JPH11307985A - Printed wiring board and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the efficiency of use of a wiring board by providing electronic components mounted along two adjacent side faces in conformity with the mounting position of a shield case. SOLUTION: Electronic components for an oscillator and four dummy electronic components 11A-11D are mounted at specified positions on one surface 10A of a printed wiring board 10, a box-like shield case 12 having no leg is mounted to cover the oscillator electronic components, a plurality of electronic components 13 are mounted at specified positions on another surface 10B, each dummy electronic component 11A-11D is mounted along corresponding side face 12A-12D with a slight space whereby the shield case 12 can be positioned by inserting it down between positioning electronic components 11A-11D, and L-shaped lands 14A-14D are provided on one surface 10A of the printed board 10 in such a way as to surround the four corners 12E-12H of the shield case with a slight space and grounded through the respective wiring patterns.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a mounting method, and is suitably applied to, for example, a printed wiring board incorporated in a radio.

[0002]

2. Description of the Related Art Conventionally, in a printed wiring board of this type, a voltage controlled oscillator (VCO:
Various electronic components such as a transistor and a capacitor constituting a voltage controlled oscillator (hereinafter referred to as electronic components for an oscillator) are mounted.

[0003] In this case, in this type of printed wiring board, noise generated by the voltage controlled oscillator may cause other electronic components to malfunction, or noise introduced from the outside may cause the voltage controlled oscillator to malfunction. A shield case formed of a predetermined conductive metal in a box shape is mounted on the voltage-controlled oscillator and connected to the ground.

Thus, in this type of printed wiring board, noise is cut off by the shield case, and thus noise generated by the voltage-controlled oscillator causes other electronic components to malfunction, or the voltage-controlled oscillator is externally controlled. It is designed to prevent malfunction due to noise that has entered.

Actually, as shown in FIG. 2, in this type of printed wiring board 1, an electronic component for an oscillator is mounted at a predetermined position on one surface 1A, and a shield case 2 is placed so as to cover the electronic component for the oscillator. Are mounted such that a plurality of feet 2A provided at the lower end thereof are respectively inserted into corresponding holes, and a plurality of electronic components 3 are mounted at predetermined positions on the other surface 1B.

[0006]

By the way, in the printed wiring board 1 having such a structure, the shield case 2 is easily positioned by inserting each foot 2A of the shield case 2 into the corresponding hole. It is designed to be implemented.

However, in the printed wiring board 1, a plurality of holes for inserting the feet 2A of the shield case 2 are formed in spite of the recent demand for high-density mounting. Therefore, it is necessary to mount the electronic component 3 on the other surface 1B so as to avoid these holes, and when the printed wiring board 1 is a multilayer wiring board, the inside of each hole also It is necessary to form a predetermined wiring pattern so as to avoid the problem, and there is a problem that the utilization efficiency of the other surface 1B and the inside is low.

The present invention has been made in view of the above points, and has as its object to propose a printed wiring board and a mounting method capable of improving the utilization efficiency.

[0009]

According to the present invention, there is provided a printed wiring board having at least two adjacent side surfaces of a shield case corresponding to a mounting position of the shield case. One or a plurality of electronic components mounted along each of them is provided.

As a result, based on the mounting position of each electronic component previously mounted on one surface of the printed wiring board, the shield case having no feet can be easily and accurately positioned and mounted. Since the holes corresponding to the feet do not need to be formed in the printed wiring board, the other surface and the inside of the printed wiring board can be effectively used.

Further, in the present invention, in the mounting method, one or a plurality of one or more of the shield cases may be provided on one surface of the printed wiring board so as to correspond to the mounting position of the shield case, and along at least two adjacent side surfaces of the shield case. A first step of mounting the electronic component and a second step of positioning and mounting the shield case on one surface of the printed wiring board based on the mounting position of each electronic component are provided.

As a result, the shield case having no foot can be easily positioned and mounted with high precision, so that there is no need to drill a hole corresponding to the foot in the printed wiring board. The other surface and the inside of the printed wiring board can be effectively used.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

(1) Configuration of Printed Wiring Board According to the Present Embodiment In FIGS. 1A and 1B, reference numeral 10 denotes a printed wiring board according to the present invention. (Not shown) and four dummy electronic components (hereinafter referred to as dummy electronic components) 11A to 11D.
Are mounted so that the box-shaped shield case 12 having no foot is placed over the oscillator electronic component, and a plurality of electronic components 13 are mounted at predetermined positions on the other surface 10B. I have.

In this case, each of the dummy electronic components 11A to 11D
Are the corresponding side surfaces 12A of the shield case 12.
It is mounted so as to be slightly apart along 〜12D, so that the shield case 12 can be positioned by dropping the shield case 12 between the positioning electronic components 11A to 11D.

