JP4260243B2 - Laminated printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board that reduces line-to-line crosstalk and radiation noise in a laminated printed wiring board.
[0002]
[Prior art]
(1) Description of the configuration of the prior art
FIG. 18 shows, for example, a multilayer printed circuit board described in JP-A-7-111387. The invention of Japanese Patent Laid-Open No. 7-111387 is an invention concerning a multilayer printed circuit board in which at least a rectangular power source layer and a rectangular ground layer are laminated.
In FIG. 18, reference numeral 100 denotes a power supply layer or ground layer of the printed wiring board, and 101 denotes an opening that divides the layer surface of the power supply layer or ground layer 100 diagonally along a diagonal line. In this multilayer printed circuit board, an opening 101 is provided in one or both of the power supply layer and the ground layer to divide the layer surface diagonally along a diagonal line.
[0003]
(2) Description of operation and operation of the prior art
Such a multilayer printed circuit board shown in FIG. 18 suppresses a resonance phenomenon in a specific frequency band by providing an opening for obliquely dividing the layer surface along a diagonal line in one or both of the power supply layer and the ground layer. Then, radiation noise in the frequency band is reduced.
[0004]
[Problems to be solved by the invention]
(1) Explanation of problems in the prior art
The conventional multilayer printed circuit board is configured as described above, and an opening that diagonally divides the layer surface along a diagonal line is provided in one or both of the power supply layer and the ground layer, so that a specific frequency band is obtained. The resonance phenomenon is suppressed and radiation noise in the frequency band is reduced.
However, in order to suppress line-to-line crosstalk on the printed circuit board, and to prevent high-speed signals flowing through the clock signal lines and the like arranged on the printed circuit board from causing electromagnetic interference outside the circuit board, A circuit board that has a structure in which a signal line is sandwiched between a ground conductor layer and a power source conductor layer adds radiation due to the mode fed by the signal line, so radiation noise is high. However, there is a problem that radiation noise must be further suppressed.
[0005]
(2) Description of the object of the invention
The present invention has been made to solve the above-described problems. In a printed wiring board having a structure in which a signal line is sandwiched between a ground conductor layer and a power supply conductor layer, the power supply conductor layer is divided and the inductance property is increased. An object of the present invention is to provide a printed wiring board having a laminated structure that can be connected by an element (for example, a lossy inductance element such as a ferrite bead) to reduce crosstalk between lines and radiation noise.
[0006]
[Means for Solving the Problems]
A printed wiring board having a laminated structure having a structure in which a signal line is sandwiched between a ground conductor layer and a power conductor layer according to the present invention,
The power supply conductor layer is divided into a plurality of parts, and the divided power supply conductor layers are connected by a conductor.
[0007]
The divided power supply conductor layers are connected by an inductance element which is one of the conductors.
[0008]
The power source conductor layer may be disposed in a region where the signal line is wired.
[0009]
Further, the signal line is a signal line in which at least electromagnetic coupling between adjacent signal lines occurs in a specific frequency band,
The power supply conductor layer is disposed in a region where the signal line is wired.
[0010]
The signal line is not wired at a position where the signal line is disposed along a gap formed between the divided power supply conductor layers.
[0011]
Moreover, the printed wiring board having the above-described laminated structure further arranges a signal line in a layer arranged in the outer side direction of the printed wiring board from the power supply conductor layer,
The signal lines sandwiched between the power supply conductor layer and the ground conductor layer and the signal lines wired in a layer disposed on the outer side of the printed wiring board with respect to the power supply conductor layer are divided into the above-described divisions. It is characterized in that it is wired at a position where it does not overlap with a gap formed between the power supply conductor layers.
[0012]
Further, the inductance element is at least a ferrite bead.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
Hereinafter, the printed wiring board of Embodiment 1 of this invention is demonstrated based on figures.
FIG. 1 is a cross-sectional view illustrating a configuration of a printed wiring board having a laminated structure.
FIG. 2 is a diagram showing a layer structure of a printed wiring board having a laminated structure. 1 and 2 show a six-layer substrate as an example.
