JPH11330198A - Substrate carrying equipment and substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide substrate carrying equipment which is able to restrain further the generation of dust as compared with the conventional one and manufacturing cost reduction or the like is enabled by simplifying mechanism such as positioning mechanism. SOLUTION: Step parts 2a, 2b, 2c as anchoring parts for anchoring the peripheral part of a wafer W are formed on the tip side upper surface of a forceps 2. The step parts 2b, 2c formed on rear end side of the forceps 2 are constituted as two steps, so as to form two anchoring surfaces for anchoring the peripheral part of the wafer W. The step part 2b is so constituted as to have sufficient clearance to the diameter of the wafer, in order to absorve the dispersion of positions of wafers and be able to anchor the wafer. The step part 2c is so constituted as to be able to retain the wafer in the state that it is precisely positioned almost without looseness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus for transferring a substrate such as a semiconductor wafer or an LCD substrate and a substrate processing apparatus provided with the substrate transfer apparatus.

[0002]

2. Description of the Related Art Conventionally, for example, in a semiconductor device manufacturing process or an LCD manufacturing process, a substrate transfer device for transferring a semiconductor wafer or an LCD substrate as a substrate from a desired position to a desired position has been used.

For example, in a photolithography step in a semiconductor device manufacturing process, a resist coating process for forming a resist film on the surface of a semiconductor wafer, and an exposure process for the semiconductor wafer after the resist coating are performed, and then the semiconductor wafer The resist coating process and the developing process are conventionally performed by a corresponding one of various processing units as well known in, for example, Japanese Patent Publication No. 2-30194.
In a complex processing system provided in one of the systems, the exposure is performed according to a predetermined sequence with the exposure process interposed.

In such an apparatus, a substrate transfer apparatus is used, for example, when taking out a semiconductor wafer from a wafer cassette and transferring it to a desired position.

[0005] As a conventional substrate transfer device, for example, a substrate transfer device for transferring a central portion of the back surface of a semiconductor wafer by suction and holding it with a vacuum chuck or the like is known.

However, in such a substrate transfer device, since the support member of the substrate transfer device contacts the central portion of the back surface of the semiconductor wafer, there is a possibility that dust (particles) adheres to the central portion of the back surface of the semiconductor wafer. Get higher. However, for example, in an exposure step of exposing a predetermined circuit pattern to a semiconductor wafer, if particles are attached to the center of the back surface of the semiconductor wafer, the distance between the lens and the surface of the semiconductor wafer during exposure is slightly changed. As a result, the circuit pattern cannot be accurately transferred.

For this reason, for example, in an apparatus for performing a resist coating or the like which is a step before the exposure step, a substrate transfer apparatus configured to support and transfer the peripheral edge of the back surface of the semiconductor wafer is also used.

[0008]

However, in the case of using a conventional substrate transfer device configured to support and transfer the peripheral edge of the back surface of the semiconductor wafer, for example, the removal of the semiconductor wafer from the wafer cassette is performed. In the substrate transfer apparatus, the position of the semiconductor wafer in the wafer cassette is shifted to some extent. Therefore, in order to be able to support the semiconductor wafer having such a position shift, the semiconductor wafer positioning mechanism of the wafer support unit has a certain degree of displacement. Clearance is provided. For this reason, the semiconductor wafer moves during the transfer, and the semiconductor wafer and the support member rub against each other to generate dust. Also, when the semiconductor wafer is transferred to another transfer mechanism or the like, the semiconductor wafer is transferred on the transferred side. Has to be performed.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and the generation of dust can be further suppressed as compared with the related art, and the manufacturing cost can be reduced by simplifying the mechanism such as a positioning mechanism. It is an object of the present invention to provide a substrate transport apparatus and a substrate processing apparatus capable of reducing the number of substrates.

