JPH11334076A - Ink jet recording head and ink jet recorder employing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance reliability while reducing cost by forming a protrusion on a silicon substrate of a metal corrosion resistant against ink and an overlying plating layer. SOLUTION: Since TiW corrosion resistant against pretreatment liquid overlaps an aluminum electrode part and a silicon nitride SiN film by 15 μm and an aluminum electrode pad has opening of 100 μm, the size of a bump is 130 μmsq. The silicon substrate side is brought into tight contact with a top plate 300 by means of a retainer spring 330, and then the ink channel part around silicon sealant, the gap at the common liquid chamber part of the silicon substrate and the top plate 300, and the electric joint are covered and the silicon sealant is hardened to produce an ink jet recording head chip. Since the size of the silicon substrate can be standardized in the same recording head, cost can be reduced while enhancing the reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head for performing recording by discharging a recording liquid (hereinafter referred to as ink) as flying droplets from an ink discharge port (nozzle) and attaching it to a recording material. And an inkjet recording apparatus using the inkjet recording head.

[0002]

2. Description of the Related Art Conventionally, in an ink jet recording head, a silicon substrate is arranged on an aluminum support member to which a printed wiring board is adhered, and an electric connection is made by wire bonding. A configuration in which a connection portion with a printer main body is arranged on the same side as the above or on the back side is disclosed.

In the case of this structure, specifically, since the printed wiring board cannot be bent, the same surface as the side on which the electrothermal converter is disposed, or the surface opposite to the side on which the electrothermal converter is disposed Could not be connected to the printer.

In another ink jet recording head, for example, a silicon substrate provided with an ink discharge electrothermal transducer as disclosed in US Pat. No. 4,650,733 or US Pat. No. 4,827,294 is used. There is disclosed an ink jet recording head in which an insulating film on a table is surrounded by a wiring member (hereinafter referred to as a TAB film).

Usually, in the case of a semiconductor device using a TAB film or an ink jet recording head, four sides of a chip are surrounded by the TAB film.

Further, as disclosed in Japanese Patent Publication No. 5-169662, a flexible printed circuit (FPC) lined with a glass epoxy substrate is used, and a bonding portion between a silicon substrate and the lined flexible printed substrate is formed. An electrothermal converter was provided by bonding to a support member of an aluminum (Al) plate, making electrical connection by wire bonding, and bending the flexible printed circuit board from the middle to provide an electrical connection surface with the printing apparatus main body. It is possible to dispose it on the back side of the support member with the surface.

However, in the case of such a conventional configuration, if a flexible substrate is used to provide an electrical connection surface between the surface of the silicon substrate on which the electrothermal transducer is provided and the printer body at an angle, a wire is required. In order to perform bonding, it is necessary to fix and hold the silicon substrate and the flexible printed board so as to face each other on the same member, and a holding member is required. Moreover, it is necessary to finally fix the electrical connection surface of the flexible printed board to the printer body to the holding member, and it is necessary to manufacture the flexible printed board separately from the step of fixing the flexible printed board in opposition to the silicon substrate. Can be costly and expensive. For example, when two heads are used and one head is arranged for discharging black ink and the other head is arranged for discharging color ink, these steps are required for each head. Therefore, the cost increases. Further, in addition to the conventional method, the above-mentioned TAB
In the case of an ink jet recording head using a film, since the four directions of the silicon substrate are surrounded by a TAB film, there is a problem in that ink is ejected using an electrothermal converter, which becomes a problem.

In order to solve the above problems, the inventors of the present invention have proposed an electrothermal converter and a driving circuit for driving the electrothermal converter, which are arranged on four sides of a rectangular silicon substrate. The three sides are surrounded by a TAB film, and the electrothermal converters are arranged side by side on the side not facing the TAB film, so that a plurality of silicon substrates can be joined to a top plate with a nozzle formed integrally, and the printer itself There has been proposed an ink jet recording head capable of arranging a connection portion with an angle with respect to a discharge direction.

Further, as another proposal, a two-chip silicon substrate using the above-mentioned proposal is joined to an integrally formed top plate, and one side is filled with a recording ink and the other side is filled with a pretreatment liquid. Ink jet recording heads of various forms have also been proposed.

