JPH11340370A - Module for high frequency - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module for high frequency in which transmission loss in a signal transmission line of microwave or millimetric wave is small, structure is simplified, and reliability is high. SOLUTION: High frequency elements 5, 5' are mounted in cavities 4, 4' which are formed of a dielectric board 2 and a plurality of lid members 3, 3 bonded to one surface. A line 6' for elements whose one end portion is electrically connected with the high frequency elements 5, 5' is formed, and a line 7 for connection is formed on a region outside the cavities 4, 4'. The other end portion of the line 6' for the elements and the end portion of the line 7 for connection are electromagnetically coupled, so that a space between the high frequency elements 5, 5' is electrically and mutually connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency module having a plurality of high-frequency elements in a microwave band to a millimeter-wave band, and more particularly, to the transmission of signals between high-frequency elements without deteriorating the characteristics of high-frequency signals. The present invention relates to a high-frequency module capable of performing the following.

[0002]

2. Description of the Related Art Conventionally, high-frequency packages equipped with high-frequency circuit elements for handling microwaves and millimeter waves have
A high-frequency element hermetically sealed is housed in a cavity formed by a dielectric substrate and a wall or lid connected to the surface of the dielectric substrate, and a signal electrically connected to the high-frequency element. A transmission line is electrically connected to a signal transmission line formed on an external circuit board to input and output a high-frequency signal.

Therefore, conventionally, in this type of high frequency module, as shown in FIG. 9A, a cavity 43, 43 'formed by a dielectric substrate 41 made of a dielectric and lids 42, 42'. High-frequency elements 44, 4 respectively
4 ′ is mounted and hermetically sealed. The input and output of the high-frequency signal are performed by the high-frequency element 44 on the surface of the dielectric substrate 41,
High-frequency transmission lines 45 and 45 'such as strip lines connected to 44' are formed respectively. The transmission lines 45 and 45 'are connected by wire bonding, a ribbon, or the like via a conductor layer 47 insulated by an insulator 46 formed on the lids 42, 42'. FIG.
As shown in (b), a signal transmission line 49 is formed inside the dielectric substrate 41, and the signal transmission line 49 and the transmission line 4 are formed.
A semiconductor package in which 5 and 45 'are connected through a through-hole conductor 50 has been proposed. Further, FIG.
As shown in (c), a plurality of high-frequency elements are each independently electromagnetically sealed with a conductive lid, and metal terminals are respectively connected to input / output ends of each high-frequency element from the main surface of the dielectric substrate. A through-hole is formed through the rear surface of the plate 51, and coaxial transmission lines 52 and 53 are arranged inside the through-hole.
The input / output terminals on the main surface side of the coaxial transmission lines 52, 53 and the input / output terminals of the circuit block are connected to the input terminals of the circuit block via coaxial transmission line connection parts 54, 54 'for electrically connecting the input / output terminals. The configuration in which the coaxial transmission lines 52 and 53 are connected to the coaxial transmission lines 52 ′ and 53 ′ connected to the output terminals of other circuit blocks, and further connected via a connecting member 55 on the back surface side is a flat configuration. 7-263887 and the like.

[0004] In such a high-frequency module, it is required that signals can be input and output between high-frequency elements without deteriorating the transmission characteristics of high-frequency signals, and that it should be easy to manufacture.

[0005]

However, FIG.
In (a), a high-frequency signal passes through the conductor layer 47,
When the signal transmission line passes through the walls 42 and 42 ', the signal transmission line is converted from the microstrip line to the strip line at the wall passage portion. Therefore, it is necessary to reduce the width of the signal transmission line for impedance matching. As a result, there is a problem that reflection loss and radiation loss are likely to occur in the passing portion, and the transmission characteristics of the high-frequency signal deteriorate. Moreover, in order to draw out the signal transmission lines 45, 45 'to the outside of the cavities 42, 42', at least the line passing portion of the wall must be formed of a dielectric material, which complicates the structure and reduces the cost of the entire module. It was also a factor to increase.

On the other hand, FIG. 9 (b) shows that the signal does not deteriorate because the through-hole conductor 50 does not pass through the wall, but the operating frequency of the signal to be transmitted is 40G.
When the frequency is higher than Hz, the connection between the signal transmission line 49 and the through-hole conductor 50 is bent, so that the transmission loss at the bent portion increases rapidly, and it is difficult to transmit a high-frequency signal.

