JPH11170277A - Method and apparatus for producing resin-bond type optical element - Google Patents

Method and apparatus for producing resin-bond type optical element

Info

Publication number
JPH11170277A
JPH11170277A JP9339721A JP33972197A JPH11170277A JP H11170277 A JPH11170277 A JP H11170277A JP 9339721 A JP9339721 A JP 9339721A JP 33972197 A JP33972197 A JP 33972197A JP H11170277 A JPH11170277 A JP H11170277A
Authority
JP
Japan
Prior art keywords
resin liquid
mold
resin
optical element
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9339721A
Other languages
Japanese (ja)
Inventor
Etsuo Tamura
恵都夫 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP9339721A priority Critical patent/JPH11170277A/en
Publication of JPH11170277A publication Critical patent/JPH11170277A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To increase the percentage of the products of a conforming resin-bond type optical element by spreading a resin liquid within a prescribed range in the production of the optical element. SOLUTION: A process in which a mold 5 having a prescribed surface shape is installed (nearly) horizontally with the surface turned upward, a process in which a prescribed amount of a photo-curable resin liquid 6a is dropped on the surface of the mold, a process in which an optical element backing 4 is mounted (nearly) horizontally on the resin liquid 6a, and the resin liquid 6a is spread from the middle toward the fringe up to a prescribed range in the clearance between the backing 4 and the mold 5 by controlling the clearance, a process in which the spread resin liquid 6a is irradiated with light for curing to integrate the cured resin layer with the backing so that a resin-bond type optical element having a desired surface shape is prepared, and a process in which the finished optical element is removed from the mold 5 are provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂接合型光学素
子を製造する方法と装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a resin-bonded optical element.

【0002】[0002]

【従来の技術】光学素子であるレンズには、表面形状が
非球面の非球面レンズがある。非球面レンズは、球面レ
ンズによる球面収差や広角レンズにおけるディストーシ
ョンを除去できることから重用されている。現在、量産
性に優れた非球面レンズとして樹脂接合型非球面レンズ
がある。このレンズは、図3に示すような薄い(例え
ば、5〜 100μm の厚さの)樹脂硬化層12と基体たる
レンズ11により構成されている。
2. Description of the Related Art A lens which is an optical element includes an aspherical lens having an aspherical surface. Aspherical lenses are frequently used because they can remove spherical aberration due to spherical lenses and distortion in wide-angle lenses. At present, there is a resin-bonded aspherical lens as an aspherical lens having excellent mass productivity. This lens is composed of a thin (for example, 5 to 100 .mu.m thick) resin cured layer 12 and a lens 11 as a base as shown in FIG.

【0003】なお、図3のレンズでは、レンズ基材11
が球面を有し、その球面上に樹脂硬化層12が非球面を
形成するような厚さ分布をもって接合されている。この
様な樹脂接合型非球面レンズは、例えば図4に示す製法
により製造される。図4は、図3に示す樹脂接合型非球
面レンズを製造する従来の方法を示す工程図である。
尚、以下の工程説明において、括弧内の数字は図4の工
程(1)〜工程(4)に対応する。
[0003] In the lens of FIG.
Has a spherical surface, and the resin cured layer 12 is joined on the spherical surface with a thickness distribution so as to form an aspherical surface. Such a resin-bonded aspherical lens is manufactured by, for example, a manufacturing method shown in FIG. FIG. 4 is a process chart showing a conventional method for manufacturing the resin-bonded aspherical lens shown in FIG.
In the following description of the steps, the numbers in parentheses correspond to steps (1) to (4) in FIG.

【0004】(1)所定の表面形状(平面、球面、非球
面等)を有する金型13を水平に置き、前記表面の中央
部に所定量の光硬化型樹脂液12aを垂らす。 (2)レンズ基材11を金型13に向かって降下させ、
基材11を金型13に接近させることにより、樹脂液1
2aを基材11と金型13の間隙で押し広げる。
(1) A mold 13 having a predetermined surface shape (a flat surface, a spherical surface, an aspherical surface, etc.) is placed horizontally, and a predetermined amount of a photo-curable resin liquid 12a is dropped at the center of the surface. (2) Lower the lens substrate 11 toward the mold 13;
By bringing the substrate 11 close to the mold 13, the resin liquid 1
2 a is pushed out in the gap between the base material 11 and the mold 13.

【0005】ここで、基材11の材料としては、ガラス
や結晶性光学材料を用いる。 (3)レンズ基材11と金型13との間隔が所定値とな
るように両者を接近させ、この状態を保持して、光(紫
外線)14を基材11を通して樹脂液12aに照射す
る。樹脂液12aは、重合反応により硬化して樹脂硬化
層12が形成される。
Here, as the material of the substrate 11, glass or a crystalline optical material is used. (3) The lens base 11 and the mold 13 are brought close to each other such that the distance between them becomes a predetermined value. In this state, light (ultraviolet rays) 14 is irradiated to the resin liquid 12a through the base 11. The resin liquid 12a is cured by a polymerization reaction to form a cured resin layer 12.

【0006】(4)レンズ基材11と一体化された樹脂
硬化層12を金型13との界面から剥離する。以上のよ
うな製法(工程)により、樹脂接合型非球面レンズを得
ることができる。この様な方法により非球面レンズを製
造する場合、レンズ基材と金型の接近は一般に、基材と
金型の距離(間隔)により制御され、距離(間隔)が所
定値になったところで両者の接近を停止する。
(4) The cured resin layer 12 integrated with the lens substrate 11 is peeled off from the interface with the mold 13. The resin-bonded aspheric lens can be obtained by the above-described manufacturing method (step). When an aspheric lens is manufactured by such a method, the approach between the lens substrate and the mold is generally controlled by the distance (interval) between the substrate and the mold, and when the distance (interval) reaches a predetermined value, the two approaches. Stop approaching.

【0007】[0007]

【発明が解決しようとする課題】しかし、金型表面の中
央に垂らされる光硬化型樹脂液の滴下量の再現性が悪
く、同条件で垂らしても樹脂液の滴下量にばらつきが生
じる。この様な状態において、レンズ基材と金型を所定
間隔まで接近させると、樹脂液の滴下量が多い場合は樹
脂液の広がりが大きくなり、また樹脂液の滴下量が少な
い場合は樹脂液の広がりが小さくなる。
However, the reproducibility of the dripping amount of the photocurable resin liquid dripping at the center of the mold surface is poor, and the dripping amount of the resin liquid varies even when dripping under the same conditions. In such a state, when the lens substrate and the mold are brought close to each other to a predetermined distance, the spread of the resin liquid increases when the amount of the resin liquid dropped is large, and when the amount of the resin liquid dropped is small, the resin liquid spreads. Spread is reduced.

【0008】樹脂液の広がりが大きすぎると、設計形状
よりも外径が大きい非球面レンズが作製されるので、作
製されたレンズを光学系に組み込むことができないとい
う問題点が発生する。また、樹脂液の広がりが小さすぎ
ると、所望の光学特性を有する非球面レンズが得られな
いという問題点が発生する。
If the spread of the resin liquid is too large, an aspherical lens having an outer diameter larger than the designed shape is produced, so that the produced lens cannot be incorporated into the optical system. If the spread of the resin liquid is too small, there is a problem that an aspheric lens having desired optical characteristics cannot be obtained.

【0009】即ち、樹脂接合型非球面レンズを製造する
際に、樹脂液の広がりが大きすぎたり、小さすぎたりす
ると、製造される非球面レンズが不良品となり、良品率
が低下するという問題点が発生する。本発明は、かかる
問題点に鑑みてなされたものであり、樹脂接合型光学素
子を製造する際の樹脂液の広がりを所定範囲とすること
が可能であり、その結果、製造される樹脂接合型光学素
子の良品率を著しく増大させることができる樹脂接合型
光学素子の製造方法と製造装置を提供することを目的と
する。
That is, if the spread of the resin liquid is too large or too small when manufacturing the resin-bonded aspherical lens, the manufactured aspherical lens becomes defective and the non-defective product ratio decreases. Occurs. The present invention has been made in view of such a problem, and it is possible to set a spread of a resin liquid when manufacturing a resin-bonded optical element within a predetermined range. It is an object of the present invention to provide a method and apparatus for manufacturing a resin-bonded optical element that can significantly increase the yield of optical elements.

