JPH11296920A - 2p substrate manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate an adverse effect to a stamper due to an exfoliative defect and to remarkably reduce a transfer defect of a completed 2P substrate by providing a 2P substrate peeling mechanism mechanically lifting ultraviolet ray setting photo-resin (2P resin) of an optical disk 2P substrate (2P substrate) from a stamper information surface. SOLUTION: The stamper 111 is placed on a mirror finished surface plate 116, and the inside diameter is fixed by expanding a clamp pawl 115 of a caliber clamper 114 to an outer periphery, and the outer periphery is pressed down from the stamper 111 information surface side by an outer peripheral holder 113. The stamper 111 back is vacuum sucked by a mirror finished surface plate 116 stamper sucking groove 117. The 2P substrate peeling mechanism is placed on the inside of the mirror finished surface plate 116, and consists of a substrate centering jig 112a and a jig thrust-up mechanism 112b. The substrate centering jig 112a rises in the direction vertical to the stamper 111 information surface by the jig thrust-up mechanism 112b, and is in contact with only the substrate inside diameter when it descends most, and is in contact with also the 2P resin surface when it rises to thrust up the 2P substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a 2P substrate manufacturing apparatus used for manufacturing a 2P substrate for an optical disk.

[0002]

2. Description of the Related Art FIG. 3 shows a manufacturing process and a peeling method of a 2P substrate according to the prior art. FIG. 3 is a sectional view showing a conventional 2P substrate manufacturing process.

A stamper (311) on which information is recorded as an optical disk is provided on a center jig (312).
(321) (FIG. 3 (b)), it is positioned and attached to the mirror plate (316).

The outer periphery of the stamper is fixed to a mirror plate by an outer periphery holder (313). FIG. 3 (a) When the 2P resin (331) is applied on the stamper (311), the raw substrate (351) is placed on the 2P resin. The raw substrate (351) is positioned by the substrate centering portion (322) (FIG. 3B) of the center jig (312). FIG. 3 (c) In the final product optical disc, the amount of misalignment between the center of the optical disc substrate and the center of the transferred information, that is, the amount of eccentricity is defined. Therefore, the amount of eccentricity between the center of the stamper inner diameter and the center of the stamper information is controlled to a certain value or less.

[0005] The 2P substrate manufacturing apparatus includes a center jig (312)
Since the stamper (311) and the raw substrate (351) are positioned at the same time, the amount of eccentricity of the optical disk is kept within the standard value.

If the 2P resin (331) spreads before the entire stamper information area can be transferred, the 2P resin is cured by UV irradiation. Fig. 3 (d) Next, the 2P substrate where the raw substrate (351) and the 2P resin (331) are in close contact.
This is the peeling step (352). For the peeling, the take-out device (361) fixes the opposite surface of the 2P resin surface of the 2P substrate (352) by vacuum suction, and pulls it up above the stamper (311). FIG. 3 (e) The 2P substrate is taken out by the take-out device (361), and the 2P substrate is completed.

[0007]

In the prior art, when the adhesion between the stamper and the 2P resin is extremely strong, a peeling failure occurs in which the 2P substrate cannot be peeled from the stamper.

[0008] In the peeling failure, when the take-out device (361) lifts the 2P substrate (352), the vacuum between the take-out device and the 2P substrate is broken before the substrate is peeled from the stamper.
A state in which the substrate is stuck to the stamper.

When a peeling failure occurs, a peeling operation is performed a plurality of times. On a 2P substrate that has been peeled a plurality of times, transfer defects may occur in which the shapes of pits and grooves recorded on the stamper are lost. The transfer failure degrades electrical characteristics, which is one of the important characteristics of the optical disc.

As a countermeasure against peeling failure, a method of hooking the outer periphery of the substrate with a peeling claw or the like has been performed, but the effect is not sufficient.

If the 2P substrate cannot be peeled even after performing the normal peeling operation a plurality of times, a special 2P substrate removing operation is performed, which causes deformation of the stamper, scratches on the stamper surface, and the like. In the worst case, the stamper may become unusable.

[0012]

According to a first aspect of the present invention, there is provided a 2P substrate manufacturing apparatus having a 2P substrate peeling mechanism for mechanically pushing up a 2P resin surface of a 2P substrate from a stamper information surface. apparatus.

According to the above configuration, there is an effect that the peeling failure of the 2P substrate and the transfer failure of the stamper information are eliminated.

According to a second aspect of the present invention, there is provided a 2P substrate for an optical disk,
There is no transfer failure.

According to the 2P substrate for an optical disk, there is an effect that the electric characteristics are not deteriorated.

An optical disk according to a third aspect is characterized in that the optical characteristics are not deteriorated.

According to the above optical disk, there is an effect that the performance of the optical disk is not deteriorated.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows a 2P substrate manufacturing apparatus 2 according to the present invention.
It is a front view and sectional view of an under base (119) including a P substrate peeling mechanism.

The under base (119) has a mounting plate (118), a mirror plate (116), an inner diameter clamper (114), and a 2P substrate peeling mechanism. The stamper (111) is located on the mirror plate (116), the inner diameter is fixed by the inner diameter clamper (114), and the outer periphery is pressed from the stamper information surface side by the outer peripheral holder (113). The back surface of the stamper is vacuum-sucked by a stamper suction groove (117) in the mirror plate.

