JPH11330734A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the latitude in design by providing a contact piece obtained by cutting and bending a cover for closing above a frame in an inward direction of the frame, and bringing the piece into elastic contact with part of a grounding pattern of a printed board. SOLUTION: A frame 1 is bent upward at aside plate 1a from a bottom plate 1b, and an upward opened opening 1c is formed substantially into a rectangular shape. A printed board 2, in which a variety of electronic components 2a such as a coil, a resistor and the like are soldered, is disposed in the frame 1, disposed at a side plate 1a of the frame 1, and mounted by soldering or the like. A circuit pattern and a grounding pattern 2b and the like are formed on the board 2, and a solder 3 made of a hemispherical solder bump 3a is provided on a part of the surface. A cover for closing above the frame 1 is a metal plate having springiness, bent down at four side to form a mount 4a. An end of the mount 4a is projected to a side plate 1a of the frame 1, the plate 1a is held by the mount 4a, and a tongue piece-like contact piece 4c bent at part of an upper plate 4b formed in a flat state is provided at the cover.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment,
The present invention relates to an electronic device that can easily be grounded simply by covering a cover.

[0002]

2. Description of the Related Art A conventional electronic device will be described with reference to FIG. The frame 21 of a conventional electronic device is made of a metal plate, and is formed by integrally forming a side plate 21a around the periphery and a bottom plate 21b at the bottom by pressing or the like. Inside the frame 21, a shield plate 21c formed by cutting and raising the bottom plate 21b and integrally formed with the frame is provided so as to be bent vertically upward. A printed circuit board 22 is disposed inside the frame body 21. The printed circuit board 22 is provided with a ground pattern (not shown) of the printed circuit board 22 on a side plate 21b and a shield plate 21c by solder 23, respectively. Body 21
It is attached to a predetermined position inside.

A frame 2 is provided above the printed circuit board 22.
A lid 24 for closing the upper part of 1 is arranged. The lid 24 has a mounting portion 24a with four sides bent downward in the figure.
Is formed, and the distal end of the mounting portion 24a is formed so as to protrude toward the side plate 21a. With this mounting portion 24a, the frame 21
The lid 24 can be attached to the frame 21 by holding the side plate 21a. The lid 24 is provided with a resilient contact piece 24c which is formed by cutting a part of the upper plate 24b of the upper surface into a tongue-like shape and bending it downward in the figure. Then, the cover 24 is covered from above the frame 21, and the mounting portion 24 a of the cover 24 is attached to the side plate 21 a of the frame 21.
The cover 24 can be attached to the frame 21 by being pushed into the outside of the frame 21 and the attaching portion 24a holding the side plate 21a. When the lid 24 is attached to the frame 21, the vicinity of the tip of the contact piece 24 c becomes the upper end 21 of the shield plate 21 c.
d, the lid 24 is interposed through the shield plate 21c,
It is designed to be electrically conductive.

[0004]

However, in the above-mentioned conventional electronic device, the frame 21 using a plate material in which the surface of an iron plate is plated with tin or the like is processed by a press or the like. Therefore, the end surface of the upper end portion 21d of the shield plate 21c has a broken surface, and the upper end portion 21d of the shield plate 21c is broken.
There is a problem that the iron of the material is exposed, and rust or the like is generated in this portion, and the contact resistance between the lid 24 and the shield plate 21c is deteriorated. Further, in the conventional electronic device, the contact piece 24c must be formed at the position where the shield plate 21c is formed, and the shield plate 21c cannot be provided at a free position, and the degree of freedom of design is limited. There was a problem. An object of the present invention is to solve the above-described problems and to provide a high-performance electronic device.

[0005]

According to a first aspect of the present invention, there is provided an electronic apparatus comprising: a frame surrounded by side plates; and a ground pattern disposed inside the frame. And a lid made of metal for closing the upper part of the frame body, and the lid body is provided with a contact piece formed by cutting a part of the lid toward the inside of the frame body. The contact piece was configured to resiliently contact a part of the ground pattern of the printed circuit board.

As a second means for solving the above-mentioned problems, a frame surrounded by a side plate and an earth pattern provided inside the frame and partially provided with a solder portion are provided. A printed circuit board having a printed circuit board, and a cover made of metal for closing the upper part of the frame. The piece was configured to elastically contact the solder portion of the ground pattern.

As a third means for solving the above problem, the solder portion is formed of a hemispherical solder bump on a portion of the ground pattern where the contact piece resiliently contacts. The contact piece was elastically contacted to the surface.

As a fourth solution for solving the above-mentioned problem, a configuration is adopted in which the side surface of the contact piece is elastically contacted with the surface of the solder bump.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a cross-sectional view of main parts of an electronic device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of main parts of an electronic device showing a modification of the present invention, and FIG. 3 shows another embodiment of the present invention. It is principal part sectional drawing of the electronic device shown. First, in the electronic apparatus of the present invention shown in FIG. 1, a frame 1 made of a flat metal plate whose periphery is surrounded by a side plate 1a is formed in a substantially rectangular shape by press working or the like.

In such a frame 1, the side plate 1a has a bottom plate 1b.
Opening 1 that is bent upward from
c is formed in a substantially rectangular shape. A printed circuit board 2 to which various electronic components 2a such as coils or resistors are soldered is disposed inside the frame 1. The printed circuit board 2 is positioned on the side plate 1a of the frame 1 and attached by soldering or the like.