【0010】[0010]

【課題を解決するための手段】そのため、本発明は第一
に「少なくとも、所定の表面形状を有する金型を、該表
面を上に向けて水平(または略水平)に設置する工程
と、前記金型表面に所定量の光硬化型樹脂液を滴下する
工程と、光学素子基材を前記光硬化型樹脂液の上に水平
(または略水平)に載置し、かつ前記基材と前記金型と
の間隔を制御することにより、前記樹脂液を前記基材と
前記金型との間隙において中央部から周辺部に向け所定
範囲まで押し広げる工程と、前記所定範囲まで押し広げ
られた樹脂液に光を照射して硬化させ、硬化樹脂層と前
記基材とを一体化させることにより、所望の表面形状を
有する樹脂接合型光学素子を作製する工程と、前記樹脂
接合型光学素子を前記金型から取り外す工程と、を備え
た樹脂接合型光学素子の製造方法(請求項1)」を提供
する。
For this purpose, the present invention firstly comprises a step of "at least placing a mold having a predetermined surface shape horizontally (or substantially horizontally) with its surface facing upward; A step of dropping a predetermined amount of a photo-curable resin liquid onto a mold surface, placing an optical element substrate horizontally (or substantially horizontally) on the photo-curable resin liquid, and A step of spreading the resin liquid from a central portion to a peripheral portion in a gap between the base material and the mold to a predetermined range by controlling an interval between the resin liquid and the resin liquid expanded to the predetermined range; Curing the resin-bonded optical element having a desired surface shape by irradiating the resin with light to cure the resin-bonded optical element, A resin-bonded optical element having a step of removing from a mold It provides a method of manufacturing (claim 1). "

【0011】また、本発明は第二に「少なくとも、所定
の表面形状を有する金型を、該表面を上に向けて水平
(または略水平)に設置する工程と、前記金型表面の中
央部(または中央付近)に所定量の光硬化型樹脂液を滴
下する工程と、球面形状または非球面形状を有するレン
ズ基材を前記光硬化型樹脂液の上に、前記球面または非
球面の中央部(または中央付近)が前記樹脂液に接触す
るように、水平(または略水平)に載置し、かつ前記レ
ンズ基材と前記金型との間隔を制御することにより、前
記樹脂液を前記レンズ基材と前記金型との間隙において
中央部から周辺部に向け所定範囲まで押し広げる工程
と、前記所定範囲まで押し広げられた樹脂液に光を照射
して硬化させ、硬化樹脂層と前記レンズ基材とを一体化
させることにより、所望の非球面形状を有する樹脂接合
型レンズを作製する工程と、前記樹脂接合型レンズを前
記金型から取り外す工程と、を備えた樹脂接合型光学素
子の製造方法(請求項2)」を提供する。
[0011] The present invention is also directed to a second aspect: "at least a step of placing a mold having a predetermined surface shape horizontally (or substantially horizontally) with its surface facing upward; (Or near the center) dropping a predetermined amount of a photo-curable resin liquid, and placing a lens substrate having a spherical or aspherical shape on the photo-curable resin liquid at the center of the spherical or aspherical surface. (Or near the center) is placed horizontally (or substantially horizontally) so as to be in contact with the resin liquid, and by controlling the distance between the lens substrate and the mold, the resin liquid is transferred to the lens. In the gap between the base material and the mold, a step of expanding from a central portion to a peripheral portion to a predetermined range, and curing the resin liquid expanded to the predetermined range by irradiating light to the cured resin layer and the lens. By integrating with the base material, A method of manufacturing a resin-bonded optical element comprising: a step of manufacturing a resin-bonded lens having the aspherical shape described above; and a step of removing the resin-bonded lens from the mold. .

【0012】また、本発明は第三に「少なくとも、光学
素子基材をその表面を上に向けて水平(または略水平)
に設置する工程と、前記基材の表面に所定量の光硬化型
樹脂液を滴下する工程と、所定の表面形状を有する金型
の該表面と前記光硬化型樹脂液を接触させ、かつ前記基
材と前記金型との間隔を制御することにより、前記樹脂
液を前記基材と前記金型との間隙において中央部から周
辺部に向け所定範囲まで押し広げる工程と、前記所定範
囲まで押し広げられた樹脂液に光を照射して硬化させ、
硬化樹脂層と前記基材とを一体化させることにより、所
望の表面形状を有する樹脂接合型光学素子を作製する工
程と、前記樹脂接合型光学素子を前記金型から取り外す
工程と、を備えた樹脂接合型光学素子の製造方法(請求
項3)」を提供する。
[0013] The present invention is also directed to a third aspect in which "at least the optical element substrate is horizontally (or substantially horizontally) with its surface facing upward.
And a step of dropping a predetermined amount of a photo-curable resin liquid on the surface of the base material, contacting the photo-curable resin liquid with the surface of a mold having a predetermined surface shape, and By controlling the distance between the base material and the mold, a step of spreading the resin liquid from the central part to the peripheral part in a gap between the base material and the mold to a predetermined range, and pressing the resin liquid to the predetermined range. Irradiate the spread resin liquid with light to cure it,
A step of manufacturing a resin-bonded optical element having a desired surface shape by integrating the cured resin layer and the substrate, and a step of removing the resin-bonded optical element from the mold. A method for manufacturing a resin-bonded optical element (Claim 3) "is provided.

【0013】また、本発明は第四に「少なくとも、光学
素子基材をその表面を上に向けて水平(または略水平)
に設置する工程と、前記基材の表面に所定量の光硬化型
樹脂液を滴下する工程と、前記基材を反転させて、前記
光硬化型樹脂液が滴下された表面を下向きにする工程
と、所定の表面形状を有する金型の該表面と前記光硬化
型樹脂液を接触させ、かつ前記基材と前記金型との間隔
を制御することにより、前記樹脂液を前記基材と前記金
型との間隙において中央部から周辺部に向け所定範囲ま
で押し広げる工程と、前記所定範囲まで押し広げられた
樹脂液に光を照射して硬化させ、硬化樹脂層と前記基材
とを一体化させることにより、所望の表面形状を有する
樹脂接合型光学素子を作製する工程と、前記樹脂接合型
光学素子を前記金型から取り外す工程と、を備えた樹脂
接合型光学素子の製造方法(請求項4)」を提供する。
[0013] The present invention is also directed to a fourth aspect of the present invention in which "at least the optical element substrate is horizontally (or substantially horizontally) with its surface facing upward.
And a step of dropping a predetermined amount of a photocurable resin liquid on the surface of the base material, and a step of turning the base material upside down to face down the surface on which the photocurable resin liquid has been dropped. And, by contacting the photocurable resin liquid and the surface of a mold having a predetermined surface shape, and by controlling the distance between the substrate and the mold, the resin liquid and the substrate and the A step of expanding the resin liquid expanded to the predetermined range from the central part to the peripheral part in the gap between the mold and the peripheral part, and irradiating the resin liquid with light to cure the resin liquid; A method for manufacturing a resin-bonded optical element having a desired surface shape and a step of removing the resin-bonded optical element from the mold. Item 4) "is provided.

