JPH11330783A - Substrate-carrying device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To indirectly and accurately position a substrate, without contacts by positioning the substrate to be carried via a carrier for fixing and retaining it in a given state. SOLUTION: A substrate carrier 11 is provided, where it has substrate- pressing metal fittings 14 and 15, that are slidable in a direction close to or away from a carrier block 12, and one end or the other end of a plurality of coil springs is sealed between the carrier block 12 and the substrate-pressing metal fittings 14 and 15. A printed wiring board 2 is positioned at each of positioning units 3A-6A of a printing machine and first to third chip mounters of a packaging system via a conveyor, while being fixed and retained at the substrate carrier 11. As a result, each reference hole and each end face formed on the printed wiring board 2 are prevented from being worn out or damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board transfer apparatus and a board transfer method, and is suitably applied to, for example, a mounting system for mounting electronic components on a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, as a mounting system 1 of this type, as shown in FIG. 5, a printed wiring board 2 is connected to a printing machine 3 via a conveyor (not shown) and first to third chip mounters 4 to 3. 6 and a reflow furnace 7, which are sequentially conveyed through predetermined processing steps to produce a printed circuit board 8 having a plurality of electronic components (not shown) mounted on the printed wiring board 2. ing.

[0003] In practice, in such a mounting system 1,
First, the printed wiring board is sent to the printing machine 3 and positioned on a predetermined positioning unit 3A. Then, the printed wiring board is plated on a wiring pattern (not shown) formed on the printed wiring board 2 by a plating method, a vapor deposition method or a transfer method. Print solder for pre-coating using

Subsequently, the printed wiring board 2 is sent to a first chip mounter 4 and positioned on a predetermined positioning unit 4A. Then, the first chip mounter 4 is moved to a position corresponding to the wiring pattern of the printed wiring board 2 on the first chip mounter 4. A predetermined type of electronic component (not shown) is positioned and mounted. Subsequently, after positioning the printed wiring board 2 on a predetermined positioning unit 5A in the second chip mounter 5, another type of electronic component (not shown) is mounted on a predetermined portion of the printed wiring board 2. Further, after the printed wiring board 2 is positioned on a predetermined positioning unit 6A in the third chip mounter 6, a specially shaped electronic component (so-called odd-shaped chip component) (not shown) is mounted on a predetermined portion of the printed wiring board 2. I do.

[0005] Thereafter, the printed wiring board 2 on which a plurality of electronic components are mounted in this manner is placed in a reflow furnace 7.
And the electrodes of each electronic component are melt-bonded to the corresponding solder precoat on the printed wiring board 2 in the reflow furnace 7. Thus, a printed circuit board 8 having a plurality of electronic components mounted on the printed wiring board 2 can be manufactured.

[0006]

In the mounting system 1, as a method for positioning the printed wiring board 2 in the printing machine 3 and the first to third chip mounters 4 to 6, FIG. ), At least two or more holes (hereinafter referred to as reference holes) 2H are formed in the printed wiring board 2, and the printing press 3 and the first to third chip mounters 4 to 6 are correspondingly formed. Pins (hereinafter referred to as reference pins) 3AP to 6AP are formed on the respective positioning units 3A to 6A, and the respective reference holes 2H of the printed wiring board 2 are inserted into the corresponding reference pins 3AP to 6AP of the corresponding positioning units 3A to 6A. There is a method of positioning the printed wiring board 2 by the following method.

Second, as shown in FIG. 6 (B), a predetermined number of blocks (hereinafter referred to as "blocks") are located at predetermined positions on the printing press 3 and the respective positioning units 3A to 6A of the first to third chip mounters 4 to 6. 3AB to 6AB are provided, and the printed wiring board 2 conveyed through a conveyor is provided.
There is a method of positioning the printed wiring board 2 by bringing the respective end faces 2E into contact with each other.

However, according to the first and second positioning methods, the printing machine 3 and the first to third chip mounters 4 to 6 are used.
When the printed wiring board 2 is directly positioned, the reference holes 2H and the end faces 2E formed in the printed wiring board 2 made of an organic material are worn or damaged, and the positioning accuracy of the printed wiring board 2 is reduced. There was a problem.

As a third positioning method for solving such a problem, as shown in FIG. 6C, at least two or more marks (hereinafter referred to as recognition marks) 2M are formed on the printed wiring board 2, and A camera (hereinafter referred to as a recognition camera) 9 for reading the recognition mark 2M is installed in each of the printing machine and the first to third chip mounters, and each recognition mark 2M of the printed wiring board 2 is photographed to print. A method of positioning the wiring board 2 is conceivable.

