JPH11307414A - Remote controller for semiconductor aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deterioration of the activity ratio of a semiconductor aligner, by surely communicating information to an operator even when an error or assist demand is generated in the semiconductor aligner in a situation in which the operator cannot monitor the remote controller of the semiconductor aligner. SOLUTION: A ratio communication equipment for transmitting information is loaded on a remote controller 2 for remote controller one or more semiconductor aligners 1, and information is transmitted according to the generation of an error or assist demand in the semiconductor aligner 1. An operator carries an information receiving device 10 such as a pager for receiving information transmitted from the remote controller 2 anytime.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a remote control device for a semiconductor exposure apparatus, a semiconductor manufacturing system, and a semiconductor manufacturing method.

[0002]

2. Description of the Related Art In a semiconductor manufacturing plant, a remote control system of a semiconductor exposure apparatus is introduced for the purpose of unmanned operation and labor saving in a clean room. This remote operation system allows an operator to operate and monitor a plurality of semiconductor exposure apparatuses without entering the clean room.

Hereinafter, such a conventional remote control system for a semiconductor exposure apparatus will be described with reference to FIGS. FIG. 3 shows an external view of a conventional remote control system. In the figure,
1 is a semiconductor exposure apparatus, 2 is a remote operation apparatus, 3 is an operation unit of the remote operation apparatus 2, 4 is an apparatus selection switch for selecting a semiconductor exposure apparatus to be remotely operated, and 6 is connected to the remote operation apparatus 2. An apparatus status display unit for displaying an abnormality (error) occurring in the semiconductor exposure apparatus 1 or an operator's intervention request (assist request), a buzzer 7 for notifying the occurrence of an error or an assist request, and a remote control 9 for the semiconductor exposure apparatus 1 This is a communication line for transmitting and receiving various information between the operation devices 2 in both directions.

When the operator designates the semiconductor exposure apparatus 1 to be operated from the remote controller 2 and operates the operation unit 3, the operator can operate the semiconductor exposure apparatus 1 through the communication line 9. When an error occurs in the semiconductor exposure apparatus 1 or when an operator's intervention is required, the remote operation apparatus 2 is notified through the communication line 9, and the state is indicated by the buzzer 7 and the apparatus state display unit 6. Further, the operation unit 3 can be automatically switched to the device in which the abnormality has occurred, and can be brought into a screen display and operable state.

FIG. 4 is a conceptual diagram of a conventional remote control system. A plurality of semiconductor exposure apparatuses 1 in a clean room and a remote control apparatus 2 outside the clean room are connected by a communication line 9 and are collectively operated and monitored by an operator. Semiconductor exposure apparatus 1 that can be connected to remote control device 2
Since the number of the remote control devices is determined,
Form a similar system.

In order to increase the operation rate of the semiconductor exposure apparatus, it is necessary to quickly respond to the occurrence of an abnormality in the apparatus or the need for operator intervention. In the conventional remote operation system, when such an error or assist request occurs in the semiconductor exposure apparatus, information is displayed on the operation unit of the remote operation apparatus and, at the same time, a nearby operator is notified by an acoustic device or a display device. And request a response.

[0007]

As the reliability of the apparatus is improved, the number of apparatuses monitored by an operator alone is increasing. Also, depending on the installation conditions of the remote operation device, it is not always possible to install the remote operation device in one place. For these reasons, it is difficult for the operator to constantly monitor all the remote control devices, and in some cases, the operation rate of the devices is reduced due to being left unattended with an abnormality.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to surely provide an operator with an error or an assist request in a semiconductor exposure apparatus in a situation where the operator cannot monitor a remote control device of the semiconductor exposure apparatus. An object of the present invention is to provide a remote control device of a semiconductor exposure apparatus which can notify information and prevent a decrease in the operation rate of the apparatus.

[0009]

In order to achieve the above object, according to the present invention, in a remote control device capable of remotely controlling one or a plurality of semiconductor exposure apparatuses, information on the semiconductor exposure apparatuses is transmitted wirelessly. Therefore, the remote control device is provided with information transmitting means such as a communication device capable of transmitting information. This information transmission means usually detects the occurrence of an event such as an error or an assist request in the semiconductor exposure apparatus, in addition to the operation state of the semiconductor exposure apparatus such as start, end, and ongoing operation, and based on the detected event. Disseminate information.