1 and 2, the signal conductor layer 3 is disposed inside the ground conductor layer 1 and the power supply conductor layer 2, and is disposed outside (on the side closer to the outside of the substrate than the power supply conductor layer 2). The signal conductor layer 4 is disposed on the layer and the layer disposed closer to the outside of the substrate than the ground conductor layer 1. The signal conductor layers 3 and 4 may become component mounting surfaces without arranging signals. Alternatively, the component mounting surface may also serve as the signal conductor layer. Each layer is insulated by a dielectric layer 5. In FIG. 2, the dielectric layer 5 is omitted. In the first embodiment, the high-speed signal line is arranged in the signal conductor layer 3 inside the ground conductor layer 1 and the power source conductor layer 2. Accordingly, the outer side of the ground conductor layer 1 and the power source conductor layer 2 (the layer disposed closer to the outer side of the substrate than the power source conductor layer 2 and the outer side of the substrate than the ground conductor layer 1) The layer arranged on the near side), or the high-frequency component of the high-speed signal line is electromagnetically shielded from the outside of the six-layer substrate shown in FIG. (Electromagnetic coupling between signal lines is called crosstalk) and electromagnetic interference to the outside of the substrate is suppressed.
[0014]
On the other hand, the high-speed signal line is a signal including high-frequency components such as a clock signal and a data signal when the printed wiring board is a digital circuit board. For example, a periodic wave signal includes harmonic frequency components including the fundamental frequency. This current excites the ground conductor layer 1 and the power source conductor layer 2 as parallel plates, and generates radiation noise. Particularly in the vicinity of the resonance frequency, the radiation noise becomes high.
Therefore, the radiated noise is suppressed by changing the resonance frequency by dividing the DC and low frequency with an element having low impedance and high frequency with respect to high frequency. For example, the power supply conductor layer 2 divided by a conductor penetrating a ferrite bead is divided, and the power supply conductor layer 2 is configured to give a loss to the high-frequency current in the power supply conductor layer 2 to reduce radiation noise. Suppress.
[0015]
3, 4, and 5 are diagrams for explaining the printed wiring board according to the first embodiment.
FIG. 3 is a plan view showing the power source conductor layer 20 of the present invention.
(A) to (d) are divided between the four conductor layers 20 for power supply, which are inductance elements, for example, ferrite beads (ferrite elements are used in a form in which ferrite is powdered, compressed and sintered. From the Nikkei Kogyo Shimbun, 3rd edition of the Japanese Dictionary of Technical Terms, which is an element that can be processed in this way to increase magnetism, increase specific resistance, and reduce overcurrent loss at high frequencies. (Excerpt: ferrite beads are an example of a ferrite element) are connected by an inductance element 6 including a conductor penetrating a ferrite bead. The inductance element 6 is not disposed on the power supply conductor layer but is usually disposed on the component mounting surface, for example, the signal conductor layer 4. FIG. 4 shows a cross-sectional view taken along line AA of FIG. 3 in which the power source conductor layer 20 is connected by the inductance element 6. In FIG. 4A, the signal conductor layer 4 is mounted with a conductor 51 penetrating a ferrite bead. The conductor 51 penetrating the ferrite bead is connected to the power source conductor layer 20 by a conductor wire 50 such as a through hole. FIG. 4B shows details of the conductor 51 penetrating the ferrite bead. The conductor 51 penetrating the ferrite bead has a shape in which the conductor 52 penetrates the inside of the ferrite bead 53 (ferrite block).
In the first embodiment, two layers of signal wirings 30 (hereinafter, the signal wirings 30 are also referred to as signal lines 30) are laid out between the ground conductor layer 1 and the power supply conductor layer 20 shown in FIG. FIG. 5 is a cross-sectional view taken along line BB in FIG. 3 of the signal wiring 30 wired between the ground conductor layer 1 and the power supply conductor layer 20. The signal wiring 30 in FIG. 5 indicates that it is perpendicular to the paper surface. That is, the signal wiring 30 a and the signal wiring 30 b are parallel to each other and are wired at the same angle with respect to the power supply conductor layer 20. However, as long as the signal wiring 30a and the signal wiring 30b are parallel to each other, they may be wired at different angles with respect to the power supply conductor layer 20.
In FIG. 3, the power supply conductor layer 20 is divided into four parts, but other numbers such as two parts may be used. The same applies to the following embodiments.