【0014】また、本発明は第五に「少なくとも、球面
形状または非球面形状を有するレンズ基材を、該球面ま
たは非球面を上に向けて水平(または略水平)に設置す
る工程と、前記球面または非球面の中央部(または中央
付近)に所定量の光硬化型樹脂液を滴下する工程と、所
定の表面形状を有する金型の該表面の中央部(または中
央付近)と前記樹脂液を接触させ、かつ前記レンズ基材
と前記金型との間隔を制御することにより、前記樹脂液
を前記レンズ基材と前記金型との間隙において中央部か
ら周辺部に向け所定範囲まで押し広げる工程と、前記所
定範囲まで押し広げられた樹脂液に光を照射して硬化さ
せ、硬化樹脂層と前記レンズ基材とを一体化させること
により、所望の非球面形状を有する樹脂接合型レンズを
作製する工程と、前記樹脂接合型レンズを前記金型から
取り外す工程と、を備えた樹脂接合型光学素子の製造方
法(請求項5)」を提供する。
[0015] The present invention is also directed to a fifth aspect of the present invention, which is "at least a step of horizontally (or substantially horizontally) installing a lens substrate having a spherical or aspherical surface with the spherical or aspherical surface facing upward, A step of dropping a predetermined amount of a photo-curable resin liquid onto a central part (or near the center) of a spherical or aspherical surface, and a central part (or near the center) of the surface of a mold having a predetermined surface shape and the resin liquid , And by controlling the distance between the lens substrate and the mold, the resin liquid is spread out from the central portion to the peripheral portion in the gap between the lens substrate and the mold to a predetermined range. Step and curing the resin liquid expanded to the predetermined range by irradiating the resin liquid with light, and integrating the cured resin layer and the lens substrate to form a resin-bonded lens having a desired aspherical shape. A step of making; Serial to provide a step of removing the resin bonding type lens from the mold, a method of manufacturing a resin bonding type optical element (claim 5) "equipped with.

【0015】また、本発明は第六に「少なくとも、球面
形状または非球面形状を有するレンズ基材を、該球面ま
たは非球面を上に向けて水平(または略水平)に設置す
る工程と、前記球面または非球面の中央部(または中央
付近)に所定量の光硬化型樹脂液を滴下する工程と、前
記レンズ基材を反転させて、前記光硬化型樹脂液が滴下
された面を下向きにする工程と、所定の表面形状を有す
る金型の該表面の中央部(または中央付近)と前記樹脂
液を接触させ、かつ前記レンズ基材と前記金型との間隔
を制御することにより、前記樹脂液を前記レンズ基材と
前記金型との間隙において中央部から周辺部に向け所定
範囲まで押し広げる工程と、前記所定範囲まで押し広げ
られた樹脂液に光を照射して硬化させ、硬化樹脂層と前
記レンズ基材とを一体化させることにより、所望の非球
面形状を有する樹脂接合型レンズを作製する工程と、前
記樹脂接合型レンズを前記金型から取り外す工程と、を
備えた樹脂接合型光学素子の製造方法(請求項6)」を
提供する。
The present invention is also directed to a sixth aspect of the present invention in which at least a step of horizontally (or substantially horizontally) installing a lens substrate having a spherical shape or an aspherical surface with the spherical or aspherical surface facing upward, A step of dropping a predetermined amount of a photo-curable resin liquid on a central portion (or near the center) of a spherical or aspherical surface, and inverting the lens substrate so that the surface on which the photo-curable resin liquid is dropped faces downward. And contacting the resin liquid with the center (or near the center) of the surface of a mold having a predetermined surface shape, and controlling the distance between the lens substrate and the mold, A step of spreading the resin liquid to a predetermined range from a central portion to a peripheral portion in a gap between the lens substrate and the mold, and irradiating the resin liquid expanded to the predetermined range with light to cure and cure The resin layer and the lens substrate A method of manufacturing a resin-bonded optical element including a step of producing a resin-bonded lens having a desired aspherical shape by embedding, and a step of removing the resin-bonded lens from the mold (claim) Item 6) is provided.

【0016】また、本発明は第七に「少なくとも、所定
の表面形状を有し、該表面を上に向けて水平(または略
水平)に設置された金型と、所定量の光硬化型樹脂液を
前記金型表面に滴下するディスペンサーと、光学素子基
材を保持する保持部材と、前記保持部材に保持された基
材を、前記光硬化型樹脂液の上に水平(または略水平)
に載置し、かつ前記金型との間隔を変化させる前記保持
部材の駆動機構と、前記基材と前記金型との間隙におい
て、中央部から周辺部に向けて押し広げられる樹脂液の
広がりまたは端部位置を検知する樹脂液検知部と、前記
樹脂液検知部により検知された樹脂液の広がりまたは端
部位置に基づいて、前記駆動機構による駆動を制御する
ことにより、前記樹脂液が押し広げられる範囲を制御す
る制御部と、前記樹脂液を硬化させる光を照射する光照
射部と、を備えた樹脂接合型光学素子の製造装置(請求
項7)」を提供する。
A seventh aspect of the present invention is to provide a mold having at least a predetermined surface shape, and a mold placed horizontally (or substantially horizontally) with the surface facing upward, and a predetermined amount of a photocurable resin. A dispenser for dropping a liquid onto the mold surface, a holding member for holding an optical element base, and a base held by the holding member are horizontally (or substantially horizontally) placed on the photocurable resin liquid.
And a driving mechanism of the holding member for changing the distance between the mold and the mold, and the spread of the resin liquid pushed and spread from the center to the periphery in the gap between the base material and the mold. Alternatively, by controlling the driving by the drive mechanism based on the resin liquid detecting unit for detecting the end position and the spread or the end position of the resin liquid detected by the resin liquid detecting unit, the resin liquid is pushed. A manufacturing apparatus for a resin-bonded optical element, comprising: a control unit for controlling an expanded range; and a light irradiation unit for irradiating light for curing the resin liquid.

【0017】また、本発明は第八に「少なくとも、所定
の表面形状を有し、該表面を上に向けて水平(または略
水平)に設置された金型と、所定量の光硬化型樹脂液を
前記金型表面に滴下するディスペンサーと、光学素子基
材を保持する保持部材と、前記保持部材に保持された基
材に対して、前記金型を水平(または略水平)に接近さ
せることにより、金型上の光硬化型樹脂液を前記基材の
表面に接触させるとともに、基材と金型の間隔を変化さ
せる前記金型の駆動機構と、前記基材と前記金型との間
隙において、中央部から周辺部に向けて押し広げられる
樹脂液の広がりまたは端部位置を検知する樹脂液検知部
と、前記樹脂液検知部により検知された樹脂液の広がり
または端部位置に基づいて、前記駆動機構による駆動を
制御することにより、前記樹脂液が押し広げられる範囲
を制御する制御部と、前記樹脂液を硬化させる光を照射
する光照射部と、を備えた樹脂接合型光学素子の製造装
置(請求項8)」を提供する。
An eighth aspect of the present invention is to provide a resin having at least a predetermined surface shape, and a mold placed horizontally (or substantially horizontally) with its surface facing upward, and a predetermined amount of photocurable resin. A dispenser that drops a liquid onto the surface of the mold, a holding member that holds the optical element base material, and bringing the die horizontally (or substantially horizontally) close to the base material held by the holding member. By contacting the photocurable resin liquid on the mold with the surface of the substrate, the driving mechanism of the mold for changing the distance between the substrate and the mold, and the gap between the substrate and the mold In, a resin liquid detection unit that detects the spread or end position of the resin liquid pushed out from the center toward the peripheral portion, based on the spread or end position of the resin liquid detected by the resin liquid detection unit By controlling the drive by the drive mechanism, An apparatus for manufacturing a resin-bonded optical element, comprising: a control unit for controlling a range in which the resin liquid is spread; and a light irradiation unit for irradiating light for curing the resin liquid. I do.