Further, one surface 10A of the printed wiring board 10
Are provided with L-shaped lands 14A to 14D so as to slightly surround the four corners 12E to 12H of the shield case 12, respectively.
A to 14D and the corresponding corners 12E to 12H of the shield case 12 are electrically and physically connected via solder (not shown).

Each of the lands 14A to 14D is grounded via a predetermined wiring pattern (not shown).

(2) Operation and Effect of the Present Embodiment In the configuration described above, in the printed wiring board 10, each side surface 12A of the shield case 12 corresponds to the mounting position of the shield case 12 on one surface 10A. The dummy electronic components 11A to 11D are mounted along 13D.

Next, in the printed wiring board 10, after positioning the shield case 12 so as to drop between the dummy electronic components 11A to 11D on one surface 10A, the corners 12E to 12H of the shield case 12 are set.
And the corresponding lands 14A to 14D are electrically and physically connected via solder, and thus the shield case 12 is mounted on one surface 10A of the printed wiring board 10.

Therefore, in the printed wiring board 10, since the dummy electronic components 11A to 11D mounted along the side surfaces 12A to 12D of the shield case 12 are used for positioning the shield case 12, the shield case 12 is used. Can be easily and accurately positioned without having a foot portion as in the related art.

In this printed wiring board 10, one surface 1
Since the shield case 12 having no feet is mounted at 0A, it is not necessary to form a hole as in the conventional printed wiring board 1 (FIG. 2). A larger number of electronic components 13 than the board 1 can be mounted, and a wiring pattern can be formed in a place where a hole is conventionally formed inside.

The printed wiring board 10 has an electronic component 13 that can be mounted on the other surface 10B opposite to the mounting position of the shield case 12 as compared with the conventional printed wiring board 1.
Can be increased by about 3 to 5.

Further, in the printed wiring board 10, the lands 14A to 14D corresponding to the positions slightly away from the corners 12E to 12H of the shield case 12 are provided. When replacing the shield case 12 due to failure,
Land 14 corresponding to each of the corners 12E to 12H
The solder that electrically and physically connects A to 14D can be easily melted and sucked, and thus the shield case 12 can be easily removed.

According to the above configuration, the printed wiring board 10
Each of the side surfaces 12 </ b> A to 12 </ b> A of the shield case 12 is made to correspond to the mounting position of the shield case 12.
D, the respective dummy electronic components 11A to 11D are mounted.
A to 11D, the shield case 12
Since there is no foot, there is no need to drill holes in the printed wiring board 10, so that more electronic components 13 than the conventional printed wiring board 1 can be mounted on the other surface 10B, A wiring pattern can be formed in a place where a hole is formed in the printed wiring board 10 in the related art, and a printed wiring board and a mounting method that can improve utilization efficiency can be realized.

(3) Other Embodiments In the above-described embodiment, a case has been described in which the present invention is applied to the printed wiring board 10 built in a radio, but the present invention is not limited to this. Instead, if the printed wiring board on which the shield case 12 is mounted is embedded on one side, the present invention can be applied to a printed wiring board incorporated in various other devices such as a communication terminal device.

In the above-described embodiment, one dummy electronic component 11A to 11D extends along one side surface 12A to 12D of the shield case 12.
Although the description has been given of the case where the electronic components are mounted slightly apart from each other, the present invention is not limited to this, and a plurality of dummy electronic components 11A to 11D or an actual device may be mounted on one side surface 12A to 12D of the shield case 12. The electronic components for operation may be mounted along with and slightly separated from or in contact with each other.

Further, in the above-described embodiment, the dummy electronic components 11 are arranged along the side surfaces 12A to 12D of the shield case 12 and slightly apart from each other.
A to 11D have been described, but the present invention is not limited to this, and two adjacent sides 12A to 12D of the shield case 12 or three adjacent sides 1A
One or a plurality of dummy electronic components 11A to 11D or electronic components for actually operating the device may be arranged along the 2A to 12D, and may be mounted slightly apart or in contact with each other. Also in this case, the shield case 12 can be easily and accurately positioned as in the above-described embodiment.

Further, in the above-described embodiment, the case has been described where the lands 14A to 14D are provided so as to surround the corners 12E to 12H of the shield case 12 slightly apart from the corresponding corners 12E to 12H. However, the present invention is not limited to this, and the lands 14A to 14D may be provided to face the corresponding corners 12E to 12H of the shield case 12.

Further, in the above-described embodiment, the case has been described where the lands 14A to 14D are provided so as to surround the corners 12E to 12H of the shield case 12 slightly apart from the corresponding corners 12E to 12H. However, the present invention is not limited to this, and the inside or outside of each of the lands 14A to 14D may be provided so as to face the corresponding corners 12E to 12H of the shield case 12.