[0016]
The above is a printed wiring board having a laminated structure in which the signal conductor layer 3 is disposed between the ground conductor layer 1 and the power supply conductor layer 2, even for a wiring board having fewer or more layers than six layers. Apply.
[0017]
As described above, in the first embodiment, in the printed wiring board having a structure in which the signal line is sandwiched between the ground conductor layer and the power supply conductor layer, the power supply conductor layer is divided and divided by the inductance element. The power source conductor layer was connected. As a result, high-frequency components are lost by the magnetic through-type conductor using ferrite beads or the like having high impedance and loss at high frequencies. Further, for the parallel plate formed by the ground conductor layer and the power supply conductor layer, an electromagnetic field that changes the resonance frequency depending on the mode fed by the signal line or is induced between the ground conductor layer and the power supply conductor layer. The noise is reduced by attenuating.
[0018]
As described above, it is possible to obtain a printed wiring board capable of reducing electromagnetic interference and radiation noise on the outside of the substrate and the layer closer to the outside of the substrate, such as crosstalk between lines.
[0019]
Embodiment 2. FIG.
FIG. 6 is a cross-sectional view for explaining the printed wiring board according to the second embodiment.
Generally, in a printed wiring board having a laminated structure, the power source conductor layer has the same size as the wiring board. Here, as shown in FIG. 6, the power supply conductor layer 20 is provided only in a range where the signal wiring 30 between the power supply conductor layer 20 and the ground conductor layer 1 is disposed. Thereby, the area of the power supply conductor layer 20 can be reduced, and the resonance frequency can be moved higher. FIG. 7A shows that the frequency a is a resonance frequency when the power source conductor layer 20 and the wiring board have the same size. FIG. 7B shows that the frequency b (frequency a <frequency b) is a resonance frequency when the power supply conductor layer 20 is provided only in the range where the signal wiring 30 is disposed. Furthermore, the radiation efficiency in the frequency band lower than the resonance frequency can be degraded, and the effect of suppressing radiation noise can be enhanced. The signal wiring 30 is disposed on the inner side of the power conductor layer 20 by one pattern width or more (one pattern width is the width of the signal line). As shown in FIG. 6, when the width of the signal line 30 c is x, the signal line 30 c is arranged on the inner side by y (x ≦ y) from the end of the power supply conductor layer 20. This is to prevent the gap and the signal line from overlapping each other along the gap formed between the divided power supply conductor layers 20. If the gap and the signal line overlap, electromagnetic waves generated from the signal line are radiated from the gap, which is prevented.
[0020]
In addition, the number of divisions of the power supply conductor layer can be reduced, and the number of inductance elements for connecting the divided power supply conductors can be reduced. For example, in FIG. 3, the four power source conductor layers 20 of (A) to (D) are connected by the inductance element 6. If the signal line is wired only in the area where the power source conductor layer 20 of (A) and (C) is disposed, the power source conductor layer 20 of (A) and (D) is unnecessary. be able to.
In FIG. 6, the power source conductor layer 20 is moved to one side, but the shape including the vertical and horizontal directions of the wiring board is not limited.
[0021]
As described above, in the second embodiment, the power source conductor layer is provided only in the region where the signal line is located in the signal line layer sandwiched between the ground conductor layer and the power source conductor layer.
Thereby, it is possible to obtain a printed wiring board capable of reducing electromagnetic interference and radiation noise to the outside of the board and a layer closer to the outside of the board than the conductor layer, such as crosstalk between lines.
In addition, the effect of suppressing radiation noise can be enhanced.
Further, the number of inductive elements for connecting the divided power supply conductor layers can be reduced.
[0022]
Embodiment 3 FIG.
FIG. 8 is a cross-sectional view for explaining the printed wiring board according to the third embodiment.
