JPH11333862A - Resin molding die of resin junction optical element and manufacture thereof - Google Patents
Resin molding die of resin junction optical element and manufacture thereofInfo
- Publication number
- JPH11333862A JPH11333862A JP10145261A JP14526198A JPH11333862A JP H11333862 A JPH11333862 A JP H11333862A JP 10145261 A JP10145261 A JP 10145261A JP 14526198 A JP14526198 A JP 14526198A JP H11333862 A JPH11333862 A JP H11333862A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- mold surface
- resin layer
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光学素子基材上に
所定形状の樹脂層を成形して設けることにより樹脂接合
型の光学素子を製造するための樹脂成形用金型と、樹脂
接合型光学素子の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-molding mold for manufacturing a resin-bonded optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate, and a resin-bonding mold. The present invention relates to a method for manufacturing an optical element.
【０００２】[0002]
【従来の技術】光学素子であるレンズには、表面形状が
非球面の非球面レンズがある。非球面レンズは、球面レ
ンズによる球面収差や広角レンズにおけるディストーシ
ョンを除去できる等、球面レンズでは得られない優れた
性能を有することから重用されている。2. Description of the Related Art A lens which is an optical element includes an aspherical lens having an aspherical surface. Aspheric lenses are used frequently because they have excellent performance that cannot be obtained with spherical lenses, such as the ability to eliminate spherical aberration caused by spherical lenses and distortion in wide-angle lenses.
【０００３】現在、量産性に優れた非球面レンズとして
樹脂接合型非球面レンズがある。このレンズは、図３に
示すような薄い（例えば、5〜 100μm の厚さの）樹脂
硬化層３２と基体たるレンズ３１により構成されてい
る。なお、図３のレンズでは、レンズ基材３１が球面を
有し、その球面上に樹脂硬化層３２が非球面を形成する
ような厚さ分布をもって接合されている。At present, there is a resin-bonded aspherical lens as an aspherical lens excellent in mass productivity. This lens is composed of a thin resin cured layer 32 (for example, having a thickness of 5 to 100 μm) as shown in FIG. In the lens of FIG. 3, the lens substrate 31 has a spherical surface, and the resin cured layer 32 is joined on the spherical surface with a thickness distribution such that an aspherical surface is formed.
【０００４】この様な樹脂接合型非球面レンズは、例え
ば図４に示す製法により製造される。図４は、図３に示
す樹脂接合型非球面レンズを製造する従来の方法を示す
工程図である。尚、以下の工程説明において、括弧内の
数字は図４の工程（１）〜工程（４）に対応する。[0004] Such a resin-bonded aspherical lens is manufactured by, for example, a manufacturing method shown in FIG. FIG. 4 is a process chart showing a conventional method for manufacturing the resin-bonded aspherical lens shown in FIG. In the following description of the steps, the numbers in parentheses correspond to steps (1) to (4) in FIG.
【０００５】（１）所定の表面形状（平面、球面、非球
面等）の金型面を有する金型４３を水平に置き、前記金
型面の中央部に所定量の光硬化型樹脂液４２ａを垂ら
す。 （２）光学素子基材４１を金型４３に向かって降下さ
せ、光学素子基材４１を金型４３に接近させることによ
り、樹脂液４２ａを基材４１と金型４３の間隙で押し広
げる。(1) A mold 43 having a mold surface having a predetermined surface shape (flat surface, spherical surface, aspherical surface, etc.) is placed horizontally, and a predetermined amount of a photo-curable resin liquid 42a is placed at the center of the mold surface. Drop. (2) By lowering the optical element substrate 41 toward the mold 43 and bringing the optical element substrate 41 closer to the mold 43, the resin liquid 42 a is pushed and spread in the gap between the substrate 41 and the mold 43.
【０００６】ここで、光学素子基材４１の材料として
は、ガラスや結晶性光学材料を用いる。 （３）光学素子基材４１と金型４３との間隔が所定値と
なるように両者を接近させ、この状態を保持して、光
（紫外線）４４を基材４１を通して樹脂液４２ａに照射
する。樹脂液４２ａは、重合反応により硬化して硬化樹
脂層４２が形成される。Here, as the material of the optical element substrate 41, glass or a crystalline optical material is used. (3) The optical element base material 41 and the mold 43 are brought close to each other so that the distance between them becomes a predetermined value. In this state, light (ultraviolet light) 44 is irradiated to the resin liquid 42a through the base material 41. . The resin liquid 42a is cured by a polymerization reaction to form a cured resin layer 42.
【０００７】（４）基材４１と一体化された硬化樹脂層
４２を金型４３との界面から剥離して離型する。 以上のような製法（工程）により、樹脂接合型光学素子
を得ることができる。(4) The cured resin layer 42 integrated with the base material 41 is peeled off from the interface with the mold 43 and released. The resin-bonded optical element can be obtained by the above-described manufacturing method (step).
【０００８】[0008]
【発明が解決しようとする課題】前記製法により樹脂接
合型光学素子を製造すると、硬化樹脂層４２の形成時に
樹脂層４２と金型４３の金型面とがオプティカル・コン
タクトにより非常に強く密着する。そして、この密着し
た樹脂層４２と金型４３とを光学素子基材４１の外周部
の一部または全部に荷重を加えることにより引き離そう
とすると（即ち、樹脂接合型光学素子を金型から離型し
ようとすると）、非常に大きな力が必要となり、光学素
子基材４１が破壊されたり、樹脂層４２が基材４１から
剥がれるおそれがあって問題となっていた。When a resin-bonded optical element is manufactured by the above-mentioned manufacturing method, the resin layer 42 and the mold surface of the mold 43 adhere very strongly to the mold surface of the mold 43 when the cured resin layer 42 is formed. . Then, when the resin layer 42 and the mold 43 that are in close contact with each other are to be separated from each other by applying a load to part or all of the outer peripheral portion of the optical element substrate 41 (that is, the resin-bonded optical element is separated from the mold). However, a very large force is required, and the optical element substrate 41 may be broken or the resin layer 42 may be peeled off from the substrate 41.
【０００９】そこで、この問題を解決すべく離型を小さ
な力で可能にする方法として、金型面に離型剤を塗布す
る方法が一般的に知られている。また、塗布方法として
は、スピン法やハケによる塗布方法が知られている。或
いは、前記問題を解決すべく、特開平4-317435には、金
型面に同心円状のＶ型溝を複数本設けることにより、小
さな力で離型を可能にする方法が提案されている。In order to solve this problem, a method of applying a release agent to a mold surface is generally known as a method for releasing the mold with a small force. Further, as a coating method, a coating method using a spin method or a brush is known. Alternatively, in order to solve the above-mentioned problem, Japanese Patent Application Laid-Open No. 4-317435 proposes a method in which a plurality of concentric V-shaped grooves are provided on a mold surface so that the mold can be released with a small force.
【００１０】しかし、離型剤を塗布する方法では、塗布
工程が増えてサイクルタイムが長くなる、離型剤層の制
御が難しく塗布ムラが生じる、所望の成形面を安定して
形成することができないという問題があった。また、特
開平4-317435に提案されている方法は、金型面に溝を設
けることにより、金型面と樹脂との間にオプティカル・
コンタクト状態から解放される微少領域を何点か生じさ
せ、その領域を起点にして小さな力で離型する方法であ
る。However, in the method of applying the release agent, the number of application steps increases, the cycle time becomes longer, the control of the release agent layer becomes difficult, and application unevenness occurs, and a desired molding surface can be formed stably. There was a problem that it was not possible. In addition, the method proposed in Japanese Patent Application Laid-Open No. 4-317435 discloses that an optical disk is provided between a mold surface and a resin by providing a groove on the mold surface.
This is a method in which several small areas released from the contact state are generated, and the mold is released with a small force starting from the small areas.
【００１１】しかし、溝が同心円状に設けられており、
オプティカル・コンタクト状態から解放される溝付近の
空間は外気とリークしていないので、離型動作を進める
と、前記空間の体積が大きくなって空間内の気圧が減少
する。そして、その結果、離型を妨げる方向に力が働い
て十分な離型効果を得ることができないという問題があ
った。However, the grooves are provided concentrically,
Since the space near the groove released from the optical contact state does not leak with the outside air, the volume of the space increases and the air pressure in the space decreases as the mold releasing operation proceeds. As a result, there is a problem in that a force acts in a direction that hinders release, and a sufficient release effect cannot be obtained.