In FIG. 9C, the transmission loss of a high-frequency signal can be reduced by the coaxial transmission lines 54 and 54 'inside the through-hole conductors 52 and 52'. There is a problem that it is difficult to form a transmission line, and that the reliability of the connection part is poor.

Therefore, according to the present invention, a plurality of high-frequency elements formed on the surface of a dielectric substrate are individually electromagnetically sealed, and transmission loss during signal transmission between the high-frequency elements is small.
It is another object of the present invention to provide a small and highly reliable high frequency module having a simple structure.

[0009]

Means for Solving the Problems The inventors of the present invention have repeatedly studied a structure capable of reducing loss and miniaturizing a high-frequency module. As a result, the structure is formed on the surface of the dielectric substrate in the cavity by the lid. Element connection high-frequency transmission lines, one end of which is electrically connected to the high-frequency element,
By connecting by electromagnetic coupling with a connecting high-frequency transmission line formed in a region outside the cavity, the high-frequency elements can be electrically interconnected without deteriorating transmission characteristics, and can be simple and simple. We have found that the module structure can be downsized.

Further, by electromagnetically sealing the connection transmission line, it is possible to make a compact module with a simple structure, to protect the entire circuit, to prevent the influence of external electromagnetic waves, to control the module and It is possible to prevent leakage of electromagnetic waves from the signal transmission line.

That is, a high-frequency module according to the present invention comprises a dielectric substrate, a first lid joined to one surface of the dielectric substrate, and the first lid and the dielectric substrate. A first high-frequency element mounted on the surface of the dielectric substrate in the first cavity and a first high-frequency element formed on the surface of the dielectric substrate in the first cavity; A first element-connected high-frequency transmission line electrically connected to the element, a second lid joined to one surface of the dielectric substrate, and the second lid and the dielectric substrate; A second high-frequency element mounted on the surface of the dielectric substrate in the formed second cavity, and a second high-frequency element formed on the surface of the dielectric substrate in the second cavity, and one end of the second high-frequency element is formed on the second substrate. A second element-connected high-frequency transmission electrically connected to the element; A line, and a connection high-frequency transmission line formed in a region outside the first cavity and the second cavity. The other end of the first element-connection high-frequency transmission line; By electromagnetically coupling one end of the transmission line, and the other end of the second element connection high-frequency transmission line, and the other end of the connection high-frequency transmission line, the first and the second elements are connected. The second high-frequency elements are electrically connected to each other.

In particular, according to the present invention, the electromagnetic coupling includes the first element-connected high-frequency transmission line, the connection high-frequency transmission line, the second element-connected high-frequency transmission line, and the connection high-frequency transmission. A ground layer is interposed between the lines, and the first element-connected high-frequency transmission line, the connection high-frequency transmission line, and the second element-connected high-frequency transmission line are connected to each other through a slot hole formed in the ground layer. Are preferably electromagnetically coupled.

In a specific structure of the high-frequency module according to the present invention, the ground layer is formed inside the dielectric substrate, and the connecting high-frequency transmission line is formed on the other surface of the dielectric substrate. Wherein the ground layer is provided on the first dielectric substrate, and the high-frequency transmission line for connection is formed on a second dielectric substrate.
A structure in which the dielectric substrate is disposed at a predetermined position on the other surface of the first dielectric substrate, the ground layer and the high-frequency transmission line for connection are provided on a second dielectric substrate, It is desirable that the second dielectric substrate is provided at a predetermined position on the other surface of the dielectric substrate.

Further, in the structure of the high frequency module of the present invention, it is preferable that the high frequency transmission line for connection is electromagnetically sealed.

Further, the high-frequency transmission line for element connection includes:
The high-frequency transmission line for connection is composed of one selected from a microstrip line, a coplanar line, a coplanar line with a ground, and a triplate line. It is desirable to be done.

