JPH11340630A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce line crosstalk and emissive noise, by providing a plurality of divided conductive layers with signaling conductive layers and connections connecting each of divided conductive layers, the signaling conductive layers which divide the divided conductive layers into first and second conductive layers in one side of plane direction and constitute a multilayer substrate along with the first and the second conductive layers. SOLUTION: In a printed wiring board, signaling conductive layers are formed on a plurality of divided conductive layers 20, each of which divides the divided conductive layer 20 into a first ground conductive layer 1 and a second ground conductive layer 2 in one side of plane direction, and positions signal wires 3a and 3b along with the first and the second conductive layers 1 and 2 between the first ground layer 1 and the second conductive layer 2. Furthermore, each of divided conductive layers 20 is connected to each other by a connection 7 as an inductive element. As a result, line crosstalks generated with the signaling conductive layer and outward emission noise can be reduced without spoiling the reliability of performance in the ground conductive layers 1 and 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board capable of reducing line-to-line crosstalk and radiation noise.

[0002]

2. Description of the Related Art FIG.
FIG. 8 is a configuration diagram illustrating a printed wiring board disclosed in Japanese Patent Publication No. 7-No. 7; In FIG. 12, reference numeral 100 denotes a power supply layer or a ground layer of the printed wiring board, and 101 denotes an opening that diagonally separates the layer surface of the power supply layer or the ground layer 100 along a diagonal line. In this printed wiring board, one or both of the power supply layer and the ground layer 100 is provided with an opening 101 for diagonally dividing a layer surface along a diagonal line. Such a printed wiring board is a multilayer printed wiring board in which a power supply layer and a ground layer are stacked, and an opening 101 that diagonally separates a layer surface along a diagonal line is provided in one or both of the power supply layer and the ground layer 100. Thus, the resonance phenomenon in a specific frequency band is suppressed, and the radiation noise in that frequency band is reduced.

[0003]

Since the conventional printed wiring board is constructed as described above, an opening 101 for diagonally dividing the layer surface along a diagonal line is formed in one or both of the power supply layer and the ground layer 100. With this arrangement, a resonance phenomenon in a specific frequency band can be suppressed and radiation noise in the frequency band can be reduced. On the other hand, a signal line having at least a first ground conductor layer and a second ground conductor layer is provided. In a printed wiring board adopting a structure in which the radiation noise is sandwiched between these ground conductor layers, there is a problem that radiation noise needs to be further suppressed.

Further, the conventional printed wiring board is intended for a wiring board in which at least a power supply layer and a ground layer are stacked, and therefore has a problem that it cannot be applied to a wiring board in which only a ground layer is stacked.

To supplement the description, a plurality of circuits having different properties generally use a dedicated ground for each circuit. For example, in a printed circuit board in which digital circuits and analog circuits are mixed, a dedicated ground conductor is provided for each circuit. It suppresses line-to-line crosstalk on such a printed wiring board, and also prevents high-speed signals flowing through clock signal lines and the like arranged on the printed wiring board from giving electromagnetic interference to the outside of the printed wiring board. In order to adjust the characteristic impedance, a structure is adopted in which a signal line through which such a high-speed signal flows is sandwiched between a first ground conductor layer (for example, for a digital circuit) and a second ground conductor layer (for example, for an analog circuit). May be.

[0006] In such a printed wiring board, radiation noise is generated by the parallel flat plate formed by the first ground conductor layer and the second ground conductor layer, that is, the noise is generated when the signal line disposed therebetween supplies power. The radiation due to the mode must be suppressed. In such a case, mere provision of a hole in the ground conductor layer has a low effect of suppressing radiation noise. Furthermore, it is necessary to lower the impedance of the ground conductor layer of circuits using high-speed signals such as digital circuits, and making a hole in this layer can improve the performance as the ground conductor layer and reduce radiation noise. However, it is naturally undesirable to form holes in both ground conductor layers in terms of performance reliability and radiation noise suppression.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a printed wiring board capable of effectively reducing line-to-line crosstalk and radiation noise without impairing the reliability of the performance of a conductor layer. The purpose is to gain.

[0008]

A printed wiring board according to the present invention comprises a first conductor layer and a second conductor layer, one of which is divided into a plurality of divided conductor layers in a plane direction; A signal conductor layer formed between the first conductor layer and the second conductor layer and forming a multilayer substrate together with the first conductor layer and the second conductor layer; and connecting the divided conductor layers to each other And a connecting portion as an inductance element.