[0010] The information transmitted from the information transmitting means includes identification information for identifying an apparatus in which the error or the assist request has occurred, and information about the content of the error or the assist request. It is desirable to include the identification information such as the error code described above so that the urgency of the response can be determined at that time.

A semiconductor manufacturing system according to the present invention receives one or more semiconductor exposure apparatuses, the above-mentioned remote operation apparatus capable of remotely operating the semiconductor exposure apparatus, and information from information transmitting means of the remote operation apparatus. And an information receiving device for the operator, wherein the information receiving device has a portable receiving device that can be carried by an operator.

An operator carries an information receiving device such as a pager so that information transmitted from a remote control device can be received at any time. The information receiving device may be a device that directly receives information transmitted from the information transmitting means by the portable receiving device, or may be a device that receives the information via another communication facility.

A device manufacturing method according to the present invention is a method for manufacturing a semiconductor device by remotely controlling one or more semiconductor exposure apparatuses. When an event occurs in the semiconductor exposure apparatus, the occurrence of the event is determined. It is characterized by detecting and transmitting wirelessly information based on the detected event from the remote control device.

Thus, even if the operator does not monitor in the vicinity of the remote control device, the operator can immediately know the error of the device and the assist request and can take a quick response, thereby increasing the operation rate of the device.

[0015]

An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows functional blocks of the remote control device according to the present embodiment. 1 is a semiconductor exposure device, 2 is a remote control device for remotely controlling the semiconductor exposure device, 3 is a remote control device 2
, 4 is a device selection switch for selecting a semiconductor exposure device to be remotely operated, 5 is a remote operation target switching unit for switching a semiconductor exposure device to be remotely operated according to the device selection switch 4, and 6 is a remote operation device 2. A device status display unit for displaying an error or an assist request of a semiconductor exposure apparatus connected to the apparatus; 7 a buzzer for notifying the occurrence of an error or an assist request; and 8 for detecting an error or an assist request of the semiconductor exposure apparatus. An information transmission unit for transmitting information; 9 a communication line for transmitting and receiving various information between the semiconductor exposure apparatus and the remote control device 2 in both directions; 10 an information receiving device carried by an operator; 11 an information receiving unit; A reception information display unit for displaying received information, a reception notification unit 13 including a buzzer or a vibration generator for notifying the reception of information, and a reception notification unit 14 for a private telephone system. Part, 15 is a transmission unit of the private telephone equipment.

FIG. 2 is an external view of a semiconductor manufacturing system according to this embodiment. When an error or an assist request occurs in the semiconductor exposure apparatus 1, the remote operation apparatus 2 is notified by the communication line 9. Regardless of whether the semiconductor exposure apparatus 1 is remotely operated, the remote operation apparatus 2 displays a message on the apparatus state display section 6 and sounds a buzzer 7 to notify a nearby operator. At this time, when the operator is not near the remote control device 2, the display unit 6 or the buzzer 7
Such notification means becomes invalid.

In this embodiment, information indicating that an error or an assist request has occurred is transmitted from the information transmitting unit 8 at the same time as these notifying means. The transmitted information is received by the information receiving unit 11 of the information receiving device 10 carried by the operator directly or through the in-house telephone facilities 14 and 15, and is notified to the operator by a reception notifying unit 13 having a buzzer and a vibration generator. Since the operator carries the information receiving apparatus 10, the operator can immediately know the occurrence of an error or an assist request in the semiconductor exposure apparatus 1 without always monitoring near the remote control device 2. The operator goes to the remote control device 2 to obtain detailed information and takes appropriate measures.

Next, another embodiment of the present invention will be described. To the information transmitted from the information transmitting unit 8, identification information indicating which semiconductor exposure apparatus has generated an error or an assist request and identification information indicating the content of the error or the assist request are added. In the information receiving apparatus 10, the reception notifying section 13 notifies the operator and displays the identification information on the received information display section 12 at the same time. The operator can determine whether the response is performed by the remote control device or the semiconductor exposure device based on the information, so that an appropriate response can be performed in a shorter time.

