JP3484675B2 - Head mounting structure for ink liquid jet printer - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink liquid ejecting type printer head which is applied to a printer and which ejects ink droplets to record the ink droplets on a printer recording sheet.

[0002]

2. Description of the Related Art In recent years, development of high performance, miniaturization and low price of information recording equipment has been rapidly advanced. Among such recording devices, dot printers have been widely used in the past, but recently laser printers and ink jet printers have been widely used. Among them, the ink jet printer has advantages such as low price, low noise, and low running cost as compared with the conventional dot printer, and its share is rapidly expanding at present.

As an ink liquid jet printer, a method in which an ink liquid is caused to fly by deformation of a piezoelectric element, a method in which an ink liquid is caused to fly by resistance heating by direct current, or a current is directly applied to the ink liquid to cause the ink liquid to fly There are various methods such as alternating current heating method.

Hereinafter, a conventional head mounting structure for an ink jet printer will be described with reference to the drawings.

FIG. 5 is a plan view of a main part of a conventional head mounting structure for an ink liquid ejecting printer by an alternating current heating system, and FIG. 6 is a cross-sectional view of the main part showing a section AA 'in FIG. Is an ink liquid jet type printer head (hereinafter referred to as a head chip) having a plurality of electrodes (not shown) on a substrate made of glass or the like, and 2 are provided corresponding to the electrodes (not shown) of the head chip 1, respectively. A nozzle plate having a plurality of nozzle holes, 4 is a driver for driving a plurality of electrodes (not shown) on the head chip 1, and 5 is a driver.
Is a flexible substrate (hereinafter referred to as FPC) for applying an electric signal from the printer body (not shown) to the driver 4, 3 is a head chip 1, a driver 4 and an FPC 5
Is an Au wire for electrically connecting the head chip 1, the driver 4, the FPC 5 and the Au wire 3 with a resinous adhesive.

The head chip 1 has a conductor pattern 1a for applying a voltage to a plurality of electrode pairs (not shown).
Is equipped with. Further, the driver 4 has a conductor pattern 1a.
And a conductor pattern 4a for receiving a voltage from the FPC 5. Furthermore, the FPC 5 is a conductor pattern 5a corresponding to the conductor pattern 4a.
Is equipped with.

The FPC 5 is a flexible substrate 5d.
A hole 5c provided in the center of the substrate 5d, a conductor pattern 5a formed on the substrate 5d with a slight distance on both sides of the hole 5c, and an electrical component for predetermined parts of the printer body. The conductor pattern 5b for connecting the conductor pattern 5a, the wiring portion 5f for conducting the conductor pattern 5a and the conductor pattern 5b, and the substrate 5d except for the region around the hole 5c including the region of the conductor pattern 5a and the region of the conductor pattern 5b. And a PI protective layer 5e covering the upper part of the.

Then, the head chip 1 is arranged in the hole 5c of the FPC 5, and the drivers 4 are fixed on both sides of the hole 5c on the FPC 5, and the Au wire is provided between the conductor patterns 5a and 4a and between the conductor patterns 4a and 1a. By electrically connecting at 3, an ink liquid jet printer head mounting structure is constructed.

The manufacturing process of the ink liquid jet type head mounting structure for a printer constructed as described above will be described below.

First, a die bond adhesive (not shown) is applied to a predetermined area on the FPC 5. Next, the driver 4 is positioned on the die bond adhesive by a device such as a die bonder. After positioning the driver 4, the die bond adhesive is cured. In this way, the driver 4
Fix in place of C5.

Next, in order to electrically connect the FPC 5 and the driver 4, a conductor pattern 5 wired on the FPC 5
a and the conductor pattern 4a wired on the driver 4 with A
The u wire 3 is bonded by wire bond. In this way, the FPC 5 and the driver are electrically connected.

Next, the head chip 1 is inserted into the hole 5c formed in the FPC 5 in a predetermined shape. Then, the head chip 1 is positioned using a positioning device or the like so as to secure a predetermined position in the hole 5c. Immediately after positioning, a fixing adhesive (not shown) is applied between the hole 5c and the head chip 1 in a bridge shape. Then, the fixing adhesive is cured. In this way, the head chip 1 is fixed in the FPC 5.

Next, in order to electrically connect the head chip 1 fixed in the FPC 5 and the driver 4, a conductor pattern 4b wired on the driver 4 and a conductor pattern wired on the head chip 1 Au wire 3 is bonded to 1a by wire bond. In this way, the driver 4 and the head chip 1 are electrically connected.