[0010]

The above-described two-chip silicon substrate proposed by the inventors is bonded to a top plate integrally formed, and one side is provided with a recording ink and the other side is provided with a recording ink. In the ink jet recording head in which the pretreatment liquid is respectively filled, the metal projections (bumps) provided on the electrodes of the silicon substrate are mechanically formed because the number of electrodes provided per chip is as small as about 30. Used stud bumps. In the case of such a stud bump, all the aluminum electrodes on the silicon substrate are made of gold (A
u) It cannot be covered with metal, and the lower aluminum electrode is always partially exposed.

In this case, particularly, it is known that the pretreatment liquid becomes acidic because the recording ink is alkaline and must be neutralized. Further, when an electric field is applied to the electrode portion on the silicon substrate by chlorine ions (Cl ⁻ ) present in the pretreatment liquid, metal protrusions (hereinafter referred to as stud bumps) mechanically formed on the electrode portion on the silicon substrate. ) Was exposed to corrosion.

In order to prevent corrosion by the pretreatment liquid, the following method can be considered.

(1) The electrode portion is separated from the common liquid chamber of the pretreatment liquid by a sufficient distance.

(2) The electrode portion is covered with a material through which chlorine ions (Cl ⁻ ) in the pretreatment liquid do not pass.

(3) The structure of the electrode portion is made not to corrode.

[0016] However乍Ra, of the above methods (1), it is necessary to increase the chip size, and chloride ions in the case of the method (2) - a space covered with a material which is not transmitted ^(Cl) This is necessary, and both of the methods (1) and (2) inevitably increase the chip size of the silicon substrate, resulting in a significant increase in cost. Therefore, the method (3) is the best because there is no change in the chip size of the silicon substrate for discharging the pretreatment ink and the chip size of the silicon substrate for discharging the recording ink. In addition, a structure that does not corrode the electrode portion even in the presence of the pretreatment liquid is a metal that does not corrode with the pretreatment liquid and that electrical connection with the TAB wiring is performed to ensure reliability. It is.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve such a conventional problem by providing a corrosion-resistant metal on a silicon substrate which does not corrode metal protrusions with ink, and a plating layer on the metal. It is an object of the present invention to provide an ink jet recording head characterized by being formed by:

[0018]

According to the present invention, there is provided an ink jet recording head comprising:
A rectangular silicon substrate provided with a drive circuit for driving a plurality of electrothermal transducers for generating energy for discharging recording ink, a nozzle serving as an ink flow path, and a common liquid for supplying ink to the nozzle The silicon substrate is formed by bonding a top plate having a chamber, and three sides of four sides of the silicon substrate face a flexible insulating film on which a metal wiring member is placed, and A conductor lead is extended to the silicon substrate and joined to an electrode on the silicon substrate, the electrothermal transducer is arranged on a side not facing the flexible insulating film, and a plurality of the silicon substrates are used. In an ink jet recording head having a configuration in which a metal protrusion is formed at a bonding portion between a lead of a metal conductor disposed on the flexible insulating film and electrical connection is made, the metal provided on the silicon substrate is provided. Protrusions are characterized by being constituted by a plated layer formed on the corrosion resistance of the metal and the metal that is not corroded by ink.

[0019]

According to the present invention, corrosion of the aluminum electrode to the aluminum electrode for making an electrical connection with the outside of the silicon substrate on which the electrothermal transducer for ink ejection of the ink jet recording head using the pretreatment liquid is disposed is provided. In order to prevent this, a bump formed by sputtering titanium tungsten (TiW), which is usually used as a barrier metal, and further plating gold (Au) is used. In such an ink jet recording head of the present invention, since titanium tungsten (TiW) is not corroded by an acidic pretreatment liquid and chlorine ions (Cl ⁻ ) present in the pretreatment liquid, the titanium tungsten (TiW) is used. By overlapping the silicon nitride (SiN) film, which is a protective film around the electrodes, and completely covering and hiding the aluminum electrode portions, it is possible to prevent the electric wiring member from being corroded by the pretreatment liquid. It is possible to unify the size in the same print head, to achieve commonality of the apparatus, to minimize the increase in the cost of the silicon substrate, and to provide a highly reliable inkjet print head at a low cost. .