The printed wiring board according to the present invention has a first ground conductor layer and a second ground conductor layer, one of which is divided into a plurality of divided conductor layers in a plane direction, and the first ground conductor. The signal conductor layer, which is formed between the first conductor layer and the second ground conductor layer and forms a multilayer substrate together with the first and second ground conductor layers, is connected to each of the divided conductor layers. And a connection portion as an inductance element.

[0010] A printed wiring board according to the present invention has a configuration in which a signal wiring through which a high-frequency signal flows and a signal wiring for a low-frequency signal including direct current and a power supply are formed by a signal conductor layer. It was made.

In the printed wiring board according to the present invention, a signal wiring through which a high-frequency signal flows is constituted by a signal conductor layer, and a signal wiring for a low-frequency signal including direct current or a power supply is formed by a first ground conductor. And a configuration arranged and formed outside the layer and the second ground conductor layer.

In the printed wiring board according to the present invention, a divided ground conductor layer is formed only in a region where a signal wiring through which a high-frequency signal flows and a signal wiring for a low-frequency signal including direct current or a power supply are formed. It is something to do.

In the printed wiring board according to the present invention, a divided ground conductor layer is formed by the first ground conductor layer or the second ground conductor layer so as to cover a region where the signal wiring through which a high-frequency signal flows is formed. It is something to do.

In the printed wiring board according to the present invention, a signal wiring through which a high-frequency signal flows is arranged and formed at a predetermined distance from the side of the divided ground conductor layer.

A printed wiring board according to the present invention is used for a low frequency signal including a direct current and a power source outside a first ground conductor layer or a second ground conductor layer which is divided to form a plurality of divided ground conductor layers. Signal wiring for
A signal wiring between the first ground conductor layer and the second ground conductor layer, through which a high-frequency signal flows,
It is formed so as not to be parallel to the gap between the adjacent divided ground conductor layers.

In the printed wiring board according to the present invention, a connection portion as an inductance element is constituted by a pattern connecting the divided ground conductor layers.

In the printed wiring board according to the present invention, a pattern as a connection part as an inductance element is formed on the component mounting surface or the first ground conductor layer or the second ground conductor layer constituting each divided ground conductor layer. It is to be formed.

A printed wiring board according to the present invention is provided with a power supply conductor layer divided into a plurality of divided conductor layers and having a connection as an inductance element connecting the divided conductor layers. .

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIG. 1 is a sectional view showing a configuration of a printed wiring board having a laminated structure according to the first embodiment. FIG.
FIG. 2 is a structural explanatory diagram illustrating a layer configuration of the printed wiring board having the multilayer structure illustrated in FIG. 1. The configuration of the printed wiring board shown in FIGS. 1 and 2 is an example, and shows a six-layer board. In FIG. 1, 1 is a first ground conductor layer, 2 is a second ground conductor layer, and 3 is a signal conductor formed between the first ground conductor layer 1 and the second ground conductor layer 2. The layers 4 and 4 are the outer signal conductor layers and the power supply conductor layer 5 is disposed adjacent to one surface of the first ground conductor layer 1.

As described above, the signal conductor layer 3 is arranged inside the first ground conductor layer 1 and the second ground conductor layer 2, and the signal conductor layer 4 is arranged outside. The power supply conductor layer 5 is arranged adjacent to one surface of the first ground conductor layer 1. The signal conductor layer 4 may serve as a component mounting surface or may also serve as a component mounting surface, and each layer is insulated by a dielectric layer 6.

In FIG. 2, the dielectric layer 6 is omitted. Further, the power supply conductor layer 5 may not be formed, and the power supply conductor may be arranged as a part of the power supply conductor layer 5 in FIG. 1 or in the signal conductor layer 4 or the like. In this printed wiring board, a high-speed signal line through which a high-speed signal flows is arranged on the signal conductor layer 3 inside the first ground conductor layer 1 and the second ground conductor layer 2. This electromagnetically shields the high-frequency component of the high-speed signal line from the outside of the first ground conductor layer 1 and the second ground conductor layer 2 or the outside of the substrate, and the wiring on the outside signal conductor layer 4 In addition, crosstalk and electromagnetic interference to the outside are suppressed, and the characteristic impedance of the signal line is adjusted.

