JPH11326856A - Production of liquid crystal display device and apparatus for production therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the adhesion of splinter dust of substrates produced in respective working stages of liquid crystal display substrates to electronic circuit surfaces and the disconnection, gap defects and other characteristic defects and defects of working treatment and substrate/cell floating occurring therein. SOLUTION: A cap-like substrate fixing surface plate 1 having upwardly open recesses 2 in portions exclusive of peripheral edges is used and the peripheral edge of the transparent glass substrate SUB is brought into contact with the peripheral edge of this substrate 1 by downwardly directing its surface having laminated film forming parts 3. The substrate SUB is vacuum attracted and fixed by grooves 4a and holes 4b for vacuum suction and releasing, by which the laminated film forming parts 3 are arranged in the recesses 2 of the surface plate 1. The substrate is subjected to processing, such as scribing, cutting and chamfering, from its rear surface side in a state of covering the substrate with the surface plate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a liquid crystal display device having a liquid crystal display element, and more particularly to a technique for processing a liquid crystal display substrate such as scribe, cut, chamfer or corner cut. .

[0002]

2. Description of the Related Art A liquid crystal display device (ie, a liquid crystal display module) used as a display unit of a personal computer or a word processor.
For example, two transparent insulating substrates made of glass or the like are overlapped with a predetermined gap therebetween so that the surfaces on which a laminated film such as a transparent electrode for display or an alignment film is formed face each other. By the sealing material provided in the peripheral part in a frame shape (b-shaped),
A liquid crystal display element (hereinafter referred to as a liquid crystal display element) in which both substrates are bonded together, a liquid crystal is sealed inside a seal material between the two substrates from a liquid crystal sealing opening provided in a part of the seal material, and a polarizing plate is further provided outside the two substrates. That is, liquid crystal display panel, LCD: Liquid Crystal Display
A backlight disposed below the liquid crystal display element and emitting light to the liquid crystal display element by performing surface emission; a driving circuit board disposed outside the outer periphery of the liquid crystal display element; It is composed of a plastic mold case for storing and holding the light, a metal upper shield case for storing the above members and having a display window opened, a metal lower shield case, and the like.

For example, in an active matrix type liquid crystal display device, a pair of transparent glass substrates disposed to face each other via a liquid crystal is used as an envelope, and each pixel capable of independently modulating light transmitted through the liquid crystal is provided. The display surface is formed in a matrix.

For this reason, on the liquid crystal side surface of one of the transparent glass substrates, an electrode for modulating light passing through the liquid crystal in each pixel, a signal line for supplying a signal to the electrode, and a signal line Active elements and the like for controlling the flow are formed (hereinafter, the liquid crystal display element forming substrate is referred to as an active element substrate, and hereinafter, the liquid crystal display element forming substrate is referred to as a liquid crystal display substrate). Also,
In the case where the liquid crystal display element is for color display, for example, red, green, and blue color filters having different colors for pixels adjacent in one direction are formed on the liquid crystal side surface of the other transparent glass substrate. (Hereinafter, this liquid crystal display substrate is referred to as a color filter substrate).

Further, in order to improve the resolution of a displayed image, the number of the pixels is extremely large, and accordingly, the electrodes, signal lines, active elements, color filters, and the like have to have an extremely fine structure. .

Therefore, these electrodes, signal lines, active elements, color filters and the like are formed by a laminated film having a predetermined pattern by a selective etching method using a so-called photolithography technique.

Here, the transparent glass substrate serving as a base on which the electrodes, signal lines, active elements, color filters, etc. are formed may be formed in a size suitable for one liquid crystal display substrate from the beginning. Rare, usually 1
On a glass substrate having a size several times larger than the number of liquid crystal display substrates, the same pattern of electrodes, signal lines, and active elements, or each laminated film such as a color filter, etc. is simultaneously formed in the formation region of each liquid crystal display substrate. After forming a plurality of pieces, a method of cutting and separating the transparent glass substrate is adopted. This is because it is advantageous in terms of mass productivity. In recent years, the substrate size has tended to increase,
The pattern of the laminated film has been arranged on the transparent glass substrate.

[0008] In the processing step of the transparent glass substrate, a scribing step of forming a groove (cutting guide line) along a portion to be cut on the surface thereof, and thereafter, a cutting is performed by applying a breaking stress along the scribe groove. There are a cutting (breaking) step for dividing (split), a chamfering step for polishing the cut surface to C or R after cutting the transparent glass substrate, and a corner cutting step (a kind of chamfering step) for cutting corners of the transparent glass substrate. .

In a processing step for manufacturing a liquid crystal display substrate constituting a liquid crystal display element, a single plate having a multi-layered laminated film of a predetermined pattern is scribed and cut into a size for flowing in a subsequent step. , Chamfering, corner cutting, veneer cutting, lamination of an active element substrate and a color filter substrate, and then cell cutting, cutting, and substrate cutting, chamfering, and corner cutting for terminal connection. There is a terminal cutting step and the like.

In general, in a scribing step of a transparent glass substrate, a cutter wheel made of carbide or diamond is rotated along a cut portion of the glass substrate to form a scribe groove in the glass substrate. In the break step, the glass surface opposite to the surface on which the scribe grooves are formed is hit with a squeegee made of urethane rubber or the like to apply bending stress to the glass substrate, or the glass substrate itself is bent by a roller or the like to scribe. The glass substrate is cut by developing cracks in the direction perpendicular to the substrate surface generated in the groove. In the chamfering step and the corner cutting step, the cut surface is polished with a rotating grindstone to perform C or R chamfering and corner cutting.

[0011]

However, in the manufacturing method of the prior liquid crystal display device, glass swarf (powder) generated during each of the above-mentioned processes such as cutting and chamfering of the transparent glass substrate is generated by the lamination film forming portion of the liquid crystal display substrate. (Ie, the electronic circuit surface), and if the electrodes and signal lines are broken or the other liquid crystal display substrate is arranged facing the gap due to the adhesion of the glass fragments, the gap (the distance between the two substrates) A problem has been identified in which dispensing cannot be performed accurately.

Further, when an organic film such as a protective film (overcoat film) is formed at a cut portion where a scribe groove is to be formed, as in a color filter substrate, the crack does not enter well and the scribe groove is not formed. However, there is a problem that the substrate is cut apart from the cut portion, is cut off, and the substrate is cracked or the amount of glass fragments generated is increased.

In order to process these transparent glass substrates, a substrate fixing member (surface plate) for fixing the substrate during the processing is required. In addition, the washing water for washing it out and the cooling water during processing accumulate, and the transparent glass substrate or cell floats well from the fixed surface plate (floating).
A problem that it cannot be done.