Next, the mounted and wired A on the FPC 5
An adhesive 6 is applied and sealed to protect the u wire 3, the driver 4 and the head chip 1. After sealing, the adhesive 6 is cured to form the ink liquid jet printer head mounting structure.

The operation of the ink-jet type printer head mounting structure constructed as described above will be briefly described below.

A predetermined drive permission signal and a high-frequency pulse based on the predetermined drive permission signal from a driver control device (not shown) of the printer main body pass through the conductor patterns 5b and 5a, the Au wire 3 and the conductor pattern 4a on the driver 4 on the FPC 5. It is applied to the driver 4. At the same time, a DC voltage from a driver power supply (not shown) is applied to the conductor patterns 5b, 5a, A on the FPC 5.
It is applied to the driver 4 via the u-line 3 and the conductor pattern 4a on the driver 4.

As a result, a predetermined signal from the driver 4
It is applied to each electrode (not shown) on the head chip 1 via the conductor pattern 4b on the driver 4, the Au wire 3 and the conductor pattern 1a on the head chip 1.

[0018]

However, in the conventional ink liquid ejecting type head mounting structure for a printer, an adhesive which is a relatively low-viscosity sealing resin due to the improvement of the wiring density and the mounting density. When the agent 6 is applied only to a predetermined area, the end portion B where the adhesive 6 is a sealing resin application area (hereinafter, simply referred to as an application area) as shown in FIG.
There is the first problem that the unnecessary resin portion 6a flows out to the outside of 1, B2, B3 and B4.

Further, from the above-mentioned first problem, the quality of the potting shape of the adhesive 6 after application is deteriorated, and the surface of the driver 4, the Au wire 3, and the surface of the head chip 1 are not sealed and an exposed portion 7 is generated. There was the second problem of doing so.

Therefore, when the purging mechanism and the wiping mechanism which are peculiar to the ink jet printer are operated, the Au wire 3 of the exposed portion 3, the conductor pattern 1a of the head chip 1, the conductor pattern 4a of the driver 4, Since 4b was mechanically damaged, electrical troubles such as disconnection and short circuit occurred. In addition, even when the purging mechanism and the wiping mechanism are not operating, the A
u wire 3, conductor pattern 1a of head chip 1, driver 4
The conductor patterns 4a and 4b of No. 1 are chemically eroded by water, air, or ink, and the electrical and mechanical characteristics of the respective conductors are deteriorated.

Due to such a problem, the head chip 1
A signal with a certain quality is not applied to the electrode (not shown) above, resulting in poor print quality, performance degradation such as large variations in print quality, and in the worst case, no signal is applied and ejection failure occurs. There are various problems such as defects and deterioration of mechanical quality of the head mounting structure itself for an ink jet printer.

There is also a problem that the suction of the ink, which is the purging mechanism, does not function because of the unnecessary resin portion 6a and the nozzle hole (not shown) in the nozzle plate 2 is clogged.

Now, in order to stabilize the shape of such an adhesive after application, a dam has been conventionally used.

The following will briefly describe them.
8 and 9 are cross-sectional views of a main part showing a cross section when a dam is formed on a substrate. In the case of FIG. 8, the dam 10 is formed on the substrate 8 by a new member at the end of the application area of the adhesive 6. The dam 10 prevented the adhesive 6 from flowing out from the application area. In the case of FIG. 9, a high-viscosity resin 11 is formed as a dam on the end of the application area of the adhesive 6 on the substrate 8, and this resin 11 prevents the adhesive 6 from flowing out from the application area. Was there. However, the dam formation by such a conventional method has a problem that a cost and man-hours are required because a new material is added and a process is required.

The present invention is directed to solving the above-mentioned problems and inconveniences in the prior art, and an ink liquid jet which realizes a stable shape after application of an adhesive without cost and man-hours. An object of the present invention is to provide a head mounting structure for a pattern printer.

[0026]

As a technical means for effectively solving the above problems, the present invention provides an ink having a plurality of pair of electrodes and a plurality of nozzle holes provided corresponding to the pair of electrodes. Liquid jet printer head, a driver for driving the ink liquid jet printer head, a flexible substrate serving as a supply path of an electric signal from the printer main body device, the ink liquid jet printer head, the driver, and In a head mounting structure for an ink liquid ejecting printer, which comprises a wire that electrically connects the flexible substrate and a resin that seals the wire, the flexible substrate has a conductive property that the flexible substrate has as an uppermost layer. A protective layer for protecting the pattern is further provided on the flexible substrate. The protective layer is formed so as to surround the periphery of the connection portion between the wire and the conductive pattern, and a wall portion is formed to prevent the resin from flowing out to the protective layer due to the thickness of the protective layer. And

Further, the present invention is also characterized in that the shape of the area surrounded by the protective layer conforms to the shape of the resin application area.