The high-speed signal is a signal containing high-frequency components such as a clock signal and a data signal when the printed wiring board is a board for a digital circuit. For example, a periodic signal contains a harmonic frequency component including a fundamental frequency. This current excites the first ground conductor layer 1 and the second ground conductor layer 2 as parallel flat plates to generate radiation noise.
In particular, radiation noise increases near the resonance frequency. Therefore, the second ground conductor layer 2 is divided, and each divided ground conductor layer obtained by division is connected by an element having low impedance for direct current and low frequency, and high impedance for high frequency, The radiation noise is suppressed by changing the resonance frequency. Alternatively, by connecting the divided ground conductor layers with a conductor or the like penetrating the ferrite bead, a configuration that gives a loss to a high-frequency current to the second ground conductor layer 2 is employed to suppress radiation noise. In this case, the second ground conductor layer 2
It is desirable that the conductor is not a ground conductor for the digital circuit.

For example, in the case of a printed circuit board in which digital circuits and analog circuits are mixed, the first ground conductor layer 1 is used for digital circuits, and the second ground conductor layer 2 is used for analog circuits. The second ground conductor layer 2 is divided by the above configuration. If the assignments for digital and analog circuits are interchanged,
The above-described configuration in which the first ground conductor layer 1 is divided using an inductance element is employed.

In the case of a printed wiring board having a laminated structure in which the signal conductor layer 3 is disposed between the first ground conductor layer 1 and the second ground conductor layer 2, the number of layers is smaller or larger than six. It is also possible to apply to the substrate.

As a result, a printed wiring board which can reduce electromagnetic interference to the outside and radiation noise such as crosstalk between lines can be obtained.

FIG. 3 is a plan view showing a specific example of the configuration of the divided ground conductor layer in the printed wiring board described above. The divided ground conductor layer shown in FIG. Yes, the first ground conductor layer 1
Alternatively, if any one of the second ground conductor layers 2 is divided, effects such as reduction of electromagnetic interference to the outside and radiation noise including crosstalk between lines can be expected.

In FIG. 3, the second ground conductor layer 2
1 shows a configuration in which the divided ground conductor layers 20 are divided by the inductance element 7 (connection portion). The inductance element 7 includes a lossy inductance element such as a conductor penetrating a ferrite bead.
In this embodiment, the inductance element 7 is usually arranged not on the second ground conductor layer 2 but on the component mounting surface. Therefore, the connection portion for connecting the inductance element 7 such as a lossy inductance element such as a conductor penetrating the ferrite bead is connected to each of the divided ground conductor layers 20 by a through hole or the like. It is configured on the component mounting surface.

FIG. 4 shows the divided ground conductor layer 20 and the first ground conductor layer 1 when the second ground conductor layer 2 is divided, and between the divided ground conductor layer 20 and the first ground conductor layer 1. FIG. 3 is a partial cross-sectional view showing a configuration relationship of a signal wiring which is a signal conductor layer 3 of FIG. In FIG. 4, 3a
Is a signal wiring on which a signal of a high frequency is carried, and 3b is a signal wiring such as a power supply wiring conductor for a low frequency signal including DC. In the first embodiment, the signal wires 3a and 3b are laid out between the first ground conductor layer 1 and the divided ground conductor layers 20. Note that the signal lines 3a, 3 shown in FIG.
"b" indicates that it is formed perpendicular to the paper surface. Further, in FIG. 3, the second ground conductor layer 2 is divided into four parts, but may be another division number such as two. They are,
The same applies to the following embodiments.

The inductance element 7 separates a high frequency component by an inductance element having a high impedance with respect to a high frequency, or is a high-frequency, high impedance and lossy ferrite bead or other magnetic material penetrating type conductor, and has a high frequency component with a high impedance. Increase. Thereby, the first
In the parallel plate formed by the ground conductor layer 1 and the second ground conductor layer 2, the resonance frequency in the mode fed by the signal wiring 3a is changed, or the electromagnetic field induced between the ground conductor layers 1 and 2 , The radiation noise can be reduced.