Further, when the substrate of the cell is sucked and fixed on the entire surface by the fixing plate during the terminal cutting step, beads for forming a gap move or bubbles are generated in the substrate, thereby causing display defects. There was also the problem of doing so.

[0015] These problems have a greater effect as the size of the substrate becomes larger recently and the peripheral portion of the substrate outside the laminated film forming portion becomes smaller.

As an invention related to the present invention, there is an invention described in Japanese Patent Application Laid-Open No. Hei 7-191308 by the same applicant, in which the substrate is cut in a liquid. According to the present invention, there is an effect of suppressing adhesion of glass swarf debris to the laminated film forming portion of the substrate, but it is not sufficient.

The present invention has been made in view of the above circumstances, and has as its object to prevent adhesion of substrate debris or cleaning water or cooling water to an electronic circuit surface generated in each processing step of a liquid crystal display substrate. An object of the present invention is to provide a method and an apparatus for manufacturing a liquid crystal display device that can prevent disconnection, gap failure, other characteristic failure, processing, and floating of substrates and cells due to this.

[0018]

In order to solve the above-mentioned problems, a method of manufacturing a liquid crystal display device according to the present invention is directed to a liquid crystal display device in which a laminated film is formed on the surface of a liquid crystal display substrate and then the substrate is processed. In the manufacturing method of (1), the processing is performed from the back surface side of the substrate while covering the laminated film forming portion.

Further, the processing is performed from the back side of the substrate in a state where the front surface is directed downward, the peripheral edge of the front surface is fixed by suction, and the laminated film forming portion is covered.

Further, a lid-shaped substrate fixing member having a concave portion which opens upward except for the peripheral portion is used, the surface is turned downward, and the peripheral portion of the surface is brought into contact with the peripheral portion of the substrate fixing member. Then, the substrate is sucked and fixed, and the processing is performed from the back surface side of the substrate in a state where the laminated film forming portion is disposed in the concave portion of the substrate fixing member and covered with the substrate fixing member. Features.

Further, in a method of manufacturing a liquid crystal display device in which two liquid crystal display substrates are stacked with a predetermined gap therebetween to assemble a cell, and then the substrate is processed, one of the substrates constituting the cell The processing is performed from the side opposite to the suction side in a state where the peripheral portion of the outer surface is fixed by suction.

Further, the processing is scribe, cut, chamfer, or corner cut of the substrate.

The manufacturing apparatus for the liquid crystal display device has a concave portion which is open upward except for a peripheral portion, and has a lid-like shape for adsorbing and fixing the substrate by bringing the peripheral portion into contact with the peripheral portion of the substrate. It is characterized by comprising a substrate fixing member, vacuum suction and release means for the substrate provided on the substrate fixing member, and processing means for performing the processing.

The peripheral portion of the substrate fixing member;
At least one of a suction port and a suction groove as the vacuum suction and release means is provided on at least the peripheral edge of the recess.

Further, in the concave portion of the substrate fixing member,
A drain port is provided.

Further, the present invention is characterized in that the processing means has at least one of a scribing wheel, a cutting squeegee, a chamfering grindstone, and a corner cutting grindstone.

In the method and the apparatus for manufacturing a liquid crystal display device according to the present invention, since the processing is performed in a state where the laminated film forming portion of the liquid crystal display substrate is covered, the laminated film such as electrodes, signal lines, active elements, etc. It is possible to prevent substrate debris, cleaning water, cooling water, and the like from adhering to the formation portion (electronic circuit surface). That is, during processing such as cutting and chamfering of the laminated film forming portion, a member that covers the laminated film forming portion, for example, a lid-shaped substrate fixing member (a surface plate) having a concave portion that is opened at a portion other than the peripheral portion, or the like As a result, the same state as the sealed state is obtained, and it is possible to prevent entry of substrate debris generated during processing. Therefore, it is possible to prevent the occurrence of disconnection, gap failure, and the like due to substrate debris.

Further, when an organic film such as an overcoat film is formed on the surface to be cut, such as a color filter substrate, the cutting property is reduced as described above, and the substrate is cracked. Although the generation amount of the debris increases, in the present invention, since the back surface on which the laminated film is not formed, for example, the glass surface is cut or the like, the cutting property can be prevented from lowering.

Further, by providing a drain port in the concave portion of the substrate fixing member, the substrate debris and the cleaning water and cooling water are discharged from the drain port. Debris and water can be prevented from accumulating.

In order to fix the peripheral portion of the substrate by suction,
By reducing the contact area with the substrate and making the drain port smaller, air leakage at the time of releasing the suction of the substrate can be reduced, the reliability of the suction fixing and releasing can be improved, and the floating of the substrate or the cell can be smoothly performed. Can be done.

Further, according to the present invention, when processing the substrate constituting the cell, the outer peripheral portion of the substrate of the cell is fixed by suction, and the laminated film forming portion of the substrate is disposed in the concave portion of the substrate fixing member. Therefore, the area other than the periphery of the cell is not subjected to the force at the time of adsorption or release of adsorption, so that it is possible to prevent the movement of beads and the generation of bubbles that occur when the entire surface is fixed by adsorption, and to prevent the occurrence of display defects. , And the yield is improved.

These are more effective as the size of the substrate becomes larger and the peripheral portion of the substrate becomes smaller.

[0033]

Embodiments of the present invention will be described below in detail with reference to the drawings. In the drawings described below, those having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 6 is a schematic plan view showing an example of a transparent glass substrate for forming an active element substrate to which the present invention is applied.

In the drawing, SUB is a transparent glass substrate for forming an active element substrate which constitutes an envelope of a liquid crystal display element. The main surface (the side that contacts the liquid crystal)
An electrode, a signal line, an active element, and the like, which are formed by a selective etching method using a photolithography technique and are formed of a laminated film having a fine predetermined pattern, are formed (not shown; see FIG. 8). CTA is a cutting line of the substrate SUB, SUB1 is an active element substrate, AR is an active matrix portion, Td (e) is a drain terminal portion, and Tg is a gate terminal portion.

In this case, from the transparent glass substrate SUB, 2 × 2 = 4 transparent glass substrates SUB1 for forming one active element substrate of the two liquid crystal display substrates constituting the liquid crystal display element are formed. For this reason, the electrodes, signal lines, active elements and the like are formed in the same pattern in each of the four divided regions (regions surrounded by solid lines in the figure). ing. As described above, this is to improve mass productivity in manufacturing a liquid crystal display substrate.