In FIG. 8, the signal wiring 30 disposed between the power supply conductor layer 20 and the ground conductor layer 1 may include a low-speed signal line 32 in addition to the high-speed signal line 31. A high-speed signal line is a signal line in a frequency band where electromagnetic coupling between adjacent signal lines occurs. Conversely, the low-speed signal line is a signal line in a frequency band in which electromagnetic coupling between adjacent signal lines does not occur. Here, the power supply conductor layer 20 is provided only in a range where the high-speed signal line 31 is disposed in the signal wiring 30 between the power supply conductor layer 20 and the ground conductor layer 1. As a result, the area of the power source conductor layer 20 can be reduced, the resonance frequency is moved higher, and the radiation efficiency in the frequency band lower than the resonance frequency is deteriorated, thereby increasing the effect of suppressing radiation noise. Can do. The high-speed signal line 31 is arranged at least one pattern width inside the power supply conductor layer 20 as in the second embodiment. This is to prevent the gap and the signal line from overlapping each other along the gap formed between the divided power supply conductor layers 20. If the gap and the signal line overlap, electromagnetic waves generated from the signal line are radiated from the gap, which is prevented.
In addition, since the number of divisions of the power supply conductor layer can be reduced, the number of inductance elements for connecting the divided power supply conductor layers can be reduced.
In FIG. 8, the power source conductor layer 20 is moved to one side, but the shape thereof is not limited including the vertical and horizontal directions of the wiring board. Moreover, the structure which arrange | positions the block which gathered the high-speed signal line 31 and the block which gathered the low-speed signal line 32 separately is also included. By separating the blocks collecting the high-speed signal lines 31 from the blocks collecting the low-speed signal lines 32, electromagnetic coupling between the high-speed signal lines 31 and the low-speed signal lines 32 can be suppressed.
The low-speed signal line 32 includes an analog signal line and a power line different from the power conductor layer 20 and a ground line different from the ground conductor layer 1.
[0023]
As described above, in the third embodiment, the power supply conductor layer is provided only in the range where the high-speed signal line is wired. Thereby, it is possible to obtain a printed wiring board capable of reducing electromagnetic interference and radiation noise to the outside of the board and a layer closer to the outside of the board than the conductor layer, such as crosstalk between lines. In addition, the effect of suppressing radiation noise can be enhanced.
Further, it is possible to reduce the number of inductance elements for connecting the divided power supply conductor layers.
Furthermore, electromagnetic coupling between the high-speed signal line and the low-speed signal line can be suppressed.
[0024]
Embodiment 4 FIG.
FIG. 9 is a cross-sectional view for explaining the printed wiring board according to the fourth embodiment.
As shown in FIG. 9, only the high-speed signal line 31 is disposed between the power supply conductor layer 20 and the ground conductor layer 1, and the low-speed signal lines are the power supply conductor layer 20 and the ground conductor layer. 1 is disposed on a layer near the outside of the substrate, for example, the signal conductor layer 4.
[0025]
As described above, in the fourth embodiment, in a printed wiring board having a structure in which a signal line is sandwiched between a ground conductor layer and a power supply conductor layer, the power supply conductor layer is divided, and the divided power supply conductor layer is divided. Are connected by an inductance element, and only the high-speed signal line is laid out on the signal line layer sandwiched between the ground conductor layer and the power source conductor layer.
[0026]
As described above, the performance of suppressing electromagnetic coupling between the high-speed signal line 31 and the low-speed signal line can be improved by arranging the high-speed signal line and the low-speed signal line in different layers.
Also, since the isolation between the high-speed signal line and the low-speed signal line is structurally ensured when designing the board, there is no need to consider the arrangement of the high-speed signal line and the low-speed signal line in the same layer when designing the board. The board design period can be shortened and the design load can be reduced.
[0027]
Embodiment 5 FIG.
FIG. 10 is a cross-sectional view for explaining the printed wiring board according to the fifth embodiment.
As shown in FIG. 10, here, the signal line disposed between the power supply conductor layer 20 and the ground conductor layer 1 is only the high-speed signal line 31, and the low-speed signal line is used for the power supply conductor layer 20 and the ground. The conductor layer 1 is disposed on the layer outside the substrate, for example, the signal conductor layer 4. Further, the power source conductor layer 20 is provided only in the range where the high-speed signal line 31 is disposed between the power source conductor layer 20 and the ground conductor layer 1.
[0028]
As described above, in the fifth embodiment, the power supply conductor layer is provided only in the region where the high-speed signal line is present.
[0029]
As described above, the performance of suppressing electromagnetic coupling between the high-speed signal line and the low-speed signal line can be enhanced. Further, since the isolation between the high-speed signal line and the low-speed signal line is structurally ensured at the time of designing the board, it is not necessary to consider the arrangement of the high-speed signal line and the low-speed signal line in the same layer at the time of designing the board.