As described above, according to the first embodiment, the first ground conductor layer 1 and the second ground conductor layer 2
In the printed wiring board having a configuration in which the signal conductor layers such as the signal wirings 3a and 3b are sandwiched between the first and second ground conductor layers 1 and 2, When a circuit and an analog circuit coexist, the ground conductor layer for an analog circuit generally functioning as a current feedback circuit is divided, and the resulting divided ground conductor layers are connected by an inductance element 7. For the parallel plate formed by the first ground conductor layer 1 and the second ground conductor layer 2, the signal wiring 3
The print that can change the resonance frequency by the mode fed by a or attenuate the electromagnetic field induced between the ground conductor layers 1 and 2 and reduce external electromagnetic interference such as crosstalk between lines and radiation noise There is an effect that a wiring board can be obtained. Further, by arranging the signal wires 3a and 3b between the first ground conductor layer 1 and the second ground conductor layer 2, there is an effect that a printed wiring board whose characteristic impedance can be adjusted can be obtained.

Embodiment 2 FIG. 5 shows the second embodiment.
FIG. 2 is a partial cross-sectional view illustrating a configuration of a printed wiring board according to the first embodiment. 5, the same or corresponding parts as those in FIG. 4 are denoted by the same reference numerals, and description thereof will be omitted. Embodiment 2
In the first embodiment, the divided ground conductor layer 20 is provided only between the first ground conductor layer 1 and the divided ground conductor layer 20 formed by dividing the second ground conductor layer 2 only in the region where the signal wirings 3a and 3b are arranged. Is provided. Signal wiring 3a, 3
The position where “b” is arranged is arranged at least one pattern width inward from the side of the divided ground conductor layer 20. As a result, the area of the divided ground conductor layer 20 can be reduced, the resonance frequency can be shifted to a higher frequency, the radiation efficiency in a frequency band lower than the resonance frequency can be degraded, and the effect of suppressing radiation noise can be improved. it can. Further, the number of divisions of the second ground conductor layer 2 can be reduced, and the number of inductance elements 7 for connecting the divided ground conductor layers 20 can be reduced. In FIG. 5, the signal wiring 3b such as a power supply wiring conductor for low-frequency signals including direct current is shifted to one side, but the shape of the printed wiring board, including the vertical and horizontal directions, is not limited.

As described above, according to the second embodiment, by providing the divided ground conductor layer 20 only in the area where the signal wirings 3a and 3b are arranged, crosstalk between lines can be reduced.
There is an effect that a printed wiring board that can reduce electromagnetic interference to the outside and radiation noise can be obtained. Further, a printed wiring board capable of adjusting the characteristic impedance by arranging the signal wires 3a and 3b between the first ground conductor layer 1 and the second ground conductor layer 2 divided into the divided ground conductor layers 20 is provided. There is an effect that can be obtained.

Further, the second ground conductor layer 2 is divided into a plurality of divided ground conductor layers 20, and the positions where the signal lines 3 a and 3 b are arranged are set at one position with respect to the divided ground conductor layers 20.
By arranging the printed circuit board so as to be located at least inside the width of the pattern, a printed wiring board can be obtained in which the effect of suppressing radiation noise is enhanced and the number of inductance elements 7 for connecting the divided ground conductor layers 20 can be reduced. Has the effect.

Embodiment 3 FIG. 6 shows the third embodiment.
FIG. 2 is a partial cross-sectional view illustrating a configuration of a printed wiring board according to the first embodiment. 6, the same or corresponding parts as those in FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted. Embodiment 2
Thus, the signal conductor layer 3 disposed between the divided ground conductor layer 20 and the first ground conductor layer 1 is not only a signal wire 3a on which a high-frequency signal is mounted but also a power wire for a low-frequency signal including DC. Although a signal wiring 3b such as a conductor is included, in the third embodiment, the divided ground conductor layer 20 is provided only in a region of the signal wiring where the signal wiring 3a is arranged.

The signal wiring 3a is arranged at least one pattern width inside the divided ground conductor layer 20. Thereby, the area of the divided ground conductor layer 20 can be reduced,
By moving the resonance frequency higher, the radiation efficiency in a frequency band lower than the resonance frequency is degraded, and the effect of suppressing radiation noise can be enhanced. Further, since the divided ground conductor layer 20 is not provided in the area where the signal wiring 3b is arranged, but is provided only in the area where the signal wiring 3a is arranged, the area of the divided ground conductor layer 20 can be reduced. And the number of divisions of the second ground conductor layer 2 can be reduced.
Can be reduced in the number of inductance elements 7 for connecting.