【0018】また、本発明は第九に「少なくとも、光学
素子基材をその表面を上に向けて水平(または略水平)
に保持する保持部材と、所定量の光硬化型樹脂液を前記
保持部材に保持された基材の表面に滴下するディスペン
サーと、前記保持部材に保持された光学素子基材を反転
させて、前記光硬化型樹脂液が滴下された面を下向きに
する反転機構と、所定の表面形状を有する金型の該表面
を前記光硬化型樹脂液に接触させ、かつ前記保持部材に
保持された基材との間隔を変化させる前記金型の駆動機
構と、前記基材と前記金型との間隙において、中央部か
ら周辺部に向けて押し広げられる樹脂液の広がりまたは
端部位置を検知する樹脂液検知部と、前記樹脂液検知部
により検知された樹脂液の広がりまたは端部位置に基づ
いて、前記駆動機構による駆動を制御することにより、
前記樹脂液が押し広げられる範囲を制御する制御部と、
前記樹脂液を硬化させる光を照射する光照射部と、を備
えた樹脂接合型光学素子の製造装置(請求項9)」を提
供する。
The ninth aspect of the present invention is that the optical element substrate is horizontally (or substantially horizontally) with its surface facing upward.
Holding member, and a dispenser for dropping a predetermined amount of a photo-curable resin liquid onto the surface of the substrate held by the holding member, and inverting the optical element substrate held by the holding member, A reversing mechanism for turning the surface on which the photocurable resin liquid has been dropped downward, and a substrate held in the holding member by bringing the surface of a mold having a predetermined surface shape into contact with the photocurable resin liquid A driving mechanism for the mold that changes the distance between the base and the mold, and a resin liquid that detects the spread or end position of the resin liquid that is spread from the center to the periphery in the gap between the base material and the mold. By controlling the drive by the drive mechanism based on the detection unit and the spread or end position of the resin liquid detected by the resin liquid detection unit,
A control unit that controls a range in which the resin liquid is spread,
And a light irradiation unit for irradiating the resin liquid with light for curing the resin liquid.

【0019】また、本発明は第十に「少なくとも、光学
素子基材をその表面を上に向けて水平(または略水平)
に保持する保持部材と、所定量の光硬化型樹脂液を前記
保持部材に保持された基材の表面に滴下するディスペン
サーと、前記保持部材に保持された光学素子基材を反転
させて、前記光硬化型樹脂液が滴下された面を下向きに
する反転機構と、所定の表面形状を有する金型に対し
て、前記保持部材に保持された光学素子基材を水平(ま
たは略水平)に接近させることにより、光学素子基材上
の光硬化型樹脂液を前記金型の表面に接触させるととも
に、基材と金型の間隔を変化させる前記保持部材の駆動
機構と、前記基材と前記金型との間隙において、中央部
から周辺部に向けて押し広げられる樹脂液の広がりまた
は端部位置を検知する樹脂液検知部と、前記樹脂液検知
部により検知された樹脂液の広がりまたは端部位置に基
づいて、前記駆動機構による駆動を制御することによ
り、前記樹脂液が押し広げられる範囲を制御する制御部
と、前記樹脂液を硬化させる光を照射する光照射部と、
を備えた樹脂接合型光学素子の製造装置(請求項1
0)」を提供する。
The present invention is also directed to a tenth aspect in which “at least the optical element substrate is horizontally (or substantially horizontally) with its surface facing upward.
Holding member, and a dispenser for dropping a predetermined amount of a photo-curable resin liquid onto the surface of the substrate held by the holding member, and inverting the optical element substrate held by the holding member, The optical element substrate held by the holding member approaches (or substantially horizontally) the reversing mechanism for turning the surface on which the photocurable resin liquid has been dropped downward and the mold having a predetermined surface shape. By contacting the photocurable resin liquid on the optical element substrate with the surface of the mold, the driving mechanism of the holding member for changing the distance between the substrate and the mold, and the substrate and the metal In the gap with the mold, a resin liquid detecting portion for detecting the position of the spread or end portion of the resin liquid pushed out from the central portion toward the peripheral portion, and the spread or end portion of the resin liquid detected by the resin liquid detect portion. The driving machine based on the position By controlling the driving by a control unit configured to control a range of the liquid resin is spread, a light irradiation unit that irradiates light to cure the resin liquid,
An apparatus for manufacturing a resin-bonded optical element comprising:
0) ”.

【0020】[0020]

【発明の実施の形態】本発明(請求項1〜6)にかかる
製造方法においては、金型表面または光学素子基材の表
面に滴下された光硬化型樹脂液を、基材と金型との間隙
において中央部から周辺部に向け所定範囲まで押し広げ
たところで、樹脂液に光を照射して硬化させることによ
り、硬化樹脂層と前記基材とを一体化させている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the manufacturing method according to the present invention (claims 1 to 6), a photo-curable resin liquid dropped on the surface of a mold or the surface of an optical element substrate is treated with a substrate and a mold. When the resin liquid is pressed and spread from the center to the peripheral portion in a predetermined range in the gap, the resin liquid is irradiated with light to be cured, so that the cured resin layer and the base material are integrated.

【0021】そのため、本発明(請求項1〜6)によれ
ば、樹脂液の広がりが大きすぎて、設計形状よりも外径
が大きい樹脂接合型光学素子が製造され、製造された樹
脂接合型光学素子を光学系に組み込むことができないと
いう問題点や、樹脂液の広がりが小さすぎて、所望の光
学特性を有する樹脂接合型光学素子が得られないという
問題点が発生することがなく、製造される樹脂接合型光
学素子の良品率を著しく増大させることができる。
Therefore, according to the present invention (claims 1 to 6), a resin-joined optical element having an outer diameter larger than a designed shape due to too large spread of the resin liquid is manufactured, and the manufactured resin-joined optical element is manufactured. Manufacturing without the problem that the optical element cannot be incorporated into the optical system, and the problem that the spread of the resin liquid is too small to obtain a resin-bonded optical element having desired optical characteristics does not occur. The non-defective rate of the resin-bonded optical element to be manufactured can be remarkably increased.

【0022】また、本発明(請求項7〜10)にかかる
製造装置は、請求項1〜6にかかる製造方法を実施でき
る装置であり、同様に、該装置により製造される樹脂接
合型光学素子の良品率を著しく増大させることができ
る。即ち、本発明(請求項1〜10)にかかる製造方法
または製造装置によれば、樹脂接合型光学素子を製造す
る際の樹脂液の広がりを所定範囲とすることが可能であ
り、その結果、製造される樹脂接合型光学素子の良品率
を著しく増大させることができる。
A manufacturing apparatus according to the present invention (claims 7 to 10) is an apparatus capable of performing the manufacturing method according to claims 1 to 6, and similarly, a resin-bonded optical element manufactured by the apparatus. Can be remarkably increased. That is, according to the manufacturing method or the manufacturing apparatus according to the present invention (claims 1 to 10), it is possible to set the spread of the resin liquid in manufacturing the resin-joined optical element to a predetermined range. The non-defective rate of the manufactured resin-bonded optical element can be significantly increased.

【0023】本発明は、光学素子基材と金型の接近によ
り押し広げられる樹脂液の広がりを観察し、例えば樹脂
液の直径が所定範囲内になった所で光学素子基材と金型
の接近を停止させ、この状態を保持して、光(紫外線)
を光学素子基材を通して樹脂液に照射する方法や、その
ための装置が該当する。このように、本発明では樹脂液
の広がりを観察し、例えば樹脂液の直径が所定範囲内に
なったところで光学素子基材と金型の接近を停止させ、
樹脂液を硬化させているので、樹脂液の押し広げの際
に、樹脂層の直径が所定範囲からはずれることがない。
The present invention observes the spread of the resin liquid which is spread by the approach of the optical element substrate and the mold. For example, when the diameter of the resin liquid falls within a predetermined range, the optical element substrate and the mold are separated. Stop approaching and hold this state, light (ultraviolet light)
And the apparatus for irradiating the resin liquid through the optical element substrate. Thus, in the present invention, the spread of the resin liquid is observed, for example, when the diameter of the resin liquid is within a predetermined range, the approach between the optical element substrate and the mold is stopped,
Since the resin liquid is cured, the diameter of the resin layer does not deviate from a predetermined range when the resin liquid is spread.