Further, according to the present invention, an ink liquid ejecting type printer head having a plurality of electrodes and a plurality of nozzle holes provided corresponding to the pair of electrodes, and the ink liquid ejecting type printer head are driven. A driver, a flexible substrate serving as a supply path of an electric signal from the printer main body device, a wire for electrically connecting the ink liquid ejecting printer head, the driver and the flexible substrate, and for sealing the wire In a head mounting structure for an ink liquid ejecting printer comprising the resin of, the flexible substrate has a protective layer for protecting a conductive pattern of the flexible substrate as an uppermost layer, and the protective layer of the resin is provided. In order to suppress the outflow of water, a groove portion is provided on the protective layer.

Further, the present invention is characterized in that the groove is formed in accordance with the shape of the resin application region, and the protective layer has a thickness of 50 μm or more.

[0030]

With this structure, even when a resin having a relatively low viscosity is applied only to a predetermined area due to the improvement of the wiring density and the mounting density, the wall or Since the grooves are formed, they function as a dam and prevent the resin from flowing out of the end of the resin application area, which causes problems such as forming an unnecessary resin portion and the quality of the resin potting shape. Deteriorated driver's surface,
This eliminates the problem that the exposed surfaces of the wires are not sealed because the surfaces of the wires and head chips are not sealed.

Therefore, when the purging mechanism and the wiping mechanism, which are peculiar to the ink jet printer, are operated, there is no exposed portion of the wire, so that there is no electrical trouble such as disconnection or short circuit.

Similarly, even when the purging mechanism and the wiping mechanism are not operating, the exposed portion of the wire does not exist, so that the conductor is not electrically corroded by water, air or ink, and the electrical and mechanical parts of the conductor are not mechanically corroded. The problem of deteriorating the dynamic characteristics is eliminated. Further, by eliminating such a defect, a signal having a predetermined quality is applied to an electrode (not shown) on the head chip, so that high performance and high quality printing characteristics can be realized. Furthermore, the mechanical quality of the head mounting structure itself for the ink jet printer is also improved. Further, the suction of the ink, which is the purging mechanism, is unnecessary, and the clogging of the nozzle holes in the nozzle plate is eliminated because there is no resin portion.

Further, unlike the dam method as shown in FIGS. 8 and 9, it is possible to eliminate the cost and man-hours because a new material is not added and a process is not required.

Further, when the protective layer has a thickness of 50 μm or more, the function of the dam for preventing the outflow of the resin can be sufficiently fulfilled.

[0035]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of an essential part of a head mounting structure for an ink liquid ejecting printer according to the alternating current heating system of the present invention, FIG. 2 is a sectional view taken along the line AA 'in FIG. Show. Note that in FIGS. 1 and 2, FIGS.
The components denoted by the same reference numerals as those in the conventional example shown in FIG. 1 have the same configuration, and detailed description thereof will be omitted.

In the first embodiment, in the protection area of the PI protection layer 5e according to the conventional example shown in FIGS. 5, 6 and 7, the application area of the adhesive 6, that is, the straight line B in FIG.
The area corresponding to the area surrounded by 1, B2, B3, and B4 is set as a non-protected area without the PI protective layer 5e.
The protective layer 5e is formed. That is, the FPC 5 is configured by attaching the film-like PI protective layer 5e to the substrate 5d on which the conductive patterns 5a, 5b, 5f are formed. At this time, by forming an opening in the area corresponding to the application area on the PI protective layer 5e in advance, the application area appears outside. That is, the FPC 5 is formed by attaching the PI protective layer 5e to the substrate 5d on which the conductive patterns 5a, 5b, 5h are formed. At this time, the coating region is exposed to the outside by forming an opening in the region corresponding to the coating region in advance on the PI protective layer 5.

The manufacturing process of the ink liquid jet type head mounting structure for a printer constructed as described above will be described below.

First, a die bond adhesive (not shown) is bonded to a predetermined area on the FPC 5. Next, the driver 4 is positioned on the die bond adhesive by a device such as a die bonder. After positioning the driver 4, the die bond adhesive is cured. In this way, the driver 4 is fixed at a predetermined position on the FPC 5.

Next, in order to electrically connect the FPC 5 and the driver 4, a conductor pattern 5 wired on the FPC 5
The Au wire 3 is bonded by wire bonding to a and the conductor pattern 4a wired on the driver 4. In this way, the FPC 5 and the driver 4 are electrically connected.