In FIG. 6, the signal wiring 3b is moved to one side, but the shape of the printed wiring board, including the vertical and horizontal directions, is not limited, and the signal wiring 3a and the signal wiring 3b are arranged separately. Signal wiring 3b may be an analog signal line, an analog power supply line, or a ground line of a different type from the first ground conductor layer 1 and the second ground conductor layer 2. Electromagnetic coupling with the signal wiring 3b can also be suppressed.

As described above, according to the third embodiment, among the signal wirings, the signal wiring
By providing the divided ground conductor layer 20 only in the area where the “a” is disposed, the area of the divided ground conductor layer 20 can be reduced, and a printed wiring board that can reduce external electromagnetic interference and radiation noise such as crosstalk between lines can be obtained. Has the effect. Further, the signal wirings 3a, 3 are provided between the ground conductor layers 1, 2.
By arranging b, there is an effect that a printed wiring board whose characteristic impedance can be adjusted is obtained. Further, there is an effect that a printed wiring board that can reduce the number of inductance elements 7 for connecting the divided ground conductor layers 20 can be obtained. Further, there is an effect that a printed wiring board that can suppress electromagnetic coupling between the high-speed signal line and the low-speed signal line can be obtained.

Embodiment 4 FIG. FIG. 7 shows the fourth embodiment.
FIG. 2 is a partial cross-sectional view illustrating a configuration of a printed wiring board according to the first embodiment. 7, parts that are the same as or correspond to those in FIG. 5 are given the same reference numerals, and descriptions thereof will be omitted. Embodiment 7
In the printed wiring board described above, the signal conductor layer 3 disposed between the first ground conductor layer 1 and the divided ground conductor layer 20 is a signal wire 3a, and the signal wire 3b is the first ground conductor layer 1 and The configuration is such that it is arranged outside the second ground conductor layer 2.

As described above, according to the fourth embodiment, the first ground conductor layer 1 and the divided ground conductor layers 20
And the signal wiring 3b is arranged between
Is arranged outside the ground conductor layer 1 and the second ground conductor layer 2, the effect of obtaining a printed wiring board that can further enhance the effect of suppressing the electromagnetic coupling between the signal wiring 3a and the signal wiring 3b is obtained. is there. Also, the signal wiring 3
Since the isolation between the signal wiring 3a and the signal wiring 3b is structurally ensured, there is no need to consider it again when designing the board, and there is an effect that a printed wiring board capable of shortening the board design period and reducing the design load can be obtained. .

Embodiment 5 FIG. 8 shows the fifth embodiment.
FIG. 2 is a partial cross-sectional view illustrating a configuration of a printed wiring board according to the first embodiment. 8, the same or corresponding parts as those in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted. Embodiment 5
Then, the first ground conductor layer 1 and the divided ground conductor layer 2
The signal conductor layer 3 between 0 and 0 is only the signal wiring 3a,
Further, the signal wiring 3b is arranged outside the first ground conductor layer 1 and the second ground conductor layer 2. further,
In this configuration, the divided ground conductor layer 20 is provided only in the region where the signal wiring 3a is arranged.

As described above, according to the fifth embodiment, the first ground conductor layer 1 and the divided ground conductor layers 20
And only the signal wiring 3a is arranged between
Is arranged outside the first ground conductor layer 1 and the second ground conductor layer 2 and the divided ground conductor layer 20 is provided only in the area where the signal wiring 3a is arranged. There is an effect that a printed wiring board that can enhance the performance of suppressing the electromagnetic coupling with 3b is obtained.
Further, since the isolation between the signal wiring 3a and the signal wiring 3b is ensured structurally, it is not necessary to consider it again when designing the substrate. Further, there is an effect that a printed wiring board that can reduce the area of the divided ground conductor layer 20 and enhance the effect of suppressing radiation noise can be obtained. Also,
The signal wiring 3b is arranged outside the first ground conductor layer 1 and the second ground conductor layer 2, and the divided ground conductor layer 20 is provided only in the area where the signal wiring 3a is arranged. The conductor layer 20 is a signal wiring 3a
It is no longer necessary to divide the second ground conductor layer 2 in correspondence with the area of the signal wiring 3b and the number of divisions of the second ground conductor layer 2 can be reduced, and the area of the divided ground conductor layer 20 can be further reduced. Thus, there is an effect that a printed wiring board is obtained in which the number of inductance elements 7 for connecting the divided ground conductor layers 20 can be reduced.