【0024】これに対して、樹脂接合型光学素子を製造
する従来の方法では、樹脂液の押し広げの際に金型と光
学素子基材の距離(間隔)を制御しており、これは結果
的に硬化樹脂層の厚さを制御することになる。従って、
従来の製造方法では、形成される硬化樹脂層の直径は、
製造時に供給される樹脂液量により変動し、前述したよ
うな問題点(光学系に組み込めない、所望の光学特性が
得られない)が発生することとなる。
On the other hand, in the conventional method of manufacturing a resin-bonded optical element, the distance (interval) between the mold and the optical element substrate is controlled when the resin liquid is spread, which is a result. In other words, the thickness of the cured resin layer is controlled. Therefore,
In the conventional manufacturing method, the diameter of the formed cured resin layer is
This varies depending on the amount of the resin liquid supplied at the time of manufacture, and causes the above-described problems (cannot be incorporated in an optical system, and desired optical characteristics cannot be obtained).

【0025】ところで、本発明においては、樹脂液の広
がりが所定範囲となるように制御しているので、硬化樹
脂層の厚さが多少変動することになる。しかし、光学素
子に要求される光学性能や、光学素子を光学系に(例え
ばレンズを筐体に)組み込む際の寸法公差等により決定
される樹脂層厚さの許容公差は、樹脂液の広がり(即
ち、硬化樹脂層の形成領域)の許容公差よりも大きい。
In the present invention, since the spread of the resin liquid is controlled so as to be within a predetermined range, the thickness of the cured resin layer slightly varies. However, the tolerance of the resin layer thickness, which is determined by the optical performance required for the optical element and the dimensional tolerance when the optical element is incorporated into an optical system (for example, a lens in a housing), is determined by the spread of the resin liquid. That is, it is larger than the allowable tolerance of the cured resin layer formation region).

【0026】従って、製造時に供給される樹脂液量が多
少変動しても、本発明によれば樹脂層厚さの許容公差内
で樹脂接合型光学素子を製造することができる。光学素
子基材と金型との間隙において、中央部から周辺部に向
けて押し広げられる樹脂液の広がりまたは端部位置を検
知する本発明の樹脂液検知部としては、例えば、樹脂液
の広がりまたは端部位置を撮像する動画用カメラと、樹
脂液の広がりまたは端部位置の画像データを画像処理す
る画像処理装置等を使用することができる。
Therefore, according to the present invention, a resin-bonded optical element can be manufactured within an allowable tolerance of the thickness of the resin layer even if the amount of the resin liquid supplied at the time of manufacture slightly varies. In the gap between the optical element base material and the mold, as the resin liquid detection portion of the present invention for detecting the spread or the end position of the resin liquid pushed out from the center toward the peripheral portion, for example, the spread of the resin liquid Alternatively, a moving image camera that captures an image of the end position, an image processing device that performs image processing on image data of the spread of the resin liquid or the end position, or the like can be used.

【0027】なお、請求項4,6,9,10にかかる発
明においては、樹脂液が塗布された光学素子基材を反転
させて、基材表面(下向き)上の樹脂液と金型面(上向
き)を接触させる構成になっている。かかる構成にする
と、樹脂液と金型面が最初に接触する際の接触領域が一
体状となり、複数の島状とならないので、気泡を巻き込
むことがない。そのため、気泡のない硬化樹脂層が得ら
れるので好ましい。
In the invention according to claims 4, 6, 9 and 10, the optical element substrate coated with the resin liquid is turned over, and the resin liquid on the substrate surface (downward) and the die surface ( (Upward) contact. With this configuration, the contact area when the resin liquid and the mold surface first come into contact with each other is integrated and does not form a plurality of islands, so that air bubbles are not involved. Therefore, it is preferable because a cured resin layer without bubbles is obtained.

【0028】以下、本発明を実施例により更に具体的に
説明するが、本発明はこの例に限定されるものではな
い。
Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

【0029】[0029]

【実施例】図1は、本実施例の製造方法に用いられる製
造装置の概略構成図である。この製造装置は、所定の表
面形状を有し、該表面を上に向けて水平(または略水
平)に設置された金型5と、所定量の光硬化型樹脂液6
aを金型表面に滴下するディスペンサー(不図示)と、
レンズ基材(光学素子基材の一例)4を保持する保持部
材(不図示)と、前記保持部材に保持された基材4を、
前記光硬化型樹脂液6aの上に水平(または略水平)に
載置し、かつ前記金型5との間隔を変化させる前記保持
部材の駆動機構(不図示)と、前記基材4と前記金型5
との間隙において、中央部から周辺部に向けて押し広げ
られる樹脂液6aを観察するカメラ(樹脂液検知部の一
例)1と、カメラ1で得られた画像を画像処理すること
により、樹脂液6aの広がりまたは端部位置を検知し、
その検知結果に基づいて、前記駆動機構による駆動を制
御する(レンズ基材4と金型5の接近を制御する)こと
により、前記樹脂液6aが押し広げられる範囲を制御す
るパソコン(樹脂液検知部及び制御部の一例)2と、樹
脂液6aを硬化させる紫外線を照射する紫外線照射器
(光源が出力 150Wのキセノンランプ、光照射部の一
例)3と、により構成されている。
FIG. 1 is a schematic structural view of a manufacturing apparatus used in the manufacturing method of this embodiment. The manufacturing apparatus includes a mold 5 having a predetermined surface shape, which is set horizontally (or substantially horizontally) with the surface facing upward, and a predetermined amount of a photocurable resin liquid 6.
a dispenser (not shown) for dropping a on the mold surface;
A holding member (not shown) for holding a lens base (an example of an optical element base) 4 and a base 4 held by the holding member
A driving mechanism (not shown) for the holding member, which is placed horizontally (or substantially horizontally) on the photo-curable resin liquid 6a and changes the distance from the mold 5; Mold 5
A camera (an example of a resin liquid detection unit) 1 for observing the resin liquid 6a that is spread from the center to the peripheral portion in the gap between the camera 1 and an image obtained by the camera 1 is image-processed. 6a to detect the spread or end position,
A personal computer (resin liquid detection) that controls the range in which the resin liquid 6a is spread by controlling the driving by the driving mechanism (controlling the approach between the lens substrate 4 and the mold 5) based on the detection result. Unit and an example of a control unit) 2 and an ultraviolet irradiator (an example of a xenon lamp with a 150 W output light source and a light irradiation unit) 3 for irradiating ultraviolet rays for curing the resin liquid 6a.

【0030】以下、図2を引用して、本実施例の製造方
法にかかる各工程を説明をする。下記の括弧内の数字は
図2の工程(1)〜工程(4)に対応する。 (1)金型面にニッケルメッキが施されており、所望の
非球面形状を有する金型5を水平に置き、金型面の中央
部にディスペンサーにより所定量の光硬化型樹脂液6a
を垂らす。
Hereinafter, each step of the manufacturing method of this embodiment will be described with reference to FIG. The numbers in parentheses below correspond to steps (1) to (4) in FIG. (1) A mold 5 whose surface is nickel-plated and has a desired aspherical shape is placed horizontally, and a predetermined amount of a photo-curable resin liquid 6a is placed at the center of the mold surface by a dispenser.
Drop.

【0031】樹脂液6aとしては、例えば、商品名アロ
ニックスUV3700又はアロニックス3033HV(東亜合成化学
株式会社製)を用いる。ガラス製のレンズ基材4は、外
径φ40mm、中心部の厚さ 5mmの凸レンズであり、両面と
も球面に仕上げられている。また、樹脂層6との接着力
を向上させるために、レンズ基材4の表面にはシランカ
ップリング処理が施されている。シランカップリング剤
としては、例えば商品名KBM503(信越化学株式会社製)
をエタノールに希釈して2wt%エタノール溶液としたも
のを使用する。
As the resin liquid 6a, for example, Aronix UV3700 or Aronix 3033HV (manufactured by Toa Gosei Chemical Co., Ltd.) is used. The lens substrate 4 made of glass is a convex lens having an outer diameter of 40 mm and a thickness of 5 mm at the center, and both surfaces are finished to be spherical. The surface of the lens substrate 4 is subjected to a silane coupling treatment in order to improve the adhesive strength with the resin layer 6. As a silane coupling agent, for example, a brand name KBM503 (manufactured by Shin-Etsu Chemical Co., Ltd.)
Is diluted with ethanol to obtain a 2 wt% ethanol solution.