【００１２】本発明はかかる問題に鑑みてなされたもの
であり、光学素子基材上に所定形状の樹脂層を成形して
設けることにより樹脂接合型の光学素子を製造する際
に、高精度な樹脂層の成形面を安定して形成することが
可能であり、また成形物を容易に小さな力で離型するこ
とができる樹脂成形用金型と、これを用いた樹脂接合型
光学素子の製造方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and is intended to provide a resin-bonded type optical element by molding and providing a resin layer having a predetermined shape on an optical element base material. Manufacture of a resin molding die capable of stably forming the molding surface of the resin layer and releasing the molded product easily with a small force, and production of a resin bonded optical element using the same. The aim is to provide a method.
【００１３】[0013]
【課題を解決するための手段】そのため、本発明は第一
に「光学素子基材上に所定形状の樹脂層を成形して設け
ることにより樹脂接合型光学素子を製造するための樹脂
成形用金型において、前記樹脂層の光学有効径部分の外
側に位置する光学有効径周辺部を成形する金型面領域か
ら、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない金型面領域まで達する溝を少なくとも１カ所以
上に設けたことを特徴とする樹脂接合型光学素子の樹脂
成形用金型（請求項１）」を提供する。Therefore, the present invention firstly provides a resin molding metal for manufacturing a resin-bonded optical element by forming and providing a resin layer of a predetermined shape on an optical element substrate. In the mold, from the mold surface area for molding the optical effective diameter peripheral portion located outside the optical effective diameter portion of the resin layer, to the mold surface located outside the terminal portion of the resin layer and not molding the resin layer A resin molding die (claim 1) for a resin-bonded optical element, characterized in that at least one or more grooves reaching the region are provided.
【００１４】また、本発明は第二に「前記光学素子基材
上に非球面形状を有する樹脂層を成形して設けることを
特徴とする請求項１記載の樹脂成形用金型（請求項
２）」を提供する。また、本発明は第三に「少なくと
も、光学素子基材上に所定形状の樹脂層を成形して設け
ることにより樹脂接合型光学素子を製造するための樹脂
成形用金型であり、前記樹脂層の光学有効径部分を成形
する第１金型面領域と、前記光学有効径部分の外側に位
置する前記樹脂層の光学有効径周辺部を成形する第２金
型面領域と、前記樹脂層の末端部分の外側に位置し、樹
脂層を成形しない第３金型面領域とを有し、前記第２金
型面領域から前記第３金型面領域まで達する溝を金型面
の少なくとも１カ所以上に設けた樹脂成形用金型を用意
する工程と、前記光学素子基材と前記金型との間に光硬
化型樹脂液を挟み、かつ前記基材と前記金型との間隔を
制御することにより、前記樹脂液を前記基材と前記金型
との間隙において、前記第１金型面領域から前記第２金
型面領域まで押し広げる工程と、前記第２金型面領域ま
で押し広げられた樹脂液に光を照射して硬化させ、硬化
樹脂層と前記基材とを一体化させることにより、所望の
表面形状を有する樹脂接合型光学素子を作製する工程
と、前記樹脂接合型光学素子を前記金型から取り外す工
程と、を備えた樹脂接合型光学素子の製造方法（請求項
３）」を提供する。The present invention also provides a resin molding die according to claim 1, wherein a resin layer having an aspherical shape is formed and provided on the optical element substrate. )"I will provide a. Further, the present invention provides a resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element base material. A first mold surface area for molding the optically effective diameter portion of the resin layer, a second mold surface area for molding the optically effective diameter peripheral portion of the resin layer located outside the optically effective diameter portion, A third mold surface area, which is located outside the end portion, and on which the resin layer is not formed, wherein at least one groove extending from the second mold surface area to the third mold surface area is formed on the mold surface. The step of preparing the resin molding die provided above, and interposing a photocurable resin liquid between the optical element substrate and the die, and controlling the distance between the substrate and the die. Thereby, the first mold surface area is provided in the gap between the base material and the mold. And spreading the resin liquid to the second mold surface area, and irradiating the resin liquid spread to the second mold surface area with light to cure the resin liquid, thereby integrating the cured resin layer and the base material. A method of manufacturing a resin-bonded optical element having a desired surface shape, and a step of removing the resin-bonded optical element from the mold. "I will provide a.
【００１５】また、本発明は第四に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、金型面を上に向けて前記金型を水平（または略水
平）に設置する工程と、前記金型面に所定量の光硬化型
樹脂液を滴下する工程と、光学素子基材を前記樹脂液の
上に水平（または略水平）に載置し、かつ前記基材と前
記金型との間隔を制御することにより、前記樹脂液を前
記基材と前記金型との間隙において、前記第１金型面領
域から前記第２金型面領域まで押し広げる工程と、前記
第２金型面領域まで押し広げられた樹脂液に光を照射し
て硬化させ、硬化樹脂層と前記基材とを一体化させるこ
とにより、所望の表面形状を有する樹脂接合型光学素子
を作製する工程と、前記樹脂接合型光学素子を前記金型
から取り外す工程と、を備えた樹脂接合型光学素子の製
造方法（請求項４）」を提供する。The present invention also provides a resin molding die for manufacturing a resin-bonded optical element by molding and providing at least a resin layer of a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding an optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface A step of preparing, a step of placing the mold horizontally (or substantially horizontally) with the mold surface facing upward, a step of dropping a predetermined amount of a photocurable resin liquid on the mold surface, and an optical element The substrate is placed horizontally (or substantially horizontally) on the resin liquid, and by controlling the distance between the substrate and the mold, the resin liquid is transferred between the substrate and the mold. In the gap, a step of expanding from the first mold surface area to the second mold surface area; Irradiating the spread resin liquid with light to cure the resin liquid, and integrating the cured resin layer and the base material to form a resin-bonded optical element having a desired surface shape; And a step of removing the mold optical element from the mold.
【００１６】また、本発明は第五に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、金型面を上に向けて前記金型を水平（または略水
平）に設置する工程と、前記第１金型面領域に所定量の
光硬化型樹脂液を滴下する工程と、球面形状または非球
面形状を有するレンズ基材を前記樹脂液の上に、前記球
面または非球面の中央部（または中央付近）が前記樹脂
液に接触するように、水平（または略水平）に載置し、
かつ前記レンズ基材と前記金型との間隔を制御すること
により、前記樹脂液を前記レンズ基材と前記金型との間
隙において、前記第１金型面領域から前記第２金型面領
域まで押し広げる工程と、前記第２金型面領域まで押し
広げられた樹脂液に光を照射して硬化させ、硬化樹脂層
と前記レンズ基材とを一体化させることにより、所望の
非球面形状を有する樹脂接合型レンズを作製する工程
と、前記樹脂接合型レンズを前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法（請求項
５）」を提供する。The present invention also provides a resin molding die for manufacturing a resin-bonded optical element by forming at least a resin layer having a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding an optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface A step of preparing, a step of placing the mold horizontally (or substantially horizontally) with the mold face upward, and a step of dropping a predetermined amount of a photocurable resin liquid on the first mold face area. A lens substrate having a spherical shape or an aspherical surface is placed horizontally (or substantially horizontally) on the resin liquid such that the central portion (or near the center) of the spherical surface or the aspherical surface contacts the resin liquid. Put on,
And by controlling the distance between the lens substrate and the mold, the resin liquid is supplied from the first mold surface region to the second mold surface region in the gap between the lens substrate and the mold. The resin liquid expanded to the second mold surface area and cured by irradiating light, and integrating the cured resin layer and the lens base material into a desired aspherical shape. A method of manufacturing a resin-bonded optical element comprising: a step of manufacturing a resin-bonded lens having the following steps; and a step of removing the resin-bonded lens from the mold.