Therefore, the transparent glass substrate SUB1 on which the electrodes, signal lines, active elements and the like are formed as described above.
Is divided into four identical transparent glass substrates SUB1 by being cut along the boundaries of the respective regions, and the respective subsequent processes are performed.

As described above, the cutting step of the transparent glass substrate SUB includes a scribe step of forming a scribe groove along a cut portion of the substrate, and a cut (break) step of applying a breaking stress along the groove to cut the substrate. Further, the cut surfaces and corners are formed through a chamfering step of chamfering with a diamond grindstone or the like and a corner cutting step (a kind of chamfering step).

<< Manufacturing Process of Liquid Crystal Display Device >> The manufacturing process of a liquid crystal display device is usually performed by forming various thin films on an active device substrate and a color filter substrate → cutting each substrate (for two liquid crystal display devices) → forming each substrate. Cleaning → Formation of alignment film on each substrate → Rubbing of each alignment film → Dispersion of beads for defining the gap between both substrates → Formation of sealing material → Cell assembly with both substrates overlapped → Gap setting and sealing material curing → Cutting of cell substrate Process (for one liquid crystal display element) → Liquid crystal encapsulation / sealing process → Cell washing process → Substrate cutting / chamfering / corner cutting /
This is a washing step.

That is, first, the transparent glass substrate SUB on which the laminated film is formed is cut (at the cutting line CTA in FIG. 6 for the active element substrate), and divided into substrates on which two electronic circuits are formed. . The cutting method will be described later.

Next, after cleaning the divided substrates, an alignment film is formed, and the surface of the alignment film is rubbed. afterwards,
Beads are dispersed on the surface of the substrate on which the alignment film is formed, and a sealing material is formed around the electronic circuit. Next, the two substrates are assembled with the surfaces on which the electronic circuits are formed facing each other. Next, a gap is set so that the gap between the two substrates is set as set, and then the sealing material is cured. Next, both substrates of the cell are cut to a size of one liquid crystal display element.

Next, the liquid crystal is sealed in the cell and then sealed. Next, the liquid crystal attached to the outside of the cell is washed. Next, by cutting the periphery of the active element substrate,
Cut off the part where each terminal is connected in common due to electrostatic breakdown. This cut portion is shown by CT1 and CT2 in FIG. Thereafter, the cut surface is chamfered and corner-cut. The method of cutting, chamfering, and corner cutting will be described later.

Actually, in this terminal cutting step, the peripheral portion is cut, chamfered, and corner-cut at the cutting point CT1 of the active element substrate, and the cutting at the cutting point CT2 of the color filter substrate is performed at the previous cell cutting step. It is implemented in.

<< Production Apparatus for Liquid Crystal Display Element >> FIG. 5 is a configuration diagram of a terminal processing apparatus for a transparent glass substrate SUB1 or SUB2 or a cell.

(1) is a loader device, (2) is a transfer and transfer device, (3) is a scribe device, (4) is a transfer device,
(5) Break device, (6) broken material removal device, (7)
Is a broken material receiver, (8) is a chamfer / corner cut device,
(9) is a transfer device, (10) is a cleaning device, (11) is a separation and transfer device, (12) is an underwater unloader device, (13)
Is a pure water supply tank.

The present apparatus is configured to sequentially arrange apparatuses for performing each step, and to perform a series of processing by carrying and transferring after each processing.

At the left end of the figure, the transparent glass substrate S before cutting is shown.
A loader device (1) serving as an entrance for transporting the UB into the device is disposed, and the transparent glass substrate SUB placed in the loader device (1) is scribed by the transport / transfer device (2). ).

The substrate S in the scribe device (3)
The UB scribe will be described later.

The scribed substrate SUB is transferred to the break device (5) by the transfer device (4).

The break (cut) of the substrate SUB in the break device (5) will be described later.

The broken material cut from the substrate SUB is removed by a broken material removing device (6) and accumulated in a broken material receiver (7) provided in the device (6).

The cut substrate SUB is conveyed to a chamfering / corner cutting device (8), where the substrate SUB is chamfered and corner-cut. At this time, pure water for cooling is supplied from the pure water supply tank (13) to the processing section.

The substrate SUB is transferred to the cleaning device (10) by the transfer device (9), washed here, and arranged on the underwater unloader device (12) by the sorting and transferring device (11).

Hereinafter, each of the above steps will be described.

<< Scribing Step and Scribe Apparatus >> FIG.
FIG. 1 is a sectional view of a main part of a scribe device according to an embodiment of the present invention.

Reference numeral 1 denotes a substrate fixing surface plate for fixing the transparent glass substrate SUB, 2 denotes a recess formed in the substrate fixing surface plate 1, 3 denotes a laminated film forming portion of the transparent glass substrate SUB, 4a
Is a groove for vacuum suction and release, and 4b is a groove 4
a, a drain hole formed in the recess 2, a scribe wheel 6, a washing water 7 for washing glass swarf debris and the like on the substrate SUB surface (shower). Water).

The transparent glass substrate SUB shown in FIG. 6 is turned downward with the surface on which the laminated film of the electrodes, signal lines, active elements and the like is formed as shown in FIG.
The laminated film forming section 3 of each of the substrates SUB1 of B is arranged in the concave portion 2 formed in the substrate fixing surface plate 1, which is a substrate fixing member, and the peripheral edge portion of the substrate SUB including the cut portion is fixed by suction. A groove 4a for vacuum-sucking and releasing the transparent glass substrate SUB is provided on the board 1 for fixing the substrate (see FIG. 4).
And a hole 4b, a concave portion 2 for arranging the laminated film forming portion 3 of the substrate SUB, and a drain port 5 for discharging foreign matters such as glass swarf debris and dust, and cleaning water 7. The platen 1 for fixing a substrate is made of, for example, stainless steel.
On the upper surface (plain glass surface) of the transparent glass substrate SUB,
After the scribe wheel 6 is located, the scribe wheel 6 is moved over the cutting position, and positioned at one end of the substrate SUB, the scribe wheel 6 is lowered,
The cutting edge of the scribe wheel 6 is brought into contact with the substrate SUB. Thereafter, the scribe wheel 6 is moved at a constant speed to form a scribe groove (see reference numeral 8 in FIG. 2) at the cut position. During this scribing step, washing water 7 is applied to the entire upper surface of the transparent glass substrate SUB (a means for supplying the washing water 7 is not shown), and the generated glass fragments and the like are discharged out of the surface plate 1 through the drain port 5. It is also done. In this case, the electrodes of the transparent glass substrate SUB, the signal lines,
Since the laminated film forming section 3 such as an active element is arranged in the concave portion 2 of the substrate fixing surface plate 1 and is covered by the substrate fixing surface plate 1, the cleaning water 7 does not contact the laminated film forming portion 3. . The peripheral portion of the substrate SUB including the cut portion is sucked from the groove 4a and the hole 4b of the substrate fixing base 1 through an intake pipe (not shown) at the end of the hole 4b, thereby firmly holding the transparent glass substrate SUB. It is fixed. The vacuum suction is released by blowing air from the holes 4b and the grooves 4a, and the transparent glass substrate SUB floats. When the substrate SUB is processed, since the substrate SUB is covered with the surface plate 1, foreign matter such as glass swarf debris, dust and the like, and the cleaning water 7 generated by the processing do not enter the surface plate 1, but the substrate SUB moves. At this time, these foreign substances, cleaning water and the like attached to the substrate SUB enter the surface plate 1. However, since the drainage port 5 is provided in the concave portion 2 of the surface plate 1, these foreign matters, cleaning water, and the like are discharged from the surface opening 1 to the outside of the surface plate 1. In this scribing apparatus, as shown in FIG. 1, the surface plate 1 is provided with two or four concave portions 2 corresponding to the four substrates SUB1, and scribe grooves formed on the substrate SUB. Along the lower surface of the substrate SUB and the surface plate 1
Is in contact with the upper surface.