【0032】(2)保持部材に保持したレンズ基材4を
駆動機構により金型5に向けて降下させて、レンズ基材
4を樹脂液6aの上に水平(または略水平)に載置し、
さらにレンズ基材4を金型5に接近させることにより、
樹脂液6aをレンズ基材4と金型5の間隙で流動させて
押し広げる。この際、流動による樹脂液の広がりをカメ
ラ1およびパソコン2で監視する。
(2) The lens base 4 held by the holding member is lowered toward the mold 5 by the driving mechanism, and the lens base 4 is placed horizontally (or substantially horizontally) on the resin liquid 6a. ,
Further, by bringing the lens substrate 4 closer to the mold 5,
The resin liquid 6a is caused to flow in the gap between the lens substrate 4 and the mold 5 and spread. At this time, the spread of the resin liquid due to the flow is monitored by the camera 1 and the personal computer 2.

【0033】(3)パソコン2は、樹脂液の広がりまた
は端部位置が所定範囲に達したところで、駆動機構の駆
動を停止させることにより、レンズ基材4と金型5の接
近を止めて、この状態を保持する。その後、紫外線照射
器3により紫外線をレンズ基材4を通して樹脂液6aに
照射して樹脂液6aを硬化させることにより、硬化樹脂
層6を形成する。
(3) When the spread of the resin liquid or the end position reaches a predetermined range, the personal computer 2 stops the drive of the drive mechanism, thereby stopping the approach between the lens base 4 and the mold 5, This state is maintained. Thereafter, the resin liquid 6a is irradiated with ultraviolet rays through the lens substrate 4 by the ultraviolet irradiation device 3 to cure the resin liquid 6a, thereby forming the cured resin layer 6.

【0034】即ち、光源として出力 150Wのキセノンラ
ンプを用いて約60秒間照射すると、樹脂液6aは重合反
応により硬化し、中心の厚さ30μm、最大厚さ200μmの
硬化樹脂層6が形成される。 (4)レンズ基材4と一体化した硬化樹脂層6を金型5
との界面から剥離することにより、樹脂接合型非球面レ
ンズが完成する。
That is, when irradiation is performed for about 60 seconds using a 150 W xenon lamp as a light source, the resin liquid 6a is cured by a polymerization reaction, and a cured resin layer 6 having a center thickness of 30 μm and a maximum thickness of 200 μm is formed. . (4) The cured resin layer 6 integrated with the lens substrate 4 is
The resin-bonded aspherical lens is completed by peeling off from the interface with.

【0035】本実施例の装置及び方法により樹脂接合型
非球面レンズ製造したところ、硬化樹脂層の広がりまた
は端部が所定範囲を越えることがなくなり、製造される
樹脂接合型非球面レンズの良品率が向上した。
When the resin-bonded aspherical lens was manufactured by the apparatus and method of the present embodiment, the spread or the end of the cured resin layer did not exceed a predetermined range. Improved.

【0036】[0036]

【発明の効果】以上説明したように、本発明によれば、
樹脂液の広がりが大きすぎて、設計形状よりも外径が大
きい樹脂接合型光学素子が製造され、製造された樹脂接
合型光学素子を光学系に組み込むことができないという
問題点や、樹脂液の広がりが小さすぎて、所望の光学特
性を有する樹脂接合型光学素子が得られないという問題
点が発生することがなく、製造される樹脂接合型光学素
子の良品率を著しく増大させることができる。
As described above, according to the present invention,
The resin liquid spreads too much and a resin-bonded optical element having an outer diameter larger than the designed shape is manufactured, and the problem that the manufactured resin-bonded optical element cannot be incorporated into an optical system, The problem that the resin-joined optical element having desired optical characteristics cannot be obtained because the spread is too small does not occur, and the yield rate of the manufactured resin-joined optical element can be significantly increased.

【図面の簡単な説明】[Brief description of the drawings]

【図1】は、実施例にかかる樹脂接合型非球面レンズを
製造する装置の概略構成図である。
FIG. 1 is a schematic configuration diagram of an apparatus for manufacturing a resin-bonded aspheric lens according to an embodiment.

【図2】は、実施例にかかる樹脂接合型非球面レンズの
製造方法を示す工程図である。
FIG. 2 is a process diagram illustrating a method for manufacturing a resin-bonded aspheric lens according to an example.

【図3】は、樹脂接合型非球面レンズの構造を示す概略
断面図である。
FIG. 3 is a schematic sectional view showing the structure of a resin-bonded aspheric lens.

【図4】は、従来の樹脂接合型非球面レンズの製造方法
を示す工程図である。
FIG. 4 is a process chart showing a method for manufacturing a conventional resin-bonded aspherical lens.

【符号の説明】[Explanation of symbols]

1 カメラ 2 パソコン 3 紫外線照射器 4 レンズ基材 5 金型 6 硬化樹脂層(樹脂硬化層) 6a 光硬化型樹脂液 11 レンズ基材 12 硬化樹脂層(樹脂硬化層) 12a光硬化型樹脂液 13 金型 14 光(紫外線) 以上 DESCRIPTION OF SYMBOLS 1 Camera 2 Personal computer 3 Ultraviolet irradiation device 4 Lens base material 5 Mold 6 Cured resin layer (resin cured layer) 6a Photocurable resin liquid 11 Lens substrate 12 Cured resin layer (resin cured layer) 12a Photocurable resin liquid 13 Mold 14 light (ultraviolet) or more