A circuit pattern (not shown), an earth pattern 2b, and the like are formed on the printed circuit board 2. A solder portion 3 composed of a hemispherical solder bump 3a is provided on a part of the surface of the earth pattern 2b. I have. When the electronic component 2a is soldered to the printed board 2, such a hemispherical solder bump 3a is applied by applying a suitable amount of cream solder in a ball shape onto the ground pattern 2b. Is melted by a reflow soldering device or the like, so that hemispherical solder bumps 3a can be formed.

A lid 4 for closing the upper part of the frame is attached above the frame 1. The lid 4 is made of a metal plate having a spring property, and the four sides are bent downward in the figure to form an attachment portion 4a. The distal end of the mounting portion 4a is formed so as to protrude toward the side plate 1a of the frame 1, so that the mounting portion 4a can hold the side plate 1a. The lid 4 has a flat upper plate 4b.
Is provided in the form of a tongue-shaped contact piece 4c, which is formed by cutting and bending a part of the inside of the frame body 1. The tip of the contact piece 4c is bent upward in a round shape. Then, the lid 4 is covered so as to close the opening 1c of the frame 1 and the mounting portion 4a is pushed into the side plate 1a of the frame 1, and the mounting portion 4a elastically clamps the side plate 1a. The cover 4 can be attached to the frame 1. The lid 4 attached in this manner is configured such that the flat side surface 4d on the lower side in the drawing of the contact piece 4c elastically contacts the surface of the hemispherical solder bump 3a. The lid 4 is electrically connected to the ground pattern 2b of the printed board 2 via the solder bumps 3a.

Another embodiment of the electronic apparatus according to the present invention will be described with reference to FIG. First, the printed circuit board 2
The solder portion 3 provided on a part of the surface of the ground pattern 2b has a solder film 3b of a predetermined thickness. By elastically contacting the bent end of the contact piece 4c of the lid 4 with the solder film 3b, the lid 4 is electrically connected to the ground pattern 2b of the printed circuit board 2 via the solder film 3b. It has become. In order to form the solder film 3b on such a solder portion 3, a small amount of cream solder may be applied to the surface of the ground pattern 2b, so that a small amount of solder can be reduced.

In the description of the electronic device of the present invention, the solder portion 3 is provided on the surface of the ground pattern 2b.
Although the contact piece 4c was elastically contacted with the ground pattern 2b, as shown in FIG. 3, the surface of the ground pattern 2b was exposed without providing a solder portion, and the contact piece 4c of the lid 4 was directly connected to the ground pattern 2b. It may be in contact with a part of the surface.

[0015]

According to the electronic device of the present invention, the lid is provided with a contact piece which is partially cut and formed inwardly of the frame.
Since this contact piece is elastically contacted with a part of the ground pattern of the printed circuit board, the contact piece can be elastically contacted at an appropriate position of the earth pattern formed on the printed circuit board, improving the degree of freedom in design. Can be done.

Further, the lid is provided with a contact piece which is partially cut and bent toward the inside of the frame, and this contact piece is elastically contacted with the solder portion of the ground pattern. By providing the solder portion on the surface of the ground pattern that is in contact, the portion that is in contact with the contact piece can be protected from obstacles such as rust. For this reason, it is possible to prevent the contact resistance of the portion where the contact piece comes into contact from deteriorating, and to provide a high-performance electronic device.

Further, the solder portion is formed of a hemispherical solder bump on the ground pattern where the contact piece resiliently contacts, and the contact piece resiliently contacts the surface of the solder bump. The size can be freely adjusted by the application amount of the cream solder, and an appropriate contact pressure with the contact piece can be obtained.

Further, since the side surface of the contact piece is resiliently contacted with the surface of the solder bump, the flat side surface of the contact piece can make point contact with the surface of the hemispherical solder bump. In this portion, a stable contact resistance value with no variation can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an electronic apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a main part showing a modification of the electronic apparatus of the present invention.

FIG. 3 is a cross-sectional view of a main part of another embodiment of the electronic apparatus of the present invention.

FIG. 4 is a cross-sectional view of a main part of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 1a Side plate 1b Bottom plate 1c Opening 2 Printed circuit board 2a Electronic component 2b Ground pattern 3 Solder part 3a Solder bump 3b Solder film 4 Lid 4a Mounting part 4b Top surface 4c Contact piece 4d Side surface

Claims (4)

[Claims] 1. A frame having a frame surrounded by a side plate, a printed circuit board having an earth pattern disposed inside the frame, and a lid made of metal for closing a top of the frame. The lid is provided with a contact piece, a part of which is cut and bent toward the inside of the frame body, and the contact piece elastically contacts a part of the ground pattern of the printed circuit board. machine. 2. A frame body surrounded by a side plate, a printed circuit board having a ground pattern disposed inside the frame body and having a solder part on a part of a surface thereof, and a lid above the frame body. A lid made of a metal to be closed, and provided with a contact piece formed by cutting a part of the lid into the inside of the frame and bending the contact piece into elastic contact with the solder portion of the ground pattern. Electronic equipment characterized in that: 3. The solder part is formed of a hemispherical solder bump on a portion of the ground pattern where the contact piece resiliently contacts, and the contact piece resiliently contacts the surface of the solder bump. The electronic device according to claim 2, wherein 4. The electronic device according to claim 3, wherein a side surface of said contact piece is elastically contacted with a surface of said solder bump.