[0016]

According to the above construction of the present invention, in particular, the other end of the element-connected high-frequency transmission line and the end of the connection-use high-frequency transmission line are electromagnetically connected to each other through, for example, a slot hole formed in the ground layer. Transmission line does not pass through the wall made of a dielectric or pass through a through-hole conductor or a coaxial line, so that when a high-frequency signal passes through the wall or a bent portion, It is possible to provide a module capable of minimizing the occurrence of reflection loss and radiation loss and eliminating the necessity of forming a coaxial line or the like, and having low transmission loss and miniaturization.

Further, by electromagnetically sealing the transmission line for connection, the influence of external electromagnetic waves, leakage of electromagnetic waves, and coupling with other signal transmission lines can be prevented. Transmission loss in the line can be reduced.

[0018]

FIG. 1 is a schematic sectional view showing a first embodiment of a high-frequency module according to the present invention. According to the high-frequency module 1 of FIG. 1, two or more lids 3 are provided on the surface of a dielectric substrate 2 made of a dielectric material.
3 ′ are joined, and the dielectric substrates 2 and their lids 3, 3 ′ form cavities 4, 4 ′. Then, the dielectric substrate 2 in the cavities 4, 4 '
On the surface, high-frequency elements 5, 5 'for high frequency, such as MMIC and MIC, are mounted, respectively. In the cavities 4 and 4 ′ of the above-described module, high-frequency elements 5 and
As a line for transmitting a signal to 5 ', an element-connected high-frequency transmission line (hereinafter abbreviated as an element line) composed of one kind selected from a microstrip line, a strip line, and a coplanar line with a ground. Is formed on the surface of the dielectric substrate 2 in the cavities 4 and 4 ', and is electrically connected to the high-frequency elements 5, 5'.

The dielectric substrate 2 has a dielectric constant of 20 or less, such as ceramics such as alumina, mullite, silicon nitride, silicon carbide, and aluminum nitride, glass ceramics, ceramic metal composite materials, glass organic resin composite materials, and quartz. Desirably, it is made of a dielectric material.

The lids 3, 3 'are made of a material having an electromagnetic wave shielding property capable of preventing the electromagnetic waves from the cavities 4, 4' from leaking to the outside or leaking the electromagnetic waves to the outside.
For example, a metal, a conductive ceramic, a ceramic metal composite material, or the like can be used, but a material obtained by applying a conductive substance to the surface of an insulating substrate may be used, but a metal is preferable in consideration of cost. .

The element lines 6, 6 'are made of Ag, Cu, Au.
For this reason, the dielectric substrate 2 is preferably made of glass ceramics having a firing temperature of about 800 to 1000 ° C., and the combination of the dielectric substrate 2 and the signal transmission line is preferable. Simultaneous firing becomes possible.

The high-frequency elements 5, 5 'are connected to element lines 6, 6'.
The connection can be made with a small transmission loss by mounting the flip chip directly on the chip, but the present invention is not limited to this.For example, the connection is made by gold ribbon or a plurality of wire bonding, or polyimide or the like. Cu on the substrate
It can also be connected by a conductor plate or the like on which a conductor such as is formed.

According to the present invention, as shown in FIG. 1, a ground layer 8 is formed substantially parallel to the element lines 6, 6 'over the entire surface inside the dielectric substrate 2, and in the ground layer 8, , Slot holes 9 and 9 ′ are formed.

On the other surface of the dielectric 2, in parallel with the element lines 6, 6 'and the ground layer 8, one of a microstrip line, a strip line, and a coplanar line with ground is selected. The connecting high-frequency transmission line 7 (hereinafter, abbreviated as a connecting line) is formed.

Then, as shown in FIG. 1, the other end of the element line 6 whose one end is electrically connected to the high-frequency element 5 and one end of the connection line 7 are opposed to each other via the slot hole 9 as shown in FIG. By forming, the element line 6 and the connection line 7 are electromagnetically coupled, and a signal with low loss is transmitted between the element line 6 and the connection line 7.

Similarly, the other end of the element line 6 'whose one end is electrically connected to the high-frequency element 5' and the other end of the connection line 7 are formed at positions facing each other via the slot hole 9 '. As a result, the element line 6 'and the connection line 7 are electromagnetically coupled, and a low-loss signal is transmitted between the element line 6' and the connection line 7.

As a result, the high-frequency elements 5 and 5 '
Can be connected with low loss via the element line 6, the connection line 7, and the element line 6 '.