As described above, foreign matter such as glass fragments generated from the transparent glass substrate SUB and the cleaning water 7 generated by the scribing of the scribe wheel 6 are caused by the laminated film forming portion 3 being sealed by the substrate fixing plate 1. Since there is no adhesion, it is possible to solve the problem that disconnection of a signal line caused by glass swarf or the like, or that a gap cannot be accurately formed when the other glass substrate is disposed to face.

In the scribing of the color filter substrate, the surface opposite to the surface on which the overcoat film is formed (the upper glass surface) is scribed, so that the overcoat film is not scribed. In the subsequent cutting step, it is possible to prevent a decrease in the cutting performance of the substrate and an increase in the amount of glass fragments generated.

Further, since the drain port 5 is provided in the concave portion 2 of the base plate 1 for fixing the substrate, foreign matters such as glass swarf and cleaning water can be removed.
Since the water is discharged from the drain port 5, it is possible to prevent foreign matters and cleaning water from collecting in the substrate fixing platen 1.

Further, since the peripheral portion of the transparent glass substrate SUB (or cell) is fixed by suction, the area of contact with the substrate SUB (or cell) is small, and the diameter of the drain port 5 is reduced. Alternatively, air is blown from the groove 4a arranged on the periphery of the
It is possible to reduce the leakage of air when releasing adsorption of (or the cell), and the substrate SUB (or the cell) can be smoothly floated.

Further, after assembling a cell by stacking two glass substrates with a predetermined gap therebetween, when performing a scribing for cutting the cell, the surface of the transparent glass substrate constituting the cell where the laminated film is formed is formed. Since no adsorption occurs, movement of beads and generation of bubbles can be prevented.

<< Cutting Step and Cutting Apparatus >> FIG. 2 is a sectional view of a main part of a cutting apparatus according to an embodiment of the present invention.

8 is a scribe groove formed by the scribe device of FIG. 1, and 9a and 9b are cutting squeegees.

In this cutting step, the transparent glass substrate SUB scribed in the scribe step is cut (breaked) along the scribe grooves (scribe lines) 8. As shown in FIG. 2, similarly to the scribe device, the transparent glass substrate SUB has its surface on which the laminated film forming portion 3 such as electrodes, signal lines, active elements and the like are formed facing downward, and the laminated film forming portion 3 is placed on the substrate. It is arranged in the concave portion 2 of the fixing platen 1, and the peripheral portion of the substrate SUB including the scribe groove 8 at the cutting position is fixed by suction. In the present cutting apparatus, two squeegees 9a and 9b that move up and down with respect to the substrate fixing platen 1 are arranged, and the squeegee 9a is located above the transparent glass substrate SUB and above the substrate fixing platen. 1 and is arranged at a position slightly deviated to the outside of FIG. The squeegee 9b is built in the center of the board 1 for fixing the substrate, moves up and down in the figure, and its tip protrudes from the upper surface of the board 1.

The squeegees 9a and 9b extend along the scribe lines 8 formed on the transparent glass substrate SUB, that is, are arranged so as to roughly correspond to the positions of the scribe lines 8. As the 9b moves up and down, a bending stress is applied to the substrate SUB, and the end and the center of the substrate SUB are separated. During the main cutting process,
Washing water (shower water) 7 is applied to the transparent glass substrate SUB (a means for supplying the washing water 7 is not shown), and glass fragments and the like are discharged out of the platen 1 through the drain port 5. In addition, in the present cutting device, similarly to the scribing device, the surface plate 1 is provided with two or four concave portions 2 corresponding to the four substrates SUB1.
The lower surface of the substrate SUB and the upper surface of the surface plate 1 are in contact with each other along the scribe groove 8 formed in B.

The present cutting process and apparatus have exactly the same effects as the scribing apparatus. That is,
During the cutting step, since the laminated film forming section 3 of the substrate SUB is sealed by the substrate fixing platen 1, it is possible to prevent foreign substances such as glass swarf and the cleaning water 7 from adhering. Further, in the case of scribing the color filter substrate, the substrate can be satisfactorily cut along the scribe grooves formed on the surface from the upper surface opposite to the surface on which the overcoat film is formed.
In addition, since foreign matters such as glass fragments and cleaning water are discharged from the drain port 5, they can be prevented from accumulating in the surface plate 1. Further, since the peripheral portion of the substrate SUB1 (or cell) is fixed by suction, the area of close contact with the substrate SUB is small and the diameter of the drain port 5 is small, so that suction of the substrate SUB by air blow from the groove 4b is released. Air leakage at the time can be reduced, and floating of the substrate SUB (or cell) can be performed smoothly. Further, when the cell is cut after the two glass substrates are assembled into a cell, the surface of the substrate constituting the cell on which the laminated film is formed is not adsorbed, so that movement of beads and generation of bubbles can be prevented.

<< Chamfering and Corner Cutting Process and Apparatus >> FIG. 3 is a sectional view of a principal part of a chamfering and corner cutting apparatus according to an embodiment of the present invention.