【００１７】また、本発明は第六に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、光学素子基材をその表面を上に向けて水平（または
略水平）に設置する工程と、前記基材の表面に所定量の
光硬化型樹脂液を滴下する工程と、前記金型の金型面と
前記樹脂液を接触させ、かつ前記基材と前記金型との間
隔を制御することにより、前記樹脂液を前記基材と前記
金型との間隙において、前記第１金型面領域から前記第
２金型面領域まで押し広げる工程と、前記第２金型面領
域まで押し広げられた樹脂液に光を照射して硬化させ、
硬化樹脂層と前記基材とを一体化させることにより、所
望の表面形状を有する樹脂接合型光学素子を作製する工
程と、前記樹脂接合型光学素子を前記金型から取り外す
工程と、を備えた樹脂接合型光学素子の製造方法（請求
項６）」を提供する。The present invention sixthly provides a resin molding die for manufacturing a resin-bonded optical element by forming and providing a resin layer having a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding an optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface. Preparing, placing the optical element substrate horizontally (or substantially horizontally) with the surface thereof facing upward, and dropping a predetermined amount of a photocurable resin liquid on the surface of the substrate, By bringing the mold liquid of the mold into contact with the resin liquid, and controlling the distance between the base material and the mold, the resin liquid is passed through the first space in the gap between the base material and the mold. Expanding the mold surface area from the mold surface area to the second mold surface area; Liquid resin is then cured by irradiation with light,
A step of manufacturing a resin-bonded optical element having a desired surface shape by integrating the cured resin layer and the substrate, and a step of removing the resin-bonded optical element from the mold. A method for manufacturing a resin-bonded optical element (Claim 6) "is provided.
【００１８】また、本発明は第七に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、光学素子基材をその表面を上に向けて水平（または
略水平）に設置する工程と、前記基材の表面に所定量の
光硬化型樹脂液を滴下する工程と、前記基材を反転させ
て、前記光硬化型樹脂液が滴下された表面を下向きにす
る工程と、前記金型の金型面と前記樹脂液を接触させ、
かつ前記基材と前記金型との間隔を制御することによ
り、前記樹脂液を前記基材と前記金型との間隙におい
て、前記第１金型面領域から前記第２金型面領域まで押
し広げる工程と、前記第２金型面領域まで押し広げられ
た樹脂液に光を照射して硬化させ、硬化樹脂層と前記基
材とを一体化させることにより、所望の表面形状を有す
る樹脂接合型光学素子を作製する工程と、前記樹脂接合
型光学素子を前記金型から取り外す工程と、を備えた樹
脂接合型光学素子の製造方法（請求項７）」を提供す
る。The present invention seventhly provides a resin molding die for manufacturing a resin-bonded optical element by forming at least a resin layer having a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding an optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface Preparing, placing the optical element substrate horizontally (or substantially horizontally) with the surface thereof facing upward, and dropping a predetermined amount of a photocurable resin liquid on the surface of the substrate, Inverting the substrate, a step of facing down the surface on which the photocurable resin liquid has been dropped, and bringing the mold liquid of the mold into contact with the resin liquid,
And by controlling the distance between the substrate and the mold, the resin liquid is pressed from the first mold surface area to the second mold surface area in the gap between the substrate and the mold. Resin bonding having a desired surface shape by expanding the step and irradiating the resin liquid that has been spread to the second mold surface area with light to cure the resin liquid and integrating the cured resin layer and the base material. A method of manufacturing a resin-bonded optical element, comprising: a step of manufacturing a mold-type optical element; and a step of removing the resin-bonded optical element from the mold.
【００１９】また、本発明は第八に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、球面形状または非球面形状を有するレンズ基材を、
該球面または非球面を上に向けて水平（または略水平）
に設置する工程と、前記球面または非球面の中央部（ま
たは中央付近）に所定量の光硬化型樹脂液を滴下する工
程と、前記金型の第１金型面領域と前記樹脂液を接触さ
せ、かつ前記レンズ基材と前記金型との間隔を制御する
ことにより、前記樹脂液を前記レンズ基材と前記金型と
の間隙において、前記第１金型面領域から前記第２金型
面領域まで押し広げる工程と、前記第２金型面領域まで
押し広げられた樹脂液に光を照射して硬化させ、硬化樹
脂層と前記レンズ基材とを一体化させることにより、所
望の非球面形状を有する樹脂接合型レンズを作製する工
程と、前記樹脂接合型レンズを前記金型から取り外す工
程と、を備えた樹脂接合型光学素子の製造方法（請求項
８）」を提供する。An eighth aspect of the present invention is a resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding the optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface Preparing a lens substrate having a spherical shape or an aspherical shape,
Horizontal (or nearly horizontal) with the spherical or aspheric surface facing upward
And a step of dropping a predetermined amount of a photo-curable resin liquid on a central portion (or near the center) of the spherical surface or the aspherical surface, and contacting the resin liquid with a first mold surface area of the mold. And controlling the distance between the lens substrate and the mold to allow the resin liquid to flow from the first mold surface region to the second mold in the gap between the lens substrate and the mold. And pressing the resin liquid spread to the surface area of the second mold and irradiating the resin liquid with light to cure the liquid resin, and integrating the cured resin layer and the lens base material to form a desired non-woven fabric. A method for producing a resin-bonded optical element comprising: a step of producing a resin-bonded lens having a spherical shape; and a step of removing the resin-bonded lens from the mold (claim 8) ".
【００２０】また、本発明は第九に「少なくとも、光学
素子基材上に所定形状の樹脂層を成形して設けることに
より樹脂接合型光学素子を製造するための樹脂成形用金
型であり、前記樹脂層の光学有効径部分を成形する第１
金型面領域と、前記光学有効径部分の外側に位置する前
記樹脂層の光学有効径周辺部を成形する第２金型面領域
と、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない第３金型面領域とを有し、前記第２金型面領域
から前記第３金型面領域まで達する溝を金型面の少なく
とも１カ所以上に設けた樹脂成形用金型を用意する工程
と、球面形状または非球面形状を有するレンズ基材を、
該球面または非球面を上に向けて水平（または略水平）
に設置する工程と、前記球面または非球面の中央部（ま
たは中央付近）に所定量の光硬化型樹脂液を滴下する工
程と、前記レンズ基材を反転させて、前記光硬化型樹脂
液が滴下された面を下向きにする工程と、前記金型の第
１金型面領域と前記樹脂液を接触させ、かつ前記レンズ
基材と前記金型との間隔を制御することにより、前記樹
脂液を前記レンズ基材と前記金型との間隙において、前
記第１金型面領域から前記第２金型面領域まで押し広げ
る工程と、前記第２金型面領域まで押し広げられた樹脂
液に光を照射して硬化させ、硬化樹脂層と前記レンズ基
材とを一体化させることにより、所望の非球面形状を有
する樹脂接合型レンズを作製する工程と、前記樹脂接合
型レンズを前記金型から取り外す工程と、を備えた樹脂
接合型光学素子の製造方法（請求項９）」を提供する。The ninth aspect of the present invention is a resin molding die for manufacturing a resin-bonded optical element by molding and providing at least a resin layer of a predetermined shape on an optical element substrate. First forming an optically effective diameter portion of the resin layer;
A mold surface region, a second mold surface region for molding an optical effective diameter peripheral portion of the resin layer located outside the optical effective diameter portion, and a resin layer located outside the terminal portion of the resin layer. And a third mold surface area where no molding is performed, and a resin molding mold in which a groove extending from the second mold surface area to the third mold surface area is provided in at least one or more places on the mold surface Preparing a lens substrate having a spherical shape or an aspherical shape,
Horizontal (or almost horizontal) with the spherical or aspherical surface facing upward
And a step of dropping a predetermined amount of a photocurable resin liquid on a central portion (or near the center) of the spherical surface or the aspherical surface. A step of directing the dropped surface downward, and contacting the first mold surface area of the mold with the resin liquid, and controlling a distance between the lens substrate and the mold, thereby forming the resin liquid. In the gap between the lens substrate and the mold, from the first mold surface area to the second mold surface area, and spreading the resin liquid to the second mold surface area. A step of producing a resin-bonded lens having a desired aspherical shape by irradiating light to cure and integrating the cured resin layer and the lens substrate, and forming the resin-bonded lens into the mold Removing from the resin-bonded optical element It provides a production method (claim 9). "
【００２１】[0021]
【発明の実施の形態】本発明者が鋭意研究した結果、樹
脂成形用金型を用いて、光学素子基材上に所定形状の樹
脂層を成形して設けることにより、樹脂接合型の光学素
子を製造する際に、成形物を金型から容易に小さな力で
離型するには、１）小さな力により樹脂層と金型とが剥
離する部分を生じさせること、２）その剥離した部分
（空間）と外気とをリークさせること、が極めて有効で
あることを見いだした。DESCRIPTION OF THE PREFERRED EMBODIMENTS As a result of intensive studies by the present inventors, a resin-bonded optical element is formed by forming a resin layer of a predetermined shape on an optical element substrate using a resin molding die. In order to easily release the molded article from the mold with a small force when manufacturing the resin, 1) a portion where the resin layer and the mold are separated by a small force is generated. 2) The separated portion ( It has been found that leaking space) and outside air is extremely effective.