Embodiment 6 FIG. FIG. 9 shows Embodiment 6
FIG. 2 is a partial cross-sectional view illustrating a configuration of a printed wiring board according to the first embodiment. In the printed wiring board according to the sixth embodiment, in the printed wiring board according to the first to fifth embodiments, the range between the first ground conductor layer 1 and the divided ground conductor layer 20 is different. The signal wiring is configured so as not to overlap in parallel with the gap 21 at the portion of the gap 21 dividing the second ground conductor layer 2. The gap 2
1 and the signal wiring are parallel to each other, the signal wiring is configured to be separated from the gap 21 by one pattern width or more, or the gap 21 is arranged in a direction having an angle with the signal wiring. Constitute.

As described above, according to the sixth embodiment, the first ground conductor layer 1 and the divided ground conductor layers 20
And a printed wiring board capable of easily securing safety with respect to the signal wiring in the gap 21 and the signal wiring outside the divided ground conductor layer 20 and the outside of the board. There is.

Embodiment 7 FIG. FIG. 10 is a partial sectional view showing a configuration of a printed wiring board according to the seventh embodiment. FIG. 11 is a top perspective view when the configuration of the printed wiring board shown in FIG. 10 is seen through from above, and the same or corresponding parts as in FIG. 9 are denoted by the same reference numerals and description thereof is omitted. In each of the printed wiring boards described in the first to sixth embodiments, the signal wiring 3a in the range sandwiched between the first ground conductor layer 1 and the divided ground conductor layer 20 is the second ground conductor. The signal wiring 40 in the upper layer with the layer 2 interposed therebetween is configured so as not to overlap with the signal wiring 40 in the gap 21 in parallel. When the signal wiring 40 and the signal wiring 3a are in a parallel positional relationship at the gap 21, the configuration is such that the signal wiring 40 and the signal wiring 3a are separated from each other by at least one pattern width.

In FIG. 11, the signal wiring 40 and the signal wiring 3a in the upper layer with the second ground conductor layer 2 interposed therebetween do not have a positional relationship in which the gap 21 overlaps each other and in parallel with the gap 21. Intersect (perpendicular) to the gap 21
Are arranged in a positional relationship.

As described above, according to the seventh embodiment, the signal wiring 3a and the outer signal wiring 4
This has the effect of obtaining a printed wiring board that can prevent the isolation from zero from deteriorating.

Embodiment 8 FIG. In each of the printed wiring boards described in the first to seventh embodiments,
Whether the connection between the divided ground conductor layers 20 is made by a conductor on the component mounting surface instead of the inductance element 7 or
Alternatively, a configuration in which connections are made in a pattern on the second ground conductor layer 2 may be employed.

With such a configuration, the effect of suppressing radiation noise is deteriorated. However, if the deterioration is within an allowable range, it is not necessary to use the inductance element 7 or the like for connection between the divided ground conductor layers 20. In addition, there is no need for a space for mounting components such as the inductance element 7, so that manufacturing costs can be reduced, or the use efficiency of the component mounting surface can be improved, and a printed wiring board that can reduce manufacturing costs can be obtained.

Embodiment 9 FIG. When the power supply conductor layer 5 is provided on the printed wiring board described in the first to eighth embodiments, the power supply conductor layer 5 is divided in the same manner as the second ground conductor layer 2, and the inductance element is formed. Alternatively, a configuration in which connections are made by using a connection may be adopted.

With this configuration, not only the radiation noise due to the ground conductor layer but also the power supply conductor layer 5
This has the effect of obtaining a printed wiring board that can also suppress radiation noise due to the radiation.

[0051]

As described above, according to the present invention, the first and second conductor layers, one of which is divided into a plurality of divided conductor layers in the plane direction, A signal conductor layer formed between a conductor layer and the second conductor layer and forming a multilayer board together with the first conductor layer and the second conductor layer; and an inductance connected between the divided conductor layers. Since it is configured to have a connection portion as an element, without deteriorating the reliability in performance of each conductor layer, crosstalk between lines by the conductor layer excited by the conductor layer for signal and external There is an effect that radiation noise can be effectively reduced.

According to the present invention, the first ground conductor layer and the second ground conductor layer, one of which is divided into a plurality of divided ground conductor layers in the plane direction, A signal conductor layer formed between the second ground conductor layer and the first ground conductor layer and the second ground conductor layer to form a multilayer board; and an inductance connected between the divided ground conductor layers. And a connecting portion as an element, so that the crosstalk between the lines by the ground conductor layer excited by the signal conductor layer and the external This has the effect of effectively reducing radiation noise to the device.