In this step, chamfering and corner cutting of the divided surface of the transparent glass substrate SUB cut in the cutting step are performed. First, the transparent glass substrate SUB has a laminated film forming portion 3 for its electrodes, signal lines, active elements and the like.
The surface on which is formed is turned downward, the laminated film forming part 3 is arranged in the concave part 2 of the substrate fixing surface plate 1, and the peripheral portion of the substrate SUB is fixed by suction. As shown in FIG. 3, a chamfering grindstone 10 and a corner cutting grindstone 11 are arranged on the cut surface side of the transparent glass substrate SUB.

The grinding wheel 10 for chamfering and the grinding wheel 11 for corner cutting are rotating at a constant speed, and the grinding wheels 10 and 11 are made transparent while abutting the cut surface of the transparent glass substrate SUB and four corners. Chamfering and corner cutting are performed by feeding the glass substrate SUB at a constant speed. In this case, the processing is performed while applying cooling water (cutting water) 12 for cooling the processing portions to the grindstones 9 and 10 and washing water (shower water) 7 to the transparent glass substrate SUB.

In the present method and apparatus, chamfering and corner cutting can be performed for the same reason as in the above-described scribing and breaking without adhering glass fragments, washing water 7 and cooling water 12. Further, since the glass debris, the washing water 7 and the cooling water 12 are discharged from the drain port 5, it is possible to prevent them from accumulating in the surface plate 1. Further, in order to adsorb and fix the transparent glass substrate SUB and the peripheral portion of the cell,
Since the diameter of the drain port 5 is reduced, leakage of air at the time of releasing the suction of the substrate SUB or the cell due to the air blow from the groove 4b can be reduced, and the floating of the substrate SUB or the cell can be performed smoothly. Further, when the cell is cut, since the stacked film forming surface of the substrate constituting the cell is not adsorbed, the movement of beads and the generation of bubbles can be prevented.

FIG. 4A is a schematic plan view showing another example of the structure of the surface plate 1 for fixing a substrate according to the present invention, and FIG. 4B is a schematic diagram showing the sectional structure of the surface plate 1 of FIG. (A) is a figure seen from the opening side (upper surface) of the recessed part 2.

In this example, a case where there is one recess 2 is shown. Grooves 4 for vacuum suction and release are provided around the surface plate 1.
a and a hole 4b are provided, and a hole 4b for vacuum suction and release and a drain port 5 are provided on the bottom surface of the concave portion 2.
In (b), 13 is a vacuum suction pipe. Recess 2,
The number of the holes 4b and the number of the drain holes 5 can be increased or decreased in accordance with the substrate, and the shape of the recess 2 and the outer shape of the platen 1 is not limited to a rectangular shape, but can be formed into various shapes.

<< Outline of Matrix Unit >> FIG. 7 is a plan view showing one pixel of an active matrix / TCP type color liquid crystal display element (liquid crystal display panel) to which the present invention can be applied and its periphery, and FIG. It is sectional drawing which shows the vicinity of the panel angle and the vicinity of a video signal terminal part on both sides centering on the pixel part of the matrix in the -8 cutting line.

As shown in FIG. 7, each pixel has two adjacent scanning signal lines (gate signal lines or horizontal signal lines) GL.
And two adjacent video signal lines (drain signal lines or vertical signal lines) DL (in a region surrounded by four signal lines). Each pixel includes a thin film transistor TFT, a transparent pixel electrode ITO1, and a storage capacitor Cadd. The scanning signal lines GL extend in the left-right direction in the figure, and a plurality of scanning signal lines GL are arranged in the up-down direction. Video signal line DL
Extend in the up-down direction and are arranged in a plurality in the left-right direction.

As shown in FIG. 8, a thin film transistor TFT and a transparent pixel electrode ITO1 are formed on the lower transparent glass substrate SUB1 side with respect to the liquid crystal layer LC, and a color filter FIL and a light shielding A black matrix pattern BM is formed. A silicon oxide film SIO formed by dipping or the like is provided on both surfaces of the transparent glass substrates SUB1 and SUB2.

A light shielding film BM and a color filter FI are provided on the inner surface (the liquid crystal LC side) of the upper transparent glass substrate SUB2.
L, protective film PSV2, common transparent pixel electrode ITO2 (CO
M) and an upper alignment film ORI2 are sequentially laminated.

<< Outline of Matrix Peripheral >> FIG. 9 is a plan view of a main part around a matrix (AR) of the display panel PNL including the upper and lower glass substrates SUB1 and SUB2, and FIG. 11 is FIG. 9 and FIG.
It is a figure which shows the expansion plane of the vicinity of the seal | sticker part SL corresponding to the panel left upper corner part of 0. In FIG. 8 described above, the cross section of FIG. 7 is set at the center (b), the left side (a) is a cross section taken along the line 8a-8a in FIG. 11, and the right side (c) is connected to the video signal drive circuit. FIG. 3 is a diagram showing a cross section near an external connection terminal DTM.

[0079] Any For this panel In the manufacture of, if small size divided from simultaneously processing a plurality fraction of the device in one glass substrate for increased throughput, manufacturing facilities if large size shared A glass substrate of a standardized size is processed even in a variety, and the size is reduced to a size suitable for each type. In each case, the glass is cut after passing through one process. FIGS. 9 to 11 show the latter example. In both FIGS. 9 and 10, the upper and lower substrates SUB1, S
FIG. 11 shows the state before the cutting of UB2, and FIG.
Indicates the edges of both substrates before cutting, and CT1 and CT2 indicate the positions of the substrates SUB1 and SUB2 to be cut, respectively. In any case, in the completed state, the size of the upper substrate SUB2 is reduced so that the external connection terminal groups Tg and Td (subscripts are omitted) (the upper and lower sides and the left side in the drawing) are exposed. More restricted inside. Terminal group Tg, T
Reference symbol d designates a plurality of scanning circuit connection terminals GTM and video signal circuit connection terminals DTM, which will be described later, and their lead-out wiring portions collectively named in units of a tape carrier package TCP on which the integrated circuit chip CHI is mounted. .
The lead wiring from the matrix section of each group to the external connection terminal section is inclined as approaching both ends. this is,
Arrangement pitch of package TCP and each package TC
The terminal D of the display panel PNL is
This is for matching TM and GTM.

Along the edge between the transparent glass substrates SUB1 and SUB2, except for the liquid crystal filling opening INJ, the liquid crystal LC
Is formed to seal the sealing pattern SL. The sealing material is made of, for example, an epoxy resin. The common transparent pixel electrode ITO2 on the upper transparent glass substrate SUB2 side is connected at least at one position to the lead-out wiring INT formed on the lower transparent glass substrate SUB1 side by the silver paste material AGP at least at four corners of the panel in this embodiment. Have been. This lead wiring INT is connected to a gate terminal GT described later.
M and the drain terminal DTM are formed in the same manufacturing process.