【００２２】そこで、光学素子基材上に所定形状の樹脂
層を成形して設けることにより樹脂接合型光学素子を製
造するための本発明（請求項１〜９）にかかる樹脂成形
用金型においては、前記樹脂層の光学有効径部分の外側
に位置する光学有効径周辺部を成形する金型面領域か
ら、前記樹脂層の末端部分の外側に位置し、樹脂層を成
形しない金型面領域まで達する溝を少なくとも１カ所以
上に設けることとした。Therefore, in the resin molding die according to the present invention (claims 1 to 9) for manufacturing a resin-bonded optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate. Is a mold surface region located outside the terminal portion of the resin layer and located outside the terminal portion of the resin layer, from a mold surface region located outside the optical effective diameter portion of the resin layer. At least one groove is provided to reach the position.
【００２３】本発明にかかる樹脂成形用金型は、例えば
図１に示す様な金型面を有し、この金型面は、前記樹脂
層の光学有効径内（光学有効径部分）を成形する第１金
型面領域１１と、光学有効径部分の外側に位置する前記
樹脂層の光学有効径周辺部（光学有効径外）を成形する
第２金型面領域１２と、前記樹脂層の末端部分の外側に
位置し、樹脂層を成形しない第３金型面領域（樹脂層が
到達するより外側の領域）１３とに分けられる。The resin molding die according to the present invention has a die surface as shown in FIG. 1, for example, and this die surface is formed within the optically effective diameter (optically effective diameter portion) of the resin layer. A first mold surface region 11 to be formed, a second mold surface region 12 for molding the optical effective diameter peripheral portion (outside the optical effective diameter) of the resin layer located outside the optical effective diameter portion, and the resin layer It is located outside the end portion, and is divided into a third mold surface region (region outside the resin layer reach) 13 where the resin layer is not formed.
【００２４】そして、この金型面には、前記第２金型面
領域１２から前記第３金型面領域に１３まで達する溝１
４が設けられている。そして、この様な金型（本発明に
かかる樹脂成形用金型の一例）を用いて樹脂接合型光学
素子を製造すると、樹脂成形物の離型時に小さな力によ
り樹脂層と金型とが剥離する部分が生じるので、その剥
離した部分（空間）と外気とをリークさせることによ
り、成形物を金型から容易に小さな力で離型することが
できる。また、高精度な樹脂層の成形面を安定して形成
することも可能となる。A groove 1 extending from the second mold surface region 12 to the third mold surface region 13 is formed in the mold surface.
4 are provided. When a resin-bonded optical element is manufactured using such a mold (an example of the resin molding mold according to the present invention), the resin layer and the mold are separated by a small force when the resin molded product is released. The molded product can be easily released from the mold with a small force by leaking the peeled portion (space) and the outside air. Further, it is also possible to stably form the molding surface of the resin layer with high precision.
【００２５】前記金型（本発明にかかる樹脂成形用金型
の一例）を用いて樹脂接合型光学素子を製造する工程例
（請求項３）を以下に示す。 第１工程：光学素子基材上に所定形状の樹脂層を成形し
て設けることにより樹脂接合型光学素子を製造するため
の樹脂成形用金型であり、前記樹脂層の光学有効径部分
を成形する第１金型面領域と、前記光学有効径部分の外
側に位置する前記樹脂層の光学有効径周辺部を成形する
第２金型面領域と、前記樹脂層の末端部分の外側に位置
し、樹脂層を成形しない第３金型面領域とを有し、前記
第２金型面領域から前記第３金型面領域まで達する溝を
金型面の少なくとも１カ所以上に設けた樹脂成形用金型
（図１）を用意する。A process example (claim 3) for manufacturing a resin-bonded optical element using the mold (an example of the resin molding mold according to the present invention) will be described below. First step: A resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, and molding an optically effective diameter portion of the resin layer. A first mold surface region to be formed, a second mold surface region for molding a periphery of the optical effective diameter of the resin layer located outside the optical effective diameter portion, and a second mold surface region located outside the terminal portion of the resin layer. A third mold surface region where no resin layer is formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A mold (FIG. 1) is prepared.
【００２６】第２工程：前記光学素子基材と前記金型と
の間に光硬化型樹脂液を挟み、かつ前記基材と前記金型
との間隔を制御することにより、前記樹脂液を前記基材
と前記金型との間隙において、前記第１金型面領域から
前記第２金型面領域まで押し広げる。 第３工程：前記第２金型面領域まで押し広げられた樹脂
液に光を照射して硬化させ、硬化樹脂層と前記基材とを
一体化させることにより、所望の表面形状を有する樹脂
接合型光学素子を作製する。Second step: By sandwiching a photocurable resin liquid between the optical element substrate and the mold, and controlling the distance between the substrate and the mold, the resin liquid is In the gap between the substrate and the mold, the mold is pushed from the first mold surface area to the second mold surface area. Third step: A resin liquid having a desired surface shape is formed by irradiating the resin liquid expanded to the second mold surface area with light to cure the resin liquid and integrating the cured resin layer and the base material. A mold optical element is manufactured.
【００２７】第４工程：前記樹脂接合型光学素子を前記
金型から取り外す。ここで、前記金型（本発明にかかる
樹脂成形用金型の一例）を用いた場合の離型工程の一例
を図２を用いて説明する。図２（１）は光学素子基材２
１と金型２３が所定の距離（ここでは100μｍ）に設置
されており、光学素子基材２１と金型２３の間に光硬化
型樹脂液２２ａ（硬化収縮率:10％）が充填されている
状態を示す拡大断面図である。Fourth step: The resin-bonded optical element is removed from the mold. Here, an example of a mold release step using the mold (an example of the resin molding mold according to the present invention) will be described with reference to FIG. FIG. 2A shows an optical element substrate 2.
1 and the mold 23 are set at a predetermined distance (here, 100 μm), and the space between the optical element substrate 21 and the mold 23 is filled with a photocurable resin liquid 22a (curing shrinkage: 10%). It is an expanded sectional view showing the state where it is.
【００２８】金型２３には、前記第２金型面領域から前
記第３金型面領域まで達する溝（幅100μｍ、深さ50μ
ｍ）２４が設けられている。この状態で樹脂液２２ａに
光を照射して硬化させると、図２（２）に示す様に光学
素子基材２１と金型２３の間で樹脂液２２ａが硬化して
樹脂層２２が形成されるが、この際に樹脂層２２が硬化
収縮するので、光学素子基材２１と金型２３の距離が近
くなる。The mold 23 has a groove (width 100 μm, depth 50 μm) extending from the second mold surface area to the third mold surface area.
m) 24 are provided. When the resin liquid 22a is irradiated with light and cured in this state, the resin liquid 22a is cured between the optical element substrate 21 and the mold 23 to form the resin layer 22 as shown in FIG. However, at this time, the resin layer 22 cures and shrinks, so that the distance between the optical element substrate 21 and the mold 23 becomes short.
【００２９】この時の光学素子基材２１と金型２３の距
離は、溝２４以外のほとんどの金型面の面積を占めてい
る部分における樹脂層の厚さによって決められ、ここで
は90μｍとなる。そのため、光学素子基材２１と溝２４
の底までの距離は140μｍとなる。一方、溝部分の樹脂
液２２ａの厚さは150μｍであり、樹脂層が硬化収縮し
て形成されることにより、その部分の樹脂層の厚さは13
5μｍになる。At this time, the distance between the optical element substrate 21 and the mold 23 is determined by the thickness of the resin layer in a portion occupying most of the area of the mold surface other than the groove 24, and is 90 μm here. . Therefore, the optical element substrate 21 and the groove 24
Is 140 μm. On the other hand, the thickness of the resin liquid 22a in the groove portion is 150 μm, and the resin layer is formed by curing and shrinking, so that the thickness of the resin layer in that portion is 13 μm.
5 μm.
