JP2748320B2 - Manufacturing method of molded substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a molded substrate, and more particularly, to a transfer sheet having a circuit pattern arranged in a mold cavity, and simultaneously with the injection molding of a substrate molded product, the circuit pattern is integrated with the surface of the molded product. To a method of transferring to

[0002]

2. Description of the Related Art When a molded substrate is molded, a transfer sheet provided with a circuit pattern is placed in a mold cavity of a molding die, and a molten resin material is injected into the cavity to simultaneously mold a substrate molded product with the surface thereof. It has been proposed to integrally transfer-mold the circuit pattern of the transfer sheet. In the production of a molded substrate using such a transfer sheet, not only a flat substrate but also a substrate having a three-dimensional shape such as a curved surface, an uneven shape, or a box shape can be effectively implemented. There are advantages that can be done.

[0003] However, in molding with this type of transfer sheet, the transfer sheet rarely wrinkles during molding. Such wrinkles often occur when the molded product of the substrate has a complicated three-dimensional shape.

[0004]

In order to solve such a problem, the present inventors dispose a transfer sheet in a cavity by using positioning pins and vacuum suction holes, and at least partially transfer the transfer sheet to the cavity. The free end that is not sandwiched between the parting surfaces, and the gate position for injecting the molten resin material with respect to the transfer sheet placed in the cavity has a fixed relationship, enables accurate transfer sheet positioning and wrinkle removal at the same time. It has been found that generation can be effectively prevented.

That is, an object of the present invention is to provide a method for accurately positioning a transfer sheet and effectively preventing the occurrence of wrinkles in the formation of a molded substrate using a transfer sheet. Is what you do.

[0006]

SUMMARY OF THE INVENTION For the above purpose, the present invention provides a transfer sheet provided with a circuit pattern so that at least a part of the transfer surface is a free end which is not sandwiched by a parting surface. A molding substrate is disposed in a mold cavity by positioning pins and vacuum suction holes, a molten resin material is injected from the gate into the cavity, and the circuit pattern of the transfer sheet is integrally transferred to the surface of the molding at the same time as molding of the substrate molding. (A) when the two positioning pins are provided at a pin interval (D), a pin interval (D) from each pin on an extension line (E) connecting the positioning pins. And two lines (P1, P2) perpendicular to the extension line (E) at a point at a distance of half the distance between the extension line (E) and the pin spacing on both sides of the extension line (E). Half the distance of (D) Two parallel lines spaced (Q
1, (Q2), or (b) two or more positioning pins having the furthest pin interval (D) when three or more positioning pins are provided. Or, when there are a plurality of sets of two positioning pins having the farthest pin spacing (D), for each set of positioning pins, the pin spacing from each pin is taken along an extension line (E) connecting the positioning pins. Two lines (P) perpendicular to the extension (E) at a point half the distance of (D)
1, P2) and two parallel lines (Q1, Q2) on both sides of the extension line (E) and separated from the extension line (E) by a distance of half the pin interval (D). The gate of the molten resin material is provided within a gate setting range (X) which is a portion where the pin defined range (Z) overlaps with the transfer surface (S) of the transfer sheet.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view of a main part of a substrate molding die showing an embodiment of the present invention, FIG. 2 is a front view of the movable die, FIG. 3 is an explanatory view of a transfer surface of a transfer sheet, and FIG. Is 2
FIG. 5 is a schematic diagram showing a pin defining range defined by the pins in the case of a book, FIG. 5 is a schematic diagram showing a pin defining range when three or more positioning pins are used, and FIG. FIG. 7 is a schematic diagram showing an example in which a gate setting range is defined in a central portion of a transfer sheet, and FIG. 8 is a schematic diagram showing a gate setting range in one end portion of a transfer sheet. FIG. 9 is a schematic view showing an example in which a gate setting range is defined inside a transfer sheet, and FIG. 10 is a cross-sectional view showing an example of an apparatus for automatically arranging a transfer sheet on a mold cavity surface. FIG.

FIG. 1 and FIG. 2 show an example of a substrate molding die for carrying out the method of the present invention. In the figure, reference numeral 20 denotes a substrate molding die, 21 denotes a fixed die, 22 denotes a movable die, and a die cavity 23 is formed by clamping.