To explain the specific structure of the electromagnetic coupling, the element line 6 and the connection line 7 are arranged such that the end of each line is transmitted from the position immediately above the center of the slot hole 9 at the required frequency. It is preferable that the slot hole 9 is formed at a facing position protruding to a length corresponding to ／ wavelength, and the shape of the slot hole 9 is a rectangular hole having a long side and a short side.
The size is appropriately set according to the used frequency and the frequency bandwidth. In particular, the long side of the slot hole 9 is desirably set to a length corresponding to a half wavelength of the signal frequency.
Is desirably set to a length corresponding to 1/5 wavelength to a length corresponding to 1/50 wavelength. The element line 6 'and the connection line 7 are arranged in the same manner.

As shown in FIG. 1, a ground layer 10 is provided at the junction between the dielectric substrate 2 and the lids 3 and 3 'for shielding electromagnetic waves.
Is formed and is electrically connected to the ground layer 8 through the via hole 11, so that the electromagnetic waves in the cavities 4, 4 'can be shielded. Therefore, the electromagnetic waves generated in the high-frequency elements 5, 5' and the element lines 6, 6 ' Since leakage to the outside and an adverse effect due to an external electromagnetic field can be prevented, and malfunction of the circuit can be prevented, the reliability of the module can be improved. Further, in order to prevent the resonance from the signal transmission line from affecting other circuits and the like, an electromagnetic wave absorber may be attached to the inner surfaces of the lids 3 and 3 '.

Further, the cavity 4 of the dielectric substrate 2
A power supply line to the high-frequency elements 5 and 5 'and a low-frequency signal transmission line (not shown) for transmitting a low-frequency signal of 1 GHz or less are provided on the surface inside 4'. Electronic components and the like may be mounted, and these are led out of the cavities 4 and 4 ′ through via holes or through holes by a normal multilayer wiring board technique, and further led out of the high frequency module 1.

In the module shown in FIG. 1, the element lines 6, 6 ', the connection line 7, and the ground layer 8 are all provided in the dielectric substrate 2, but the connection line 7, the ground layer 8 need not necessarily be provided in the dielectric substrate 2. Therefore, FIGS. 2 and 3 show second and third embodiments in which the connection line 7 or the connection line 7 and the ground layer 8 are formed on another member. FIG.
FIG. 4 is an exploded sectional view of the second embodiment.

In the high frequency module 12 shown in FIG. 2, the dielectric substrate 2, the lids 3, 3 ', the cavities 4, 4' are provided.
The high-frequency elements 5, 5 ', element lines 6, 6', slot holes 9, 9 ', and ground layer 8 have the same configuration as the high-frequency module 1, but according to FIG. A connection line 7 made of one selected from a line and a coplanar line with ground is formed on the surface of a connection member 13 made of a dielectric material.

The element line 6 and the end of the connection line 7 formed on the surface of the connection member 13 are brought into a predetermined positional relationship via the slot holes 9 and 9 'in the same manner as described with reference to FIG. By bonding the dielectric substrate 2 and the connection member 13 so that the element lines 6 and 6 ′ and the connection line 7
It is possible to electromagnetically couple between them, and a signal with small loss is transmitted.

The dielectric substrate 2 and the connection member 13 can be bonded and fixed by an adhesive or a screw, and there is no problem if they are simply overlapped without using an adhesive.

FIG. 2 shows a case in which the ground layer 8 is formed inside the dielectric substrate 2 and the connection line 7 is formed on the surface of the connection member 13, but the second embodiment is not limited to this. Instead, for example, (1) a configuration in which the connection line 7 is formed inside or on the back surface of the connection member 13, and the ground layer 8 is formed on the back surface of the high-frequency elements 5, 5 ′ of the dielectric substrate 2, ) The connection line 7 may be formed inside the connection member 13, and the ground layer 8 may be formed inside or on the back surface of the dielectric substrate 2.

FIG. 3 is an exploded sectional view of the third embodiment. According to FIG. 3, in the high-frequency module 14, the dielectric substrate 2, the lids 3, 3 ', the cavity 4,
4 ′, high-frequency elements 5, 5, and element lines 6, 6 ′ have the same configuration as the high-frequency module 1, but according to FIG. And a slot hole 9 in the ground layer 8.
9 'is formed, and a connection line 7 made of one selected from a microstrip line, a strip line, and a coplanar line with ground is formed inside or on the back surface of a connection member 13 made of a dielectric material. I have.

