JPH11345744A - High withstanding voltage through capacitor and its manufacture - Google Patents

High withstanding voltage through capacitor and its manufacture

Info

Publication number
JPH11345744A
JPH11345744A JP15021498A JP15021498A JPH11345744A JP H11345744 A JPH11345744 A JP H11345744A JP 15021498 A JP15021498 A JP 15021498A JP 15021498 A JP15021498 A JP 15021498A JP H11345744 A JPH11345744 A JP H11345744A
Authority
JP
Japan
Prior art keywords
dielectric
resin
capacitor
conductor
ground plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15021498A
Other languages
Japanese (ja)
Inventor
Zenichi Kondo
善一 近藤
Yoichiro Kawabe
洋一郎 川辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KONDO DENKI KK
Original Assignee
KONDO DENKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KONDO DENKI KK filed Critical KONDO DENKI KK
Priority to JP15021498A priority Critical patent/JPH11345744A/en
Publication of JPH11345744A publication Critical patent/JPH11345744A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To enhance the reliability of product by reducing the occupation ratio of a filled and solidified resin mold to the entire capacitor thereby ensuring mechanical strength of the capacitor, and to enhance production efficiency by applying covers to the opposite sides of an earth plate while covering substantially the entirety thereof and injecting insulating resin into the inner air gap thereof and curing the resin thereby reducing the quantity of resin to be used and shortening the curing time of resin significantly. SOLUTION: A through conductor 3 is passed through a dielectric arranged, at a specified interval, with electrodes 20, 21, while being conducted with the electrode on one side. The through conductor penetrates an earth plate 1 without touching it and the dielectric is fixed to the earth plate 1 while conducting therewith at the electrode on the other side. Caps 4u, d each having a recess substantially conforming with the outline of the dielectric 2 and the through conductor 3 are fitted to the upper and lower surfaces of the earth plate 1 and then resin liquid is injected into the space 46 of the caps thus and cured integrally.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本願発明は、高耐電圧用貫通
型コンデンサの構成、及びその製造方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a feedthrough capacitor for high withstand voltage and a method of manufacturing the same.

【0002】[0002]

【従来の技術】高耐電圧用貫通型コンデンサ(以下「コ
ンデンサ」と略称する。)は、例えば電子レンジのマグ
ネトロン等のフィルタコンデンサとして使用されてい
る。
2. Description of the Related Art A through-type capacitor for high withstand voltage (hereinafter abbreviated as "capacitor") is used as a filter capacitor for a magnetron of a microwave oven, for example.

【0003】従来、この種のコンデンサの構造の一例を
挙げると、図4の組立斜視図、及び図5の縦断面図で示
す、次のようなものであった。先ず、上下に貫く2個の
貫通孔50a、50bが開設され、かつ上下端面のそれ
ぞれにコンデンサ電極51a、51b、52が配設され
たセラミック製の誘電体53が、中央部に略楕円形の開
口部54が形成されたアース板55に取付けられてい
る。
Conventionally, as an example of the structure of this type of capacitor, the following are shown in an assembly perspective view of FIG. 4 and a vertical sectional view of FIG. First, a ceramic dielectric 53 having two through holes 50a, 50b penetrating vertically and having capacitor electrodes 51a, 51b, 52 disposed on upper and lower end surfaces, respectively, has a substantially elliptical shape in the center. It is attached to a ground plate 55 having an opening 54 formed therein.

【0004】該アース板55は、電子レンジ等のシャー
シ(図示省略。)への取付け基体となるもので、その開
口部54に、階段状に立ちあげた段部56を介して前記
コンデンサ電極52と導通させた誘電体51が載置固定
されている。
The ground plate 55 serves as a base for attachment to a chassis (not shown) of a microwave oven or the like, and the capacitor electrode 52 is formed in an opening 54 of the chassis through a stepped portion 56 stood up. And a dielectric 51 that is electrically connected to the substrate is fixed.

【0005】また、各貫通孔50a、50bには、階段
円環状に形成された取付金具57a、57bを介して導
体ピン58a、58bが貫通され、絶縁チューブ59で
保護されて、誘電体51内に貫通配置されている。
[0005] Conductor pins 58a, 58b pass through the through-holes 50a, 50b via mounting brackets 57a, 57b formed in a stepped annular shape, and are protected by an insulating tube 59, so that the inside of the dielectric 51 is protected. It is arranged through.