Moreover, the area of the power source conductor layer 20 can be reduced, and the effect of suppressing radiation noise can be enhanced.
Furthermore, the number of divisions of the power supply conductor layer can be reduced, and the inductance elements for connecting the divided power supply conductor layers can be reduced.
[0030]
Embodiment 6 FIG.
FIG. 11 is a cross-sectional view for explaining a printed wiring board according to the sixth embodiment.
In the printed wiring boards described in the above first to fifth embodiments, the signal wiring 30 sandwiched between the ground conductor layer 1 and the power supply conductor layer 20 has a gap 29 (between the divided power supply conductor layers 20 ( Hereinafter, the slit 29 and the signal wiring 30 are not overlapped along the gap 29). When the signal wiring 30 overlaps with the slit 29 along the slit 29, the signal wiring 30 is at least one pattern width (one pattern width is the width x of the signal wiring 30). The distance from the end of the power supply conductor layer 20 to the end of the signal wiring 30 is y (x <y), where x is the width of the signal line ) The signal lines were not overlapped along the slit 29.
[0031]
As described above, in the sixth embodiment, the signal line sandwiched between the ground conductor layer and the power conductor layer is overlapped with the slit along the slit at the slit portion between the divided power conductor layers. The layout was such that it would not be possible.
[0032]
As described above, it is possible to prevent deterioration of isolation between the signal wiring 30 and the signal conductor layer 4 or the isolation between the signal wiring 30 and the outside of the substrate at the slit portion.
[0033]
Embodiment 7 FIG.
FIG. 12 is a cross-sectional view for explaining a printed wiring board according to the seventh embodiment.
As shown in FIG. 12, in the printed wiring boards described in the first to sixth embodiments, the signal wiring 30 sandwiched between the ground conductor layer 1 and the power supply conductor layer 20 (in the seventh embodiment, the signal wiring 30 Therefore, the signal wiring 30 is referred to as the high-speed signal line 30), and the slit 29 is slit at the low-speed signal line 40 on the layer outside the substrate with the power supply conductor layer 20 interposed therebetween. The position is not overlapped with the slit 29 along the line 29. When the high-speed signal line 30 or the high-speed signal line 30 and the low-speed signal line 40 are in a positional relationship overlapping the slit 29, the high-speed signal line 30 is connected to the end of the power supply conductor layer 20 by y (x <y, x is shifted inward by the width of the high-speed signal line) so that the signal line is separated from the slit 29 by one pattern width or more.
[0034]
Further, as shown in the cross-sectional view of FIG. 13 and the top perspective view of FIG. 14, the low-speed signal line 40 and at least one of the high-speed signal line 30d and the high-speed signal line 30e are perpendicular to the slit 29 in different layers. And at least one of the high-speed signal line 30d and the high-speed signal line 30e may be wired so that the low-speed signal line 40 overlaps. In this case, as shown in the top perspective view of FIG. 15, the position where the low-speed signal line 40 is arranged is not changed as it is, and the high-speed signal lines 30d and 30e are respectively separated by the distance y as shown in FIG. Route to a more distant location. The high-speed signal lines 30d and 30e both have a signal line width x and x <y.
[0035]
As described above, in the seventh embodiment, the signal line sandwiched between the ground conductor layer and the power supply conductor layer, and the signal line wired in a layer closer to the outside of the substrate than the power supply conductor layer However, they are laid out in a positional relationship so as not to overlap the slits along the slits formed between the divided power supply conductor layers.
[0036]
As described above, it is possible to prevent the isolation between the high-speed signal line and the low-speed signal line from being deteriorated at the slit portion.
[0037]
Embodiment 8 FIG.
In the printed wiring boards described in the first to seventh embodiments, an inductance element is used for connection between the divided power conductor layers. However, instead of the inductance element, it may be connected by a conductor on the component mounting surface or connected by a pattern on the power supply conductor layer.
FIG. 16 shows a diagram in which the divided power conductor layers 20 are connected by conductors 60.
