JPH11297732A - Manufacture of ic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable shortening of a time for manufacturing an IC tag as well as printing operation at the same time as a molding operation. SOLUTION: In this manufacturing method, a molding apparatus, which has a stationary die 14 and a movable die 15 which form a predetermined shape cavity when dies are combined are used and also has an auxiliary die 17 in a cavity formation recess 14a of the stationary die 14 for changing the depth of the recess. In a condition in which the auxiliary die 17 is made to retreat from an end face of the stationary die 14 by a predetermined amount, an IC module sheet is first set on a bottom of the cavity formation recess 14a, a transfer film A is supplied onto a molding surface 15a, and molten resin is injected thereinto. Thereafter, in a condition in which the auxiliary die 17 is retreated by a predetermined amount, the molten resin is further injected, a molded product after the resin has set is removed from the cavity, a base material of the film A is removed from the molded product, thus manufacturing an IC tag, on which a predetermined figure or the like is transferred.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC having a circuit sheet constituting an electric circuit including an IC chip therein.
The method for manufacturing a tag belongs to the field of IC tag manufacturing technology.

[0002]

2. Description of the Related Art In recent years, a system for automatically reading and identifying information such as a product name and a production lot number given to an article or the like can handle a larger amount of information than a barcode, and has excellent environmental resistance. In addition, an automatic identification system using an IC tag that can store the information and can be remotely read has been put to practical use. As a method of manufacturing this IC tag, for example, as disclosed in Japanese Patent Application Laid-Open No. 9-293130, an IC including an IC chip and an antenna is disclosed.
There is a type in which an internal part of a tag is set in a molding die and an exterior part is molded with a synthetic resin layer.

[0003]

By the way, this IC tag is completed as a final product only after characters, designs, and the like are printed on the surface thereof. Therefore, after performing the molding operation for molding the IC tag, it is necessary to perform a printing operation for printing characters, designs, and the like on the surface. As a result, there arises a problem that the time required for these operations increases.

[0004] Further, in equipment for manufacturing the final product of an IC tag, it is necessary to prepare a molding machine for molding the IC tag and a printing device for printing characters, designs, and the like on the surface thereof, thereby increasing costs. There is a problem of inviting.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an IC tag capable of shortening the manufacturing time of the IC tag and simultaneously performing a molding operation and a printing operation.

[0006]

In order to solve the above problems, the present invention uses the following means.

First, the invention according to claim 1 of the present application (hereinafter referred to as “the invention”)
A first aspect of the present invention uses an IC module sheet in which a circuit sheet on which a circuit is formed is covered with a coating layer, and the module sheet is wrapped with a synthetic resin layer. The present invention relates to a method for manufacturing a solidified IC tag, comprising first and second molds that form a cavity having a predetermined shape when facing each other, and having a cavity forming recess of the first mold in the cavity. First, using a mold apparatus provided with an auxiliary mold for changing the depth, the first mold is retracted by a predetermined amount from the end surface of the first mold. The above-mentioned IC module sheet is set on the bottom of the cavity forming concave portion of the mold, and a transfer film is supplied to the molding surface of the second mold. The first between the and the transfer film After the molten resin is injected, the auxiliary mold is retracted by a predetermined amount after the resin is cured, and the molten resin is injected into a second space formed between the IC module sheet and the auxiliary mold. Then, after the resin is cured, the first and second molds are opened, the molded product is taken out from the cavity, and the base member of the transfer film is removed from the molded product, so that both surfaces of the IC module sheet are formed. The present invention is characterized in that an IC tag in which a predetermined design or the like is transferred from a transfer film onto a surface of one of the synthetic resin layers by being wrapped and hardened by a synthetic resin layer is manufactured.

The invention according to claim 2 (hereinafter referred to as the second invention) relates to the method for manufacturing an IC tag according to the first invention, wherein the first space and the second space contain molten resin. The injection is performed by different nozzle means.

The invention according to claim 3 (hereinafter referred to as the third invention) relates to the method for manufacturing an IC tag according to the first invention, wherein an IC module sheet having a plurality of projections around the IC module sheet. When the module sheet is set on the bottom of the cavity forming recess of the first mold, the protrusion is fitted to the inner peripheral surface of the bottom of the cavity forming recess of the mold to fix the IC module sheet. It is characterized by the following.