Further, by forming the aluminum electrode portion of the silicon substrate for the pretreatment liquid to have a corrosion-resistant structure, the chip size of the silicon substrate can be reduced to the size of the silicon substrate on which the electrothermal converter for discharging the pretreatment liquid is disposed. By making the size the same as that of the recording ink side, the production apparatus can be shared, and the design efficiency of the apparatus and the operation rate of the line can be improved.

Other objects, features and advantages of the present invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0022]

FIG. 1 is a view showing a silicon substrate to which a TAB film is connected in an embodiment of an ink jet recording head according to the present invention.

As shown in FIG. 1, the ink jet recording head of the present invention comprises a silicon substrate 100 in which a drive circuit for an electrothermal converter 110 is built, an electrothermal converter 110 made by a semiconductor process, At the time of cutting the TAB film 120, the film portion of the silicon substrate 100 facing the side where the electrothermal transducers 110 are arranged is removed so as not to hinder the ink ejection.
A TAB film 120 cut and cut out from the TAB tape after joining the AB lead 130;
The lead 130 of the film 120 and the TAB film 12
Bumps 140 for bonding to the lead 130, a heat dissipating block 150 for releasing excess heat from the silicon substrate 100, and an electric joint 160 with the printer provided on the back surface of the TAB film 120, which are appropriately bent in advance. And a bent portion 170 of a TAB film to be joined to the top plate as the upper body.

In such an ink jet recording head of the present invention, the bump structure used to join one end of the TAB lead 130 to the silicon substrate 100 includes a stud bump structure as shown in FIG. 2 and a bump structure as shown in FIG. Such as a plated bump structure.

First, as shown in FIG. 2, in the stud bump structure, one end of the lead 130 is bonded to the TAB film 120 and the other end is connected to the silicon substrate 100.
It is joined to the stud bump 200 joined to the upper aluminum electrode 240. Aluminum electrode 2
Reference numeral 40 designates an overlapping portion 232 in which a part of a silicon nitride (SiN) film 230 for protecting a wiring portion on the silicon substrate 100 overlaps a peripheral portion of the aluminum electrode 240 to form an overlapping portion 232. The wrap portion 232 forms a structure that prevents ink from entering the wiring portion of the aluminum electrode 240. Furthermore,
On the silicon nitride (SiN) film 230 for protecting the wiring portion on the silicon substrate 100, a tantalum (Ta) film 2 for forming a cavitation resistant film at the time of bubbling of ink discharge.
50 are provided.

In the plated bump structure, FIG.
As shown in FIG. 2, the lead 130 has one end joined to the TAB film 120 and the other end joined to the aluminum electrode 240 on the silicon substrate 100 via the plating bump 210 and the titanium tungsten (TiW) film 220. In this plated bump structure, the titanium tungsten (TiW) film 220 forms a barrier metal and a corrosion resistant structure, and is made of titanium tungsten (TiW).
The film 220 overlaps the silicon nitride (SiN) film 230 to form an overlap portion 225;
The overlap portion 225 forms a structure for preventing ink from entering the wiring portion of the aluminum electrode 240 below.

FIG. 4 shows an example of an ink jet recording head using such a TAB film electrode lead structure having a stud bump structure or a plated bump structure. As shown, the inkjet recording head includes a grooved top plate 300, an orifice plate 310,
The TAB film 315 at the fixed position and the silicon substrate 10
And a pressing spring 320 that presses the “0” from the back surface to the top plate 300 via the heat radiation block 150. Further, in this ink jet recording head, the joint seal 340 seals the ink flow path, and the recording liquid is filled on the a side, and the pre-processing ink is filled on the b side.

In FIG. 5, reference numeral 400 denotes a recording head chip of an ink jet recording head. After assembling the parts shown in FIG. 4, the ink flow path, the gap between the common liquid chambers of the silicon substrate 100 and the top plate 300, and the electrical connection The part 160 and the like are sealed with an appropriate sealing material. As shown, the print head chip 400 is joined via a joint seal 340 to the top of an ink tank 410 whose inside is separated into a print ink storage section 420 and a pretreatment liquid storage section 430.