[0010]

In order to achieve the above-mentioned object, a first aspect of the present invention is to allow insertion into a lower side of a substrate held by a substrate holding mechanism, and to lock a peripheral edge of a lower surface of the substrate. A substrate supporting member capable of supporting the substrate, and inserting the substrate supporting member below the substrate, supporting the substrate by the substrate supporting member, and then withdrawing the substrate supporting member, thereby obtaining the substrate. And a driving mechanism capable of being transported to a part, wherein the substrate support member has a positioning step at a locking portion for locking the substrate, and the positioning The step portion is formed at least one step at the front end side and at least two steps at the rear end side of the substrate support member, coarsely positions the substrate by a high step portion on the rear end side, and finely defines the substrate by a low step portion on the rear end side. Characterized to be configured to position To.

According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, when the substrate supporting member is moved toward the rear end by the driving mechanism, the substrate is higher than the rear end. The fine positioning of the substrate is performed by moving from the step to the lower step.

According to a third aspect of the present invention, in the substrate transfer apparatus according to the second aspect, when the driving mechanism moves the substrate support member toward a rear end, the substrate is disposed at a predetermined position. In this method, the substrate is moved from the high step portion on the rear end side to the low step portion by contacting the positioning member, and the fine positioning of the substrate is performed.

According to a fourth aspect of the present invention, in the substrate transfer apparatus according to any one of the first to third aspects, the positioning step includes an end on the front end side and a low step on the rear end side. Are provided at substantially the same height position.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus comprising: the substrate transfer apparatus according to any one of the first to fourth aspects; and a processing unit for processing the substrate.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 6 show a schematic configuration of a substrate transfer apparatus according to an embodiment of the present invention.
1 shows a wafer coating and developing processing system in which the substrate transfer device is arranged.

As shown in FIGS. 1 to 4, the substrate transfer apparatus 1 includes tweezers 2 as a support member for supporting a semiconductor wafer (hereinafter, referred to as a wafer) W. The tweezers 2 are formed in a thin plate shape so that they can be inserted into a wafer cassette CR accommodating a plurality of wafers W, and are supported on a transfer base 4 via a support member 3.

The transport base 4 is provided with a drive mechanism (not shown).
Is moved in the longitudinal direction (the left-right direction (Y direction) in FIGS. 1 to 4) with respect to the transfer base 4, and the tweezers 2 are inserted (and pulled out) into the wafer cassette CR as shown in FIGS. It is configured to be able to.

Further, as shown in FIG. 4, the transport base 4 is
The lifting rod 5 is provided on a lifting rod 5, and is configured to be movable in the Z direction (vertical direction), the X direction (horizontal direction), and rotatable by θ by a driving mechanism (not shown). The wafer W is supported and transported on the wafer 2.

Further, steps 2a, 2b, 2c are provided on the upper surface of the tip end of the tweezers 2 as locking portions for locking the peripheral portion of the wafer W. Of these steps, the step 2a is provided on the tip side of the tweezers 2 and has a single-step configuration so that only one locking surface for locking the peripheral edge of the wafer W is formed. I have. On the other hand, the step portions 2b and 2c are provided on the rear end side of the tweezers 2 and have a two-stage structure so as to form two locking surfaces for locking the peripheral portion of the wafer W. I have.

As shown in FIGS. 5 and 6, of these steps, the step 2a and the step 2c are configured to have substantially the same height, and the step 2b has a higher height. It is configured to be in the position. Therefore, when the wafer is supported by the step 2a and the step 2b, the wafer W is slightly inclined, and when the wafer is supported by the step 2a and the step 2c, the wafer W is substantially horizontal (step). The portion 2c is tapered to be slightly lower). Note that the tip side where the step portion 2a is formed is connected to the step portions 2b and 2
It is configured to be thinner than the rear end side where c is formed, thereby making it difficult to interfere with the lower wafer W in the wafer cassette CR.

When inserting and removing the tweezers 2 from the wafer cassette CR, the substrate transfer apparatus 1 having the above structure first raises the tweezers 2 as shown in FIGS. The wafer W is locked in a state where the wafer W is roughly positioned between the step 2a and the step 2b.
As shown in (1), the operation of pulling out the tweezers 2 from the wafer cassette CR drops the wafer W into the stepped portion 2c by inertia, and transports the wafer W in a state of fine positioning. Note that the corner of the step 2b on the side of the step 2c is smoothly rounded so that the wafer W reliably falls from the step 2b to the step 2c by the inertia due to the operation when the tweezers 2 is pulled out from the wafer cassette CR. The shape is attached.

