JPH11344721A - Device for manufacturing liquid crystal display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly pressurize a thermocompression bonding part without requiring difficult adjustment in the thermocompression bonding of lead terminals of a TCP substrate with electrode lead-out terminals of a liquid crystal display panel via an anisotropic conductive film. SOLUTION: In the device for manufacturing liquid crystal display elements comprising superposing lead terminals 7a of a flexible substrate 7 on electrode lead-out terminals 3a of the liquid crystal display panel 1 via an anisotropic conductive film 6 and thermocompression-bonding the lead terminals 7a with the electrode lead-out terminals 3a by pressurizing a superposing part 9 from the side of the lead terminals 7a, a heated fluid supplying source 10 which supplies a heated fluid at a specified pressure and a means for heating and pressurizing 20 which is expanded by the heated fluid supplied by the supplying source 10 and, is contacted to and pressurizes, the superposing part 9, are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a liquid crystal display element, and more particularly, to a liquid crystal display panel having a T
The present invention relates to the manufacture of a liquid crystal display element suitable for connecting a flexible substrate such as a substrate for a CP (Tape Carrier Package).

[0002]

2. Description of the Related Art One of the processes for manufacturing a liquid crystal display element is to form an anisotropic conductive film (anis) on an electrode lead terminal of a liquid crystal display panel.
otropic conductive film: A
For example, there is a step of connecting a lead terminal portion of a TCP substrate via the CF).

Referring to FIG. 5, a liquid crystal display panel 1 is composed of a pair of transparent electrode substrates 2 and 3 bonded together via a peripheral sealing material 4 and a liquid crystal 5 sealed in the cell. The electrode extraction terminal portion 3
a is provided continuously. Although not shown in detail, the electrode extraction terminal portion 3a has the same ITO (Indi) as the transparent electrode.
An extraction electrode group made of um tin oxide) is formed.

The liquid crystal display panel 1 is mounted on a predetermined work base B
After being placed on the upper surface, the lead terminal portion 7a of the TCP substrate 7 is superposed on the electrode lead terminal portion 3a via the anisotropic conductive film 6, and the heater bar 8 is pressed from above to heat the liquid crystal, thereby obtaining the liquid crystal. The lead terminal portions 7a of the TCP substrate 7 are collectively connected to the electrode lead terminal portions 3a of the display panel 1.

[0005]

As described above, the heating and pressurizing by the heater bar 8 deforms the conductive particles in the anisotropic conductive film 6 and cures the thermosetting resin, thereby providing an electrical connection. Although a stable connection can be obtained, it is necessary to deform the conductive particles in the anisotropic conductive film 6 by about 1 to 3 μm over the entire area in order to obtain a stable electric connection.

For this purpose, it is important to make the pressure distribution uniform by adjusting the balance and flatness of the pressing surface of the heater head 8 and the pressed surface of the lead terminal portion 7a. By the way, if adjustment of balance or flatness is not appropriate,
Bubbles remain on the connection surface, causing undesirable problems such as a decrease in mechanical connection strength and a decrease in reliability of electrical connection.

However, conventionally, the heater head 8
On the other hand, a very hard material such as stainless steel is used. On the other hand, the thickness of the TCP terminal 7 on the lead terminal portion 7a side varies, so that adjustment of the balance and flatness is delicate. It was difficult and difficult, and considerable time and effort was spent adjusting it.

In such a situation, a single liquid crystal display panel is used.
If a TCP substrate is thermocompression-bonded to each of them at once, the difficulty will be further increased.

The present invention has been made to solve such a problem, and an object of the present invention is to heat a lead terminal of a TCP substrate to an electrode lead terminal of a liquid crystal display panel through an anisotropic conductive film. An object of the present invention is to provide an apparatus for manufacturing a liquid crystal display element capable of uniformly applying pressure to a thermocompression-bonded portion without performing a difficult adjustment operation when performing pressure bonding.

[0010]

In order to achieve the above object, the present invention relates to a liquid crystal display panel, comprising: a lead terminal portion of a flexible substrate laminated on an electrode lead terminal portion via an anisotropic conductive film; A heating fluid supply source for supplying a heating fluid at a predetermined pressure, the device comprising: a heating fluid supply source for supplying a heating fluid at a predetermined pressure; A heating and pressurizing means for expanding with a heating fluid supplied from a fluid supply source and pressing the sealing portion in close contact with the overlapping portion.

