ring while the double ring holder holds the outer ring. Positioning and stretching the wafer sheet when the wafer and the wafer sheet are placed on the extension stage Dividing said wafer into a plurality of dies,
Thereafter, the double ring holder is lowered to fit the outer ring held by the double ring holder with the inner ring, and the fitting allows the stretched state of the wafer sheet to be maintained.

According to the stretching method described above, the double ring holder is provided above the extension stage, and when the double ring holder holds the outer ring, the outer ring is positioned at a position where it can be fitted to the inner ring. Therefore, the position of the outer ring is determined by holding the outer ring by the double ring holder. Therefore, if you lower the double ring holder in that state,
Since the position of the outer ring is always fixed, the outer ring is fitted to the outer side of the inner ring without requiring manual positioning or operation skill.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a wafer sheet stretching apparatus and a stretching method according to the present invention will be described with reference to the drawings. However, here, the same components as those of the above-described conventional stretching device are given the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 1A, a wafer sheet stretching apparatus according to the present embodiment is provided with a double ring holder 1 in addition to a conventional apparatus (see FIG. 2).

The double ring holder 1 has a hinge (link) not shown at one end, similarly to the upper clamp 13.
It is supported on the upper surface of the stretching device via a mechanism or the like, and is provided to be openable and closable so as to cover the extension stage 11 on the upper surface of the stretching device, and is located above the extension stage 11 and the upper clamp 13 in a closed state. Moreover, it is formed to be able to move up and down in a substantially vertical direction from that position.

The double ring holder 1 is made of an inner ring 14 made of, for example, metal or resin (including plastics).
It is assumed that it is formed of a material having strength enough to withstand a force required to fit the outer ring 15 with the outer ring 15 and having no elasticity.

The double ring holder 1 is shown in FIG.
As shown in (b), it is formed in a plate shape having a large thickness, and a concave portion 2 is provided on the lower surface thereof. The recess 2 is formed such that the depth from the lower surface of the double ring holder 1 is larger than the thickness of the outer ring 15. Also. The concave portion 2 has an arc portion 2a on the support end side when viewed from the lower surface side of the double ring holder 1, and has the opening 2 on the open / close end side.
It is formed in a U-shape having b. Of these, the arc portion 2a is formed to have substantially the same outer peripheral shape as the outer ring 15, and the opening 2b has a width
It is assumed that the outer diameter is formed to be substantially equal to the outer diameter dimension.

As shown in FIG. 1C, a rib 3 protruding from the wall surface of the concave portion 2 is provided at the lower surface end of the portion where the concave portion 2 is provided. The rib 3 is provided to prevent the outer ring 15 from dropping downward when the outer ring 15 is positioned in the concave portion 2.
It is provided corresponding to the U-shape in the concave portion 2. However, the diameter of the portion corresponding to the arc portion 2 a is larger than the outer diameter of the inner ring 14.

By providing such a concave portion 2 and a rib 3, the outer ring 15
Is held in the recess 2. That is, the double ring holder 1 holds the outer peripheral portion of the outer ring 15 by the concave portion 2 and the rib 3.

Further, the double ring holder 1 has
As shown in (b), two hold pin holes 4 are formed. When the outer ring 15 is positioned in the concave portion 2, these hold pin holes 4 are fitted by inserting positioning pins (not shown) into the respective hold pin holes 4.
The outer ring 15 is provided at a position where the outer ring 15 can be positioned by being pressed against the arc portion 2a. In addition,
The hold pin hole 4 may be provided at only one position, or may be provided at three or more positions as long as the outer ring 15 can be positioned in the concave portion 2.

That is, the double ring holder 1 is
And a holding pin hole 4 in addition to the rib 3 and the positioning pin is inserted into the holding pin hole 4 to fit the holding outer ring 15 with the inner ring 14 as described later in detail. It can be positioned at a position where it can be performed.