In the ink jet recording head of the present invention thus configured, the silicon substrate used on the pretreatment liquid side is formed by sputtering titanium tungsten (TiW) after the recording liquid side silicon substrate is completed in a wafer state. To form a film having a thickness of 3000 mm, further apply a resist, provide an opening in the electrode portion of the silicon substrate 100 by a photolithography process, and form a titanium tungsten (T
Using iW) as an electrode, gold (Au) is deposited by electrolytic plating, and after removing the resist, titanium tungsten (TiW) is etched with hydrogen dioxide (H ₂ O ₂ ) using the gold (Au) plated portion as a mask. Remove it. In the case of this embodiment, the gold (Au) plating has a thickness of 20 μm, but the thickness can be further reduced if the TAB lead does not short-circuit with the edge of the silicon substrate.

Further, TiW is not corroded by the pretreatment liquid, and further, the aluminum electrode portion is overlapped with a silicon nitride (SiN) film as a protective film by titanium tungsten. Is 15 μm and the opening of the aluminum electrode pad is 100 μm.
Since it is μm □, the size of the bump is 130 μm □. Therefore, the silicon substrate side is configured as described above, and is bonded to the top plate and brought into close contact with the top plate with the presser spring. Then, a silicone sealant is used to surround the ink flow path portion, and the gap between the silicon substrate and the common liquid chamber portion of the top plate. By covering the electrical joint and curing the silicone sealant, an ink jet recording head chip is completed. Thereafter, the ink is connected to the ink tank and the common liquid chamber is filled with ink. Here, since the TAB lead is covered with Au plating, it does not corrode.

[0031] By taking the above structure, a weakly acidic, and chlorine ions (Cl ^-) corrosion be used by filling a treatment solution 800ppm to the common liquid chamber was confirmed that not occur.

The ink jet recording ink does not corrode the aluminum electrode covered with the sealing material.
The silicon substrate 100 for discharging the recording ink on the a side of the ink jet recording head shown in FIG. 2 has the configuration of the silicon substrate 100 using the stud bumps 200 shown in FIG. 3 and a silicon substrate 100 for discharging recording ink.
The structure using the stud bumps 200 shown in FIG. 2 makes it possible to minimize an increase in the cost of the silicon substrate 100.

As described above, in the present invention, a silicon substrate provided with a drive circuit for driving an electrothermal transducer,
A nozzle, which is an ink flow path, is formed by joining a top plate having a common liquid chamber for supplying ink to the nozzle, and a lead of a metal conductor is extended from an insulating film facing the silicon substrate to form a liquid on the silicon substrate. Since the metal projection provided on the silicon substrate is formed by a metal such as Au and a plating layer formed on the metal by plating, the electrode portion is completely covered and protected. The projections and electrical wiring are not corroded by ink or pretreatment liquid, and the size of the silicon substrate can be unified in the same head. The operation rate of the line can be improved.

Next, the printing apparatus as the above-mentioned ink jet recording apparatus will be described. FIG. 6 shows an ink jet recording apparatus using the ink jet recording head of the present invention.

As shown in the figure, the carriage HC reciprocates in the B and C directions in the figure in conjunction with the forward and reverse rotations by a drive motor (not shown) and a timing belt 5030 linked to the drive motor. I do.

The carriage HC shown in FIG.
k) Two-chip recording head unit 5025 for ink and pretreatment liquid, ink tank unit 5026 for black ink and pretreatment liquid, recording head unit 5 for one-chip three-color color
027 and three color ink tank units 5028 are mounted side by side.

Recording ink is contained on the D side of the black ink and pretreatment liquid ink tank section 5026.
The E side contains a pretreatment liquid, and the inks are ejected onto recording paper in order of the pretreatment liquid and the recording ink in accordance with a recording signal. Reference numeral 5016 denotes a black ink, a black ink side of the pretreatment liquid recording head 5025, 5017 denotes a black ink, a pretreatment liquid side cap member for capping the orifice surface of the pretreatment liquid recording head 5025, and 5018.
Is a cap member for capping the orifice surface of the color recording head 5027. 5019 and 5020 are means for sucking the inside of the cap. The suction mechanism in such a suction means hardens when the pretreatment liquid and the recording ink are mixed, so that the suction mechanism uses black ink and pretreatment liquid. Separated separately. Further, the suction means can perform suction recovery of the recording head through the opening in each cap. Reference numeral 5021 denotes a pretreatment liquid cleaning blade, 5022 denotes a black ink cleaning blade, and 5023 denotes a color ink cleaning blade, which are separately divided into a pretreatment liquid and a recording ink.