The element lines 6, 6 'and the end of the connection line 7 formed inside the connection member 13 are provided through the slot holes 9, 9' in the same manner as described with reference to FIG. By bonding the dielectric substrate 2 and the connection member 13 in a positional relationship, it becomes possible to electromagnetically couple the element lines 6, 6 'and the high-frequency connection transmission line 7, thereby reducing loss. Transmission of small signals takes place.

The dielectric substrate 2 and the connecting member 13 can be bonded and fixed in the same manner as the high-frequency module 12 shown in FIG.

Further, FIG. 3 shows a case where the ground layer 8 is formed on the surface of the connection member 13. However, according to the structure of the present invention, the present invention is not limited to this. The connection line 7 may be formed inside the member 13, and the connection line 7 may be formed on the back surface of the connection member 13.

The connecting member 13 shown in FIGS.
Is preferably made of a material having a lower dielectric constant than the dielectric substrate 2, particularly a resin, in order to enhance the electromagnetic coupling. Also,
The connection member 13 may have a heat sink, a housing, and the like, and may be a member independent of this.

(Shield Structure) In the present invention, FIG.
In the embodiments shown in FIGS. 3 to 3, the connection line 7 is desirably electromagnetically shielded. Therefore, FIG. 4 is a schematic sectional view based on the method (1).

The method of sealing the connection line is described in (1)
In the high-frequency module 1, a frame thicker than the thickness of the connection line 7 is formed at a position surrounding the connection line 7 on the surface where the connection line 7 is formed, and the connection line 7 is accommodated in the opening, and furthermore, the electromagnetic wave shielding property is provided. A method of electromagnetically sealing the opening of the frame with a lid having a cover, a through hole, and a ground layer (FIG. 4); A method of installing a lid on the connection line 7 forming surface and electromagnetically shielding (FIG. 5)
(3) In the high-frequency module 12 of FIG. 2, a method of sealing the connection line 7 via the dielectric layer 13 with the same conductive lid as in (2) and electromagnetically shielding (FIG. 6), etc. There is.

According to the high-frequency module 15 shown in FIG.
A frame 16 thicker than the thickness of the line 7 is formed on the connection line 7 forming surface of the dielectric substrate 2, and an opening 17 is formed in the frame 16, and the connection line 7 is placed in the opening 17. It is configured to be stored.

A ground layer 18 is formed around the opening 17 of the frame 16, through the ground layer 8 of the dielectric substrate 2, through holes, castellations, and conductor layers 19 formed on the inner wall of the recess. It is connected.

A ground layer 18 is formed in the opening 17 of the frame 16 so that the conductive lid 20 seals the opening 17.
Are joined by a method such as brazing or soldering, and are electrically connected.

The frame 16 is made of a dielectric material, and is preferably made of a ceramic having a dielectric constant of 20 or less, a glass ceramic, a ceramic metal composite material, a glass organic resin composite material, or the like. Therefore, it is desirable that the material is the same as that of the dielectric substrate 2.

The conductive lid 20 is made of a material having an electromagnetic wave shielding property capable of preventing an electromagnetic wave from leaking to the outside. For example, a metal, a ceramic, a ceramic metal composite material, a glass ceramic, a glass organic resin composite material, or the like is used. Formed from In addition, the frame 16 and the conductive lid 20 can be bonded and fixed by an adhesive or a screw.

FIG. 5 is a schematic sectional view of a module based on the method (2). In this structure, instead of the frame 16 and the conductive lid 20 shown in FIG. 4, the high-frequency module 1 and the conductive member 22 are formed such that the conductive member 22 having the concave portion 23 is surrounded by the connecting line 7 in the concave portion. The connection line 7 can be sealed similarly to FIG. 4 by this structure.

FIG. 6 is a schematic sectional view of a module based on the above (3). According to FIG. 6, the high frequency module 2
Reference numeral 4 denotes a structure in which the conductive member 22 having the concave portion 23 and the high-frequency module 12 are bonded to each other.