In FIG. 16, the signal conductor layer 4 also serves as a component mounting surface on which components are mounted together with signal lines. The conductor 60 is mounted on the signal conductor layer 4 and connected to the end of the conductor line 50 such as a through hole via a pad 61. A conductor wire 50 such as a through-hole is connected to the power supply conductor layer 20 by connecting an end portion different from the end portion connected to the pad 61 to the power supply conductor layer 20.
FIG. 17 shows a top view in which the divided power supply conductor layers 20 are connected by changing the shape pattern.
The power supply conductor layer 20 shown in FIG. 17 is formed by processing a part of the shape, for example, by thinning the power supply conductor layer as shown by D and connecting the power supply conductor layers 21 and 22. Yes.
[0038]
As described above, in the eighth embodiment, the divided power supply conductor layers are connected not by an inductance element but by a conductor such as a pattern.
[0039]
For this reason, the effect of suppressing radiation noise is deteriorated. However, when this deterioration is within an allowable range, it is not necessary to use the component mounting surface of the board for connection between the power supply conductor layers. it can. Or the mounting area on a board | substrate can be expanded and manufacturing cost can be reduced.
[0040]
【The invention's effect】
As described above, according to the printed wiring board of the present invention, in the printed wiring board having a structure in which the signal line is sandwiched between the ground conductor layer and the power supply conductor layer, the power supply conductor layer is divided, and the divided power supply board is divided. The conductor layers are connected by a conductor. For this reason, there exists an effect which can suppress the radiation noise emitted from a signal line.
In addition, for example, the conductor connecting the divided power supply conductor layer is a conductor generated by changing the shape of a part of the power supply conductor layer, so that the component mounting of the board is connected to the connection between the power supply conductor layers. No need to use surfaces. For this reason, there exists an effect which reduces manufacturing cost.
[0041]
Further, the divided power conductor layers were connected by an inductance element including a magnetic through-type conductor such as a ferrite bead. As a result, the resonance frequency of the parallel plate formed by the ground conductor layer and the power supply conductor layer is changed by the mode fed by the signal line, or the electromagnetic field induced between the ground conductor layer and the power supply conductor layer. The radiation noise can be reduced by attenuating. Therefore, it is possible to obtain a printed wiring board that can reduce electromagnetic interference to the outside and radiation noise such as crosstalk between lines.
[0042]
Further, the power supply conductor layer is disposed in the region where the signal lines are wired. For this reason, the number of divisions of the power supply conductor layer can be reduced, and the number of inductive elements connecting the divided power supply conductor layers can be reduced. Therefore, the manufacturing cost can be reduced.
[0043]
In addition, the power supply conductor layer is disposed in a region where signal lines in which electromagnetic coupling between adjacent signal lines occurs in a specific frequency band are wired. For this reason, the number of divisions of the power supply conductor layer can be reduced, and the number of inductive elements connecting the divided power supply conductor layers can be reduced. Therefore, the manufacturing cost can be reduced.
[0044]
In addition, the signal lines were routed along the gaps between the divided power supply conductor layers so as not to overlap the gaps. For this reason, there is an effect that it is possible to prevent the isolation between the signal line sandwiched between the power supply conductor layer and the ground conductor layer and the signal line other than the signal line from deteriorating.
[0045]
Further, the signal line sandwiched between the power supply conductor layer and the ground conductor layer and a signal line other than those described above were wired along the gap between the divided power supply conductor layers so as not to overlap the gap. For this reason, there is an effect that it is possible to prevent the isolation between the signal line sandwiched between the power supply conductor layer and the ground conductor layer and the signal line other than the signal line from deteriorating.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a printed wiring board having a laminated structure according to the present invention.
2 is a diagram showing a layer configuration of a printed wiring board having a laminated structure shown in FIG.
3 is a plan view for explaining the printed wiring board according to Embodiment 1. FIG.
4A is a cross-sectional view taken along the line AA of FIG. 3 for explaining the connection between the power supply conductor layers in the printed wiring board according to the first embodiment. FIG. FIG. 4B is a detailed view of a conductor that penetrates the ferrite bead of FIG.
5 is a cross-sectional view taken along the line BB in FIG. 3 for explaining the printed wiring board according to Embodiment 1. FIG.
6 is a cross-sectional view for explaining a printed wiring board according to Embodiment 2. FIG.