【0006】このようにしてアース板55に組み付けら
れた誘電体51、及び導体ピン58は、アース板55の
両面側(図面においては上下面側)には、それぞれこれ
らを覆うような楕円筒状の絶縁ケース60u、60dが
段部56に嵌合するようにして環装固定される。そして
この絶縁ケース60u、60d内にエポキシ樹脂等から
なる絶縁性の樹脂材が充填硬化されて樹脂モールド61
u、61dが形成されるものであった。
[0006] The dielectric 51 and the conductor pins 58 assembled to the ground plate 55 in this manner are formed on both sides of the ground plate 55 (upper and lower surfaces in the drawing) in the form of elliptical cylinders that cover them. Are mounted and fixed such that the insulating cases 60u and 60d are fitted to the stepped portions 56. The insulating cases 60u and 60d are filled with an insulative resin material such as an epoxy resin or the like, and are cured.
u, 61d were formed.

【0007】[0007]

【発明が解決しようとする課題】しかし、上記従来構成
のコンデンサには、次のような問題点があった。すなわ
ち、充填固形化させた樹脂モールド61の割合の多いか
かる素子構造では、高温、多湿、そして静電気や磁力の
発生で埃や塵が付着し易い、過酷な使用環境では、温度
差による膨張収縮作用から、樹脂モールド61との接合
境界に、隙間や亀裂が生じ易く、そこから水や油等が浸
透したり、または電極が剥離したりして、絶縁不良とな
る故障が度々発生していた。このことは、耐電圧の劣化
を招くばかりでなく、ショートして火災を発生させる恐
れもあった。
However, the above-mentioned conventional capacitor has the following problems. That is, in such an element structure in which the proportion of the resin mold 61 that is filled and solidified is large, dust and dust tend to adhere due to high temperature, high humidity, and generation of static electricity and magnetic force. For this reason, a gap or a crack is easily generated at a joint boundary with the resin mold 61, and water or oil or the like permeates from the boundary or an electrode is peeled off, which often causes a failure that causes insulation failure. This not only causes deterioration of the withstand voltage, but also causes a short circuit and a fire.

【0008】そのためこれを回避するため、上記従来例
に示すようにアース板55の開口部54に段部56を形
成して、隙間や亀裂が発生し難くしているが完全ではな
かった。
Therefore, in order to avoid this, a step 56 is formed in the opening 54 of the ground plate 55 as shown in the above-mentioned conventional example so that a gap or a crack is hardly generated, but it is not perfect.

【0009】また、上記従来構成のコンデンサの製造過
程においても、アース板55に組み付けられた誘電体5
1、及び導体ピン58の周囲部分を上下開放の楕円筒状
の絶縁ケース60u、60dで覆い、その開放口から内
部に絶縁性樹脂材を必要位置まで満たし、この状態を保
持しながら硬化させる構成を採っているため、その硬化
のために多くの時間を必要としていた。
Also, in the manufacturing process of the above-mentioned conventional capacitor, the dielectric 5
1. A configuration in which the periphery of the conductor pin 58 is covered with vertically open elliptical cylindrical insulating cases 60u and 60d, and the opening is filled with an insulating resin material to a required position and cured while maintaining this state. Therefore, a lot of time was required for the curing.

【0010】その結果、一個当たりの製造時間が長くな
って単位時間当たりの製造個数を多くすることができな
いため、製品コストの低減には限界があった。
As a result, the manufacturing time per unit becomes long and the number of manufactured units per unit time cannot be increased, so that there is a limit to the reduction in product cost.

【0011】[0011]

【目的】そこで本願発明は、かかる課題に着目してなさ
れたもので、コンデンサ全体に対する充填固形化させた
樹脂モールドの占める割合を少なくすることにより、コ
ンデンサの機械的強度を確保して製品の信頼性を高める
と共に、アース板の両面側に略全体を覆う被冠体を被
せ、その内部空隙に絶縁性樹脂を注入して硬化させるこ
とより、樹脂材の使用量を削減すると共に樹脂の硬化時
間を大幅に短縮して生産効率の向上を図ることを目的と
した、新規な高耐電圧用貫通型コンデンサ、及びその製
造方法を提供するものである。
Accordingly, the present invention has been made in view of the above problem, and by reducing the proportion of a resin mold filled and solidified in the entire capacitor, the mechanical strength of the capacitor is ensured and the reliability of the product is improved. In addition to improving the performance, the cap is covered almost entirely on both sides of the ground plate, and the insulating resin is injected into the internal space and cured, thereby reducing the amount of resin material used and curing time of the resin. To provide a novel feed-through capacitor for high withstand voltage and a method for manufacturing the same for the purpose of greatly reducing the time required for improving the production efficiency.