[0011] In the present invention, the heating and pressurizing means is connected to the heating fluid supply source, and a box having an opening at a surface facing the overlapping portion; It preferably comprises an expandable and contractible film body hermetically attached to the portion.

The heating and pressurizing means includes an inflatable and contractible bag connected to the heating fluid supply source, and an opening formed on a surface opposed to the overlapping portion, and the opening is formed therein. In this case, it is more preferable that an air communication hole is provided in a predetermined portion of the box.

In any of the embodiments, it is preferable that the portion in close contact with the overlapping portion is made of silicon rubber reinforced with glass fiber.
With appropriate strength, it can be elastically brought into contact with the overlapped portion and can be satisfactorily thermocompression-bonded.

According to the present invention, since the film or bag serving as the heating / pressing means comes into elastic contact with the joint, the anisotropic conductive film is provided on the electrode lead-out terminal of the liquid crystal display panel. When the lead terminal portions of the flexible substrate are overlapped with each other via heat and pressure bonding, the work for adjusting the degree of balance and flatness can be omitted.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in more detail based on an embodiment using air as a fluid shown in the drawings, but the same effect can be obtained when the fluid is a liquid.

In this embodiment, the liquid crystal display panel and the TCP substrate thermocompression-bonded to the electrode lead-out terminal of the liquid crystal display panel are particularly modified, including the anisotropic conductive film as a joining means. Since these parts are not necessary, refer to FIG. 5 described above for those parts.

FIG. 1 is a schematic perspective view showing a first embodiment of the present invention, and FIG. 2 is a sectional view of a main part thereof. According to this, a TCP is connected to the electrode lead terminal 3a of the liquid crystal display panel 1.
When performing thermocompression bonding of the lead terminal portion 7a of the substrate 7 via the anisotropic conductive film 6, a heating air supply source 10 that supplies heated air heated to a predetermined temperature at a predetermined pressure as thermocompression bonding means, The heating and pressurizing means 20 is provided on the overlapping portion 9 of the electrode lead terminal portion 3a and the lead terminal portion 7a.

As the heating air supply source 10, a compressor having, for example, an electric heater as air heating means is used. In the first embodiment, the heating and pressurizing means 2 is used.
0 is provided with a box 21 connected to the heated air supply source 10 via the switching valve 11.

In this case, a surface of the box 21 facing the overlapping portion 9 is an opening 211, and a film body (diaphragm) 22 that can expand and contract is airtightly attached to the opening 211. ing. Preferably, the film body 22 is made of silicon rubber reinforced with glass fiber.

Although not shown in detail, the switching valve 11
Is "open" which connects the heated air supply source 10 and the box 21.
The position can be selectively switched to a “blocking” position in which the space between the heated air supply source 10 and the box 21 is cut off and the inside of the box 21 is opened to the atmosphere.

Here, the operation of this device will be described. First, as shown in FIG. 5, the liquid crystal display panel 1 is placed on the work base B, and the lead terminals of the TCP substrate 7 are placed on the electrode lead terminal portions 3a via the anisotropic conductive film 6. The part 7a is overlapped.

Then, the box 2 is placed on the overlapping portion 9.
Set 1 to set the switching valve 11 to the "open" position. As a result, heated air is supplied from the heated air supply source 10 into the box 21 at a predetermined pressure, and the film 22 expands by the pressure to press and heat the overlapping portion 9. After the end of the heating, the switching valve 11 is set to the "cutoff" position, and the inside of the box 21 is opened to the atmosphere.

Next, a second embodiment of the present invention will be described with reference to a schematic perspective view of FIG. 3 and a sectional view of a main part of FIG. The difference between the second embodiment and the first embodiment is that the first embodiment uses the expandable / contractible film body 22 for the heating / pressurizing means 20, whereas the second embodiment employs the expansion / contraction. The point is that a possible bag body 23 is used.

That is, also in the second embodiment, the box 21 having the opening 211 on the surface facing the overlapping portion 9 is provided. The bag body 23 is stored, and the bag body 23 is
To the heated air supply source 10. The bag 23 is preferably made of silicon rubber reinforced with glass fiber like the film 22.