However, according to the third method, it is possible to prevent the printed wiring board 2 from being worn or damaged. However, in the printing machine 3 and the first to third chip mounters 4 to 6, a predetermined number of recognition cameras are respectively provided. 9, the printing press 3 and the first to third chip mounters 4
6 become complicated, and as a result, there is a problem that the structure becomes complicated as a whole of the mounting system 1 (FIG. 5).

The present invention has been made in view of the above points, and an object of the present invention is to propose a substrate transfer apparatus and a substrate transfer method capable of easily performing high-precision positioning.

[0012]

According to the present invention, there is provided a substrate transport apparatus for transporting a substrate, a carrier for fixing and holding the substrate in a predetermined state, and a positioning for positioning the substrate via the carrier. Means is provided.

As a result, when the substrate is positioned by mechanical contact at a predetermined position while transporting the fixed carrier, the substrate can be indirectly positioned in a non-contact state. Damage can be prevented from occurring.

Further, in the present invention, in the substrate transporting method for transporting the substrate, the substrate is mounted on the carrier in a predetermined state, and then the substrate is positioned via the carrier.

As a result, when the carrier on which the substrate is mounted is transported and positioned at a predetermined position by mechanical contact, the substrate can be indirectly positioned in a non-contact state, and thus the substrate is worn or damaged. Can be prevented from occurring.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

In FIG. 1, in which parts corresponding to those in FIG. 5 are denoted by the same reference numerals, reference numeral 10 denotes a mounting system to which the present invention is applied as a whole, and a conventional system except that the transport mechanism of the printed wiring board 2 is different. It has the same configuration as the mounting system 1 shown in FIG.

That is, in this mounting system 10, the printed circuit board 2 is detachably fixed to and held by the board carrier 11, and the board carrier 11 is moved via a conveyor (not shown) such as a belt conveyor or a roller conveyor. A plurality of electronic components (not shown) mounted on the printed wiring board 2 by sequentially transporting them to the printing machine 3 and the first to third chip mounters 4 to 6 and subjecting them to predetermined processing. The plate 8 is manufactured. The substrate carrier 11 is returned to the original initial position from the front stage of the reflow furnace 7 via another conveyor (not shown).

As shown in FIG. 2, the substrate carrier 11 has a pair of substrate holding metal fittings 14 and 15 on both edges of an upper surface of a carrier block 12 made of a relatively hard metal or resin. The printed wiring board 2 is mounted on the upper surface 12A of the carrier block 12 so as to be slidable in the upward direction shown in FIG.
The board is fixed and held by using board holding fittings 14 and 15.

On both sides of the carrier block 12,
Guide grooves 12GA and 12GB each having a concave cross section are formed in a straight line parallel to the side edge surfaces, respectively.
Substrate holding members 14 and 15 having a substantially U-shaped cross section are attached in predetermined directions so as to sandwich the upper convex portions 12TA and 12TB of A and 12GB, respectively.

In this case, a pair of guide holes 14H and 15H are formed in the bottoms of the substrate holding members 14 and 15 along the vertical direction (the direction of the arrow z).
2 upper guide portion 1 of guide grooves 12GA and 12GB
Sliding pins 16 are attached to the end faces of the 2TA and 12TB so as to penetrate the guide holes 14H and 15H, respectively. Thereby, the substrate holding brackets 14 and 15
The upper and lower ends of the guide holes 14H and 15H can slide in the vertical direction (the direction of the arrow z) with respect to the carrier block 12 within a range where the upper or lower ends of the guide holes 14H and 15H abut on the slide pins 16.

In the board holding members 14 and 15, upper contact portions 14U and 15U and lower contact portions 14U projecting at right angles from the upper and lower ends of the bottom, respectively.
D and 15D, the inner surfaces of the upper contact portions 14U and 15U face the upper surface 12A of the carrier block 12, and the upper convex portions 12TA and 1TA of the carrier block 12.
It is made to face the lower end surface of 2TB. Further, the lower contact portions 14D and 15 of the substrate holding members 14 and 15 are provided.
Inner surface of D and upper step 12TA of carrier block 12
, A plurality of coil springs 1
7 (FIG. 3) are fixed at one end and the other end, respectively.