The alignment films ORI1 and ORI2, the transparent pixel electrode ITO1, and the common transparent pixel electrode ITO2 are formed inside the seal pattern SL. Polarizing plate P
OL1 and POL2 are each a lower transparent glass substrate SUB
1. Formed on the outer surface of the upper transparent glass substrate SUB2. The liquid crystal LC is sealed in a region partitioned by the seal pattern SL between the lower alignment film ORI1 and the upper alignment film ORI2 for setting the direction of the liquid crystal molecules. The lower alignment film ORI1 is a protective film P on the lower transparent glass substrate SUB1 side.
It is formed above the SV1.

In this liquid crystal display device, various layers are separately stacked on the lower transparent glass substrate SUB1 side and the upper transparent glass substrate SUB2 side, and a seal pattern SL is formed on the substrate SUB2.
Side, the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 are overlapped, liquid crystal LC is injected from the opening INJ of the sealing material SL, the injection port INJ is sealed with epoxy resin or the like, and the upper and lower substrates are sealed. Assembled by cutting.

<< Thin Film Transistor TFT >> Next, FIG.
Returning to FIG. 8, the configuration on the TFT substrate SUB1 side will be described in detail.

The thin film transistor TFT has a gate electrode G
When a positive bias is applied to T, the channel resistance between the source and the drain decreases, and when the bias is set to zero, the channel resistance increases.

Each pixel is provided with a plurality (two) of thin film transistors TFT1 and TFT2 redundantly. Each of the thin film transistors TFT1 and TFT2 has substantially the same size (channel length and channel width are the same), and includes a gate electrode GT, a gate insulating film GI, and an i-type (intrinsic,
intrinsic, not doped with conductivity determining impurities)
It has an i-type semiconductor layer AS made of amorphous silicon (Si), a pair of source electrode SD1, and a drain electrode SD2. It should be understood that the source and the drain are originally determined by the bias polarity between them, and in the circuit of this liquid crystal display device, the polarity is inverted during the operation, so that the source and the drain are interchanged during the operation. However, in the following description, one is fixed and the other is fixed as a drain for convenience.

<< Gate Electrode GT >> The gate electrode GT is configured to protrude vertically from the scanning signal line GL (branched into a T-shape). The gate electrode GT protrudes beyond the respective active areas of the thin film transistors TFT1 and TFT2. Thin film transistor TFT
1. The respective gate electrodes GT of the TFT 2 are integrally formed (as a common gate electrode) and are formed continuously with the scanning signal line GL. In this example, the gate electrode GT is formed of a single-layer second conductive film g2. As the second conductive film g2, for example, an aluminum (Al) film formed by sputtering is used, and an anodic oxide film AOF of Al is provided thereon.

The gate electrode GT is formed larger than the gate electrode GT so as to completely cover the i-type semiconductor layer AS (as viewed from below), and is designed so that external light or backlight does not hit the i-type semiconductor layer AS. .

<< Scanning Signal Line GL >> The scanning signal line GL is
It is composed of a conductive film g2. The second conductive film g2 of the scanning signal line GL is formed in the same manufacturing process as the second conductive film g2 of the gate electrode GT, and is integrally formed. An anodic oxide film AOF of Al is also provided on the scanning signal line GL.

<< Insulating Film GI >> The insulating film GI is used as a gate insulating film for applying an electric field to the semiconductor layer AS together with the gate electrode GT in the thin film transistors TFT1 and TFT2. The insulating film GI is formed above the gate electrode GT and the scanning signal line GL. As the insulating film GI, for example, a silicon nitride film formed by plasma CVD is selected, and is formed to a thickness of 1200 to 2700 ° (about 2000 ° in this embodiment). As shown in FIG. 11, the gate insulating film GI is formed so as to surround the entire matrix portion AR, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM. The insulating film GI also contributes to electrical insulation between the scanning signal lines GL and the video signal lines DL.

<< i-type semiconductor layer AS >> i-type semiconductor layer AS
Is formed to be an independent island for each of the thin film transistors TFT1 and TFT2 in this example, and is made of amorphous silicon to a thickness of 200 to 2200 ° (in this example, 2 mm).
(Thickness of about 000 °). The layer d0 is an N ⁺ -type amorphous silicon semiconductor layer doped with phosphorus (P) for ohmic contact, where the i-type semiconductor layer AS is present below and the conductive layer d2 (d3) is present above. Only left.

The i-type semiconductor layer AS is also provided between both intersections (crossover portions) between the scanning signal lines GL and the video signal lines DL. The i-type semiconductor layer AS at the intersection reduces a short circuit between the scanning signal line GL and the video signal line DL at the intersection.

<< Transparent Pixel Electrode ITO1 >> Transparent Pixel Electrode I
TO1 constitutes one of the pixel electrodes of the liquid crystal display section.

The transparent pixel electrode ITO1 is connected to the source electrode SD1 of the thin film transistor TFT1 and the thin film transistor T1.
It is connected to both source electrodes SD1 of FT2. Therefore, even if a defect occurs in one of the thin film transistors TFT1 and TFT2, if the defect causes a side effect, an appropriate portion is cut off by a laser beam or the like, and if not, the other thin film transistor operates normally. You can leave it. The transparent pixel electrode ITO1 is composed of a first conductive film d1.
Is a transparent conductive film (Indium-Tin) formed by sputtering.
-Oxide ITO: Nesa film), 1000-200
0 mm thick (in this embodiment, about 1400 mm thick)
It is formed.

<< Source electrode SD1, drain electrode SD
2 >> Each of the source electrode SD1 and the drain electrode SD2 is composed of a second conductive film d2 in contact with the N ⁺ type semiconductor layer d0 and a third conductive film d3 formed thereon.

The second conductive film d2 is formed of a chromium (Cr) film formed by sputtering and having a thickness of 500 to 1000 ° (about 600 ° in this embodiment). Since the stress increases when the Cr film is formed thick,
It is formed in a range not exceeding a film thickness of about 0 °. Cr film is N
⁺ Adhesion to the ⁺ type semiconductor layer d0, and the third conductive film d
3 is used for the purpose of preventing Al from diffusing into the N ⁺ type semiconductor layer d0 (so-called barrier layer). As the second conductive film d2, a high melting point metal (Mo, Ti,
Ta, W) film, refractory metal silicide (MoSi ₂ , T
_{iSi 2, TaSi 2, WSi 2} ) film may be used.