In the fixed mold 21, a gate 26 is provided at a predetermined position facing the mold cavity 23. This gate 26 is connected via a sprue 25 to an injection device (not shown) outside the mold. On the other hand, the positioning pins 30, 31, 3 are provided on the parting surface 29B of the movable mold 22.
The vacuum suction holes 40, 41, 42, 43 of the vacuum suction unit 45 connected to a vacuum device (not shown) are provided so that the transfer surface S of the transfer sheet 10 is located at a predetermined position of the mold cavity 23. Be placed.

Here, the transfer surface S of the transfer sheet 10
As is well understood from FIG. 3, the transfer sheet 10
Refers to the surface on which the circuit pattern is transferred to the surface of the molded product when the substrate is placed in the mold cavity. That is, in the case of the stepped cavity 23 shown in FIG. 1, the upper rising surface 11a, the step horizontal surface 11b, and the free end 19 as shown in FIG.
Is the transfer surface S.

A predetermined circuit pattern 15 is provided on the transfer surface of the transfer sheet 10, and the circuit pattern 1
5 is arranged inside the cavity 23. The transfer sheet 10 includes the positioning pins 30, 31, 32, and 33.
Are engaged with the positioning holes 16 provided in the transfer sheet 10, and are positioned by being suction-fixed to the mold cavity surface by the vacuum suction holes 40, 41, 42, and 43.

When the transfer sheet 10 is formed, the peripheral edge 12 of the transfer sheet 10 is closed by the closing of the fixed mold 21 and the movable mold 22 so that the mold parting surface 29 (29A, 29B) is formed.
Pinched and held by At this time, at least a part of the transfer surface S of the transfer sheet 10 is a free end 19 that is not sandwiched by the parting surface 29 (that is, retained in the cavity 23). The free end 19 is for releasing wrinkles generated in the transfer sheet 10 during molding. In the present embodiment, as shown in FIG. 2, both ends of the lower half of the substantially T-shaped transfer sheet 10 and Lower end is free end 19
It has become. This free end can also be formed by providing a cut in the transfer surface of the transfer sheet that is not sandwiched between the parting surfaces.

As will be understood from FIG. 1, in the present embodiment, the transfer sheet 1 is provided on the parting surface 29 (29A, 29B) of the mold that sandwiches the transfer sheet 10.
A clearance 27 that is about 1 to 100 microns larger than the thickness of 0 is formed. Further, the vacuum suction holes 4
Reference numerals 0, 41, 42, and 43 are provided on the parting surface 29 where the clearance 27 is formed.

After the transfer sheet 10 is placed in the mold cavity 23 as described above, a molten resin is injected from the gate 26 into the cavity 23, and simultaneously with the formation of the substrate molded product, the transfer sheet is placed on the surface of the molded product. 10 circuit patterns 1
5 are transferred integrally. In the present invention, the gate 2
The position 6 is within a range (gate setting range X) where the range defined by the number of positioning pins and the standing position (pin defined range Z) and the transfer surface S of the transfer sheet 10 overlap as described below. Provided.

That is, as shown in FIG. 4, when two positioning pins 51 and 52 are provided at a distance D in the mold, an extension line E connecting the positioning pins 51 and 52 is provided. Two lines P1 and P2 perpendicular to the extension line E are obtained at points separated from the respective pins by half the distance D (D / 2). Then, on both sides of the extension line E, two parallel lines Q1 and Q2 separated by D / 2 from the extension line E are obtained, and the two parallel lines P1 and P2 and the parallel lines Q1 and Q2 are used. An enclosed pin specified range Z is set. As will be described later, the gate of the molten resin material is provided in a gate setting range X overlapping the pin defined range Z and the transfer surface S of the transfer sheet 10.

Further, as shown in FIG. 5, when three or more positioning pins are provided, the pin defining range Z is determined as follows. That is, the positioning pins 53, 54,
An extension line E connecting two positioning pins 55 and 56 having the farthest pin interval D among 55 and 56 is assumed. Then, from a point on the extension line E which is away from the pins 55 and 56 by D / 2, respectively, a point perpendicular to the extension line E
The two lines P1 and P2 are obtained, and two parallel lines Q are separated on both sides of the extension E by D / 2 with respect to the extension E.
1, Q2 are provided. The pin defined range Z is
1, Q2 and the above-mentioned P1, P2.
A portion where the transfer surface S overlaps is a gate setting range X.

