JPH11330645A - Printed board with enlarged copper foils of surface layer and inner layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board with an increased area of those portions requiring a much pattern area, such as power source and GND parts with respect to the miniaturizing of the printed board. SOLUTION: Surface layer 2 and inner layers 3 of a multilayer printed board 1 are undulated for corrugated. In order not to reduce the thickness, even if the printed board 1 is miniaturized, the peeling of component soldering pads is prevented and physical area of Cu foils is increased, whereby a printed board is obtained, the GND and power source layer of which can be strengthened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board which improves the electrical characteristics of the printed circuit board and increases the physical area of the copper foil.

[0002]

2. Description of the Related Art Generally, a printed circuit board is formed by forming a surface layer and an inner layer in a plate shape, and pressing the surface layer with an insulator interposed therebetween to form a multilayer printed circuit board. In the design of an ordinary circuit pattern, a pattern for a power supply, a GND, or a signal through which a large amount of current flows is provided with measures such as increasing the pattern width or increasing the thickness of a copper foil. In general, a GND or a power source is provided in the inner layer, and a large area of the copper foil is secured by connecting the GND or the power source, thereby improving the electrical characteristics and satisfying the measures against static electricity.

[0003]

However, in recent years, products have tended to be more and more miniaturized. In the above-mentioned conventional method, high-density mounting has been achieved with miniaturization of products, and the size of substrates has also been reduced. There has been a problem that the area of a portion requiring a large amount of pattern area is greatly reduced, which affects electrical characteristics and measures against static electricity.

For this reason, at present, the area of the pseudo GND is increased by using a metal such as a shield case to strengthen the GND and take measures against static electricity. Also, the pattern width has become thinner due to the higher density, and the thickness of the printed circuit board has also become thinner.Thus, the thickness of the copper foil is thin on the surface layer, and the pads for soldering the parts are peeled off when replacing chip parts There was a problem of doing it.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. By making the inner layer and the surface layer of a printed circuit board uneven, a portion requiring a large number of pattern areas such as a power supply and GND is required. It is an object of the present invention to provide a printed circuit board having an increased area and reinforced component soldering pads.

[0006]

The printed circuit board according to the present invention is a multilayer printed circuit board in which the surface layer and the inner layer are corrugated or uneven. According to the present invention, even if the printed circuit board is miniaturized, the thickness is not reduced so that the soldering pads for the components are prevented from peeling, the physical area of the copper foil is increased, and the GND and the power supply layer are strengthened. A printed board that can be obtained is obtained.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is such that the shape of an inner layer of a printed circuit board is formed into a corrugated shape. Has the effect of improving the electrical characteristics of

According to a second aspect of the present invention, the shape of the inner layer of the printed circuit board is made uneven, and by increasing the copper foil area of the inner layer, the GND is increased.
And the function of improving the electrical characteristics of the power supply layer.

According to a third aspect of the present invention, the inner layer of the multilayer printed circuit board has an uneven shape or a corrugated shape.
The copper foil area is increased, and by increasing the copper foil area of the inner layer, it has the effect of strengthening the GND and the power supply layer and improving its electrical characteristics.

According to a fourth aspect of the present invention, a printed circuit board is provided with a plurality of inner layers having a concave-convex shape or a corrugated shape so as to engage with each other. It has the effect of improving measures against static electricity.

The invention according to claim 5 of the present invention is such that a capacitor is formed by the intermeshing inner or outer layers having a corrugated shape or a wavy shape. Can be reduced.

According to a sixth aspect of the present invention, the insulating layer side of the surface layer of the printed circuit board is formed to have an uneven shape or a corrugated shape, and the ability to radiate heat generated in the printed circuit board is improved. It has the action of:

According to a seventh aspect of the present invention, a multilayer printed circuit board is provided with a plurality of corrugated inner layers and arranged so as to intersect each other. It has the effect of being able to.

According to an eighth aspect of the present invention, the surface of the insulating layer of the printed circuit board is made uneven or corrugated along with the inner layer of the printed circuit board. Forming the irregular shape or the corrugated shape has an effect of preventing peeling of a pad for soldering components.

Hereinafter, based on the attached drawings and FIGS. 1 to 5,
An embodiment of the present invention will be described in detail. Embodiment 1 First, a printed circuit board according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 1 denotes a printed board as a multilayer printed board, 2 denotes a surface layer on which circuit elements such as chip components are mounted, and 3 denotes an inner layer formed in a wave shape.

In FIG. 1, only the inner layer 3 is shown in a wavy shape.
The copper foil area of the surface layer and the inner layer can be increased. By changing the shape of the surface layer and the inner layer from a normal plate shape to a waveform as shown in FIG. 1, the copper foil area of the surface layer and the inner layer depends on the height of the waveform shape and the thickness of the substrate itself. Since the pattern area can be made larger than that of the copper foil, electric characteristics can be improved. The printed circuit board 1 shown in FIG. 1 is formed by stacking two inner layers 2 of a corrugated shape and inserting an insulator between them to engage with each other. Thus, the improvement of the electrostatic characteristics is realized. be able to.

(Embodiment 2) Next, referring to FIG.
A printed circuit board according to Embodiment 2 of the present invention will be described. FIG. 2 is an exploded perspective view illustrating a configuration of a printed circuit board according to Embodiment 2 of the present invention. In FIG. 2, reference numeral 1 denotes a printed board as a multilayer printed board, 2 denotes a surface layer on which circuit elements such as chip components are mounted, and 4 denotes an inner layer formed in an uneven shape.