As described above, as a result of making the recording ink and the pretreatment liquid usable on the printing apparatus, the recording ink and the pretreatment liquid are ejected onto recording paper before the recording ink. The combined use of the liquid suppresses bleeding on the recording paper before the ink, and an image having a sharp edge, that is, a sharp contour is obtained. Further, it is possible to improve the water resistance of such printing.

(Others) It should be noted that the present invention includes a means (for example, an electrothermal converter or a laser beam) for generating thermal energy as energy used for performing ink ejection, particularly in an ink jet recording system. An excellent effect is obtained in a recording head and a recording apparatus of a type in which the state of ink is changed by the thermal energy. This is because according to such a method, it is possible to achieve higher density and higher definition of recording.

The typical configuration and principle are described in, for example, US Pat. Nos. 4,723,129 and 4,740.
It is preferable to use the basic principle disclosed in the specification of Japanese Patent No. 796. This method is a so-called on-demand type,
Although it can be applied to any type of continuous type, in particular, in the case of the on-demand type, it can be applied to a sheet holding liquid (ink) or an electrothermal converter arranged corresponding to the liquid path. By applying at least one drive signal corresponding to the recorded information and giving a rapid temperature rise exceeding the nucleate boiling, heat energy is generated in the electrothermal transducer, and film boiling occurs on the heat acting surface of the recording head. Liquid (ink) corresponding to this drive signal on a one-to-one basis.
This is effective because air bubbles inside can be formed. The liquid (ink) is ejected through the ejection opening by the growth and contraction of the bubble to form at least one droplet. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are performed immediately and appropriately, so that the ejection of a liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable. As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. Further, if the conditions described in US Pat. No. 4,313,124 relating to the temperature rise rate of the heat acting surface are adopted, more excellent recording can be performed.

As the configuration of the recording head, in addition to the combination of the discharge port, the liquid path, and the electrothermal converter (a linear liquid flow path or a right-angled liquid flow path) as disclosed in the above-mentioned respective specifications, U.S. Pat. No. 4,558,333 and U.S. Pat. No. 44,558 which disclose a configuration in which a heat acting portion is arranged in a bending region.
A configuration using the specification of Japanese Patent No. 59600 is also included in the present invention. In addition, Japanese Unexamined Patent Application Publication No. 59-123670 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal converter for a plurality of electrothermal converters, and an aperture for absorbing a pressure wave of thermal energy is provided. The effect of the present invention is effective even if the configuration is based on JP-A-59-138461, which discloses a configuration corresponding to a discharge unit. That is, according to the present invention, recording can be reliably and efficiently performed regardless of the form of the recording head.

Further, the present invention can be effectively applied to a full-line type recording head having a length corresponding to the maximum width of a recording medium on which a recording apparatus can record. Such a recording head may have a configuration that satisfies the length by a combination of a plurality of recording heads, or a configuration as one integrally formed recording head.

In addition, even in the case of the serial type as described above, a recording head fixed to the apparatus main body or an electric connection with the apparatus main body and ink from the apparatus main body can be provided by being mounted on the apparatus main body. The present invention is also effective when a replaceable chip-type recording head that can be supplied or a cartridge-type recording head in which an ink tank is provided integrally with the recording head itself is used.

It is preferable to add a recording head ejection recovery unit, a preliminary auxiliary unit, and the like as the configuration of the recording apparatus of the present invention since the effects of the present invention can be further stabilized. If these are specifically mentioned, the recording head is heated using capping means, cleaning means, pressurizing or suction means, an electrothermal transducer, another heating element or a combination thereof. Pre-heating means for performing the pre-heating and pre-discharging means for performing the discharging other than the recording can be used.

The type and number of recording heads to be mounted are not limited to those provided only for one color ink, for example, and for a plurality of inks having different recording colors and densities. A plurality may be provided. That is, for example, the printing mode of the printing apparatus is not limited to a printing mode of only a mainstream color such as black, but may be any of integrally forming a printing head or a combination of a plurality of printing heads. The present invention is also very effective for an apparatus provided with at least one of the recording modes of full color by color mixture.