When there are a plurality of sets of two positioning pins having the farthest pin interval D, as shown in FIG. 6, the positioning pins 57, 60 and 5 of each set are provided.
8 and 59, the extension line E and the parallel lines P1 and P
2, Q1 and Q2 are obtained. The largest range surrounded by the parallel lines P1, P2, Q1, and Q2 is defined as a pin defined range Z, and a portion overlapping the transfer surface of the transfer sheet is defined as a gate set range X. Note that, as in this example, when two positioning pins having the farthest pin intervals D appear to cross each other, the pin defining range Z is as shown in FIG.
It becomes a cross (X shape) like.

By providing a gate in a portion (gate setting range X) where the pin defined range Z defined by the positioning pins and the transfer surface S of the transfer sheet overlap each other,
Since the position of the gate is appropriately close to the positioning pin, the molten resin injected from the gate into the cavity is
The transfer sheet naturally flows from the portion where the transfer sheet is fixed toward the free end 19 of the transfer sheet 10. Thereby, at the same time as accurately positioning the transfer surface around the positioning pin, wrinkles that may occur on the transfer sheet can be effectively released toward the free end thereof,
No wrinkles of the transfer sheet are left on the molded product.

Next, the gate setting range X, which is a portion where the pin defining range Z defined by the positioning pins and the transfer surface S of the transfer sheet overlap, is determined by the position of the circuit pattern and the shape of the molded product. Is determined at an appropriate position. That is, FIG. 7 shows an example in which the gate setting range X is provided at the center of the transfer surface S. As indicated by arrows in the figure, the molten resin injected from the gate G flows up and down the transfer sheet. FIG. 8 shows an example in which a gate setting range X is defined at one end of the transfer sheet. Further, as shown in FIG. 9, a gate setting range X may be defined inside the transfer surface S of the transfer sheet.

As described with reference to FIGS. 1 and 2, a clearance 1 to 100 μm larger than the thickness of the transfer sheet 10 is formed on the parting surface 29 between which the transfer sheet 10 is sandwiched. By providing a vacuum suction hole for adsorbing and fixing the transfer sheet on the parting surface formed with wrinkles, wrinkles that may occur on the transfer sheet can be effectively released to parts other than the transfer surface of the transfer sheet. In addition, wrinkles of the transfer sheet are not left on the molded product corresponding to the transfer surface. The formation of such a clearance on the parting surface is particularly advantageous when the positioning pins are provided outside the molded product cavity 23.

FIG. 10 shows the transfer sheet 10 as 1
This shows an example of an apparatus suitable for automatically arranging the molds on the mold cavity surface 29 one by one. FIG.
The same reference numerals as those in FIG. 2 indicate the same members. As shown, a transfer sheet setting device 70 is provided between the fixed die 21 and the movable die 22. The transfer sheet setting device 70 is provided between the fixed mold 21 or the movable mold 22.
As shown by the arrow in the figure, the transfer sheet is provided so as to be able to advance and retreat with respect to the transfer sheet setting surface of the cavity. In the transfer sheet setting device 70, vacuum suction holes 71 and 72 for sucking and holding the transfer sheet 10 by being connected to a vacuum device (not shown) are formed on the surface of the transfer sheet 10 opposite to the mold cavity surface on which the transfer sheet 10 is arranged. Is provided.

According to the apparatus 70, a predetermined transfer sheet 10 is attracted to the surface of the apparatus 70 by vacuum suction from a transfer sheet magazine outside the mold, and when the mold 20 is opened, the fixed mold 21 and the movable mold 22 are moved. Move forward between. Then, the movable sheet 22 is moved to the front of the mold cavity face of the movable mold 22 which is the transfer sheet setting face. Subsequently, the apparatus is adjusted so that the positioning holes of the transfer sheet are aligned with the positioning pins 30 and 31 provided on the movable die 22, and the device 70 is advanced toward the movable die 22 so that the positioning pins are inserted into the positioning holes of the sheet. Insert 30 and 31. Reference numerals 73 and 74 are positioning holes provided in the device 70 corresponding to the positioning pins 30, and when the device 70 is advanced in the direction of the movable mold 22,
The surface of the apparatus can be brought into close contact with the movable mold 22 by inserting the positioning pins 30.