At this time, the thickness of the connection member 13 is set so that the connection transmission line 7 is electrically conductive so that the high-frequency module 12 and the conductive member 22 can be stably bonded together and the connection member 13 can be completely sealed. The depth of the recess 23 so as not to protrude from the recess 23 of the conductive member 22, or the recess 2
It is desirable to make the depth smaller than 3.

With the above shield structure, the connecting line 7
In this case, the electromagnetic wave generated in the module can be prevented from leaking to the outside, and the external electromagnetic field can be prevented from adversely affecting the connection line 7, and the malfunction of the circuit can be prevented. Therefore, the reliability of the module can be improved. .

In the high frequency module of the present invention,
In each of the modules shown in FIGS. 1 to 6, the lids 3 and 3 ′, the cavities 4 and 4 ′, the high-frequency elements 5 and 5 ′, and the element lines 6 and 6 ′ are formed on the same dielectric substrate 2. However, the present invention is not limited to this, and the lid 3, the cavity 4, the high-frequency element 5, and the element line 6 are formed on the dielectric substrate 2,
The lid 3 ', the cavity 4', the high-frequency element 5 ', and the element line 6' may be formed on another dielectric substrate 2 '.

Although the lids 3 and 3 'have been described as separate bodies, the lids 3 and 3' may have any structure as long as they can electromagnetically shield the high-frequency elements 5 and 5 'individually. As shown in FIG. 7 (a), the lids 3 and 3 ′ are completely integrated and separated into first and second cavities by the wall 3a, or as shown in FIG. 7 (b). To
The lid 3, 3 ′ is constituted by a wall 3 a having a structure in which the opening of the wall 3 a is covered with the lid 3 b and a lid 3 b, and is separated into the first and second cavities by the wall 3 a. It may be a body-shaped lid.

Further, in the cavities 4 and 4 ', other high-frequency elements and low-frequency elements may be built in addition to one high-frequency element, and three or more electromagnetic coupling parts are provided in one cavity. It does not matter if it exists.

According to the present invention, when three or more cavities are provided on the surface of the dielectric substrate, and the high-frequency elements are accommodated in the respective cavities, the gap between the three or more high-frequency elements is as described above. They may be interconnected by a similar structure, or there may be independent high frequency elements that are not interconnected.

Further, in the high-frequency module of the present invention, a matching circuit is provided between the connection ends of the connection lines 7 with the element lines 6 and 6 ′, and electronic components and the like are connected to the lines. It may be interposed.

Further, in the present invention, a signal is directly transmitted to an antenna element or the like by connecting a waveguide or the like from the element line 6 to the high-frequency element at the end of the module through the slot hole 9. It is possible to As a specific example, FIG. 9 shows an end view of a schematic cross section of a ninth embodiment of the high-frequency module according to the present invention. FIG.
According to this, the high-frequency module 25 has a wiring structure in which the element line 6 and the waveguide 26 are electromagnetically coupled via the slot hole 9. Further, by connecting the waveguide 26 to another module, antenna element, or the like, a high-frequency signal is transmitted with low transmission loss.

In this structure, the waveguide 26
And the ground layer 8 are electrically connected to each other by a plurality of through-hole conductors 27, and a dielectric layer 28 for impedance matching is provided on the waveguide connection side of the slot hole 9 so that the element line 6 is formed. And the waveguide 26 can be connected with reduced loss.

[0059]

As described in detail above, the high-frequency module of the present invention is provided by the electromagnetic coupling between the element lines in the respective cavities each containing a high-frequency element and the connection lines formed outside the cavities. By connecting
Since the high-frequency signal transmission line does not pass through a wall or the like for forming a cavity, signals can be transmitted between the lines and between high-frequency circuit elements with low transmission loss, and easily and at low cost. Can be made. In addition, the high frequency element, the cavity in which the element line is stored, and the transmission line for connection are electromagnetically shielded by a conductive layer, a ground layer, etc.
The effect of external electromagnetic waves and the influence between elements and lines can be prevented, and a high-reliability and compact high-frequency module can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a first embodiment of a high-frequency module according to the present invention.

FIG. 2 is an exploded sectional view showing a second embodiment of the high-frequency module according to the present invention.

FIG. 3 is an exploded cross-sectional view showing a third embodiment of the high-frequency module according to the present invention.