Next, the head chip 1 is inserted into the hole 5c formed in the FPC 5 in a predetermined shape. Then, the head chip 1 is positioned using a positioning device or the like so as to secure a predetermined position in the hole 5c. Immediately after positioning, a fixing adhesive (not shown) is applied between the hole 5c and the head chip 1 in a bridge shape. Then, the fixing adhesive is cured. In this way, the head chip 1
Are fixed in the FPC 5.

Next, in order to electrically connect the head chip 1 fixed in the FPC 5 and the driver 4, the conductor pattern 4b wired on the driver 4 and the head chip 1 are connected.
The Au wire 3 is adhered by wire bonding on the conductor pattern 1a wired above. In this way, the driver 4 and the head chip 1 are electrically connected.

Next, Au on the FPC 5 mounted and connected
An adhesive 6 is applied and sealed to protect the wires 3, the driver 4 and the head chip 1. After sealing, the adhesive 6 is cured to form the ink liquid jet printer head mounting structure.

The operation of the head mounting structure for an ink liquid jet type printer constructed as described above will be briefly described. A predetermined drive permission signal from the driver control device (not shown) of the printer main body, and a high-frequency pulse based on the predetermined drive permission signal are applied to the conductor patterns 5b, 5a, Au on the FPC 5.
It is applied to the driver 4 via the conductor pattern 4a on the line 3 and the driver 4. At the same time, a DC voltage from a driver power supply (not shown) is applied to the conductor patterns 5b, 5a, A on the FPC 5.
It is applied to the driver 4 via the u-line 3 and the conductor pattern 4a on the driver 4. As a result, a predetermined signal is applied from the driver 4 to each electrode (not shown) on the head chip 1 via the conductor pattern 4b on the driver 4, the Au wire 3 and the conductor pattern 1a on the head chip 1.

FIG. 3 is an enlarged cross-sectional view of an essential part in which the cross-section C of the head mounting structure for an ink liquid jet type printer after completion of the first embodiment of the present invention is enlarged. In the case of the first embodiment, since the uppermost PI protective layer 5e of the FPC 5 is not formed in the area surrounded by the ends B1, B2, B3 and B4 of the application area of the adhesive 6, this application is not performed. The wall portion 5g is formed at the end portion of the region due to the thickness of the PI protective layer 5e. In this embodiment, the PI protective layer has a thickness of 50.
It is set to μm or more. On the other hand, the adhesive 6 will flow to the periphery until it is applied and cured, but the tip of the adhesive 6 is the end B of the application area.
The wall portion 5g stops the flow of the resin even when it reaches 1, B2, B3, and B4, and does not flow to the peripheral portion any more. That is, the wall portion 5g functions as a dam.

FIG. 4 is an enlarged cross-sectional view of an essential part in which the cross-sectional portion C of the head mounting structure for an ink liquid jet type printer after completion of the second embodiment of the present invention is enlarged. In the second embodiment, the PI protective layer 5e according to the conventional example shown in FIGS. 5 and 6 is surrounded by the end portion of the application area of the adhesive 6, that is, the straight lines B2, B3, B3 and B4 in FIG. The groove 5j is formed in the recessed portion.

In the case of the second embodiment, since the groove portion 5h having the removed portion is formed in the PI protective layer 5e which is the uppermost portion of the FPC 5, the groove portion 5h is covered with the wall portion 5g.
Will be provided. On the other hand, before the adhesive 6 is applied and hardened, the adhesive 6 flows to the periphery, but the tip of the adhesive 6 is the end portions B1, B2, B of the application area.
Even when 3 and B4 are reached, the wall portion 5i can stop the outflow of the adhesive agent 6 and does not flow further to the peripheral portion. The so-called wall 5g functions as a dam.

Although the PI material is used as the protective layer in this embodiment, the material is not limited to this as long as it is a member having flexibility and insulation.

[0049]

As described above, an ink liquid ejecting type printer head having a plurality of pairs of electrodes and a plurality of nozzle holes provided corresponding to the pair of electrodes, a driver for driving the ink liquid ejecting type printer head, and a printer. A flexible substrate that serves as a supply path of an electric signal from the main body device, a wire that electrically connects the ink liquid ejecting printer head, the driver, and the flexible substrate, and an ink liquid made of a resin for sealing the wire. In the head mounting structure for a jet type printer, the region corresponding to the sealing resin application region in the protective layer on the protective layer of the FPC is made a non-protected region without the protective layer, so that the end of the sealing resin application region is A wall is formed by the thickness of the protective layer so as to surround the wall, and the wall is used as a dam, or By forming a groove without a protective layer in the sealing resin application area on the uppermost protective layer of, the groove shape is used as a dam so that the coating shape quality from resin application to curing is improved. Remarkably improved.