7A and 7B are cross-sectional views for explaining a resonance frequency according to the second embodiment.
FIG. 8 is a cross-sectional view for explaining a printed wiring board according to a third embodiment.
FIG. 9 is a cross-sectional view for explaining a printed wiring board according to Embodiment 4;
FIG. 10 is a cross-sectional view for explaining a printed wiring board according to a fifth embodiment.
FIG. 11 is a cross-sectional view for explaining a printed wiring board according to a sixth embodiment.
12 is a cross-sectional view for explaining a printed wiring board according to Embodiment 7. FIG.
13 is a cross-sectional view for explaining a printed wiring board according to Embodiment 7. FIG.
14 is a top perspective view for explaining a printed wiring board according to Embodiment 7. FIG.
FIG. 15 is a top perspective view for explaining the printed wiring board according to the seventh embodiment.
16 is a cross-sectional view for explaining a printed wiring board according to Embodiment 8. FIG.
FIG. 17 is a plan view for explaining a printed wiring board according to Embodiment 8;
FIG. 18 is a plan view showing a conventional printed wiring board.
[Explanation of symbols]
1 ground conductor layer, 2 power source conductor layer, 3, 4 signal conductor layer, 5 dielectric layer, 6 inductance element, 20, 21, 22 divided power source conductor layer, 29 gap (slit), 30, 30a , 30b, 30d, 30e Signal wiring, high-speed signal line, 30c signal line, 31 high-speed signal line, 32 low-speed signal line, 40 low-speed signal line, 50 conductor wire such as through hole, 51 conductor through ferrite bead, 52, 60 conductor, 53 ferrite bead, 61 pad, 100 power supply layer or ground layer of printed wiring board, 101 opening.

Claims (4)

In a printed wiring board having a laminated structure in which a dielectric layer including a signal line is sandwiched between a ground conductor layer and a power supply conductor layer,
The power supply conductor layer is divided into a plurality of parts, and the plurality of divided power supply conductor layers are arranged with a gap between the power supply conductor layers only in the region where the signal lines are wired , so that the plurality of power supply conductor layers are provided . The conductor layers are connected by conductors ,
When the signal line is a signal line along a gap formed between the divided power supply conductor layers, the printed wiring board having a laminated structure, wherein the signal line is arranged at a position not overlapping the gap . In a printed wiring board having a laminated structure in which a dielectric layer including a signal line is sandwiched between a ground conductor layer and a power supply conductor layer,
The signal line includes a high-speed signal line in which electromagnetic coupling between adjacent signal lines occurs in a specific frequency band, and a low-speed signal line in which electromagnetic coupling between adjacent signal lines does not occur in the specific frequency band. And
The power supply conductor layer is divided into a plurality of parts, the plurality of divided power supply conductor layers are arranged only in a region where the high-speed signal line is wired, and the plurality of power supply conductor layers are connected by a conductor. A printed wiring board with a laminated structure. In a printed wiring board having a laminated structure in which a dielectric layer including a signal line is sandwiched between a ground conductor layer and a power supply conductor layer,
The signal line is a high-speed signal line in which electromagnetic coupling between adjacent signal lines occurs in a specific frequency band,
The power supply conductor layer is divided into a plurality of parts, and the plurality of divided power supply conductor layers are arranged with a gap between the power supply conductor layers only in the region where the high-speed signal line is wired, While connecting the conductor layer for the conductor with a conductor ,
The printed wiring board having the laminated structure further includes an outer dielectric layer including a signal line as an outer layer of the power supply conductor layer, and electromagnetic coupling between adjacent signal lines is performed in a specific frequency band. A low-speed signal line that does not occur is placed on the outer dielectric layer,
The high-speed signal line wired to the inner dielectric layer sandwiched between the power supply conductor layer and the ground conductor layer and the low-speed signal line wired to the outer dielectric layer are divided into A printed wiring board having a laminated structure, wherein the high-speed signal line is wired at a position that does not overlap the gap when the signal line is along a gap formed between the plurality of power source conductor layers . The signal line has a predetermined width x,
2. The printed wiring board having the laminated structure, wherein the signal lines are arranged on the inner side of the predetermined width x or more from an end portion along a gap formed between the plurality of power supply conductor layers. Laminated structure printed wiring board.

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