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも、 所定の表面形状を有する金型を、該表面を上に向けて水
平(または略水平)に設置する工程と、 前記金型表面に所定量の光硬化型樹脂液を滴下する工程
と、 光学素子基材を前記光硬化型樹脂液の上に水平(または
略水平)に載置し、かつ前記基材と前記金型との間隔を
制御することにより、前記樹脂液を前記基材と前記金型
との間隙において中央部から周辺部に向け所定範囲まで
押し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記基材とを一体化させること
により、所望の表面形状を有する樹脂接合型光学素子を
作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。
At least a step of horizontally (or substantially horizontally) installing a mold having a predetermined surface shape with its surface facing upward, and applying a predetermined amount of a photocurable resin liquid to the mold surface. A step of dropping, placing an optical element base material horizontally (or substantially horizontally) on the photocurable resin liquid, and controlling a distance between the base material and the mold, thereby forming the resin liquid. A step of pressing and expanding a predetermined range from a central portion to a peripheral portion in a gap between the base material and the mold, and irradiating the resin liquid expanded to the predetermined range with light to cure the cured resin layer. A resin-bonded optical element having a step of producing a resin-bonded optical element having a desired surface shape by integrating the base material; and a step of removing the resin-bonded optical element from the mold. Device manufacturing method.
【請求項2】 少なくとも、 所定の表面形状を有する金型を、該表面を上に向けて水
平(または略水平)に設置する工程と、 前記金型表面の中央部(または中央付近)に所定量の光
硬化型樹脂液を滴下する工程と、 球面形状または非球面形状を有するレンズ基材を前記光
硬化型樹脂液の上に、前記球面または非球面の中央部
(または中央付近)が前記樹脂液に接触するように、水
平(または略水平)に載置し、かつ前記レンズ基材と前
記金型との間隔を制御することにより、前記樹脂液を前
記レンズ基材と前記金型との間隙において中央部から周
辺部に向け所定範囲まで押し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記レンズ基材とを一体化させ
ることにより、所望の非球面形状を有する樹脂接合型レ
ンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、 を備えた樹脂接合型光学素子の製造方法。
2. At least a step of placing a mold having a predetermined surface shape horizontally (or substantially horizontally) with the surface facing upward, and at a center (or near the center) of the mold surface. A step of dropping a fixed amount of a photo-curable resin liquid; and placing a lens base having a spherical shape or an aspherical shape on the photo-curable resin liquid, wherein the central part (or near the center) of the spherical or aspherical surface is The resin liquid is placed horizontally (or substantially horizontally) so as to be in contact with the resin liquid, and by controlling the distance between the lens substrate and the mold, the resin liquid is transferred to the lens substrate and the mold. In the gap between the central part and the peripheral part, expanding the resin liquid to a predetermined range, and irradiating the resin liquid expanded to the predetermined area with light to cure the resin liquid, thereby integrating the cured resin layer and the lens substrate. The desired aspherical shape Process and method for producing a resin bonding type optical element having a step, of removing the resin bonding lens from the mold for making that resin bonding type lens.
【請求項3】 少なくとも、 光学素子基材をその表面を上に向けて水平(または略水
平)に設置する工程と、 前記基材の表面に所定量の光硬化型樹脂液を滴下する工
程と、 所定の表面形状を有する金型の該表面と前記光硬化型樹
脂液を接触させ、かつ前記基材と前記金型との間隔を制
御することにより、前記樹脂液を前記基材と前記金型と
の間隙において中央部から周辺部に向け所定範囲まで押
し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記基材とを一体化させること
により、所望の表面形状を有する樹脂接合型光学素子を
作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。
3. At least a step of horizontally (or substantially horizontally) installing the optical element substrate with its surface facing upward, and a step of dropping a predetermined amount of a photocurable resin liquid onto the surface of the substrate. Contacting the surface of a mold having a predetermined surface shape with the photocurable resin liquid, and controlling the distance between the substrate and the mold, thereby allowing the resin liquid to pass through the substrate and the mold. A step of expanding from a central portion to a peripheral portion to a predetermined range in a gap with the mold; and irradiating the resin liquid expanded to the predetermined range with light to cure, and integrating the cured resin layer and the base material. A method of manufacturing a resin-bonded optical element having a desired surface shape, and a step of removing the resin-bonded optical element from the mold.
【請求項4】 少なくとも、 光学素子基材をその表面を上に向けて水平(または略水
平)に設置する工程と、 前記基材の表面に所定量の光硬化型樹脂液を滴下する工
程と、 前記基材を反転させて、前記光硬化型樹脂液が滴下され
た表面を下向きにする工程と、 所定の表面形状を有する金型の該表面と前記光硬化型樹
脂液を接触させ、かつ前記基材と前記金型との間隔を制
御することにより、前記樹脂液を前記基材と前記金型と
の間隙において中央部から周辺部に向け所定範囲まで押
し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記基材とを一体化させること
により、所望の表面形状を有する樹脂接合型光学素子を
作製する工程と、 前記樹脂接合型光学素子を前記金型から取り外す工程
と、を備えた樹脂接合型光学素子の製造方法。
4. At least a step of horizontally (or substantially horizontally) disposing an optical element substrate with its surface facing upward, and a step of dropping a predetermined amount of a photocurable resin liquid onto the surface of the substrate. Inverting the base material and turning the surface on which the photocurable resin liquid is dropped downward, and contacting the photocurable resin liquid with the surface of a mold having a predetermined surface shape, and By controlling the interval between the base material and the mold, a step of spreading the resin liquid to a predetermined range from a central portion to a peripheral portion in a gap between the base material and the mold, and up to the predetermined range. Irradiating the expanded resin liquid with light to cure the resin liquid, and integrating the cured resin layer and the base material to form a resin-bonded optical element having a desired surface shape; and Removing the mold optical element from the mold A method for manufacturing a resin-bonded optical element comprising:
【請求項5】 少なくとも、球面形状または非球面形状
を有するレンズ基材を、該球面または非球面を上に向け
て水平(または略水平)に設置する工程と、 前記球面または非球面の中央部(または中央付近)に所
定量の光硬化型樹脂液を滴下する工程と、 所定の表面形状を有する金型の該表面の中央部(または
中央付近)と前記樹脂液を接触させ、かつ前記レンズ基
材と前記金型との間隔を制御することにより、前記樹脂
液を前記レンズ基材と前記金型との間隙において中央部
から周辺部に向け所定範囲まで押し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記レンズ基材とを一体化させ
ることにより、所望の非球面形状を有する樹脂接合型レ
ンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、
を備えた樹脂接合型光学素子の製造方法。
5. At least a step of horizontally (or substantially horizontally) installing a lens substrate having a spherical shape or an aspherical surface with the spherical or aspherical surface facing upward, and a central portion of the spherical or aspherical surface. Dropping a predetermined amount of a photo-curable resin liquid onto (or near the center); bringing the resin liquid into contact with the center (or near the center) of the surface of a mold having a predetermined surface shape; By controlling the interval between the base material and the mold, a step of spreading the resin liquid from the central portion to the peripheral portion in the gap between the lens base material and the mold to a predetermined range, and up to the predetermined range. Irradiating the expanded resin liquid with light to cure the resin liquid, and integrating the cured resin layer and the lens substrate to produce a resin-bonded lens having a desired aspherical shape; and Joint type wrench A step of removing from the mold,
A method for producing a resin-bonded optical element comprising:
【請求項6】 少なくとも、 球面形状または非球面形状を有するレンズ基材を、該球
面または非球面を上に向けて水平(または略水平)に設
置する工程と、 前記球面または非球面の中央部(または中央付近)に所
定量の光硬化型樹脂液を滴下する工程と、 前記レンズ基材を反転させて、前記光硬化型樹脂液が滴
下された面を下向きにする工程と、 所定の表面形状を有する金型の該表面の中央部(または
中央付近)と前記樹脂液を接触させ、かつ前記レンズ基
材と前記金型との間隔を制御することにより、前記樹脂
液を前記レンズ基材と前記金型との間隙において中央部
から周辺部に向け所定範囲まで押し広げる工程と、 前記所定範囲まで押し広げられた樹脂液に光を照射して
硬化させ、硬化樹脂層と前記レンズ基材とを一体化させ
ることにより、所望の非球面形状を有する樹脂接合型レ
ンズを作製する工程と、 前記樹脂接合型レンズを前記金型から取り外す工程と、
を備えた樹脂接合型光学素子の製造方法。
6. At least a step of placing a lens substrate having a spherical shape or an aspherical surface horizontally (or substantially horizontally) with the spherical or aspherical surface facing upward, and a central portion of the spherical or aspherical surface. A step of dropping a predetermined amount of a photo-curable resin liquid on (or near the center); a step of inverting the lens substrate so that a surface on which the photo-curable resin liquid is dropped faces downward; The resin liquid is brought into contact with the lens substrate by bringing the resin liquid into contact with the center (or near the center) of the surface of the mold having a shape and controlling the distance between the lens substrate and the mold. And a step of pushing out a predetermined range from a central part to a peripheral part in a gap between the mold and the mold; and irradiating the resin liquid expanded and spread out to the predetermined range with light to cure the cured resin layer and the lens substrate. To integrate Ri, a step of removing a step of preparing a resin bonding type lens having a desired aspherical shape, the resin bonding type lens from the mold,