Further, the upper surface 12A of the carrier block 12
The reference pins 12 made of a metal material correspond to the respective reference holes 2H formed in the printed wiring board 2 (FIG. 7).
P is formed. Thus, when the printed wiring board 2 is placed on the upper surface 12A of the carrier block 12, the printed wiring board 2 is inserted by inserting the reference holes 2H corresponding to the respective reference pins 12P.
The displacement from 2A can be prevented.

The printed circuit board 2 is actually mounted on the substrate carrier 1.
3 (A) to 3 (A) to 3
It is shown in (C). First, as shown in FIG. 3A, with respect to the substrate carrier 11, the operator holds the carrier block 12 fixedly and holds the substrate holding members 14 and 15 in the direction shown by the arrow z (that is, the compression direction of each coil spring 17). )
To raise. At this time, the inner side surfaces of the upper contact portions 14U and 15U of the substrate holding members 14 and 15 are set to have a sufficient distance from the upper surface 12A of the carrier block 12.

In this state, as shown in FIG. 3 (B), the operator can work with each reference hole 2 formed in the printed wiring board 2.
The printed wiring board 2 is positioned on the upper surface 12A of the carrier block 12 such that the reference pins 12P formed on the upper surface 12A of the carrier block 12 are inserted into H.

Thereafter, when the operator releases the board holding members 14 and 15 from his / her hands, as shown in FIG. 3C, a plurality of coils attached between the board holding members 14 and 15 and the carrier block 12 are formed. According to the urging force of the spring 17,
By moving the board holding members 14 and 15 in the direction opposite to the direction indicated by the arrow z (that is, the extension direction of each coil spring 17), the lower contact portions 14D and 15D of the board holding members 14 and 15 are moved. Both side edges of the printed wiring board 2 are pressed against the inner surface. Thus printed wiring board 2
Is fixedly held on the upper surface 12A of the carrier block 12 by the substrate holding members 14 and 15.

In the above configuration, the substrate carrier 1
1 is to hold the board holding fittings 14 and 15 in a pulled up state, release the holding of the board holding fittings 14 and 15 after positioning the printed wiring board 2 on the upper surface 12A of the carrier block 12, and By the urging of the plurality of coil springs 17, both side edges of the printed wiring board 2 can be fixed and held between the board holding fittings 14, 15 and the carrier block 12.

Then, the substrate carrier 11 on which the printed wiring board 2 is fixed and held is attached to the printing machine 3 and the first to third chip mounters 4 to 6 in the mounting system 10 (FIG. 1).
When sequentially transported through a conveyor (not shown),
The printed circuit board 2 is positioned on each of the positioning units 3A to 6A by positioning the substrate carrier 11 itself on the positioning units 3A to 6A provided on the printing machine 3 and the first to third chip mounters 4 to 6, respectively. It can be positioned indirectly.

More specifically, as shown in FIG. 4, a predetermined number of reference blocks 3 are placed at predetermined positions on the printing press 3 and the positioning units 3A to 6A of the first to third chip mounters 4 to 6.
When AB to 6AB are provided, each end face 12E of the carrier block 12 in the substrate carrier 11 conveyed via the conveyor is referred to as a reference block 3AB.
6AB, the substrate carrier 11 can be positioned on the positioning units 3A to 6A.

As described above, instead of directly positioning the printed wiring board 2 on the positioning units 3A to 6A of the printing machine 3 and the first to third chip mounters 4 to 6 in the mounting system 10, the printed wiring board 2 is not used. The printed wiring board 2 can be positioned in a non-contact manner by positioning the board carrier 11 while being conveyed through a conveyor in a state where the printed wiring board 2 is fixedly held on the board carrier 11, thus forming the printed wiring board 2. Each reference hole 2
P and each end face 2E can be prevented from being worn or damaged.

The substrate carrier 11 to be transported for each of the printing machine 3 and the positioning units 3A to 6A of the first to third chip mounters 4 to 6 in the mounting system 10.
Are positioned by mechanical contact, there is no need to provide a recognition camera or the like corresponding to each of the positioning units 3A to 6A, and as a result, the configuration of the entire mounting system 10 becomes complicated. Can be avoided.

According to the above configuration, the carrier block 1
2 are provided on the substrate holding members 14 and 15 which are slidable in a direction approaching or moving away from the substrate spring 2.
One end and the other end of the substrate carrier 1 fixed between the carrier block 12 and the substrate holding brackets 14 and 15, respectively.
1 and the printing machine 3 and the first
To each of the positioning units 3 of the third chip mounters 4 to 6
By positioning the substrate carrier 11 on which the printed wiring board 2 is fixedly held for each of A to 6A,
It is possible to prevent the printed wiring board 2 from being worn or damaged due to external factors, and thus to easily perform high-precision positioning.