That is, the positions of the wafers W in the wafer cassette CR are not precisely positioned, but vary to some extent due to the clearances and the like of the wafer support grooves formed in the wafer cassette CR. It is housed in a state where there is. Therefore, of the steps 2b and 2c provided on the rear end side of the tweezers 2, the step 2b
Is for absorbing the variation in the position and enabling the wafer W to be locked, and has a configuration in which a sufficient clearance is provided for the diameter of the wafer W, as in the conventional apparatus. .

The step 2c provided at a position lower than the step 2b is capable of supporting the wafer W with almost no play, and in a state where the wafer W is finely positioned by the step 2c, The wafer W can be transferred and transferred to another transfer mechanism.

As described above, according to this embodiment, the wafer W is conveyed in a state where the wafer W is finely positioned and hardly rattled while holding the peripheral edge of the back surface of the wafer W. Further, as shown in FIG. Since the wafer W is transported in a slightly inclined state (a state in which the step 2c is slightly lowered), the contact area between the wafer W and the tweezers 2 is reduced as compared with the conventional case. Therefore, it is possible to prevent the wafer W from being rubbed with the tweezers 2 while the wafer W is being transported and generating dust. Further, when the wafer W is transferred to another transfer mechanism or the like, there is no need to perform positioning on the transferred side, so that there is no need to provide a positioning mechanism and the like, thereby simplifying the mechanism and reducing the manufacturing cost. Can be reduced.

Next, a description will be given of a wafer coating / developing system using the substrate transfer apparatus 1 having the above configuration.

FIGS. 7 to 9 show the overall structure of a wafer coating and developing processing system. FIG. 7 shows a plan view, FIG. 8 shows a front view, and FIG. 9 shows a rear view.

As shown in these figures, the coating and developing system comprises a wafer cassette CR containing a plurality of wafers W.
Can be loaded / unloaded from / to the outside, and the wafer cassette CR
A cassette station 10 for loading and unloading wafers W from and a processing station configured by arranging various single-wafer processing units for performing predetermined processing on the wafers W one by one in a vertically and horizontally multistage manner. 11 and an interface unit 12 for transferring a wafer W to and from an external exposure apparatus (not shown).

In the cassette station 10, as shown in FIG. 7, a plurality of wafer cassettes C, for example, up to four wafer cassettes C are provided at respective cassette positioning portions 20a on the cassette mounting table 20.
R are placed in a line in the X direction with the respective wafer entrances facing the processing station 11 side.
With respect to R, the wafer transfer operation of the wafer W is performed by the substrate transfer device 1.

As described above, the tweezers 2 of the substrate transfer device 1 are movable in the Y direction, and the transfer base 4 on which the tweezers 2 are provided is moved in the X and Z directions.
The wafer W can be moved in the direction (the direction of arranging wafers in the wafer cassette CR; the vertical direction) and can be freely rotated in the θ direction to transfer the wafer W to the wafer carrier 22 on the processing station 11 side. It is configured to be able to.

The wafer carrier 2 in the processing station 11
Numeral 2 is configured to be movable in the Y direction between the cassette station 10 and the interface unit 12, and to be able to move up and down in the Z direction (vertical direction) and to be rotatable in the θ direction.

Each of the processing units in the processing station 11 is divided into two parts with the transfer path of the wafer transfer body 22 interposed therebetween. Here, when a set of processing units for one row in the upper and lower rows is referred to as one processing unit group, each processing unit in the processing station 11 includes, for example, eight processing unit groups G ₁ , G ₂ , G ₃ , G ₄ , G _5. , G ₆ , G ₇ , and G ₈ , and the second, fourth, sixth, and eighth processing unit groups G ₂ , G ₄ , G ₆ , and G ₈ are, for example, as shown in FIG. The first, third, fifth, and seventh processing unit groups G ₁ , G ₃ , G ₅ , and G ₇ are arranged on the front side of the system, and are arranged, for example, on the back side of the system as shown in FIG. I have.

