JPH11330166A - Manufacturing device of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform attachment by a TAB tape, a stiffener and structure without void and to prevent the peeling of the stiffener from the TAB tape in the manufacturizing process, by inclining the TAB tape and slowly performing the bonding toward the other end surface from one end surface of the stiffener. SOLUTION: A stiffener 2 lifts up a drag 11, whose position is determined and fixed, and a cope 21 is lowered by a cope driving part 23. Then, a plate spring 41 pushes a TAB tape 1, which is inclined in the right rising pattern and continues the descent. The TAB tape 1 is bonded to one end surface of the stiffener 2 at the lowest point (b). Then, under the state where the TAB tape is inclined, suitable tension is applied on the plate spring 41 from one end surface of the already bonded stiffener 2 to the other end surface. Thus, the TAB tape 1 can be temporarily bonded on the stiffener 2 without involving air at the part with the stiffener 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a TBGA (Tape Ball Gr.)
id Array) related to a package manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, BGA using TAB tape
Packages (hereinafter abbreviated as TBGA packages) have been developed and put to practical use. FIG. 4 shows a conventional T
1 shows a schematic configuration of a metal plate attaching mechanism section of a manufacturing apparatus used for manufacturing a BGA package.

That is, in the case of a TBGA package, T
In order to maintain the flatness of the AB tape, a metal plate (stiffener) is bonded to the surface of the TAB tape.
For example, as shown in FIG. 1A, a lower mold 10 is provided below the TAB tape 1 so as to be able to ascend in the direction of the arrow shown in FIG.
1 and an upper die 103 provided on the upper part of the TAB tape 1 opposite to the lower die 101 so as to be operable to descend in the direction of the arrow along the guide portion 102.

In the pasting operation, the lower die XY
After the lower die 101 is moved by the table (not shown), the upper and lower surfaces of the TAB tape 1 fixed and positioned are sandwiched between the lower die 101 and the upper die 103, for example, as shown in FIG. At that time, for a certain time,
A load and heat are applied by the lower mold 101 and the upper mold 103, and the adhesive on the metal plate 2 is cured, whereby the metal plate 2 is attached to the TAB tape 1.

However, in the metal plate sticking mechanism having the above-described structure, it is difficult to control the parallelism between the lower die 101 and the upper die 103, and the rising position of the lower die 101 depends on the outer size of the metal plate 2. Has to be delicately controlled, and there is a problem that the work load increases.

In particular, air bubbles tend to be formed between the TAB tape 1 and the metal plate 2 during the sticking operation, which causes a reduction in the yield of products, and an urgent solution has been desired.

[0007]

SUMMARY OF THE INVENTION As described above, in the prior art, the TAB has been increased while increasing the workload.
There is a problem that air bubbles are easily generated between the tape and the metal plate, which causes a reduction in product yield.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device manufacturing apparatus capable of reducing the generation of air bubbles and significantly improving the product yield while suppressing a significant increase in the work load. .

[0009]

In order to achieve the above-mentioned object, a semiconductor device manufacturing apparatus according to the present invention comprises:
A lower mold for holding a metal plate to be attached to an AB (Tape Automated Bonding) tape in a positioned state, and a lower mold arranged to face the lower mold, and a uniform load is applied to the TAB tape and the metal plate. The upper die and the processing point between the upper die and the lower die are controlled so that the T
A transport mechanism for transporting the AB tape, and the TAB tape transported by the transport mechanism, before the lower press and the upper press of the metal plate, the TAB tape, the TAB tape of the metal plate And a temporary bonding portion for temporarily bonding from the end.

According to the semiconductor device manufacturing apparatus of the present invention, it is possible to prevent air from being trapped between the TAB tape and the metal plate during the sticking operation. This makes it possible to prevent the metal plate from peeling off from the TAB tape during the commercialization process.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows a configuration of a metal plate attaching mechanism of a manufacturing apparatus used for manufacturing a TBGA package according to an embodiment of the present invention.