【００３０】つまり、樹脂液２２ａが硬化して形成され
る樹脂層の硬化収縮により、溝２４の底部分において樹
脂層２２と金型２３との剥離部分２５が発生するか、或
いは剥離部分２５が発生しない場合でも溝２４の底部分
において、剥がれようとする方向に樹脂層２２内に応力
が生じる。そのため、樹脂接合型光学素子を金型から離
型するための外力を加える前に、或いは僅かな外力を加
えるだけで、容易に溝２４の底部分において金型２３と
樹脂層２２の剥離部分２５を生じさせることができる。That is, due to the curing shrinkage of the resin layer formed by curing the resin liquid 22a, a peeled portion 25 between the resin layer 22 and the mold 23 is generated at the bottom of the groove 24, or the peeled portion 25 is formed. Even when this does not occur, stress is generated in the resin layer 22 at the bottom of the groove 24 in the direction in which the resin layer 22 tends to peel off. Therefore, before applying an external force for releasing the resin-bonded optical element from the mold, or by applying only a slight external force, the peeling portion 25 between the mold 23 and the resin layer 22 can be easily formed at the bottom of the groove 24. Can be caused.
【００３１】また、溝を光硬化型樹脂液が完全には侵入
できない形状にすると、樹脂液の状態で、溝と樹脂液の
間に部分的に隙間ができた状態になる。そして、この場
合には、前記硬化収縮が無くても、最初から部分的な剥
離部分が生じている状態が得られる。なお、金型の溝形
状への樹脂液の追従性は、樹脂液の粘性、樹脂液と金型
とのぬれ性、溝の幅、深さ、溝の底の形状（角度）、樹
脂液が金型の溝と接触してから樹脂液を固めるまでの経
過時間、光学素子成形時に金型面が向いている方向（例
えば、鉛直上向き）等、多数の因子によって決定され、
実験的に求められるものである。When the groove is formed so that the photocurable resin liquid cannot completely enter, a gap is partially formed between the groove and the resin liquid in the state of the resin liquid. In this case, a state in which a partially peeled portion is generated from the beginning even without the curing shrinkage is obtained. The followability of the resin liquid to the groove shape of the mold is determined by the viscosity of the resin liquid, the wettability between the resin liquid and the mold, the width and depth of the groove, the shape (angle) of the groove bottom, and the resin liquid. Determined by a number of factors, such as the elapsed time from contacting the groove of the mold to solidifying the resin liquid, the direction in which the mold surface is oriented during optical element molding (e.g., vertically upward),
It is required experimentally.
【００３２】前述したように、樹脂接合型光学素子を金
型から離型するための外力を加える前に、或いは僅かな
力を加えるだけで、溝の底において樹脂層と金型の間に
部分的な剥離状態（空間：剥離部分）を得ることができ
るが、この後に、外力を加えて離型を進めると、樹脂層
と金型との間にできた空間の体積が増大する。このと
き、この空間が外気から閉ざされていると、空間の体積
が増大するにつれて空間内の気圧は減圧となって離型を
妨げる方向に力が働くので、離型を進行させるには大き
な力が必要となる。As described above, before applying an external force for releasing the resin-bonded optical element from the mold, or by applying only a slight force, the portion between the resin layer and the mold at the bottom of the groove is formed. Although a typical peeled state (space: peeled portion) can be obtained, when the external force is applied to release the mold, the volume of the space formed between the resin layer and the mold increases. At this time, if this space is closed from the outside air, as the volume of the space increases, the air pressure in the space decreases and a force acts in a direction that hinders mold release. Is required.
【００３３】しかし、本発明にかかる金型には、前記第
２金型面領域から前記第３金型面領域まで達する溝が設
けられており（図１）、このように金型面の溝１４を樹
脂層が到達しない領域１３まで延長しておくことによ
り、樹脂層と金型の間にできた空間（剥離部分）を外気
とリークさせることができる。そして、離型動作により
金型と樹脂層の間の空間が増大しても、空間に外気が供
給されるので減圧にならず、離型工程を小さな力で速や
かに進行させることができる。However, the mold according to the present invention is provided with a groove extending from the second mold surface area to the third mold surface area (FIG. 1). By extending 14 to a region 13 where the resin layer does not reach, a space (peeled portion) formed between the resin layer and the mold can be leaked to the outside air. Then, even if the space between the mold and the resin layer increases due to the releasing operation, the outside air is supplied to the space, so that the pressure is not reduced, and the releasing step can be rapidly advanced with a small force.
【００３４】本発明にかかる樹脂成形用金型は、例え
ば、光学素子基材上に非球面形状を有する樹脂層を成形
して設ける場合に効果的である（請求項２）。また、本
発明にかかる樹脂成形用金型を用いて樹脂接合型光学素
子を製造する方法としては、前記例（請求項３）の他に
請求項４〜９の製法が使用できる。なお、請求項７、９
にかかる発明においては、樹脂液が塗布された光学素子
基材を反転させて、基材表面（下向き）上の樹脂液と金
型面（上向き）を接触させる構成になっている。The resin molding die according to the present invention is effective, for example, when a resin layer having an aspherical shape is formed and provided on an optical element substrate (claim 2). Further, as a method of manufacturing a resin-bonded optical element using the resin molding die according to the present invention, the manufacturing methods of claims 4 to 9 can be used in addition to the above example (claim 3). Claims 7 and 9
In the invention according to the first aspect, the optical element substrate coated with the resin liquid is turned over, and the resin liquid on the substrate surface (downward) is brought into contact with the mold surface (upward).
【００３５】かかる構成にすると、樹脂液と金型面が最
初に接触する際の接触領域が一体状となり、複数の島状
とならないので、気泡を巻き込むことがない。そのた
め、気泡のない硬化樹脂層が得られるので好ましい。本
発明（請求項１〜９）によれば、従来と比較して非常に
小さな外力で樹脂成形物を成形金型から離型できるの
で、光学素子基材や樹脂層を破損することがない。With this configuration, the contact area when the resin liquid and the mold surface first come into contact with each other becomes integral and does not form a plurality of islands, so that bubbles are not entrained. Therefore, it is preferable because a cured resin layer without bubbles is obtained. According to the present invention (claims 1 to 9), since the resin molded product can be released from the molding die with a very small external force as compared with the related art, the optical element base material and the resin layer are not damaged.
【００３６】また、本発明（請求項１〜９）によれば、
従来と比較してサイクルタイムが長くならないので、成
形品の低コスト化が容易に実現可能であり、量産性に優
れている。また、従来の金型を変更すれば（金型面に本
発明にかかる溝を設ければ）、本発明（請求項１〜９）
を実施できるので、従来の成形装置を利用することが可
能であり、成形装置改造のためのコストを殆ど要しな
い。According to the present invention (claims 1 to 9),
Since the cycle time is not longer than in the conventional case, the cost of the molded product can be easily reduced, and the mass productivity is excellent. Further, if the conventional mold is changed (if the groove according to the present invention is provided on the mold surface), the present invention (claims 1 to 9)
Therefore, it is possible to use a conventional molding apparatus, and almost no cost for modifying the molding apparatus is required.
【００３７】本発明（請求項１〜９）によれば、光学素
子基材上に所定形状の樹脂層を成形して設けることによ
り樹脂接合型の光学素子を製造する際に、高精度な樹脂
層の成形面を安定して形成することが可能であり、また
成形物を容易に小さな力で離型することができる。以
下、本発明を実施例により具体的に説明するが、本発明
はこの例に限定されるものではない。According to the present invention (claims 1 to 9), when a resin-bonded optical element is manufactured by forming a resin layer having a predetermined shape on an optical element substrate, a high-precision resin is used. The molding surface of the layer can be formed stably, and the molded product can be easily released with a small force. Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.
【００３８】[0038]
【実施例】光学素子基材上に所定形状の樹脂層を成形し
て設けることにより樹脂接合型光学素子を製造するため
の本実施例にかかる樹脂成形用金型は、図１に示す金型
面を有し、この金型面は、前記樹脂層の光学有効径内
（光学有効径部分）を成形する第１金型面領域１１と、
光学有効径部分の外側に位置する前記樹脂層の光学有効
径周辺部（光学有効径外）を成形する第２金型面領域１
２と、前記樹脂層の末端部分の外側に位置し、樹脂層を
成形しない第３金型面領域（樹脂層が到達するより外側
の領域）１３とに分けられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin molding die according to this embodiment for manufacturing a resin-bonded optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate is a mold shown in FIG. A first mold surface area 11 for molding the inside of the optically effective diameter (the optically effective diameter portion) of the resin layer;
A second mold surface area 1 for molding a peripheral portion (outside the optical effective diameter) of the resin layer located outside the optical effective diameter portion of the resin layer.