According to the present invention, the signal wiring through which the high frequency signal flows and the signal wiring for the low frequency signal including direct current and the power supply are formed in the signal conductor layer. This has the effect of effectively reducing line-to-line crosstalk and external radiation noise caused by the ground conductor layer excited by the signal wiring through which the high-frequency signal of the signal conductor layer flows, without impairing the reliability of the signal conductor layer.

According to the present invention, the signal wiring through which the high-frequency signal flows is formed in the signal conductor layer, and the signal wiring for the low-frequency signal including direct current and for the power supply is connected to the first ground conductor layer and the first conductor layer. 2 is provided outside the ground conductor layer, so that line crosstalk and radiation from the signal wiring through which the high-frequency signal flows to the signal wiring for a low-frequency signal including direct current or a power supply are included. There is an effect that noise can be effectively reduced.

According to the present invention, the divided ground conductor layer is formed only in the region where the signal wiring through which the high-frequency signal flows and the signal wiring for the low-frequency signal including direct current and the power supply are formed. With this configuration, the crosstalk between lines due to the ground conductor layer excited by the signal wiring through which the high-frequency signal flows can be achieved without impairing the performance reliability of each ground conductor layer by the small-area divided ground conductor layer. This has the effect of effectively reducing external radiation noise.

According to the present invention, the divided ground conductor layer configured to cover the area where the signal wiring through which the high-frequency signal flows flows is formed by the divided first ground conductor layer or the second ground conductor layer. Since the ground conductor layer is formed, the divided ground conductor layer having a smaller area allows the ground conductor layer to be excited by the signal wiring through which the high-frequency signal flows without impairing the performance reliability of each ground conductor layer. This has the effect of effectively reducing inter-crosstalk and external radiation noise.

According to the present invention, since the signal wiring through which the high-frequency signal flows is provided inside the divided ground conductor layer at a predetermined distance from the side, the divided ground conductor having a small area is provided. The layers more effectively reduce line-to-line crosstalk and external radiation noise caused by the ground conductor layer excited by the signal wiring through which the high-frequency signal flows without impairing the performance reliability of each ground conductor layer. There is an effect that can be reduced.

According to the present invention, there are provided a plurality of divided ground conductor layers which are divided to constitute a plurality of divided ground conductor layers. The signal wiring and the signal wiring in which a high-frequency signal flows between the first ground conductor layer and the second ground conductor layer flow in a positional relationship that is not parallel to the gap between the adjacent divided ground conductor layers. Since the arrangement is provided, there is an effect that the effects of crosstalk between lines due to the gap and radiation noise to the outside can be effectively reduced.

According to the present invention, since the connection portion as the inductance element is formed by the pattern connecting the divided ground conductor layers, a space for mounting components is not required as compared with the case where an inductance element or the like is used, and the manufacturing cost is reduced. Ground conductors that are excited by the signal conductor layer without reducing the manufacturing efficiency and improving the use efficiency of the component mounting surface, reducing manufacturing costs, and without impairing the performance reliability of each ground conductor layer. This has the effect of effectively reducing line-to-line crosstalk and radiation noise due to the layers.

According to the present invention, there is provided a structure in which a pattern as a connection portion as an inductance element is formed on the component mounting surface or the first ground conductor layer or the second ground conductor layer constituting each divided ground conductor layer. As a result, component mounting space is not required, manufacturing costs can be reduced, and the use efficiency of component mounting surfaces can be improved, manufacturing costs can be reduced, and the reliability of the performance of each ground conductor layer can be reduced. This has the effect of effectively reducing line-to-line crosstalk and radiated noise caused by the ground conductor layer excited by the signal conductor layer without damaging the signal conductor layer.

According to the present invention, since the power supply conductor layer is divided into a plurality of divided conductor layers and has a connection portion as an inductance element connecting the divided conductor layers, the ground conductor layer is provided. This has the effect of suppressing not only the radiation noise due to the radiation but also the radiation noise due to the power supply conductor layer.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a printed wiring board according to Embodiment 1 of the present invention.