A method for producing a resin-bonded optical element comprising:
【請求項7】 少なくとも、 所定の表面形状を有し、該表面を上に向けて水平(また
は略水平)に設置された金型と、 所定量の光硬化型樹脂液を前記金型表面に滴下するディ
スペンサーと、 光学素子基材を保持する保持部材と、 前記保持部材に保持された基材を、前記光硬化型樹脂液
の上に水平(または略水平)に載置し、かつ前記金型と
の間隔を変化させる前記保持部材の駆動機構と、 前記基材と前記金型との間隙において、中央部から周辺
部に向けて押し広げられる樹脂液の広がりまたは端部位
置を検知する樹脂液検知部と、 前記樹脂液検知部により検知された樹脂液の広がりまた
は端部位置に基づいて、前記駆動機構による駆動を制御
することにより、前記樹脂液が押し広げられる範囲を制
御する制御部と、 前記樹脂液を硬化させる光を照射する光照射部と、を備
えた樹脂接合型光学素子の製造装置。
7. A mold having at least a predetermined surface shape and placed horizontally (or substantially horizontally) with the surface facing upward, and a predetermined amount of a photo-curable resin liquid is applied to the surface of the mold. A dispenser for dropping, a holding member for holding an optical element base material, and a base material held by the holding member placed horizontally (or substantially horizontally) on the photocurable resin liquid; A driving mechanism of the holding member for changing an interval with a mold, and a resin for detecting a spread or an end position of a resin liquid pushed from a central portion toward a peripheral portion in a gap between the base material and the mold. A liquid detection unit, and a control unit that controls a range in which the resin liquid is spread by controlling driving by the drive mechanism based on the spread or end position of the resin liquid detected by the resin liquid detection unit. And curing the resin liquid Apparatus for manufacturing a resin bonding type optical device comprising a light irradiating unit for irradiating light, a.
【請求項8】 少なくとも、 所定の表面形状を有し、該表面を上に向けて水平(また
は略水平)に設置された金型と、 所定量の光硬化型樹脂液を前記金型表面に滴下するディ
スペンサーと、 光学素子基材を保持する保持部材と、 前記保持部材に保持された基材に対して、前記金型を水
平(または略水平)に接近させることにより、金型上の
光硬化型樹脂液を前記基材の表面に接触させるととも
に、基材と金型の間隔を変化させる前記金型の駆動機構
と、 前記基材と前記金型との間隙において、中央部から周辺
部に向けて押し広げられる樹脂液の広がりまたは端部位
置を検知する樹脂液検知部と、 前記樹脂液検知部により検知された樹脂液の広がりまた
は端部位置に基づいて、前記駆動機構による駆動を制御
することにより、前記樹脂液が押し広げられる範囲を制
御する制御部と、 前記樹脂液を硬化させる光を照射する光照射部と、を備
えた樹脂接合型光学素子の製造装置。
8. A mold having at least a predetermined surface shape and placed horizontally (or substantially horizontally) with the surface facing upward, and a predetermined amount of a photo-curable resin liquid on the mold surface. A dispenser for dropping, a holding member for holding the optical element base material, and light on the die by causing the die to approach the base material held by the holding member horizontally (or substantially horizontally). A drive mechanism for the mold, which causes the curable resin liquid to come into contact with the surface of the base material, and changes the distance between the base material and the mold; and, in a gap between the base material and the mold, from a central portion to a peripheral portion. A resin liquid detection unit that detects the spread or end position of the resin liquid that is pushed out toward, and the drive by the drive mechanism based on the spread or end position of the resin liquid detected by the resin liquid detection unit. By controlling, the resin liquid is pushed. An apparatus for manufacturing a resin-bonded optical element, comprising: a control unit that controls a range to be expanded; and a light irradiation unit that irradiates light for curing the resin liquid.
【請求項9】 少なくとも、 光学素子基材をその表面を上に向けて水平(または略水
平)に保持する保持部材と、 所定量の光硬化型樹脂液を前記保持部材に保持された基
材の表面に滴下するディスペンサーと、 前記保持部材に保持された光学素子基材を反転させて、
前記光硬化型樹脂液が滴下された面を下向きにする反転
機構と、 所定の表面形状を有する金型の該表面を前記光硬化型樹
脂液に接触させ、かつ前記保持部材に保持された基材と
の間隔を変化させる前記金型の駆動機構と、 前記基材と前記金型との間隙において、中央部から周辺
部に向けて押し広げられる樹脂液の広がりまたは端部位
置を検知する樹脂液検知部と、 前記樹脂液検知部により検知された樹脂液の広がりまた
は端部位置に基づいて、前記駆動機構による駆動を制御
することにより、前記樹脂液が押し広げられる範囲を制
御する制御部と、 前記樹脂液を硬化させる光を照射する光照射部と、を備
えた樹脂接合型光学素子の製造装置。
9. A holding member for holding at least an optical element base material horizontally (or substantially horizontally) with its surface facing upward, and a base material holding a predetermined amount of a photocurable resin liquid on the holding member. Dispenser dripped on the surface of the optical element base material held by the holding member,
A reversing mechanism for turning the surface on which the photocurable resin liquid is dropped downward, a base held by the holding member, the surface of a mold having a predetermined surface shape being brought into contact with the photocurable resin liquid, A driving mechanism of the mold for changing a distance between the mold and a resin, and a resin for detecting a spread or an end position of a resin liquid that is spread from a central portion toward a peripheral portion in a gap between the base material and the mold. A liquid detection unit, and a control unit that controls a range in which the resin liquid is spread by controlling driving by the drive mechanism based on the spread or end position of the resin liquid detected by the resin liquid detection unit. And a light irradiation unit for irradiating light for curing the resin liquid.
【請求項10】 少なくとも、 光学素子基材をその表面を上に向けて水平(または略水
平)に保持する保持部材と、 所定量の光硬化型樹脂液を前記保持部材に保持された基
材の表面に滴下するディスペンサーと、 前記保持部材に保持された光学素子基材を反転させて、
前記光硬化型樹脂液が滴下された面を下向きにする反転
機構と、 所定の表面形状を有する金型に対して、前記保持部材に
保持された光学素子基材を水平(または略水平)に接近
させることにより、光学素子基材上の光硬化型樹脂液を
前記金型の表面に接触させるとともに、基材と金型の間
隔を変化させる前記保持部材の駆動機構と、 前記基材と前記金型との間隙において、中央部から周辺
部に向けて押し広げられる樹脂液の広がりまたは端部位
置を検知する樹脂液検知部と、 前記樹脂液検知部により検知された樹脂液の広がりまた
は端部位置に基づいて、前記駆動機構による駆動を制御
することにより、前記樹脂液が押し広げられる範囲を制
御する制御部と、 前記樹脂液を硬化させる光を照射する光照射部と、を備
えた樹脂接合型光学素子の製造装置。
10. A holding member for holding at least an optical element base material horizontally (or substantially horizontally) with its surface facing upward, and a base material holding a predetermined amount of a photocurable resin liquid on the holding member. Dispenser dripped on the surface of the optical element base material held by the holding member,
A reversing mechanism for turning the surface on which the photocurable resin liquid has been dropped downward, and a mold having a predetermined surface shape to horizontally (or substantially horizontally) hold the optical element substrate held by the holding member. By approaching, while contacting the photocurable resin liquid on the optical element substrate to the surface of the mold, the driving mechanism of the holding member to change the distance between the substrate and the mold, the base material and the In the gap with the mold, a resin liquid detection unit that detects the position of the spread or end of the resin liquid that is pushed out from the center toward the periphery, and the spread or end of the resin liquid that is detected by the resin liquid detection unit. A control unit that controls a range in which the resin liquid is spread by controlling driving by the driving mechanism based on the position of the unit, and a light irradiation unit that irradiates light for curing the resin liquid. Resin bonded optical element Manufacturing equipment.
JP9339721A 1997-12-10 1997-12-10 Method and apparatus for producing resin-bond type optical element Pending JPH11170277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9339721A JPH11170277A (en) 1997-12-10 1997-12-10 Method and apparatus for producing resin-bond type optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9339721A JPH11170277A (en) 1997-12-10 1997-12-10 Method and apparatus for producing resin-bond type optical element

Publications (1)

Publication Number Publication Date
JPH11170277A true JPH11170277A (en) 1999-06-29

Family

ID=18330188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9339721A Pending JPH11170277A (en) 1997-12-10 1997-12-10 Method and apparatus for producing resin-bond type optical element

Country Status (1)

Country Link
JP (1) JPH11170277A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009029140A (en) * 2008-09-19 2009-02-12 Citizen Electronics Co Ltd Method of manufacturing plastic lens
JP2012125942A (en) * 2010-12-13 2012-07-05 Toshiba Mach Co Ltd Master mold manufacturing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009029140A (en) * 2008-09-19 2009-02-12 Citizen Electronics Co Ltd Method of manufacturing plastic lens
JP4673912B2 (en) * 2008-09-19 2011-04-20 シチズン電子株式会社 Manufacturing method of plastic lens
JP2012125942A (en) * 2010-12-13 2012-07-05 Toshiba Mach Co Ltd Master mold manufacturing apparatus

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