The bag 23 is inflated by the heated air supplied from the heated air supply source 10. According to the second embodiment, since the surrounding four surfaces and the upper surface are surrounded by the box 21, the bag 23 is inflated. It swells out of the opening 211 on the lower surface of the body 21 and is heated while pressing the overlapping portion 9 as in the first embodiment.

The box 21 is pressed against the overlapping portion 9 with an appropriate force so that the box 21 does not rise due to the repulsive force at the time of heat compression by the expansion of the bag 23, and the opening 211 is formed. In the second embodiment, air communication holes 21 are provided in predetermined portions of the box 21 so that the bag 23 can be smoothly expanded and contracted in the box 21.
2 are provided.

As described above, according to the first and second embodiments, the film body 22 or the bag body 23 is inflated by the heated air to press the above-mentioned overlapping portion 9, so that the overlapping portion 9 is pressed. Even if the lead terminal portion 7a has irregularities, the irregularities can be absorbed and pressure can be applied uniformly.

Therefore, heat and pressure can be uniformly applied to the anisotropic conductive film 6, and
The conductive particles inside are uniformly deformed, and the thermosetting resin itself is also hardened uniformly, so that stable electrical connection is possible.

The heating and pressing means 20 of the first and second embodiments
As an example of conditions for thermocompression bonding, the temperature of heated air is 200 to 300 ° C. and the pressure is 20 to 40 kg / cm ^2.
Then, the thermocompression bonding time is about 20 seconds, but it is preferable that the work base B side is also heated to about 40 ° C.

[0030]

As described above, according to the present invention,
When a lead terminal portion of a flexible substrate is overlapped with an electrode lead terminal portion of a liquid crystal display panel via an anisotropic conductive film, and heated and pressurized from the lead terminal portion side, expansion is performed by a heating fluid as a heating and pressing means. By using a membrane or bag, uniform thermocompression bonding can be performed without adjusting the balance or flatness, which is difficult when using a metal heater bar, and a stable electrical The connection status is obtained.

Further, according to the present invention, a uniform pressure can be applied irrespective of the unevenness of the pressing surface. Simultaneous batch thermocompression bonding is also possible.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a first embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the first embodiment.

FIG. 3 is a schematic perspective view showing a second embodiment of the present invention.

FIG. 4 is a sectional view of an essential part of a second embodiment.

FIG. 5 is a schematic sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2, 3 Transparent electrode substrate 3a Electrode lead-out terminal part 4 Peripheral sealing material 5 Liquid crystal 6 Anisotropic conductive film 7 TCP substrate (flexible substrate) 7a Lead terminal part 9 Overlapping part 10 Heating fluid supply source 11 Switching valve Reference Signs List 20 heating / pressurizing means 21 box 211 opening 212 air communication hole 22 film 23 bag

Claims (5)

[Claims] 1. A lead terminal portion of a flexible substrate is overlapped on an electrode lead terminal portion of a liquid crystal display panel via an anisotropic conductive film, and the overlapped portion is pressed from the lead terminal portion side to press the lead terminal portion. A heating fluid supply source for supplying a heating fluid at a predetermined pressure, and a heating fluid supplied from the heating fluid supply source to expand and overlap the liquid crystal display element. An apparatus for manufacturing a liquid crystal display device, comprising: a heating / pressurizing unit that presses in close contact with a mating portion. 2. The heating and pressurizing means is connected to the heating fluid supply source, and a box having an opening at a surface facing the overlapping portion is provided on the opening of the box. 2. The apparatus for manufacturing a liquid crystal display element according to claim 1, comprising an expandable and contractible film body attached in an airtight manner. 3. The heating and pressurizing means has an inflatable and contractible bag connected to the heating fluid supply source, and a surface facing the overlapping portion has an opening. 2. The apparatus for manufacturing a liquid crystal display device according to claim 1, wherein the device comprises a housed box. 4. The apparatus for manufacturing a liquid crystal display element according to claim 3, wherein a communication hole for air is provided in a predetermined portion of the box. 5. The apparatus for manufacturing a liquid crystal display device according to claim 1, wherein the portion that is in close contact with the overlapping portion is made of silicon rubber reinforced with glass fiber.