【0012】[0012]

【課題を解決するための手段】上記目的を達成するた
め、本願発明の高耐電圧用貫通型コンデンサは、以下の
ように構成されている。
In order to achieve the above object, a feed-through capacitor for high withstand voltage according to the present invention is configured as follows.

【0013】すなわち、所定間隔をもって電極が配設さ
れた誘電体と、該誘電体の一方側の電極と導通させて誘
電体に貫通して配設した貫通導体と、該貫通導体を非接
触で貫通させると共に、前記誘電体の他方側の電極と導
通状態で誘電体が取付けられたアース板と、該アース板
の両面側にそれぞれ突出状に配置された誘電体及び(又
は)貫通導体のうち、貫通導体の先端部付近を残して全
体を覆うように被せた絶縁性の被冠体と、該被冠体の内
部空隙に注入して硬化一体化させた絶縁性の樹脂モール
ドと、から成ることを特徴とする。
That is, a dielectric having electrodes disposed at predetermined intervals, a penetrating conductor penetrating through the dielectric by conducting with an electrode on one side of the dielectric, and a non-contacting penetrating conductor. An earth plate to which a dielectric is attached in a conductive state with the electrode on the other side of the dielectric, and a dielectric and / or a through conductor arranged in a protruding shape on both surface sides of the earth plate. An insulating cap covered so as to cover the whole except for the vicinity of the tip end of the through conductor, and an insulating resin mold injected into the internal space of the cap and hardened and integrated. It is characterized by the following.

【0014】また、被冠体のアース板への取付けにおい
ては、アース板に嵌合手段を形成して被冠体を嵌合させ
るようにしたことを特徴とする。さらに、アース板への
嵌合手段においては、アース板の誘電体が取付けられる
位置の周囲に連続した凹条又は凸条を形成し、これに被
冠体の端縁部を嵌合させるようにしたことを特徴とす
る。
Further, when the crown body is attached to the ground plate, a fitting means is formed on the ground plate to fit the crown body. Furthermore, in the means for fitting to the ground plate, a continuous concave or convex line is formed around the position where the dielectric of the ground plate is attached, and the edge of the crown is fitted to this. It is characterized by having done.

【0015】さらにまた、被冠体の内側の凹部型形は、
被せられる部位の凸部形状に略習った形状に成形するこ
とを特徴とする。また、被冠体が被さる部分のアース板
には、流動状態の絶縁性樹脂材が流通し得る大きさの樹
脂流通孔を配置形成するようにすれば、硬化後に両面側
の樹脂材が一体化させる効果があり、強度向上に寄与す
る。
Further, the concave shape inside the crown body is
It is characterized in that it is formed into a shape substantially learned from the shape of the convex portion of the portion to be covered. Also, if a resin flow hole having a size that allows the flow of the insulating resin material in the flowing state is arranged and formed on the ground plate where the crown body covers, the resin materials on both sides are integrated after curing. Has the effect of improving the strength.

【0016】次に、かかる構成の高耐電圧用貫通型コン
デンサは、所定間隔をもって電極が配設された誘電体の
一方側の電極と導通させた貫通導体が貫通状に配置され
て成る誘電体を、所定形状の導電性のアース板に、誘電
体の他方側の電極と導通状態となるようにして取付け、
該アース板の両面側にそれぞれ突出状に配置された誘電
体及び(又は)貫通導体のうち、貫通導体の先端部付近
を残して全体を覆うようにして絶縁性の被冠体を被せ、
次いで、該被冠体の内部空隙に絶縁性樹脂材を注入して
硬化一体化させることにより製造される。
Next, the feedthrough capacitor for high withstand voltage having such a structure is a dielectric having a through conductor in which a through conductor electrically connected to one electrode of a dielectric having electrodes disposed at a predetermined interval is provided. Is attached to a conductive earth plate having a predetermined shape so as to be in conduction with the electrode on the other side of the dielectric,
Of the dielectric and / or penetrating conductor arranged in a protruding shape on both sides of the ground plate, respectively, the insulating cap is covered so as to cover the whole except for the vicinity of the tip of the penetrating conductor,
Next, an insulative resin material is injected into the internal space of the crowned body and cured and integrated to produce the product.