2 and a third mold surface region (region outside the resin layer reaches) 13 which is located outside the terminal portion of the resin layer and in which the resin layer is not formed.
【００３９】そして、この金型面には、前記第２金型面
領域１２から前記第３金型面領域に１３まで達する溝１
４が設けられている。即ち、溝１４は光学有効径外部を
成形する領域１２から始まり、樹脂層が到達する位置よ
り外側の領域１３まで達する様に設けられている。ま
た、溝１４の形状は幅約100μｍ、深さ約50μｍ、長さ5
00μｍであり、溝の底はＵ字形をしている。The mold surface has a groove 1 extending from the second mold surface area 12 to the third mold surface area 13.
4 are provided. That is, the groove 14 is provided so as to start from the region 12 where the outside of the optical effective diameter is formed and reach the region 13 outside the position where the resin layer reaches. The shape of the groove 14 is about 100 μm in width, about 50 μm in depth, and 5 μm in length.
00 μm, and the bottom of the groove is U-shaped.
【００４０】以下に、本実施例にかかる樹脂成形用金型
を用いて樹脂接合型光学素子を製造する工程を示す。 第１工程：前記樹脂成形用金型の金型面を上に向けて前
記金型を水平（または略水平）に設置する。 第２工程：前記第１金型面領域に所定量の光硬化型樹脂
液を滴下する。The steps of manufacturing a resin bonded optical element using the resin molding die according to this embodiment will be described below. First step: The mold is placed horizontally (or substantially horizontally) with the mold surface of the mold for resin molding facing upward. Second step: A predetermined amount of a photo-curable resin liquid is dropped on the first mold surface area.
【００４１】第３工程：球面形状または非球面形状を有
するレンズ基材を前記樹脂液の上に、前記球面または非
球面の中央部（または中央付近）が前記樹脂液に接触す
るように、水平（または略水平）に載置し、かつ前記レ
ンズ基材と前記金型との間隔を制御することにより、前
記樹脂液を前記レンズ基材と前記金型との間隙におい
て、前記第１金型面領域から前記第２金型面領域まで押
し広げる。Third step: A lens substrate having a spherical shape or an aspherical surface is placed on the resin liquid so that the central portion (or near the center) of the spherical surface or the aspherical surface comes into contact with the resin liquid. (Or substantially horizontal) and by controlling the distance between the lens substrate and the mold, the resin liquid is supplied to the first mold in the gap between the lens substrate and the mold. It is spread from the surface area to the second mold surface area.
【００４２】第４工程：前記第２金型面領域まで押し広
げられた樹脂液に光を照射して硬化させ、硬化樹脂層と
前記レンズ基材とを一体化させることにより、所望の非
球面形状を有する樹脂接合型レンズを作製する。 第５工程：前記樹脂接合型レンズを前記金型から取り外
す（離型する）。ここで、離型工程について図２を用い
て説明する。Fourth step: A desired aspherical surface is obtained by irradiating the resin liquid, which has been spread to the second mold surface area, with light to cure the resin liquid and integrating the cured resin layer with the lens substrate. A resin-bonded lens having a shape is manufactured. Fifth step: The resin-bonded lens is removed from the mold (release). Here, the release step will be described with reference to FIG.
【００４３】発明の実施の形態において前述したよう
に、樹脂液２２ａが硬化して形成される樹脂層２２の硬
化収縮により、溝２４の底部分において樹脂層２２と金
型２３との剥離部分２５が発生するか、或いは剥離部分
２５が発生しない場合でも溝２４の底部分において、剥
がれようとする方向に樹脂層内に応力が生じる。そのた
め、樹脂接合型光学素子を金型から離型するための外力
を加える前に、或いは僅かな外力を加えるだけで、容易
に溝２４の底部分において金型２３と樹脂層２２の剥離
部分２５を生じさせることができる。As described above in the embodiment of the invention, the resin layer 22 formed by curing the resin liquid 22a cures and contracts, so that the peeled portion 25 between the resin layer 22 and the mold 23 at the bottom of the groove 24. Occurs, or even when the peeled portion 25 does not occur, a stress is generated in the resin layer in the direction of the peeling at the bottom of the groove 24. Therefore, before applying an external force for releasing the resin-bonded optical element from the mold, or by applying only a slight external force, the peeling portion 25 between the mold 23 and the resin layer 22 can be easily formed at the bottom of the groove 24. Can be caused.
【００４４】この後に、外力を加えて離型を進めると、
樹脂層と金型との間にできた空間の体積が増大する。本
実施例にかかる金型には、前記第２金型面領域から前記
第３金型面領域まで達する溝が設けられており（図
１）、このように金型面の溝１４を樹脂層が到達しない
領域１３まで延長しておくことにより、樹脂層と金型の
間にできた空間（剥離部分）を外気とリークさせること
ができる。Thereafter, when the mold is released by applying an external force,
The volume of the space formed between the resin layer and the mold increases. The mold according to the present embodiment is provided with a groove extending from the second mold surface area to the third mold surface area (FIG. 1). Is extended to the region 13 where the resin does not reach, the space (separated portion) formed between the resin layer and the mold can be leaked to the outside air.
【００４５】そして、離型動作により金型と樹脂層の間
の空間が増大しても、空間に外気が供給されるので減圧
にならず、離型工程を小さな力で速やかに進行させるこ
とができる。離型時に加えた力をロードセルにより実際
に測定したところ、従来の溝を設けていない金型を用い
た場合には、離型に約120kgfの力が必要であったのに対
して、本実施例にかかる金型を用いた場合には、約70kg
fという小さな力で離型することができた。Even if the space between the mold and the resin layer increases due to the releasing operation, the outside air is supplied to the space, so that the pressure is not reduced, and the releasing step can be rapidly advanced with a small force. it can. When the force applied at the time of mold release was actually measured with a load cell, when a mold without a conventional groove was used, a force of about 120 kgf was required for mold release. When using the mold according to the example, about 70 kg
The mold was released with a small force of f.
【００４６】本実施例によれば、従来に比べて非常に小
さな外力で離型できるので、光学素子基材や樹脂を破損
することがなかった。また、従来の製法と比較してもサ
イクルタイムが長くならないので、成形品の低コスト化
が容易に実現できた。このように、本実施例によれば、
光学素子基材上に所定形状の樹脂層を成形して設けるこ
とにより樹脂接合型の光学素子を製造する際に、高精度
な樹脂層の成形面を安定して形成することが可能であ
り、また成形物を容易に小さな力で離型することができ
た。According to this embodiment, the mold can be released with a very small external force as compared with the prior art, so that the optical element base material and the resin are not damaged. Further, since the cycle time does not become longer as compared with the conventional manufacturing method, the cost of the molded product can be easily reduced. Thus, according to the present embodiment,
When manufacturing a resin bonding type optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate, it is possible to stably form a molding surface of a high-precision resin layer, Also, the molded product could be easily released with a small force.
【００４７】[0047]
【発明の効果】本発明（請求項１〜９）によれば、従来
と比較して非常に小さな外力で樹脂成形物を成形金型か
ら離型できるので、光学素子基材や樹脂層を破損するこ
とがない。また、本発明（請求項１〜９）によれば、従
来と比較してサイクルタイムが長くならないので、成形
品の低コスト化が容易に実現可能であり、量産性に優れ
ている。According to the present invention (claims 1 to 9), the resin molded product can be released from the molding die with a very small external force as compared with the conventional one, so that the optical element substrate and the resin layer are damaged. Never do. Further, according to the present invention (claims 1 to 9), since the cycle time is not longer than in the conventional case, the cost of the molded product can be easily reduced, and the mass productivity is excellent.