With the above-described configuration, the following effects can be obtained according to the present invention.

According to the method for manufacturing an IC tag of the first invention, first, the auxiliary mold for the first mold is retracted by a predetermined amount from the end face of the first mold. The above IC module sheet is set on the bottom of the cavity forming concave portion of the mold, and a transfer film is supplied to the molding surface of the second mold, and the IC formed by clamping both molds in this state. First between module sheet and transfer film
The molten resin is injected into the space, so that one surface of the IC module sheet is covered with the synthetic resin layer and hardened, and at the same time, a predetermined design or the like is transferred from the transfer film to the surface of the synthetic resin layer. . Next, in this clamped state, the auxiliary mold is retracted by a predetermined amount, and a molten resin is injected into a second space created between the IC module sheet and the auxiliary mold. Both surfaces are hardened while being wrapped in the synthetic resin layer. By removing the molded product from the cavity and removing the base member of the transfer film from the molded product, a final product of an IC tag having a predetermined design printed on one synthetic resin layer surface can be manufactured. become.

Therefore, after forming the IC tag, a post-process of printing a predetermined design or the like on the surface thereof is not required, and the predetermined design or the like is printed on the surface simultaneously with the molding of the IC tag in one process. Therefore, the manufacturing time of the IC tag can be reduced.

Moreover, both sides of the IC module sheet are
Because it is hardened in a state wrapped in a synthetic resin layer,
The IC chip and the electric circuit of the circuit sheet in the module sheet are protected from external impact, moisture and the like, and an IC tag having excellent environmental resistance can be obtained.

According to the method of manufacturing an IC tag of the second invention, the injection of the molten resin into the first space and the second space is performed by:
Since it is performed by different nozzle means, it is not necessary to make the material and the color of the resin the same so that the molten resin is injected by one nozzle means, and the material and the color of the molten resin to be injected into these spaces can be freely selected. it can.

According to the method for manufacturing an IC tag of the third invention, an IC module sheet having a plurality of projections around the IC module sheet is used.
When setting at the bottom of the cavity forming concave part of the mold,
The protrusion fits into the inner peripheral surface of the bottom of the cavity forming recess of the mold, and the IC module sheet is fixed. Therefore, the IC module sheet can be easily fixed at the set position without being displaced without a mechanism for separately fixing the IC module sheet to the bottom of the cavity forming concave portion of the first mold.

[0016]

Embodiments of the present invention will be described below. An apparatus for manufacturing an IC tag according to this embodiment implements the method of the present invention.

First, an example of an IC module sheet used in the IC tag manufacturing apparatus according to the present embodiment will be described.

As shown in FIGS. 1 and 2, this IC module sheet 1 has an electric circuit 4 including an IC chip 4a and an antenna portion 4b on a base sheet 3, and is provided on the electric circuit 4 side of the circuit sheet 2. And a surface of the cover sheet 5 and a layer of a hot-melt type adhesive 6, and the upper circuit sheet 2 and the cover sheet 5 are joined by the adhesive 6 to form a square. One set of sides facing each other has one protrusion 1a at the center position, and the other set of sides has two protrusions 1 at the center position.
a, 1a and a total of six protrusions 1a... 1a.

Next, an IC tag manufacturing apparatus will be described.

As shown in FIGS. 3 and 4, this IC tag manufacturing apparatus 10 includes a fixed base 12 and a movable base 13 which are supported by a plurality of guide rods 11. It has a fixed die 14 fixed to the fixed base 12 and a movable die 15 fixed to face the fixed die 14.

The fixed mold 14 has a cavity forming recess 14a, an auxiliary cavity 14b, and a runner 14c corresponding to the shape of an IC tag, and is supported by a fixed base 12 via a support block 16. Further, the cavity forming concave portion 14a of the fixed die 14 has:
An auxiliary mold 17 for changing the depth is attached to a rod 18a of an auxiliary cylinder 18, and is provided so as to be able to advance and retreat in the depth direction by operation of the cylinder 18. Further, the first injection nozzle 1 for injecting the molten resin is provided in the runner 14c.
9 is connected, and the nozzle 19 communicates with the first injection gate 20. The cavity forming recess 14a and the auxiliary cavity 14 are formed via the runner 14c of the fixed die 14.
The molten resin flows through b.