【0017】[0017]

【発明の実施の形態】次に、本願発明の実施形態例を図
面に基づき詳細に説明する。図1は本実施形態例の組立
分解斜視図であり、図2はその組み付けた状態を一部切
欠いて示す斜視図である。また図3は図2のA−A線断
面図である。
Next, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is an exploded perspective view of the embodiment, and FIG. 2 is a perspective view showing the assembled state with a part cut away. FIG. 3 is a sectional view taken along line AA of FIG.

【0018】図示符号1は、略矩形状の金属板等の導電
性材により形成されるアース板であり、本コンデンサの
取付け基板となるものである。その中央部には、2個の
円形状の貫通口10がそれぞれ独立した状態で並べるよ
うにして開設している。さらに、該2個の貫通口10、
10の周囲には、複数個の樹脂流通孔11を配設してい
る。この樹脂流通孔11は、長孔状等の適宜の形状にし
て配置形成している。
Reference numeral 1 denotes a ground plate formed of a conductive material such as a substantially rectangular metal plate, and serves as a mounting board for the capacitor. At the center thereof, two circular through-holes 10 are formed so as to be arranged independently of each other. Further, the two through holes 10,
A plurality of resin circulation holes 11 are arranged around the periphery of the resin circulation hole 10. The resin flow holes 11 are arranged and formed in an appropriate shape such as a long hole shape.

【0019】また、アース板1の上面には、樹脂流通孔
11の外周囲を取り囲むようにして、所定深さの連続し
た溝部12がプレス等により成形している。この溝部1
2は、上面から見ると凹条12aとなり、下面から見る
と凸条12bとなる。
On the upper surface of the earth plate 1, a continuous groove 12 having a predetermined depth is formed by a press or the like so as to surround the outer periphery of the resin circulation hole 11. This groove 1
2 is a concave stripe 12a when viewed from above, and a convex stripe 12b when viewed from below.

【0020】図示符号2は、誘電体であり、セラミック
等の磁器材で長円柱状に形成されており、その上面には
2個の上位電極20、20がそれぞれ離隔して形成さ
れ、かつ下面の略前面には下位電極21が形成されてい
る。この上位電極20と下位電極21との構成によりコ
ンデンサ機能を発揮するものである。かかる電極20、
21は、金属薄板、金属泊の張り付け、金属蒸着、又は
電極材印刷などにより形成されている。
Reference numeral 2 denotes a dielectric, which is formed of a ceramic material or the like and is formed in an elongated column shape, and two upper electrodes 20 are formed on the upper surface thereof and are separated from each other. , A lower electrode 21 is formed substantially on the front surface. The configuration of the upper electrode 20 and the lower electrode 21 exerts a capacitor function. Such an electrode 20,
Reference numeral 21 is formed by attaching a thin metal plate, attaching a metal sheet, depositing metal, or printing an electrode material.

【0021】この誘電体2には、2本の貫通導体3、3
が離隔して貫通配置しており、この貫通導体3は、下端
部が下方に突出した状態で貫通配置された棒状の導体ピ
ン30と、該導体ピン30の上端部に、誘電体6の上位
電極20と接合導通させた金属円盤状のスペーサ31を
介して接続された平板舌片状のタブ端子32と、から構
成されている。
The dielectric 2 has two through conductors 3, 3
Are penetrated and spaced apart from each other. The penetrating conductor 3 has a rod-shaped conductor pin 30 penetratingly disposed with its lower end protruding downward, and an upper end of the dielectric 6 on an upper end of the conductor pin 30. And a tab terminal 32 in the form of a flat tongue connected to the electrode 20 via a spacer 31 in the form of a metal disk that is electrically connected to the electrode 20.

【0022】上記構成により、誘電体2のアース板1へ
の組み付けは、誘電体2の下端面から突き出した導体ピ
ン30を、貫通口2に非接触で挿通させると共に、下位
電極21とアース板1とを半田等で接着させて固定して
いる。
With the above structure, the dielectric 2 is assembled to the ground plate 1 by inserting the conductor pins 30 protruding from the lower end surface of the dielectric 2 through the through hole 2 in a non-contact manner, and connecting the lower electrode 21 and the ground plate. 1 is fixed by bonding with solder or the like.