In the above-described embodiment, a case has been described in which the substrate carrier 11 as the carrier is constituted by the carrier block 12 and the substrate holders 14 and 15 as shown in FIG. However, the invention is not limited to this, and any carrier having various other configurations can be applied as long as the carrier can fix and hold the printed wiring board 2 in a predetermined state.

In the above-described embodiment, the board holding members 14 and 15 for holding the printed wiring board 2 placed on the carrier block 12 are fixed by the biasing force of the plurality of coil springs 17. 2 is pressed against the upper surface 12A of the carrier block 12. However, the present invention is not limited to this. A spring or an elastic member such as rubber or synthetic resin may be used.

Further, in the above-described embodiment, as the positioning means for positioning the printed wiring board 2 via the substrate carrier 11 as a carrier, each positioning unit of the printing machine 3 and the first to third chip mounters 4 to 6 is used. A predetermined number of reference blocks 3AB to 6AB provided respectively for 3A to 6A are applied, and the respective reference blocks 3AB to 3AB are applied.
Although the description has been given of the case where the end faces 12E of the carrier block 12 are brought into contact with the 6AB and the positioning is performed, the present invention is not limited to this. Can be applied as positioning means having various other configurations.

Further, in the above-described embodiment, a case has been described in which the board transfer apparatus and the board transfer method according to the present invention are applied to the mounting system 10. However, the present invention is not limited to this, and various positioning is required. The present invention can be widely applied to various systems as long as the system conveys a substrate (various substrates other than a printed wiring board) in a process.

[0037]

As described above, according to the present invention, in a substrate transfer apparatus for transferring a substrate, a carrier for fixing and holding the substrate in a predetermined state and a positioning means for positioning the substrate via the carrier are provided. This allows the substrate to be indirectly positioned in a non-contact state when the substrate is positioned by mechanical contact at a predetermined position while transporting the fixedly held carrier, resulting in wear and damage to the substrate. Thus, it is possible to realize a substrate transfer apparatus capable of easily performing high-precision positioning.

Further, according to the present invention, in a substrate transport method for transporting a substrate, after the substrate is mounted on the carrier in a predetermined state, the substrate is positioned via the carrier. When the substrate is positioned by mechanical contact at a predetermined position while being transported, the substrate can be indirectly positioned in a non-contact state, and as a result, wear and damage to the substrate can be prevented. A substrate transfer method that can easily perform high-precision positioning can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic diagram for explaining a configuration of a mounting system according to an embodiment.

FIG. 2 is a perspective view showing a configuration of a substrate carrier according to the present embodiment.

FIG. 3 is a cross-sectional view for describing a holding state of a printed wiring board on a substrate carrier.

FIG. 4 is a perspective view illustrating a positioning state of a substrate carrier on a positioning unit.

FIG. 5 is a schematic diagram for explaining the configuration of a conventional mounting system.

FIG. 6 is a schematic diagram for explaining a conventional method for positioning a printed wiring board.

[Explanation of symbols]

1, 10 mounting system, 2 printed circuit board, 2
H: Reference hole, 2E: End face, 3A to 6A: Positioning unit, 3AB to 6AB: Reference block, 11 ...
Substrate carrier, 12 ... Carrier block, 12A ...
Top surface, 12GA, 12GB ... Guide groove, 12TA, 1
2TB ... upper convex part, 14, 15 ... board holding bracket,
14H, 15H: Guide hole, 14U, 15U: Upper contact block, 14D, 15D: Lower contact portion, 16
... Sliding pin, 17 ... Coil spring.

Claims (4)

[Claims] 1. A substrate transfer device for transferring a substrate, comprising: a carrier for fixing and holding the substrate in a predetermined state; and a positioning means for positioning the substrate via the carrier. . 2. The substrate transfer apparatus according to claim 1, wherein the carrier holds and fixes an end of the substrate. 3. A substrate transport method for transporting a substrate, comprising: a first step of attaching the substrate to a carrier in a predetermined state; and a second step of positioning the substrate via the carrier. Substrate transfer method. 4. In the first step, an end of the substrate is attached to the carrier.
3. The substrate transfer method according to 1.