A resin inlet 21 is provided on the side of the cavity forming recess 14a of the fixed mold 14. A second injection nozzle 22 for injecting the molten resin is connected to the resin injection port 21, and the nozzle 22 is connected to a second injection gate 23.

On the other hand, above the movable base 13,
A transfer means 24 for the transfer film A and a winding means 25 for the transfer film A are provided below the transfer film A, and the transfer film A is supplied to the molding surface 15a of the movable mold 15 by these means 24 and 25. A transfer film supply device 26 is configured.

The movable base 13 is provided so as to be able to come into contact with and separate from the fixed base 12 via guide rods 11... By a cylinder 27 or the like supported on a base (not shown).

The movable base 13 has stepped forming holes 28 penetrating in the left-right direction (as viewed from the front in FIG. 3).
Is provided. The ejector rods 29 having an enlarged diameter portion 29a at one end are formed in the molding holes 28 ... 2.
8 and the other end of the ejector rods 29... 29 are connected to a plate member 30 provided on the fixed die 14. The movable mold 1 of the plate member 30
Ejector pins 31 are provided on the surface of the fifth side at the bottom of the auxiliary cavity 14b and the runner 14c of the fixed die 14 so as to penetrate the fixed die 14, respectively. Further, the plate member 30 is urged by springs 32... 32 so that the surface on the side opposite to the movable die 15 contacts the support block 16.

The movable base 13 is provided with clamp mechanisms 33... 33 for pressing the transfer film A supplied to the molding surface 15 a of the movable mold 15 against the molding surface 15 a.

Next, the operation of the IC tag manufacturing apparatus 10 will be described.

First, as shown in FIG. 5, the movable cylinder 15 was attached to the rod 18a of the cylinder 18 by the operation of the auxiliary cylinder 18 in a mold opening state in which the movable mold 15 was separated from the fixed mold 14. The auxiliary mold 17 is retracted from the end face of the fixed mold 14 by a predetermined amount. Then, in this state, the IC module sheet 1 is set on the bottom of the cavity forming concave portion 14a of the fixed die 14, and the transfer film A is fed into the molding surface 15a of the movable die 15. At this time, FIG.
Projections 1a provided on the IC module sheet 1 shown in FIG.
The IC module sheet 1 is fitted to the inner peripheral surface of the cavity forming recess 14a so that the IC module sheet 1 does not deviate from the set position. The transfer film A
3 is performed from the upper side to the lower side in FIG. 3 by the feeding means 24, and the symbols and the like to be transferred are carried into the molding surface 15a of the movable die 15.

Then, after positioning the transfer film A,
The transfer film A is brought into close contact with the molding surface 15 a of the movable mold 15 by the operation of the clamp mechanisms 33.

Next, as shown in FIG.
The movable mold 15 is moved to the fixed mold 14 by the operation of FIG.
The movable-side base 13 is fixed to the fixed-side base 12
And the mold is clamped. The molten resin C is injected into the first space B and the auxiliary cavity 14b from the first injection gate 20 through the runner 14c of the fixed die 14 into the first space B generated by the mold clamping, and the heat at that time is reduced. Due to the pressure, the transfer film A moves the molding surface 15a of the movable mold 15
At the same time, a synthetic resin layer that completely adheres to and covers one surface of the IC module sheet 1 is formed, and at the same time, a pattern or the like is transferred from the transfer film A to the surface of the synthetic resin layer.

Further, as shown in FIG. 7, in a state in which the molten resin C is cured, the auxiliary cylinder 18 is actuated to retreat the auxiliary mold 17 attached to the rod 18a of the cylinder 18 by a predetermined amount. In the second space D, the second space D
The same molten resin C as that injected into the first space B is injected from the injection gate 23 through the resin injection port 21 provided on the side of the fixed mold 14. The operation of the clamp mechanisms 33 for bringing the transfer film A into close contact with the molding surface 15a of the movable die 15 is continued until the injection of the molten resin C is completed.

After completion of the molding, as shown in FIG. 8, the movable base 13 is separated from the fixed base 12, and the ejector pins 31, 31 push up the auxiliary portion E1 and the runner portion E2 of the molded product E. As a result, the molded product E from which the base member of the transfer film A has been removed is taken out of the fixed mold 14. Although not shown, the molded product E is held by an actuator or a holding mechanism or the like, and is discharged from the IC tag manufacturing apparatus 10.