The third conductive film d3 is formed to a thickness of 3000 to 5000 ° by sputtering of Al (400
(Approximately 0 °). The Al film has a smaller stress than the Cr film and can be formed to have a large film thickness. The Al film has a source electrode SD1, a drain electrode SD2, and a video signal line DL.
Has the effect of reducing the resistance value of the gate electrode GT and ensuring the overstep due to the gate electrode GT and the i-type semiconductor layer AS (improving the step coverage).

After patterning the second conductive film d2 and the third conductive film d3 with the same mask pattern, using the same mask or using the second conductive film d2 and the third conductive film d3 as a mask, an N ⁺ type semiconductor layer is formed. d0 is removed. That is, i
In the N ⁺ type semiconductor layer d0 remaining on the type semiconductor layer AS, portions other than the second conductive film d2 and the third conductive film d3 are removed by self-alignment. At this time, since the N ⁺ type semiconductor layer d0 is etched so as to remove the entire thickness thereof,
The surface of the i-type semiconductor layer AS is also slightly etched, but the extent may be controlled by the etching time.

<< Video Signal Line DL >> The video signal line DL is composed of the second conductive film d2 and the third conductive film d3 in the same layer as the source electrode SD1 and the drain electrode SD2.

<< Protective Film PSV1 >> Thin Film Transistor TF
A protective film PSV1 is provided on T and the transparent pixel electrode ITO1. The protective film PSV1 is mainly formed to protect the thin film transistor TFT from moisture and the like.
Use a material with high transparency and good moisture resistance. The protective film PSV1 is formed of, for example, a silicon oxide film or a silicon nitride film formed by a plasma CVD device, and has a thickness of 1 μm.
It is formed with a film thickness of about m.

As shown in FIG. 11, the protective film PSV1 is formed so as to surround the entire matrix portion AR, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM.
Further, the common electrode COM of the upper substrate SUB2 is connected to the lower substrate SU.
The portion connected to the external connection terminal connection lead-out wiring INT of B1 with the silver paste AGP is also removed. Protective film PSV
Regarding the thickness relationship between 1 and the gate insulating film GI, the former is made thicker in consideration of the protective effect, and the latter is made thinner in the transconductance gm of the transistor. Therefore, as shown in FIG. 11, the protective film PSV1 having a high protective effect is such that the peripheral portion is protected over the widest possible range.
It is formed larger than I.

<< Light shielding film BM >> Upper transparent glass substrate SUB
On the second side, external light or backlight light is applied to the i-type semiconductor layer A.
A light shielding film BM is provided so as not to enter S. FIG.
The closed polygonal contour line of the light shielding film BM shown in FIG. 3 indicates an opening on the inside of which the light shielding film BM is not formed. The light-shielding film BM is formed of, for example, an aluminum film or a chromium film having a high light-shielding property. In this embodiment, the chromium film is formed to a thickness of about 1300 ° by sputtering.

Therefore, the thin film transistors TFT1,
The i-type semiconductor layer AS of the TFT 2 is sandwiched between the upper and lower light-shielding films BM and the large gate electrode GT, so that external natural light or backlight does not shine.
The light-shielding film BM is formed in a grid around each pixel (a so-called black matrix), and an effective display area of one pixel is partitioned by the grid. Therefore, the outline of each pixel is made clear by the light shielding film BM, and the contrast is improved. That is, the light-shielding film BM has two functions of light-shielding for the i-type semiconductor layer AS and black matrix.

Since the root portion (lower right portion in FIG. 7) of the transparent pixel electrode ITO1 on the base side in the rubbing direction is also shielded from light by the light shielding film BM, even if a domain is generated in the above portion, the domain is not visible. The display characteristics do not deteriorate.

The light-shielding film BM is also formed in a frame shape at the peripheral portion as shown in FIG. 10, and its pattern is formed continuously with the pattern of the matrix portion shown in FIG. I have. The light-shielding film BM in the peripheral portion is extended outside the seal portion SL as shown in FIGS. 10, 11, and 8, to prevent leakage light such as reflected light from the mounting machine such as a personal computer from entering the matrix portion. I'm preventing. On the other hand, the light shielding film BM is about 0.3 to 1.0 m longer than the edge of the substrate SUB2.
m, and is formed so as to avoid the cutting region of the substrate SUB2.

<< Color Filter FIL >> The color filter FIL is formed in a stripe shape by repeating red, green, and blue at a position facing the pixel. The color filter FIL is formed to be large so as to cover the entirety of the transparent pixel electrode ITO1, and the light shielding film BM is formed so that the transparent pixel electrode I1 overlaps the color filter FIL and the edge of the transparent pixel electrode ITO1.
It is formed inside the periphery of TO1.

The color filter FIL can be formed as follows. First, a dye base such as an acrylic resin is formed on the surface of the upper transparent glass substrate SUB2, and the dye base other than the red filter formation region is removed by photolithography. Thereafter, the dyed substrate is dyed with a red dye and subjected to a fixing treatment to form a red filter R. Next, a green filter G and a blue filter B are sequentially formed by performing a similar process.

<< Protective Film PSV2 >> The protective film PSV2 is provided to prevent the dye of the color filter FIL from leaking into the liquid crystal LC. The protective film PSV2 is formed of, for example, a transparent resin material such as an acrylic resin or an epoxy resin.

<< Common Transparent Pixel Electrode ITO2 >> The common transparent pixel electrode ITO2 faces the transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and the optical state of the liquid crystal LC is determined by the pixel electrode ITO1. In response to a potential difference (electric field) between the pixel electrode and the common transparent pixel electrode ITO2. The common transparent pixel electrode ITO2 is configured to apply a common voltage Vcom. In the present embodiment, the common voltage Vcom is the minimum level driving voltage Vdmin and the maximum level driving voltage Vdmin applied to the video signal line DL.
Although it is set to an intermediate DC potential with dmax, if it is desired to reduce the power supply voltage of the integrated circuit used in the video signal drive circuit to about half, an AC voltage may be applied. The plan shape of the common transparent pixel electrode ITO2 should be referred to FIGS.

<< Overall Configuration of Liquid Crystal Display Module >> FIG.
1 is an exploded perspective view of an active matrix flip-chip type color liquid crystal display module MDL to which the present invention can be applied.