【0023】次に、被冠体について説明する。図示符号
4は、アース板1に組み付けられた誘電体2及び貫通導
体3を、アース板1の両面から覆う耐熱性の樹脂成型品
から成る被冠体であり、上側被冠体4u、下側被冠体4
dとから構成されている。
Next, the crown body will be described. Reference numeral 4 denotes a crown member made of a heat-resistant resin molded product that covers the dielectric 2 and the through conductor 3 attached to the ground plate 1 from both sides of the ground plate 1, and includes an upper crown member 4u and a lower crown member. Crowned body 4
d.

【0024】上側被冠体4uは、下方開放の有底長円筒
状に形成され、その下部縁端部41uをアース板1の溝
部12の凹条12aに挿入嵌合させて、アース板1の上
面側に誘電体2とタブ端子32の先端付近を露出した状
態で被せるようにして取付けられている。
The upper cap body 4u is formed in a bottomed long cylindrical shape which is open downward, and its lower edge 41u is inserted and fitted into the groove 12a of the groove 12 of the earth plate 1 so that It is attached so that the dielectric 2 and the vicinity of the tip of the tab terminal 32 are exposed on the upper surface side.

【0025】この上側被冠体4uの内部の凹部型形45
uは、被せられる部位(タブ端子32の先端部付近を残
した誘電体2の全体)の凸部形状に略習った形状に成形
され、かつ被冠時に若干の樹脂充填空隙46uができる
ように形成されている。
The concave shape 45 inside the upper crown 4u
u is formed into a shape substantially similar to the shape of the convex portion of the portion to be covered (the entirety of the dielectric 2 except for the vicinity of the tip end of the tab terminal 32), and a small resin-filled void 46u is formed when the crown is covered. Is formed.

【0026】また、上側被冠体4uの蓋板42uを厚く
形成することでスペーサ31からタブ端子32に沿って
上方へ延びる端子孔43uの距離を長くしている。な
お、この端子孔43uは、タブ端子32を把持すること
によりタブ端子32の位置決めして保持する機能を有す
るが、樹脂液の注入時のエアー抜きとして機能するよう
にある程度の隙間を形成するようにしてもよい。
Further, the thickness of the cover plate 42u of the upper crowned body 4u is increased to increase the distance between the spacer 31 and the terminal hole 43u extending upward along the tab terminal 32. Although the terminal hole 43u has a function of positioning and holding the tab terminal 32 by gripping the tab terminal 32, a certain gap is formed so as to function as an air vent when injecting the resin liquid. It may be.

【0027】さらに、蓋板42uの中央部付近には、樹
脂充填空隙46uに連通した注入孔44uを設けてい
る。一方、下側被冠体4dは、上方開放の有底長円筒状
に形成され、その上部縁端部41dをアース板1の下面
側の凸条12aの外周縁に嵌合させて、アース板1の下
面に取り付けている。
Further, near the center of the cover plate 42u, an injection hole 44u communicating with the resin filling space 46u is provided. On the other hand, the lower crowned body 4d is formed in a long cylindrical shape with an open top and a bottom, and its upper edge 41d is fitted to the outer peripheral edge of the ridge 12a on the lower surface side of the ground plate 1 to form a ground plate. 1 is attached to the lower surface.

【0028】下側被冠体4dの内部の凹部型形45d
は、被せられる部位(導体ピン30の先端部付近を残し
た凸条12aの全体)の凸部形状に略習った形状に成形
され、かつ被冠時に若干の樹脂充填空隙46dができる
ように形成されている。
Recessed shape 45d inside lower cap 4d
Is formed so as to have a shape substantially conforming to the shape of the convex portion of the portion to be covered (the entirety of the protruding ridge 12a except for the vicinity of the tip of the conductor pin 30), and is formed so that a slight resin-filled void 46d is formed when the crown is covered. Have been.

【0029】また、下側被冠体4dの蓋板42dを厚く
形成することで導体ピン30に沿って下方へ延びるピン
孔43dの距離を長くしている。なお、このピン孔43
dは、導体ピン30を把持することにより導体ピン30
の位置決めして保持する機能を有するが、樹脂液の注入
時のエアー抜きとして機能するようにある程度の隙間を
形成するようにしてもよい。
Further, the thickness of the lid plate 42d of the lower cap 4d is made thicker, so that the distance of the pin hole 43d extending downward along the conductor pin 30 is increased. In addition, this pin hole 43
d is that the conductor pin 30
Although it has a function of positioning and holding, a certain gap may be formed so as to function as an air vent when injecting the resin liquid.