Thereafter, in a post-process, the auxiliary part E1 and the runner part E2 are removed from the molded product E, and FIG.
As shown in FIG. 10, both sides of the IC module 1 are wrapped and hardened in the synthetic resin layer C, and a predetermined pattern or the like is transferred from the transfer film A to the surface of the synthetic resin layer C formed in the first space B. Thus, an IC tag X as a finished product is obtained.

Therefore, after forming the IC tag, a post-process of printing a predetermined design or the like on the surface thereof is not required, and the predetermined design or the like is printed on the surface simultaneously with the molding of the IC tag in one process. Therefore, the manufacturing time of the IC tag can be reduced.

Moreover, since both surfaces of the IC module sheet 1 are hardened in a state of being wrapped in the synthetic resin layer C, the IC sheet 1 of the circuit sheet 2 in the module sheet 1 is hardened.
The C chip 4a and the electric circuit 4 are protected from external impact, moisture and the like, and an IC tag X having excellent environmental resistance can be obtained.

In the above-described IC tag manufacturing apparatus 10, the same molten resin C is injected into the first space B and the second space D, but different first injections are used in the respective spaces B and D. Since the nozzle 20 and the second injection nozzle 23 are provided, it is not necessary to make the material and color of the resin the same so that the molten resin is injected by one injection nozzle.
The material and color of the molten resin to be injected into these spaces B and D can be freely selected.

Since the IC module sheet 1 has a plurality of protrusions 1a... 1a around the periphery, when the module sheet 1 is set on the bottom of the cavity forming recess 14a of the fixed mold 14, the protrusions 1a …
The IC module sheet 1 is fixed by fitting 1a into the inner peripheral surface of the bottom of the cavity forming concave portion 14a of the fixed mold 14. Accordingly, the IC module sheet 1 can be easily provided without a mechanism for separately fixing the IC module sheet 1 to the bottom of the cavity forming concave portion 14a of the fixed mold 14.
The module sheet 1 can be fixed at the set position without shifting.

The movable type 1 in the IC tag device 10
5 may be replaced with a molding surface 15a 'having an uneven portion as shown in Fig. 11 or a molding surface 15a "having a concave portion as shown in Fig. 12. In this case, a synthetic resin is used. The surface of the layer becomes a surface having irregularities or a surface having a bulge corresponding to the molding surfaces 15a 'and 15a ", respectively.
In addition, a predetermined pattern or the like is transferred from the transfer film to the surface.

[0039]

As described above, first, according to the method for manufacturing an IC tag of the first invention, the auxiliary mold for the first mold is replaced with the first mold.
The IC module sheet is set on the bottom of the cavity forming concave portion of the first mold in a state where the IC module sheet is retracted from the end surface of the mold by a predetermined amount, and a transfer film is supplied to the molding surface of the second mold. In this state, the molten resin is injected into the first space between the IC module sheet and the transfer film generated by clamping the two dies.
At the same time that one surface of the module sheet is covered with the synthetic resin layer and hardened, a predetermined design or the like is transferred from the transfer film to the surface of the synthetic resin layer. Next, the auxiliary mold is retracted by a predetermined amount in this mold clamped state, and
Since the molten resin is injected into the second space created between the module sheet and the auxiliary mold, both sides of the IC module sheet are solidified while being wrapped in the synthetic resin layer. Then, while removing the molded product from the cavity and removing the base member of the transfer film from the molded product, the final product of the IC tag in which a predetermined pattern or the like is printed on one synthetic resin layer surface can be manufactured. become.

Therefore, after forming the IC tag, a post-process of printing a predetermined design or the like on the surface thereof is not required, and the predetermined design or the like is printed on the surface simultaneously with the molding of the IC tag in one process. Therefore, the manufacturing time of the IC tag can be reduced.

Moreover, both sides of the IC module sheet are
Because it is hardened in a state wrapped in a synthetic resin layer,
The IC chip and the electric circuit of the circuit sheet in the module sheet are protected from external impact, moisture and the like, and an IC tag having excellent environmental resistance can be obtained.