The inner diameter clamper has clamp claws (115) for supporting the inner diameter of the stamper at three places. The clamp claws are movable in the radial direction of the stamper, and three of them are moved simultaneously by a common moving mechanism, and the amount of movement is the same. The clamp pawl spreads over the outer periphery to hold down and fix the inner surface of the stamper. Further, the clamper claw does not come out of a position higher than the stamper information surface.

The 2P substrate peeling mechanism is located inside the mirror plate and has a function of peeling the substrate and positioning the substrate. The 2P substrate peeling mechanism includes a substrate centering jig (112a) and a jig pushing-up mechanism (112b). Substrate centering jig (112a)
Is raised in a direction perpendicular to the stamper information surface by the jig pushing-up mechanism (112b). When the substrate centering jig comes down most, it comes into contact only with the substrate inner diameter, and when it goes up, it comes into contact with the 2P resin surface and pushes up the 2P substrate.

The center of the inner diameter clamper and the center of the jig for centering the substrate are arranged at positions satisfying the eccentricity standard of the optical disk.

In this embodiment, the eccentricity between the inner diameter of the 2P substrate and the center of the transferred stamper information is set to 30 μm or less. (The eccentricity of the stamper inner diameter and stamper information center is 20
Next, the 2P substrate manufacturing process and the 2P substrate peeling operation will be described with reference to FIG.

As an initial state of the under base (219),
The stamper (211) is fixed to the mirror plate (216), and the substrate centering jig (212a) is at the lowest position.

When the 2P resin (231) is applied on the stamper (211), the raw substrate (251) is set on the resin. Raw board
(251) is positioned by fitting the inner diameter with the substrate centering jig (212a). When the 2P resin (231) spreads to the position where the stamper information is completely transferred, the 2P resin is cured by UV irradiation. FIG. 2 (b) In this embodiment, the step of spreading the 2P resin is performed in a vacuum.
It promotes the spread of P resin.

When the 2P resin (231) cures and comes into close contact with the raw substrate (251), the completed 2P substrate (252) is released from the stamper.

The 2P substrate (252) is taken out of the surface opposite to the 2P resin surface, and is vacuum-sucked by the take-out device (261). When the substrate centering jig (212a) starts rising by the jig pushing-up mechanism (212b), the unloading device also starts to rise accordingly. The 2P substrate is separated from the stamper from the inner peripheral portion of the substrate by a jig for centering the substrate. At this time, the stamper is kept fixed on the mirror surface by the inner diameter clamper and the stamper suction groove. FIG. 2 (c) The unloading device rises even if the substrate centering jig reaches the upper limit and stops. The 2P substrate (252) comes off the substrate centering jig and is completely taken out from the under base (219).

When the 2P substrate is taken out, the under base is set in the initial state, and one cycle of manufacturing the 2P substrate is completed.

In this embodiment, the inner diameter of the stamper is fixed by the stamper inner diameter clamper. However, the inner diameter holder shown in FIG. 401, 402).

[0031]

According to the present invention, the 2P substrate surface is mechanically pushed up from the stamper information surface by the 2P resin surface, so that the 2P substrate peeling mechanism does not cause peeling failure. Adverse effects on the stamper due to poor peeling are eliminated. In the completed 2P substrate, transfer defects are greatly reduced, and an excellent optical disk can be manufactured.

[Brief description of the drawings]

FIG. 1 is a front view and a cross-sectional view of an under base including a 2P substrate peeling mechanism of the present invention.

FIG. 2 is a sectional view showing a 2P substrate peeling operation in FIG. 1;

FIG. 3 is a cross-sectional view showing a 2P substrate peeling operation according to the related art.

FIG. 4 is a sectional view showing a method of fixing a stamper by an inner peripheral holder.

[Explanation of symbols]

 Reference Signs List 111 stamper 112a substrate centering jig 112b jig pushing-up mechanism 113 outer peripheral holder 114 inner diameter clamper 115 clamp claw 116 mirror surface plate 117 stamper suction groove 118 mounting plate 119 under base 211 stamper 212a substrate centering jig 212b jig pushing-up mechanism 213 outer periphery Holder 214 Inner diameter clamper 215 Clamp claw 216 Mirror surface plate 217 Stamper suction groove 218 Mounting plate 219 Under base 231 2P resin 251 Raw substrate 252 2P substrate 261 Extraction device 262 UV lamp 311 Stamper 312 Center jig 313 Peripheral holder 316 Mirror surface plate 321 Stamper Outgoing part 322 Board center outgoing part 331 2P resin 351 Raw substrate 352 2P substrate 361 Take-out device 3 62 UV lamp 401 inner diameter holder 402 inner diameter holder 411 stamper

Claims (3)

[Claims] 1. A stamper information is transferred to an ultraviolet curing resin (hereinafter referred to as 2P resin) between a stamper and a transparent substrate (hereinafter referred to as a raw substrate), and the 2P resin is further cured and attached to the raw substrate. , 2P substrate for optical disk (hereinafter 2P substrate)
An apparatus for manufacturing a 2P substrate, comprising a 2P substrate peeling mechanism for mechanically pushing up a 2P resin surface of the 2P substrate from a stamper information surface. 2. A 2P substrate for an optical disk manufactured by using the 2P substrate manufacturing apparatus according to the above item. 3. An optical disk using the 2P substrate for an optical disk according to claim 2.