As shown in FIG. 8, the second, fourth, sixth and eighth processing unit groups G ₂ , G ₄ , G ₆ , G ₈ are respectively
A resist coating unit (COT) stacked in two stages
And a developing unit (DEV).

As shown in FIG. 9, the first processing unit group G ₁ includes a cooling unit (COL) for cooling the wafer W, an alignment unit (ALIM) for positioning the wafer W, and an exposure process. A pre-baking unit (PRE) for performing a heating process on the previous wafer W
BAKE) and a post-baking unit (POBAKE) for performing a heating process on the wafer W after the exposure process.
They are arranged in order from the bottom.

Further, the third processing unit G ₃ includes a cooling unit (COL) for performing a cooling process on the wafer W,
An adhesion unit (A) for performing a hydrophobic treatment for improving the fixability of the resist solution applied to the surface of the wafer W
D), a pre-baking unit (PREBAKE) for performing a heating process on the wafer W before the exposure process and a post-baking unit (POBAKE) for performing a heating process on the wafer W after the exposure process are provided in order from the bottom. Have been.

Fifth and seventh processing units G ₅ , G
Reference numeral ₇ denotes a cooling unit (COL) for performing a cooling process on the wafer W, an extension cooling unit (EXTCOL), and a prebaking unit (PREBAKE) for performing a heating process on the wafer W before the exposure process.
Further, post-baking units (POBAKE) for performing a heating process on the wafer W after the exposure process are arranged in order from the bottom.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged at the lower stage, and the pre-baking unit (PREBAKE), the post-baking unit (POBAKE) and the ad-hoc unit having a high processing temperature are arranged. By arranging the John units (AD) in the upper stage, thermal mutual interference between the units can be reduced.

The interface section 12 includes a portable pickup cassette CR, a stationary buffer cassette B
R, a peripheral exposure device 23, and a wafer carrier 24 are provided. The wafer carrier 24 moves in the X direction and the Z direction to perform an operation of transferring the wafer W to the cassettes CR and BR and the peripheral exposure device 23. The wafer transfer body 24 is also rotatable in the θ direction, and transfers the wafer W between the wafer transfer body 22 on the processing station 11 side and a wafer transfer table (not shown) on the external exposure apparatus side. Is configured to do so.

The developing unit (DEV) includes, in a processing container, a spin chuck configured to rotate while holding the wafer W horizontally by vacuum suction, and surrounds the outer and lower sides of the spin chuck and forms a bottom portion. And a developing solution supply nozzle for discharging the developing solution onto the surface of the wafer W held on the spin chuck.

Further, a resist coating unit (COT)
A spin chuck configured to rotate while holding the wafer W horizontally by vacuum suction in a processing container, and a drain port and an exhaust port at the bottom surrounding the outer and lower sides of the spin chuck. It comprises a cup provided, a resist liquid supply nozzle for discharging the resist liquid onto the surface of the wafer W held on the spin chuck, and the like.

Next, the flow of processing of the wafer W by this coating and developing system will be described.

First, at the cassette station 10,
The substrate transfer apparatus 1 accesses the cassette CR on the cassette mounting table 20 that stores the unprocessed wafers W, and takes out one wafer W from the cassette CR. afterwards,
The substrate transfer device 1 transfers the wafer W to the wafer transfer body 22 on the processing station 11 side. Wafer carrier 22
Moves to the first processing unit group G ₁ of the alignment unit (ALIM), to transfer the wafer W into the alignment unit (ALIM).

When the alignment unit (ALIM) completes the alignment and centering of the wafer W, the wafer carrier 22 receives the aligned wafer W, and the adhesion unit (3) of the third processing unit group G _3. AD), the wafer W is carried in, and a hydrophobic treatment is performed.

The wafer W that has been subjected to the hydrophobizing process is then carried into a predetermined prebaking unit (PREBAKE) by the wafer carrier 22 and baked.
It is carried into a predetermined cooling unit (COL). In the cooling unit (COL), the wafer W is cooled to a set temperature before the resist coating processing, for example, 23 ° C.
When the cooling process is completed, the wafer W is transferred to the wafer carrier 22
Then, the wafer W is carried into a predetermined resist coating unit (COT), and the resist coating on the surface of the wafer W is performed in the resist coating unit (COT).