According to the method for manufacturing an IC tag of the second invention, the injection of the molten resin into the first space and the second space is performed by:
Since it is performed by different nozzle means, it is not necessary to make the material and color of the resin the same so that the molten resin is injected by one nozzle means, and the material and color of the molten resin to be injected into these spaces can be freely selected. it can. Therefore,
Since the combination of the material and the color of the molten resin can be freely set, an IC tag with various variations can be easily manufactured by changing the molten resin to be used.

According to the method for manufacturing an IC tag of the third invention, an IC module sheet having a plurality of projections around the IC module sheet is used.
When setting at the bottom of the cavity forming concave part of the mold,
The protrusion fits into the inner peripheral surface of the bottom of the cavity forming recess of the mold, and the IC module sheet is fixed. Therefore, the IC module sheet can be easily fixed at the set position without being displaced without a mechanism for separately fixing the IC module sheet to the bottom of the cavity forming concave portion of the first mold.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an example of an IC module sheet used in an IC tag manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along the line AA in FIG.

FIG. 3 is a vertical cross-sectional view showing a state in which the IC tag manufacturing apparatus according to the embodiment of the present invention is opened.

FIG. 4 is an enlarged plan view taken along the line II in FIG. 3;

FIG. 5 is an enlarged cross-sectional view of a main part of the IC tag manufacturing apparatus of FIG. 3 showing a mold opened state.

FIG. 6 is an enlarged cross-sectional view of a main part showing a state of mold clamping similarly.

FIG. 7 is an enlarged sectional view of a main part showing a state in which the auxiliary mold is retracted by a predetermined amount in the same state of the mold clamping.

FIG. 8 is an enlarged sectional view of a main part showing removal of a molded product in the same mold open state.

FIG. 9 is a plan view showing an IC tag manufactured by the IC tag manufacturing apparatus.

FIG. 10 is a cross-sectional view taken along the line wo in FIG. 8;

FIG. 11 is an enlarged sectional view showing another molding surface of the movable die of the IC tag manufacturing apparatus.

FIG. 12 is an enlarged sectional view showing another molding surface of the movable die of the IC tag manufacturing apparatus.

[Explanation of symbols]

 Reference Signs List 1 IC module sheet 2 Circuit sheet 4 Electric circuit 4a IC chip 14 Fixed mold (first mold) 14a Cavity forming recess 15 Movable mold (second mold) 15a Molding surface 17 Auxiliary mold A Transfer film B First Space C molten resin D second space E Molded product X IC tag

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kimihiko Ishida 1-15-15 Higashi-Ishizucho-Higashi, Sakai-shi, Osaka Prefecture Inside NAIS Co., Ltd. No. 15 Inside NAIS Co., Ltd.

Claims (3)

[Claims] An IC module sheet comprising an electric circuit including an IC chip and a circuit layer provided on a surface of the circuit sheet on which a circuit is provided is covered with a covering layer, and the module sheet is wrapped with a synthetic resin layer and solidified. A method of manufacturing an IC tag, comprising:
A mold apparatus having a second mold and an auxiliary mold for changing the depth of the cavity forming recess of the first mold is used. The auxiliary mold is
The IC module sheet is set on the bottom of the cavity forming concave portion of the first mold in a state where the IC module sheet is retracted by a predetermined amount from the end surface of the mold, and a transfer film is supplied to the molding surface of the second mold. After clamping both molds in this state, a molten resin is injected into the first space between the IC module sheet and the transfer film, and after the resin is cured, the auxiliary mold is retracted by a predetermined amount. At the same time, a molten resin is injected into a second space formed between the IC module sheet and the auxiliary mold, and after the resin is cured, the first and second molds are opened and molded from the cavity. By taking out the product and removing the base member of the transfer film from the molded product, both surfaces of the IC module sheet are wrapped and hardened with a synthetic resin layer, and a predetermined pattern is formed on the surface of one of the synthetic resin layers from the transfer film. There method of manufacturing an IC tag which is characterized by the production of IC tag that has been transferred. 2. The method according to claim 1, wherein the injection of the molten resin into the first space and the second space is performed by different nozzles. 3. An IC module sheet having a plurality of projections around its periphery is used as an IC module sheet. When this module sheet is set on the bottom of the cavity forming recess of the first mold, the projections are formed in the cavity of the mold. 2. The method for manufacturing an IC tag according to claim 1, wherein the IC module sheet is fixed by being fitted to an inner peripheral surface of a bottom of the concave portion.