In addition, in the embodiment of the present invention described above, the ink is described as a liquid. However, an ink which solidifies at room temperature or lower and which softens or liquefies at room temperature may be used. In general, the ink jet method generally controls the temperature of the ink itself within a range of 30 ° C. or more and 70 ° C. or less to control the temperature so that the viscosity of the ink is in a stable ejection range. Sometimes, the ink may be in a liquid state. In addition, in order to positively prevent temperature rise due to thermal energy by using it as energy for changing the state of the ink from a solid state to a liquid state, or to prevent evaporation of the ink, the ink is solidified in a standing state and heated. May be used. In any case, the application of heat energy causes the ink to be liquefied by the application of the heat energy according to the recording signal and the liquid ink to be ejected, or to start solidifying when it reaches the recording medium. The present invention is also applicable to a case where an ink having a property of liquefying for the first time is used. In such a case, the ink
JP-A-54-56847 or JP-A-60-7
As described in Japanese Patent Publication No. 1260, it is also possible to adopt a form in which the sheet is opposed to the electrothermal converter in a state where it is held as a liquid or solid substance in the concave portion or through hole of the porous sheet. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

Further, the form of the ink jet recording apparatus of the present invention is not limited to the one used as an image output terminal of an information processing apparatus such as a computer, a copying apparatus combined with a reader or the like, and a facsimile apparatus having a transmission / reception function. It may take a form.

[0048]

As described above, according to the ink jet recording head of the first aspect of the present invention, the driving for driving the plurality of electrothermal transducers for generating the energy for discharging the recording ink is performed. A rectangular silicon substrate provided with a circuit, formed by bonding a nozzle serving as an ink flow path and a top plate having a common liquid chamber for supplying ink to the nozzle,
Three of the four sides of the silicon substrate are opposed to a flexible insulating film on which a metal wiring member is mounted, and a lead of a metal conductor is extended from the flexible insulating film to the silicon substrate. The electrode is joined to the upper electrode, the electrothermal transducer is arranged on a side not facing the flexible insulating film, and a plurality of the silicon substrates are used, and a lead of a metal conductor arranged on the flexible insulating film is used. In the ink jet recording head having a configuration in which a metal protrusion is formed at a bonding portion to perform electrical bonding, a metal protrusion provided on the silicon substrate is formed by a corrosion-resistant metal and a plating layer on the metal. because it is, Cl metal protrusions and the electric wires are present in the pretreatment solution and the pretreatment solution ^- together be prevented from being corroded by the can, Sai silicon substrate in the same recording head It becomes possible to unify the can be used in common production apparatus, it is possible to provide an inexpensive and reliable ink jet recording head as much as possible down the rise in the cost of the silicon substrate. Further, by making the size of the silicon substrate on which the electrothermal transducer for discharging the pretreatment liquid is disposed the same size as that of the recording ink side, production equipment can be shared and design efficiency of the production equipment can be improved. And the operation rate of the line can be improved.

According to a second aspect of the present invention, there is provided an ink jet recording head using a plurality of silicon substrates, wherein the projections provided on the silicon substrate are made of gold (Au) which is a metal having corrosion resistance and the gold. Since the silicon substrate is formed with a plating layer on which the protrusions are mechanically formed, the protrusions and the electrical wiring can be prevented from being corroded by the pretreatment liquid, and the size of the silicon substrate is unified, The production apparatus can be shared, and a highly reliable inkjet recording head can be obtained.

In the ink jet recording head according to the third aspect of the present invention, when forming a metal projection provided on an electrode on a silicon substrate, titanium tungsten (TiW) which is a high melting point metal is used on an aluminum electrode. Since a plating layer is formed by plating gold (Au) on the high melting point metal, titanium tungsten (TiW) is an acidic pretreatment liquid and chlorine ions (Cl ⁻ ) present in the pretreatment liquid.
Therefore, the aluminum electrode portion and the electric wiring can be prevented from being corroded.