When the double ring holder 1 is completely lowered toward the extension stage 11, the outer ring 15 held by the double ring holder 1 just fits with the inner ring 14 mounted around the outer periphery of the extension stage 11. It is assumed that the movement range is adjusted so that

Next, a description will be given of an example of a processing operation in the case where the wafer sheet 22 is stretched in the stretching apparatus configured as described above.

In this stretching device, when the wafer sheet 22 is stretched, the extension stage 1
When the wafer 21 and the wafer sheet 22 are placed on the extension stage 11 in a state where the inner ring 14 is mounted on the inner ring 14, first, the upper clamp 13 is lowered, and the upper clamp 13 and the lower clamp 12 To clamp the periphery of the wafer sheet 22 (see FIG. 3). Then, the extension stage 11 is raised, and the wafer sheet 22
To divide the wafer 21 into individual dies (see FIG. 5). After that, the wafer sheet 2 on the extension stage 11
In order to maintain the extension of No. 2, a processing operation for fitting the outer ring 15 to the outer side of the inner ring 14 is performed.

However, in this stretching apparatus, the outer ring 1
It is assumed that the following processing operation is performed prior to fitting and mounting of the inner ring 5 and the inner ring 14. First, when the double ring holder 1 is in the open state on the upper surface of the stretching device, the opening 2b of the double ring holder 1
The outer ring 15 to be fitted and mounted is inserted inward.
Then, the outer circumference of the outer ring 15 in the concave portion 2 is formed into an arc portion 2 a
The outer ring 15 is positioned by inserting a positioning pin into each hold pin hole 4 in a state where the outer ring 15 is in contact with the outer ring 15. afterwards,
By closing the double ring holder 1 in the open state so as to cover the extension stage 11, the outer ring 15
The preparation for fitting and fitting the inner ring 14 and the inner ring 14 is completed.

When the preparation for such fitting is completed and the wafer sheet 22 is extended on the extension stage 11, the double ring holder 1 holds the outer ring 15 in this stretching apparatus. The double ring holder 1 is lowered in the state in which the double ring is held. The lowering of the double ring holder 1 can be performed manually by an operator,
Alternatively, it may be performed automatically using a lifting means (not shown).

Then, when the double ring holder 1 is lowered to the lowermost end of the moving range, the outer ring 15 held by the double ring holder 1 has the same height as the inner ring 14, that is, just fits with the inner ring 14. Will be located at the same height. At this time, the outer ring 15
Inner ring 1 in recess 2 of double ring holder 1
4 is located at a position where it can be fitted. Accordingly, when the outer ring 15 is lowered to the same height as the inner ring 14, the outer ring 15 is moved without performing new positioning or the like.
4 will be fitted and mounted. In addition, at the time of this fitting and mounting, since it descends in a substantially vertical direction while being held by the double ring holder 1, a substantially uniform force is applied to the entire outer ring 15.

That is, in the present embodiment, the outer ring 1
5 is held by the double ring holder 1, and the outer ring 15 is positioned at a position where the outer ring 15 can be fitted to the inner ring 14 by the circular arc portion 2 a of the double ring holder 1 and the positioning pins inserted into the hold pin holes 4. ing. Therefore, if the double ring holder 1 is lowered in this state, the position of the outer ring 15 is always fixed, so that the outer ring 15 is positioned by hand and the outer ring 15 is not displaced from that state. Fifteen
Without being pressed by hand, the fitting is mounted on the outside of the inner ring 14, and as a result, there is no need for manual positioning or work skill at the time of fitting and mounting.

In the present embodiment, the double ring holder 1 is movable in a substantially vertical direction, and the double ring holder 1 is lowered while holding the outer ring 15 in a state where the double ring holder 1 is positioned. Fifteen
And the inner ring 14 are fitted and mounted. Therefore, a force is applied almost uniformly to the entire outer ring 15 at the time of fitting and mounting, so that not only the skill of the worker can be reduced, but also the occurrence of a work error and the like can be prevented. become able to. In addition, the force required for the fitting and mounting is smaller than that of the related art, and it is very easy to deal with automation.