When the resist coating process is completed, the wafer carrier 22 transfers the wafer W to a resist coating unit (COT).
From the pre-baking unit (PRE)
BAKE). Here, the wafer W is heated at a predetermined temperature, for example, 100 ° C. for a predetermined time.
The remaining solvent is removed by evaporation from the upper coating film.

Thereafter, the wafer W is transferred to the extension / cooling unit (@TC
OL). Here, the wafer W is cooled to a temperature suitable for the next step, ie, the peripheral exposure processing by the peripheral exposure device 23, for example, 24 ° C. Thereafter, the wafer carrier 22
Represents the wafer W in the wafer carrier 2 of the interface unit 12
Hand over to 4. The wafer carrier 24 carries the wafer W into the peripheral exposure device 23 in the interface unit 12.
Here, the wafer W is subjected to an exposure process on its peripheral portion.

When the peripheral exposure process is completed, the wafer carrier 24 carries out the wafer W from the peripheral exposure device 23 and transfers it to a wafer receiving table (not shown) on the adjacent exposure device side. In this case, before the wafer W is transferred to the exposure apparatus,
It may be temporarily stored in the buffer cassette BR as needed.

Thereafter, exposure using a reticle is performed by an exposure apparatus (stepper). When exposure processing on the entire surface of the wafer W in the exposure apparatus is completed and the wafer W is returned to the wafer receiving table on the exposure apparatus side, the interface unit 1
The second wafer carrier 24 accesses the wafer receiving table, receives the wafer W after the exposure processing, and is delivered to the wafer carrier 22 on the processing station 11 side. In this case, the wafer W may be temporarily stored in the buffer cassette BR in the interface unit 12 as necessary before being transferred to the processing station 11 side.

The wafer carrier 22 receives the wafer W
Into a predetermined post-baking unit (POBAKE). This post baking unit (POBAK
In E), the wafer W is placed on the hot plate 52 and baked for a predetermined time.

Thereafter, the baked wafer W is carried into one of the cooling units (COL) by the wafer carrier 22, and the cooling unit (CO)
The wafer W is returned to normal temperature in L). Subsequently, the wafer W
Is a predetermined developing unit (DE) by the wafer carrier 22.
V).

In the developing unit (DEV), the wafer W is placed on a spin chuck, and a developing solution is uniformly applied to a resist on the surface of the wafer W by, for example, a spray method to perform development. After the development, a rinsing liquid is applied to the surface of the wafer W, and the developing liquid is washed off.
Thereafter, the wafer W is rotated at a high speed to perform drying.

Thereafter, the wafer carrier 22 carries out the wafer W from the developing unit (DEV), and then carries the wafer W again into a predetermined post-baking unit (POBAK #). This post baking unit (POBA
In KE), the wafer W is heated, for example, at 100 ° C. for a predetermined time, whereby the resist swollen by development is hardened, and the chemical resistance is improved.

When the post-baking is completed, the wafer carrier 22 carries the wafer W out of the post-baking unit, and then carries the wafer W into a predetermined cooling unit (COL) to perform a cooling process.

After the temperature of the wafer W has returned to room temperature, the wafer carrier 22 transfers the wafer W to the substrate carrier 1 on the cassette station 10 side, and the substrate carrier 1 transfers the received wafer W to the cassette mounting table 20. The wafer is inserted into a predetermined wafer accommodating groove of the cassette CR for accommodating the processed wafer.

According to the coating and developing system having the above-described configuration, the wafer W is transferred from the cassette CR to
When the wafer W is taken out and when the wafer W is accommodated in the cassette CR, the wafer W can be transported in a finely positioned state with almost no play, and the wafer W is transported in a slightly inclined state. Since the contact area between the W and the tweezers 2 is reduced as compared with the related art, it is possible to prevent the wafer W and the tweezers 2 from being rubbed during the transfer of the wafer W to generate dust. Further, when the wafer W is transferred to the wafer carrier 22, there is no need to position the wafer W on the side of the wafer carrier 22, so that there is no need to provide a positioning mechanism or the like. Reduction can be achieved.