Further, in the above-described embodiment, L corresponds to each corner 12E to 12H of the shield case 12.
Although the case where the lands 14A to 14D having a character shape are provided has been described, the present invention is not limited to this, and the lands 14A to 14D having various other shapes such as an arcuate shape and an arc shape may be used. It may be provided.

Further, in the above-described embodiment, the case where each of the lands 14A to 14D is grounded via a wiring pattern has been described. However, the present invention is not limited to this. Like other wires, grounding may be performed via various other conductive materials.

Further, in the above-described embodiment, the case where each corner 12E to 12H of the shield case 12 is grounded via the solder, the corresponding lands 14A to 14D, and the wiring pattern sequentially is described. However, the present invention is not limited to this, and at least one predetermined portion of the shield case 12 may be directly grounded via a conductive material such as a wire.

Further, in the above-described embodiment, a case has been described in which an electronic component for an oscillator is mounted in the shield case 12. However, the present invention is not limited to this, and an electronic device which malfunctions under the influence of noise is provided. If it is a component, various other electronic components may be mounted.

Further, in the above-described embodiment, the case where each corner 12E to 12H of the shield case 12 and each corresponding land 14A to 14D are electrically and physically connected via solder. As described above, the present invention is not limited to this.
12H and the corresponding lands 14A to 14D are electrically connected to each other via a conductive material such as a wire. When such connection alone does not provide sufficient physical connection strength, the shield case 12 A predetermined position at the lower end may be connected to one surface 10A of the printed wiring board 10 via an adhesive.

Further, in the above-described embodiment, one or a plurality of electronic components mounted on one surface so as to correspond to the mounting position of the shield case and along at least two adjacent side surfaces of the shield case. As described above, the case where the dummy electronic components 11A to 11D are applied has been described. However, the present invention is not limited to this, and may be applied to an electronic component for operating a device having the printed wiring board of the present invention built therein. You may do it.

[0036]

As described above, according to the present invention, the shield case is mounted on one surface of the printed wiring board so as to correspond to the mounting position of the shield case and along at least two adjacent side surfaces of the shield case. By providing one or more electronic components, a shield case having no feet can be easily and accurately formed based on the mounting position of each electronic component previously mounted on one surface of the printed wiring board. Because it is not necessary to drill holes corresponding to the feet in the printed wiring board, the other surface and the inside of the printed wiring board can be effectively used, and thus the printed wiring board can be effectively used. A printed wiring board that can improve utilization efficiency can be realized.

A first step of mounting one or a plurality of electronic components on one surface of the printed wiring board so as to correspond to the mounting position of the shield case and along at least two adjacent side surfaces of the shield case. And a second step of positioning and mounting the shield case based on the mounting position of each electronic component on one surface of the printed wiring board, so that the shield case having no feet can be easily provided. Since it can be positioned and mounted with high precision, it is not necessary to drill holes corresponding to the feet in the printed wiring board, so that the other surface and the inside of the printed wiring board can be effectively used. Thus, a mounting method that can improve utilization efficiency can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic side view and a schematic top view showing an embodiment of the configuration of a printed wiring board according to the present invention.

FIG. 2 is a schematic side view showing a configuration of a conventional printed wiring board.

[Explanation of symbols]

10 ... printed wiring board, 10A ... one side, 11A, 1
1B, 11C, 11D ... Dummy electronic component, 12 ... Shield case, 12A, 12B, 12C, 12D ... Side, 12E, 12F, 12G, 12H ... Corner, 14
A, 14B, 14C, 14D ... land.

Claims (4)

[Claims] 1. A printed wiring board having a shield case mounted on one surface thereof, wherein the shield case is mounted on the one surface so as to correspond to at least two adjacent side surfaces of the shield case in correspondence with a mounting position of the shield case. A printed wiring board, comprising one or more electronic components. 2. The printed wiring board according to claim 1, further comprising a grounded ground land provided at a predetermined position away from the shield case on the one surface. 3. A mounting method for mounting a shield case on one surface of a printed wiring board, wherein at least two adjacent shield cases are provided on the one surface of the printed wiring board in correspondence with mounting positions of the shield case. A first step of mounting one or a plurality of electronic components along each side surface; and a step of positioning and mounting the shield case on the one surface of the printed wiring board based on a mounting position of each electronic component. 2. A mounting method, comprising: 4. In the first step, a grounded ground land is provided at a predetermined position on the one surface of the printed wiring board away from the shield case, and in the second step, the land of the printed wiring board is provided. 4. The mounting method according to claim 3, wherein the shield case mounted on the one surface is conductively connected to the land.