【0030】さらに、蓋板42dの中央部付近には、樹
脂充填空隙46dに連通した注入孔44dを設けてい
る。上記樹脂充填空隙46u、46d内には、樹脂モー
ルド5が充填形成されている。すなわち、注入孔44
u、および44dから流し込まれた熱可塑性、又は熱硬
化性の樹脂液が、貫通口10の周りに配置されたの樹脂
流通孔11、11・・を通過してアース板1の上下側に
行き渡り、そしてこの樹脂液の硬化によりアース板1、
誘電体2、上側被冠体4uおよび下側被冠体4dとが樹
脂モールド5を介して一体化されることになる。
Further, an injection hole 44d communicating with the resin filling space 46d is provided near the center of the cover plate 42d. The resin mold 5 is filled in the resin filling gaps 46u and 46d. That is, the injection hole 44
The thermoplastic or thermosetting resin liquid poured from u and 44d passes through the resin flow holes 11, 11... disposed around the through-hole 10, and spreads over the upper and lower sides of the ground plate 1. , And the grounding plate 1
The dielectric 2, the upper crown 4u, and the lower crown 4d are integrated via the resin mold 5.

【0031】なお、この樹脂充填空隙46u、46d内
への樹脂注入及び硬化は、アース板1の片面ずつ行うよ
うにしてもよい。すなわち、先ず上側被冠体4uの樹脂
充填空隙46uへ注入孔44uから樹脂液を注入して硬
化させた後、下側被冠体4dがアース板1の上側となる
ように裏返して、下側被冠体4dの樹脂充填空隙46d
へ注入孔44dから樹脂液を注入して硬化させるよう
に、二段階に行ってもよい。
The resin may be injected into the resin-filled voids 46u and 46d and cured one by one on the ground plate 1. That is, first, a resin liquid is injected from the injection hole 44u into the resin-filled gap 46u of the upper crowned body 4u and cured, and then the lower crowned body 4d is turned over so as to be on the upper side of the ground plate 1, and Resin-filled void 46d of crowned body 4d
It may be performed in two stages so that the resin liquid is injected from the injection hole 44d and cured.

【0032】上記構成により、本実施形態例では、樹脂
充填空隙46u、46dへの樹脂注入量が、上記従来構
成に示すような上下開放の絶縁ケース60内に注入する
樹脂量よりも著しく少ない量で済み、その硬化時間にも
大きな違いがあった。出願人の実施例によると、従来構
成では注入した樹脂の全部が完全に硬化するまでに約1
5時間を要していたのに対して、本構成では約30分で
十分な硬化を得ることができた。
With the above configuration, in this embodiment, the amount of resin injected into the resin filling gaps 46u and 46d is significantly smaller than the amount of resin injected into the vertically open insulating case 60 as shown in the above-described conventional configuration. And the curing time also varied greatly. According to the embodiment of the applicant, in the conventional configuration, it takes about one to completely cure the injected resin.
In the present configuration, sufficient curing could be obtained in about 30 minutes, while 5 hours were required.

【0033】[0033]

【他の実施例】本実施例では、2個の貫通導体3を1つ
の誘電体2に貫通配置しているが、これに限定するもの
ではなく、誘電体6を貫通導体3毎に別個に形成しても
良い。
[Other Embodiments] In this embodiment, two through conductors 3 are arranged to penetrate one dielectric 2, but the present invention is not limited to this. It may be formed.

【0034】また、アース板1に形成した樹脂流通孔1
1、11、・・は、アース板1の両面に配置される樹脂
モールド5を一体化させるためのものであるが、必須の
構成要素ではなく、もし電気的特性に不具合がある場合
には設けなくても良い。
The resin flow holes 1 formed in the ground plate 1
The elements 1, 11,... Are for integrating the resin molds 5 arranged on both sides of the ground plate 1, but are not essential components, and are provided if there is a defect in the electrical characteristics. You don't have to.