FIG. 2 is a structural explanatory view showing a layer configuration of the printed wiring board according to Embodiment 1 of the present invention;

FIG. 3 is a plan view showing a specific example of a configuration of a divided ground conductor layer in the printed wiring board according to Embodiment 1 of the present invention.

FIG. 4 is a partial cross-sectional view showing a configuration relationship between a divided ground conductor layer and a first ground conductor layer and a signal wiring in the printed wiring board according to Embodiment 1 of the present invention.

FIG. 5 is a partial cross-sectional view showing a configuration of a printed wiring board according to Embodiment 2 of the present invention.

FIG. 6 is a partial cross-sectional view showing a configuration of a printed wiring board according to Embodiment 3 of the present invention.

FIG. 7 is a partial sectional view illustrating a configuration of a printed wiring board according to Embodiment 4 of the present invention;

FIG. 8 is a partial cross-sectional view showing a configuration of a printed wiring board according to Embodiment 5 of the present invention.

FIG. 9 is a partial sectional view showing a configuration of a printed wiring board according to Embodiment 6 of the present invention.

FIG. 10 is a partial sectional view showing a configuration of a printed wiring board according to Embodiment 7 of the present invention.

FIG. 11 is a top perspective view when the configuration of a printed wiring board according to Embodiment 7 of the present invention is seen through from above.

FIG. 12 is a configuration diagram showing a conventional printed wiring board disclosed in Japanese Patent Application Laid-Open No. H7-111387.

[Explanation of symbols]

1 first ground conductor layer, 2 second ground conductor layer, 3 signal conductor layer, 3a, 3b, 40 signal wiring,
5 conductor layer for power supply, 7 inductance element (connection part), 20 divided ground conductor layers, 21 gaps.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Mitsuhiko Kanda, 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Katsumi Toyama 2-3-2, Marunouchi, Chiyoda-ku, Tokyo Rishi Electric Co., Ltd. (72) Inventor Yu Uchida 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Hideki Tsuruse 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside the corporation

Claims (11)

[Claims] A first conductor layer and a second conductor layer, one of which is divided in a plane direction into a plurality of divided conductor layers; and the first conductor layer and the second conductor layer. A printed wiring comprising: a signal conductor layer which is formed between layers and constitutes a multilayer substrate together with the first conductor layer and the second conductor layer; and a connection portion serving as an inductance element connecting the divided conductor layers. substrate. 2. The printed wiring board according to claim 1, wherein the conductor layer is a ground conductor layer. 3. The signal conductor layer according to claim 2, wherein the signal conductor layer forms a signal wiring through which a high-frequency signal flows, and a signal wiring for a low-frequency signal including direct current or a power supply. Printed wiring board. 4. The signal conductor layer constitutes a signal wiring through which a high-frequency signal flows, and the signal wiring for a low-frequency signal including direct current or for a power supply is formed by a first ground conductor layer and a second ground. 3. The printed wiring board according to claim 2, wherein the printed wiring board is formed outside the conductor layer. 5. The divided ground conductor layer is formed only in a region where a signal wiring through which a high-frequency signal flows and a signal wiring for a low-frequency signal including direct current or a power supply are formed. The printed wiring board according to claim 3, wherein 6. The divided ground conductor layer is configured to cover only a region where a signal wiring through which a high-frequency signal flows is formed, and is formed by the divided first ground conductor layer or the second ground conductor layer. The printed wiring board according to claim 3, wherein 7. The printed wiring board according to claim 6, wherein the signal wiring through which the high-frequency signal flows is formed inside the side portion of the divided ground conductor layer by a predetermined distance. 8. A signal wiring for a low frequency signal including a direct current and a power supply outside of the first ground conductor layer or the second ground conductor layer which is divided to form a plurality of divided ground conductor layers, A signal wiring between the first ground conductor layer and the second ground conductor layer, through which a high-frequency signal flows, is formed in a non-parallel arrangement with a gap between adjacent divided ground conductor layers. The printed wiring board according to claim 4, wherein: 9. The printed wiring board according to claim 2, wherein the connection part as the inductance element is a pattern connecting the divided ground conductor layers. 10. The print according to claim 9, wherein the pattern is formed on the component mounting surface or the first ground conductor layer or the second ground conductor layer constituting each divided ground conductor layer. Wiring board. 11. A power supply conductor layer divided into a plurality of divided conductor layers and having a connection portion serving as an inductance element connecting said divided conductor layers, is provided. The printed wiring board according to any one of Nouichi.