【００４８】また、従来の金型を変更すれば（金型面に
本発明にかかる溝を設ければ）、本発明（請求項１〜
９）を実施できるので、従来の成形装置を利用すること
が可能であり、成形装置改造のためのコストを殆ど要し
ない。本発明（請求項１〜９）によれば、光学素子基材
上に所定形状の樹脂層を成形して設けることにより樹脂
接合型の光学素子を製造する際に、高精度な樹脂層の成
形面を安定して形成することが可能であり、また成形物
を容易に小さな力で離型することができる。If the conventional mold is changed (if the groove according to the present invention is provided on the mold surface), the present invention (Claims 1 to 5)
Since 9) can be performed, a conventional molding device can be used, and almost no cost is required for modifying the molding device. According to the present invention (claims 1 to 9), when a resin-bonded optical element is manufactured by molding and providing a resin layer having a predetermined shape on an optical element substrate, the resin layer can be formed with high precision. The surface can be formed stably, and the molded product can be easily released with a small force.
【図１】は実施例にかかる金型が有する金型面を示す概
略平面図である。FIG. 1 is a schematic plan view showing a mold surface of a mold according to an embodiment.
【図２】は実施例にかかる金型が有する金型面に設けた
溝２４等を示す概略断面図である。FIG. 2 is a schematic sectional view showing a groove 24 and the like provided on a mold surface of the mold according to the embodiment.
【図３】は樹脂接合型非球面レンズの構造を示す断面図
である。FIG. 3 is a sectional view showing the structure of a resin-bonded aspheric lens.
【図４】は従来の樹脂接合型非球面レンズの製造方法を
示す工程図である。FIG. 4 is a process chart showing a method for manufacturing a conventional resin-bonded aspheric lens.
１１・・・樹脂成形用金型の金型面のうち、樹脂層の光
学有効径内（光学有効径部分）を成形する第１金型面領
域 １２・・・樹脂成形用金型の金型面のうち、光学有効径
部分の外側に位置する前記樹脂層の光学有効径周辺部
（光学有効径外）を成形する第２金型面領域 １３・・・樹脂成形用金型の金型面のうち、樹脂層を成
形しない第３金型面領域（樹脂層が到達するより外側の
領域） １４，２４・・・溝 ２１，４１・・・光学素子基材 ２２，３２，４２・・・硬化樹脂層 ２２ａ，４２ａ・・・光硬化型樹脂液 ２３，４３・・・金型 ２５・・・剥離部分 ３１・・・ガラスレンズ ４４・・・光（紫外線）
以上11 ... First mold surface area for molding the inside of the optically effective diameter (optically effective diameter portion) of the resin layer in the mold surface of the resin molding mold 12 ... Die of the resin molding mold A second mold surface area for molding the optical effective diameter peripheral portion (outside the optical effective diameter) of the resin layer located outside the optical effective diameter portion of the surface 13... Mold surface of resin molding die Among them, the third mold surface area where the resin layer is not formed (the area outside the resin layer reaches) 14, 24 ... grooves 21, 41 ... optical element base materials 22, 32, 42 ... Cured resin layer 22a, 42a: Photo-curable resin liquid 23, 43: Mold 25: Peeled part 31: Glass lens 44: Light (ultraviolet light)
that's all
Claims (9)
形して設けることにより樹脂接合型光学素子を製造する
ための樹脂成形用金型において、 前記樹脂層の光学有効径部分の外側に位置する光学有効
径周辺部を成形する金型面領域から、前記樹脂層の末端
部分の外側に位置し、樹脂層を成形しない金型面領域ま
で達する溝を少なくとも１カ所以上に設けたことを特徴
とする樹脂接合型光学素子の樹脂成形用金型。1. A resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, wherein a resin layer is formed outside an optically effective diameter portion of the resin layer. At least at one or more grooves extending from the mold surface area for molding the peripheral portion of the optical effective diameter located to the outside of the end portion of the resin layer to the mold surface area where the resin layer is not molded. A resin-molding mold for a resin-joined optical element, comprising:
る樹脂層を成形して設けることを特徴とする請求項１記
載の樹脂成形用金型。2. The resin molding die according to claim 1, wherein a resin layer having an aspherical shape is formed and provided on the optical element substrate.
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 前記光学素子基材と前記金型との間に光硬化型樹脂液を
挟み、かつ前記基材と前記金型との間隔を制御すること
により、前記樹脂液を前記基材と前記金型との間隙にお
いて、前記第１金型面領域から前記第２金型面領域まで
押し広げる工程と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記基材とを一体化させ
ることにより、所望の表面形状を有する樹脂接合型光学
素子を作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。3. A resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate, wherein the optical effective diameter of the resin layer is A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die, by sandwiching a photocurable resin liquid between the optical element substrate and the die, and controlling the distance between the substrate and the die, In the gap between the substrate and the mold, a resin liquid is supplied from the first mold surface area to the front. A step of expanding the second mold surface area, and curing the resin liquid expanded to the second mold surface area by irradiating light to integrate the cured resin layer and the base material, A method of manufacturing a resin-bonded optical element, comprising: a step of producing a resin-bonded optical element having a desired surface shape; and a step of removing the resin-bonded optical element from the mold.
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 金型面を上に向けて前記金型を水平（または略水平）に
設置する工程と、 前記金型面に所定量の光硬化型樹脂液を滴下する工程
と、 光学素子基材を前記樹脂液の上に水平（または略水平）
に載置し、かつ前記基材と前記金型との間隔を制御する
ことにより、前記樹脂液を前記基材と前記金型との間隙
において、前記第１金型面領域から前記第２金型面領域
まで押し広げる工程と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記基材とを一体化させ
ることにより、所望の表面形状を有する樹脂接合型光学
素子を作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。4. A resin molding die for producing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, wherein the optical effective diameter of the resin layer is A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a mold for resin molding; a step of placing the mold horizontally (or substantially horizontally) with the mold surface facing upward; and dropping a predetermined amount of a photocurable resin liquid onto the mold surface. And a step of horizontally (or substantially horizontally) placing the optical element substrate on the resin liquid.
And by controlling the distance between the substrate and the mold, the resin liquid is transferred from the first mold surface region to the second mold in the gap between the substrate and the mold. A step of expanding the mold surface region, and irradiating the resin liquid expanded to the second mold surface region with light to cure the resin solution, thereby integrating the cured resin layer and the base material to obtain a desired surface. A method for manufacturing a resin-bonded optical element, comprising: a step of manufacturing a resin-bonded optical element having a shape; and a step of removing the resin-bonded optical element from the mold.
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 金型面を上に向けて前記金型を水平（または略水平）に
設置する工程と、 前記第１金型面領域に所定量の光硬化型樹脂液を滴下す
る工程と、 球面形状または非球面形状を有するレンズ基材を前記樹
脂液の上に、前記球面または非球面の中央部（または中
央付近）が前記樹脂液に接触するように、水平（または
略水平）に載置し、かつ前記レンズ基材と前記金型との
間隔を制御することにより、前記樹脂液を前記レンズ基
材と前記金型との間隙において、前記第１金型面領域か
ら前記第２金型面領域まで押し広げる工程と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記レンズ基材とを一体
化させることにより、所望の非球面形状を有する樹脂接
合型レンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、
を備えた樹脂接合型光学素子の製造方法。5. A resin molding die for producing a resin-joined optical element by molding and providing a resin layer of a predetermined shape on an optical element substrate, wherein the optical effective diameter of the resin layer is A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die; a step of placing the die horizontally (or substantially horizontally) with the die surface facing upward; and a predetermined amount of photocurable resin in the first die surface area. A step of dropping a liquid, and forming a lens substrate having a spherical shape or an aspherical shape on the resin liquid. Is placed horizontally (or substantially horizontally) such that the central portion (or near the center) of the spherical surface or the aspherical surface comes into contact with the resin liquid, and the distance between the lens substrate and the mold By spreading the resin liquid from the first mold surface area to the second mold surface area in the gap between the lens base material and the mold; and the second mold surface Irradiating light to the resin liquid expanded to the region and curing the same, and by integrating the cured resin layer and the lens substrate, a step of producing a resin-bonded lens having a desired aspherical shape; Removing the resin-bonded lens from the mold;
A method for producing a resin-bonded optical element comprising:
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 光学素子基材をその表面を上に向けて水平（または略水
平）に設置する工程と、 前記基材の表面に所定量の光硬化型樹脂液を滴下する工
程と、 前記金型の金型面と前記樹脂液を接触させ、かつ前記基
材と前記金型との間隔を制御することにより、前記樹脂
液を前記基材と前記金型との間隙において、前記第１金
型面領域から前記第２金型面領域まで押し広げる工程
と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記基材とを一体化させ
ることにより、所望の表面形状を有する樹脂接合型光学
素子を作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。6. A resin molding die for producing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, wherein an optical effective diameter of the resin layer is provided. A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die; a step of horizontally (or substantially horizontally) placing an optical element substrate with its surface facing upward; and applying a predetermined amount of a photocurable resin liquid to the surface of the substrate. A step of dropping, bringing the mold surface of the mold into contact with the resin liquid, and the base material Controlling the distance between the mold and the mold, the resin liquid in the gap between the substrate and the mold, the step of spreading from the first mold surface region to the second mold surface region, By irradiating the resin liquid expanded to the second mold surface area with light to cure the resin liquid and integrating the cured resin layer and the base material, a resin-bonded optical element having a desired surface shape can be obtained. A method of manufacturing a resin bonded optical element, comprising: a step of manufacturing; and a step of removing the resin bonded optical element from the mold.