Next, a method for manufacturing a device using the remote control device of the semiconductor exposure apparatus described above will be described.

FIG. 3 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micro machines, etc.). Step 1
In (circuit design), a circuit of a semiconductor device is designed. Step 2 is a process for making a mask on the basis of the designed pattern. Step 3 (wafer manufacturing)
Then, a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation check test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 4 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern on the mask is printed and exposed on the wafer by the exposure apparatus having the above-described means for confirming the suitability of the exposure. Step 17 (development) develops the exposed wafer. Step 18 (etching)
Then, portions other than the developed resist image are scraped off. In step 19 (resist stripping), unnecessary resist after etching is removed. These steps 11-1
By repeating step 9, multiple circuit patterns are formed on the wafer. In this embodiment, in each of the repetitive processes, the exposure (step 1) is performed as described above.
6) Sometimes, the effects of errors, assist requests, and the like are minimized, making it possible to efficiently manufacture devices.

By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which was conventionally difficult to manufacture, at low cost.

[0023]

As described above, according to the present invention, when an error or an assist request is generated in the semiconductor exposure apparatus, the information is transmitted from the remote control device to notify the portable information receiving device of the operator. Even if the operator does not constantly monitor the remote control device, it is possible to quickly respond to an error or an assist request, thereby increasing the operation rate of the device.

[Brief description of the drawings]

FIG. 1 is a functional block diagram of a remote control device according to the present invention.

FIG. 2 is an external view of a remote control system of the semiconductor exposure apparatus according to the present invention.

FIG. 3 is a flowchart showing a manufacturing process of a micro device.

FIG. 4 is a detailed flowchart of the wafer process of FIG. 3;

FIG. 5 is an external view of a conventional remote control system for a semiconductor exposure apparatus.

FIG. 6 is a conceptual diagram of a conventional remote control system for a semiconductor exposure apparatus.

[Explanation of symbols]

1: semiconductor exposure apparatus, 2: remote control device, 3: operation unit,
4: Device selection switch, 5: Remote operation target switching unit,
6: device status display section, 7: buzzer, 8: information transmission section,
9: communication line, 10: information receiving device, 11: information receiving unit, 12: received information display unit, 13: reception notifying unit, 14:
Private telephone equipment receiving unit, 15: Private telephone equipment transmitting unit.

Claims (9)

[Claims] 1. A remote control device capable of remotely controlling one or a plurality of semiconductor exposure apparatuses, wherein the remote control apparatus is provided with information transmitting means for wirelessly transmitting information on the semiconductor exposure apparatus. Characteristic remote control device for semiconductor exposure equipment. 2. The remote control device according to claim 1, wherein said information transmission means detects occurrence of an event in said semiconductor exposure apparatus and transmits information based on the detected event. 3. The remote control device according to claim 2, wherein the event is an error or an assist request. 4. The remote control according to claim 3, wherein the information transmitted from the information transmitting means includes identification information for identifying which device has generated the error or the assist request. Operating device. 5. The remote operation according to claim 3, wherein the information transmitted from the information transmitting means includes identification information for identifying the content of the error or the assist request. apparatus. 6. One or more semiconductor exposure apparatuses, the remote operation apparatus according to claim 1, wherein said semiconductor exposure apparatus can be remotely controlled, and information from information transmission means of said remote operation apparatus. An information receiving device for receiving,
A semiconductor manufacturing system, wherein the information receiving device has a portable receiving device that can be carried by an operator. 7. The semiconductor manufacturing system according to claim 6, wherein said information receiving apparatus directly receives information transmitted from said information transmitting means by said portable receiving apparatus. 8. The information receiving apparatus according to claim 6, wherein the information transmitted from the information transmitting means is received by the portable receiving apparatus via another communication facility.
The semiconductor manufacturing system according to the above. 9. A method for manufacturing a semiconductor device by remotely controlling one or more semiconductor exposure apparatuses, comprising:
When an event occurs in the semiconductor exposure apparatus, the occurrence of the event is detected, and information based on the detected event is wirelessly transmitted from the remote control device.