【0035】[0035]

【効果】上記構成により本願発明は以下のような効果を
奏する。すなわち、アース板に樹脂流通孔を設けて両面
側の樹脂モールドを一体のものとすると共に、かかる樹
脂流通孔が貫通口を略連続して囲むようにしているた
め、樹脂モールドとアース板との接触境界面に生ずる水
等の浸透現象を回避することができ、これが誘電体まで
達して起きる絶縁不良を防止することができる。
According to the above configuration, the present invention has the following effects. That is, since the resin flow holes are provided in the ground plate to make the resin molds on both sides integral with each other, and the resin flow holes substantially continuously surround the through holes, a contact boundary between the resin mold and the ground plate is provided. It is possible to avoid the penetration phenomenon of water or the like that occurs on the surface, and it is possible to prevent insulation failure that occurs when the phenomenon reaches the dielectric.

【0036】また、上下板厚を厚くした被冠体と樹脂モ
ールドとが一体となっているため、タブ端子、導体ピン
に作用する外力に対する機械的強度を向上させることが
可能となることに加えて、内部空間の体積を小さくして
いるため、樹脂モールドの体積を削減することができ、
コンデンサの生産性を飛躍的に向上させることができ
る。樹脂量を削減したことにより、樹脂の硬化に要する
時間が短く、樹脂硬化時の構成部品への応力が作用しに
くくなり、コンデンサの経時劣化の抑制にも貢献するこ
とができる。
Further, since the crowned body having the upper and lower plate thicknesses and the resin mold are integrated with each other, the mechanical strength against external force acting on the tab terminals and the conductor pins can be improved. Because the volume of the internal space is reduced, the volume of the resin mold can be reduced,
The productivity of the capacitor can be dramatically improved. By reducing the amount of the resin, the time required for curing the resin is short, the stress on the components during the curing of the resin is less likely to act, and it is possible to contribute to the suppression of the deterioration with time of the capacitor.

【0037】さらに、アース板への誘電体の取付けは貫
通口と誘電体の縮径部との嵌合によるものであり、被冠
体の取付もアース板の凹条または凸条への嵌合によるた
め、これらの位置決めが容易であると共に確実な取付け
を行うことができ、このこともまた生産効率の向上に寄
与するものである。
Further, the attachment of the dielectric to the ground plate is based on the fitting of the through hole and the reduced diameter portion of the dielectric. Therefore, the positioning can be easily performed and the mounting can be performed reliably, which also contributes to the improvement of the production efficiency.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本実施形態例の組立分解斜視図である。FIG. 1 is an exploded perspective view of an embodiment of the present invention.

【図2】 本実施形態例の組み付けた状態を一部切欠い
て示す斜視図である。
FIG. 2 is a partially cutaway perspective view showing an assembled state of the embodiment.

【図3】 図2のA−A線断面図である。FIG. 3 is a sectional view taken along line AA of FIG. 2;

【図4】 従来例を示す組立斜視図である。FIG. 4 is an assembled perspective view showing a conventional example.

【図5】 従来例を示す縦断面図である。FIG. 5 is a longitudinal sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 アース板 10 貫通口 11 樹脂流通孔 12 溝部 2 誘電体 20 上位電極 21 下位電極 3 貫通導体 4 被冠体 4u 上側被冠体 45u 凹部型形 46u 樹脂充填空隙 4u 下側被冠体 45d 凹部型形 46d 樹脂充填空隙 5・・・樹脂モールド DESCRIPTION OF SYMBOLS 1 Ground plate 10 Through-hole 11 Resin circulation hole 12 Groove part 2 Dielectric 20 Upper electrode 21 Lower electrode 3 Penetrating conductor 4 Covered body 4u Upper crowned body 45u Concave type 46u Resin filling gap 4u Lower crowned body 45d Concave type Shape 46d Resin-filled void 5: Resin mold