That is, the metal plate attaching mechanism section includes, for example, a lower mold 11 for holding a stiffener (metal plate) 2 for positioning on a TAB tape 1 in a positioned state, and a lower mold 11 opposed to the lower mold 11. An upper die 2 which is disposed and whose parallelism is controlled so that a uniform load is applied to the TAB tape 1 and the stiffener 2.
1 and a processing point a between the upper mold 21 and the lower mold 11
The lower die 11 of a TAB tape feeder (transportation mechanism) 31 for transporting the TAB tape 1 with a predetermined inclination, and the stiffener 2 of the TAB tape 1 transported by the feeder 31. In addition, prior to the final pressing operation at the processing point a by the upper die 21, the TA
A leaf spring (temporary bonding portion) 41 for temporarily bonding the B tape 1 gradually from the end of the stiffener 2 is mainly configured.

The lower mold 11 has a heat source (not shown) for melting the adhesive applied on the stiffener 2, and at the time of the attaching operation, the lower mold driving unit 12 controls the processing point. a.

The upper die 21 is supported by an upper die holder 22, and is configured to be lowered to the processing point a by the upper die driving unit 23 during the sticking operation.

The upper die 21 is provided with an upper die holder 2.
The pressure unit (press unit) 24 attached to the second unit 2 is configured to apply a predetermined load during the sticking operation.

The TAB tape feeder 31 is provided with a drive shaft portion 32 provided to be vertically movable, and a pair of transport sprockets 33a, 33b supported by the drive shaft portion 32 and arranged before and after the processing point a. When,
In order to make the TAB tape 1 have a certain inclination, for example, a spring (elevating drive unit) 34 for positioning the transport sprocket 33b above the transport sprocket 33a with the transport sprocket 33a as a fulcrum, and the upper die 21 In accordance with the lowering operation, an arm (downward drive) 35 for lowering the transport sprocket 33b is provided.

The spring 34 is provided, for example, at one end of the drive shaft 32, and pulls down one end of the drive shaft 32 in the direction of the arrow as shown in FIG. The transport sprocket 33b provided on the side is lifted.

The arm portion 35 is provided, for example, at the other end of the drive shaft portion 32, and is brought into contact with the upper die holder portion 22 at the time of the sticking operation.
With the lowering operation of the upper die 21, the transport sprocket 33b is pushed down to almost the same position as the transport sprocket 33a.

The transport sprockets 33a, 33
b, press rollers 36a and 36b for holding the TAB tape 1 are provided. The leaf spring 41 has, for example, a flat cross-sectional shape, and is arranged between the upper die 21 and the TAB tape 1 so as to be substantially arc-shaped. Further, the leaf spring 41 is arranged such that the lowest point b is substantially the same as one end face of the stiffener 2 or is located outside the one end face.

In this case, one end of the leaf spring 41 (on the side of the conveying sprocket 33a) is attached to the upper holder 22 via a guide mechanism 42, and the other end (on the side of the conveying sprocket 33b) is connected to the upper holder. 22 directly attached. Then, the lowering operation of the guide mechanism 42 is restricted by the stopper 43 during the sticking operation, so that the leaf spring 41 does not go down beyond the processing point a.

Here, a brief description will be given of the outline of a TBGA package manufactured using a manufacturing apparatus having the metal plate attaching mechanism section. FIG. 2 shows the TBG
3 shows a basic configuration of the A package. In addition,
FIG. 2A is a plan view of the TBGA package, and FIG.
FIG. 3A is a sectional view taken along line bb in FIG. 3A, and FIG. 3C is a sectional view taken along line cc in FIG.

In the TBGA package, a stiffener 2 is adhered to the surface of the TAB tape 1 using an adhesive 3 in order to maintain the flatness of the TAB tape 1. The stiffener 2 is provided with a rectangular opening 2a. Semiconductor integrated circuit chip 4 housed in package
Is disposed in the opening 2a, and the TAB tape 1
Are electrically connected to the leads 5 provided in the PDP by a face-down method.