As described above, according to the stretching apparatus and the stretching method of the present embodiment, the fitting of the outer ring 15 and the inner ring 14 for holding the wafer sheet 22 in the stretched state can be performed.
Easily available to anyone without the need for work skills, etc.
In addition, since it is possible to perform work with less force while preventing the occurrence of work mistakes, etc., it is possible to significantly reduce the burden on the worker as compared with the conventional case, and as a result, it is possible to realize improvement in work efficiency Becomes

In the present embodiment, various technically preferable limitations have been described as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the description that particularly limits the present invention in the above description. Unless otherwise, it is not limited to the embodiment.

[0035]

As described above, according to the apparatus and method for stretching a wafer sheet of the present invention, the position of the outer ring is always fixed at the time of fitting the outer ring and the inner ring. In addition, the outer ring and the inner ring are fitted and mounted in a state in which a force is applied to the entire outer ring substantially uniformly without requiring manual positioning or skill of the operation. Therefore, this fitting and mounting can be easily performed by anyone without requiring the skill of the work and the like, and it is possible to perform the work with a small force while preventing the occurrence of a work mistake, etc. The burden can be greatly reduced than before,
There is an effect that it is possible to realize improvement in work efficiency.

[Brief description of the drawings]

FIG. 1 is a view showing an example of an embodiment of a wafer sheet stretching apparatus according to the present invention, wherein (a) is an external view of the stretching apparatus, and (b) is a double ring holder used in the stretching apparatus. A bottom view, (c) is a sectional view of the double ring holder.

FIG. 2 is an external view showing an example of a conventional wafer sheet stretching apparatus.

FIG. 3 is an explanatory view (part 1) illustrating an outline of an example of a processing operation when a wafer sheet is stretched by a conventional stretching apparatus.

FIG. 4 is a perspective view showing a detailed structure of a main part of an example of a conventional stretching apparatus.

FIG. 5 is an explanatory view (part 2) illustrating an outline of an example of a processing operation when a wafer sheet is stretched by a conventional stretching apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Double ring holder, 2 ... recessed part, 2a ... Arc part, 2
b ... opening, 3 ... rib, 4 ... hold pin hole, 11 ... extension stage, 14 ... inner ring, 15 ... outer ring

Claims (3)

[Claims] 1. A wafer sheet affixed to a full-cut diced wafer is extended on an extension stage, and an inner ring mounted around an outer periphery of the extension stage is fitted to the inner ring on the outside thereof. In a wafer sheet stretching apparatus configured to maintain a stretched state of the wafer sheet by an outer ring, a double ring holder that holds the outer ring above the extension stage, and an outer ring that is held by the double ring holder Positioning means for positioning the wafer sheet at a position where it can be fitted to the inner ring. 2. The double ring holder is provided so as to be movable in a vertical direction, and lowers while holding the outer ring to fit the outer ring with the inner ring. The apparatus for stretching a wafer sheet according to claim 1. 3. A wafer sheet affixed to a full-cut diced wafer is extended on an extension stage, and an inner ring mounted around the outer periphery of the extension stage is fitted to the inner ring on the outside. A stretching method used in a wafer sheet stretching apparatus configured to maintain a stretched state of the wafer sheet by an outer ring, wherein a double ring holder that holds the outer ring is provided above the extension stage. When the double ring holder holds the outer ring, the outer ring is positioned at a position where the outer ring can be fitted to the inner ring, and the wafer and the wafer sheet are placed on the extension stage. Stretching the wafer sheet to divide the wafer into a plurality of dies, and then lowering the double ring holder An outer ring to which the double-ring holder holds fitted with the inner ring, the wafer sheet stretching method, characterized by keeping the stretched condition of the wafer sheet by fitting.