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 所定間隔をもって電極が配設された誘電
体と、 該誘電体の一方側の電極と導通させて誘電体に貫通して
配設した貫通導体と、 該貫通導体を非接触で貫通させると共に、前記誘電体の
他方側の電極と導通状態で誘電体が取付けられたアース
板と、 該アース板の両面側にそれぞれ突出状に配置された誘電
体及び(又は)貫通導体のうち、貫通導体の先端部付近
を残して全体を覆うように被せた絶縁性の被冠体と、 該被冠体の内部空隙に注入して硬化一体化させた絶縁性
の樹脂モールドと、から成ることを特徴とした高耐電圧
用貫通型コンデンサ。
1. A dielectric having electrodes disposed at predetermined intervals, a through conductor provided to penetrate through the dielectric by being electrically connected to an electrode on one side of the dielectric; An earth plate to which a dielectric is attached in a conductive state with the electrode on the other side of the dielectric, and a dielectric and / or a penetrating conductor arranged on both sides of the earth plate so as to protrude, respectively. An insulative cap covering the entire surface of the through conductor except for the vicinity of the tip, and an insulative resin mold injected into the internal space of the cap and hardened and integrated. A through-type capacitor for high withstand voltage characterized by the following.
【請求項2】 被冠体のアース板への取付けにおいて、 アース板に嵌合手段を形成して被冠体を嵌合させるよう
にしたことを特徴とする請求項1記載の高耐電圧用貫通
型コンデンサ。
2. The high withstand voltage device according to claim 1, wherein, when the crown body is attached to the ground plate, a fitting means is formed on the ground plate to fit the crown body. Feedthrough capacitor.
【請求項3】 アース板に嵌合手段において、 アース板の誘電体が取付けられる位置の周囲に連続した
凹条又は凸条を形成し、これに被冠体の端縁部を嵌合さ
せるようにしたことを特徴とする請求項2記載の高耐電
圧用貫通型コンデンサ。
3. A grounding plate fitting means, wherein a continuous concave or convex ridge is formed around a position where a dielectric of the grounding plate is mounted, and an edge portion of the crowned body is fitted to the concave or convex ridge. 3. The feedthrough capacitor for high withstand voltage according to claim 2, wherein:
【請求項4】 被冠体の内側の凹部型形を、被せられる
部位の凸部形状に略習った形状に成形したことを特徴と
する請求項1の高耐電圧用貫通型コンデンサ。
4. The high withstand voltage penetration type capacitor according to claim 1, wherein the concave shape inside the crowned body is formed into a shape substantially similar to a convex shape of a portion to be covered.
【請求項5】 被冠体が被さる部分のアース板に、流動
状態の絶縁性樹脂材が流通し得る大きさの樹脂流通孔を
配置形成したことを特徴とする請求項1、2、3、又は
4記載の高耐電圧用貫通型コンデンサ。
5. A resin circulation hole having a size through which an insulative resin material in a flowing state can be arranged is formed in a ground plate in a portion covered by a crown body. Or a feed-through capacitor for high withstand voltage according to 4.
【請求項6】 所定間隔をもって電極が配設された誘電
体の一方側の電極と導通させた貫通導体が貫通状に配置
されて成る誘電体を、所定形状の導電性のアース板に、
誘電体の他方側の電極と導通状態となるようにして取付
け、 該アース板の両面側にそれぞれ突出状に配置された誘電
体及び(又は)貫通導体のうち、貫通導体の先端部付近
を残して全体を覆うようにして絶縁性の被冠体を被せ、 次いで、該被冠体の内部空隙に絶縁性樹脂材を注入して
硬化一体化させようとしたことを特徴とする高耐電圧用
貫通型コンデンサの製造方法。
6. A dielectric formed by penetrating through-hole conductors electrically connected to electrodes on one side of a dielectric on which electrodes are disposed at a predetermined interval, is provided on a conductive ground plate having a predetermined shape.
Attached so as to be in conduction with the electrode on the other side of the dielectric, leaving the vicinity of the tip of the penetrating conductor out of the dielectric and / or penetrating conductor arranged respectively on both sides of the ground plate in a projecting manner. Characterized in that an insulating cap is covered so as to cover the whole body, and then an insulating resin material is injected into an internal space of the cap to be integrated by curing. Manufacturing method of feedthrough capacitor.
JP15021498A 1998-05-29 1998-05-29 High withstanding voltage through capacitor and its manufacture Pending JPH11345744A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15021498A JPH11345744A (en) 1998-05-29 1998-05-29 High withstanding voltage through capacitor and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15021498A JPH11345744A (en) 1998-05-29 1998-05-29 High withstanding voltage through capacitor and its manufacture

Publications (1)

Publication Number Publication Date
JPH11345744A true JPH11345744A (en) 1999-12-14

Family

ID=15492037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15021498A Pending JPH11345744A (en) 1998-05-29 1998-05-29 High withstanding voltage through capacitor and its manufacture

Country Status (1)

Country Link
JP (1) JPH11345744A (en)

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