In the second embodiment, the inner layer 4
The shape of the inner layer 4 is changed from an ordinary flat plate to an uneven shape as shown in FIG. 2, so that the copper foil area of the inner layer 4 depends on the height of the uneven shape and the thickness of the substrate itself. Since the pattern area can be made larger than that of the copper foil, electric characteristics can be improved. The printed board 1 shown in FIG. 2 is configured by stacking two uneven inner layers 4,
During this time, an insulator is inserted and engaged with each other, so that the measures against static electricity can be improved. In the first and second embodiments, two inner layers 3 and 4 having the same corrugated shape or uneven shape have been described. However, the inner layer 3 having the corrugated shape and the inner layer 4 having the uneven shape are overlapped. May be configured.

(Embodiment 3) Next, referring to FIG.
A printed circuit board according to Embodiment 3 of the present invention will be described. FIG. 3 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 3 of the present invention. In FIG. 3, reference numeral 1 denotes a printed board as a multilayer printed board, 2 denotes a surface layer on which circuit elements such as chip components are mounted, and 5 denotes an inner layer formed into two corrugated shapes.

The printed circuit board according to the third embodiment includes:
As shown in FIG. 3, two corrugated surface layers 5 cross each other. With this configuration, the warpage of the printed board 1 can be prevented, and the strength of the printed board 1 can be improved. Although FIG. 3 shows only the inner layer 5 in a waveform, both the surface layer 2 and the inner layer 5 have a waveform.
Copper foil area can be increased.

In this way, by changing the shape of the surface layer 2 and the inner layer 5 from a normal plate shape to a waveform as shown in FIG. 3, the copper foil area of the surface layer 2 and the inner layer 5 becomes higher than that of the waveform. Although it depends on the thickness of the substrate and the thickness of the substrate itself, the pattern area can be increased as compared with the flat copper foil, so that the electrical characteristics can be improved. Although FIG. 3 shows a configuration in which the corrugated inner layer 5 is crossed, it may be configured in such a manner that the uneven inner layer 4 as shown in FIG. 2 is crossed.

(Embodiment 4) Next, a printed circuit board according to Embodiment 4 of the present invention will be described with reference to FIGS. 4 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 4 of the present invention, FIG. 5 is a view showing another effect of the printed circuit board shown in FIG. 4, (A) is a perspective view of the printed circuit board, FIG. 3B is a partially enlarged view of a portion A. FIG.
1 is a printed circuit board as a multilayer printed circuit board, 6 is a surface layer on which circuit elements such as chip components are mounted, 4 is 2
Reference numeral 7 denotes an insulator formed between the two concavo-convex inner layers 4.

As shown in FIG. 4, the surface layer 6 in the fourth embodiment has an irregular shape on the back side of the insulating layer. When the surface layer 6 has such a shape, the thermal conductivity of the component soldering pad is improved, so that the pad is hardly peeled off and the heat radiation effect can be improved.

In the fourth embodiment, as shown in detail in FIG. 5 (the same applies to FIGS. 2 and 4), two copper foil inner layers 4 (for example, GND and a power supply layer) are interposed between them. The insulator 7 is inserted into the
As shown in FIG. 5B, a capacitor component is formed between the inner layers 4 of the two copper foils, so that noise can be removed and reduced.

[0025]

According to the present invention, the surface layer and the inner layer of the printed circuit board are formed in a corrugated or irregular shape, particularly when the printed circuit board is miniaturized. Since the area can be increased and the pattern area of the inner layer GND and the power supply layer can be increased, the pattern can be strengthened and the electrical characteristics can be improved.

According to the present invention, in particular, by making the surface of the insulating layer side of the surface layer uneven or corrugated, the area of the surface layer is increased, the thermal conductivity is improved, and the heat radiation effect is improved.
The peeling of the component soldering pad which occurs at the time of component soldering can be prevented.

According to the present invention, in particular, by forming two layers of uneven or corrugated inner layers on top of each other and inserting an insulator between them to engage with each other, even if the printed circuit board is downsized, the copper of the surface layer and the inner layer can be reduced. As the area of the foil increases, the electrical characteristics of the printed circuit board itself can be improved, the electrostatic characteristics can be improved, and noise can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 1 of the present invention;

FIG. 2 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 2 of the present invention;

FIG. 3 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 3 of the present invention;

FIG. 4 is an exploded perspective view showing a configuration of a printed circuit board according to Embodiment 4 of the present invention;

5A and 5B are diagrams showing another effect of the printed circuit board shown in FIG. 4, wherein FIG. 5A is a perspective view of the printed circuit board, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Surface layer 3 Inner layer 4 Inner layer 5 Inner layer 6 Surface layer 7 Insulator

Claims (8)

[Claims] 1. A printed circuit board, wherein an inner layer of the printed circuit board has a corrugated shape. 2. A printed circuit board, wherein the inner layer of the printed circuit board has an uneven shape. 3. A printed circuit board wherein the inner layer of the multi-layer printed circuit board is made uneven or corrugated to increase the copper foil area. 4. A printed circuit board comprising a plurality of uneven layers or corrugated inner layers on a printed circuit board so as to engage with each other. 5. The printed circuit board according to claim 4, wherein the capacitor is formed by the engaged inner and concave inner layers or corrugated inner layers. 6. A printed circuit board characterized in that the surface of the printed circuit board on the side of the insulating layer is made uneven or corrugated. 7. A printed circuit board comprising a multilayer printed circuit board having a plurality of corrugated inner layers and arranged so as to intersect each other. 8. A printed circuit board characterized in that the insulating layer side of the surface layer is made uneven or corrugated along with the inner layer of the printed circuit board.