Thereafter, the vacuum device is switched from the device 70 to the movable mold 22 so that the vacuum suction holes 7 are formed.
1 and 72 are stopped, and the vacuum suction holes 3 of the movable mold 22 are stopped.
0, 31 is activated. Thereby, the transfer sheet 10 adsorbed on the surface of the apparatus 70 is automatically moved to the mold cavity surface 23 and held and fixed. When the transfer sheet 10 is disposed on the cavity surface of the movable mold 22, the device 70 retreats from the mold 20.

[0024]

As shown and described above, according to the manufacturing method of the present invention, the transfer sheet is arranged at the correct position on the mold cavity surface by the positioning pins. Moreover,
Since the gate position of the mold is appropriately brought close to the positioning pins in a fixed relationship, the molten resin injected from the gate flows effectively toward the free end, so that wrinkles and the like are generated on the molded product. I will not let you.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part of a substrate molding die showing one embodiment of the present invention.

FIG. 2 is a front view of the movable type.

FIG. 3 is an explanatory diagram of a transfer surface of a transfer sheet.

FIG. 4 is a schematic diagram showing a pin defining range defined by two positioning pins when the positioning pins are two.

FIG. 5 is a schematic diagram showing a pin defined range when three or more positioning pins are used.

FIG. 6 is a schematic diagram showing a pin definition range when there are a plurality of sets of positioning pins having the farthest pin intervals.

FIG. 7 is a schematic diagram illustrating an example in which a gate setting range is defined in a central portion of a transfer sheet.

FIG. 8 is a schematic diagram illustrating an example in which a gate setting range is defined at one end of a transfer sheet.

FIG. 9 is a schematic diagram illustrating an example in which a gate setting range is defined inside a transfer sheet.

FIG. 10 is a sectional view showing an example of an apparatus for automatically arranging a transfer sheet on a mold cavity surface.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Transfer sheet 15 Circuit pattern 20 Die 21 Fixed type 22 Movable type 26 Gate 30, 31, 32, 33 Positioning pin D Pin interval E Extension line of positioning pin P1, P2 Perpendicular line to extension line E Q1, Q2 For extension line E Parallel line S Transfer surface of sheet X Gate setting range Z Pin specified range

Claims (2)

(57) [Claims] 1. A transfer sheet provided with a circuit pattern is arranged in a mold cavity by positioning pins and vacuum suction holes such that at least a part of the transfer surface is a free end not sandwiched by a parting surface. A method of manufacturing a molded substrate in which a molten resin material is injected from a gate into a cavity and a circuit pattern of the transfer sheet is integrally transferred to a surface of the molded product at the same time as molding of the substrate molded product; When two pins are provided at the pin interval (D), on the extension line (E) connecting the positioning pins, the extension line (E) at a point at a distance of half the pin interval (D) from each pin. Vertical lines (P1, P2)
And a pin definition surrounded by two parallel lines (Q1, Q2) on both sides of the extension line (E) and separated from the extension line (E) by a distance of a half of the pin interval (D). Range (Z)
Or (b) when three or more positioning pins are provided, two positioning pins having the furthest pin spacing (D) or two having the furthest pin spacing (D) If there are a plurality of sets of positioning pins, an extension line (E) connecting the positioning pins for each set of positioning pins
Above, two lines (P1, P2) perpendicular to the extension line (E) at a point at a distance of half the pin interval (D) from each pin.
2) and parallel two sides of the extension line (E) separated from the extension line (E) by a distance of a half of the pin interval (D).
The gate of the molten resin material is set within a gate setting range (X) which is a portion where the pin defined range (Z) surrounded by the two lines (Q1, Q2) and the transfer surface (S) of the transfer sheet overlap. A method for manufacturing a molded substrate, comprising: 2. The transfer sheet according to claim 1, wherein the parting surface on which the transfer sheet is sandwiched is 1 to 1 thicker than the thickness of the transfer sheet.
A method for manufacturing a molded substrate, wherein a clearance larger by 00 microns is formed, and a vacuum suction hole for sucking and fixing a transfer sheet is provided on the parting surface where the clearance is formed.