SHD is a shield case (also called a metal frame) made of a metal plate, WD is a display window, SPC1
4 are insulating spacers, FPC1 and 2 are bent multilayer flexible circuit boards (FPC1 is a gate side circuit board, FPC2 is a drain side circuit board), PCB is an interface circuit board, and ASB is an assembled liquid crystal display with a drive circuit board. A liquid crystal display element (also referred to as a liquid crystal display panel) in which a driving IC is mounted on one of two superposed transparent insulating substrates, GC1 and G
C2 is a rubber cushion, PRS is a prism sheet (2
), SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, MCA is a lower case (mold case) formed by integral molding, LP is a fluorescent tube, LPC is a lamp cable, and LCT is a connection for an inverter. Connector, G
B is a rubber bush that supports the fluorescent tube LP, and the members are stacked in a vertical arrangement as shown in the figure to assemble the liquid crystal display module MDL.

FIG. 13 is a perspective view of a notebook personal computer or a word processor on which the liquid crystal display module of FIG. 12 is mounted.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and it is needless to say that various modifications can be made without departing from the gist of the present invention. It is. For example, it is needless to say that the present invention can be applied not only to a vertical electric field type active matrix type liquid crystal display device but also to a horizontal electric field type active matrix type liquid crystal display device.

[0113]

As described above, according to the present invention,
Foreign substances such as substrate debris generated by processing steps such as scribing, cutting, chamfering and corner cutting of the substrate constituting the liquid crystal display element, and adhesion of washing water and cooling water to the electronic circuit surface can be prevented. Can be prevented.
Further, it is possible to avoid a decrease in the cutting performance of the color filter substrate provided with the overcoat film. In addition, it is possible to prevent foreign substances such as substrate debris, cleaning water and cooling water from accumulating in the substrate fixing member. Further, since the peripheral portion of the substrate or the cell in which the two substrates are assembled is suction-fixed, the floating of the substrate or the cell from the fixing member can be performed smoothly. In addition, it is possible to prevent the occurrence of characteristic defects due to the movement of beads and the generation of bubbles during cell processing.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a scribe device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the cutting apparatus according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of a principal part of the chamfering and corner cutting device according to the embodiment of the present invention.

FIG. 4A is a schematic plan view showing another example of the structure of the surface plate 1 for fixing a substrate according to the present invention, and FIG. 4B is a schematic diagram showing a sectional structure of the surface plate 1 of FIG.

FIG. 5 is a configuration diagram of an apparatus for processing a terminal portion of a transparent glass substrate SUB or a cell.

FIG. 6 is a schematic plan view showing an example of a transparent glass substrate for forming an active element substrate to which the present invention is applied.

FIG. 7 is a main part plan view showing one pixel of a liquid crystal display element of an active matrix type color liquid crystal display device to which the present invention can be applied and the periphery thereof.

8 is a cross-sectional view showing the vicinity of a panel angle and the vicinity of a video signal terminal on both sides with the pixel portion of the matrix taken along the line 8-8 in FIG. 7 as a center;

FIG. 9 is a plan view illustrating a configuration of a matrix peripheral portion of a liquid crystal display element.

FIG. 10 is a plan view of a liquid crystal display element for explaining the concrete example in a more exaggerated manner in the peripheral portion of FIG. 9;

FIG. 11 is an enlarged plan view of a corner portion of a liquid crystal display element including an electrical connection portion between upper and lower substrates.

FIG. 12 is an exploded perspective view of a liquid crystal display module to which the present invention can be applied.

13 is a perspective view of a notebook personal computer or a word processor on which the liquid crystal display module of FIG. 12 is mounted.

[Explanation of symbols]

SUB: transparent glass substrate, 1: platen for fixing the substrate, 2: concave portion, 3 ... laminated film forming portion, 4a: groove for vacuum suction and release, 4b ... hole for vacuum suction and release, 5 ... drain port, 6 ...
Scribe wheel, 7… wash water, 8… scribe groove,
9a, 9b: cutting squeegee, 10: chamfering whetstone, 1
1 ... Wheel for corner cutting, 12 ... Cooling water (cutting water),
13 ... Vacuum suction pipe.

Claims (9)

[Claims] In a method of manufacturing a liquid crystal display device, wherein a laminated film is formed on a surface of a liquid crystal display substrate, and then the substrate is processed. A method for manufacturing a liquid crystal display device, comprising processing. 2. A method of manufacturing a liquid crystal display device, comprising: forming a laminated film on a surface of a liquid crystal display substrate; and processing the substrate, wherein the surface is turned downward, and a peripheral portion of the surface is fixed by suction. A method for manufacturing a liquid crystal display device, wherein the processing is performed from the back surface side of the substrate while covering the film forming portion. 3. A method of manufacturing a liquid crystal display device in which a laminated film is formed on a surface of a liquid crystal display substrate and then the substrate is processed. Using a member for, the surface is turned downward, the peripheral portion of the surface is brought into contact with the peripheral portion of the substrate fixing member, and the substrate is suction-fixed,
A method of manufacturing the liquid crystal display device, wherein the processing is performed from the back side of the substrate in a state where the laminated film forming portion is disposed in the concave portion of the substrate fixing member and covered with the substrate fixing member. . 4. A method for manufacturing a liquid crystal display device, comprising: assembling a cell by stacking two liquid crystal display substrates with a predetermined gap therebetween, and processing the substrate, wherein one of the substrates constituting the cell is formed. A method of manufacturing the liquid crystal display device, wherein the processing is performed from a side opposite to the suction side in a state in which a peripheral portion of the outer surface of the liquid crystal display is fixed by suction. 5. The method according to claim 1, wherein said processing is scribe, cut, chamfer, or corner cut of said substrate. 6. An apparatus for manufacturing a liquid crystal display device for processing a liquid crystal display substrate, comprising: a concave portion that opens upward except for a peripheral portion, wherein the peripheral portion is brought into contact with the peripheral portion of the substrate, and A liquid crystal display device comprising: a lid-shaped substrate fixing member that adsorbs and fixes the substrate; vacuum suction and release means for the substrate provided on the substrate fixing member; and processing means for performing the processing. Manufacturing equipment. 7. The apparatus according to claim 1, wherein at least one of a suction port and a suction groove serving as said vacuum suction and release means is provided on at least the peripheral edge of the substrate fixing member and the concave portion. 7. An apparatus for manufacturing a liquid crystal display device according to item 6. 8. An apparatus for manufacturing a liquid crystal display device according to claim 6, wherein a drain port is provided in said concave portion of said substrate fixing member. 9. An apparatus for manufacturing a liquid crystal display device according to claim 6, wherein said processing means includes at least one of a scribing wheel, a cutting squeegee, a chamfering grindstone, and a corner cutting grindstone.