A square cover plate 6 is adhered to the entire surface of the stiffener 2 using an adhesive 7. The cover plate 6 is also adhered to the chip 4 via the adhesive 7.

By bonding the chip 4 to the cover plate 6 in this manner, the cover plate 6 is thermally coupled to the chip 4 and functions as a heat radiating plate for releasing the heat generated by the chip 4 to the outside.

On the other hand, a plurality of solder balls 8 are provided on the back surface of the TAB tape 1. The solder balls 8
Each is electrically connected to a lead 5 provided on the TAB tape 1 and functions as an external terminal of the chip 4.

On the back side of the TAB tape 1,
A potting resin 9 is provided for shielding each of the leads 5 for electrically connecting the TAB tape 1 and the chip 4 from the outside.

Next, referring to FIG. 3, the TAB tape 1 is formed by using the metal plate attaching mechanism having the above-described structure.
The operation at the time of attaching the stiffener 2 to the above will be described. First, in the state shown in FIG. 1, the lower die 11 on which the stiffener 2 is positioned and fixed is moved to the lower die driving unit 12.
As a result, the upper die 21 is lowered by the upper die driving unit 23. Then, following the lowering operation of the upper die 21, the upper die holder 22
The leaf spring 41 attached to the lowers.

As shown in FIG. 3 (a), for example, the leaf spring 41 keeps descending while pushing the TAB tape 1 tilted at the upper right, and the lower die 11 moving upward
At a position facing the upper stiffener 2, the TAB tape 1 is adhered to one end surface of the stiffener 2 at the lowest point b.

In this position, the lowering operation of the guide mechanism 42 is stopped by the stopper 43. This prevents the leaf spring 41 from being deformed such that the TAB tape 1 is pushed down below the processing point a, and further lowers the TAB tape 1 from the one end surface of the stiffener 2 to the other end surface. It is deformed so as to gradually adhere to the side.

At this time, the arm portion 35 of the drive shaft portion 32 is brought into contact with the upper die holder portion 22, and the lower position of the upper die 21 causes the position of the transport sprocket 33b to be pushed down.

As a result, for example, as shown in FIG. 3B, the TAB tape 1 is gradually approached to the stiffener 2 and the TAB tape 1 is
1, the TAB tape 1 is stuck on one surface of the stiffener 2.

In this manner, the TAB tape 1 is tilted so that an appropriate tension is applied by the leaf spring 41 from one end face to the other end face of the stiffener 2 already bonded, so that the stiffener 2 can be connected to the stiffener 2. The TAB tape 1 is temporarily bonded onto the stiffener 2 without entraining air therebetween.

At the processing point a, the above TA
In a state where the B tape 1 and the stiffener 2 are temporarily bonded, the B tape 1 and the stiffener 2 are sandwiched between the lower mold 11 and the upper mold 21 via the leaf spring 41, and a load by the pressing unit 24 and heat from a heat source are applied. Thereby, the stiffener 2 is completely press-bonded (thermo-compression-bonded) to the surface of the TAB tape 1.

According to the metal plate attaching mechanism having such a configuration, the TAB tape 1 and the stiffener 2 are
It becomes possible to attach by a void dress. For this reason, it is possible to make the stiffener 2 difficult to peel off from the TAB tape 1 in a commercialization process when a TBGA package is manufactured later.

As described above, it is possible to prevent the entrainment of air between the TAB tape and the stiffener during the sticking operation. That is, the TAB tape is inclined so that the TAB tape is gradually adhered from one end face to the other end face. This allows
Since the TAB tape and the stiffener can be attached by a voidless method, peeling of the stiffener from the TAB tape during the production process can be prevented. Therefore, it is possible to significantly improve the product yield without particularly increasing the work load.

In addition, since the temporary bonding operation is performed before the actual pressure bonding operation, it is possible to prevent the application of excessive tension, thereby achieving a more accurate bonding operation.

In the above-described embodiment,
Although the case where the cross-sectional shape of the leaf spring is a flat plate has been described as an example, the present invention is not limited to this. For example, a configuration in which a curved (arc-shaped) convex portion is provided below may be used.