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 光学素子基材をその表面を上に向けて水平（または略水
平）に設置する工程と、 前記基材の表面に所定量の光硬化型樹脂液を滴下する工
程と、 前記基材を反転させて、前記光硬化型樹脂液が滴下され
た表面を下向きにする工程と、 前記金型の金型面と前記樹脂液を接触させ、かつ前記基
材と前記金型との間隔を制御することにより、前記樹脂
液を前記基材と前記金型との間隙において、前記第１金
型面領域から前記第２金型面領域まで押し広げる工程
と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記基材とを一体化させ
ることにより、所望の表面形状を有する樹脂接合型光学
素子を作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。7. A resin molding die for producing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, wherein the optical effective diameter of the resin layer is A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die; a step of horizontally (or substantially horizontally) placing an optical element substrate with its surface facing upward; and applying a predetermined amount of a photocurable resin liquid to the surface of the substrate. A step of dropping, the substrate is inverted, and the photocurable resin liquid is dropped A step of directing the surface downward, and contacting the mold surface of the mold with the resin liquid, and controlling the distance between the base material and the mold, thereby allowing the resin liquid to flow through the base material and the mold. In the gap with the mold, a step of expanding from the first mold surface area to the second mold surface area, and curing the resin liquid expanded to the second mold surface area by irradiating light to the resin liquid, A step of producing a resin-bonded optical element having a desired surface shape by integrating the cured resin layer and the base material; and a step of removing the resin-bonded optical element from the mold. A method for manufacturing a resin-joined optical element.
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 球面形状または非球面形状を有するレンズ基材を、該球
面または非球面を上に向けて水平（または略水平）に設
置する工程と、 前記球面または非球面の中央部（または中央付近）に所
定量の光硬化型樹脂液を滴下する工程と、 前記金型の第１金型面領域と前記樹脂液を接触させ、か
つ前記レンズ基材と前記金型との間隔を制御することに
より、前記樹脂液を前記レンズ基材と前記金型との間隙
において、前記第１金型面領域から前記第２金型面領域
まで押し広げる工程と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記レンズ基材とを一体
化させることにより、所望の非球面形状を有する樹脂接
合型レンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、
を備えた樹脂接合型光学素子の製造方法。8. A resin molding die for producing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, and an optical effective diameter of the resin layer. A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die; a step of disposing a lens base having a spherical shape or an aspherical surface horizontally (or substantially horizontally) with the spherical or aspherical surface facing upward; At the center (or near the center) of the spherical surface, a certain amount of light-curing tree A step of dropping a liquid, and contacting the resin liquid with a first mold surface area of the mold, and controlling a distance between the lens base material and the mold, so that the resin liquid is A step of expanding the first mold surface area to the second mold surface area in a gap between the material and the mold; and irradiating the resin liquid expanded to the second mold surface area with light. Hardening and integrating the cured resin layer and the lens substrate to produce a resin-bonded lens having a desired aspherical shape; and removing the resin-bonded lens from the mold. ,
A method for producing a resin-bonded optical element comprising:
とにより樹脂接合型光学素子を製造するための樹脂成形
用金型であり、 前記樹脂層の光学有効径部分を成形する第１金型面領域
と、前記光学有効径部分の外側に位置する前記樹脂層の
光学有効径周辺部を成形する第２金型面領域と、前記樹
脂層の末端部分の外側に位置し、樹脂層を成形しない第
３金型面領域とを有し、 前記第２金型面領域から前記第３金型面領域まで達する
溝を金型面の少なくとも１カ所以上に設けた樹脂成形用
金型を用意する工程と、 球面形状または非球面形状を有するレンズ基材を、該球
面または非球面を上に向けて水平（または略水平）に設
置する工程と、 前記球面または非球面の中央部（または中央付近）に所
定量の光硬化型樹脂液を滴下する工程と、 前記レンズ基材を反転させて、前記光硬化型樹脂液が滴
下された面を下向きにする工程と、 前記金型の第１金型面領域と前記樹脂液を接触させ、か
つ前記レンズ基材と前記金型との間隔を制御することに
より、前記樹脂液を前記レンズ基材と前記金型との間隙
において、前記第１金型面領域から前記第２金型面領域
まで押し広げる工程と、 前記第２金型面領域まで押し広げられた樹脂液に光を照
射して硬化させ、硬化樹脂層と前記レンズ基材とを一体
化させることにより、所望の非球面形状を有する樹脂接
合型レンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、
を備えた樹脂接合型光学素子の製造方法。9. A resin molding die for manufacturing a resin-bonded optical element by molding and providing a resin layer having a predetermined shape on an optical element substrate, wherein an optical effective diameter of the resin layer is provided. A first mold surface region for molding a portion, a second mold surface region for molding a periphery of the optically effective diameter of the resin layer located outside the optically effective diameter portion, and an outside of a terminal portion of the resin layer. And a third mold surface region where the resin layer is not formed, and a groove extending from the second mold surface region to the third mold surface region is provided in at least one or more locations on the mold surface. A step of preparing a resin molding die; a step of disposing a lens base having a spherical shape or an aspherical surface horizontally (or substantially horizontally) with the spherical or aspherical surface facing upward; At the center (or near the center) of the spherical surface, a certain amount of light-curing tree A step of dropping a liquid; a step of inverting the lens substrate to face down the surface on which the photocurable resin liquid is dropped; and contacting the resin liquid with a first mold surface area of the mold. And controlling the distance between the lens substrate and the mold to allow the resin liquid to flow from the first mold surface region to the second mold in the gap between the lens substrate and the mold. A step of expanding the surface to the surface area, and irradiating the resin liquid expanded to the surface area of the second mold with light to cure the resin liquid, and integrating the cured resin layer and the lens base material to form a desired non-conductive layer. A step of producing a resin-bonded lens having a spherical shape; and a step of removing the resin-bonded lens from the mold.
A method for producing a resin-bonded optical element comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14526198A JP4171936B2 (en) | 1998-05-27 | 1998-05-27 | Resin-molding mold for resin-bonded optical element and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14526198A JP4171936B2 (en) | 1998-05-27 | 1998-05-27 | Resin-molding mold for resin-bonded optical element and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11333862A true JPH11333862A (en) | 1999-12-07 |
| JP4171936B2 JP4171936B2 (en) | 2008-10-29 |
Family
ID=15381048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14526198A Expired - Lifetime JP4171936B2 (en) | 1998-05-27 | 1998-05-27 | Resin-molding mold for resin-bonded optical element and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4171936B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7690912B2 (en) | 2005-02-28 | 2010-04-06 | Canon Kabushiki Kaisha | Pattern transferring mold, pattern transferring apparatus and device manufacturing method using the same |
| JP2015101077A (en) * | 2013-11-28 | 2015-06-04 | 東洋ゴム工業株式会社 | Production method of seat back pad and molding tool |
-
1998
- 1998-05-27 JP JP14526198A patent/JP4171936B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7690912B2 (en) | 2005-02-28 | 2010-04-06 | Canon Kabushiki Kaisha | Pattern transferring mold, pattern transferring apparatus and device manufacturing method using the same |
| JP2015101077A (en) * | 2013-11-28 | 2015-06-04 | 東洋ゴム工業株式会社 | Production method of seat back pad and molding tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4171936B2 (en) | 2008-10-29 |
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