Therefore, since the unnecessary resin portion or the element exposed portion on the FPC as in the prior art is eliminated, a signal having a predetermined quality is applied to an electrode (not shown) on the head chip, so that high performance and high quality are achieved. Application characteristics can be realized. Further, the mechanical quality of the head mounting structure itself for the ink jet printer is also improved. Further, since the ink that is the purging mechanism is smoothly sucked, the clogging of the nozzle holes (not shown) in the nozzle plate is eliminated.

Further, the cost and man-hours are lower than those of the conventional dam method.

As described above, according to the present invention, the problems peculiar to the conventional head mounting structure for an ink liquid ejecting printer are solved by an easy means which does not require cost and man-hours, and the head mounting for an ink liquid ejecting printer is mounted. It is possible to improve the quality of the structure itself, and at the same time, to realize high-performance and high-quality printing performance, which has a great practical effect.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of an ink liquid jet type printer head mounting body according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view of an essential part showing a cross section AA ′ of FIG.

FIG. 3 is an enlarged cross-sectional view of an essential part of an enlarged portion C of FIG.

FIG. 4 is an enlarged cross-sectional view of an essential part showing an enlarged cross section of an ink liquid jet type printer head mounting body according to a second embodiment of the invention.

FIG. 5 is a plan view of a principal part of an ink liquid jet type printer head mounting body according to a conventional example.

6 is a cross-sectional view of a main part showing a cross section taken along the line AA ′ of FIG.

FIG. 7 is an enlarged cross-sectional view of an essential part of an enlarged portion C of FIG.

FIG. 8 is an enlarged cross-sectional view of an essential part showing an example of a conventional dam system.

FIG. 9 is an enlarged cross-sectional view of a main part showing another example of the conventional dam method.

[Explanation of symbols]

1 ... Head chip, 2 ... Nozzle plate, 3 ... Au wire,
4 ... Driver, 5 ... Flexible substrate (FPC), 5
e ... PI protective layer, 5g ... Wall portion, 5h ... Groove portion, 6 ... Adhesive agent, 7 ... Element exposed portion, 8 ... Substrate, 9 ... Element, 10
... Dam, 11 ... High viscosity resin, B1, B2, B3, B4 ... Adhesive application area.

Claims (5)

(57) [Claims] 1. A head for an ink liquid ejecting printer having a plurality of pairs of electrodes and a plurality of nozzle holes provided corresponding to the pair of electrodes, and a driver for driving the head for the ink liquid ejecting printer. A flexible substrate that serves as a supply path of an electric signal from the printer main body device, a wire that electrically connects the ink liquid ejecting printer head, the driver, and the flexible substrate, and a resin for sealing the wire. In a head mounting structure for an ink liquid ejecting printer consisting of, the flexible substrate has a protective layer for protecting the conductive pattern of the flexible substrate as the uppermost layer, and further the wire on the flexible substrate. The protective layer is formed so as to surround the periphery of the connection portion with the conductive pattern. A head mounting structure for an ink liquid ejecting printer, wherein a wall portion is formed to suppress the resin from flowing out to the protective layer depending on the thickness of the protective layer. 2. The head mounting structure for an ink liquid ejecting printer according to claim 1, wherein the shape of the area surrounded by the protective layer conforms to the shape of the resin application area. . 3. An ink liquid ejecting type printer head having a plurality of electrodes and a plurality of nozzle holes provided corresponding to the pair of electrodes, and a driver for driving the ink liquid ejecting type printer head. A flexible substrate that serves as a supply path of an electric signal from the printer main body device, a wire that electrically connects the ink liquid jet printer head, the driver, and the flexible substrate,
In a head mounting structure for an ink liquid ejecting printer, which comprises a resin for sealing the wire, the flexible substrate has a protective layer for protecting the conductive pattern of the flexible substrate as the uppermost layer,
A head mounting structure for an ink liquid ejecting printer, characterized in that a groove is provided on the protective layer in order to prevent the resin from flowing out to the protective layer. 4. The head mounting structure for an ink liquid ejecting printer according to claim 3, wherein the groove is formed according to the shape of the resin application region. 5. The head mounting structure for an ink liquid jet printer according to claim 1, wherein the protective layer has a thickness of 50 μm or more.