The ink jet recording head according to claim 4 of the present invention is a head using an ink which uses both a recording ink and a pretreatment liquid, and is formed by plating metal projections on the pretreatment liquid side. Since the substrate is used, the electrode portion can be prevented from being corroded by the pretreatment liquid, and the size of the silicon substrate can be unified.

Since the ink jet recording head according to the fifth aspect of the present invention uses a substrate on which metal projections are mechanically formed on the ordinary recording liquid side, the size of the silicon substrate can be unified.

In the ink jet recording head according to the sixth aspect of the present invention, bubbles are generated in the ink using thermal energy, and the ink is discharged with the generation of the bubbles. Images can be obtained.

Since the ink jet recording apparatus according to the seventh aspect of the present invention uses the ink jet recording head according to any one of the first to sixth aspects of the present invention, it is possible to use a silicon substrate having an electrothermal converter for discharging a pretreatment liquid. By making the size of the substrate the same as the size of the recording ink, the production equipment can be shared, and the design efficiency of the production equipment and the operation rate of the line can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a silicon substrate to which a TAB film of the present invention is connected.

FIG. 2 is an enlarged sectional view of a TAB film lead formed by stud bumps.

FIG. 3 is an enlarged sectional view of a TAB film formed by plating and leads.

FIG. 4 is an exploded perspective view of an ink jet recording head using a two-chip silicon substrate.

FIG. 5 is a perspective view of an ink tank of an ink jet recording head using a two-chip silicon substrate.

FIG. 6 is a perspective view showing an ink jet recording apparatus.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 silicon substrate 110 electrothermal transducer 120 TAB film 130 TAB lead 140 bump 150 heat dissipation block 160 junction with printer 170 TAB bending section 200 stud bump 210 plating bump 220 titanium tungsten (TiW) film 225 titanium tungsten (TiW) film And silicon nitride (SiN) film overlap portion 230 silicon nitride (SiN) film 240 aluminum electrode 250 tantalum (Ta) film 300 top plate with groove 310 orifice plate 315 TAB film 320 ink discharge port 330 presser spring 340 joint seal 400 inkjet Recording head chip 410 Ink tank 420 Recording ink storage section 430 Pretreatment liquid storage section

Claims (7)

[Claims] 1. A rectangular silicon substrate having a driving circuit for driving a plurality of electrothermal transducers for generating energy for discharging recording ink, a nozzle serving as an ink flow path, and an ink And a top plate provided with a common liquid chamber for supplying a liquid supply member. Three of the four sides of the silicon substrate face a flexible insulating film on which a metal wiring member is mounted, and A lead of a metal conductor is extended to the silicon substrate and joined to an electrode on the silicon substrate, the electrothermal transducer is arranged on a side not facing the insulating film, and a plurality of the silicon substrates are used. In an ink jet recording head configured to form a metal projection at a bonding portion between a metal conductor and a lead arranged at a position to perform electrical bonding, the metal substrate provided on the silicon substrate An ink jet recording head, characterized in that it is constituted by a plated layer formed on the outs corrosion resistance of the metal and the metal. 2. In an ink jet recording head using a plurality of silicon substrates, a projection provided on the silicon substrate is formed of gold (Au) which is a corrosion-resistant metal and a plating layer on the gold. 2. An ink jet recording head according to claim 1, wherein a silicon substrate on which said projections are mechanically formed is used in combination. 3. When forming a metal projection provided on an electrode on the silicon substrate, titanium tungsten (TiW), which is a high melting point metal, is used on an aluminum electrode, and gold (Au) is formed on the high melting point metal. 3. The ink-jet recording head according to claim 1, wherein a plating layer is formed by plating. 4. The ink jet recording head is a head that uses an ink that uses both a recording ink and a pretreatment liquid, and uses a substrate that is formed by plating the metal protrusions on the pretreatment liquid side. The inkjet recording head according to any one of claims 1 to 3, wherein: 5. The ink jet recording head according to claim 1, wherein a substrate on which the metal protrusion is mechanically formed is used on a normal recording ink side. 6. The ink jet recording head according to claim 1, wherein bubbles are generated in the ink by using thermal energy, and the ink is ejected as the bubbles are generated. Item 7. The ink jet recording head according to Item 1. 7. An ink jet recording apparatus using the ink jet recording head according to claim 1.