Next, another embodiment will be described with reference to FIGS. In the substrate transfer apparatus 1a shown in these figures, the transfer base 4 is provided with an abutment member 7, and the wafer W in the cassette CR is
When the tweezers 2 are returned to the home position on the transfer base 4, the wafer W is brought into contact with the inside of the contact member 7, whereby the wafer W is moved from the step 2b to the step 2c.
It is configured to be dropped into. Since the other parts are configured in the same manner as the above-described substrate transfer device 1, the same parts are denoted by the same reference numerals, and redundant description will be omitted.

In the substrate transfer apparatus 1a having the above structure,
The same effect as that of the above-described substrate transfer apparatus 1 can be achieved, and the wafer W can be accurately and precisely positioned only by adding the contact member 7 having a simple structure.

The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical concept. In the above-described example, an apparatus for applying and developing a resist liquid on the surface of a semiconductor wafer has been described. However, the present invention is similarly applied to an apparatus for applying and developing a resist liquid on a surface of an LCD substrate or the like. Of course you can.

[0059]

As described above, according to the present invention, it is possible to further suppress the generation of dust as compared with the related art, and to reduce the manufacturing cost by simplifying the mechanisms such as the positioning mechanism. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of a substrate transfer device according to an embodiment of the present invention.

FIG. 2 is a side view of the embodiment of FIG.

FIG. 3 is a plan view showing a state in which the tweezers of the embodiment of FIG. 1 is contracted;

FIG. 4 is a side view of the state shown in FIG. 3;

FIG. 5 is an enlarged side view showing the state of the wafer of FIG. 1;

FIG. 6 is an enlarged side view showing a state of the wafer of FIG. 3;

FIG. 7 is a plan view of a coating and developing processing system provided with the substrate transfer device of FIG. 1;

FIG. 8 is a front view of the coating and developing system shown in FIG. 7;

FIG. 9 is a rear view of the coating and developing system shown in FIG. 7;

FIG. 10 is a plan view illustrating a configuration of a substrate transfer apparatus according to another embodiment of the present invention.

FIG. 11 is a side view of the embodiment of FIG.

[Explanation of symbols]

 W: semiconductor wafer (substrate) CR: wafer cassette 1: substrate transfer device 2: tweezers (substrate support member) 2a: step (top end) 2b: step (back end ( 2c: Step (rear end side (for fine positioning)) 3: Support member 4: Transfer base

Claims (5)

[Claims] A substrate support member that can be inserted below a substrate held by a substrate holding mechanism, and that can support the substrate by locking a peripheral edge of a lower surface of the substrate; A substrate transport device comprising a drive mechanism that is inserted below the substrate, pulls out the substrate support member after supporting the substrate by the substrate support member, and is capable of transporting the substrate to a desired site. The substrate supporting member has a positioning step on the locking portion for locking the substrate, and the positioning step is one step on the front end side and two steps on the rear end side of the substrate supporting member. A substrate transport apparatus formed at least and configured to roughly position the substrate by a high step portion on a rear end side and to finely position the substrate by a low step portion on a rear end side. 2. The substrate transfer device according to claim 1, wherein when the drive mechanism moves the substrate support member toward a rear end, the substrate moves from a high step on the rear end to a low step. Wherein the substrate is moved to a position where fine positioning of the substrate is performed. 3. The positioning member according to claim 2, wherein the substrate is disposed at a predetermined position when the driving mechanism moves the substrate support member toward a rear end side. Wherein the substrate is moved from the high step portion on the rear end side to the low step portion to perform fine positioning of the substrate. 4. The substrate transfer device according to claim 1, wherein the positioning step has a substantially same height as that of the end on the front end side and the low step on the rear end side. A substrate transfer device provided at a position. 5. A substrate processing apparatus comprising: the substrate transfer device according to claim 1; and a processing unit that processes the substrate.