As a method of temporarily bonding the TAB tape on the stiffener while tilting the TAB tape, as described above,
The present invention is not limited to the case where the tape is gradually attached from the TAB tape side located below. For example, after adhering the TAB tape to one end face of the stiffener, the other end face side is lifted from the one end face side to the other end side. It is good also as a method of pasting up. Of course, various modifications can be made without departing from the scope of the present invention.

[0039]

As described above in detail, according to the present invention, it is possible to manufacture a semiconductor device capable of reducing the generation of bubbles and greatly improving the product yield while suppressing a large increase in the work load. Equipment can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a metal plate attaching mechanism according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a basic configuration of a TBGA package similarly manufactured by using a manufacturing apparatus including the metal plate attaching mechanism.

FIG. 3 is a schematic configuration diagram of a metal plate attaching mechanism unit similarly illustrating an attaching operation.

FIG. 4 is shown to explain the prior art and its problems;
The schematic block diagram of a metal plate sticking mechanism part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... TAB tape 2 ... Stiffener 2a ... Opening 3,7 ... Adhesive 4 ... Semiconductor integrated circuit chip 5 ... Lead 6 ... Cover plate 8 ... Solder ball 9 ... Potting resin 11 ... Lower mold 12 ... Lower mold drive 21 Upper mold 22 ... Upper mold holder 23 ... Upper mold drive 24 ... Pressing unit 31 ... TAB tape feeder 32 ... Drive shaft 33a, 33b ... Conveying sprocket 34 ... Spring 35 ... Arm 36a, 36b ... Pressing roller 41 ... Leaf spring 42: Guide mechanism 43: Stopper a: Processing point b: Lowermost point

Claims (9)

[Claims] 1. A lower mold for holding a metal plate to be attached to a TAB (Tape Automated Bonding) tape in a positioned state, and a lower mold arranged to face the lower mold, and An upper die having a parallelism controlled so that a uniform load is applied thereto, and a transport mechanism for transporting the TAB tape with a predetermined inclination to a processing point between the upper die and the lower die. In order to temporarily temporarily adhere the TAB tape from the end of the metal plate before the final pressing operation by the lower mold and the upper mold of the TAB tape conveyed by the conveyance mechanism unit with the metal plate. And a temporary bonding part. 2. The apparatus according to claim 1, wherein the lower mold has a heat source for melting an adhesive applied on the metal plate. 3. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the lower mold is configured to be moved up to the processing point by a lower mold driving unit. 4. The semiconductor device manufacturing apparatus according to claim 1, wherein the upper die is configured to be moved down to the processing point by an upper die driving unit. 5. The apparatus according to claim 1, wherein the upper die is configured to apply the load by a press unit. 6. The transport mechanism includes a pair of transport sprockets arranged before and after the processing point, and one transport sprocket and one transport sprocket for giving the TAB tape a constant inclination. 2. The semiconductor according to claim 1, further comprising: an ascending drive unit for positioning the upper sprocket, and a descending drive unit for descending the other transport sprocket with the descending operation of the upper die. 3. Equipment manufacturing equipment. 7. The temporary bonding part includes the upper mold and the T
It is arranged so that it becomes a substantially arc shape between the AB tapes,
2. The device according to claim 1, wherein the lowermost point is constituted by a leaf spring disposed so as to be substantially the same as one end face of the metal plate or to be outside the one end face. Equipment for manufacturing semiconductor devices. 8. The semiconductor device manufacturing apparatus according to claim 7, wherein the leaf spring is configured to have a flat or curved cross section. 9. The leaf spring is lowered with the lowering operation of the upper die, and a lowermost point of the leaf spring is in a state where one end of the TAB tape is in contact with one end of the metal plate. The lowering operation is stopped by the stopper, and the other end is further lowered to gradually abut the other end of the TAB tape toward the other end of the metal plate. 8. The apparatus according to claim 7, wherein the TAB tape is brought into contact with the entire surface of the metal plate.