FIG. 4 is a schematic sectional view showing a fourth embodiment of the high-frequency module according to the present invention.

FIG. 5 is a schematic sectional view showing a fifth embodiment of the high-frequency module according to the present invention.

FIG. 6 is a schematic sectional view showing a high-frequency module according to a sixth embodiment of the present invention.

FIG. 7 is a schematic sectional view showing an eighth embodiment of the high-frequency module according to the present invention.

FIG. 8 is a schematic sectional end view showing a ninth embodiment of the high-frequency module of the present invention.

FIG. 9 is a schematic sectional view showing the structure of a conventional high-frequency module.

[Explanation of symbols]

1, 12, 14, 15, 21, 24, 25 High-frequency module 2 Dielectric substrate 3, 3 'Lid 3a Wall 3b Lid 4, 4' Cavity 5, 5 'High-frequency element 6, 6' Element line 7 Connection Line 8, 10, 18 Ground Layer 9, 9 'Slot Hole 11 Via Hole 13 Connection Member 16 Frame 17 Opening 19, 27 Through Hole 20 Conductive Lid 22 Conductive Member 23 Concave 26 Waveguide 28 Matching dielectric

Continued on the front page (72) Inventor Shigeo Morioka 10-1 Kawai, Gamo-cho, Gamo-gun, Shiga Prefecture Inside the Shiga Plant of Kyocera Corporation (72) Inventor Takanori Kubo 1-1-1, Yamashita-cho, Kokubu-shi, Kagoshima Kyocera Corporation Kagoshima Kokubu Factory

Claims (8)

[Claims] 1. A dielectric substrate, a first lid joined to one surface of the dielectric substrate,
A first cover formed by the first lid and the dielectric substrate;
The first substrate mounted on the surface of the dielectric substrate in the cavity of
A first element-connected high-frequency transmission line formed on the surface of the dielectric substrate inside the first cavity and having one end electrically connected to the first high-frequency element; A second lid joined to one surface of the dielectric substrate, and a second lid mounted on the surface of the dielectric substrate in a second cavity formed by the second lid and the dielectric substrate A second element-connected high-frequency transmission line formed on the surface of the dielectric substrate inside the second cavity and having one end electrically connected to the second high-frequency element; A high-frequency transmission line for connection formed in an outer region of the first cavity and the second cavity; and a second end of the high-frequency transmission line for connection of the first element and one of the high-frequency transmission lines for connection. And the second element The other end of the connection high-frequency transmission line is electromagnetically coupled to the other end of the connection high-frequency transmission line to electrically interconnect the first and second high-frequency elements. A high-frequency module, characterized in that: 2. A ground layer is interposed between the first element-connected high-frequency transmission line, the connection high-frequency transmission line, the second element-connection high-frequency transmission line, and the connection high-frequency transmission line. The first element-connection high-frequency transmission line, the connection high-frequency transmission line, and the second element-connection high-frequency transmission line are electromagnetically coupled via a slot hole formed in a ground layer. The high-frequency module according to claim 1. 3. The high-frequency module according to claim 2, wherein the ground layer is formed inside the dielectric substrate, and the connection high-frequency transmission line is formed on the other surface of the dielectric substrate. 4. The connection substrate according to claim 1, wherein the ground layer is provided on the dielectric substrate, the connection high-frequency transmission line is formed on the connection dielectric substrate, and the connection dielectric substrate is connected to the other of the first dielectric substrates. 3. The high-frequency module according to claim 2, which is installed at a predetermined location on the surface. 5. The ground layer and the high-frequency transmission line for connection are provided on the dielectric substrate for connection, and the dielectric substrate for connection is provided at a predetermined position on the other surface of the dielectric substrate. The high-frequency module according to claim 2. 6. The high-frequency module according to claim 1, wherein the connection high-frequency transmission line is electromagnetically sealed. 7. The high-frequency module according to claim 1, wherein the element-connecting high-frequency transmission line is composed of one selected from a microstrip line, a coplanar line, and a grounded coplanar line. 8. The high-frequency module according to claim 1, wherein said high-frequency transmission line for connection comprises one selected from a microstrip line, a coplanar line, a coplanar line with ground, and a triplate line.